Wistron NeWeb M14A2A LTE Cat.M1 LGA module User Manual 1

Wistron NeWeb Corporation LTE Cat.M1 LGA module 1

Contents

User Manual

1 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide Project Name: IMA3 Author: Wistron NeWeb Corporation Revision: 1.0 Revision Date: 2017/05/26
2 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide Contact Information Technical Support Website supportiot.wnc.com.tw WNC company Website www.wnc.com.tw Revision History Rev. # Author Summary of Changes Date 1.0 Michael Liao 1st release version 2017/05/26
3 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide © Wistron NeWeb Corporation THIS DOCUMENT AND THE INFORMATION CONTAINED HEREIN IS PROPRIETARY AND IS THE EXCLUSIVE PROPERTY OF WNC AND SHALL NOT BE DISTRIBUTED, REPRODUCED, OR DISCLOSED IN WHOLE OR IN PART WITHOUT PRIOR WRITTEN PERMISSION FROM WNC. LIMITATION OF LIABILITY THIS DOCUMENT AND THE INFORMATION CONTAINED HEREIN IS PURELY FOR DESIGN REFERENCE AND SUBJECT TO REVISION BY WNC AT ANY TIME. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY WARRANTY OR RIGHT TO USE THE MATERIAL CONTAINED HPRIOR EXPRESS WRITTEN CONSENT. WNC SHALL NOT BE LIABLE FOR ANY USE, APPLICATION OR DEVELOPMENT DERIVED FROM THE MATERIAL WITHOUT SUCH PRIOR EXPRESS WRITTEN CONSENT.
4 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide Contents Contact Information ........................................................................................................ 2 Revision History .............................................................................................................. 2 Contents ......................................................................................................................... 4 1. Introduction ........................................................................................................... 6 1.1. Abbreviation ......................................................................................................... 6 1.2. Features ................................................................................................................ 8 2. Electrical Specifications ........................................................................................... 9 2.1. Interface pin assignments .................................................................................... 9 2.1.1. LGA Pad Diagram ...................................................................................... 9 2.1.2. Pin Assignments ..................................................................................... 10 2.2. Power supply ...................................................................................................... 20 2.3. USB interface ...................................................................................................... 20 2.4. SIM interface ...................................................................................................... 22 2.5. Control interface (signals) .................................................................................. 23 2.5.1. Power-on Signal ...................................................................................... 23 2.5.2. Host-to-modem wake-up interface ........................................................ 25 2.5.3. Reset Signal............................................................................................. 29 2.6. Digital interface .................................................................................................. 30 2.6.1. SPI Master Interface ............................................................................... 30 2.6.2. PCM Interface ......................................................................................... 32 2.6.3. I2S Interface ............................................................................................ 33 2.6.4. I2C Interface ........................................................................................... 34
5 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide 2.6.5. UART Interface ........................................................................................ 35 2.7. ADC interface ...................................................................................................... 36 2.8. GPIO .................................................................................................................... 37 3. RF Specifications ................................................................................................... 38 3.1. RF connections ................................................................................................... 38 3.2. Interference and sensitivity ................................................................................ 38 3.3. Radiated sensitivity measurement ..................................................................... 39 3.4. Supported frequencies ....................................................................................... 39 3.5. Power consumption ........................................................................................... 40 3.6. Module power states ......................................................................................... 43 4. Software Interface ................................................................................................ 45 5. Mechanical and Environmental Specifications ....................................................... 46 5.1. PCBA form factor ................................................................................................ 46 5.2. Module PCB Layout ............................................................................................ 48 5.3. Reflow ................................................................................................................. 50 5.4. Labeling .............................................................................................................. 52 5.5. Thermal considerations ...................................................................................... 53 6. Regulatory and Industry Approvals ....................................................................... 54 6.1. Certification testing ............................................................................................ 54 6.2. Safety and hazards.............................................................................................. 54 7. Packaging ............................................................................................................. 55 8. Safety Recommendation ....................................................................................... 57 9. Appendix .............................................................................................................. 58
6 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide 1. Introduction IMA3 is a CAT-M1 (1 Mbps/1 Mbps DL/UL respectively) LTE modem which incorporates an application CPU subsystem and a host of peripheral interfaces and functions uniquely designed to address the power/performance/cost requirements of IoT and M2M applications. The chip is based on SDR-v3.0 (Software Defined Radio) architecture which offers OFDMA-related software based signal processing capabilities that significantly exceed traditional communications DSP cores, yet consumes a fraction of the power. Linux OS with a variety of host interfaces including USB 2.0, I2C, SPI, and UART. 1.1. Abbreviation Table 1. Pin Interface Family Abbreviation Definition AC Alternating Current DC Direct Current ETSI European Telecommunications Standards Institute GND GrouND GPS Global Positioning System GNSS Any single or combined satellite navigation system (GPS, GLONASS and combined GPS/GLONASS) GPIO General Purpose Input Output I/O Input/Output IoT Internet of Things I2C Inter-Integrated Circuit I2S Inter-IC Sound or Integrated Interchip Sound IMS IP Multimedia Subsystem LGA Land Grid Array LTE Long Term Evolution
7 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide M2M Machine to Machine Mbps Megabits per second MIPS Millions of Instructions Per Second N/A Not/Applicable OS Operating System OTA Over The Air PC Personal Computer PCM Pulse Code Modulation PIN Personal Identification Number PSM Power Saving Mode RRC Radio Resource Control SIM Subscriber Identity Module SMA Surface Mount Antenna SPI Serial Peripheral Interface UART Universal Asynchronous Receiver-Transmitter UIM User Identity Module USB Universal Serial Bus Vref Voltage reference WCDMA Wideband Code Division Multiple Access WNC Winstron NeWeb Corporation
8 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide 1.2. Features  3GPP category support: LTE CAT-M1 with 1 Mbps for DL/UL  Embedded 512Mbit LPDDR  Embedded 256Mbit SPI NOR Flash  Ultra-high performance enhanced SDR processor  Embedded network processor with Linux OS  Integrated PMU circuitry  Integrated RTC support    Optimized for the M2M and IoT markets  Interfaces: – HS USB2.0 with integrated PHY – Dual UART interfaces (4 bit and 2 bit) for high-speed data transfer and diagnostic tools support – SPI master interface – Mobile LPDDR and PSRAM support – Serial NOR flash controller – USIM interface – I2S/PCM audio interface – GPIOs – One I2C interface (master mode)
9 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide 2. Electrical Specifications 2.1. Interface pin assignments 2.1.1. LGA Pad Diagram Figure 1. LGA pad diagram (top view)
10 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide 2.1.2. Pin Assignments I/O type description :  AO : Analog Output  AI : Analog Input  DO : Digital Output  DI : Digital Input Table 2. Pin Interface Family Interface Family Signal Name Description I/O RF Interfaces RF_1 Main Antenna AI/AO RF_2 Aux Antenna AI User Identity Module UIM_VCC UIM Power DO UIM_DATA UIM Data in/out DI/DO UIM_CLK UIM Clock DO UIM_RESET UIM Reset DO UIM_DETECT UIM Detect DI/DO Data Interfaces- USB2.0 USB_Dp USB Data Positive DI/DO USB_Dn USB Data Negative DI/DO Data Interfaces- UART1 UART1_CTS Clear To Send for UART 1 DI UART1_RTS Request To Send for UART 1 DO UART1_RX Receive for UART 1 DI UART1_TX Transmit for UART 1 DO Data Interfaces- UART2 UART2_RX Receive for UART2 DI UART2_TX Transmit for UART2 DO Data Interfaces- I2C I2C_SDA I2C Data DI/DO I2C_SCL I2C Clock DO
11 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide Data Interfaces- SPI SPIM_MOSI SPI Master Out Slave In DO SPIM_MISO SPI Master In Slave Out DI SPIM_EN SPI master interface enable DO SPIM_CLK SPI master interface clock DO Module Control and State Interfaces WWAN_STATE Wireless WAN Radio State DO POWER_ON Power On the module DI WAKEUP_OUT Module wakes up host OR GPIO DO WAKEUP_IN Host wakes up module OR GPIO. DI RESET Reset the module DI Power and GND VREF Reference Logic Voltage AO VCC Main Power AI GND Ground AI General Purpose GPIO General Purpose I/O DI/DO ADC Analog to Digital Convertor AI Audio- PCM/I2S PCM_SYNC PCM_SYNC DI /DO PCM_IN PCM_IN DI PCM_OUT PCM_OUT DO PCM_CLK PCM_CLK DO
12 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide Table 3. Pin Assignments Pin No. Signal Name Description Voltage Levels (V) Min. Typ. Max. 1 GND Ground - 0 - 2 GND Ground - 0 - 3 NC NC - - - 4 GND Ground - 0 - 5 GND Ground - 0 - 6 GND Ground - 0 - 7 GND Ground - 0 - 8 GND Ground - 0 - 9 NC NC - - - 10 GND Ground - 0 - 11 GND Ground - 0 - 12 GND Ground - 0 - 13 GND Ground - 0 - 14 GND Ground - 0 - 15 RF_1 Main Antenna - - - 16 GND Ground - 0 - 17 GND Ground - 0 - 18 GND Ground - 0 - 19 GND Ground - 0 - 20 GND Ground - 0 - 21 RF_2 Aux Antenna - - - 22 GND Ground - 0 - 23 GND Ground - 0 - 24 GND Ground - 0 - 25 GND Ground - 0 - 26 GND Ground - 0 - 27 NC NC - - - 28 GND Ground - 0 - 29 GND Ground - 0 - 30 GND Ground - 0 -
13 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide 31 GND Ground - 0 - 32 GND Ground - 0 - 33 NC NC - - - 34 GND Ground - 0 - 35 GND Ground - 0 - 36 GND Ground - 0 - 37 VCC1 Power 3.3 3.8 4.2 38 VCC2 Power 3.3 3.8 4.2 39 VCC3 Power 3.3 3.8 4.2 40 VCC4 Power 3.3 3.8 4.2 41 VCC5 Power 3.3 3.8 4.2 42 VCC6 Power 3.3 3.8 4.2 43 NC NC - - - 44 GND Ground - 0 - 45 GND Ground - 0 - 46 PCM_SYNC/GPIO46 PCM_SYNC or GPIO 1.7 1.8 1.9 47 PCM_IN/GPIO47 PCM_IN or GPIO 1.7 1.8 1.9 48 PCM_OUT/GPIO48 PCM_OUT or GPIO 1.7 1.8 1.9 49 PCM_CLK/GPIO49 PCM_CLK or GPIO 1.7 1.8 1.9 50 GND Ground - 0 - 51 GND Ground - 0 - 52 GPIO01 GPIO 1.7 1.8 1.9 53 GPIO02 GPIO 1.7 1.8 1.9 54 GPIO03 GPIO 1.7 1.8 1.9 55 GPIO04 GPIO 1.7 1.8 1.9 56 NC NC - - - 57 NC NC - - - 58 NC NC - - - 59 NC NC - - - 60 I2C_SDA I2C Data 1.7 1.8 1.9 61 I2C_SCL I2C Clock 1.7 1.8 1.9 62 NC NC - - - 63 NC NC - - -
14 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide 74 GND Ground - 0 - 75 GND Ground - 0 - 76 NC NC - - - 77 NC NC - - - 78 NC NC - - - 79 NC NC - - - 80 UART1_CTS (UART1) Clear To Send for UART 1 1.7 1.8 1.9 81 UART1_RTS (UART1) Request To Send for UART 1 1.7 1.8 1.9 82 UART1_RX (UART1) Receive for UART 1 1.7 1.8 1.9 83 UART1_TX (UART1) Transmit for UART 1 1.7 1.8 1.9 84 GND Ground - 0 - 85 GND Ground - 0 - 86 USB_Dp USB Data Positive - - - 87 GPIO87 GPIO 1.7 1.8 1.9 88 USB_Dn USB Data Negative - - - 89 GND Ground - 0 - 90 GND Ground - 0 - 91 GND Ground - 0 - 92 NC NC - - - 93 GPIO93 GPIO 1.7 1.8 1.9 94 GPIO94 GPIO 1.7 1.8 1.9 95 GPIO95 GPIO 1.7 1.8 1.9 96 GPIO96 GPIO 1.7 1.8 1.9 97 GPIO97 GPIO 1.7 1.8 1.9 98 NC NC - - - 99 NC NC - - - 100 NC NC - - - 101 NC NC - - - 102 NC NC - - - 103 NC NC - - - 104 GND Ground - 0 - 105 GND Ground - 0 - 106 UART2_RX (UART2) Receive for UART2 1.7 1.8 1.9
15 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide 107 UART2_TX (UART2) Transmit for UART2 1.7 1.8 1.9 108 GND Ground - 0 - 109 GND Ground - 0 - 120 NC NC - - - 121 NC NC - - - 122 ADC Analog to Digital Converter 1.7 1.8 1.9 123 NC NC - - - 124 NC NC - - - 125 SPIM_MOSI SPI Master Out Slave In data line 1.7 1.8 1.9 126 SPIM_MISO SPI Master In Slave Out data line 1.7 1.8 1.9 127 SPIM_EN SPI master interface enable signal 1.7 1.8 1.9 128 SPIM_CLK SPI master interface clock 1.7 1.8 1.9 129 GPIO05 GPIO 1.7 1.8 1.9 130 GPIO06 GPIO 1.7 1.8 1.9 131 GPIO07 GPIO 1.7 1.8 1.9 132 GPIO08 GPIO 1.7 1.8 1.9 133 UIM_VCC SIM Card Power 1.7 2.7 1.8 3.0 1.9 3.3 134 UIM_DATA SIM Card Data Line 1.7 2.7 1.8 3.0 1.9 3.3 135 UIM_CLK SIM Card Clock Line 1.7 2.7 1.8 3.0 1.9 3.3 136 UIM_RESET SIM Card Reset Line 1.7 2.7 1.8 3.0 1.9 3.3 137 UIM_DETECT SIM Card Detect Line 1.7 1.8 1.9 138 NC NC - - - 139 GND Ground - 0 - 140 GND Ground - 0 - 141 WWAN_STATE Wireless WAN Radio State 1.7 1.8 1.9 142 POWER_ON Power On the module: Low is Module ON and High is 1.7 1.8 1.9
16 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide Module OFF. 143 WAKEUP_OUT Module wakes up host. 1.7 1.8 1.9 144 WAKEUP_IN Host wakes up module. 1.7 1.8 1.9 145 RESET Main reset line. Active low 1.7 1.8 1.9 146 VREF Reference Logic Voltage 1.7 1.8 1.9 200 NC NC - - - 201 JTAG_TCK JTAG/EJTAG clock 1.7 1.8 1.9 202 JTAG_TDI JTAG/EJTAG input data 1.7 1.8 1.9 203 JTAG_TDO JTAG/EJTAG output data 1.7 1.8 1.9 204 JTAG_TMS JTAG/EJTAG test mode select 1.7 1.8 1.9 205 JTAG_TRST_N EJTAG reset; emulation JTAG is used to debug and run software on embedded MIPS processors. Only driven high when in use 1.7 1.8 1.9 206 NC NC - - - 207 NC NC - - - 208 GND Ground - 0 -
17 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide Below is the I/O default setting table to describe the level. It was recommended to follow the pulling High or Low to choose a suitable GPIO for application. PU : Pull Up. PD : Pull Down NP : Non-Pull I/O default setting table Pin No. Signal Name Type Default setting in Normal mode 15 RF_1 AI/AO - 21 RF_2 AI - 46 PCM_SYNC/GPIO46 DI /DO PD 47 PCM_IN/GPIO47 DI PU 48 PCM_OUT/GPIO48 DO PU 49 PCM_CLK/GPIO49 DO PD 52 GPIO01 DI/DO PD 53 GPIO02 DI/DO PD 54 GPIO03 DI/DO PD 55 GPIO04 DI/DO PD 60 I2C_SDA DI/DO PU 61 I2C_SCL DO PU 80 UART1_CTS (UART1) DI PD 81 UART1_RTS (UART1) DO PD 82 UART1_RX (UART1) DI PU 83 UART1_TX (UART1) DO PU 86 USB_Dp DI/DO - 87 GPIO87 DI/DO PD 88 USB_Dn DI/DO - 93 GPIO93 DI/DO PU 94 GPIO94 DI/DO PD 95 GPIO95 DI/DO PD 96 GPIO96 DI/DO PD
18 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide 97 GPIO97 DI/DO PU 106 UART2_RX (UART2) DI PU 107 UART2_TX (UART2) DO PU 122 ADC AI PU 125 SPIM_MOSI DO PU 126 SPIM_MISO DI PU 127 SPIM_EN DO PD 128 SPIM_CLK DO PD 129 GPIO05 DI/DO PD 130 GPIO06 DI/DO PD 131 GPIO07 DI/DO PD 132 GPIO08 DI/DO PD 134 UIM_DATA DI/DO PU 135 UIM_CLK DO PU 136 UIM_RESET DO PU 137 UIM_DETECT DI/DO PU 141 WWAN_STATE DO PD 142 POWER_ON DI PD 143 WAKEUP_OUT DO PD 144 WAKEUP_IN DI PU 145 RESET DI PU 201 JTAG_TCK DI PD 202 JTAG_TDI DI PD 203 JTAG_TDO DO PU 204 JTAG_TMS DI PD 205 JTAG_TRST_N DI PD
19 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide Table 4. Digital I/O specifications Parameter Description Min. Typ. Max. Units VIH Logic High Input Voltage 0.85*VREF - VREF + 0.3 V VIL Logic Low Input Voltage -0.3 - 0.25*VREF V IIH Input Leakage Current (Either Low or High and No Pull enabled) - - ± 10  VOH Logic High Output Voltage VREF  0.45 - VREF V VOL Logic Low Output Voltage 0 - 0.8 V IOZH Tri-state Output Leakage Current (either Low or High) - - ±10  RPU Internal Pull Up Resistor 53 89 16  RPD Internal Pull Down Resistor 54 96 189 K Input Capacitance Input Pin Capacitance - - 7 pF Notes: *1. If voltage level of digital I/O from the other side is not compatible with module, level shifter is recommended to transfer the voltage level to 1.8V.
20 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide 2.2. Power supply IMA3 includes an integrated Power Manager enabling single and direct voltage supply from the battery and reducing the overall bill of materials. Table 5. Power supply specifications Power Signal Name Pin No. Description Voltage Levels (V) Min. Typ. Max. VCC VCC1 to VCC6 3742 Main Power Supply 3.3 3.8 4.2 Layout Suggestion: Each power trace should possess sufficient line width to withstand its respective current listed in the table below: Net Name Current Value VCC(1–6) total 1.5A UIM_VCC 150 mA VREF 100 mA Note : The current of VCC in real measurement is less than 800mA, but it would be better to routed under 1.5A design for getting stable power. 2.3. USB interface IMA3 complies with USB 2.0 high-speed protocol. The USB input/output lines comply with USB 2.0 specifications. If USB interface is not used, recommended to reserve USB_Dp and USB_Dn test points. Table 6. Signals of the USB interface Name Description Input/Output (Direction to module) Voltage Levels (V) Min. Typ. Max. D+ USB data positive (low-/full-speed) Input High 2 3.3 3.6 Input Low 0  0.8
21 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide Output High 2.8 3.3 3.6 Output Low   0.3 USB data positive (high-speed) Input High 0.3  0.44 Input Low 0  0.01 Output High 0.36 0.38 0.44 Output Low 0  0.01 D– USB data negative (low-/full-speed) Input High 2 3.3 3.6 Input Low 0  0.8 Output High 2.8 3.3 3.6 Output Low   0.3 USB data negative (high-speed) Input High 0.3  0.44 Input Low 0  0.01 Output High 0.36 0.38 0.44 Output Low 0  0.01 Layout suggestion:  Differential impedance: 90   Space to other signals should be at least 20 mils  Intra-pair length mismatch should be less than 150 mils  If reserved USB test point, it also suggest the trace should be followed differential impedance 90  and put the USB_Dp, USB_Dn test points together USB Length in IMA3 is tuned as below: Function Net Name Length (mil) USB USB_Dp 167.08 USB_Dn 197.62
22 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide 2.4. SIM interface IMA3 includes an SC controller, interface pins, and a dedicated LDO (3.0 V or 1.8 V). Since IMA3 is not equipped with a SIM socket, it must place a SIM socket on the user interface board. IMA3 provides a UIM_DETECT input pin to detect if the SIM card is present. If the USIM card is present, UIM_DETECT should be high. (The voltage level should be 1.8 V) If the USIM card is absent, UIM_DETECT should be low. (The module is internally pulled down.) It was recommended to choose a SIM socket with the Card Detect pin. If the SIM card is preset, the pin will not contact the ground and pull up to 1.8 V through a 2 k resistor. If the SIM card is absent, the pin will normally contact the ground. Other types of SIM sockets which can achieve this feature are also acceptable. A 100 nF capacitor and a 1 r are placed between the UIM_VCC and Ground pins in a parallel manner. (If the UIM_VCC circuit is too long, a larger capacitor such as a 4.7 capacitor can be employed if necessary.) Four 33 pF capacitors (0402 package is recommended.) are placed between the UIM_VCC and Ground pins, the UIM_CLK and Ground pins, the UIM_DATA and Ground pins, and the UIM_RESET and Ground pins in parallel to filter out interference from RF signals. (An R/C circuit on pin UIM_CLK is optional. If there is an EMI issue on this clock signal, try to adjust these R/C values.) We recommend taking protective measures against electrostatic discharge (ESD) near the SIM socket. The TVS diode with a VRWM of 5 V and junction capacitance of less than 10 pF must be placed as close as possible to the SIM socket, and the Ground pin of the ESD protection component must be well connected to the power Ground pin that supplies power to IMA3. Figure 2. SIM card interface circuit
23 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide 2.5. Control interface (signals) This section describes the host-to-modem wake-up interface and power-on signal to enable or disable the control module. 2.5.1. Power-on Signal The POWER_ON pad is an input signal used to control whether the module is in the Module Enabled or Module Disabled state. Do not toggle the PERST# pin during power-on. This signal has the highest priority over the wakeup, the alarms signals, and the digital control pins. The POWER_ON signal is Active Low (VIL for VREF), its voltage level is 1.8V if going to High for Module Disabled:  POWER_ON is High: Module is OFF  POWER_ON is Low: Module is ON There are three possible states of the module:  Module Off - VCC is not present.  Module Enabled - VCC is supplied, and the module is enabled.  Module Disabled - VCC is supplied, and the module is disabled. The state transitions are defined as follows:  When voltage is applied to VCC, the module shall enter the Module Disabled state.  An input to the POWER_ON pad shall trigger the transition from the Module Disabled to the Module Enabled state.  An input to the POWER_ON pad shall trigger the transition from the Module Enabled to the Module Disabled state.
24 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide VCC PowerPOWER_ONRESET Module Enable Module Disable TonTon≧0ms VCC Power ON Power OFF Power OFF UART1_RTSUART2_TXUART2_RXTdelay≧500msTdelayTboot≧10sTboot≧10sStarts transmitting message or commandsStarts receiving message or commandsVref (1.8V)36s ≤ T ≤ 100 s Figure 3. Power ON/OFF timming In order to prevent the POWER_ON signal in a floating state, default had a internal pull low 200 k resistor to power on the module. For controlling the module well, it was recommended to pull LOW for Module Enabled, or pull HIGH to VREF for Module Disabled. UART1_RTS signal should be LOW at least 500ms while booting up the system, since there is a internal booting configuration limited. UART2_TX and UART2_RX signals should keep HIGH over 10 seconds, since any transmition activity in the period will let the system stop in u-boot mode.
25 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide 2.5.2. Host-to-modem wake-up interface In applications where the device power consumption is a major target of optimization such as battery-operated sensors that are based on IOT/M2M modem solution and in addition, include a third-party host, it is necessary to define a simple interface that will allow both the modem and the host to be able to enter low power states whenever possible while allowing the other side to wake it up when required. For example, if the host has no data to transmit or any other tasks, it may wish to enter some low power state according to its own capabilities and configurations. If during the time the host is in a low power state and the modem suddenly receives data, it must wake-up the host. A similar requirement exists from the other side. If, for example, the modem is in a low power state and suddenly the host must transmit data, it must to be able to wake-up the modem. Each side has notification functionality when they are up and ready to follow a wake-up request. The idea behind the suggested method is to have a very simple interface that will also be pin-limited (requires only two pins) to fit into such limited-pin-count applications and packages. The interface consists of two lines: one is driven by the host and received by the modem, and the other is driven by the modem and received by the host. Each side can wake the other side by toggling it high and allowing the other side to go to sleep when not needed by toggling it low. Toggling the signal high does not necessary mean the other side will enter the low power state; the toggling function is only intended to notify the other side that its functions will not be required in the near term and that it is allowed to enter a low power state if he can (according to its own tasks, configurations, and capabilities). The following diagram depicts how this simple interface works. In addition to the two hardware signals, additional higher-level messages may be defined to pass further information or details between the host and the modem if required.
26 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide If the Power states of “Sleep” and “Hibernation” feature are required, it was recommended to connect WAKEUP_IN and WAKEUP_OUT signal to Host. This design can make sure IMA3 can be waked up by Host.  WAKEUP_IN LOW: Host does not need the MODEM (allowing it to sleep). HIGH: Host needs the MODEM or acknowledges it is ready following a wakeup request from the MODEM.  WAKEUP_OUT LOW: MODEM does not need the Host (allowing it to sleep). HIGH: MODEM needs the Host or acknowledges it is ready following a wakeup request from the Host. The first part is Close UART interface. To confirm that both Host and Modem will not send data with each other. If there is no data traffic, then enter low power state. The second part is Open UART interface. Host can notify Modem to wakeup via WAKEUP_IN High, or Modem can notify Host via WAKEUP_OUT high. There are some steps to make a communication between Host and Modem. Please refer to Figure 4 and Figure 5.
27 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide Low Power stateWAKEUP_INHOST_UART_TX(UART1_RX)MODEM_UART_TX(UART1_TX)WAKEUP_OUTA B C D E FHost sends DataTransmit Data Figure 4. Open UART interface  Host to Modem A. Host detects that it has nothing to send and Modem isnt transmitting any data (HOST_UART_TX = 0). Host requests Modem to enter low power state and send AT%IFSUSP to Modem. B. Modem receives AT%IFSUSP and decides whether to send OK or Not Ready response. If Modem wants to suspend communication, it will not send any data (MDOEM_UART_TX = 0). If Host receives Not Ready, it can send data over HOST_UART_TX. If Host still wants to suspend the UART interface, it should continue trying to send AT%IFSUSP every 100ms. (This number should be adjusted soon) C. Host receives OK. Then Host drops WAKEUP_IN to request Modem to enter Low Power state, which includes Sleep mode, Hibernation mode, or PSM mode. It depends on the software configure. D. Modem detects WAKEUP_IN is down, and drops WAKEUP_OUT. Modem enters Low Power state. E. Host wants to send data to Modem. WAKEUP_IN is up. F. Modem is awaking and brings WAKEUP_OUT up when Modem is ready. Then Host can start to send data to Modem.
28 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide Low Power stateWAKEUP_INHOST_UART_TX(UART1_RX)MODEM_UART_TX(UART1_TX)WAKEUP_OUTA B C D G HModem sends DataTransmit Data Figure 5. Open UART interface  Modem to Host There is another scenario to open UART interface by Modem. The step A to D is same as opening UART interface by Host. But step G and H is different. G. Modem wants to send data to Host. WAKEUP_IN is up H. Host is awaking and brings WAKEUP_IN up when Host is ready. Then Host can start to send data to Modem.
29 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide 2.5.3. Reset Signal The Reset Signal is a hardware reset signal to control the system reset directly. You can connect it to a key or a control signal. It was recommended to reserve a pull up resistor and a capacitor to ground. Default is not installed. It is required that the Reset Signal is kept LOW at least 3 seconds after a command to reset the module has been issued to ensure that there is time for the module reset properly. Figure 6. Reset Signals circuit
30 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide 2.6. Digital interface This section provides the required AC timing information relating to Module Digital Interfaces. 2.6.1. SPI Master Interface Operating Modes The SPI master controller supports two operating modes: Standard SPI protocol: – SPIM_CLK  Output clock – SPIM_CS  Output, chip-select – SPIM_MOSI  Output, data to slave – SPIM_MISO  Input, data from slave LCD interface protocol: – SPIM_CLK  Output clock – SPIM_CS  Output, chip-select – SPIM_MOSI  Output, data to slave – SPIM_MISO  Output, command/data control bit to slave Interface timing is defined separately for each SPI operating mode. Timing Modes Each operating mode, as described above, can be configured to one of the following timing modes: SPI_CLK_POS: Both output data and input data are related to the clock rising edge SPI_CLK_NEG: Both output data and input data are related to the clock falling edge
31 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide Figure 7. SPI_CLK_POS timing diagram Figure 8. SPI_CLK_NEG timing diagram Table 7. Standard SPI mode timing (both SPI_CLK_OS and SPI_CLK_NEG) Parameter Minimum Maximum Unit Description TCYCLE 20 - ns Clock cycle time TSU 5 - ns Input setup time THO 0 - ns Input hold time TPD 1.5 8.5 ns Output delay
32 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide Table 8. LCD mode timing (both SPI_CLK_OS and SPI_CLK_NEG) Parameter Minimum Maximum Unit Description TCYCLE 20 - ns Clock cycle time TSU 5 - ns Input setup time THO 0 - ns Input hold time MOSI TPO 1.5 8.5 ns Output delay MISO TPD 1.5 16 ns Output delay 2.6.2. PCM Interface IMA3 The PCM interface enables communication with an external codec to support a linear format. Figure 9. Recommended circuit for the PCM interface Use a TVS on the related interface to prevent electrostatic discharge and protect integrated-circuit (IC) components.
33 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide 2.6.3. I2S Interface PCM and I2S share the same pins on IMA3, the PCM signal pins can be configured as an I2S interface. Figure 10. Recommended circuit for the I2S interface Pad Config1 Config2 46 PCM_SYNC I2S_LRCK 47 PCM_DIN I2S_DATA_IN 48 PCM_DOUT I2S_DATA_OUT 49 PCM_CLK I2S_BCK
34 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide 2.6.4. I2C Interface There is one I2C interface in IMA3. It was recommended to add pull high to 1.8 V through resistors with values of 2.2  to 4.7 k. ICs and sensors can use the same I2C interface. IMA3 can recognize them by different addresses. I2C interface only supports master mode. Figure 11. Recommended circuit for the I2C interface
35 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide 2.6.5. UART Interface There are dual UART interfaces. One is 4 bit for high-speed data transfer, and the other is 2 bit for diagnostic tools and debugging. Recommended to reserve a pull down 1kΩ resistor on UART1_RTS signal near IMA3 module side for booting up normally. Figure 12. Recommended circuit for UART interface (4 bit) with Level translator Note : UART1_RTS signal should be LOW at least 500ms while booting up the system, since there is a internal booting configuration limited.
36 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide 2.7. ADC interface One Analog to Digital Converter (ADC) input is provided by IMA3. The converter is of a 10 bit resolution, ranging from 0.1 V to 1.8 V with a sampling rate of 2 MHz. They can be used for customer applications. Table 9. ADC interface Signal Name Pads Type Description ADC 122 Analog Analog to digital conversion input Table 10. Electrical characteristics of the ADC interface Parameter Minimum Typical Maximum Unit Input signal range 0.1 - 1.8 V Resolution - 10 - bit Offset error - 1 2 %FS Sampling time - 10 - Clock Cycles Conversion clock 0.04 2 - MHz Throughput rate - 2 - MSPS Notes : 1. %FS = % Full Scale 2. MSPS = Million Samples per Second
37 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide 2.8. GPIO IMA3 includes general purpose I/O signals that are summarized in the following table. These GPIOs are available for customer-defined purposes such as control, signaling, and monitoring. Some GPIO signals also can be configured as PCM signals for audio applications. Table 11. GPIOs Signal Name Pads Description Alt. Function GPIO01 52 Configurable general purpose I/O GPIO02 53 Configurable general purpose I/O GPIO03 54 Configurable general purpose I/O GPIO04 55 Configurable general purpose I/O GPIO05 129 Configurable general purpose I/O GPIO06 130 Configurable general purpose I/O GPIO07 131 Configurable general purpose I/O GPIO08 132 Configurable general purpose I/O GPIO46 46 Configurable general purpose I/O PCM_SYNC GPIO47 47 Configurable general purpose I/O PCM_IN GPIO48 48 Configurable general purpose I/O PCM_OUT GPIO49 49 Configurable general purpose I/O PCM_CLK GPIO87 87 Configurable general purpose I/O GPIO93 93 Configurable general purpose I/O GPIO94 94 Configurable general purpose I/O GPIO95 95 Configurable general purpose I/O GPIO96 96 Configurable general purpose I/O GPIO97 97 Configurable general purpose I/O
38 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide 3. RF Specifications 3.1. RF connections IMA3 provides two RF pads; developers can connect them via 50  traces to the main board. TRX pads  RX/TX path It is recommended to have keep-out under RF pads. 3.2. Interference and sensitivity This section is to help developers to identify the interference that may affect IMA3 when adopting it in systems. Interference from other wireless devices Harmonics or inter-modulated signals generated from wireless devices that fall in RX ranges of IMA3 may result in degraded RX performance. It is highly recommended to check the RX performance of the entire systems in the shielding environment. Interference from the host interface High-speed switching signal elements in the system can easily couple noise to the module (Ex.: DDR memory, LCD modules, DC-DC converter). Methods to avoid sources of interference Antenna location is important; it is recommended that the antenna away from high-speed switching signals. Tracing from the module to the antenna is recommended to be as short as possible and must be shielded by complete grounding. However, IMA3 is well-shielded. The high-speed elements in the system are recommend to be reserved for shielding during an early stage development.
39 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide 3.3. Radiated sensitivity measurement Over-the-air testing can demonstrate the TRX ability of the whole system. Keys elements that affect the measurement are: Module ability (refer Specification) Antenna Gain System noise source The OTA performance should be performed in an OTA chamber. 3.4. Supported frequencies Table 12. IMA3 supported frequencies Band Uplink (MHz) Downlink (MHz) LTE Band 2 1,8501,910 1,9301,990 LTE Band 4 1,7101,755 2,1102,155 LTE Band 12 699716 729746 Table 13. Band Bandwidth 1.4 MHz 3 MHz 5 MHz 10 MHz 15 MHz 20 MHz LTE Band 2 V V V V LTE Band 4 V V V V LTE Band 12 V V
40 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide 3.5. Power consumption IMA3 was designed for the IoT and M2M markets. WNC has devoted special attention from the beginning of development to low power design and has undergone major efforts to further reduce the system power consumption in order to achieve unprecedented figures for an LTE device. The system can exist at any given time in one of the defined power states. Each of these power states defines what power supplies are available, what clock the system is operating on, and additional hardware requirements such as IO usage and connectivity. In the operational mode the system will move from one power state to another based on the specific operational mode/scenario and based on different parameters such as: system configured permissions, hardware limitations, and the time left until the next required activity. Table 14. System Power States Power State Description Available Interfaces Active The system is active, operating on the high PLL clock. All interfaces may be used according to the system configuration Sleep All systems are halted. Module registers data is retained. DRAM is in self-refresh. The system can be configured to wake up from a slow clock counter at a specific time or by one of the specific pins. These pins can be used to wake up the device from deep-sleep state: WAKEUP_IN pin. The USB interface can also wake the device from the sleep state Hibernation All system data is retained in DDR memory, but all user interfaces are disabled. A 32.768 KHz clock counter can be configured to wake the system at a specific time or use the AKEUP_IN. After entering Hibernation, USB interface was disabled. If user want to resume USB interface, WAKEUP_IN pin
41 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide please reboot IMA3 PSM Power Saving Mode is newly added feature in 3GPP Release 12 and is specified in 3GPP 24.301-5.3.11 Power saving mode and 23.682-4.5.4 UE Power Saving Mode. PSM is applied between the expiration of T3324 and T3412. None Off The modem has no power supply; there is no system clock. None The following figure depicts the possible transitions between the system power states. The system can be turned off from any power state (by shutting the external supplies or by toggling high POWER_ON pin input). performed from the active state. Deep Hibernation state was not supported in this module. Figure 13. Power-state transitions
42 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide Figure 14 can describe the PSM mechanism between User Equipment (UE) and Network (NW). The time of T3412 could be configured by users. Please refer to the document WNC IMA3 Application Notes for Power Saving Mode v0.9.4.pdf for the commands of PSM. < RRC Setup >T3324 and/or T3412 Extended ValueAttach Request< Authentication/Security >Attach AcceptT3324 and/or T3412 Extended ValueRRC ReleaseNormal Idle Mode : Monioring PagingUE NWT3412 Extended ValuePower Saving Mode : (1) No Monitoring fro Paging (2) Turning off all the functionality that is not critical< RRC Setup >Tracking Area Update RequestT3324 and/or T3412 Extended ValueTracking Area Update AcceptT3324 and/or T3412 Extended Value< Data Traffic >RRC ReleaseT3342 Figure 14. PSM mechanism between UE and NW
43 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide 3.6. Module power states In the operational modes, the system can be configured to use the different power states. The system state is selected according to the permissions, required activity, and the available expected time until the next power state. This method allows the power management to be very dynamic and flexible and to be tuned according to the needs of each product/application and according to specific conditions. The following table shows several main system operational modes and the different system power states used in each mode. If the Power states of “Sleep” and “Hibernation” feature are required, it was recommended to connect WAKEUP_IN and WAKEUP_OUT signal to Host. This design can make sure IMA3 can be waked up by Host. Table 15. Power Consumption result LTE Working Mode Conditions Result ( VCC=3.8V) Airplane mode Only Module, no other device TBD LTE standby – Hibernation (1.28 sec) Band2 LTE Standby mode, DRX = 1.28 sec TBD Band4 LTE Standby mode, DRX = 1.28 sec TBD Band12 LTE Standby mode, DRX = 1.28 sec TBD LTE standby – Sleep (1.28 sec) Band2 LTE Standby mode, DRX = 1.28 sec TBD Band4 LTE Standby mode, DRX = 1.28 sec TBD Band12 LTE Standby mode, DRX = 1.28 sec TBD Band2 Working mode Band2  Bandwidth 10MHz, TX Power=23dbm Cat. M1, Downlink 1Mbps/ Uplink 1Mbps via USB interface by iperf tool TBD
44 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide Band4 Working mode Band4  Bandwidth 10MHz, TX Power=23dbm Cat. M1, Downlink 1Mbps/ Uplink 1Mbps via USB interface by iperf tool TBD Band12 Working mode Band12  Bandwidth 10MHz, TX Power=23dbm Cat. M1, Downlink 1Mbps/ Uplink 1Mbps via USB interface by iperf tool TBD Powering on Conditions Result (VCC=3.8V) Peak power consumption Power consumption peak when the module is powering up TBD Power off Conditions Result (VCC=3.8V) Module disable Provided VCC Power but POWER_ON is High to disable module < 8uA Note : The current value was measured at VCC = 3.8V voltage level.
45 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide 4. Software Interface IMA3 can be configured with several types of configurations for different external host processors which require data communication to the Internet. The basic concept is that the module provides proper interfaces for its control and for the data traffic, which supports as many external host processors as possible with different capabilities for network connection. Please refer to the IMA3  for further detail.
46 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide 5. Mechanical and Environmental Specifications 5.1. PCBA form factor Dimensions and recommended PCB Layout footprint for IMA3. Figure 15. PCBA dimensions
47 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide Figure 16. Recommended PCB layout footprint (top view)
48 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide 5.2. Module PCB Layout This section depicts the inner layer of IMA3 PCB layout to understanding of the module design. Top layer: Figure 17. Top layer of IMA3 PCB layout
49 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide Bottom layer: Figure 18. Bottom Layer of IMA3 PCB layout
50 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide 5.3. Reflow This section details the recommended reflow profile when the module is mounted onto other boards. Temp. Region 1 2 3 4 5 6 7 8 9 10 11 Upper temp. region 120 170 170 170 170 190 225 225 245 250 245 Lower temp. region 120 170 170 170 170 190 225 225 245 250 245 Conveyer band speed 90 cm/minute Figure 19. Reflow Profile of IMA3 Table 16. Reflow data PWI = 60% D31-1 D31-2 U23-3 U23-4 Temp. Difference Preheat from 140–190°C 4.34 93.50 96.60 95.96 3.1 39% 34% 52% 48% Melt-out Time/230°C 4.88 55.19 50.65 52.55 4.54 49% 52% 6% 26%
51 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide Max Temp 45.73 246.01 245.56 245.38 0.63 57% 60% 56% 54% Total Time/217°C 3.45 84.37 80.45 80.82 3.92 -6% -3% -18% -17% Gradient1 (100–150°C) 2.27 2.31 2.22 2.22 0.09 52% 54% 48% 48% Table 17. Process limit Solder Paste Lead-free Profile feature Min. Max. Unit Gradient1 (Target = 1.5) (100 °C –150 °C) (Time period = 20 s) 0 3 °C /sec Preheat time from 140 °C to 190 °C 70 105 sec Time maintained above 230 °C 40 60 sec Peak package body temperature 230 250 °C Time maintained above 217 °C 60 110 sec
52 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide 5.4. Labeling Figure 20. Label form
53 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide 5.5. Thermal considerations Ambient operating temperature: 25 °C to +75 °C (20 °C to +60 °C fully compliant with 3GPP; 25 °C to +75 °C functional work) Ambient storage temperature: 40 °C to +85 °C The case temperature of module shielding cover must be < 85 °C when integrated to prevent damage. Design points used to improve the thermal performance:  Its better to add a naked copper area onto IMA3 module back side of the PCB. If the thermal performance becomes an thermal solutions for improvement such as a thermal pad or a heat sink.  Its recommended to have a thermal pad or a heat sink on shielding cover to help transfer heat.  If systems with IMA3 module embedded intend to work under ambient temperatures as low as -40°C , its suggested that: 1. SIM Card need to be well arranged to make sure it is functional at the condition of ambient temperature as low as -40°C . 2. Adding heating circuit on board design, the circuit mainly consists of temperature sensing unit, heating element and control unit.
54 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide 6. Regulatory and Industry Approvals 6.1. Certification testing PTCRB, FCC and AT&T TA 6.2. Safety and hazards Be sure the use of this product is allowed in the country and in the environment required. The use of this product may be dangerous and must be avoided in the following areas:  Where it can interfere with other electronic devices in environments such as hospitals, airports, and aircraft  Where there is a risk of explosion such as gasoline stations and oil refineries It is the responsibility of the user to comply with his or her country regulations and the specific environmental regulations. Do not disassemble the product; any mark of tampering will compromise the warranty validity. We recommend following the instructions of the hardware user guides for a correct wiring of the product. The product must be supplied with a stabilized voltage source, and the wiring must conform to the security and fire-prevention regulations. This product must be handled with care; avoid any contact with the pins because electrostatic discharge may damage the product. Same caution must be taken regarding the SIM card; carefully check the instructions for its use. Do not insert or remove the SIM when the product is in power-saving mode. The system integrator is responsible of the functioning of the final product; therefore, care must be taken for the external components of the module as well as for project or installation issuesthere may be a risk of disturbing the GSM network or external devices or of having an impact on device security. If you have any doubts, please refer to the technical documentation and the relevant regulations in force. Every module must be equipped with a proper antenna with specific characteristics. The antenna must be installed with care in order to avoid any interference with other electronic devices.
55 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide 7. Packaging The IMA3 modules are delivered in tape and reel. Figure 21. Packing-Tape
56 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide Figure 22. Packingreel Figure 23. Packingcarton
57 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide 8. Safety Recommendation Be sure the use of this product is allowed in the country and in the environment required. The use of this product may be dangerous and must be avoided in the following areas:  Where it can interfere with other electronic devices in environments such as hospitals, airports, and aircraft  Where there is a risk of explosion such as gasoline stations and oil refineries It is the responsibility of the user to comply with the his or her country regulations and the specific environmental regulations. Do not disassemble the product; any mark of tampering will compromise the warranty validity. We recommend following the instructions of the hardware user guides for a correct wiring of the product. The product must be supplied with a stabilized voltage source, and the wiring must conform to the security and fire-prevention regulations. This product must be handled with care; avoid any contact with the pins because electrostatic discharge may damage the product. Same caution must be taken regarding the SIM card; carefully check the instructions for its use. Do not insert or remove the SIM when the product is in power-saving mode. The system integrator is responsible of the functioning of the final product; therefore, care must be taken for the external components of the module as well as for project or installation issuesthere may be a risk of disturbing the GSM network or external devices or of having an impact on device security. If you have any doubts, please refer to the technical documentation and the relevant regulations in force. Every module must be equipped with a proper antenna with specific characteristics. The antenna must be installed with care in order to avoid any interference with other electronic devices.
58 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide 9. Appendix In order to describe more detailed about the I/O default setting while entering Sleep or Hibernation is as below table. Table 18. I/O default setting table Pin No. Signal Name Type Default setting in Normal mode Default Setting while entering Sleep or Hibernation 15 RF_1 AI/AO - - 21 RF_2 AI - - 46 PCM_SYNC/GPIO46 DI /DO PD PD 47 PCM_IN/GPIO47 DI PU PU 48 PCM_OUT/GPIO48 DO PU PU 49 PCM_CLK/GPIO49 DO PD PD 52 GPIO01 DI/DO PD PD 53 GPIO02 DI/DO PD PD 54 GPIO03 DI/DO PD PD 55 GPIO04 DI/DO PD PD 60 I2C_SDA DI/DO PU PU 61 I2C_SCL DO PU PU 80 UART1_CTS (UART1) DI PD PU 81 UART1_RTS (UART1) DO PD NP 82 UART1_RX (UART1) DI PU PU 83 UART1_TX (UART1) DO PU PU 86 USB_Dp DI/DO - - 87 GPIO87 DI/DO PD PD 88 USB_Dn DI/DO - - 93 GPIO93 DI/DO PU PU 94 GPIO94 DI/DO PD PD 95 GPIO95 DI/DO PD PD 96 GPIO96 DI/DO PD PD 97 GPIO97 DI/DO PU PU
59 / 59 □ Normal □ Internal Use  Confidential □ Restricted Confidential User Manual Guide 106 UART2_RX (UART2) DI PU PU 107 UART2_TX (UART2) DO PU PU 122 ADC AI PU PU 125 SPIM_MOSI DO PU PU 126 SPIM_MISO DI PU PU 127 SPIM_EN DO PD PU 128 SPIM_CLK DO PD PD 129 GPIO05 DI/DO PD PD 130 GPIO06 DI/DO PD PD 131 GPIO07 DI/DO PD PD 132 GPIO08 DI/DO PD PD 134 UIM_DATA DI/DO PU PU 135 UIM_CLK DO PU NP 136 UIM_RESET DO PU NP 137 UIM_DETECT DI/DO PU NP 141 WWAN_STATE DO PD PD 142 POWER_ON DI PD PD 143 WAKEUP_OUT DO PD PD 144 WAKEUP_IN DI PU PD 145 RESET DI PU PU 201 JTAG_TCK DI PD PD 202 JTAG_TDI DI PD PD 203 JTAG_TDO DO PU PU 204 JTAG_TMS DI PD PD 205 JTAG_TRST_N DI PD PD

Navigation menu