Telit Communications S p A LE910SV LTE Module User Manual HE910 Hardware User Guide

Telit Communications S.p.A. LTE Module HE910 Hardware User Guide

User Manual

LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 2 of 79 Applicability Table PRODUCT LE910-EUG LE910-NAG LE910-NVG LE910-SVG LE910-SKG
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 3 of 79 SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Notice While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein. The information in this document has been carefully checked and is believed to be entirely reliable. However, no responsibility is assumed for inaccuracies or omissions. Telit reserves the right to make changes to any products described herein and reserves the right to revise this document and to make changes from time to time in content hereof with no obligation to notify any person of revisions or changes. Telit does not assume any liability arising out of the application or use of any product, software, or circuit described herein; neither does it convey license under its patent rights or the rights of others. It is possible that this publication may contain references to, or information about Telit products (machines and programs), programming, or services that are not announced in your country. Such references or information must not be construed to mean that Telit intends to announce such Telit products, programming, or services in your country. Copyrights This instruction manual and the Telit products described in this instruction manual may be, include or describe copyrighted Telit material, such as computer programs stored in semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit and its licensors certain exclusive rights for copyrighted material, including the exclusive right to copy, reproduce in any form, distribute and make derivative works of the copyrighted material. Accordingly, any copyrighted material of Telit and its licensors contained herein or in the Telit products described in this instruction manual may not be copied, reproduced, distributed, merged or modified in any manner without the express written permission of Telit. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit, as arises by operation of law in the sale of a product. Computer Software Copyrights The Telit and 3rd Party supplied Software (SW) products described in this instruction manual may include copyrighted Telit and other 3rd Party supplied computer programs stored in semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted computer programs, including the exclusive right to copy or reproduce in any form the copyrighted computer program. Accordingly, any copyrighted Telit or other 3rd Party supplied SW computer programs contained in the Telit products described in this instruction manual may not be copied (reverse engineered) or reproduced in any manner without the express written permission of Telit or the 3rd Party SW supplier. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit or other 3rd Party supplied SW, except for the normal non-exclusive, royalty free license to use that arises by operation of law in the sale of a product.
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 4 of 79 Usage and Disclosure Restrictions License Agreements The software described in this document is the property of Telit and its licensors. It is furnished by express license agreement only and may be used only in accordance with the terms of such an agreement. Copyrighted Materials Software and documentation are copyrighted materials. Making unauthorized copies is prohibited by law. No part of the software or documentation may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means, without prior written permission of Telit High Risk Materials Components, units, or third-party products used in the product described herein are NOT fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control equipment in the following hazardous environments requiring fail-safe controls: the operation of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic Control, Life Support, or Weapons Systems (High Risk Activities"). Telit and its supplier(s) specifically disclaim any expressed or implied warranty of fitness for such High Risk Activities. Trademarks TELIT and the Stylized T Logo are registered in Trademark Office. All other product or service names are the property of their respective owners. Copyright © Telit Communications S.p.A. 2014
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 5 of 79 1 INTRODUCTION ......................................................................................................................................................... 7 1.1 SCOPE ................................................................................................................................................................................ 7 1.2 AUDIENCE ........................................................................................................................................................................... 7 1.3 CONTACT INFORMATION, SUPPORT .......................................................................................................................................... 7 1.4 DOCUMENT ORGANIZATION ................................................................................................................................................... 8 1.5 TEXT CONVENTIONS .............................................................................................................................................................. 9 1.6 RELATED DOCUMENTS ........................................................................................................................................................... 9 1.7 DOCUMENT HISTORY .......................................................................................................................................................... 10 2 OVERVIEW .............................................................................................................................................................. 11 3 LE910 MODULE CONNECTIONS................................................................................................................................ 12 3.1 PIN-OUT ......................................................................................................................................................................... 12 3.1.1 LGA Pads Layout ..................................................................................................................................................... 17 4 HARDWARE COMMANDS ........................................................................................................................................ 18 4.1 TURNING ON THE LE910 .................................................................................................................................................... 18 4.2 INITIALIZATION AND ACTIVATION STATE................................................................................................................................... 20 4.3 TURNING OFF THE LE910 ................................................................................................................................................... 21 4.3.1 Shutdown by Software Command .......................................................................................................................... 21 4.3.2 Hardware Shutdown .............................................................................................................................................. 22 4.4 LE910 UNCONDITIONAL SHUTDOWN ..................................................................................................................................... 23 4.5 SUMMARY OF TURNING ON AND OFF THE MODULE ................................................................................................................. 26 5 POWER SUPPLY ....................................................................................................................................................... 27 5.1 POWER SUPPLY REQUIREMENTS ............................................................................................................................................ 27 5.2 POWER CONSUMPTION ....................................................................................................................................................... 28 5.3 GENERAL DESIGN RULES ...................................................................................................................................................... 29 5.3.1 Electrical Design Guidelines ................................................................................................................................... 29 5.3.2 Thermal Design Guidelines ..................................................................................................................................... 33 5.3.3 Power Supply PCB layout Guidelines ...................................................................................................................... 34 6 GSM/WCDMA/LTE RADIO SECTION......................................................................................................................... 36 6.1 LE910 PRODUCT VARIANTS ................................................................................................................................................. 36 6.2 TX OUTPUT POWER ............................................................................................................................................................ 36 6.3 GSM/WCDMA/LTE ANTENNA REQUIREMENTS .................................................................................................................... 37 6.4 GSM/WCDMA/LTE - PCB LINE GUIDELINES ......................................................................................................................... 40 6.5 GSM/WCDMA/LTE ANTENNA - INSTALLATION GUIDELINES .................................................................................................... 41 6.6 ANTENNA DIVERSITY REQUIREMENTS ..................................................................................................................................... 41 7 GNSS RECEIVER ....................................................................................................................................................... 43 7.1 GNSS SIGNALS PINOUT ....................................................................................................................................................... 43 7.2 GPS/GLONASS ANTENNA REQUIREMENTS ............................................................................................................................ 43 7.2.1 GNSS Antenna - PCB Line Guidelines ...................................................................................................................... 44 7.2.2 RF Trace Losses....................................................................................................................................................... 44 7.2.3 GNSS Antenna - Installation ................................................................................................................................... 45 8 LOGIC LEVEL SPECIFICATIONS .................................................................................................................................. 46
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 6 of 79 9 UNCONDITIONAL SHUTDOWN ................................................................................................................................ 47 10 USB PORT ................................................................................................................................................................ 48 10.1 USB 2.0 HS DESCRIPTION ................................................................................................................................................. 48 11 SERIAL PORTS .......................................................................................................................................................... 49 11.1 MODEM SERIAL PORT 1 ............................................................................................................................................... 50 11.2 MODEM SERIAL PORT 2 (USIF1) ................................................................................................................................... 51 11.3 RS232 LEVEL TRANSLATION ................................................................................................................................................ 52 12 AUDIO SECTION OVERVIEW .................................................................................................................................... 54 12.1 ELECTRICAL CHARACTERISTICS ............................................................................................................................................. 54 13 GENERAL PURPOSE I/O ........................................................................................................................................... 55 13.1 GPIO LOGIC LEVELS .......................................................................................................................................................... 56 13.2 USING A GPIO PAD AS INPUT ........................................................................................................................................... 56 13.3 USING A GPIO PAD AS OUTPUT ........................................................................................................................................ 56 13.4 INDICATION OF NETWORK SERVICE AVAILABILITY ..................................................................................................................... 57 13.5 RTC BYPASS OUT ............................................................................................................................................................. 58 13.6 VAUX POWER OUTPUT ..................................................................................................................................................... 58 13.7 ADC CONVERTER ............................................................................................................................................................. 59 13.7.1 Description ........................................................................................................................................................... 59 13.7.2 Using ADC Converter ............................................................................................................................................ 59 14 MOUNTING THE LE910 ON THE APPLICATION ......................................................................................................... 60 14.1 GENERAL ........................................................................................................................................................................ 60 14.2 MODULE FINISHING & DIMENSIONS ..................................................................................................................................... 60 14.3 RECOMMENDED FOOT PRINT FOR THE APPLICATION ................................................................................................................. 62 14.4 STENCIL .......................................................................................................................................................................... 63 14.5 PCB PAD DESIGN .............................................................................................................................................................. 63 14.6 PCB PAD DIMENSIONS ....................................................................................................................................................... 64 14.7 SOLDER PASTE .................................................................................................................................................................. 66 14.7.1 LE910 Solder reflow .............................................................................................................................................. 66 14.8 PACKING SYSTEM (TRAY) .................................................................................................................................................... 68 14.9 PACKING SYSTEM (REEL) .................................................................................................................................................... 70 14.9.1 Carrier Tape Detail ............................................................................................................................................... 70 14.9.2 Reel Detail ............................................................................................................................................................ 71 14.9.3 Packaging Detail .................................................................................................................................................. 72 14.10 MOISTURE SENSITIVITY .................................................................................................................................................... 72 15 SAFETY RECOMMANDATIONS ................................................................................................................................. 73 16 CONFORMITY ASSESSMENT ISSUES ......................................................................................................................... 74 16.1 1999/5/EC DIRECTIVE ..................................................................................................................................................... 74 16.2 FCC/IC REGULATORY NOTICES ............................................................................................................................................ 77
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 7 of 79 The aim of this document is the description of some hardware solutions useful for developing a product with the Telit LE910 module. This document is intended for Telit customers, who are integrators, about to implement their applications using our LE910 modules. For general contact, technical support, to report documentation errors and to order manuals, contact Telit’s Technical Support Center (TTSC) at: TS-EMEA@telit.com TS-NORTHAMERICA@telit.com TS-LATINAMERICA@telit.com TS-APAC@telit.com Alternatively, use: http://www.telit.com/en/products/technical-support-center/contact.php For detailed information about where you can buy the Telit modules or for recommendations on accessories and components visit: http://www.telit.com To register for product news and announcements or for product questions contact Telit’s Technical Support Center (TTSC). Our aim is to make this guide as helpful as possible. Keep us informed of your comments and suggestions for improvements. Telit appreciates feedback from the users of our information.
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 8 of 79 This document contains the following chapters: Chapter 1: “Introduction” provides a scope for this document, target audience, contact and support information, and text conventions. Chapter 2: “Overview” provides an overview of the document. Chapter3: “LE910 Module Connections” deals with the pin out configuration and layout. Chapter 4: “Hardware Commands” How to operate on the module via hardware. Chapter 5: “Power supply” Power supply requirements and general design rules. Chapter 6: “GSM/WCDMA Radio” The antenna connection and board layout design are the most important parts in the full product design. Chapter 7: “GNSS Receiver” This section describes the GNSS receiver. Chapter 8: “Logic Level specifications” Specific values adopted in the implementation of logic levels for this module. Chapter 9: “USB Port” The USB port on the Telit LE910 is the core of the interface between the module and OEM hardware Chapter 10: “SPI port” Refers to the SPI port of the Telit LE910 Chapter 11: “Serial ports” Refers to the serial ports of the Telit LE910 Chapter 12: “Audio Section overview” Refers to the audio blocks of the Base Band Chip of the LE910 Telit Modules. Chapter 13: “General Purpose I/O” How the general purpose I/O pads can be configured. Chapter 14: “Mounting the LE910 on the application board” Mechanical dimensions and recommendations on how to mount the module on the user’s board. Chapter 15: “Safety Recommendations” Information related to the Safety topics. Chapter 16: “Conformity Assessment Issues” Information related to the Conformity Assessments.
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 9 of 79 Danger – This information MUST be followed or catastrophic equipment failure or bodily injury may occur. Caution or Warning – Alerts the user to important points about integrating the module, if these points are not followed, the module and end user equipment may fail or malfunction. Tip or Information – Provides advice and suggestions that may be useful when integrating the module. All dates are in ISO 8601 format, i.e. YYYY-MM-DD.  LE910 Product description 80421ST10587a  SIM Holder Design Guides 80000NT10001a  AT Commands Reference Guide 80421ST10585A  Telit EVK2 User Guide 1vv0300704
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 10 of 79 RReevviissiioonn DDaattee CChhaannggeess ISSUE#0 2013-11-07 Preliminary Version ISSUE#1 2013-12-20 Updated schematics & tray drawing; ISSUE#2 2014-05-12 Added LE910-SVG and LE910-SKG; LE910-EUG now Dual Band 2G (900/1800); added B5 WCDMA on LE910-EUG. ISSUE#3 2014-06-19 Added Conformity assessment issues section for LE910-NVG, SVG and NAG; updated chapter 10 (USB).
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 11 of 79 The aim of this document is the description of some hardware solutions useful for developing a product with the Telit LE910 module. In this document all the basic functions of a mobile phone will be taken into account; for each one of them a proper hardware solution will be suggested and eventually the wrong solutions and common errors to be avoided will be evidenced. Obviously this document cannot embrace the whole hardware solutions and products that may be designed. The wrong solutions to be avoided shall be considered as mandatory, while the suggested hardware configurations shall not be considered mandatory, instead the information given shall be used as a guide and a starting point for properly developing your product with the Telit LE910 module. For further hardware details that may not be explained in this document refer to the Telit LE910 Product Description document where all the hardware information is reported. NOTICE: (EN) The integration of the GSM/GPRS/WCDMA/LTE LE910 cellular module within user application shall be done according to the design rules described in this manual. (IT) L’integrazione del modulo cellulare GSM/GPRS/WCDMA/LTE LE910 all’interno dell’applicazione dell’utente dovrà rispettare le indicazioni progettuali descritte in questo manuale. (DE) Die Integration des LE910 GSM/GPRS/WCDMA/LTE Mobilfunk-Moduls in ein Gerät muß gemäß der in diesem Dokument beschriebenen Kunstruktionsregeln erfolgen. (SL) Integracija GSM/GPRS/WCDMA/LTE LE910 modula v uporabniški aplikaciji bo morala upoštevati projektna navodila, opisana v tem priročniku. (SP) La utilización del modulo GSM/GPRS/WCDMA/LTE LE910 debe ser conforme a los usos para los cuales ha sido deseñado descritos en este manual del usuario. (FR) L’intégration du module cellulaire GSM/GPRS/WCDMA/LTE LE910 dans l’application de l’utilisateur sera faite selon les règles de conception décrites dans ce manuel. (HE) The information presented in this document is believed to be accurate and reliable. However, no responsibility is assumed by Telit Communications S.p.A. for its use, nor any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent rights of Telit Communications S.p.A. other than for circuitry embodied in Telit products. This document is subject to change without notice. LE910
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 12 of 79 PAD Signal I/O Function Type COMMENT USB HS 2.0 COMMUNICATION PORT B15 USB_D+ I/O USB differential Data (+) C15 USB_D- I/O USB differential Data (-) A13 VUSB I Power sense for the internal USB transceiver. Asynchronous Serial Port (USIF0) – Prog. / Data + HW Flow Control N15 C103/TXD I Serial data input from DTE CMOS 1.8V M15 C104/RXD O Serial data output to DTE CMOS 1.8V M14 C108/DTR I Input for (DTR) from DTE CMOS 1.8V L14 C105/RTS I Input for Request to send signal (RTS) from DTE CMOS 1.8V P15 C106/CTS O Output for Clear to Send signal (CTS) to DTE CMOS 1.8V N14 C109/DCD O Output for (DCD) to DTE CMOS 1.8V P14 C107/DSR O Output for (DSR) to DTE CMOS 1.8V R14 C125/RING O Output for Ring (RI) to DTE CMOS 1.8V Asynchronous Auxiliary Serial Port (USIF1) D15 TX_AUX O Auxiliary UART (TX Data to DTE) CMOS 1.8V E15 RX_AUX I Auxiliary UART (RX Data from DTE) CMOS 1.8V SIM card interface A6 SIMCLK O External SIM signal – Clock 1.8 / 3V A7 SIMRST O External SIM signal – Reset 1.8 / 3V A5 SIMIO I/O External SIM signal – Data I/O 1.8 / 3V A4 SIMIN I External SIM signal – Presence (active low) CMOS 1.8 A3 SIMVCC - External SIM signal – Power supply for the SIM 1.8 / 3V Digital Voice Interface (DVI) B9 DVI_WA0 I/O Digital Audio Interface (WA0) 1.8V B6 DVI_RX I Digital Audio Interface (RX) 1.8V B7 DVI_TX I/O Digital Audio Interface (TX) 1.8V B8 DVI_CLK I/O Digital Audio Interface (CLK) 1.8V DIGITAL IO C8 GPIO_01 I/O GPIO_01 /STAT LED CMOS 1.8V Alternate Function STAT LED C9 GPIO_02 I/O GPIO_02 CMOS 1.8V C10 GPIO_03 I/O GPIO_03 CMOS 1.8V C11 GPIO_04 I/O GPIO_04 CMOS 1.8V
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 13 of 79 B14 GPIO_05 I/O GPIO_05 CMOS 1.8V C12 GPIO_06 I/O GPIO_06 CMOS 1.8V C13 GPIO_07 I/O GPIO_07 CMOS 1.8V K15 GPIO_08 I/O GPIO_08 CMOS 1.8V L15 GPIO_09 I/O GPIO_09 CMOS 1.8V G15 GPIO_10 I/O GPIO_10 CMOS 1.8V ADC B1 ADC_IN1 AI Analog / Digital converter input A/D RF SECTION K1 ANTENNA I/O GSM/EDGE/UMTS Antenna (50 ohm) RF F1 ANT_DIV I Antenna Diversity Input (50 ohm) RF GNSS SECTION (see NOTE1) R9 ANT_GNSS I GNSS Antenna (50 ohm) RF R7 GNSS_LNA_EN O Output enable for External LNA supply CMOS 1.8V Miscellaneous Functions R13 HW_SHUTDOWN* I HW Unconditional Shutdown 1.8V Active low R12 ON_OFF* I Input command for power ON 1.8V Active low C14 VRTC I VRTC Backup capacitor Power backup for the embedded RTC supply R11 VAUX/PWRMON O Supply Output for external accessories / Power ON Monitor 1.8V Power Supply M1 VBATT - Main power supply (Baseband) Power M2 VBATT - Main power supply (Baseband) Power N1 VBATT_PA - Main power supply (Radio PA) Power N2 VBATT_PA - Main power supply (Radio PA) Power P1 VBATT_PA - Main power supply (Radio PA) Power P2 VBATT_PA - Main power supply (Radio PA) Power E1 GND - Ground Power G1 GND - Ground Power H1 GND - Ground Power J1 GND - Ground Power L1 GND - Ground Power A2 GND - Ground Power E2 GND - Ground Power F2 GND - Ground Power G2 GND - Ground Power H2 GND - Ground Power J2 GND - Ground Power K2 GND - Ground Power L2 GND - Ground Power R2 GND - Ground Power
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 14 of 79 M3 GND - Ground Power N3 GND - Ground Power P3 GND - Ground Power R3 GND - Ground Power D4 GND - Ground Power M4 GND - Ground Power N4 GND - Ground Power P4 GND - Ground Power R4 GND - Ground Power N5 GND - Ground Power P5 GND - Ground Power R5 GND - Ground Power N6 GND - Ground Power P6 GND - Ground Power R6 GND - Ground Power P8 GND - Ground Power R8 GND - Ground Power P9 GND - Ground Power P10 GND - Ground Power R10 GND - Ground Power M12 GND - Ground Power B13 GND - Ground Power P13 GND - Ground Power E14 GND - Ground Power RESERVED C1 RESERVED - RESERVED D1 RESERVED - RESERVED B2 RESERVED - RESERVED C2 RESERVED - RESERVED D2 RESERVED - RESERVED B3 RESERVED - RESERVED C3 RESERVED - RESERVED D3 RESERVED - RESERVED E3 RESERVED - RESERVED F3 RESERVED - RESERVED G3 RESERVED - RESERVED H3 RESERVED - RESERVED J3 RESERVED - RESERVED K3 RESERVED - RESERVED L3 RESERVED - RESERVED B4 RESERVED - RESERVED C4 RESERVED - RESERVED
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 15 of 79 B5 RESERVED - RESERVED C5 RESERVED - RESERVED C6 RESERVED - RESERVED C7 RESERVED - RESERVED N7 RESERVED - RESERVED P7 RESERVED - RESERVED N8 RESERVED - RESERVED N9 RESERVED - RESERVED A10 RESERVED - RESERVED N10 RESERVED - RESERVED N11 RESERVED - RESERVED P11 RESERVED - RESERVED B12 RESERVED - RESERVED D12 RESERVED - RESERVED N12 RESERVED - RESERVED P12 RESERVED - RESERVED F14 RESERVED - RESERVED G14 RESERVED - RESERVED H14 RESERVED - RESERVED J14 RESERVED - RESERVED K14 RESERVED - RESERVED N13 RESERVED - RESERVED L13 RESERVED - RESERVED J13 RESERVED - RESERVED M13 RESERVED - RESERVED K13 RESERVED - RESERVED H13 RESERVED - RESERVED G13 RESERVED - RESERVED F13 RESERVED - RESERVED A11 RESERVED - RESERVED A12 RESERVED - RESERVED B11 RESERVED - RESERVED B10 RESERVED - RESERVED A9 RESERVED - RESERVED A8 RESERVED - RESERVED D14 RESERVED - RESERVED A14 RESERVED - RESERVED D13 RESERVED - RESERVED E13 RESERVED - RESERVED F15 RESERVED - RESERVED H15 RESERVED - RESERVED J15 RESERVED - RESERVED
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 16 of 79 WARNING: Reserved pins must not be connected. If not used, almost all pins should be left disconnected. The only exceptions are the following pins: RTS pin should be connected to the GND (on the module side) if flow control is not used. The above pins are also necessary to debug the application when the module is assembled on it so we recommend connecting them also to dedicated test point. PAD Signal Notes M1,M2,N1,N2,P1,P2 VBATT & VBATT_PA E1,G1,H1,J1,L1,A2,E2,F2,G2,H2, J2,K2,L2,R2,M3,N3,P3,R3,D4,M4, N4,P4,R4,N5,P5,R5,N6,P6,R6,P8, R8,P9,P10,R10,M12,B13,P13,E14 GND R12 ON/OFF* R13 HW_SHUTDOWN* B15 USB_D+ If not used should be connected to a Test Point or an USB connector C15 USB_D- If not used should be connected to a Test Point or an USB connector A13 VUSB If not used should be connected to a Test Point or an USB connector N15 C103/TXD If not used should be connected to a Test Point M15 C104/RXD If not used should be connected to a Test Point D15 TXD_AUX If not used should be connected to a Test Point E15 RXD_AUX If not used should be connected to a Test Point K1 MAIN ANTENNA F1 ANT_DIV R9 ANT_GNSS If the GNSS is not used it could be left unconnected
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 17 of 79 A B C D E F G H J K L M N P R 1 ADC_IN1 RES RES GND ANT_DIV GND GND GND ANT GND VBATT VBATT_PA VBATT_PA 2 GND RES RES RES GND GND GND GND GND GND GND VBATT VBATT_PA VBATT_PA GND 3 SIMVCC RES RES RES RES RES RES RES RES RES RES GND GND GND GND 4 SIMIN RES RES GND GND GND GND GND 5 SIMIO RES RES GND GND GND 6 SIMCLK DVI_RX RES GND GND GND 7 SIMRST DVI_TX RES RES RES GNSS_LNA_EN 8 RES DVI_CLK GPIO_01 RES GND GND 9 RES DVI_WA0 GPIO_02 RES GND ANT_GNSS 10 RES RES GPIO_03 RES GND GND 11 RES RES GPIO_04 RES RES VAUX/PWRMON 12 RES RES GPIO_06 RES GND RES RES ON_OFF* 13 VUSB GND GPIO_07 VDD_IO1 1V8_SEL RES RES RES RES RES RES RES RES GND HW_SHUTDOWN* 14 RES GPIO_05 VRTC RES GND RES RES RES RES RES C105/RTS C108/DTR C109/DCD C107/DSR C125/RING 15 USB_D+ USB_D- TX AUX RX AUX RES GPIO_10 RES RES GPIO_08 GPIO_09 C104/RXD C103/TXD C106/CTS NOTE: The pin defined as RES has to be considered RESERVED and not connected on any pin in the application.
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 18 of 79 To turn on the LE910 the pad ON_OFF* must be tied low for at least 1 seconds and then released. The maximum current that can be drained from the ON_OFF* pad is 0,1 mA. A simple circuit to do it is: NOTE: Don’t use any pull up resistor on the ON_OFF* line, it is internally pulled up. Using pull up resistor may bring to latch up problems on the LE910 power regulator and improper power on/off of the module. The line ON_OFF* must be connected only in open collector or open drain configuration. NOTE: In this document all the lines that are inverted, hence have active low signals are labelled with a name that ends with”#”,”*” or with a bar over the name. TIP: To check if the device has powered on, the hardware line PWRMON should be monitored.
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 19 of 79 For example: 1- Let’s assume you need to drive the ON_OFF* pad with a totem pole output of a +3/5 V microcontroller (uP_OUT1): 2- Let’s assume you need to drive the ON_OFF* pad directly with an ON/OFF button:
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 20 of 79 Upon turning on LE910 module, The LE910 is not activated yet because the boot sequence of LE910 is still going on internally. It takes about 10 seconds to complete the initializing the module internally. For this reason, it would be useless to try to access LE910 during the Initialization state as below. To get the desirable stability, the LE910 needs at least 15 seconds after the PWRMON goes high to become operational by reaching the activation state. NOTE: Don’t use any pull up resistor on the ON_OFF* line, it is internally pulled up. Using pull up resistor may bring to latch up problems on the LE910 power regulator and improper power on/off of the module. The line ON_OFF* must be connected only in open collector or open drain configuration. In this document all the lines that are inverted, hence have active low signals are labelled with a name that ends with”#”,”*” or with a bar over the name. During the Initialization state, any kind of AT-command is not available. DTE must be waiting for the Activation state to communicate with LE910. To check if the device has powered on, the hardware line PWRMON should be monitored.
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 21 of 79 Turning off of the device can be done in two ways:  via AT command (see LE910 Software User Guide, AT#SHDN)  by tying low pin ON_OFF* Either ways, the device issues a detach request to network informing that the device will not be reachable any more. LE910 can be shut down using the AT#SHDN command. When a shutdown command is sent, LE910 goes into the finalization state and finally will shut down PWRMON at the end of this state. The period of the finalization state can differ according to the situation in which the LE910 is so it cannot be fixed definitely. Normally it will be above 15 seconds later from sending a shutdown command and DTE should monitor the status of PWRMON to see the actual power off.TIP: To check if the device has been powered off, the hardware line PWRMON must be monitored. The device is powered off when PWRMON goes low.NOTE: In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the LE910 when the module is powered off or during an ON/OFF transition.
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 22 of 79 To turn OFF LE910 the pad ON/OFF# must be tied low for at least 2 seconds and then released. Same circuitry and timing for the power on must be used. When the hold time of ON/OFF# is above 2 seconds, LE910 goes into the finalization state and finally will shut down PWRMON at the end of this state. The period of the finalization state can differ according to the situation in which the LE910 is so it cannot be fixed definitely. Normally it will be above 15 seconds later from releasing ON/OFF# and DTE should monitor the status of PWRMON to see the actual power off.TIP: To check if the device has been powered off, the hardware line PWRMON must be monitored. The device is powered off when PWRMON goes low.NOTE: In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the LE910 when the module is powered off or during an ON/OFF transition.
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 23 of 79 The Unconditional Shutdown of the module could be activated using the HW_SHUTDOWN* line (pad R13). WARNING: The hardware unconditional Shutdown must not be used during normal operation of the device since it does not detach the device from the network. It shall be kept as an emergency exit procedure. To unconditionally shutdown the LE910, the pad HW_SHUTDOWN* must be tied low for at least 200 milliseconds and then released. NOTE: Do not use any pull up resistor on the HW_SHUTDOWN* line nor any totem pole digital output. Using pull up resistor may bring to latch up problems on the LE910 power regulator and improper functioning of the module. The line HW_SHUTDOWN* must be connected only in open collector configuration. The HW_SHUTDOWN* is generating an unconditional shutdown of the module without an automatic restart. The module will shutdown, but will NOT perform the detach from the cellular network. To proper power on again the module please refer to the related paragraph (“Powering ON the HE910”) TIP: The unconditional hardware shutdown must always be implemented on the boards and should be used only as an emergency exit procedure.
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 24 of 79 A typical circuit is the following: For example: 1- Let us assume you need to drive the HW_SHUTDOWN* pad with a totem pole output of a +3/5 V microcontroller (uP_OUT2):
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 25 of 79 The below flow chart is describing the HW Shutdown procedure: “HW SHUTDOWN Unconditional” START HW_SHDN = LOW Delay 200ms HW_SHDN = HIGH PWRMON = ON Delay 1s Y N Disconnect VBATT “HW SHUTDOWN Unconditional” END
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 26 of 79 Below chart describes the overall sequences for Turning ON and OFF.
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 27 of 79 The power supply circuitry and board layout are a very important part in the full product design and they strongly reflect on the product overall performances, hence read carefully the requirements and the guidelines that will follow for a proper design. The external power supply must be connected to VBATT & VBATT_PA signals and must fulfil the following requirements: POWER SUPPLY Nominal Supply Voltage 3.8 V Normal Operating Voltage Range 3.40 V÷ 4.20 V Extended Operating Voltage Range 3.30 V÷ 4.20 V NOTE: The Operating Voltage Range MUST never be exceeded; care must be taken when designing the application’s power supply section to avoid having an excessive voltage drop. If the voltage drop is exceeding the limits it could cause a Power Off of the module. The Power supply must be higher than 3.3 V to power on the module NOTE: Overshoot voltage (regarding MAX Extended Operating Voltage) and drop in voltage (regarding MIN Extended Operating Voltage) MUST never be exceeded; The “Extended Operating Voltage Range” can be used only with completely assumption and application of the HW User guide suggestions.
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 28 of 79 LE910 current consumption Mode Average (mA) Mode description SWITCHED OFF Module supplied but Switched Off Switched Off 40uA IDLE mode (GSM/EDGE) AT+CFUN=1 WCDMA 16 Normal mode: full functionality of the module GSM 16 LTE 16 AT+CFUN=4 10 Disabled TX and RX; module is not registered on the network AT+CFUN=5 WCDMA 1.7 Full functionality with power saving; GSM 1.9 Operative mode (LTE) LTE (0dBm) 203 LTE data call (channel BW 5MHz, RB=1, TX=0dBm) LTE (22dBm) 540 LTE data call (channel BW 5MHz, RB=1, TX=22dBm) Operative mode (WCDMA) WCDMA Voice 185 WCDMA voice call (TX = 10dBm) WCDMA HSDPA (0dBm) 100 WCDMA data call (RMC, TX = 0dBm) WCDMA HSDPA (22dBm) 390 WCDMA data call (RMC, TX = 22dBm) Operative mode (EDGE) EDGE 4TX+1RX EDGE Sending data mode LOW Band PL5 255 High Band PL0 240 Operative mode (GSM) GSM TX and RX mode GSM VOICE CALL LOW Band CSD PL5 290 High Band CSD PL0 170 GPRS 4TX+1RX GPRS Sending data mode LOW Band PL5 410 High Band PL0 320 The GSM system is made in a way that the RF transmission is not continuous, else it is packed into bursts at a base frequency of about 216 Hz, and the relative current peaks can be as high as about 2A. Therefore the power supply has to be designed in order to withstand with these current peaks without big voltage drops; this means that both the electrical design and the board layout must be designed for this current flow. If the layout of the PCB is not well designed a strong noise floor is generated on the ground and the supply; this will reflect on all the audio paths producing an audible annoying noise at 216 Hz; if the voltage drop during the peak current absorption is too much, then the device may even shutdown as a consequence of the supply voltage drop. NOTE: The electrical design for the Power supply should be made ensuring it will be capable of a peak current output of at least 2A.
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 29 of 79 The principal guidelines for the Power Supply Design embrace three different design steps:  the electrical design  the thermal design  the PCB layout. The electrical design of the power supply depends strongly from the power source where this power is drained. We will distinguish them into three categories:  +5V input (typically PC internal regulator output)  +12V input (typically automotive)  Battery  The desired output for the power supply is 3.8V, hence there’s not a big difference between the input source and the desired output and a linear regulator can be used. A switching power supply will not be suited because of the low drop out requirements.  When using a linear regulator, a proper heat sink shall be provided in order to dissipate the power generated.  A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current absorption peaks close to the LE910, a 100μF tantalum capacitor is usually suited.  Make sure the low ESR capacitor on the power supply output (usually a tantalum one) is rated at least 10V.  A protection diode should be inserted close to the power input, in order to save the LE910 from power polarity inversion.
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 30 of 79 An example of linear regulator with 5V input is:  The desired output for the power supply is 3.8V, hence due to the big difference between the input source and the desired output, a linear regulator is not suited and shall not be used. A switching power supply will be preferable because of its better efficiency especially with the 2A peak current load represented by the LE910.  When using a switching regulator, a 500kHz or more switching frequency regulator is preferable because of its smaller inductor size and its faster transient response. This allows the regulator to respond quickly to the current peaks absorption.  In any case the frequency and Switching design selection is related to the application to be developed due to the fact the switching frequency could also generate EMC interferences.  For car PB battery the input voltage can rise up to 15,8V and this should be kept in mind when choosing components: all components in the power supply must withstand this voltage.  A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current absorption peaks, a 100μF tantalum capacitor is usually suited.
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 31 of 79  Make sure the low ESR capacitor on the power supply output (usually a tantalum one) is rated at least 10V.  For Car applications a spike protection diode should be inserted close to the power input, in order to clean the supply from spikes.  A protection diode should be inserted close to the power input, in order to save the LE910 from power polarity inversion. This can be the same diode as for spike protection. An example of switching regulator with 12V input is in the below schematic:
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 32 of 79 The desired nominal output for the power supply is 3.8V and the maximum voltage allowed is 4.2V, hence a single 3.7V Li-Ion cell battery type is suited for supplying the power to the Telit LE910 module. WARNING: The three cells Ni/Cd or Ni/MH 3,6 V Nom. Battery types or 4V PB types MUST NOT BE USED DIRECTLY since their maximum voltage can rise over the absolute maximum voltage for the LE910 and damage it. NOTE: DON’T USE any Ni-Cd, Ni-MH, and Pb battery types directly connected with LE910. Their use can lead to overvoltage on the LE910 and damage it. USE ONLY Li-Ion battery types.  A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current absorption peaks, a 100μF tantalum capacitor is usually suited.  Make sure the low ESR capacitor (usually a tantalum one) is rated at least 10V.  A protection diode should be inserted close to the power input, in order to save the LE910 from power polarity inversion. Otherwise the battery connector should be done in a way to avoid polarity inversions when connecting the battery.  The battery capacity must be at least 500mAh in order to withstand the current peaks of 2A; the suggested capacity is from 500mAh to 1000mAh.
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 33 of 79 The thermal design for the power supply heat sink should be done with the following specifications:  Average current consumption during HSPA transmission @PWR level max in LE910: 640mA (TBD)  Average current consumption during class12 GPRS transmission @PWR level max: 680mA (TBD)  Average GPS current during GPS ON (Power Saving disabled) : 65mA (TBD) NOTE: The average consumption during transmissions depends on the power level at which the device is requested to transmit by the network. The average current consumption hence varies significantly. The thermal design for the Power supply must be made keeping an average consumption at the max transmitting level during calls of 640mA(HSPA)/680mA(GPRS) rms plus 65mA rms for GPS in tracking mode. Considering the very low current during idle, especially if Power Saving function is enabled, it is possible to consider from the thermal point of view that the device absorbs current significantly only during calls. If we assume that the device stays in transmission for short periods of time (let us say few minutes) and then remains for quite a long time in idle (let us say one hour), then the power supply has always the time to cool down between the calls and the heat sink could be smaller than the calculated for 640mA (HSPA)/680mA (GPRS) maximum RMS current. There could even be a simple chip package (no heat sink). Moreover in average network conditions the device is requested to transmit at a lower power level than the maximum and hence the current consumption will be less than 640mA (HSPA) /680mA (GPRS) (being usually around 250mA). For these reasons the thermal design is rarely a concern and the simple ground plane where the power supply chip is placed can be enough to ensure a good thermal condition and avoid overheating. For the heat generated by the LE910, you can consider it to be during transmission 2W max during class12 GPRS upload. This generated heat will be mostly conducted to the ground plane under the LE910; you must ensure that your application can dissipate heat. In the WCDMA/HSPA mode, since LE910 emits RF signals continuously during transmission, you must pay special attention how to dissipate the heat generated. The current consumption will be up to about 640mA in HSPA (630mA in WCDMA) continuously at the maximum TX output power (23dBm). Thus, you must arrange the PCB area as large as possible under LE910 which you will mount. You must mount LE910 on the large ground area of your application board and make many ground vias to dissipate the heat.
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 34 of 79 The peak current consumption in the GSM mode is higher than that in WCDMA. However, considering the heat sink is more important in case of WCDMA. As mentioned before, a GSM signal is bursty, thus, the temperature drift is more insensible than WCDMA. Consequently, if you prescribe the heat dissipation in the WCDMA mode, you don’t need to think more about the GSM mode. As seen on the electrical design guidelines the power supply shall have a low ESR capacitor on the output to cut the current peaks and a protection diode on the input to protect the supply from spikes and polarity inversion. The placement of these components is crucial for the correct working of the circuitry. A misplaced component can be useless or can even decrease the power supply performances.  The Bypass low ESR capacitor must be placed close to the Telit LE910 power input pads or in the case the power supply is a switching type it can be placed close to the inductor to cut the ripple provided the PCB trace from the capacitor to the LE910 is wide enough to ensure a dropless connection even during the 2A current peaks.  The protection diode must be placed close to the input connector where the power source is drained.  The PCB traces from the input connector to the power regulator IC must be wide enough to ensure no voltage drops occur when the 2A current peaks are absorbed. Note that this is not made in order to save power loss but especially to avoid the voltage drops on the power line at the current peaks frequency of 216 Hz that will reflect on all the components connected to that supply, introducing the noise floor at the burst base frequency. For this reason while a voltage drop of 300-400 mV may be acceptable from the power loss point of view, the same voltage drop may not be acceptable from the noise point of view. If your application doesn’t have audio interface but only uses the data feature of the Telit LE910, then this noise is not so disturbing and power supply layout design can be more forgiving.  The PCB traces to the LE910 and the Bypass capacitor must be wide enough to ensure no significant voltage drops occur when the 2A current peaks are absorbed. This is for the same reason as previous point. Try to keep this trace as short as possible.  The PCB traces connecting the Switching output to the inductor and the switching diode must be kept as short as possible by placing the inductor and the diode very close to the power switching IC (only for switching power supply). This is done in order to reduce the radiated field (noise) at the switching frequency (100-500 kHz usually).
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 35 of 79  The use of a good common ground plane is suggested.  The placement of the power supply on the board should be done in such a way to guarantee that the high current return paths in the ground plane are not overlapped to any noise sensitive circuitry as the microphone amplifier/buffer or earphone amplifier.  The power supply input cables should be kept separate from noise sensitive lines such as microphone/earphone cables.  The insertion of EMI filter on VBATT pins is suggested in those designs where antenna is placed close to battery or supply lines. A ferrite bead like Murata BLM18EG101TN1 or Taiyo Yuden P/N FBMH1608HM101 can be used for this purpose. The below figure shows the recommended circuit:
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 36 of 79 The following table is listing the main differences between the LE910 variants: Product Supported 2G Bands Supported 3G bands Supported LTE bands GNSS LE910-EUG GSM 900, DCS1800 B5(850), B8 (900), B1 (2100) B20 (800), B3 (1800), B7 (2600) YES LE910-NAG GSM 850, PCS 1900 B5(850), B2(1900) B17(700), B5(850), B4(1700), B2(1900) YES LE910-NVG Not supported B5(850), B2(1900) B13(700), B4(1700) YES LE910-SVG Not supported Not supported B13(700), B4(1700) YES LE910-SKG Not supported Not supported B3 (1800), B5(850) YES Band Power Class GSM 850 / 900 4 (2W) DCS1800 / PCS 1900 1 (1W) EDGE, 850/900 MHz E2 (0.5W) EDGE, 1800/1900 MHz Class E2 (0.4W) WCDMA FDD B1, B2, B4, B5, B8 Class 3 (0.25W) LTE FDD B2, B3, B4, B5, B7, B13, B17, B20 Class 3 (0.2 W)
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 37 of 79 The antenna connection and board layout design are the most important aspect in the full product design as they strongly affect the product overall performances, hence read carefully and follow the requirements and the guidelines for a proper design. The antenna and antenna transmission line on PCB for a Telit LE910 device shall fulfil the following requirements: ANTENNA REQUIREMENTS for LE910-EUG Frequency range Depending by frequency band(s) provided by the network operator, the customer shall use the most suitable antenna for that/those band(s) Bandwidth (GSM/EDGE) GSM900 : 80 MHz GSM1800(DCS) : 170 MHz Bandwidth (WCDMA) WCDMA band I(2100) : 250 MHz WCDMA band V(850) : 70 MHz WCDMA band VIII(900) : 80 MHz Bandwidth (LTE) LTE band III(1800) : 170 MHz LTE Band VII(2600) : 190 MHz LTE Band XX(800) : 71 MHz Impedance 50 ohm Input power > 33dBm(2 W) peak power in GSM > 24dBm Average power in WCDMA & LTE VSWR absolute max ≤ 10:1 (limit to avoid permanent damage) VSWR recommended ≤ 2:1 (limit to fulfil all regulatory requirements) ANTENNA REQUIREMENTS for LE910-NAG Frequency range Depending by frequency band(s) provided by the network operator, the customer shall use the most suitable antenna for that/those band(s) Bandwidth (GSM/EDGE) GSM850 : 70 MHz GSM1900(PCS) : 140 MHz Bandwidth (WCDMA) WCDMA band II(1900) : 140 MHz WCDMA band V(850) : 70 MHz Bandwidth (LTE) LTE Band II(1900) : 140 MHz LTE Band IV(1700) : 445 MHz LTE Band V (850) : 70 MHz LTE Band XVII(700) : 42 MHz Impedance 50 ohm Input power > 33dBm(2 W) peak power in GSM > 24dBm Average power in WCDMA & LTE VSWR absolute max ≤ 10:1 (limit to avoid permanent damage) VSWR recommended ≤ 2:1 (limit to fulfil all regulatory requirements)
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 38 of 79 ANTENNA REQUIREMENTS for LE910-NVG Frequency range Depending by frequency band(s) provided by the network operator, the customer shall use the most suitable antenna for that/those band(s) Bandwidth (WCDMA) WCDMA band II(1900) : 140 MHz WCDMA band V(850) : 70 MHz Bandwidth (LTE) LTE Band IV(1700) : 445 MHz LTE Band XIII(700) : 41 MHz Impedance 50 ohm Input power > 24dBm Average power in WCDMA & LTE VSWR absolute max ≤ 10:1 (limit to avoid permanent damage) VSWR recommended ≤ 2:1 (limit to fulfil all regulatory requirements) ANTENNA REQUIREMENTS for LE910-SVG Frequency range Depending by frequency band(s) provided by the network operator, the customer shall use the most suitable antenna for that/those band(s) Bandwidth (LTE) LTE Band IV(1700) : 445 MHz LTE Band XIII(700) : 41 MHz Impedance 50 ohm Input power > 24dBm Average power VSWR absolute max ≤ 10:1 (limit to avoid permanent damage) VSWR recommended ≤ 2:1 (limit to fulfil all regulatory requirements) ANTENNA REQUIREMENTS for LE910-SKG Frequency range Depending by frequency band(s) provided by the network operator, the customer shall use the most suitable antenna for that/those band(s) Bandwidth (LTE) LTE band III(1800) : 170 MHz LTE Band V (850) : 70 MHz Impedance 50 ohm Input power > 24dBm Average power VSWR absolute max ≤ 10:1 (limit to avoid permanent damage) VSWR recommended ≤ 2:1 (limit to fulfil all regulatory requirements) When using the LE910, since there's no antenna connector on the module, the antenna must be connected to the LE910 antenna pad (K1) by means of a transmission line implemented on the PCB. In the case the antenna is not directly connected at the antenna pad of the LE910, then a PCB line is needed in order to connect with it or with its connector.
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 39 of 79 This transmission line shall fulfil the following requirements: ANTENNA LINE ON PCB REQUIREMENTS Characteristic Impedance 50 ohm Max Attenuation 0,3 dB Coupling with other signals shall be avoided Cold End (Ground Plane) of antenna shall be equipotential to the LE910 ground pins Furthermore if the device is developed for the US market and/or Canada market, it shall comply with the FCC and/or IC approval requirements: This device is to be used only for mobile and fixed application. In order to re-use the Telit FCC/IC approvals the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. If antenna is installed with a separation distance of less than 20 cm from all persons or is co-located or operating in conjunction with any other antenna or transmitter then additional FCC/IC testing may be required. End-Users must be provided with transmitter operation conditions for satisfying RF exposure compliance. Antennas used for this OEM module must not exceed the gains for mobile and fixed operating configurations as described in “FCC/IC Regulatory notices” chapter.
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 40 of 79  Make sure that the transmission line’s characteristic impedance is 50ohm ;  Keep line on the PCB as short as possible, since the antenna line loss shall be less than around 0,3 dB;  Line geometry should have uniform characteristics, constant cross section, avoid meanders and abrupt curves;  Any kind of suitable geometry / structure (Microstrip, Stripline, Coplanar, Grounded Coplanar Waveguide...) can be used for implementing the printed transmission line afferent the antenna;  If a Ground plane is required in line geometry, that plane has to be continuous and sufficiently extended, so the geometry can be as similar as possible to the related canonical model;  Keep, if possible, at least one layer of the PCB used only for the Ground plane; If possible, use this layer as reference Ground plane for the transmission line;  It is wise to surround (on both sides) the PCB transmission line with Ground, avoid having other signal tracks facing directly the antenna line track.  Avoid crossing any un-shielded transmission line footprint with other signal tracks on different layers;  The ground surrounding the antenna line on PCB has to be strictly connected to the main Ground Plane by means of via holes (once per 2mm at least), placed close to the ground edges facing line track;  Place EM noisy devices as far as possible from LE910 antenna line;  Keep the antenna line far away from the LE910 power supply lines;  If EM noisy devices are present on the PCB hosting the LE910, such as fast switching ICs, take care of the shielding of the antenna line by burying it inside the layers of PCB and surround it with Ground planes, or shield it with a metal frame cover.  If EM noisy devices are not present around the line, the use of geometries like Microstrip or Grounded Coplanar Waveguide has to be preferred, since they typically ensure less attenuation if compared to a Stripline having same length;
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 41 of 79  Install the antenna in a place covered by the GSM signal.  If the device antenna is located greater then 20cm from the human body and there are no co-located transmitter then the Telit FCC/IC approvals can be re-used by the end product  If the device antenna is located less than 20cm from the human body or there are no co-located transmitter then the additional FCC/IC testing may be required for the end product (Telit FCC/IC approvals cannot be reused)  Antenna shall not be installed inside metal cases  Antenna shall be installed also according Antenna manufacturer instructions. This product is including an input for a second RX antenna to improve the radio sensitivity. The function is called Antenna Diversity. DIVERSITY ANTENNA REQUIREMENTS for LE910-EUG Frequency range Depending by frequency band(s) provided by the network operator, the customer shall use the most suitable antenna for that/those band(s) Bandwidth (WCDMA) WCDMA band I(2100) : 250 MHz WCDMA band V(850) : 70 MHz WCDMA band VIII(900) : 80 MHz Bandwidth (LTE) LTE band III(1800) : 170 MHz LTE Band VII(2600) : 190 MHz LTE Band XX(800) : 71 MHz Impedance 50 ohm VSWR recommended ≤ 2:1 (limit to fulfil all regulatory requirements) DIVERSITY ANTENNA REQUIREMENTS for LE910-NAG Frequency range Depending by frequency band(s) provided by the network operator, the customer shall use the most suitable antenna for that/those band(s) Bandwidth (WCDMA) WCDMA band II(1900) : 140 MHz WCDMA band V(850) : 70 MHz Bandwidth (LTE) LTE Band II(1900) : 140 MHz LTE Band IV(1700) : 445 MHz LTE Band V (850) : 70 MHz LTE Band XVII(700) : 42 MHz Impedance 50 ohm VSWR recommended ≤ 2:1 (limit to fulfil all regulatory requirements)
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 42 of 79 DIVERSITY ANTENNA REQUIREMENTS for LE910-NVG Frequency range Depending by frequency band(s) provided by the network operator, the customer shall use the most suitable antenna for that/those band(s) Bandwidth (WCDMA) WCDMA band II(1900) : 140 MHz WCDMA band V(850) : 70 MHz Bandwidth (LTE) LTE Band IV(1700) : 445 MHz LTE Band XIII(700) : 41 MHz Impedance 50 ohm VSWR recommended ≤ 2:1 (limit to fulfil all regulatory requirements) DIVERSITY ANTENNA REQUIREMENTS for LE910-SVG Frequency range Depending by frequency band(s) provided by the network operator, the customer shall use the most suitable antenna for that/those band(s) Bandwidth (LTE) LTE Band IV(1700) : 445 MHz LTE Band XIII(700) : 41 MHz Impedance 50 ohm VSWR recommended ≤ 2:1 (limit to fulfil all regulatory requirements) DIVERSITY ANTENNA REQUIREMENTS for LE910-SKG Frequency range Depending by frequency band(s) provided by the network operator, the customer shall use the most suitable antenna for that/those band(s) Bandwidth (LTE) LTE band III(1800) : 170 MHz LTE Band V (850) : 70 MHz Impedance 50 ohm VSWR recommended ≤ 2:1 (limit to fulfil all regulatory requirements) When using the LE910, since there's no antenna connector on the module, the antenna must be connected to the LE910 antenna pad (F1) by means of a transmission line implemented on the PCB. In the case the antenna is not directly connected at the antenna pad of the LE910, then a PCB line is needed in order to connect with it or with its connector. The second Rx antenna should not be located in the close vicinity of main antenna. In order to improve Diversity Gain, Isolation and reduce mutual interaction, the two antennas should be located at the maximum reciprocal distance possible, taking into consideration the available space into the application.
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 43 of 79 The LE910 module is integrating a GNSS receiver that could be used in Autonomous or in A-GPS (assisted GPS) mode. The module includes already an LNA (13.5dB gain typ.) so it could be used with a passive antenna. The Pads related to this function are the following: PAD Signal I/O Function Type R9 ANT_GNSS I GNSS Antenna (50 ohm) RF R7 GNSS_LNA_EN O Output enable for External LNA supply CMOS 1.8V It is recommended to use antennas as follow: • An external passive antenna (GPS only) • An external passive antenna, GNS pre-Filter The external pre-Filter shall be required for GLONASS application. The Glonass pre-Filter requirement shall fulfil the following requirements:  Source and Load Impedance = 50Ohm  Insertion Loss (1575.42 – 1576.42MHz) = 1.4dB (Max)  Insertion Loss (1565.42 – 1585.42MHz) = 1.4dB (Max)  Insertion Loss (1597.5515 – 1605.886MHZ) = 2.0dB (Max)
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 44 of 79  Ensure that the antenna line impedance is 50ohm.  Keep the antenna line on the PCB as short as possible to reduce the loss.  Antenna line must have uniform characteristics, constant cross section, avoid meanders and abrupt curves.  Keep one layer of the PCB used only for the Ground plane, if possible.  Surround (on the sides, over and under) the antenna line on PCB with Ground, avoid having other signal tracks facing directly the antenna line of track.  The ground around the antenna line on PCB has to be strictly connected to the Ground Plane by placing vias once per 2mm at least.  Place EM noisy devices as far as possible from LE910 antenna line.  Keep the antenna line far away from the LE910 power supply lines.  Keep the antenna line far away from the LE910 GSM RF lines.  If you have EM noisy devices around the PCB hosting the LE910, such as fast switching ICs, take care of the shielding of the antenna line by burying it inside the layers of PCB and surround it with Ground planes, or shield it with a metal frame cover.  If you do not have EM noisy devices around the PCB of LE910, use a strip-line on the superficial copper layer for the antenna line. The line attenuation will be lower than a buried one. RF Trace losses are difficult to estimate on a PCB without having the appropriate tables or RF simulation software to estimate what the losses would be. A good rule of thumb would be to keep the RF traces as short as possible, make sure they are 50 ohms impedance and don’t contain any sharp bends.
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 45 of 79  The LE910 due to its characteristics of sensitivity is capable to perform a Fix inside the buildings. (In any case the sensitivity could be affected by the building characteristics i.e. shielding).  The Antenna must not be co-located or operating in conjunction with any other antenna or transmitter.  Antenna must not be installed inside metal cases.  Antenna must be installed also according to the Antenna manufacturer instructions.
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 46 of 79 The following table shows the logic level specifications used in the LE910 interface circuits: Absolute Maximum Ratings -Not Functional Parameter Min Max Input level on any digital pin (CMOS 1.8) with respect to ground -0.3V 2.16V Operating Range - Interface levels (1.8V CMOS) Level Min Max Input high level 1.5V 2.1V Input low level 0V 0.5V Output high level 1.35V 1.8 Output low level 0V 0.45V
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 47 of 79 Signal Function I/O PAD HW_SHUTDOWN* Unconditional Shutdown of the Module I R13 HW_SHUTDOWN* is used to unconditionally shutdown the LE910. Whenever this signal is pulled low, the LE910 is reset. When the device is reset it stops any operation. After the release of the line, the LE910 is unconditionally shut down, without doing any detach operation from the network where it is registered. This behaviour is not a proper shut down because any GSM device is requested to issue a detach request on turn off. For this reason the HW_SHUTDOWN* signal must not be used to normally shutting down the device, but only as an emergency exit in the rare case the device remains stuck waiting for some network response. The HW_SHUTDOWN* is internally controlled on start-up to achieve always a proper power-on reset sequence, so there's no need to control this pin on start-up. It may only be used to reset a device already on that is not responding to any command. NOTE: Do not use this signal to power off the LE910. Use the ON/OFF signal to perform this function or the AT#SHDN command. Unconditional Shutdown Signal Operating levels: Signal Min Max HW_SHUTDOWN* Input high 1.5V 2.1V HW_SHUTDOWN* Input low 0V 0.5V * this signal is internally pulled up so the pin can be left floating if not used. If unused, this signal may be left unconnected. If used, then it must always be connected with an open collector transistor, to permit to the internal circuitry the power on reset and under voltage lockout functions.
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 48 of 79 The LE910 module includes a Universal Serial Bus (USB) transceiver, which operates at USB full-speed (12Mbits/sec) and USB high-speed (480Mbits/sec). It is compliant with the USB 2.0 specification and can be used for diagnostic monitoring, control and data transfers. The following table is listing the available signals: PAD Signal I/O Function Type NOTE B15 USB_D+ I/O USB differential Data (+) 3.3V C15 USB_D- I/O USB differential Data (-) 3.3V A13 VUSB AI Power sense for the internal USB transceiver. 5V The USB_DPLUS and USB_DMINUS signals have a clock rate of 480 MHz. The signal traces should be routed carefully. Trace lengths, number of vias and capacitive loading should be minimized. The characteristic impedance value should be as close as possible to 90 Ohms differential.
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 49 of 79 The LE910 module is provided with by 2 Asynchronous serial ports:  MODEM SERIAL PORT 1 (Main)  MODEM SERIAL PORT 2 (Auxiliary) Several configurations can be designed for the serial port on the OEM hardware, but the most common are:  RS232 PC com port  microcontroller UART @ 1.8V (Universal Asynchronous Receive Transmit)  microcontroller UART @ 5V or other voltages different from 1.8V Depending from the type of serial port on the OEM hardware a level translator circuit may be needed to make the system work. On the LE910 the ports are CMOS 1.8. The electrical characteristics of the Serial ports are explained in the following tables: Absolute Maximum Ratings -Not Functional Parameter Min Max Input level on any digital pin (CMOS 1.8) with respect to ground -0.3V 2.16V Operating Range - Interface levels (1.8V CMOS) Level Min Max Input high level 1.5V 2.1V Input low level 0V 0.5V Output high level 1.35V 1.8 Output low level 0V 0.45V
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 50 of 79 The serial port 1 on the LE910 is a +1.8V UART with all the 7 RS232 signals. It differs from the PC-RS232 in the signal polarity (RS232 is reversed) and levels. RS232 Pin # Signal LE910 Pad Number Name Usage 1 C109/DCD N14 Data Carrier Detect Output from the LE910 that indicates the carrier presence 2 C104/RXD M15 Transmit line *see Note Output transmit line of LE910 UART 3 C103/TXD N15 Receive line *see Note Input receive of the LE910 UART 4 C108/DTR M14 Data Terminal Ready Input to the LE910 that controls the DTE READY condition 5 GND M12, B13, P13, E14 … Ground Ground 6 C107/DSR P14 Data Set Ready Output from the LE910 that indicates the module is ready 7 C106/CTS P15 Clear to Send Output from the LE910 that controls the Hardware flow control 8 C105/RTS L14 Request to Send Input to the LE910 that controls the Hardware flow control 9 C125/RING R14 Ring Indicator Output from the LE910 that indicates the incoming call condition NOTE: According to V.24, some signal names are referred to the application side, therefore on the LE910 side these signal are on the opposite direction: TXD on the application side will be connected to the receive line (here named C103/TXD) RXD on the application side will be connected to the transmit line (here named C104/RXD) NOTE: For a minimum implementation, only the TXD, RXD lines can be connected, the other lines can be left open provided a software flow control is implemented. NOTE: In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the LE910 when the module is powered off or during an ON/OFF transition.
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 51 of 79 The secondary serial port on the LE910 is composed by only the RX and TX lines. The signals of the LE910 serial port are: PAD Signal I/O Function Type COMMENT D15 TX_AUX O Auxiliary UART (TX Data to DTE) 1.8V E15 RX_AUX I Auxiliary UART (RX Data from DTE) 1.8V NOTE: In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the LE910 when the module is powered off or during an ON/OFF transition.
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 52 of 79 In order to interface the LE910 with a PC com port or a RS232 (EIA/TIA-232) application a level translator is required. This level translator must:  invert the electrical signal in both directions;  Change the level from 0/1.8V to +15/-15V. Actually, the RS232 UART 16450, 16550, 16650 & 16750 chipsets accept signals with lower levels on the RS232 side (EIA/TIA-562), allowing a lower voltage-multiplying ratio on the level translator. Note that the negative signal voltage must be less than 0V and hence some sort of level translation is always required. The simplest way to translate the levels and invert the signal is by using a single chip level translator. There are a multitude of them, differing in the number of drivers and receivers and in the levels (be sure to get a true RS232 level translator not a RS485 or other standards). By convention the driver is the level translator from the 0-1.8V UART to the RS232 level. The receiver is the translator from the RS232 level to 0-1.8V UART. In order to translate the whole set of control lines of the UART you will need:  5 drivers  3 receivers NOTE: The digital input lines working at 1.8V have an absolute maximum input voltage of 2.7V; therefore the level translator IC shall not be powered by the VBATT supply of the module to avoid damaging the LE910 digital signals. Instead it has to be supplied by a dedicated 1.8V power supply.
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 53 of 79 An example of RS232 level adaptation circuitry could be done using a MAXIM transceiver (MAX218) In this case the chipset is capable to translate directly from 1.8V to the RS232 levels (Example done on 4 signals only). NOTE: In this case the length of the lines on the application has to be carefully checked to avoid problems in case of High Speed data rates on RS232. The RS232 serial port lines are usually connected to a DB9 connector with the following layout:
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 54 of 79 The Audio of the LE910 Module is carried by DVI digital audio interface. The audio port can be directly connected to end device using digital interface, or via one of the several compliant codecs (in case an analog audio is needed). The product is providing the Digital Audio Interface (DVI) on the following Pins: Digital Voice Interface (DVI) PAD Signal I/O Function Note Type B9 DVI_WA0 I/O Digital Audio Interface (WA0) B-PD 1.8V B6 DVI_RX I Digital Audio Interface (RX) B-PD 1.8V B7 DVI_TX O Digital Audio Interface (TX) B-PD 1.8V B8 DVI_CLK I/O Digital Audio Interface (BCLK) B-PD 1.8V
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 55 of 79 The LE910 module is provided by a set of Digital Input / Output pins Input pads can only be read; they report the digital value (high or low) present on the pad at the read time. Output pads can only be written or queried and set the value of the pad output. An alternate function pad is internally controlled by the LE910 firmware and acts depending on the function implemented. The following table shows the available GPIO on the LE910: PAD Signal I/O Function Type Drive strength Note C8 GPIO_01 I/O Configurable GPIO BH-PD (*) 1.8V 1 mA C9 GPIO_02 I/O Configurable GPIO BH-PD (*) 1.8V 1 mA C10 GPIO_03 I/O Configurable GPIO BH-PD (*) 1.8V 1 mA C11 GPIO_04 I/O Configurable GPIO BH-PD (*) 1.8V 1 mA B14 GPIO_05 I/O Configurable GPIO BH-PD (*) 1.8V 1 mA C12 GPIO_06 I/O Configurable GPIO BH-PD (*) 1.8V 1 mA C13 GPIO_07 I/O Configurable GPIO BH-PD (*) 1.8V 1 mA K15 GPIO_08 I/O Configurable GPIO BH-PD (*) 1.8V 1 mA L15 GPIO_09 I/O Configurable GPIO BH-PD (*) 1.8V 1 mA G15 GPIO_10 I/O Configurable GPIO BH-PD (*) 1.8V 1 mA (*) BH-PD - Bidirectional digital with CMOS input; High-voltage tolerant; Contains an internal pull-down device. NOTE: In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the LE910 when the module is powered off or during an ON/OFF transition.
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 56 of 79 Where not specifically stated, all the interface circuits work at 1.8V CMOS logic levels. The following table shows the logic level specifications used in the LE910 interface circuits: Absolute Maximum Ratings -Not Functional Parameter Min Max Input level on any digital pin (CMOS 1.8) with respect to ground -0.3V 2.16V Operating Range - Interface levels (1.8V CMOS) Level Min Max Input high level 1.5V 2.1V Input low level 0V 0.5V Output high level 1.35V 1.8 Output low level 0V 0.45V The GPIO pads, when used as inputs, can be connected to a digital output of another device and report its status, provided this device has interface levels compatible with the 1.8V CMOS levels of the GPIO. If the digital output of the device to be connected with the GPIO input pad has interface levels different from the 1.8V CMOS, then it can be buffered with an open collector transistor with a 10K pull up to 1.8V. NOTE: In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the LE910 when the module is powered off or during an ON/OFF transition. The GPIO pads, when used as outputs, can drive 1.8V CMOS digital devices or compatible hardware. When set as outputs, the pads have a push-pull output and therefore the pull-up resistor may be omitted.
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 57 of 79 The STAT_LED pin status shows information on the network service availability and Call status. The function is available as alternate function of GPIO_01 (to be enabled using the AT#GPIO=1,0,2 command). In the LE910 modules, the STAT_LED needs an external transistor to drive an external LED. Therefore, the status indicated in the following table is reversed with respect to the pin status. Device Status LED status Device off Permanently off Net search / Not registered / turning off Fast blinking (Period 1s, Ton 0,5s) Registered full service Slow blinking (Period 3s, Ton 0,3s) Voice Call Active Permanently on A schematic example could be:
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 58 of 79 The VRTC pin brings out the Real Time Clock supply, which is separate from the rest of the digital part, allowing having only RTC going on when all the other parts of the device are off. To this power output a backup capacitor can be added in order to increase the RTC autonomy during power off of the battery. NO Devices must be powered from this pin. A regulated power supply output is provided in order to supply small devices from the module. The signal is present on Pad R11 and it is in common with the PWRMON (module powered ON indication) function. This output is always active when the module is powered ON. The operating range characteristics of the supply are: Level Min Typical Max Output voltage 1.75V 1.80V 1.85V Output current - - 100mA Output bypass capacitor (inside the module) 1uF
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 59 of 79 The LE910 is provided by one AD converter. It is able to read a voltage level in the range of 0÷1.7 volts applied on the ADC pin input, store and convert it into 8 bit word. The following table is showing the ADC characteristics: Min Max Units Input Voltage range 0 1.7 Volt AD conversion - 8 bits Resolution - < 6,6 mV The input line is named as ADC_IN1 and it is available on Pad B1 An AT command is available to use the ADC function. The command is AT#ADC=1,2 The read value is expressed in mV Refer to SW User Guide or AT Commands Reference Guide for the full description of this function.
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 60 of 79 The LE910 modules have been designed in order to be compliant with a standard lead-free SMT process. Pin B1 Dimensions in mm Bottom view Lead-free Alloy: Surface finishing Ni/Au for all solder pads
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 61 of 79
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 62 of 79 TOP VIEW In order to easily rework the LE910 is suggested to consider on the application a 1.5 mm placement inhibit area around the module. It is also suggested, as common rule for an SMT component, to avoid having a mechanical part of the application in direct contact with the module. NOTE: In the customer application, the region under WIRING INHIBIT (see figure above) must be clear from signal or ground paths.
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 63 of 79 Stencil’s apertures layout can be the same of the recommended footprint (1:1), we suggest a thickness of stencil foil ≥ 120 µm. Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB. PCB Copper PadSolder Mask SMD (Solder Mask Defined) NSMD (Non Solder Mask Defined)
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 64 of 79 The recommendation for the PCB pads dimensions are described in the following image (dimensions in mm) Solder resist openings
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 65 of 79 It is not recommended to place via or micro-via not covered by solder resist in an area of 0,3 mm around the pads unless it carries the same signal of the pad itself (see following figure). Holes in pad are allowed only for blind holes and not for through holes. Recommendations for PCB pad surfaces: Finish Layer thickness [µm] Properties Electro-less Ni / Immersion Au 3 –7 / 0.05 – 0.15 good solder ability protection, high shear force values The PCB must be able to resist the higher temperatures which are occurring at the lead-free process. This issue should be discussed with the PCB-supplier. Generally, the wettability of tin-lead solder paste on the described surface plating is better compared to lead-free solder paste. It is not necessary to panel the application’s PCB, however in that case it is suggested to use milled contours and predrilled board breakouts; scoring or v-cut solutions are not recommended. Inhibit area for micro-via
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 66 of 79 Lead free Solder paste Sn/Ag/Cu We recommend using only “no clean” solder paste in order to avoid the cleaning of the modules after assembly. Recommended solder reflow profile:
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 67 of 79 Profile Feature Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max Preheat – Temperature Min (Tsmin) – Temperature Max (Tsmax) – Time (min to max) (ts) 150°C 200°C 60-180 seconds Tsmax to TL – Ramp-up Rate 3°C/second max Time maintained above: – Temperature (TL) – Time (tL) 217°C 60-150 seconds Peak Temperature (Tp) 245 +0/-5°C Time within 5°C of actual Peak Temperature (tp) 10-30 seconds Ramp-down Rate 6°C/second max. Time 25°C to Peak Temperature 8 minutes max. NOTE: All temperatures refer to topside of the package, measured on the package body surface WARNING: The LE910 module withstands one reflow process only.
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 68 of 79 The LE910 modules are packaged on trays of 20 pieces each. These trays can be used in SMT processes for pick & place handling.
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 69 of 79
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 70 of 79 The LE910 can be packaged on reels of 200 pieces each. See figure for module positioning into the carrier.
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 71 of 79
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 72 of 79 The LE910 is a Moisture Sensitive Device level 3, in according with standard IPC/JEDEC J-STD-020, take care all the relatives requirements for using this kind of components. Moreover, the customer has to take care of the following conditions: a) Calculated shelf life in sealed bag: 12 months at <40°C and <90% relative humidity (RH). b) Environmental condition during the production: 30°C / 60% RH according to IPC/JEDEC J-STD-033A paragraph 5. c) The maximum time between the opening of the sealed bag and the reflow process must be 168 hours if condition b) “IPC/JEDEC J-STD-033A paragraph 5.2” is respected d) Baking is required if conditions b) or c) are not respected e) Baking is required if the humidity indicator inside the bag indicates 10% RH or more
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 73 of 79 READ CAREFULLY Be sure the use of this product is allowed in the country and in the environment required. The use of this product may be dangerous and has to be avoided in the following areas:  Where it can interfere with other electronic devices in environments such as hospitals, airports, aircrafts, etc  Where there is risk of explosion such as gasoline stations, oil refineries, etc It is responsibility of the user to enforce the country regulation and the specific environment regulation. Do not disassemble the product; any mark of tampering will compromise the warranty validity. We recommend following the instructions of the hardware user guides for a correct wiring of the product. The product has to be supplied with a stabilized voltage source and the wiring has to be conforming to the security and fire prevention regulations. The product has to be handled with care, avoiding any contact with the pins because electrostatic discharges may damage the product itself. Same cautions have to be taken for the SIM, checking carefully the instruction for its use. Do not insert or remove the SIM when the product is in power saving mode. The system integrator is responsible of the functioning of the final product; therefore, care has to be taken to the external components of the module, as well as of any project or installation issue, because the risk of disturbing the GSM network or external devices or having impact on the security. Should there be any doubt, please refer to the technical documentation and the regulations in force. Every module has to be equipped with a proper antenna with specific characteristics. The antenna has to be installed with care in order to avoid any interference with other electronic devices and has to guarantee a minimum distance from the body (20 cm). In case of this requirement cannot be satisfied, the system integrator has to assess the final product against the SAR regulation. The European Community provides some Directives for the electronic equipments introduced on the market. All the relevant information’s are available on the European Community website: http://europa.eu.int/comm/enterprise/rtte/dir99-5.htm The text of the Directive 99/05 regarding telecommunication equipments is available, while the applicable Directives (Low Voltage and EMC) are available at: http://europa.eu.int/comm/enterprise/electr_equipment/index_en.htm
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 74 of 79 The LE910-EUG module has been evaluated against the essential requirements of the 1999/5/EC Directive. Bulgarian С настоящето Telit Communications S.p.A. декларира, че 2G/3G/LTE module отговаря на съществените изисквания и другите приложими изисквания на Директива 1999/5/ЕС. Czech Telit Communications S.p.A. tímto prohlašuje, že tento 2G/3G/LTE module je ve shodě se základními požadavky a dalšími příslušnými ustanoveními směrnice 1999/5/ES. Danish Undertegnede Telit Communications S.p.A. erklærer herved, at følgende udstyr 2G/3G/LTE module overholder de væsentlige krav og øvrige relevante krav i direktiv 1999/5/EF. Dutch Hierbij verklaart Telit Communications S.p.A. dat het toestel 2G/3G/LTE module in overeenstemming is met de essentiële eisen en de andere relevante bepalingen van richtlijn 1999/5/EG. English Hereby, Telit Communications S.p.A., declares that this 2G/3G/LTE module is in compliance with the essential requirements and other relevant provisions of Directive 1999/5/EC. Estonian Käesolevaga kinnitab Telit Communications S.p.A. seadme 2G/3G/LTE module vastavust direktiivi 1999/5/EÜ põhinõuetele ja nimetatud direktiivist tulenevatele teistele asjakohastele sätetele. German Hiermit erklärt Telit Communications S.p.A., dass sich das Gerät 2G/3G/LTE module in Übereinstimmung mit den grundlegenden Anforderungen und den übrigen einschlägigen Bestimmungen der Richtlinie 1999/5/EG befindet. Greek ΜΕ ΤΗΝ ΠΑΡΟΥΣΑ Telit Communications S.p.A. ΔΗΛΩΝΕΙ ΟΤΙ 2G/3G/LTE module ΣΥΜΜΟΡΦΩΝΕΤΑΙ ΠΡΟΣ ΤΙΣ ΟΥΣΙΩΔΕΙΣ ΑΠΑΙΤΗΣΕΙΣ ΚΑΙ ΤΙΣ ΛΟΙΠΕΣ ΣΧΕΤΙΚΕΣ ΔΙΑΤΑΞΕΙΣ ΤΗΣ ΟΔΗΓΙΑΣ 1999/5/ΕΚ. Hungarian Alulírott, Telit Communications S.p.A. nyilatkozom, hogy a 2G/3G/LTE module megfelel a vonatkozó alapvetõ követelményeknek és az 1999/5/EC irányelv egyéb elõírásainak. Finnish Telit Communications S.p.A. vakuuttaa täten että 2G/3G/LTE module tyyppinen laite on direktiivin 1999/5/EY oleellisten vaatimusten ja sitä koskevien direktiivin muiden ehtojen mukainen. French Par la présente Telit Communications S.p.A. déclare que l'appareil 2G/3G/LTE module est conforme aux exigences essentielles et aux autres dispositions pertinentes de la directive 1999/5/CE. Icelandic Hér með lýsir Telit Communications S.p.A. yfir því að 2G/3G/LTE module er í samræmi við grunnkröfur og aðrar kröfur, sem gerðar eru í tilskipun 1999/5/EC
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 75 of 79 Italian Con la presente Telit Communications S.p.A. dichiara che questo 2G/3G/LTE module è conforme ai requisiti essenziali ed alle altre disposizioni pertinenti stabilite dalla direttiva 1999/5/CE. Latvian Ar šo Telit Communications S.p.A. deklarē, ka 2G/3G/LTE module atbilst Direktīvas 1999/5/EK būtiskajām prasībām un citiem ar to saistītajiem noteikumiem. Lithuanian Šiuo Telit Communications S.p.A. deklaruoja, kad šis 2G/3G/LTE module atitinka esminius reikalavimus ir kitas 1999/5/EB Direktyvos nuostatas. Maltese Hawnhekk, Telit Communications S.p.A., jiddikjara li dan 2G/3G/LTE module jikkonforma mal-ħtiġijiet essenzjali u ma provvedimenti oħrajn relevanti li hemm fid-Dirrettiva 1999/5/EC. Norwegian Telit Communications S.p.A. erklærer herved at utstyret 2G/3G/LTE module er i samsvar med de grunnleggende krav og øvrige relevante krav i direktiv 1999/5/EF. Polish Niniejszym Telit Communications S.p.A. oświadcza, że 2G/3G/LTE module jest zgodny z zasadniczymi wymogami oraz pozostałymi stosownymi postanowieniami Dyrektywy 1999/5/EC Portuguese Telit Communications S.p.A. declara que este 2G/3G/LTE module está conforme com os requisitos essenciais e outras disposições da Directiva 1999/5/CE. Slovak Telit Communications S.p.A. týmto vyhlasuje, že 2G/3G/LTE module spĺňa základné požiadavky a všetky príslušné ustanovenia Smernice 1999/5/ES. Slovenian Telit Communications S.p.A. izjavlja, da je ta 2G/3G/LTE module v skladu z bistvenimi zahtevami in ostalimi relevantnimi določili direktive 1999/5/ES. Spanish Por medio de la presente Telit Communications S.p.A. declara que el 2G/3G/LTE module cumple con los requisitos esenciales y cualesquiera otras disposiciones aplicables o exigibles de la Directiva 1999/5/CE. Swedish Härmed intygar Telit Communications S.p.A. att denna 2G/3G/LTE module står I överensstämmelse med de väsentliga egenskapskrav och övriga relevanta bestämmelser som framgår av direktiv 1999/5/EG. In order to satisfy the essential requirements of 1999/5/EC Directive, the LE910-EUG module is compliant with the following standards: RF spectrum use (R&TTE art. 3.2) EN 300 440-2 V1.4.1 EN 301 511 V9.0.2 EN 301 908-1 V6.2.1 EN 301 908-2 V5.4.1 EN 301 908-13 V5.2.1 EMC (R&TTE art. 3.1b) EN 301 489-1 V1.9.2 EN 301 489-3 V1.6.1 EN 301 489-7 V1.3.1 EN 301 489-24 V1.5.1 Health & Safety (R&TTE art. 3.1a) EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011 + AC:2011 EN 62311:2008 EN 62479:2010
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 76 of 79 The conformity assessment procedure referred to in Article 10 and detailed in Annex IV of Directive 1999/5/EC has been followed with the involvement of the following Notified Body: AT4 wireless, S.A. Parque Tecnologico de Andalucía C/ Severo Ochoa 2 29590 Campanillas – Málaga SPAIN Notified Body No: 1909 Thus, the following marking is included in the product: The full declaration of conformity can be found on the following address: http://www.telit.com/ There is no restriction for the commercialisation of the LE910-EUG modules in all the countries of the European Union. Final product integrating this module must be assessed against essential requirements of the 1999/5/EC (R&TTE) Directive. It should be noted that assessment does not necessarily lead to testing. Telit Communications S.p.A. recommends carrying out the following assessments: RF spectrum use (R&TTE art. 3.2) It will depend on the antenna used on the final product. EMC (R&TTE art. 3.1b) Testing Health & Safety (R&TTE art. 3.1a) Testing Alternately, assessment of the final product against EMC (Art. 3.1b) and Electrical safety (Art. 3.1a) essential requirements can be done against the essential requirements of the EMC and the LVD Directives:  Low Voltage Directive 2006/95/EC and product safety  Directive EMC 2004/108/EC for conformity for EMC 1909
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 77 of 79 Modification statement Telit has not approved any changes or modifications to this device by the user. Any changes or modifications could void the user’s authority to operate the equipment. Telit n’approuve aucune modification apportée à l’appareil par l’utilisateur, quelle qu’en soit la nature. Tout changement ou modification peuvent annuler le droit d’utilisation de l’appareil par l’utilisateur. Interference statement This device complies with Part 15 of the FCC Rules and Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Wireless notice This equipment complies with FCC and IC radiation exposure limits set forth for an uncontrolled environment. The antenna should be installed and operated with minimum distance of 20 cm between the radiator and your body. Antenna gain must be below: Frequency band LE910-NAG LE910-NVG LE910-SVG 700 MHz 8.74 dBi 9.16 dBi 850 MHz 6.93 dBi 9.42 dBi N/A 1700 MHz 5.00 dBi 5.00 dBi 5.00 dBi 1900 MHz 2.51 dBi 8.01 dBi N/A This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. 9.16 dBi
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 78 of 79 Cet appareil est conforme aux limites d'exposition aux rayonnements de la IC pour un environnement non contrôlé. L'antenne doit être installé de façon à garder une distance minimale de 20 centimètres entre la source de rayonnements et votre corps. Gain de l'antenne doit être ci-dessous: Bande de fréquence LE910-NAG LE910-NVG LE910-SVG 700 MHz 8.74 dBi 850 MHz 6.93 dBi 9.42 dBi N/A 1700 MHz 5.00 dBi 5.00 dBi 5.00 dBi 1900 MHz 2.51 dBi 8.01 dBi N/A L'émetteur ne doit pas être colocalisé ni fonctionner conjointement avec à autre antenne ou autre émetteur. FCC Class B digital device notice This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: - Reorient or relocate the receiving antenna. - Increase the separation between the equipment and receiver. - Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. - Consult the dealer or an experienced radio/TV technician for help. Labelling Requirements for the Host device The host device shall be properly labelled to identify the modules within the host device. The certification label of the module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labelled to display the FCC ID and IC of the module, preceded by the words "Contains transmitter module", or the word "Contains", or similar wording expressing the same meaning, as follows: LE910-NAG Contains FCC ID: RI7LE910NA Contains IC: 5131A-LE910NA LE910-NVG Contains FCC ID: RI7LE910NV Contains IC: 5131A-LE910NV 9.16 dBi 9.16 dBi
LE910 Hardware User Guide 1vv0301089 Rev.3 – 09-06-2014 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 79 of 79 LE910-SVG Contains FCC ID: RI7LE910SV Contains IC: 5131A-LE910SV L'appareil hôte doit être étiqueté comme il faut pour permettre l'identification des modules qui s'y trouvent. L'étiquette de certification du module donné doit être posée sur l'appareil hôte à un endroit bien en vue en tout temps. En l'absence d'étiquette, l'appareil hôte doit porter une étiquette donnant le FCC ID et le IC du module, précédé des mots « Contient un module d'émission », du mot « Contient » ou d'une formulation similaire exprimant le même sens, comme suit : LE910-NAG Contains FCC ID: RI7LE910NA Contains IC: 5131A-LE910NA LE910-NVG Contains FCC ID: RI7LE910NV Contains IC: 5131A-LE910NV LE910-SVG Contains FCC ID: RI7LE910SV Contains IC: 5131A-LE910SV CAN ICES-3 (B) / NMB-3 (B) This Class B digital apparatus complies with Canadian ICES-003. Cet appareil numérique de classe B est conforme à la norme canadienne ICES-003.

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