Telit Communications S p A LE910C1NS Wireless Module User Manual 1VV0301298 LE910Cx Hardware User Guide r1 04

Telit Communications S.p.A. Wireless Module 1VV0301298 LE910Cx Hardware User Guide r1 04

Users Guide

LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 2 of 116 Applicability Table This documentation applies to the following products: Table 1: Applicability Table Module Name Description LE910C1-NA North America – AT&T with global roaming LE910C1-NS North America - Sprint variant LE910C1-AP APAC variant
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 3 of 116 SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Notice While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein. The information in this document has been carefully checked and is believed to be entirely reliable. However, no responsibility is assumed for inaccuracies or omissions. Telit reserves the right to make changes to any products described herein and reserves the right to revise this document and to make changes from time to time in the content hereof with no obligation to notify any person of revisions or changes. Telit does not assume any liability arising out of the application or use of any product, software, or circuit described herein; neither does it convey any license under its patent rights or the rights of others. It is possible that this publication may contain references to, or information about Telit products (machines and programs), programming, or services that are not announced in your country. Such references or information must not be construed to mean that Telit intends to announce such Telit products, programming, or services in your country. Copyrights This instruction manual and the Telit products described in this instruction manual may be, include, or describe copyrighted Telit material, such as computer programs stored in semiconductor memories or other media. Laws in Italy and other countries preserve for Telit and its licensors certain exclusive rights for copyrighted material, including the exclusive right to copy, reproduce in any form, distribute, and make derivative works of the copyrighted material. Accordingly, any copyrighted material of Telit and its licensors contained herein or in the Telit products described in this instruction manual may not be copied, reproduced, distributed, merged, or modified in any manner without the express written permission of Telit. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit, as arises by operation of law in the sale of a product. Computer Software Copyrights Telit and third-party software (SW) products described in this instruction manual may include copyrighted Telit and other third-party computer programs stored in semiconductor memories or other media. Laws in Italy and other countries preserve for Telit and other third-party SW certain exclusive rights for copyrighted computer programs, including the exclusive right to copy or reproduce in any form the copyrighted computer program. Accordingly, any copyrighted Telit or other third-party SW computer programs contained in the Telit products described in this instruction manual may not be copied (reverse engineered) or reproduced in any manner without the express written permission of Telit or the third-party SW supplier. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit or other third-party SW, except for the normal non-exclusive, royalty free license to use that arises by operation of law in the sale of a product.
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 4 of 116 Usage and Disclosure Restrictions License Agreements The software described in this document is the property of Telit and its licensors. It is furnished by an express license agreement only and may be used only in accordance with the terms of such an agreement. Copyrighted Materials Software and documentation are copyrighted materials. Making unauthorized copies is prohibited by law. No part of the software or documentation may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means, without prior written permission of Telit. High Risk Materials Components, units, or third-party products used in the product described herein are NOT fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control equipment in the following hazardous environments requiring fail-safe controls: the operation of nuclear facilities, aircraft navigation or aircraft communication systems, air traffic control, life support, or weapons systems (“high risk activities"). Telit and its supplier(s) specifically disclaim any expressed or implied warranty of fitness for such high risk activities. Trademarks TELIT and the stylized T logo are trademarks and/or registered trademarks of Telit Communications S.p.A. in the Unites States and/or other countries. All other product or service names are the property of their respective owners. Copyright © 2016 Telit Communications S.p.A.
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 5 of 116 Contents 1. Introduction ..................................................................................................... 13 1.1. Scope ................................................................................................................ 13 1.2. Audience .......................................................................................................... 13 1.3. Contact Information, Support .......................................................................... 13 1.4. Text Conventions ............................................................................................. 14 1.5. Related Documents .......................................................................................... 15 1.6. Abbreviations ................................................................................................... 16 2. General Product Description ............................................................................ 17 2.1. Overview .......................................................................................................... 17 2.2. Applications ..................................................................................................... 17 2.3. General Functionality and Main Features ....................................................... 18 2.4. Block Diagram .................................................................................................. 21 2.5. Environmental Requirements .......................................................................... 22 2.5.1. Temperature Range .............................................................................. 22 2.5.2. RoHS Compliance.................................................................................. 22 2.6. Frequency Bands .............................................................................................. 23 2.6.1. RF Bands per Regional Variant ............................................................. 23 2.6.2. Reference Table of RF Bands Characteristics ....................................... 24 2.7. Sensitivity ......................................................................................................... 26 2.8. LE910Cx Mechanical Specifications ................................................................. 27 2.8.1. Dimensions ........................................................................................... 27 2.8.2. Weight .................................................................................................. 27 3. LE910Cx Module Connections ........................................................................... 28 3.1. Pin-out .............................................................................................................. 28 3.2. LE910Cx - Signals That Must Be Connected ..................................................... 39 3.3. LGA Pads Layout ............................................................................................... 41 3.4. Backward Compatibility to xE910 Family ........................................................ 42 4. Electrical Specifications .................................................................................... 43 4.1. Absolute Maximum Ratings – Not Operational ............................................... 43
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 6 of 116 4.2. Recommended Operating Conditions ............................................................. 43 4.3. Logic Level Specifications ................................................................................. 44 4.3.1. 1.8V Pads - Absolute Maximum Ratings ............................................... 44 4.3.2. 1.8V Standard GPIOs ............................................................................ 44 4.3.3. 1.8V SD Card Pads ................................................................................. 45 4.3.4. 1.8V SIM Card Pads ............................................................................... 45 4.3.5. Dual Voltage Pads - Absolute Maximum Ratings ................................. 46 4.3.6. SD Card Pads @ 2.95V .......................................................................... 46 4.3.7. SIM Card Pads @2.95V ......................................................................... 47 5. Hardware Commands ....................................................................................... 48 5.1. Turning on the LE910Cx Module ...................................................................... 48 5.2. Initialization and Activation State .................................................................... 48 5.3. Turning OFF the LE910Cx Module ................................................................... 50 5.3.1. Shutdown by Software Command ....................................................... 50 5.3.2. Hardware Shutdown ............................................................................. 51 5.3.4. Unconditional Hardware Shutdown ..................................................... 52 6. Power Supply ................................................................................................... 53 6.1. Power Supply Requirements............................................................................ 53 6.2. General Design Rules ....................................................................................... 55 6.2.1. Electrical Design Guidelines .................................................................. 55 6.2.1.1. + 5V Input Source Power Supply – Design Guidelines ......... 55 6.2.1.2. + 12V Input Source Power Supply – Design Guidelines ....... 56 6.2.1.3. Battery Source Power Supply – Design Guidelines .............. 58 6.2.2. Thermal Design Guidelines ................................................................... 59 6.2.3. Power Supply PCB Layout Guidelines ................................................... 60 7. Antenna(s) ....................................................................................................... 61 7.1. GSM/WCDMA/LTE Antenna Requirements ..................................................... 61 7.2. GSM/WCDMA/LTE Antenna – PCB Line Guidelines ......................................... 62 7.3. GSM/WCDMA/LTE Antenna – Installation Guidelines .................................... 63 7.4. Antenna Diversity Requirements ..................................................................... 63
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 7 of 116 7.5. GNSS Antenna Requirements .......................................................................... 64 7.5.1. Combined GNSS Antenna ..................................................................... 64 7.5.2. Linear and Patch GNSS Antenna ........................................................... 64 7.5.3. Front End Design Considerations ......................................................... 64 7.5.4. GNSS Antenna – PCB Line Guidelines ................................................... 65 7.5.5. GNSS Antenna – Installation Guidelines ............................................... 66 8. Hardware Interfaces......................................................................................... 67 8.1. USB Port ........................................................................................................... 68 8.2. HSIC Interface .................................................................................................. 69 8.3. SGMII Interface (optional) ............................................................................... 69 8.3.1. Ethernet Control interface ................................................................... 69 8.4. Serial Ports ....................................................................................................... 70 8.4.1. Modem Serial Port 1 Signals ................................................................. 71 8.4.2. Modem Serial Port 2 ............................................................................. 72 8.4.3. RS232 Level Translation ........................................................................ 73 8.5. Peripheral Ports ............................................................................................... 75 8.5.1. SPI – Serial Peripheral Interface ........................................................... 75 8.5.2. I2C - Inter-integrated Circuit ................................................................ 76 8.5.3. SD/MMC Card Interface ....................................................................... 76 8.5.4. WiFi SDIO Interface .............................................................................. 78 8.6. Audio Interface ................................................................................................ 80 8.6.1. Digital Audio ......................................................................................... 80 8.6.1.1. Short Frame Timing Diagrams .............................................. 81 8.6.1.2. Long Frame Timing Diagrams ............................................... 83 8.7. General Purpose I/O ........................................................................................ 85 8.7.1. Using a GPIO Pad as Input .................................................................... 87 8.7.2. Using a GPIO Pad as an interrupt / Wakeup source ............................. 87 8.7.3. Using a GPIO Pad as Output ................................................................. 87 9. Miscellaneous Functions .................................................................................. 89 9.1. Indication of Network Service Availability ....................................................... 89
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 8 of 116 9.2. Indication of Software Ready ........................................................................... 90 9.3. RTC – Real Time Clock ...................................................................................... 90 9.4. VAUX Power Output ........................................................................................ 90 9.5. ADC Converter ................................................................................................. 91 9.5.1. Description............................................................................................ 91 9.5.2. Using the ADC Converter ...................................................................... 91 9.6. Using the Temperature Monitor Function ...................................................... 91 9.7. GNSS Characteristics ........................................................................................ 92 10. Mounting the Module on your Board ............................................................... 93 10.1. General ............................................................................................................. 93 10.2. Finishing & Dimensions .................................................................................... 93 10.3. Recommended Footprint for the Application ................................................. 96 10.4. Stencil ............................................................................................................... 97 10.5. PCB Pad Design ................................................................................................ 97 10.6. Recommendations for PCB Pad Dimensions (mm) .......................................... 98 10.7. Solder Paste ..................................................................................................... 99 10.7.1. Solder Reflow ........................................................................................ 99 11. Application Guide ........................................................................................... 101 11.1. Debug of the LE910Cx Module in Production ................................................ 101 11.2. Bypass Capacitor on Power Supplies ............................................................. 102 11.3. SIM Interface .................................................................................................. 103 11.3.1. SIM Schematic Example ...................................................................... 103 11.4. EMC Recommendations ................................................................................. 104 11.5. Download and Debug Port ............................................................................. 105 11.5.1. Fast Boot mode................................................................................... 105 11.5.2. Recovery Boot Mode .......................................................................... 105 12. Packing System ............................................................................................... 106 12.1. Packing system – Tray .................................................................................... 106 12.2. Tape & Reel .................................................................................................... 108 12.3. Moisture Sensitivity ....................................................................................... 110
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 9 of 116 13. Safety Recommendations ................................................................................ 111 14. Conformity assessment issues ......................................................................... 112 14.1. FCC/ISED Regulatory notices ........................................................................ 112 15. Document History ........................................................................................... 115
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 10 of 116 List of Tables Table 1: Applicability Table ................................................................................................................. 2 Table 2: Related Documents ............................................................................................................ 15 Table 3: RF Bands per Regional Variant ............................................................................................ 23 Table 4: RF Bands Characteristics ..................................................................................................... 24 Table 5: LE910Cx Pin-out .................................................................................................................. 28 Table 6: Mandatory Signals .............................................................................................................. 39 Table 7: Absolute Maximum Ratings – Not Operational .................................................................. 43 Table 8: Recommended Operating Conditions ................................................................................ 43 Table 9: Absolute Maximum Ratings - Not Functional ..................................................................... 44 Table 10: Operating Range – Interface Levels (1.8V CMOS) ............................................................ 44 Table 11: Operating Range – SD Card Pads Working at 1.8V ........................................................... 45 Table 12: Operating Range – SIM Pads Working at 1.8V.................................................................. 45 Table 13: Absolute Maximum Ratings - Not Functional ................................................................... 46 Table 14: Operating Range – For SD Card Pads Operating at 2.95V ................................................ 46 Table 15: Operating Range – For SIM Pads Operating at 2.95V ....................................................... 47 Table 16: Power Supply Requirements ............................................................................................ 53 Table 17: LE910Cx Current Consumption ......................................................................................... 53 Table 18: GSM / WCDMA/ LTE Antenna Requirements ................................................................... 61 Table 19: Antenna Line on PCB Requirements ................................................................................. 61 Table 20: Antenna Diversity Requirements ...................................................................................... 63 Table 21: Antenna Line on PCB Requirements ................................................................................. 65 Table 22: LE910Cx Hardware Interfaces ........................................................................................... 67 Table 23: USB Interface Signals ........................................................................................................ 68 Table 25: Ethernet Control Interface Signals .................................................................................... 69 Table 24: Modem Serial Port 1 Signals ............................................................................................. 71 Table 25 Modem Serial Port 2 Signals .............................................................................................. 72 Table 26: SPI Signals ......................................................................................................................... 75 Table 27: SD Card Signals .................................................................................................................. 77 Table 28: WiFi SDIO Interface Signals ............................................................................................... 78 Table 29: Digital Audio Interface (DVI) Signals ................................................................................. 80 Table 30: PCM_CODEC Timing Parameters ...................................................................................... 82 Table 31: AUX_PCM_CODEC Timing Parameters ............................................................................. 84 Table 32: Primary GPIOs ................................................................................................................... 85 Table 33: Network Service Availability Indication ............................................................................ 89 Table 34: Operating Range – VAUX Power Supply ........................................................................... 90 Table 35: ADC Parameters ................................................................................................................ 91 The values are related to typical environment and conditions Table 36 GNSS Characteristics....... 92 Table 37: Recommendations for PCB Pad Surfaces ......................................................................... 98 Table 38: Solder Profile Characteristics .......................................................................................... 100 Table 39: SIM Interface – C1 Range ................................................................................................ 103
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 11 of 116 Table 40: EMC Recommendations ................................................................................................. 104 Table 41: Document Revision History ............................................................................................ 115
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 12 of 116 List of Figures Figure 1: LE910Cx Block Diagram ..................................................................................................... 21 Figure 2: LGA Pads Layout ................................................................................................................ 41 Figure 3: LE910Cx vs. LE910 Pin-out Comparison (top view) ........................................................... 42 Figure 4: Power-on Circuit ................................................................................................................ 48 Figure 5: LE910Cx Initialization and Activation ................................................................................ 49 Figure 6: Shutdown by Software Command ..................................................................................... 50 Figure 7: Hardware Shutdown .......................................................................................................... 51 Figure 8: Circuit for Unconditional Hardware Shutdown ................................................................. 52 Figure 9 Power down timing using HW_SHUTDOWN_N ................................................................. 52 Figure 10: Example of Linear Regulator with 5V Input ..................................................................... 56 Figure 11: Example of Switching Regulator with 12V Input – Part 1 ................................................ 57 Figure 12: Example of Switching Regulator with 12V Input – Part 2 ................................................ 57 Figure 13: RS232 Level Adaption Circuitry Example ......................................................................... 73 Figure 14: RS232 Serial Port Lines Connection Layout ..................................................................... 74 Figure 15: SPI Signal Connectivity ..................................................................................................... 75 Figure 16: SD/MMC Interface Connectivity ...................................................................................... 77 Figure 17: Primary PCM Timing ........................................................................................................ 81 Figure 18: Auxiliary PCM Timing ....................................................................................................... 83 Figure 19: GPIO Output Pad Equivalent Circuit ................................................................................ 88 Figure 20: Status LED Reference Circuit ........................................................................................... 89 Figure 21: LE910Cx Mechanical Dimensions (bottom view) ............................................................ 93 Figure 22: LE910Cx Mechanical Dimensions (Top view) .................................................................. 94 Figure 23: LE910Cx Mechanical Dimensions (Side view) .................................................................. 95 Figure 24: Recommended Footprint - Top View, 181 pads (dimensions are in mm, top view). ...... 96 Figure 25: PCB Pad Design ................................................................................................................ 97 Figure 26: PCB Pad Dimensions ........................................................................................................ 98 Figure 27: Solder Reflow Profile ....................................................................................................... 99 Figure 28: SIM Schematics .............................................................................................................. 103 Figure 29: Packing ........................................................................................................................... 106 Figure 30: Tray Drawing .................................................................................................................. 107 Figure 31: Module Positioning into the Carrier .............................................................................. 108 Figure 32: Carrier Tape Detail ......................................................................................................... 108 Figure 33: Reel Detail ...................................................................................................................... 109 Figure 34: Reel Box Detail ............................................................................................................... 110
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 13 of 116 1. Introduction 1.1. Scope This document introduces the Telit LE910Cx module and presents possible and recommended hardware solutions for developing a product based on the LE910Cx module. All the features and solutions detailed in this document are applicable to all LE910Cx variants, where “LE910Cx” refers to the variants listed in the applicability table. If a specific feature is applicable to a specific product only, it will be clearly marked. NOTE: LE910Cx refers to all modules listed in the Applicability Table. This document takes into account all the basic functions of a wireless module; a valid hardware solution is suggested for each function, and incorrect solutions and common errors to be avoided are pointed out. Obviously, this document cannot embrace every hardware solution or every product that can be designed. Obviously, avoiding invalid solutions must be considered mandatory. Where the suggested hardware configurations need not be considered mandatory, the information given should be used as a guide and a starting point for properly developing your product with the Telit LE910Cx module. NOTE: The integration of the GSM/GPRS/EGPRS/WCDMA/HSPA+/LTE LE910Cx cellular module within a user application must be done according to the design rules described in this manual. 1.2. Audience This document is intended for Telit customers, especially system integrators, about to implement their applications using the Telit LE910Cx module. 1.3. Contact Information, Support For general contact, technical support, to report documentation errors and to order manuals, contact Telit’s Technical Support Center (TTSC) at: • TS-EMEA@telit.com • TS-AMERICAS@telit.com • TS-APAC@telit.com
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 14 of 116 Alternatively, use: http://www.telit.com/en/products/technical-support-center/contact.php For detailed information about where you can buy the Telit modules or for recommendations on accessories and components, visit: http://www.telit.com To register for product news and announcements or for product questions contact Telit’s Technical Support Center (TTSC). Our aim is to make this guide as helpful as possible. Keep us informed of your comments and suggestions for improvements. Telit appreciates feedback from the users about the information provided. 1.4. Text Conventions The following conventions are used to emphasize specific types of information: Danger: This information MUST be followed or catastrophic equipment failure or bodily injury may occur. Caution or Warning: Alerts the user to important points about integrating the module. If these points are not followed, the module and end user equipment may fail or malfunction. NOTE: Tip or Information – Provides advice and suggestions that may be useful when integrating the module. All dates are in ISO 8601 format, that is, YYYY-MM-DD.
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 15 of 116 1.5. Related Documents Table 2: Related Documents Document Title Document Number Ref 1: LE9x0 AT Command User Guide 80407ST10116A Ref 2: Telit EVB HW User Guide 1VV0301249 Ref 3: LE910Cx Interface Board HW User Guide 1VV0301323 Ref 4: LE910/LE920 Digital Voice Interface Application Note 80000NT11246A Ref 5: Telit_LE920A4_LE910Cx_Wi-Fi_Interface_Application_Note_r1 80490NT11511A Ref 6: Antenna Detection Application Note 80000NT10002A Ref 7: High-Speed Inter-Chip USB Electrical Specification, version 1.0 (a supplement to the USB 2.0 specification, Section 3.8.2)
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 16 of 116 1.6. Abbreviations Term Definition ADC Analog-to-digital converter AE Application-enabled DAC Digital-to-analog converter DTE Data Terminal Equipment FDD Frequency division duplex GLONASS Global orbiting navigation satellite system GNSS Global navigation satellite system GPIO General-purpose input/output GPRS General packet radio services GPS Global positioning system GSM Global system for mobile communications HSIC High-speed inter-chip I2C Inter-integrated circuit LTE Long term evolution SD Secure digital SGMII Serial Gigabit media-independent interface SIM Subscriber identity module SOC System-on-Chip SPI Serial peripheral interface UART Universal asynchronous receiver transmitter UMTS Universal mobile telecommunications system USB Universal serial bus WCI Wireless Coexistence Interface WCDMA Wideband code division multiple access
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 17 of 116 2. General Product Description 2.1. Overview LE910Cx is Telit’s new LTE series for IoT applications. In its most basic use case, LE910Cx can be applied as a wireless communication front-end for telematics products, offering GNSS and mobile communication features to an external host CPU through its rich interfaces. LE910Cx is available in hardware variants as listed in Table 1: Applicability Table. For differences in the designated RF band sets – refer to Section 2.6.1, RF Bands per Regional Variant. 2.2. Applications LE910Cx can be used for telematics applications where tamper-resistance, confidentiality, integrity, and authenticity of end-user information are required, for example: • Emergency call • Telematics services • Road pricing • Pay-as-you-drive insurance • Stolen vehicles tracking • Internet connectivity
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 18 of 116 2.3. General Functionality and Main Features The LE910Cx series of cellular modules features LTE and multi-RAT modem together with an on-chip powerful application processor and a rich set of interfaces. The major functions and features are listed below: Function Features Modem • Multi-RAT cellular modem for voice and data communication o LTE FDD Cat1 (Other variants) (10/5Mbps DL/UL). o Carrier aggregation is not supported o GSM/GPRS/EDGE o WCDMA up to DC HSPA+, Rel.9 • Support for European eCall , US E911, and ERA Glonass • Support for SIM profile switching • Regional variants with optimal choice of RF bands for worldwide coverage of countries and MNOs • State-of-the-art GNSS solution with GPS/GLONASS/BeiDou/Galileo/QZSS receiver Digital audio subsystem • PCM/I2S digital audio interface • Up to 48 kHz sample rate, 16 bit words Two USIM ports – dual voltage • Class B and Class C support • Hot swap support • Clock rates up to 4 MHz Application processor Application processor to run customer application code • 32 bit ARM Cortex-A7 up to 1.3 GHz running the Linux operating system • Flash + DDR are large enough to allow for customer’s own software applications
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 19 of 116 Function Features Interfaces Rich set of interfaces, including: • SD/MMC Card Interface supporting SD3.0 standard • SDIO for external WiFi transceiver supporting SDIO3.0 standard • SGMII for external Ethernet transceiver (optional) o Compliant with IEEE802.3 o Full duplex operation at 1 Gbps o Half/full duplex operation at 10/100 Mbps o Support for VLAN tagging o Support for IEEE1588, PTP (Precision Time Protocol) • USB2.0 – USB port is typically used for: o Flashing of firmware and module configuration o Production testing o Accessing the Application Processor’s file system o AT command access o High-speed WWAN access to external host o Diagnostic monitoring and debugging o Communication between Java application environment and an external host CPU o NMEA data to an external host CPU • HSIC o High-speed 480 Mbps (240 MHz DDR) USB transfers are 100% host driver compatible with traditional USB cable connected topologies o Bidirectional data strobe signal (STROBE) o Bidirectional data signal (DATA) o No power consumption unless a transfer is in progress o Maximum trace length 10 cm o Signals driven at 1.2V standard LVCMOS levels • Peripheral Ports – SPI, I2C, UART • GPIOs • Antenna ports
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 20 of 116 Function Features Form factor Form factor (28x28mm), accommodating the multiple RF bands in each region variant Environment and quality requirements The entire module is designed and qualified by Telit for satisfying the environment and quality requirements. Single supply module The module generates all its internal supply voltages. RTC No dedicated RTC supply, RTC is supplied by VBATT Operating temperature Range -40 °C to +85 °C (conditions as defined in Section 2.5.1, Temperature Range). NOTE: The following interfaces are unique for the LE910Cx and may not be supported on other (former or future) xE910 family. Special care must be taken when designing the application board if future compatibility is required: - SGMII for Ethernet connectivity - SDIO for WIFI connectivity - SD/MMC for SD Card connectivity
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 21 of 116 2.4. Block Diagram Figure 1 shows an overview of the internal architecture of the LE910Cx module. It includes the following sub-functions: • Application processor, Modem subsystem and Location processing with their external interfaces. These three functions are contained in a single SOC. • RF front end, including antenna diagnosis circuitry • Analog Audio codec for attaching external speaker amplifier and microphone • Rich IO interfaces. Depending on which LE910Cx software features are enabled, some of its interfaces that are exported due to multiplexing may be used internally and thus may not be usable by the application. • PMIC with the RTC function inside Figure 1: LE910Cx Block Diagram
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 22 of 116 2.5. Environmental Requirements 2.5.1. Temperature Range Operating temperature range -20 ~ +55°C. This range is defined by 3GPP (the global standard for wireless mobile communication). Telit guarantees its modules to comply with all the 3GPP requirements and to have full functionality of the module with in this range. -40 ~ +85°C. Telit guarantees full functionality within this range as well. However, there may possibly be some performance deviations in this extended range relative to 3GPP requirements, which means that some RF parameters may deviate from the 3GPP specification in the order of a few dB. For example: receiver sensitivity or maximum output power may be slightly degraded. Even so, all the functionalities, such as call connection, SMS, USB communication, UART activation etc., will be maintained, and the effect of such degradations will not lead to malfunction. Storage and non-operating temperature range –40°C ~ +85°C 2.5.2. RoHS Compliance As a part of the Telit corporate policy of environmental protection, the LE910Cx complies with the RoHS (Restriction of Hazardous Substances) directive of the European Union (EU directive 2011/65/EU).
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 23 of 116 2.6. Frequency Bands The operating frequencies in GSM850, EGSM900, DCS1800, PCS1900, WCDMA & LTE modes conform to the 3GPP specifications. 2.6.1. RF Bands per Regional Variant Table 3 summarizes all region variants within the LE910Cx family, showing the supported band sets in each variant. Table 3: RF Bands per Regional Variant Region Variant LTE FDD LTE TDD HSPA+ TD-SCDMA 2G LE910C1-NA 2, 4, 12 - 1, 2, 4, 5, 8 - 2, 3, 5, 8 LE910C1-NS 2, 4, 5, 12, 25, 26 - - - - LE910C1-AP 1, 3, 5, 8, 28 - 1, 5, 8 - -
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 24 of 116 2.6.2. Reference Table of RF Bands Characteristics Table 4: RF Bands Characteristics Mode Freq. Tx (MHz) Freq. Rx (MHz) Channels Tx-Rx Offset PCS 1900 1850.2 ~ 1909.8 1930.2 ~ 1989.8 512 ~ 810 80 MHz DCS 1800 1710 ~ 1785 1805 ~ 1880 512 ~ 885 95 MHz GSM 850 824.2 ~ 848.8 869.2 ~ 893.8 128 ~ 251 45 MHz EGSM 900 890 ~ 915 935 ~ 960 0 ~ 124 45 MHz 880 ~ 890 925 ~ 935 975 ~ 1023 45 MHz WCDMA 2100 – B1 1920 ~ 1980 2110 ~ 2170 Tx: 9612 ~ 9888 Rx: 10562 ~ 10838 190 MHz WCDMA 1900 – B2 1850 ~ 1910 1930 ~ 1990 Tx: 9262 ~ 9538 Rx: 9662 ~ 9938 80 MHz WCDMA 1800 – B3 1710 ~ 1785 1805 ~ 1880 Tx: 937 ~ 1288 Rx: 1162 ~ 1513 95 MHz WCDMA AWS – B4 1710 ~ 1755 2110 ~ 2155 Tx: 1312 ~ 1513 Rx: 1537 ~ 1738 400 MHz WCDMA 850 – B5 824 ~ 849 869 ~ 894 Tx: 4132 ~ 4233 Rx: 4357 ~ 4458 45 MHz WCDMA 900 – B8 880 ~ 915 925 ~ 960 Tx: 2712 ~ 2863 Rx: 2937 ~ 3088 45 MHz WCDMA 1800 – B9 1750 ~ 1784.8 1845 ~ 1879.8 Tx: 8762 ~ 8912 Rx: 9237 ~ 9387 95 MHz WCDMA 800 – B19 830 ~ 845 875 ~ 890 Tx: 312 ~ 363 Rx: 712 ~ 763 45 MHz TDSCDMA 2000 – B34 2010 ~ 2025 2010 ~ 2025 Tx: 10054 ~ 10121 Rx: 10054 ~ 10121 0 MHz
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 25 of 116 Mode Freq. Tx (MHz) Freq. Rx (MHz) Channels Tx-Rx Offset TDSCDMA 1900 – B39 1880 ~ 1920 1880 ~ 1920 Tx: 9404 ~ 9596 Rx: 9404 ~ 9596 0 MHz LTE 2100 – B1 1920 ~ 1980 2110 ~ 2170 Tx: 18000 ~ 18599 Rx: 0 ~ 599 190 MHz LTE 1900 – B2 1850 ~ 1910 1930 ~ 1990 Tx: 18600 ~ 19199 Rx: 600 ~ 1199 80 MHz LTE 1800 – B3 1710 ~ 1785 1805 ~ 1880 Tx: 19200 ~ 19949 Rx: 1200 ~ 1949 95 MHz LTE AWS – B4 1710 ~ 1755 2110 ~ 2155 Tx: 19950 ~ 20399 Rx: 1950 ~ 2399 400 MHz LTE 850 – B5 824 ~ 849 869 ~ 894 Tx: 20400 ~ 20649 Rx: 2400 ~ 2649 45 MHz LTE 2600 – B7 2500 ~ 2570 2620 ~ 2690 Tx: 20750 ~ 21449 Rx: 2750 ~ 3449 120 MHz LTE 900 – B8 880 ~ 915 925 ~ 960 Tx: 21450 ~ 21799 Rx: 3450 ~ 3799 45 MHz LTE 1800 – B9 1749.9 ~ 1784.9 1844.9 ~ 1879.9 Tx: 21800 ~ 2149 Rx: 3800 ~ 4149 95 MHz LTE AWS+ – B10 1710 ~ 1770 2110 ~ 2170 Tx: 22150 ~ 22749 Rx: 4150 ~ 4749 400 MHz LTE 700a – B12 699 ~ 716 729 ~ 746 Tx : 23010 ~ 23179 Rx : 5010 ~ 5179 30 MHz LTE 700c – B13 777 ~ 787 746 ~ 756 Tx : 27210 ~ 27659 Rx : 9210 ~ 9659 -31 MHz LTE 700b – B17 704 ~ 716 734 ~ 746 Tx: 23730 ~ 23849 Rx: 5730 ~ 5849 30 MHz
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 26 of 116 Mode Freq. Tx (MHz) Freq. Rx (MHz) Channels Tx-Rx Offset LTE 800 – B19 830 ~ 845 875 ~ 890 Tx: 24000 ~ 24149 Rx: 6000 ~ 6149 45 MHz LTE 800 – B20 832 ~ 862 791 ~ 821 Tx: 24150 ~ 24449 Rx: 6150 ~ 6449 -41 MHz LTE 1500 – B21 1447.9 ~ 1462.9 1495.9 ~ 1510.9 Tx: 24450 ~ 24599 Rx: 6450 ~ 6599 48 MHz LTE 1900+ – B25 1930 ~ 1995 1850 ~ 1915 Tx: 26040 ~ 26689 Rx: 8040 ~ 8689 80 MHz LTE 850+ – B26 814 ~ 849 859 ~ 894 Tx: 26690 ~ 27039 Rx: 8690 ~ 9039 45 MHz LTE 700 – B28 703 ~ 748 758 ~ 803 Tx : 27210 ~ 27659 Rx : 9210 ~ 9659 45 MHz LTE TDD 2600 – B38 2570 ~ 2620 2570 ~ 2620 Tx: 37750 ~ 38250 Rx: 37750 ~ 38250 0 MHz LTE TDD 1900 – B39 1880 ~ 1920 1880 ~ 1920 Tx: 38250 ~ 38650 Rx: 38250 ~ 38650 0 MHz LTE TDD 2300 – B40 2300 ~ 2400 2300 ~ 2400 Tx: 38650 ~ 39650 Rx: 38650 ~ 39650 0 MHz LTE TDD 2500 – B41 2496 ~ 2690 2496 ~ 2690 Tx: 39650 ~ 41590 Rx: 39650 ~ 41590 0 MHz 2.7. Sensitivity LE910Cx maximum sensitivity levels are as follow: • -108 dBm (TBD) @ 2G • -111 dBm (TBD) @ 3G • -102 dBm (TBD) @ 4G FDD (BW=5 MHz)
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 27 of 116 2.8. LE910Cx Mechanical Specifications 2.8.1. Dimensions The LE910Cx module’s overall dimensions are: • Length: 28.2 mm, +/- 0.15 mm Tolerance • Width: 28.2 mm, +/- 0.15 mm Tolerance • Thickness: 2.2 mm, +/- 0.22 mm Tolerance 2.8.2. Weight The nominal weight of the LE910Cx module is 9.0 gram.
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 28 of 116 3. LE910Cx Module Connections 3.1. Pin-out Table 5: LE910Cx Pin-out PAD Signal I/O Function Type Comment USB HS 2.0 Communication Port B15 USB_D+ I/O USB differential Data(+) C15 USB_D- I/O USB differential Data(-) A13 USB_VBUS AI Power sense for the internal USB transceiver Power 2.5V – 5.5V A14 USB_ID AI USB ID See note below Asynchronous UART N15 C103/TXD I Serial data input (TXD) from DTE 1.8V M15 C104/RXD O Serial data output to DTE 1.8V L14 C105/RTS I Input for Request to send signal (RTS) from DTE 1.8V P15 C106/CTS O Output for Clear to send signal (CTS) to DTE 1.8V P14 C107/DSR O Output for Data Set Ready (DSR) to DTE 1.8V Alternate Fn GPIO_32 M14 C108/DTR I Input for Data Terminal Ready (DTR) from DTE 1.8V Alternate Fn GPIO_34 N14 C109/DCD O Output for Data Carrier Detect (DCD) to DTE 1.8V Alternate Fn GPIO_33 R14 C125/RING O Output for Ring Indication (RI) to DTE 1.8V Alternate Fn GPIO_31
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 29 of 116 SPI – Serial Peripheral Interface / AUX UART F15 SPI_CLK O SPI Clock output 1.8V E15 SPI_MISO/ RX_AUX I SPI data Master Input Slave output / RX_AUX 1.8V D15 SPI_MOSI/TX_AUX O SPI data Master Output Slave input/ TX_AUX 1.8V H14 SPI_CS/GPIO11 O SPI Chip select output / GPIO11 1.8V See note below SD/MMC Card Digital I/O J12 SD/MMC_CMD O SD Command 1.8/2.95V F12 SD/MMC_CLK O SD Card Clock 1.8/2.95V E12 SD/MMC_DATA0 I/O SD Serial Data 0 1.8/2.95V G12 SD/MMC_DATA1 I/O SD Serial Data 1 1.8/2.95V K12 SD/MMC_DATA2 I/O SD Serial Data 2 1.8/2.95V H12 SD/MMC_DATA3 I/O SD Serial Data 3 1.8/2.95V G13 SD/MMC_CD I SD card detect input 1.8V Active Low F13 VMMC - Power supply for MMC card pull-up resistors 1.8/2.95V
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 30 of 116 WiFi (SDIO) Interface N13 WiFi_SD_CMD O Wi-Fi SD Command 1.8V L13 WiFi_SD_CLK O Wi-Fi SD Clock 1.8V J13 WiFi_SD_DATA0 I/O Wi-Fi SD Serial Data 0 1.8V M13 WiFi_SD_DATA1 I/O Wi-Fi SD Serial Data 1 1.8V K13 WiFi_SD_DATA2 I/O Wi-Fi SD Serial Data 2 1.8V H13 WiFi_SD_DATA3 I/O Wi-Fi SD Serial Data 3 1.8V L12 WiFi_SDRST O Wi-Fi Reset / Power enable control 1.8V Active Low M11 WLAN_SLEEP_CLK O Wi-Fi Sleep clock output 1.8V M10 RFCLK2_QCA O Wi-Fi low noise RF clock output 1.8V LTE-WiFi Coexistence M8 WCI_TX O Wireless coexistence interface TXD 1.8V M9 WCI_RX I Wireless coexistence interface RXD 1.8V SIM Card Interface 1 A6 SIMCLK1 O External SIM 1 signal – Clock 1.8/2.85V A7 SIMRST1 O External SIM 1 signal – Reset 1.8/2.85V A5 SIMIO1 I/O External SIM 1 signal - Data I/O 1.8/2.85V Internally PU 20 kΩ to SIMVCC1 A4 SIMIN1 I External SIM 1 signal - Presence 1.8V Active low A3 SIMVCC1 - External SIM 1 signal – Power supply for SIM 1 1.8/2.85V
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 31 of 116 SIM Card Interface 2 C1 SIMCLK2 O External SIM 2 signal – Clock 1.8/2.85V D1 SIMRST2 O External SIM 2 signal – Reset 1.8/2.85V C2 SIMIO2 I/O External SIM 2 signal – Data I/O 1.8/2.85V Internally PU 20kΩ to SIMVCC2 G4 SIMIN2 I External SIM 2 signal – Presence 1.8V Active low D2 SIMVCC2 - External SIM 2 signal – Power supply for SIM 2 1.8/2.85V Digital Voice Interface (DVI) B9 DVI_WAO O Digital Voice interface (WAO master output) 1.8V B6 DVI_RX I Digital Voice interface (Rx) 1.8V B7 DVI_TX O Digital Voice interface (Tx) 1.8V B8 DVI_CLK O Digital Voice interface (CLK master output) 1.8V B12 REF_CLK O Reference clock for external Codec 1.8V See Note below General Purpose Digital I/O C8 GPIO_01 I/O GPIO_01 / STAT_LED 1.8V Alternate Fn I2C C9 GPIO_02 I/O GPIO_02 1.8V Alternate Fn I2C C10 GPIO_03 I/O GPIO_03 1.8V Alternate Fn I2C C11 GPIO_04 I/O GPIO_04 1.8V Alternate Fn I2C B14 GPIO_05 I/O GPIO_05 1.8V Alternate Fn I2C C12 GPIO_06 I/O GPIO_06 1.8V Alternate Fn I2C C13 GPIO_07 I/O GPIO_07 1.8V Alternate Fn I2C K15 GPIO_08 I/O GPIO_08 / SW_RDY 1.8V Alternate Fn I2C L15 GPIO_09 I/O GPIO_09 1.8V Alternate Fn I2C G15 GPIO_10 I/O GPIO_10 1.8V Alternate Fn I2C
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 32 of 116 RF Section K1 Antenna I/O GSM/EDGE/UMTS/LTE Main antenna (50 Ohm) RF F1 ANT_DIV I UMTS/LTE antenna diversity input (50 Ohm) RF GPS Section R9 ANT_GPS I GPS antenna (50 Ohm) RF R7 GPS_LNA_EN O Enables the external regulator for GPS LNA 1.8V N9 GPS_SYNC O GPS sync signal for Dead Reckoning 1.8V Miscellaneous Functions R12 ON_OFF_N I Power ON / Power OFF input Active low R13 HW_SHUTDOWN_N I Unconditional Shutdown input Active low R11 VAUX/PWRMON O Supply output for external accessories / Power ON monitor 1.8V B1 ADC_IN1 AI Analog/Digital Converter Input 1 Analog H4 ADC_IN2 AI Analog/Digital Converter Input 2 Analog D7 ADC_IN3 AI Analog/Digital Converter Input 3 Analog SGMII Interface E4 SGMII_RX_P AI SGMII receive – plus PHY F4 SGMII_RX_M AI SGMII receive – minus PHY D5 SGMII_TX_P AO SGMII transmit – plus PHY D6 SGMII_TX_M AO SGMII transmit - minus PHY HSIC Interface A12 HSIC_DATA I/O High-speed inter-chip interface - data 1.2V A11 HSIC_STB I/O High-speed inter-chip interface - strobe 1.2V
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 33 of 116 I2C Interface B11 I2C_SCL I/O I2C clock 1.8V Internally PU 2.2kΩ to 1.8V B10 I2C_SDA I/O I2C Data 1.8V Internally PU 2.2kΩ to 1.8V Power Supply M1 VBATT - Main Power Supply (Digital Section) Power M2 VBATT - Main Power Supply (Digital Section) Power N1 VBATT_PA - Main Power Supply (RF Section) Power N2 VBATT_PA - Main Power Supply (RF Section) Power P1 VBATT_PA - Main Power Supply (RF Section) Power P2 VBATT_PA - Main Power Supply (RF Section) Power A2 GND - Ground B13 GND Ground D4 GND - Ground E1 GND - Ground E2 GND - Ground E14 GND - Ground F2 GND - Ground G1 GND - Ground G2 GND - Ground G7 GND - Ground G8 GND - Ground G9 GND - Ground H1 GND - Ground
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 34 of 116 H2 GND - Ground H7 GND - Ground H8 GND - Ground H9 GND - Ground J1 GND - Ground J2 GND - Ground J7 GND - Ground J8 GND - Ground J9 GND - Ground K2 GND - Ground L1 GND - Ground L2 GND - Ground M3 GND - Ground M4 GND - Ground M12 GND - Ground N3 GND - Ground N4 GND - Ground N5 GND - Ground N6 GND - Ground P3 GND - Ground P4 GND - Ground P5 GND - Ground P6 GND - Ground P8 GND - Ground
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 35 of 116 P9 GND - Ground P10 GND - Ground P13 GND - Ground R2 GND - Ground R3 GND - Ground R5 GND - Ground R6 GND - Ground R8 GND - Ground R10 GND - Ground Reserved A8 Reserved - Reserved A9 Reserved - Reserved A10 Reserved - Reserved B2 Reserved - Reserved B3 Reserved - Reserved B4 Reserved - Reserved B5 Reserved - Reserved C3 Reserved - Reserved C4 Reserved - Reserved C5 Reserved - Reserved C6 Reserved - Reserved C7 Reserved - Reserved C14 Reserved - Reserved D3 Reserved - Reserved
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 36 of 116 D8 Reserved - Reserved D9 Reserved - Reserved D10 Reserved - Reserved D11 Reserved - Reserved D12 Reserved - Reserved D13 Reserved - Reserved D14 Reserved - Reserved E3 Reserved - Reserved E13 Reserved - Reserved F3 Reserved - Reserved F14 Reserved - Reserved G3 Reserved - Reserved G14 Reserved - Reserved H3 Reserved - Reserved H15 Reserved - Reserved J3 Reserved - Reserved J4 Reserved - Reserved J14 Reserved - Reserved J15 Reserved - Reserved K3 Reserved - Reserved K4 Reserved - Reserved K14 Reserved - Reserved L3 Reserved - Reserved L4 Reserved - Reserved
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 37 of 116 M5 Reserved - Reserved M6 Reserved - Reserved M7 Reserved - Reserved N7 Reserved - Reserved N8 Reserved - Reserved N10 Reserved - Reserved N11 Reserved - Reserved N12 Reserved - Reserved P7 Reserved - Reserved P11 Reserved - Reserved P12 Reserved - Reserved Reserved for future use R4 RFU - Reserved for future use. Not connected internally Can be tied to GND
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 38 of 116 Caution: GPIO_09 and WCI_RX are used as special HW flags during boot. If they are used as GPIOs, they must be connected via a 3-state buffer to avoid any undesirable effect during the boot. NOTE: When the UART signals are used as the communication port between the Host and the Modem, RTS must be connected to GND (on the module side) if flow control is not used. If the UART port is not used, UART signals can be left floating. NOTE: Unless otherwise specified, RESERVED pins must be left unconnected (Floating). NOTE: The following pins are unique for the LE910Cx and may not be supported on other (former or future) xE910 family. Special care must be taken when designing the application board if future compatibility is required REF_CLK SPI_CS USB_ID I2C_SCL I2C_SDA ADC_IN2 ADC_IN3
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 39 of 116 3.2. LE910Cx - Signals That Must Be Connected Table 6 specifies the LE910Cx signals that must be connected even if not used by end application: Table 6: Mandatory Signals PAD Signal Notes M1, M2, N1, N2, P1, P2 VBATT & VBATT_PA A2, B13, D4, E1, E2, E14, F2, G1, G2, G7, G8, G9, H1, H2, H7, H8, H9, J1, J2, J7, J8, J9, K2, L1, L2, M3, M4, M12, N3, N4, N5, N6, P3, P4, P5, P6, P8, P9, P10, P13, R2, R3, R5, R6, R8, R10 GND R12 ON/OFF Main power on off signal R13 HW_SHUTDOWN_N Emergency power off B15 USB_D+ If not used, connect to a Test Point or an USB connector C15 USB_D- If not used, connect to a Test Point or an USB connector A13 USB_VBUS If not used, connect to a Test Point or an USB connector N15 C103/TXD If not used, connect to a Test Point M15 C104/RXD If not used, connect to a Test Point L14 C105/RTS If flow control is not used, connect to GND P15 C106/CTS If not used, connect to a Test Point D15 TX_AUX If not used, connect to a Test Point E15 RX_AUX If not used, connect to a Test Point K1 Antenna MAIN antenna F1 ANT_DIV DIV antenna
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 40 of 116 PAD Signal Notes R9 ANT_GPS GPS antenna C4, C5, C6, C7, D3, E3, G3, K4, L4, P11 Reserved Connect to a Test Point for Telit internal use L15 GPIO_09 If not used, connect to a Test Point M9 WCI_RX If not used, connect to a Test Point
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 41 of 116 3.3. LGA Pads Layout Figure 2: LGA Pads Layout A B C D E F G H J K L M N P R 1 ADC_IN1 SIMCLK2 SIMRST2 GND ANT_DIV GND GND GND ANT_MAIN GND VBATT VBATT_PA VBATT_PA 2 GND RES SIMIO2 SIMVCC2 GND GND GND GND GND GND GND VBATT VBATT_PA VBATT_PA GND 3 SIMVCC RES RES RES RES RES RES RES RES RES RES GND GND GND GND 4 SIMIN RES RES GND SGMII_RX_P SGMII_RX_M SIMIN2 ADC_IN2 RES RES RES GND GND GND RFU 5 SIMIO RES RES SGMII_TX_P RES GND GND GND 6 SIMCLK DVI_RX RES SGMII_TX_M RES GND GND GND 7 SIMRST DVI_TX RES ADC_IN3 GND GND GND RES RES RES GPS_LNA_EN 8RES DVI_CLK GPIO_01 RES GND GND GND WCI_TXD_TGPIO24 RES GND GND 9RES DVI_WA0 GPIO_02 RES GND GND GND WCI_RXD_TGPIO25 GPS_SYNC GND ANT_GPS 10 RES I2C_SDA GPIO_03 RES RFCLK2_QCA RES GND GND 11 HSIC_STB I2C_SCL GPIO_04 RES WLAN_SLEEP_CLK RES RES VAUX/PWRMON 12 HSIC_DATA REF_CLK GPIO_06 RES MMC_DAT0 MMC_CLK MMC_DAT1 MMC_DAT3 MMC_CMD MMC_DAT2 WIFI_SDRST GND RES RES ON_OFF* 13 VUSB GND GPIO_07 RES RES VMMC MMC_CD WIFI_SD3 WIFI_SD0 WIFI_SD2 WIFI_SDCLK WIFI_SD1 WIFI_SDCMD GND HW_SHUTDOWN* 14 USB_ID GPIO_05 RES RES GND RES RES SPI_CS / GPIO_11 RES RES C105/RTS C108/DTR C109/DCD C107/DSR C125/RING 15 USB_D+ USB_D- SPI_MOSI/ TX_AUXSPI_MISO/RX_AUX SPI_CLK GPIO_10 RES RES GPIO_8 GPIO_9 C104/RXD C103/TXD C106/CTS
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 42 of 116 3.4. Backward Compatibility to xE910 Family The LE910Cx is a new series in the xE910 form factor The LE910Cx is fully backward compatible to the previous xE910 in terms of: • Mechanical dimensions • Package and pin-map To support the extra features and additional interfaces, the LE910Cx introduces more pins compared to the xE910. The extra pins of the LE910Cx can be considered as optional if not needed and can be left unconnected (floating) if not used. In this case, the new LE910Cx can be safely mounted on existing carrier boards designed for the previous xE910. The additional pins of the LE910Cx are shown in Figure 3 (marked as Green) Figure 3: LE910Cx vs. LE910 Pin-out Comparison (top view)
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 43 of 116 4. Electrical Specifications 4.1. Absolute Maximum Ratings – Not Operational A deviation from the value ranges listed below may harm the LE910Cx module. Table 7: Absolute Maximum Ratings – Not Operational Symbol Parameter Min Max Unit VBATT Battery supply voltage on pin VBATT -0.5 +6.0 [V] VBATT TRANSIENT Transient voltage on pin VBATT (< 10 ms) -0.5 +7.0 [V] VBATT_PA Battery supply voltage on pin VBATT_PA -0.3 +6.0 [V] 4.2. Recommended Operating Conditions Table 8: Recommended Operating Conditions Symbol Parameter Min Typ Max Unit Tamb Ambient temperature -40 +25 +85 [°C] VBATT Battery supply voltage on pin VBATT 3.4 3.8 4.2 [V] VBATT_PA Battery supply voltage on pin VBATT_PA 3.4 3.8 4.2 [V] IBATT_PA + IBATT Peak current to be used to dimension decoupling capacitors on pin VBATT_PA - 80 2000 [mA]
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 44 of 116 4.3. Logic Level Specifications Unless otherwise specified, all the interface circuits of the LE910Cx are 1.8V CMOS logic. Only few specific interfaces (such as USIM and SD Card) are capable of dual voltage I/O. The following tables show the logic level specifications used in the LE910Cx interface circuits. The data specified in the tables below is valid throughout all drive strengths and the entire temperature ranges. NOTE: Do not connect LE910Cx’s digital logic signal directly to OEM’s digital logic signal with a level higher than 2.7V for 1.8V CMOS signals. 4.3.1. 1.8V Pads - Absolute Maximum Ratings Table 9: Absolute Maximum Ratings - Not Functional Parameter Min Max Input level on any digital pin when on -0.3V +2.16V Input voltage on analog pins when on -0.3V +2.16 V 4.3.2. 1.8V Standard GPIOs Table 10: Operating Range – Interface Levels (1.8V CMOS) Pad Parameter Min Max Unit Comment VIH Input high level 1.25V -- [V] VIL Input low level -- 0.6V [V] VOH Output high level 1.4V -- [V] VOL Output low level -- 0.45V [V] IIL Low-level input leakage current -1 -- [uA] No pull-up IIH High-level input leakage current -- +1 [uA] No pull-down RPU Pull-up resistance 30 390 [kΩ]
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 45 of 116 Pad Parameter Min Max Unit Comment RPD Pull-down resistance 30 390 [kΩ] Ci Input capacitance -- 5 [pF] NOTE: Pull-Up and Pull-Down resistance of GPIO3, GPIO7 and GPIO8 is different than above mentioned GPIO3 pull resistance is specified as 10KΩ to 50KΩ 4.3.3. 1.8V SD Card Pads Table 11: Operating Range – SD Card Pads Working at 1.8V Pad Parameter Min Max Unit Comment VIH Input high level 1.27V 2V [V] VIL Input low level -0.3V 0.58V [V] VOH Output high level 1.4V -- [V] VOL Output low level 0 0.45V [V] IIL Low-level input leakage current -2 - [uA] No pull-up IIH High-level input leakage current - 2 [uA] No pull-down RPU Pull-up resistance 10 100 [kΩ] RPD Pull-down resistance 10 100 [kΩ] Ci Input capacitance 5 [pF] 4.3.4. 1.8V SIM Card Pads Table 12: Operating Range – SIM Pads Working at 1.8V Pad Parameter Min Max Unit Comment VIH Input high level 1.35V 2V [V] VIL Input low level -0.3V 0.43V [V] VOH Output high level 1.35V 1.875V [V]
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 46 of 116 Pad Parameter Min Max Unit Comment VOL Output low level 0V 0.4V [V] IIL Low-level input leakage current -2 - [uA] No pull-up IIH High-level input leakage current - 2 [uA] No pull-down RPU Pull-up resistance 10 100 [kΩ] RPD Pull-down resistance 10 100 [kΩ] Ci Input capacitance 5 [pF] 4.3.5. Dual Voltage Pads - Absolute Maximum Ratings Table 13: Absolute Maximum Ratings - Not Functional Parameter Min Max Input level on any digital pin when on -0.3V +3.6V Input voltage on analog pins when on -0.3V +3.6 V 4.3.6. SD Card Pads @ 2.95V Table 14: Operating Range – For SD Card Pads Operating at 2.95V Pad Parameter Min Max Unit Comments VIH Input high level 1.9V 3.1V [V] VIL Input low level -0.3V 0.7V [V] VOH Output high level 2.1V 3.05V [V] VOL Output low level 0V 0.4V [V] IIL Low-level input leakage current -10 [uA] No pull-up IIH High-level input leakage current 10 [uA] No pull-down RPU Pull-up resistance 10 100 [kΩ]
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 47 of 116 Pad Parameter Min Max Unit Comments RPD Pull-down resistance 10 100 [kΩ] Ci Input capacitance 5 [pF] 4.3.7. SIM Card Pads @2.95V Table 15: Operating Range – For SIM Pads Operating at 2.95V Pad Parameter Min Max Unit Comment VIH Input high level 2.1V 3.1V [V] VIL Input low level -0.3V 0.55V [V] VOH Output high level 2.25V 3.1V [V] VOL Output low level 0V 0.4V [V] IIL Low-level input leakage current -10 [uA] No pull-up IIH High-level input leakage current 10 [uA] No pull-down RPU Pull-up resistance 10 100 [kΩ] RPD Pull-down resistance 10 100 [kΩ] Ci Input capacitance 5 [pF]
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 48 of 116 5. Hardware Commands 5.1. Turning on the LE910Cx Module To turn on the LE910Cx module, the ON/OFF# pad must be asserted low for at least 1 second and then released. The maximum current that can be drained from the ON/OFF # pad is 0.1 mA. This pin is internally pulled up; customers should expect to see ~ 800 mV on the output. Figure 4 illustrates a simple circuit to power on the module using an inverted buffer output. Figure 4: Power-on Circuit NOTE: Recommended values R2 = 47kΩ, R1 = 10kΩ. 5.2. Initialization and Activation State After turning on the LE910Cx module, the LE910Cx is not yet activated because the SW initialization process of the LE910Cx module is still in process internally. It takes some time to fully complete the HW and SW initialization of the module. For this reason, it is impossible to access LE910Cx during the Initialization state. As shown in Figure 5, the LE910Cx becomes operational (in the Activation state) at least 20 seconds after the assertion of ON_OFF. NOTE: During the Initialization state, AT commands are not available. The DTE host must wait for the Activation state prior to communicating with the LE910Cx.
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 49 of 116 Figure 5: LE910Cx Initialization and Activation NOTE: SW_RDY signal is available on GPIO_08 (by default GPIO_08 functions as SW_RDY) NOTE: To check if the LE910Cx has completely powered on, monitor the SW_RDY signal. When SW_RDY goes high, the module has completely powered on and is ready to accept AT commands. NOTE: During SW initialization of the LE910Cx, the SW configures all pads and interfaces to their desired mode. When PWRMON goes high, this indicates that the initialization of all I/O pads is completed. NOTE: Do not use any pull-up resistor on the ON/OFF# line as it is internally pulled up. Using a pull-up resistor may cause latch-up problems on the LE910Cx power regulator and improper powering on/off of the module. The ON/OFF# line must be connected only in an open-collector configuration. NOTE: Active low signals are labeled with a name that ends with "#" or with “_N” NOTE: To avoid a back-powering effect, it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the module when it is powered OFF or during an ON/OFF transition. 1 Sec < T_Hold < 2 SecVBATTON_OFFSW_RDYT_RDY < 20 SecV_AUXPWRMON18 Sec < T_PWRMON < 20 SecOFF State Initialization State Active StateOK to Send AT commandsAll interfaces and pins configured
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 50 of 116 5.3. Turning OFF the LE910Cx Module Turning OFF the device can be done in four different ways: • AT#SHDN software command • Hardware shutdown using ON/OFF# pad • Hardware Unconditional Shutdown using the HW_SHUTDOWN_N When the device is shut down by a software command or a hardware shutdown, it issues a detach request to the network, informing the network that the device will not be reachable any more. NOTE: To check if the device has powered off, monitor the PWRMON hardware line. When PWRMON goes low, this indicates that the device has powered off. NOTE: To avoid a back-powering effect, it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the module when it is powered OFF or during an ON/OFF transition. 5.3.1. Shutdown by Software Command The LE910Cx module can be shut down by a software command. When a shutdown command is sent, LE910Cx goes into the Finalization state and at the end of the finalization process shuts down PWRMON. The duration of the finalization state can differ according to the current situation of the module, so a value cannot be defined. Usually, it will take more than 15 seconds from sending a shutdown command until reaching a complete shutdown. The DTE should monitor the status of PWRMON to observe the actual power-off. Figure 6: Shutdown by Software Command
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 51 of 116 NOTE: To check whether the device has powered OFF, monitor the PWRMON hardware line. When PWRMON goes low, the device has powered OFF. 5.3.2. Hardware Shutdown To turn off LE910Cx module, the ON/OFF# pad must be asserted low for at least 2.5 seconds and then released. Use the same circuitry and timing for power-on. When the hold time of ON/OFF# is above 2.5 seconds, LE910Cx goes into the Finalization state and in the end shuts down PWRMON. The duration of the Finalization state can differ according to the current situation of the module, so a value cannot be defined. Usually, it will take more than 15 seconds from sending a shutdown command until reaching a complete shutdown. DTE should monitor the status of PWRMON to observe the actual power-off. Figure 7: Hardware Shutdown NOTE: To check whether the device has powered off, monitor the PWRMON hardware line. When PWRMON goes low, the device has powered off.
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 52 of 116 5.3.4. Unconditional Hardware Shutdown To unconditionally shut down the LE910Cx module, the HW_SHUTDOWN_N pad must be tied low for at least 200 milliseconds and then released. A simple circuit for applying unconditional shutdown is shown below: Figure 8: Circuit for Unconditional Hardware Shutdown The system power down timing for using HW_SHUTDOWN_N is shown below Figure 9 Power down timing using HW_SHUTDOWN_N NOTE: Recommended values R2 = 47kΩ, R1 = 10kΩ. NOTE: Do not use any pull-up resistor on the HW_SHUTDOWN_N line or any totem pole digital output. Using a pull-up resistor may cause latch-up problems on the LE910Cx power regulator and improper functioning of the module. The HW_SHUTDOWN_N line must be connected only in an open-collector configuration. NOTE: The Unconditional Hardware Shutdown must always be implemented on the boards, but the software must use it only as an emergency exit procedure, and not as a normal power-off operation. 200mS Sec < T_Hold VBATTSHDN_NSW_RDYT_RDY ~0 SecV_AUXPWRMONT_PWRMON ~0 SecOFF StateActive State
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 53 of 116 6. Power Supply The power supply circuitry and board layout are very important parts of the full product design, with critical impact on the overall product performance. Read the following requirements and guidelines carefully to ensure a good and proper design. 6.1. Power Supply Requirements The LE910Cx power requirements are as follows: Table 16: Power Supply Requirements Nominal supply voltage 3.8V Supply voltage range 3.4V – 4.2V Max ripple on module input supply 30mV Table 17 provides typical current consumption values of LE910Cx for various operation modes. Table 17: LE910Cx Current Consumption Mode Average [Typical] Mode Description 1) Switched Off Switched off 25µA Module is powered but switched Off (RTC On) 2) IDLE Mode (Standby Mode; No Call in Progress) AT+CFUN=4 1.0mA Tx and Rx are disabled ; module is not registered on the network (Flight mode) DRX GSM 2.0mA DRx2 1.4mA DRx5 WCDMA 1.4mA DRx7 1.2mA DRx8 LTE 1.8mA Paging cycle #128 frames (1.28 sec DRx cycle) 1.4mA Paging cycle #256 frames (2.56 sec DRx cycle)
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 54 of 116 Mode Average [Typical] Mode Description 3) Operative Mode (LTE) LTE (0 dBm) 190mA LTE CAT 4 channel BW 20 MHz, RB=1, Tx = 0 dBm (Test case: BAND 1, Channel 300) LTE (22 dBm) 500mA LTE CAT 4 channel BW 20 MHz, RB=1, Tx = 22 dBm (Test case: BAND 1, Channel 300) 4) Operative Mode (WCDMA) WCDMA Voice 200mA WCDMA voice call (Tx = 10 dBm) WCDMA HSDPA (0 dBm) 150mA WCDMA data call (Cat 14, Tx = 0 dBm, Max throughput) WCDMA HSDPA (22 dBm) 310mA WCDMA data call (Cat 14, Tx = 22 dBm, Max throughput) 5) Operative Mode (GSM) GSM Tx and Rx mode GSM900 PL5 250mA GSM voice call DCS1800 PL0 170mA GPRS 4 Tx + 1 Rx GSM900 PL5 430mA GPRS Sending Data mode (CS-4) DCS1800 PL0 340mA * Worst/best case current values depend on network configuration - not under module control. NOTE: The electrical design for the power supply must ensure a peak current output of at least 2A. NOTE: In GSM/GPRS mode, RF transmission is not continuous, but is packed into bursts at a base frequency of about 216 Hz with relative current peaks as high as about 2A. Therefore, the power supply must be designed to withstand these current peaks without big voltage drops. This means that both the electrical design and the board layout must be designed for this current flow. If the layout of the PCB is not well designed, a strong noise floor is generated on the ground. This will reflect on all the audio paths producing an audible annoying noise at 216 Hz. If the voltage drops during the peaks, current absorption is too high. The device may even shut down as a consequence of the supply voltage drop.
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 55 of 116 6.2. General Design Rules The principal guidelines for the Power Supply Design embrace three different design steps: • Electrical design • Thermal design • PCB layout 6.2.1. Electrical Design Guidelines The electrical design of the power supply depends strongly on the power source where this power is drained. Power sources can be distinguished by three categories: • +5V input (typically PC internal regulator output) • +12V input • Battery 6.2.1.1. + 5V Input Source Power Supply – Design Guidelines • The desired output for the power supply is 3.8V. So, the difference between the input source and the desired output is not big, and therefore a linear regulator can be used. A switching power supply is preferred to reduce power consumption. • When using a linear regulator, a proper heat sink must be provided to dissipate the power generated. • A bypass low ESR capacitor of adequate capacity must be provided to cut the current absorption peaks close to the LE910Cx module. A 100 μF tantalum capacitor is usually suitable (on both VBATT and VBATT_PA together). • Make sure that the low ESR capacitor on the power supply output (usually a tantalum one) is rated at least 10V. • A protection diode must be inserted close to the power input to protect the LE910Cx module from power polarity inversion.
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 56 of 116 Figure 10 shows an example of linear regulator with 5V input. Figure 10: Example of Linear Regulator with 5V Input 6.2.1.2. + 12V Input Source Power Supply – Design Guidelines • The desired output for the power supply is 3.8V. Due to the big difference between the input source and the desired output, a linear regulator is unsuitable and must not be used. A switching power supply is preferable because of its better efficiency, especially with the 2A peak current load which is expected during GSM Tx. • When using a switching regulator, a 500-kHz or higher switching frequency regulator is preferable because of its smaller inductor size and its faster transient response. This allows the regulator to respond quickly to the current peaks absorption. • In any case, the selection of the frequency and switching design is related to the application to be developed due to the fact that the switching frequency can also generate EMC interference. • For car batteries (lead-acid accumulators) the input voltage can rise up to 15.8V. This must be kept in mind when choosing components: all components in the power supply must withstand this voltage. • A bypass low ESR capacitor of adequate capacity must be provided to cut the current absorption peaks. A 100μF tantalum capacitor is usually suitable (on both VBATT and VBATT_PA together). • Make sure that the low ESR capacitor on the power supply output (usually a tantalum one) is rated at least 10V. • For automotive applications, a spike protection diode must be inserted close to the power input to clean the supply of spikes. • A protection diode must be inserted close to the power input to protect the LE910Cx module from power polarity inversion. This can be the same diode as for spike protection.
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 57 of 116 Figure 11 and Figure 12 show an example of switching regulator with 12V input. Figure 11: Example of Switching Regulator with 12V Input – Part 1 Figure 12: Example of Switching Regulator with 12V Input – Part 2
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 58 of 116 6.2.1.3. Battery Source Power Supply – Design Guidelines • The desired nominal output for the power supply is 3.8V, and the maximum allowed voltage is 4.2V. Hence, a single 3.7V Li-Ion cell battery type is suitable for supplying the power to the LE910Cx module. NOTE: Do not use any Ni-Cd, Ni-MH, and Pb battery types directly connected to the LE910Cx module. Their use can lead to overvoltage on the LE910Cx and damage it. Use only Li-Ion battery types. • A bypass low ESR capacitor of adequate capacity must be provided to cut the current absorption peaks; a 100μF tantalum capacitor is usually suitable (on both VBATT and VBATT_PA together). • Make sure that the low ESR capacitor (usually a tantalum one) is rated at least 10V. • A protection diode must be inserted close to the power input to protect the LE910Cx module from power polarity inversion. Otherwise, the battery connector must be done in a way to avoid polarity inversions when connecting the battery. • The battery capacity must be at least 900 mAh to withstand the current peaks of 2A.
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 59 of 116 6.2.2. Thermal Design Guidelines The thermal design for the power supply heat sink must be done with the following specifications: • Average current consumption during RF transmission @PWR level max in LE910Cx as shown in Table 17 • Average current consumption during Class12 GPRS transmission @PWR level max as shown in Table 17 • Average GPS current during GPS ON (Power Saving disabled) : mA (TBD) NOTE: The average consumption during transmission depends on the power level at which the device is requested to transmit via the network. Therefore, the average current consumption varies significantly. NOTE: The thermal design for the power supply must be made keeping an average consumption at the max transmitting level during calls of (LTE/HSPA)/GPRS plus average consumption in GPS Tracking mode. Considering the very low current during Idle, especially if the Power Saving function is enabled, it is possible to consider from the thermal point of view that the device absorbs significant current only during an Active Call or Data session. For the heat generated by the LE910Cx module, consider it to be 2W max during transmission at Class12 GPRS upload. The generated heat is mostly conducted to the ground plane under the LE910Cx module. Ensure that your application can dissipate heat. In LTE/WCDMA/HSPA mode, the LE910Cx emits RF signals continuously during transmission. Therefore, you must pay special attention how to dissipate the heat generated. Application board design needs to make sure the area under the LE910Cx module is as large as possible. Make sure that the LE910Cx is mounted on the large ground area of application board and provide many ground vias to dissipate the heat. Even though peak current consumption in GSM mode is higher than in LTE/WCDMA/HSPA, considerations for the heat sink are more important in the case of WCDMA due to the continuous transmission conditions.
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 60 of 116 6.2.3. Power Supply PCB Layout Guidelines As seen in the electrical design guidelines, the power supply must have a low ESR capacitor on the output to cut the current peaks and a protection diode on the input to protect the supply from spikes and polarity inversion. The placement of these components is crucial for the correct operation of the circuitry. A misplaced component can be useless or can even decrease the power supply performances. • The bypass low ESR capacitor must be placed close to the LE910Cx power input pads, or if the power supply is of a switching type, it can be placed close to the inductor to cut the ripple, as long as the PCB trace from the capacitor to LE910Cx is wide enough to ensure a drop-less connection even during the 2A current peaks. • The protection diode must be placed close to the input connector where the power source is drained. • The PCB traces from the input connector to the power regulator IC must be wide enough to ensure that no voltage drops occur during the 2A current peaks. Note that this is not done to save power loss but especially to avoid the voltage drops on the power line at the current peaks frequency of 216 Hz that will reflect on all the components connected to that supply (also introducing the noise floor at the burst base frequency.) For this reason while a voltage drop of 300-400 mV may be acceptable from the power loss point of view, the same voltage drop may not be acceptable from the noise point of view. If your application does not have an audio interface but only uses the data feature of the LE910Cx, this noise is not so disturbing, and the power supply layout design can be more forgiving. • The PCB traces to LE910Cx and the bypass capacitor must be wide enough to ensure that no significant voltage drops occur when the 2A current peaks are absorbed. This is needed for the same above-mentioned reasons. Try to keep these traces as short as possible. • The PCB traces connecting the switching output to the inductor and the switching diode must be kept as short as possible by placing the inductor and the diode very close to the power switching IC (only for the switching power supply). This is done to reduce the radiated field (noise) at the switching frequency (usually 100-500 kHz). • Use a good common ground plane. • Place the power supply on the board in a way to guarantee that the high current return paths in the ground plane do not overlap any noise sensitive circuitry, such as the microphone amplifier/buffer or earphone amplifier. • The power supply input cables must be kept separate from noise sensitive lines, such as microphone/earphone cables.
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 61 of 116 7. Antenna(s) Antenna connection and board layout design are the most important parts in the full product design, and they have a strong influence on the product’s overall performance. Read carefully and follow the requirements and guidelines for a good and proper design. 7.1. GSM/WCDMA/LTE Antenna Requirements The antenna for the LE910Cx device must meet the following requirements: Table 18: GSM / WCDMA/ LTE Antenna Requirements Frequency range The customer must use the most suitable antenna band width for covering the frequency bands provided by the network operator and also supported by the car OEM while using the Telit module. The bands supported by each variant of the LE910Cx module family are provided in Section 2.6.1, RF Bands per Regional Variant. Gain Gain < 3 dBi Impedance 50 Ohm Input power > 33 dBm(2 W) peak power in GSM > 24 dBm average power in WCDMA & LTE VSWR absolute max <= 10:1 VSWR recommended <= 2:1 Since there is no antenna connector on the LE910Cx module, the antenna must be connected to the LE910Cx antenna pad (K1) by a transmission line implemented on the PCB. If the antenna is not directly connected to the antenna pad of the LE910Cx, a PCB line is required to connect to it or to its connector. This transmission line must meet the following requirements: Table 19: Antenna Line on PCB Requirements Characteristic impedance 50 Ohm Max attenuation 0.3 dB Avoid coupling with other signals. Cold End (Ground Plane) of the antenna must be equipotential to the LE910Cx ground pads.
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 62 of 116 Furthermore, if the device is developed for the US and/or Canada market, it must comply with the FCC and/or IC approval requirements. NOTE: This device is to be used only for mobile and fixed application. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. End-Users must be provided with transmitter operation conditions for satisfying RF exposure compliance. OEM integrators must ensure that the end user has no manual instructions to remove or install the LE910Cx module. Antennas used for this OEM module must not exceed 3dBi gain for mobile and fixed operating configurations. 7.2. GSM/WCDMA/LTE Antenna – PCB Line Guidelines • Make sure that the transmission line’s characteristic impedance is 50 Ohm. • Keep the line on the PCB as short as possible since the antenna line loss should be less than around 0.3 dB. • Line geometry should have uniform characteristics, constant cross sections, and avoid meanders and abrupt curves. • Any suitable geometry/structure can be used for implementing the printed transmission line affecting the antenna. • If a ground plane is required in the line geometry, this plane must be continuous and sufficiently extended so the geometry can be as similar as possible to the related canonical model. • Keep, if possible, at least one layer of the PCB used only for the ground plane. If possible, use this layer as reference ground plane for the transmission line. • Surround the PCB transmission line with ground (on both sides). Avoid having other signal tracks facing the antenna line track directly. • Avoid crossing any un-shielded transmission line footprint with other tracks on different layers. • The ground surrounding the antenna line on the PCB must be strictly connected to the main Ground plane by means of via-holes (once per 2 mm at least) placed close to the ground edges facing the line track. • Place EM-noisy devices as far as possible from LE910Cx antenna line. • Keep the antenna line far away from the LE910Cx power supply lines. • If EM-noisy devices are present on the PCB hosting the LE910Cx, such as fast switching ICs, take care to shield them with a metal frame cover.
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 63 of 116 • If EM-noisy devices are not present around the line, geometries like Micro strip or Grounded Coplanar Waveguide are preferred because they typically ensure less attenuation compared to a Strip line having the same length. 7.3. GSM/WCDMA/LTE Antenna – Installation Guidelines • Install the antenna in a location with access to the network radio signal. • The antenna must be installed such that it provides a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. • The antenna must not be installed inside metal cases. • The antenna must be installed according to the antenna manufacturer’s instructions. 7.4. Antenna Diversity Requirements This product includes an input for a second Rx antenna to improve radio sensitivity. The function is called Antenna Diversity. Table 20: Antenna Diversity Requirements Frequency range The customer must use the most suitable antenna band width for covering the frequency bands provided by the network operator and also supported by the car OEM while using the Telit module. The bands supported by each variant of the LE910Cx module family are provided in Section 2.6.1, RF Bands per Regional Variant Impedance 50Ω VSWR recommended ≤ 2:1 Since there is no antenna connector on the LE910Cx module, the antenna must be connected to the LE910Cx diversity antenna pad (F1) by means of a transmission line implemented on the PCB. If the antenna is not directly connected at the antenna pad of the LE910Cx, a PCB line is required to connect to it or to its connector. The second Rx antenna must not be located in close vicinity of the main antenna. To improve diversity gain and isolation and to reduce mutual interaction, the two antennas should be located at the maximum reciprocal distance possible, taking into consideration the available space within the application. NOTE: If Rx Diversity is not used/connected, disable the Diversity functionality using the AT#RXDIV command (refer to the AT User guide) and leave the Diversity pad F1 unconnected.
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 64 of 116 7.5. GNSS Antenna Requirements LE910Cx supports an active antenna. It is recommended to use antennas as follow: • An external active antenna (GPS only) • An external active antenna plus GNSS pre-filter NOTE: The external GNSS pre-filter is required for the GLONASS application. The GNSS pre-filter must meet the following requirements: Source and load impedance = 50 Ohm • Insertion loss (1575.42–1576.42 MHz) = 1.4 dB (Max) • Insertion loss (1565.42–1585.42 MHz) = 2.0 dB (Max) • Insertion loss (1597.5515–1605.886 MHz) = 2.0 dB (Max) NOTE: It is recommended to add a DC block to the customer’s GPS application to prevent damage to the LE910Cx module due to unwanted DC voltage. 7.5.1. Combined GNSS Antenna The use of a combined RF/GNSS antenna is NOT recommended. This solution can generate an extremely poor GNSS reception. In addition, the combination of antennas requires an additional diplexer, which adds significant power loss in the RF path. 7.5.2. Linear and Patch GNSS Antenna Using this type of antenna introduces at least 3 dB of loss compared to a circularly polarized (CP) antenna. Having a spherical gain response instead of a hemispherical gain response can aggravate the multipath behavior and create poor position accuracy. 7.5.3. Front End Design Considerations Since there is no antenna connector on the LE910Cx module, the antenna must be connected to the LE910Cx through the PCB to the antenna pad. If the antenna is not directly connected at the antenna pad of the LE910Cx, a PCB line is required. This line of transmission must meet the following requirements:
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 65 of 116 Table 21: Antenna Line on PCB Requirements Characteristic impedance 50 Ohm Max attenuation 0.3 dB Avoid coupling with other signals. Cold End (Ground Plane) of the antenna must be equipotential to the LE910Cx ground pads. Furthermore, if the device is developed for the US and/or Canada market, it must comply with the FCC and/or IC requirements. This device is to be used only for mobile and fixed application. 7.5.4. GNSS Antenna – PCB Line Guidelines • Ensure that the antenna line impedance is 50 Ohm. • Keep the line on the PCB as short as possible to reduce the loss. • The antenna line must have uniform characteristics, constant cross section, avoiding meanders and abrupt curves. • Keep one layer of the PCB used only for the Ground plane; if possible. • Surround (on the sides, over and under) the antenna line on the PCB with Ground. Avoid having other signal tracks directly facing the antenna line track. • The Ground around the antenna line on the PCB must be strictly connected to the main Ground plane by placing vias at least once per 2mm. • Place EM-noisy devices as far as possible from LE910Cx antenna line. • Keep the antenna line far away from the LE910Cx power supply lines. • If EM-noisy devices are around the PCB hosting the LE910Cx, such as fast switching ICs, ensure shielding the antenna line by burying it inside the layers of PCB and surrounding it with Ground planes; or shield it with a metal frame cover. • If you do not have EM-noisy devices around the PCB of LE910Cx, use a Micro strip line on the surface copper layer for the antenna line. The line attenuation will be lower than a buried one.
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 66 of 116 7.5.5. GNSS Antenna – Installation Guidelines • The LE910Cx, due to its sensitivity characteristics, is capable of performing a fix inside buildings. (In any case, the sensitivity could be affected by the building characteristics i.e. shielding.) • The antenna must not be co-located or operating in conjunction with any other antenna or transmitter. • The antenna must not be installed inside metal cases. • The antenna must be installed according to the antenna manufacturer’s instructions.
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 67 of 116 8. Hardware Interfaces Table 22 summarizes all the hardware interfaces of the LE910Cx module. Table 22: LE910Cx Hardware Interfaces Interface LE910Cx SGMII For Ethernet support HSIC x1 SD/MMC x1 dual voltage interface for supporting SD/MMC card SDIO For WIFI support (1.8V only) USB USB2.0, OTG support SPI Master only, up to 50 MHz I2C For sensors, audio control UART 2 HS-UART (up to 4 Mbps) Audio I/F I2S/PCM, Analog I/O GPIO 10 ~ 27 (10 dedicated + 17 multiplexed with other signals) USIM x2, dual voltage each (1.8V/2.85V) ADC Up to x3 Antenna ports 2 for Cellular, 1 for GNSS
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 68 of 116 8.1. USB Port The LE910Cx module includes a Universal Serial Bus (USB) transceiver, which operates at USB high-speed (480 Mbits/sec). It can also operate with USB full-speed hosts (12 Mbits/sec). It is compliant with the USB 2.0 specification and can be used for control and data transfers as well as for diagnostic monitoring and firmware update. The USB port is typically the main interface between the LE910Cx module and OEM hardware. NOTE: The USB_D+ and USB_D- signals have a clock rate of 480 MHz. The signal traces must be routed carefully. Minimize trace lengths, number of vias, and capacitive loading. The impedance value should be as close as possible to 90 Ohms differential. Table 23 lists the USB interface signals. Table 23: USB Interface Signals Signal Pad No Usage USB_VBUS A13 Power and cable detection for the internal USB transceiver. Acceptable input voltage range 2.5V – 5.5V @ max 5 mA consumption USB_D- C15 Minus (-) line of the differential, bi-directional USB signal to/from the peripheral device USB_D+ B15 Plus (+) line of the differential, bi-directional USB signal to/from the peripheral device USB_ID A14 Used for USB OTG in order to determine host or client mode NOTE: USB_VBUS input power is internally used to detect the USB port and start the enumeration process. It is not used for supplying power to the internal LE910Cx USB HW block. Therefore, only a maximum of 5 mA is required. NOTE: Even if USB communication is not used, it is still highly recommended to place an optional USB connector on the application board. At least test points of the USB signals are required since the USB physical communication is needed in the case of SW update. NOTE An external 5V power supply is required on the application board for supporting USB OTG
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 69 of 116 8.2. HSIC Interface The application processor exposes a High-Speed Inter-Chip (HSIC). HSIC eliminates the analog transceiver from a USB interface for lower voltage operation and reduced power dissipation. • High-speed 480 Mbps (240 MHz DDR) USB transfers are 100% host driver compatible with traditional USB cable connected topologies • Bidirectional data strobe signal (STROBE) • Bidirectional data signal (DATA) • No power consumption unless a transfer is in progress Further details will be provided in a future release of this document. 8.3. SGMII Interface (optional) The SOC optionally includes an integrated Ethernet MAC with an SGMII interface, having the following key features: • The SGMII interface can be used connect to an external Ethernet PHY, or an external switch. • When enabled, an additional network interface will be available to the Linux kernel’s router. 8.3.1. Ethernet Control interface When using an external PHY for Ethernet connectivity, the LE910C1 also includes the control interface for managing the external PHY The table below lists the signals for controlling the external PHY Table 24: Ethernet Control Interface Signals PAD Signal I/O Function Type COMMENT C2 MAC_MDC O MAC to PHY Clock 2.85V C1 MAC_MDIO I/O MAC to PHY Data 2.85V D1 ETH_RST_N O Reset to Ethernet PHY 2.85V G4 ETH_INT_N I Interrupt from Ethernet PHY 2.85V NOTE: The Ethernet control interface is shared with USIM2 port! When Ethernet PHY is used, USIM2 port cannot be used (and vice versa).
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 70 of 116 8.4. Serial Ports The serial port is typically a secondary interface between the LE910Cx module and OEM hardware. Two serial ports are available on the module: • MODEM SERIAL PORT 1(Main) • MODEM SERIAL PORT 2 (Auxiliary) Several configurations can be designed for the serial port on the OEM hardware. The most common are: • RS232 PC com port • Microcontroller UART @ 1.8V (Universal Asynchronous Receive Transmit) • Microcontroller UART @ 3.3V/5V or other voltages different from 1.8V Depending on the type of serial port on the OEM hardware, a level translator circuit may be needed to make the system operate. The only configuration that does not need level translation is the 1.8V UART. The levels for LE910Cx UART are the CMOS levels as described in Section 4.3, Logic Level Specifications.
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 71 of 116 8.4.1. Modem Serial Port 1 Signals Serial Port 1 on LE910Cx is a +1.8V UART with 7 RS232 signals. It differs from the PC-RS232 in signal polarity (RS232 is reversed) and levels. Table 25 lists the signals of LE910Cx Serial Port 1. Table 25: Modem Serial Port 1 Signals RS232 Pin No. Signal LE910Cx Pad No. Name Usage 1 DCD - DCD_UART N14 Data Carrier Detect Output from the LE910Cx that indicates carrier presence 2 RXD - TX_UART M15 Transmit line *see Note Output transmit line of the LE910Cx UART 3 TXD -RX_UART N15 Receive line *see Note Input receive line of the LE910Cx UART 4 DTR - DTR_UART M14 Data Terminal Ready Input to LE910Cx that controls the DTE READY condition 5 GND A2, B13, D4… Ground Ground 6 DSR - DSR_UART P14 Data Set Ready Output from the LE910Cx that indicates that the module is ready 7 RTS - RTS_UART L14 Request to Send Input to LE910Cx controlling the Hardware flow control 8 CTS - CTS_UART P15 Clear to Send Output from LE910Cx controlling the Hardware flow control 9 RI - RI_UART R14 Ring Indicator Output from LE910Cx indicating the Incoming call condition NOTE: DCD, DTR, DSR, RI signals that are not used for UART functions can be configured as GPIO using AT commands. NOTE: To avoid a back-powering effect, it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the module when it is powered OFF or during an ON/OFF transition.
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 72 of 116 NOTE: For minimum implementations, only the TXD and RXD lines need be connected. The other lines can be left open provided a software flow control is implemented. NOTE: According to V.24, Rx/Tx signal names refer to the application side; therefore, on the LE910Cx side, these signal are in the opposite direction: TXD on the application side will be connected to the receive line (here named TXD/ RX_UART) of the LE910Cx serial port and vice versa for Rx. NOTE: DTR pin must not be pulled low in order not to prevent the UART and the entire module from entering low power mode. DTR can be left floating if not used. 8.4.2. Modem Serial Port 2 Serial Port 2 on the LE910Cx is a +1.8V UART with RX and TX signals only. The UART functionality is shared with SPI thus simultaneous of SPI and UART is not supported. The below table lists the signals of LE910Cx Serial Port 2. Table 26 Modem Serial Port 2 Signals PAD Signal I/O Function Type COMMENT D15 TX_AUX O Auxiliary UART (Tx Data to DTE) 1.8V Shared with SPI_MOSI E15 RX_AUX I Auxiliary UART (Rx Data to DTE) 1.8V Shared with SPI_MISO NOTE: To avoid a back-powering effect, it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the module when it is powered OFF or during an ON/OFF transition. NOTE: The Auxiliary UART is used as the SW main debug console. It is required to place test points on this interface even if not used.
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 73 of 116 8.4.3. RS232 Level Translation To interface the LE910Cx with a PC com port or a RS232 (EIA/TIA-232) application, a level translator is required. This level translator must: • Invert the electrical signal in both directions • Change the level from 0/1.8V to +15/-15V The RS232 UART 16450, 16550, 16650 & 16750 chipsets accept signals with lower levels on the RS232 side (EIA/TIA-562), allowing a lower voltage-multiplying ratio on the level translator. Note that the negative signal voltage must be less than 0V and hence some sort of level translation is always required. The simplest way to translate the levels and invert the signal is by using a single chip-level translator. There are a multitude of them, differing in the number of drivers and receivers and in the levels (be sure to get a true RS232 level translator, not a RS485 or other standards). By convention, the driver is the level translator from the 0-1.8V UART to the RS232 level. The receiver is the translator from the RS232 level to 0-1.8V UART. To translate the whole set of control lines of the UART, the following is required: • 2 drivers • 2 receivers NOTE: The digital input lines operating at 1.8V CMOS have an absolute maximum input voltage of 2.7V. Therefore, the level translator IC must not be powered by the +3.8V supply of the module. Instead, it must be powered from a dedicated +1.8V power supply. An example of RS232 level adaption circuitry could use a MAXIM transceiver (MAX218). In this case, the chipset is capable of translating directly from 1.8V to the RS232 levels (Example on 4 signals only). Figure 13: RS232 Level Adaption Circuitry Example
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 74 of 116 NOTE: In this case, the length of the lines on the application must be taken into account to avoid problems in the case of High-speed rates on RS232. The RS232 serial port lines are usually connected to a DB9 connector as shown in Figure 14. Signal names and directions are named and defined from the DTE point of view. Figure 14: RS232 Serial Port Lines Connection Layout
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 75 of 116 8.5. Peripheral Ports In addition to the LE910Cx serial ports, the LE910Cx supports the following peripheral ports: • SPI – Serial Peripheral Interface • I2C - Inter-integrated circuit • SD/MMC Card Interface • SDIO Interface 8.5.1. SPI – Serial Peripheral Interface The LE910Cx SPI supports the following: • Master Mode only • 1.8V CMOS level • Up to 50 MHz clock rate NOTE: SPI is supported only on the Linux side. The LE910Cx module supports Master mode only and cannot be configured as Slave mode. NOTE: Simultaneous / Concurrent usage of AUX UART and SPI is not supported. Table 27: SPI Signals PAD Signal I/O Function Type Comment F15 SPI_CLK O SPI clock output 1.8V E15 SPI_MISO I SPI data Master input Slave output 1.8V Shared with RX_AUX D15 SPI_MOSI O SPI data Master output Slave input 1.8V Shared with TX_AUX H14 SPI_CS/GPIO11 O SPI chip-select output 1.8V Figure 15: SPI Signal Connectivity LE910Cx SPI_CS SPI_CLK SPI_MO SPI_MISO Host (Slave) SPI_CS SPI_CLK SPI_MOSI SPI_MISO
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 76 of 116 8.5.2. I2C - Inter-integrated Circuit The LE910Cx supports an I2C interface on the following pins: • B11 - I2C_SCL • B10 - I2C_SDA The I2C can also be used externally by the end customer application. In addition, SW emulated I2C functionality can be used on GPIO 1-10 pins. Any GPIO (among GPIO 1-10) can be configured as SCL or SDA. LE910Cx supports I2C Master Mode only. NOTE: SW emulated I2C on GPIO lines is supported only from the Modem side. For more information, refer to the LE910Cx AT SW manual for command settings. NOTE: For keeping backward compatibility with previous LE910 products it is recommended to keep using the SW emulated I2C available on GPIO’s 1-10. 8.5.3. SD/MMC Card Interface The LE910Cx provides an SD port supporting the SD3.0 specification, which can be used to support standard SD/MMC memory cards with the following features: • Interface with SD/MMC memory cards up to 2 TB • Max clock @ 2.95V - 50 MHz SDR • Max Data: 25 MB/s • SD standard: HS-SDR25 at 2.95V • Max clock @ 1.8V - 200 MHz SDR • Max Data: 100 MB/s • SD standard: UHS-SDR104 at 1.8 V • Max clock @ 1.8V - 50 MHz DDR • Max Data: 50 MB/s • SD standard: UHS-DDR50 at 1.8 V
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 77 of 116 Table 28 lists the LE910Cx SD card signals. Table 28: SD Card Signals PAD Signal I/O Function Type Comments J12 SD/MMC_CMD O SD command 1.8/2.95V F12 SD/MMC_CLK O SD card clock 1.8/2.95V E12 SD/MMC_DATA0 I/O SD Serial Data 0 1.8/2.95V G12 SD/MMC_DATA1 I/O SD Serial Data 1 1.8/2.95V K12 SD/MMC_DATA2 I/O SD Serial Data 2 1.8/2.95V H12 SD/MMC_DATA3 I/O SD Serial Data 3 1.8/2.95V G13 SD/MMC_CD I SD card detect input 1.8V Active Low F13 VMMC - Power supply for MMC card pull-up resistors 1.8/2.95V Max Current is 50mA Figure 16 shows the recommended connection diagram of the SD interface. Figure 16: SD/MMC Interface Connectivity SD/MMC_DATA2 SD/MMC_DATA3 SD/MMC_CMD SD/MMC_CLK SD/MMC_DATA0 SD/MMC_DATA1 LE910Cx SD/MMC Interface SD/MMC_CD DATA2 DATA3 CMD VDD VSS DATA0 DATA1 MicroSD MMC_CD GND GND 10K 10K 10K 10K 10K C=100nF GND External PS 3V VMMC
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 78 of 116 NOTE: SD/MMC is supported only on the Linux side. The power supply to the SD/MMC card is to be provided by the Host application board. The LE910Cx does not provide a dedicated power supply for the SD/MMC card. VMMC Supply is limited to 50mA thus can only supply the MMC card external pull-up resistors. Pull-up resistors must be placed on the host application board. The card detection input has an internal pull-up resistor. VMMC can be used for enabling of the external power supply (LDO Enable signal) 8.5.4. WiFi SDIO Interface The LE910Cx provides an SDIO port supporting the SDIO3.0 specification, which can be used to interface with a WiFi chipset (Qualcomm QCA6574 chipset or other WiFi solutions) The LE910Cx module includes an integrated SW driver for supporting the Qualcomm QCA6574 chipset The LE910Cx SDIO port supports the SDIO 3.0 specification at 1.8V CMOS only, thus cannot be used as an external SD/MMC card connection. The LE910Cx module supports an LTE/WiFi coexistence mechanism via the WCI (Wireless Coexistence Interface) port, which connects between the module and the external WiFi IC. For a detailed explanation, refer to Ref 5: Table 29: WiFi SDIO Interface Signals PAD Signal I/O Function Type Comments N13 WIFI_SD_CMD O WiFi SD Command 1.8V L13 WIFI_SD_CLK O WiFi SD Clock 1.8V 200 MHz max. J13 WIFI_SD_DATA0 I/O WiFi SD Serial Data 0 1.8V M13 WIFI_SD_DATA1 I/O WiFi SD Serial Data 1 1.8V K13 WIFI_SD_DATA2 I/O WiFi SD Serial Data 2 1.8V H13 WIFI_SD_DATA3 I/O WiFi SD Serial Data 3 1.8V L12 WIFI_SDRST O WiFi Reset / Power enable control 1.8V Active Low M8 WCI_TX O Wireless coexistence interface TXD 1.8V M9 WCI_RX I Wireless coexistence interface RXD 1.8V
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 79 of 116 NOTE: It is recommended that WiFi_SDRST be equipped with a pull-up resistor to 1.8V on the host application to disable WiFi reset function if needed.
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 80 of 116 8.6. Audio Interface The LE910Cx module support digital audio interface. 8.6.1. Digital Audio The LE910Cx module can be connected to an external codec through the digital interface. The product provides a single Digital Audio Interface (DVI) on the following pins: Table 30: Digital Audio Interface (DVI) Signals PAD Signal I/O Function Type COMMENT B9 DVI_WAO O Digital Audio Interface (WAO) B-PD 1.8V PCM_SYNC B6 DVI_RX I Digital Audio Interface (RX) B-PD 1.8V PCM_DIN B7 DVI_TX O Digital Audio Interface (TX) B-PD 1.8V PCM_DOUT B8 DVI_CLK O Digital Audio Interface (CLK) B-PD 1.8V PCM_CLK B12 REF_CLK O Audio Master Clock B-PD 1.8V I2S_MCLK LE910Cx DVI has the following characteristics: • PCM Master mode using short or long frame sync modes • 16 bit linear PCM format • PCM clock rates of 256 kHz, 512 kHz, 1024 kHz and 2048 kHz (Default) • Frame size of 8, 16, 32, 64, 128 & 256 bits per frame • Sample rates of 8 kHz and 16 kHz In addition to the DVI port, the LE910Cx module provides a master clock signal (REF_CLK on Pin B12) which can either provide a reference clock to an external codec or form an I2S interface together with the DVI port where the REF_CLK acts as the I2S_MCLK. The REF_CLK default frequency is 12.288 MHz. When using the DVI with REF_CLK as an I2S interface, 12.288 MHz is 256 x fs (where fs = 48 kHz)
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 81 of 116 8.6.1.1. Short Frame Timing Diagrams Figure 17: Primary PCM Timing
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 82 of 116 Table 31: PCM_CODEC Timing Parameters
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 83 of 116 8.6.1.2. Long Frame Timing Diagrams Figure 18: Auxiliary PCM Timing
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 84 of 116 Table 32: AUX_PCM_CODEC Timing Parameters
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 85 of 116 8.7. General Purpose I/O The general-purpose I/O pads can be configured to act in three different ways: • Input • Output • Alternate function (internally controlled) Input pads can only be read and report digital values (high or low) present on the pad at the read time. Output pads can only be written or queried and set the value of the pad output. An alternate function pad is internally controlled by LE910Cx firmware and acts depending on the implemented function. The following GPIOs are always available as a primary function on the LE910Cx. Table 33: Primary GPIOs PAD Signal I/O Function Type Drive Strength C8 GPIO_01 I/O Configurable GPIO CMOS 1.8V 2-16 mA C9 GPIO_02 I/O Configurable GPIO CMOS 1.8V 2-16 mA C10 GPIO_03 I/O Configurable GPIO CMOS 1.8V 2-16 mA C11 GPIO_04 I/O Configurable GPIO CMOS 1.8V 2-16 mA B14 GPIO_05 I/O Configurable GPIO CMOS 1.8V 2-16 mA C12 GPIO_06 I/O Configurable GPIO CMOS 1.8V 2-16 mA C13 GPIO_07 I/O Configurable GPIO CMOS 1.8V 2-16 mA K15 GPIO_08 I/O Configurable GPIO CMOS 1.8V 2-16 mA L15 GPIO_09 I/O Configurable GPIO CMOS 1.8V 2-16 mA G15 GPIO_10 I/O Configurable GPIO CMOS 1.8V 2-16 mA
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 86 of 116 The additional GPIOs below can be used in case their initial functionality is not used: PAD Signal I/O Initial Function Alternate Function Type Drive Strength L12 GPIO_13 I/O WIFI_SDRST Configurable GPIO CMOS 1.8V 2-16 mA N13 GPIO_14 I/O WIFI_SDIO_CMD Configurable GPIO CMOS 1.8V 2-16 mA J13 GPIO_15 I/O WIFI_SDIO_D0 Configurable GPIO CMOS 1.8V 2-16 mA M13 GPIO_16 I/O WIFI_SDIO_D1 Configurable GPIO CMOS 1.8V 2-16 mA K13 GPIO_17 I/O WIFI_SDIO_D2 Configurable GPIO CMOS 1.8V 2-16 mA H13 GPIO_18 I/O WIFI_SDIO_D3 Configurable GPIO CMOS 1.8V 2-16 mA L13 GPIO_19 I/O WIFI_SDIO_CLK Configurable GPIO CMOS 1.8V 2-16 mA M8 GPIO_24 I/O WCI_TXD Configurable GPIO CMOS 1.8V 2-16 mA M9 GPIO_25 I/O WCI_RXD Configurable GPIO CMOS 1.8V 2-16 mA R14 GPIO_31 I/O UART_RI Configurable GPIO CMOS 1.8V 2-16 mA P14 GPIO_32 I/O UART_DSR Configurable GPIO CMOS 1.8V 2-16 mA N14 GPIO_33 I/O UART_DCD Configurable GPIO CMOS 1.8V 2-16 mA M14 GPIO_34 I/O UART_DTR Configurable GPIO CMOS 1.8V 2-16 mA F15 GPIO_35 I/O SPI_CLK Configurable GPIO CMOS 1.8V 2-16 mA E15 GPIO_36 I/O SPI_MISO Configurable GPIO CMOS 1.8V 2-16 mA D15 GPIO_37 I/O SPI_MOSI Configurable GPIO CMOS 1.8V 2-16 mA H14 GPIO_11 I/O SPI_CS Configurable GPIO CMOS 1.8V 2-16 mA NOTE: To avoid a back-powering effect, it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the module when it is powered OFF or during an ON/OFF transition. NOTE: LE910Cx GPIO 1~10 can also be used as alternate I2C function. Refer to Section 0,
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 87 of 116 I2C - Inter-integrated Circuit. 8.7.1. Using a GPIO Pad as Input GPIO pads, when used as inputs, can be connected to a digital output of another device and report its status, provided this device has interface levels compatible with the 1.8V CMOS levels of the GPIO. If the digital output of the device is connected with the GPIO input, the pad has interface levels different from the 1.8V CMOS. It can be buffered with an open collector transistor with a 47 kΩ pull-up resistor to 1.8V. 8.7.2. Using a GPIO Pad as an interrupt / Wakeup source GPIO pads which are used as input can also be used as an interrupt source for the software. In general all GPIO pads can be also used as interrupts. However, not all GPIO’s can be used as a wakeup source of the module (wakeup from sleep) Only the following GPIO’s can be used for waking up the system from sleep • GPIO1 • GPIO4 • GPIO5 • GPIO8 8.7.3. Using a GPIO Pad as Output GPIO pads, when used as outputs, can drive 1.8V CMOS digital devices or compatible hardware. When set as outputs, the pads have a push-pull output, and therefore the pull-up resistor can be omitted.
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 88 of 116 Figure 19: GPIO Output Pad Equivalent Circuit
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 89 of 116 9. Miscellaneous Functions 9.1. Indication of Network Service Availability The STAT_LED signal shows information on the network service availability and call status. In the LE910Cx modules, the STAT_LED usually needs an external transistor to drive an external LED. The STAT_LED does not have a dedicated pin. The STAT_LED functionality is available on GPIO_01 pin (by default GPIO_01 functions as STAT_LED) The table below shows the device status corresponding to the pin status: Table 34: Network Service Availability Indication LED Status Device Status Permanently off Device off Fast blinking (Period 1s, Ton 0,5s) Net search / Not registered / Turning off Slow blinking (Period 3s, Ton 0,3s) Registered full service Permanently on A call is active Figure 20: Status LED Reference Circuit
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 90 of 116 9.2. Indication of Software Ready The SW_RDY signal provides indication about the ability of the module to receive commands As long as the SW_RDY is asserted low it indicates that the LE910Cx has not yet finished booting Once the SW_RDY is asserted high, it indicates that the LE910Cx is ready to receive commands The SW_RDY does not have a dedicated pin The SW_RDY functionality is available on GPIO_08 pin (by default GPIO_08 functions as SW_RDY 9.3. RTC – Real Time Clock The RTC within the LE910Cx module does not have a dedicated RTC supply pin. The RTC block is supplied by the VBATT supply. If the battery is removed, RTC is not maintained so if maintaining an internal RTC is needed, VBATT must be supplied continuously. In Power OFF mode, the average current consumption is ~25uA. 9.4. VAUX Power Output A regulated power supply output is provided to supply small devices from the module. This output is active when the module is ON and goes OFF when the module is shut down. The operating range characteristics of the supply are as follows: Table 35: Operating Range – VAUX Power Supply Min Typical Max Output voltage 1.75V 1.80V 1.85V Output current 100 mA Output bypass capacitor (inside the module) 1 μF
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 91 of 116 9.5. ADC Converter 9.5.1. Description The LE910Cx module provides three 8-bit Analog to Digital converters. Each ADC reads the voltage level applied on the relevant pin, converts it, and stores it into an 8-bit word. Table 36 shows the ADC characteristics. Table 36: ADC Parameters Min Max Units Input voltage range 0.1 1.7 Volt AD conversion - 8 bits Resolution - < 6.6 mV 9.5.2. Using the ADC Converter An AT command is available to use the ADC function. The command is AT#ADC=1,2. The read value is expressed in mV. Refer to LE9x0 AT Command User Guide 0 for the full description of this function. 9.6. Using the Temperature Monitor Function The Temperature Monitor permits to control the module’s internal temperature and, if properly set (see the #TEMPMON command in LE9x0 AT Command User Guide(, raises a GPIO to High Logic level when the maximum temperature is reached.
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 92 of 116 9.7. GNSS Characteristics The table below specifies the GNSS characteristics and expected performance The values are related to typical environment and conditions Table 37 GNSS Characteristics Parameters Typical Measurement Notes Sensitivity Standalone or MS Based Tracking Sensitivity -162.3 dBm Acquisition -162.3 dBm Cold Start Sensitivity -157.5 dBm TTFF Hot 1.1s GPS+GLONASS Simulator test Warm 22.1s GPS+GLONASS Simulator test Cold 29.94s GPS+GLONASS Simulator test Accuracy 0.8 m GPS+GLONASS Simulator test Min Navigation update rate 1Hz Dynamics 2g A-GPS Supported
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 93 of 116 10. Mounting the Module on your Board 10.1. General The LE910Cx module was designed to be compliant with a standard lead-free SMT process. 10.2. Finishing & Dimensions Figure 21 shows the mechanical dimensions of the LE910Cx module. Figure 21: LE910Cx Mechanical Dimensions (bottom view) Lead-free Alloy: Surface finishing Ni/Au for all solder pads 4 x Route Inhibit Pin B1
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 94 of 116 Figure 22: LE910Cx Mechanical Dimensions (Top view)
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 95 of 116 Figure 23: LE910Cx Mechanical Dimensions (Side view)
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 96 of 116 10.3. Recommended Footprint for the Application Figure 24 shows the recommended footprint for the application board (dimensions are in mm). To facilitate replacing the LE910Cx module if necessary, it is suggested to design the application with a 1.5 mm placement inhibit area around the module. It is also suggested, as a common rule for an SMT component, to avoid having a mechanical part of the application in direct contact with the module. NOTE: In the customer application, the region marked as INHIBIT in Figure 24 must be clear of any signal wiring or ground polygons. Figure 24: Recommended Footprint - Top View, 181 pads (dimensions are in mm, top view). 4 x Route Inhibit
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 97 of 116 10.4. Stencil Stencil’s apertures layout can be the same as the recommended footprint (1:1). The suggested thickness of stencil foil is greater than 120 µm. 10.5. PCB Pad Design The solder pads on the PCB are recommended to be of the Non Solder Mask Defined (NSMD) type. Figure 25: PCB Pad Design
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 98 of 116 10.6. Recommendations for PCB Pad Dimensions (mm) Figure 26: PCB Pad Dimensions It is not recommended to place around the pads a via or micro-via that is not covered by solder resist in an area of 0.15 mm unless it carries the same signal as the pad itself. Micro via inside the pads are allowed. Holes in pad are allowed only for blind holes and not for through holes. Table 38: Recommendations for PCB Pad Surfaces Finish Layer Thickness (um) Properties Electro-less Ni / Immersion Au 3-7 / 0.05-0.15 Good solder ability protection, high shear force values The PCB must be able to resist the higher temperatures, which occur during the lead-free process. This issue should be discussed with the PCB-supplier. Generally, the wettability of tin-lead solder paste on the described surface plating is better compared to lead-free solder paste.
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 99 of 116 10.7. Solder Paste We recommend using only “no clean” solder paste to avoid the cleaning of the modules after assembly. 10.7.1. Solder Reflow Figure 27 shows the recommended solder reflow profile. Figure 27: Solder Reflow Profile
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 100 of 116 Table 39: Solder Profile Characteristics Profile Feature Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max Preheat – Temperature min (Tsmin) – Temperature max (Tsmax) – Time (min to max) (ts) 150°C 200°C 60-180 seconds Tsmax to TL – Ramp-up rate 3°C/second max Time maintained above: – Temperature (TL) – Time (tL) 217°C 60-150 seconds Peak temperature (Tp) 245 +0/-5°C Time within 5°C of actual peak Temperature (tp) 10-30 seconds Ramp-down rate 6°C/second max Time 25°C to peak temperature 8 minutes max NOTE: All temperatures refer to topside of the package, measured on the package body surface. Warning: The LE910Cx module withstands one reflow process only.
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 101 of 116 11. Application Guide 11.1. Debug of the LE910Cx Module in Production To test and debug the mounting of the LE910Cx module, we strongly recommend to add several test pads on the host PCB for the following purposes: • Checking the connection between the LE910Cx itself and the application • Testing the performance of the module by connecting it with an external computer Depending on the customer application, these test pads include, but are not limited to the following signals: • TXD • RXD • ON/OFF • HW_SHUTDOWN_N • GND • VBATT • TX_AUX • RX_AUX • USB_VBUS • USB_D+ • USB_D- • GPIO_09 • WCI_RX In addition, the following signals are also recommended (but not mandatory): • PWRMON • GPIO_01 (STAT_LED) • GPIO_08 (SW_RDY)
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 102 of 116 11.2. Bypass Capacitor on Power Supplies When a sudden voltage step is asserted to or a cut from the power supplies, the steep transition causes some reactions such as overshoot and undershoot. This abrupt voltage transition can affect the device causing it to not operate or to malfunction. Bypass capacitors are needed to alleviate this behavior. The behavior can appear differently depending on the various applications. Customers must pay special attention to this issue when they design their application board. The length and width of the power lines must be considered carefully and the capacitance of the capacitors must be selected accordingly. The capacitor will also prevent ripple of the power supplies and the switching noise caused in TDMA systems such as GSM. Especially, a suitable bypass capacitor must be mounted on the following lines on the application board: • VBATT & VBATT_PA (M1, M2, N1, N2, P1, P2) • USB_VBUS (Pad A13) Recommended values are: • 100uF for both VBATT and VBATT_PA together • 4.7uF for USB_VBUS (including the 1uF capacitor inside the module) Customers must still consider that the capacitance mainly depends on the conditions of their application board. Generally, more capacitance is required when the power line is longer.
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 103 of 116 11.3. SIM Interface This section presents the recommended schematics for the design of SIM interfaces on the application boards. The LE910Cx supports two external SIM interfaces. 11.3.1. SIM Schematic Example Figure 28 illustrates in particular how the application side should be designed, and what values the components should have. Figure 28: SIM Schematics NOTE: The resistor value on SIMIO pulled up to SIMVCC must be defined to be compliant with the 3GPP specification for USIM electrical testing. The LE910Cx module contains an internal pull-up resistor of 20K Ω on SIMIO. However, the un-mounted option in the application design can be recommended to tune R1 if necessary. Table 40 lists the values of C1 to be adopted with the LE910Cx product: Table 40: SIM Interface – C1 Range Product P/N C1 Range (nF) LE910Cx 100 nF Refer to the following document for details: • Error! Reference source not found.
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 104 of 116 11.4. EMC Recommendations All LE910Cx signals are provided with some EMC protection. Nevertheless, the accepted level differs according to the specific pin. Table 41 lists the characteristics. Table 41: EMC Recommendations Pad Signal I/O Function Contact Air All Pins All pins All functions ± 4KV ± 8KV Antenna F1,K1,R9 Antenna pads Analog I/O Antenna pad ± 4KV ± 4KV Appropriate series resistors must be considered to protect the input lines from overvoltage.
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 105 of 116 11.5. Download and Debug Port Chose one of the following options in the design of host system to download or upgrade the Telit software and debug the LE910Cx module when it is already mounted on a host system. • UART and USB interfaces Users who use both UART and USB interfaces to communicate with the LE910Cx module must implement a USB download method in the host system to upgrade the LE910Cx when it is mounted. • USB interface only Users who use a USB interface only to communicate with the LE910Cx module must arrange for a USB port in the host system to debug or upgrade the LE910Cx when it is mounted. • UART interface only Users who use a UART interface only to communicate with the LE910Cx module must arrange for a UART port in the host system to debug or upgrade the LE910Cx when it is mounted. 11.5.1. Fast Boot mode Fast boot mode is normally used by Telit SW to enter SW download mode Fastboot is triggered by GPIO_09 (PAD L15). Asserting this signal high (1.8V) during boot will force the system into Fastboot 11.5.2. Recovery Boot Mode Emergency boot download mode is used in case of corrupted boot image was flashed into the device or in case all other recovery modes failed to work Emergency download mode is triggered by WCI_RX signal (PAD M9). Asserting this signal high (1.8V) during boot will force the system into Emergency download. NOTE: Application board must support accessible test pads on GPIO_09 and WCI_RX signal in order to enable download recovery modes mentioned above
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 106 of 116 12. Packing System 12.1. Packing system – Tray The LE910Cx modules are packaged on trays of 36 pieces each as shown in Figure 29. These trays can be used in SMT processes for pick & place handling. Figure 29: Packing
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 107 of 116 Figure 30: Tray Drawing
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 108 of 116 12.2. Tape & Reel The LE910Cx can be packaged on reels of 200 pieces each. See figure for module positioning into the carrier. Figure 31: Module Positioning into the Carrier Figure 32: Carrier Tape Detail
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 109 of 116 Figure 33: Reel Detail
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 110 of 116 Figure 34: Reel Box Detail 12.3. Moisture Sensitivity The LE910Cx module is a Moisture Sensitive Device Level 3, in accordance with standard IPC/JEDEC J-STD-020. Observe all of the requirements for using this kind of components.
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 111 of 116 13. Safety Recommendations READ CAREFULLY Be sure that the use of this product is allowed in your country and in the environment required. The use of this product may be dangerous and must be avoided in the following areas: • Where it can interfere with other electronic devices in environments such as hospitals, airports, aircrafts, etc. • Where there is risk of explosion, such as gasoline stations, oil refineries, etc. It is the responsibility of the user to enforce the country regulations and the specific environment regulations. Do not disassemble the product; any mark of tampering will compromise the warranty validity. We recommend following the instructions of the hardware user guides for correct wiring of the product. The product must be supplied with a stabilized voltage source and the wiring conform to the security and fire prevention regulations. The product must be handled with care, avoiding any contact with the pins because electrostatic discharges may damage the product itself. The same caution must be taken for the SIM, checking carefully the instructions for its use. Do not insert or remove the SIM when the product is in power saving mode. The system integrator is responsible for the functioning of the final product; therefore, care must be taken of the external components of the module, as well as of any project or installation issue, because of the risk of disturbing the GSM network or external devices or having any impact on safety. Should there be any doubt, refer to the technical documentation and the regulations in force. Every module must be equipped with a proper antenna with the specified characteristics. The antenna must be installed with care to avoid any interference with other electronic devices and must be installed with the guarantee of a minimum 20 cm distance from a human body. If this requirement cannot be satisfied, the system integrator must assess the final product against the SAR regulation. The European Community provides some Directives for electronic equipment introduced on the market. All the relevant information is available on the European Community website: http://europa.eu.int/comm/enterprise/rtte/dir99-5.htm The text of the Directive 99/05 regarding telecommunication equipment is available, while the applicable Directives (Low Voltage and EMC) are available at: http://europa.eu.int/comm/enterprise/rtte/dir99-5.htm
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 112 of 116 14. Conformity assessment issues 14.1. FCC/ISED Regulatory notices Modification statement Telit has not approved any changes or modifications to this device by the user. Any changes or modifications could void the user’s authority to operate the equipment. Telit n’approuve aucune modification apportée à l’appareil par l’utilisateur, quelle qu’en soit la nature. Tout changement ou modification peuvent annuler le droit d’utilisation de l’appareil par l’utilisateur. Interference statement (if it is not placed in the device) This device complies with Part 15 of the FCC Rules and Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Wireless notice This device complies with FCC/ISED radiation exposure limits set forth for an uncontrolled environment and meets the FCC radio frequency (RF) Exposure Guidelines and RSS-102 of the ISED radio frequency (RF) Exposure rules. Antenna gain must be below: Frequency Band Freq [MHz] LE910C1 NA Gain [dBi] LE910C1 NS Gain [dBi] 850 MHZ 850 0.63 6.08 1900 MHZ 1900 2.51 8.01 1700 MHZ 1700 5.00 5.00 900 MHZ 900 5.00 N/A 700 MHZ 700 5.63 5.63 This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Le présent appareil est conforme à l'exposition aux radiations FCC / ISED définies pour un environnement non contrôlé et répond aux directives d'exposition de la fréquence de la FCC radiofréquence (RF) et RSS-102 de la fréquence radio (RF) ISED règles d'exposition. Gain de l'antenne doit être ci-dessous:
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 113 of 116 Frequency Band Freq [MHz] LE910C1 NA Gain [dBi] LE910C1 NS Gain [dBi] 850 MHZ 850 0.63 6.08 1900 MHZ 1900 2.51 8.01 1700 MHZ 1700 5.00 5.00 900 MHZ 900 5.00 N/A 700 MHZ 700 5.63 5.63 L'émetteur ne doit pas être colocalisé ni fonctionner conjointement avec à autre antenne ou autre émetteur. FCC Class B digital device notice This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: - Reorient or relocate the receiving antenna. - Increase the separation between the equipment and receiver. - Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. - Consult the dealer or an experienced radio/TV technician for help. Labelling Requirements for the Host device The host device shall be properly labelled to identify the modules within the host device. The certification label of the module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labelled to display the FCC ID and IC of the module, preceded by the words "Contains transmitter module", or the word "Contains", or similar wording expressing the same meaning, as follows: LE910C1 NA Contains FCC ID: RI7LE910C1NA Contains IC: 5131A-LE910C1NA LE910C1 NS Contains FCC ID: RI7LE910C1NS Contains IC: 5131A-LE910C1NS
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 114 of 116 L'appareil hôte doit être étiqueté comme il faut pour permettre l'identification des modules qui s'y trouvent. L'étiquette de certification du module donné doit être posée sur l'appareil hôte à un endroit bien en vue en tout temps. En l'absence d'étiquette, l'appareil hôte doit porter une étiquette donnant le FCC ID et le IC du module, précédé des mots « Contient un module d'émission », du mot « Contient » ou d'une formulation similaire exprimant le même sens, comme suit: LE910C1 NA Contains FCC ID: RI7LE910C1NA Contains IC: 5131A-LE910C1NA LE910C1 NS Contains FCC ID: RI7LE910C1NS Contains IC: 5131A-LE910C1NS CAN ICES-3 (B) / NMB-3 (B) This Class B digital apparatus complies with Canadian ICES-003. Cet appareil numérique de classe B est conforme à la norme canadienne ICES-003.
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 115 of 116 15. Document History Table 42: Document Revision History Revision Date Changes 0.1 2016-08-30 First Draft 0.2 2016-09-05 Minor edits 0.3 2016-11-13 Added information for GPIO usage as Interrupt Added clarification for AUX_UART location and backward compatibility 0.4 2016-11-30 Updated band support table Updated WIFI application note doc info Added note related to future compatibility related to few pins Updated section 3.2 - Signals That Must Be Connected Updated pinout and pin description Updated pinout layout (Figure 2) Remove HW RESET description section Updated serial port 2 section Updated SPI port section Updated 1.8V pads pull info Updated AUX UART section Updated GPIO section Updated mechanical drawing (Cosmetic) 0.5 2016-12-02 Added section 9.2 to better describe SW_RDY signal Minor modifications per typos and improved description Renaming of SHDN_N pin 0.6 2016-12-07 Remove all China variant related information 1.0 2016-12-22 Section 1.5 - Updated “Related Documents” table Section 5.3.4 – Added Figure for SHDN_N power down timing Section 8.5.3 – Added clarification about VMMC Section 9.7 - Added GNSS characteristics
LE910Cx Hardware User Guide 1VV0301298 Rev. 1.04 - 2017-05-25 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 116 of 116 Revision Date Changes 1.01 2017-02-16 Adding Section 14: FCC/ISED Regulatory notices Changing Document History section from 14 to 15 1.02 2017-04-03 Section 14.1 – updated column “Band” to “Frequency Band” in Wireless notice table Section 8.4.1 - Added note regarding DTR 1.03 2017-04-23 Section 11.4 – Updated ESD values Updated Reference document table Section 8.3 - Updated Ethernet control interface information Section 8.5.2 – Added note related to I2C Section 2.6.2 – Updated table 4 with B25 information. Section 14.1 – Added LE910C1 NS Max antenna gain. Added LE910C1 NS FCC ID & IC number. 1.04 2017-05-25 Section 14.1 – Added Labelling Requirements for the Host device

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