Telit Communications S p A LE70FH FHSS and DTS Module User Manual 1VV0301106 xE70 915 RF module User Guide r3

Telit Communications S.p.A. FHSS and DTS Module 1VV0301106 xE70 915 RF module User Guide r3

User Manual

xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 2 of 34 APPLICABILITY TABLE PRODUCT LE70-915
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 3 of 34 SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Notice While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein. The information in this document has been carefully checked and is believed to be entirely reliable. However, no responsibility is assumed for inaccuracies or omissions. Telit reserves the right to make changes to any products described herein and reserves the right to revise this document and to make changes from time to time in content hereof with no obligation to notify any person of revisions or changes. Telit does not assume any liability arising out of the application or use of any product, software, or circuit described herein; neither does it convey license under its patent rights or the rights of others. It is possible that this publication may contain references to, or information about Telit products (machines and programs), programming, or services that are not announced in your country. Such references or information must not be construed to mean that Telit intends to announce such Telit products, programming, or services in your country. Copyrights This instruction manual and the Telit products described in this instruction manual may be, include or describe copyrighted Telit material, such as computer programs stored in semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit and its licensors certain exclusive rights for copyrighted material, including the exclusive right to copy, reproduce in any form, distribute and make derivative works of the copyrighted material. Accordingly, any copyrighted material of Telit and its licensors contained herein or in the Telit products described in this instruction manual may not be copied, reproduced, distributed, merged or modified in any manner without the express written permission of Telit. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit, as arises by operation of law in the sale of a product. Computer Software Copyrights The Telit and 3rd Party supplied Software (SW) products described in this instruction manual may include copyrighted Telit and other 3rd Party supplied computer programs stored in semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted computer programs, including the exclusive right to copy or reproduce in any form the copyrighted computer program. Accordingly, any copyrighted Telit or other 3rd Party supplied SW computer programs contained in the Telit products described in this instruction manual may not be copied (reverse engineered) or reproduced in any manner without the express written permission of Telit or the 3rd Party SW supplier. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit or other 3rd Party supplied SW, except for the normal non-exclusive, royalty free license to use that arises by operation of law in the sale of a product.
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 4 of 34 Usage and Disclosure Restrictions License Agreements The software described in this document is the property of Telit and its licensors. It is furnished by express license agreement only and may be used only in accordance with the terms of such an agreement. Copyrighted Materials Software and documentation are copyrighted materials. Making unauthorized copies is prohibited by law. No part of the software or documentation may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means, without prior written permission of Telit High Risk Materials Components, units, or third-party products used in the product described herein are NOT fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control equipment in the following hazardous environments requiring fail-safe controls: the operation of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic Control, Life Support, or Weapons Systems (High Risk Activities"). Telit and its supplier(s) specifically disclaim any expressed or implied warranty of fitness for such High Risk Activities. Trademarks TELIT and the Stylized T Logo are registered in Trademark Office. All other product or service names are the property of their respective owners. Copyright © Telit Communications S.p.A.
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 5 of 34 Contents 1. Introduction ................................................. 7 1.1. Scope ..................................................... 7 1.2. xE70-915 Product Description .............................. 7 1.3. Audience .................................................. 7 1.4. Contact Information, Support .............................. 7 1.5. Text Conventions .......................................... 8 1.6. Related Documents ......................................... 8 2. Regulatory Conformance Information ........................... 9 2.1. Operational Frequency Bands ............................... 9 2.1.1. 915 MHz band Requirements ................................... 9 2.2. Other Regulatory Requirements ............................. 9 3. General Features ............................................ 10 3.1. Main Functionalities ..................................... 10 3.2. Software ................................................. 10 3.3. Temperature Requirements ................................. 10 3.4. Mechanical Specifications ................................ 11 3.5. Mechanical dimensions .................................... 12 3.6. DC Specifications ........................................ 13 3.7. Radio Specifications ..................................... 14 3.8. Digital Specifications ................................... 15 3.9. Absolute Maximum Ratings ................................. 15 3.10. Ordering Information ................................... 15 4. Pin-out and Signals Description ............................. 17 4.1. Module Pin-out (Top View) ................................ 17 4.2. Module Pin-out Table ..................................... 18 4.3. Pin-out of the Module DIP ................................ 19 4.4. DIP – Module Pin-out Correspondence Table ................ 20 4.5. Signals Description ...................................... 21 5. Process Information ......................................... 22 5.1. Delivery ................................................. 22
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 6 of 34 5.2. Storage .................................................. 23 5.3. Soldering pad pattern .................................... 23 5.4. Solder paste ............................................. 24 5.5. Placement ................................................ 24 5.6. Soldering Profile (RoHS Process) ......................... 24 6. Board Mounting Recommendation ............................... 26 6.1. Electrical environment ................................... 26 6.2. Power supply decoupling on xE70-915 module ............... 26 6.3. RF layout considerations ................................. 27 6.4. Antenna connections on printed circuit boards ............ 28 6.5. xE70-868/915 Interfacing ................................. 29 7. Safety Recommendations ...................................... 32 8. Glossary .................................................... 33 9. Document History ............................................ 34
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 7 of 34 1. Introduction 1.1. Scope Scope of this document is to present the features and the application of the Telit xE70-915 radio modules. 1.2. xE70-915 Product Description The xE70-915 module is a multi-channel radio board, delivering up to 500mW in Frequency Hopping technology. It is compliant with the FCC Code of Federal Regulations [1] in the 915 MHz ISM unlicensed frequency band. It is delivered with preloaded protocol stack: “x” Product name Stack functionality L LE70-915 FH Star Network xE70-915 is pin-to-pin compatible with LE, NE and ME modules working at different frequencies, in particular xE50-868 and xE70-868. xE70-915 is also pin-to-pin compatible with Telit ZE Family (ZigBee 2007 and ZigBee PRO stack). 1.3. Audience This document is intended for developers using Telit xE70-915 radio modules. 1.4. Contact Information, Support For general contact, technical support, to report documentation errors and to order manuals, contact Telit Technical Support Center (TTSC) at: TS-SRD@telit.com TS-NORTHAMERICA@telit.com TS-LATINAMERICA@telit.com TS-APAC@telit.com Alternatively, use: http://www.telit.com/en/products/technical-support-center/contact.php For detailed information about where you can buy the Telit modules or for recommendations on accessories and components visit: http://www.telit.com
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 8 of 34 To register for product news and announcements or for product questions contact Telit Technical Support Center (TTSC). Our aim is to make this guide as helpful as possible. Keep us informed of your comments and suggestions for improvements. Telit appreciates feedback from the users of our information. 1.5. Text Conventions Danger – This information MUST be followed or catastrophic equipment failure or bodily injury may occur. Caution or Warning – Alerts the user to important points about integrating the module, if these points are not followed, the module and end user equipment may fail or malfunction. Tip or Information – Provides advice and suggestions that may be useful when integrating the module. All dates are in ISO 8601 format, i.e. YYYY-MM-DD. 1.6. Related Documents • [1] Code of Federal Regulations, Title 47, Part 15 • [2] Frequency Hopping Star Network Protocol Stack User Guide, 1vv0301059 • [3] SR Tool User Guide, 1vv0300899
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 9 of 34 2. Regulatory Conformance Information 2.1. Operational Frequency Bands The module radio transmitter operations must be compliant with some regulatory requirements in terms of frequency bands and emitted power, as detailed below. 2.1.1. 915 MHz Band Requirements The FCC part 15.247 regulates the frequency hopping RF devices, and gives the following requirements: Frequency Band Channel spacing Maximum radiated power Hopping cycle 902-928 MHz 25< “20dB BW” < 250kHz 1W <0.4s each 20s<0.4s each 20s, 50 hop. Freq min 250 < “20dB BW” < 500kHz 250mW <0.4s each 10s, 25 hop. Freq. min The main requirements of the FCC regulation are given in [1]. The xE70-915 module operates in the ISM band. This band is free to use but the module and the user must respect some limitations. Most of these restrictions are integrated in the conception of the module. 2.2. Other Regulatory Requirements The module complies with the European Directive 2002/95/EC concerning the Restrictive Usage of Hazardous Substances (RoHS).
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 10 of 34 3. General Features 3.1. Main Functionalities The xE70-915 module is a complete solution from serial interface to RF interface. The xE70-915 module has a digital part and a RF part. The radio link is a Half Duplex bi-directional link. The digital part has the following functionalities: • Communication interface • I/O management • Micro controller with embedded Telit Software Stack The RF part has the following functionalities: • Frequency synthesis • Front-end • Low noise reception • Power amplification • Packet handling 3.2. Software The xE70-915 module is provided pre-flashed with Telit in-house stack. Please refer to Protocol Stack User Guides [2] for detailed information. 3.3. Temperature Requirements Minimum Typical Maximum Unit Operating Temperature - 40 25 + 85 °C Relative humidity @ 25°C 20 75 % Storage Temperature - 40 25 + 85 °C
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 11 of 34 3.4. Mechanical Specifications Size Rectangular 25.8 x 15 mm Height 3 mm Weight 1.7 g PCB thickness 0.8 mm Cover Mounted above SMD components for EMI reduction and automatic placement • Dimensions : 25 x 14.2 x 2.2mm • Thickness : 200µm Components All SMD components, on one side of the PCB. Mounting Suitable for RoHS reflow process • SMD • LGA on the 4 external sides Number of pins 30
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 12 of 34 3.5. Mechanical dimensions
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 13 of 34 3.6. DC Specifications Measured on DIP interface with T = 25°C, under 50Ω impedance connected to RF port and default power register setting if nothing else stated. Max limits apply over the entire operating range, T=-40°C to +85°C, Vdd=2.3V to 3.6V and all channels. Characteristics xE70-915 Min. Typ. Max. Unit Power Supply (VDD) +2.3 - +3.6 V Consumption at 3.6V Maximum output power 500mW (+27dBm) 390 420 mA Reception 25 30 mA Stand-by (32.768 kHz On) 2 3 µA I/O low level GND - 0.2x VDD V I/O high level 0.8x VDD - VDD V
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 14 of 34 3.7. Radio Specifications Measured on DIP interface at T = 25°C, Vdd = 3.6V, 50 Ω impedance and default power register setting if nothing else stated. Frequency Band 902 MHz - 928 MHz RF data rate 9.6 kbps 19.2 kbps 38.4 kbps 57.6 kbps Number of channels 50 Channel spacing 250 kHz First Channel 915.375 MHz Transmission Duty cycle ≤ 10% Modulation Format 2GFSK Technology Frequency Hopping Table of channels 8 Dwell time 350 ms Deviation ± 7 kHz ± 10 kHz ± 20 kHz ± 30 kHz Frequency tolerance at 25°C ± 2.5 kHz RF Output Power at 3.6V +27dBm ± 1dB Reception Rx filter BW 27 kHz 44 kHz 81 kHz 122 kHz Sensitivity for PER < 0.8 (1) -114 dBm -113 dBm -110.5 dBm -108.5 dBm (1) 20 bytes Data Packet not including preamble length
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 15 of 34 3.8. Digital Specifications Function Characteristics µC • 128 kB + 8 kB in system programmable flash • 8 kB RAM • 2 kB E2PROM Serial link • RS232 TTL Full Duplex • 1200 to 115200 bps • 7 or 8 bits • Parity management • Flow control o Hardware (RTS/CTS) Embedded software functionality • Flexibility: o Pre flashed o Customization capability o Embedded bootloader for firmware download through serial link or over the air 3.9. Absolute Maximum Ratings Voltage applied to Vcc, VDD : -0.3V to +3.6V Voltage applied to “TTL” Input : -0.3V to VDD+0.3V 3.10. Ordering Information The following equipments can be ordered: • The SMD version (LE70-915) • The DIP interface version (LE70-915) • The Demo Kit (LE70-915) composed by n.2 EVK board, n.2 DIP interface boards, n.2 RF antennas, n.2 USB cables, n.2 batteries 9V. The versions below are considered standard and should be readily available. For other versions, please contact Telit. Please make sure to give the complete part number when ordering.
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 16 of 34 Equipment and Part Number SMD Version B LE70-915/SMD DIP Version B LE70-915/DIP Demo Case D LE70-915 DemKit
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 17 of 34 4. Pin-out and Signals Description 4.1. Module Pin-out (Top View) CAUTION: reserved pins must not be connected CAUTION: In case you want to use in the same application Telit ZE51 or ZE61 modules J9 and J8 should not be connected, since reserved on these modules (see foot notes on Pin-Out tables.
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 18 of 34 4.2. Module Pin-out Table Pin Pin name Pin type Signal level Function J30 GND Gnd RF Ground connection for external antenna J29 Ext_Antenna RF RF I/O connection to external antenna J28 GND Gnd RF Ground connection for external antenna J27 GND Gnd Ground J26 GND Gnd Ground J25 VDD Power Digital and Radio part power supply pin J24 CTS I TTL Clear To Send J23 RESET I TTL µC reset ( Active low with internal pull-up ) J22 RTS O TTL Request To Send J21 RXD I TTL RxD UART – Serial Data Reception J20 GND Gnd Ground J19 TXD O TTL TxD UART – Serial Data Transmission J18 STAND_BY I TTL Standby (Active high with internal pull-down: when set to 1 the module is put in stand-by) J17 GND Gnd Ground J16 PROG I TTL Signal for serial µC flashing (Active high with internal pull-down) J15 GND Gnd Ground J14 PDI_DATA I/O TTL Program and Debug Interface DATA J13 GND Gnd Ground J12 GND Gnd Ground J11 GND Gnd Ground J10 PDI_CLK I TTL Program and Debug Interface CLOCK J9 IO91 I/O TTL Digital I/O N°9 with interrupt Status TX/RX O TTL See reference document [2] Frequency Hopping Star Network Protocol Stack User Guide J8 IO8_AD_DA2 I/O analog A to D and D to A I/O N°8 with interrupt (Logic I/O capability) ACK TX O TTL See reference document [2] Frequency Hopping Star Network Protocol Stack User Guide J7 IO7_A I/O analog Analog Input N°7 (Logic I/O capability) J6 IO6_A I/O analog Analog Input N°6 (Logic I/O capability) J5 IO5_A I/O analog Analog Input N°5 (Logic I/O capability) J4 IO4_A I/O analog Analog Input N°4 (Logic I/O capability) J3 IO3_A I/O analog Analog Input N°3 (Logic I/O capability) 1, 2 In case you want to use in the same application Telit ZE51 or ZE61 modules J9 and J8 should not be connected, since reserved on these modules.
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 19 of 34 J2 IO2_P I/O TTL Logic I/O N°2 with interrupt RX LED O TTL See reference document [2] Frequency Hopping Star Network Protocol Stack User Guide J1 IO1_P I/O TTL Logic I/O N°1 with interrupt TX LED O TTL See reference document [2] Frequency Hopping Star Network Protocol Stack User Guide 4.3. Pin-out of the Module DIP
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 20 of 34 4.4. DIP – Module Pin-out Correspondence Table Pin-Out correspondence between xE70-915/DIP and xE70-915/SMD xE70-915/DIP xE70-915/SMD Comments Connector Pin Name Pin Name J1 1 2 GND GND 3 P1 J5 IO5_A 4 P2 J9 Status TX/RX Reserved Pin 5 P3 J2 RX LED 6 P4 J1 TX LED 7 P5 J4 IO4_A 8 P6 J3 IO3_A 9 GND GND 10 VDD J25 VDD J2 11 PROG J16 PROG 12 RTS J22 RTS 13 CTS J24 CTS 14 RESET J23 RESET 15 RxD J21 RxD 16 TxD J19 TxD 17 STDBY J18 STAND_BY 18 RTS J22 RTS 19 P7 J6 IO6_A 20 GND GND J4 1 J14 PDI_DATA J4 Connector for debugging and flashing 2 J10 PDI_CLK 3 J23 RESET 4 J25 VDD 5 GND J7 IO7_A Reserved Pin J8 IO8_AD_DA J3 SMA connector J29 Ext_Antenna (Unbalanced RF) A 50 Ohm coplanar wave guide and a 0 ohm resistor are used to connect J29 to J3
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 21 of 34 4.5. Signals Description Signals Description Reset External hardware reset of the radio module. Active on low state. TXD, RXD Serial link signals, format NRZ/TTL: TXD is for outgoing data. RXD is for incoming data. The ‘1’ is represented by a high state. CTS Incoming signal. Indicates whether the module can send serial data to user (Active, on low state) or not (inactive, on high state). RTS Outgoing signal. Indicates whether the user can transmit serial data (active, on low state) or not (inactive, on high state). IO I/O, configurable as input or as output. See reference document [2] for LE70-915. STANDBY Input signal which indicates to the module to switch to pre-selected low-power mode. See reference document [2] for LE70-915 TX LED Output signal set to VCC during radio transmission and set to GND the rest of the time RX LED Output signal set to VCC as soon as a radio frame is detected with correct synchronization word. The signal returns to GND as soon as the frame reception is finished ACK TX In Addressed Secured mode, this signal rises to VCC when an ACK hasn’t been received after frame transmission and repetition. This is the hardware version of “ERROR” serial message. It stays at VCC until next success addressed secured transmission STATUS TX/RX Output signal which indicates the status of the serial port. When serial port is transmitting, Status RX/TX signal goes VCC until the end of serial transmission. The signal stays to GND the rest of the time
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 22 of 34 5. Process Information 5.1. Delivery xE70-915 modules are delivered in plastic tray packaging, each tray including 50 units. The dimensions of the tray are the following: 329 mm x 176 mm x 5.6 mm. Each unit is placed in a 26.6 mm x 16 mm location. An empty tray weights 45 g and a loaded tray weights around 130 g.
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 23 of 34 5.2. Storage The optimal storage environment for xE70-915 modules should be dust free, dry and the temperature should be included between -40°C and +85°C. In case of a reflow soldering process, radio modules must be submitted to a drying bake at +125°C during 24 hours. The drying bake must be used prior to the reflow soldering process in order to prevent a popcorn effect. After being submitted to the drying bake, modules must be soldered on host boards within 168 hours. Also, it must be noted that due to some components, xE70-915 modules are ESD sensitive device. Therefore, ESD handling precautions should be carefully observed. 5.3. Soldering pad pattern The surface finished on the printed circuit board pads should be made of Nickel/Gold surface. The recommended soldering pad layout on the host board for the xE70-915 module is shown in the diagram below: All dimensions in mm Neither via-holes nor wires are allowed on the PCB upper layer in area occupied by the module.
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 24 of 34 5.4. Solder paste xE70-915 module is designed for reflow soldering process. For proper module assembly, solder paste must be printed on the target surface of the host board. The solder paste should be eutectic and made of 95.5% of SN, 4% of Ag and 0.5% of Cu. The recommended solder paste height is 180 µm. 5.5. Placement The xE70-915 module can be automatically placed on host boards by pick-and-place machines like any integrated circuit 5.6. Soldering Profile (RoHS Process) It must be noted that xE70-915 module should not be allowed to be hanging upside down during the reflow operation. This means that the module has to be assembled on the side of the printed circuit board that is soldered last. The recommendation for lead-free solder reflow in IPC/JEDEC J-STD-020D Standard should be followed.
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 25 of 34 The barcode label located on the module shield is able to withstand the reflow temperature. CAUTION - It must also be noted that if the host board is submitted to a wave soldering after the reflow operation, a solder mask must be used in order to protect the xE70-915 radio module’s metal shield from being in contact with the solder wave.
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 26 of 34 6. Board Mounting Recommendation 6.1. Electrical environment The best performances of the xE70-915 module are obtained in a “noise free” environment. Some basic recommendations must be followed: • Noisy electronic components (serial RS232, DC-DC Converter, Display, Ram, bus,...) must be placed as far as possible from the xE70-915 module. CAUTION – A particular attention must be put on power supply DC-DC converter, due to switching frequency that generates spurious into the receiver band. It can strongly decrease module performances. Therefore it is recommended to put a metallic shield covering DC conversion function. • Switching components circuits (especially RS-232/TTL interface circuit power supply) must be decoupled with a 100 µF low ESR tantalum capacitor. The decoupling capacitor must be placed as close as possible to the noisy chip. 6.2. Power supply decoupling on xE70-915 module The power supply of xE70-915 module must be nearby decoupled. A LC filter is strongly recommended in case of DC-DC conversion. It must be placed as close as possible to the radio module power supply pin, VDD. For example: Symbols Reference Value Manufacturer L1 LQH32CN1R0M33 1µH Murata C1 GRM31CF51A226ZE01 22µF Murata C2 Ceramic CMS 25V 100nF Multiple L1 must be chosen carefully with very low serial resistance (ESR) in order to limit voltage drop. Vdd C1 C2 Power Supply L1
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 27 of 34 6.3. RF layout considerations Basic recommendations must be followed to achieve a good RF layout: • It is recommended to fill all unused PCB area around the module with ground plane • The radio module ground pin must be connected to solid ground plane. • If the ground plane is on the bottom side, a via (metal hole) must be used in front of each ground pad. Especially J28 and J30 (RF Gnd) pins should be grounded via several holes to be located right next to the pins, thus minimizing inductance and preventing mismatch and losses.
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 28 of 34 6.4. Antenna connections on printed circuit boards Special care must be taken when connecting an antenna or a connector to the module. The RF output impedance is 50 ohms, so the strip between the pad and the antenna or connector must be 50 ohms following the tables below. Ground lines should be connected to the ground plane with as many vias as possible, but not too close to the signal line. PCB material PCB thickness H (mm) Coplanar line W (mm) Coplanar line G (mm) FR4 0.8 1 0.3 1.6 1 0.2 Table 1: Values for double face PCB with ground plane around and under coplanar wave guide (recommended) PCB material PCB thickness H (mm) Coplanar line W (mm) Coplanar line G (mm) FR4 0.8 1 0.22 1.6 1 0.23 Table 2: Values for simple face PCB with ground plane around coplanar wave guide (not recommended)
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 29 of 34 6.5. xE70-868/915 Interfacing Example of a full RS-232 connection between a PC or an Automat (PLC) and xE70-868/915
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 30 of 34 Example of minimum connections for communication between a PC and xE70-868/915
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 31 of 34 Example for sensor connection with xE70-868/915
xE70-915 RF Module User Guide 1VV0301106 rev.4 – 2015-06-16 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 45 of 50 7. Conformity assessment issuesFCC/IC Regulatory notices7.1. Modification statement Telit has not approved any changes or modifications to this device by the user. Any changes or modifications could void the user’s authority to operate the equipment. Telit n’approuve aucune modification apportée à l’appareil par l’utilisateur, quelle qu’en soit la nature. Tout changement ou modification peuvent annuler le droit d’utilisation de l’appareil par l’utilisateur. 7.2. Interference statement This device complies with Part 15 of the FCC Rules and Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. 7.3. Wireless notice This equipment complies with FCC and IC radiation exposure limits set forth for an uncontrolled environment. The antenna should be installed and operated with minimum distance of 20 cm between the radiator and your body. Antenna gain and type must be: Type Max Gain λ/2 dipole antenna 1.9 dBi This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
xE70-915 RF Module User Guide 1VV0301106 rev.4 – 2015-06-16 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 46 of 50 Cet appareil est conforme aux limites d'exposition aux rayonnements de l’IC pour un environnement non contrôlé. L'antenne doit être installée de façon à garder une distance minimale de 20 centimètres entre la source de rayonnements et votre corps. Gain et Type de l'antenne doit être ci-dessous: Type Gain maximum Antenne dipole λ/2 1.9 dBi L'émetteur ne doit pas être colocalisé ni fonctionner conjointement avec à autre antenne ou autre émetteur. 7.4. FCC Class B digital device notice This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. 7.5. Labelling Requirements for the Host device The host device shall be properly labelled to identify the modules within the host device. The certification label of the module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labelled to display the FCC ID and IC of the module, preceded by the words "Contains transmitter module", or the word "Contains", or similar wording expressing the same meaning, as follows: Contains FCC ID: RI7LE70FH Contains IC: 5131A-LE70FH L'appareil hôte doit être étiqueté comme il faut pour permettre l'identification des modules qui s'y trouvent. L'étiquette de certification du module donné doit être posée sur l'appareil hôte à un endroit bien en vue en tout temps. En l'absence d'étiquette, l'appareil hôte doit porter une étiquette donnant le FCC ID et le IC du module, précédé des mots « Contient un
xE70-915 RF Module User Guide 1VV0301106 rev.4 – 2015-06-16 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 47 of 50 module d'émission », du mot « Contient » ou d'une formulation similaire exprimant le même sens, comme suit : Contains FCC ID: RI7LE70FH Contains IC: 5131A-LE70FH 7.6. CAN ICES-3 (B) / NMB-3 (B) This Class B digital apparatus complies with Canadian ICES-003. Cet appareil numérique de classe B est conforme à la norme canadienne ICES-003.
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 32 of 34 8.Safety Recommendations READ CAREFULLY Be sure the use of this product is allowed in the country and in the environment required. The use of this product may be dangerous and has to be avoided in the following areas: •Where it can interfere with other electronic devices in environments such as hospitals,airports, aircrafts, etc. •Where there is risk of explosion such as gasoline stations, oil refineries, etc. It isresponsibility of the user to enforce the country regulation and the specific environment regulation. Do not disassemble the product; any mark of tampering will compromise the warranty validity. We recommend following the instructions of the hardware user guides for a correct wiring of the product. The product has to be supplied with a stabilized voltage source and the wiring has to be conforming to the security and fire prevention regulations. The product has to be handled with care, avoiding any contact with the pins because electrostatic discharges may damage the product itself. The system integrator is responsible of the functioning of the final product; therefore, care has to be taken to the external components of the module, as well as of any project or installation issue, because the risk of disturbing the GSM network or external devices or having impact on the security. Should there be any doubt, please refer to the technical documentation and the regulations in force. Every module has to be equipped with a proper antenna with specific characteristics. The antenna has to be installed with care in order to avoid any interference with other electronic devices and has to guarantee a minimum distance from the body (20 cm). In case of this requirement cannot be satisfied, the system integrator has to assess the final product against the SAR regulation. The FCC provides some Directives for the electronic equipments introduced on the market. All the relevant information’s are available on the FCC website: http://www.gpo.gov/fdsys/pkg/CFR-2010-title47-vol1/content-detail.html
xE70-915 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 33 of 34 9.GlossaryACP Adjacent Channel Power AFA Adaptive Frequency Agility bps Bits per second BW Bandwidth dB Decibel dBm Power level in decibel milliwatt (10 log (P/1mW)) E2PROM Electrically Erasable Programmable Read Only Memory E.R.P Effective radiated power ETSI European Telecommunication Standard Institute FCC FH GFSK Federal Communications Commission Frequency Hopping Gaussian Frequency Shift Keying I Input ISM Industrial, Scientific and Medical kB KiloByte kbps Kilobits per second kcps Kilochips per second kHz Kilo Hertz LBT Listen Before Talk LGA Land Grid Array MHz Mega Hertz mW milliwatt O Output PER Packet Error Rate ppm Parts per million RAM Random Access Memory RF Radio Frequency RoHS Restriction of Hazardous Substances RxD Receive Data SMD Surface Mounted Device SRD Short Range Device TxD Transmit Data UART Universal Asynchronous Receiver Transmitter µC microcontroller
¡Error! No se encuentra el origen de la referencia. 1VV0301106 rev.4 – 2015-06-16 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 50 of 50 10. Document History Revision Date Changes 0 2013-10-11 First Release 1 2014-04-02 Updated LE70-915 Demo Kit content 2 2014-07-21 Corrected partname for L1 on page 26; updated sensitivity and current consumption values 3 2015-03-04 Updated first channel frequency; added tolerance on maximum output power; picture dimension adjusted 4 2015-06-16 Added Conformity Assessment Issue section; added dimensions for inhibit area under the module; Digital Specification table corrected

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