Telit Communications S p A HE910 WWAN Module User Manual HE910 Hardware User Guide

Telit Communications S.p.A. WWAN Module HE910 Hardware User Guide

User Manual

HE910 Hardware User Guide 1vv03700925 Rev.9 07-02-2012
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 2 of 80 Applicability Table PRODUCT HE910 HE910-GA HE910-D
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 3 of 80 DISCLAIMER The information contained in this document is the proprietary information of Telit Communicationany disclosure to persons other than the officers, employees, agents or subcontractors of the owner or licensee of this document, without the prior written consent of Telit, is strictly prohibited. Telit makes every effort to ensure the quality of the information it makes available. Notwithstanding the foregoing, Telit does not make any warranty as to the information contained herein, and does not accept any liability for any injury, loss or damage of any kind incurred by use of or reliance upon the information. Telit disclaims any and all responsibility for the application of the devices characterized in this document, and notes that the application of the device must comply with the safety standards of the applicable country, and where applicable, with the relevant wiring rules. Telit reserves the right to make modifications, additions and deletions to this document due to typographical errors, inaccurate information, or improvements to programs and/or equipment at any time and without notice. Such changes will, nevertheless be incorporated into new editions of this application note. All rights reserved. © 2011, 2012 Telit Communications S.p.A.
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 4 of 80 Contents 1 INTRODUCTION ......................................................................................................................................................... 6 1.1 SCOPE ................................................................................................................................................................................ 6 1.2 AUDIENCE ........................................................................................................................................................................... 6 1.3 CONTACT INFORMATION, SUPPORT .......................................................................................................................................... 6 1.4 DOCUMENT ORGANIZATION ................................................................................................................................................... 7 1.5 TEXT CONVENTIONS .............................................................................................................................................................. 8 1.6 RELATED DOCUMENTS ........................................................................................................................................................... 8 1.7 DOCUMENT HISTORY ............................................................................................................................................................ 9 2 OVERVIEW .............................................................................................................................................................. 10 3 HE910 MODULE CONNECTIONS ............................................................................................................................... 11 3.1 PIN-OUT ......................................................................................................................................................................... 11 3.1.1 LGA Pads Layout (HE910 and HE910-GA) .............................................................................................................. 17 3.1.2 LGA Pads Layout (HE910-D) ................................................................................................................................... 18 4 HARDWARE COMMANDS ........................................................................................................................................ 19 4.1 TURNING ON THE HE910 ................................................................................................................................................... 19 4.2 TURNING OFF THE HE910 .................................................................................................................................................. 24 4.3 HE910 UNCONDITIONAL SHUTDOWN .................................................................................................................................... 27 5 POWER SUPPLY ....................................................................................................................................................... 30 5.1 POWER SUPPLY REQUIREMENTS ............................................................................................................................................ 30 5.2 POWER CONSUMPTION ....................................................................................................................................................... 31 5.3 GENERAL DESIGN RULES ...................................................................................................................................................... 32 5.3.1 Electrical Design Guidelines ................................................................................................................................... 32 5.3.2 Thermal Design Guidelines ..................................................................................................................................... 36 5.3.3 Power Supply PCB layout Guidelines ...................................................................................................................... 37 6 GSM/WCDMA ANTENNA......................................................................................................................................... 38 6.1 GSM/WCDMA ANTENNA REQUIREMENTS ............................................................................................................................ 38 6.2 GSM/WCDMA - PCB LINE GUIDELINES ................................................................................................................................ 40 6.3 GSM/WCDMA ANTENNA - INSTALLATION GUIDELINES ........................................................................................................... 41 6.4 ANTENNA DIVERSITY REQUIREMENTS ..................................................................................................................................... 42 6.5 GPS ANTENNA REQUIREMENTS (HE910 AND HE910-GA) ....................................................................................................... 43 6.5.1 Combined GPS Antenna ......................................................................................................................................... 43 6.5.2 Linear and Patch GPS Antenna ............................................................................................................................... 43 6.5.3 LNA and Front End Design Considerations ............................................................................................................. 43 6.5.4 GPS Antenna - PCB Line Guidelines ........................................................................................................................ 44 6.5.5 GPS Antenna - Installation Guidelines .................................................................................................................... 45 7 LOGIC LEVEL SPECIFICATIONS .................................................................................................................................. 46 7.1 RESET SIGNAL .................................................................................................................................................................... 47 8 USB PORT ................................................................................................................................................................ 48 8.1 USB 2.0 HS ...................................................................................................................................................................... 48 9 SPI PORT ................................................................................................................................................................. 49
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 5 of 80 9.1 SPI CONNECTIONS .............................................................................................................................................................. 50 10 SERIAL PORTS .......................................................................................................................................................... 51 10.1 MODEM SERIAL PORT 1 (USIF0) ................................................................................................................................... 52 10.2 MODEM SERIAL PORT 2 (USIF1) ................................................................................................................................... 54 10.3 RS232 LEVEL TRANSLATION ................................................................................................................................................ 55 11 AUDIO SECTION OVERVIEW .................................................................................................................................... 57 11.1 ELECTRICAL CHARACTERISTICS ............................................................................................................................................. 57 11.1.1 CODEC Examples .................................................................................................................................................. 57 12 GENERAL PURPOSE I/O ........................................................................................................................................... 58 12.1 GPIO LOGIC LEVELS .......................................................................................................................................................... 59 12.2 USING A GPIO PAD AS INPUT ........................................................................................................................................... 60 12.3 USING A GPIO PAD AS OUTPUT ........................................................................................................................................ 60 12.4 INDICATION OF NETWORK SERVICE AVAILABILITY ..................................................................................................................... 61 12.5 RTC BYPASS OUT ............................................................................................................................................................. 62 12.6 EXTERNAL SIM HOLDER IMPLEMENTATION ........................................................................................................................... 62 12.7 VAUX POWER OUTPUT ..................................................................................................................................................... 62 13 MOUNTING THE HE910 ON THE APPLICATION ........................................................................................................ 63 13.1 GENERAL ........................................................................................................................................................................ 63 13.2 MODULE FINISHING & DIMENSIONS ..................................................................................................................................... 63 13.3 RECOMMENDED FOOT PRINT FOR THE APPLICATION ................................................................................................................. 64 13.4 STENCIL .......................................................................................................................................................................... 65 13.5 PCB PAD DESIGN .............................................................................................................................................................. 65 13.6 RECOMMENDATIONS FOR PCB PAD DIMENSIONS (MM): .......................................................................................................... 66 13.7 SOLDER PASTE .................................................................................................................................................................. 68 13.7.1 HE910 Solder reflow ............................................................................................................................................. 68 14 PACKING SYSTEM .................................................................................................................................................... 70 14.1 MOISTURE SENSITIVITY ...................................................................................................................................................... 72 15 SAFETY RECOMMANDATIONS ................................................................................................................................. 73 16 CONFORMITY ASSESSMENT ISSUES ......................................................................................................................... 75 16.1 1999/5/EC DIRECTIVE ..................................................................................................................................................... 75 16.2 FCC/IC REGULATORY NOTICES ............................................................................................................................................ 79
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 6 of 80 1 Introduction 1.1 Scope The aim of this document is the description of some hardware solutions useful for developing a product with the Telit HE910 module. 1.2 Audience This document is intended for Telit customers, who are integrators, about to implement their applications using our HE910 modules. 1.3 Contact Information, Support For general contact, technical support, to report documentation errors and to order Center (TTSC) at: TS-EMEA@telit.com TS-NORTHAMERICA@telit.com TS-LATINAMERICA@telit.com TS-APAC@telit.com Alternatively, use: http://www.telit.com/en/products/technical-support-center/contact.php For detailed information about where you can buy the Telit modules or for recommendations on accessories and components visit: http://www.telit.com To register for product news and announcements or for product questions contact ical Support Center (TTSC). Our aim is to make this guide as helpful as possible. Keep us informed of your comments and suggestions for improvements. Telit appreciates feedback from the users of our information.
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 7 of 80 1.4 Document Organization This document contains the following chapters: provides a scope for this document, target audience, contact and support information, and text conventions. provides an overview of the document. Chapter3 HE910 Module Connections Chapter 4 How to operate on the module via hardware. Chapter 5 Power supply requirements and general design rules. Chapter 6 The antenna connection and board layout design are the most important parts in the full product design. Chapter 7 Specific values adopted in the implementation of logic levels for this module. Chapter 8 The USB port on the Telit HE910 is the core of the interface between the module and OEM hardware PI port Refers to the SPI port of the Telit HE910 Chapter 10 Refers to the serial ports of the Telit HE910 Chapter 11 Refers to the audio blocks of the Base Band Chip of the HE910 Telit Modules. Chapter 12 How the general purpose I/O pads can be configured. Chapter 13 HE910 Mechanical dimensions and recomm Chapter 14 Conformity Assessment Issues Information related to the Conformity Assessments.
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 8 of 80 1.5 Text Conventions Danger This information MUST be followed or catastrophic equipment failure or bodily injury may occur. Caution or Warning Alerts the user to important points about integrating the module, if these points are not followed, the module and end user equipment may fail or malfunction. Tip or Information Provides advice and suggestions that may be useful when integrating the module. All dates are in ISO 8601 format, i.e. YYYY-MM-DD. 1.6 Related Documents HE910 Digital Voice Interface Application Note 80000NT10050A HE910 SPI Port Application Note 80000NT10053A HE910 Product description 80378ST10085a SIM Holder Design Guides 80000NT10001a AT Commands Reference Guide 80378ST10091A Telit EVK2 User Guide 1vv0300704
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 9 of 80 1.7 Document History RReevviissiioonn DDaattee CChhaannggeess ISSUE#0 2011-03-31 Preliminary Version ISSUE#1 2011-05-19 Updated pinout on UART1 ISSUE#2 2011-05-25 Update chapter 13 ISSUE#3 2011-07-25 Added DVI app note references; chapter 4.1 ISSUE#4 2011-07-29 Updated audio, on_off/reset and digital sections ISSUE#5 2011-10-18 Added STAT_LED info, Updated SPI pinout ISSUE#6 2011-12-22 - Pads A8, A9, D14, A14 now reserved Power supply extended to 3.3 V - - USIF0 USIF1 names added to Main and AUX serial ports - Updated IO logic levels - - IO levels selection 1.8/1.2 removed (now only 1.8) ISSUE#7 2012-01-16 Added HE910-GA and D; added Conformity assessment chapter ISSUE#8 2012-02-03 Chapter 5.1 updated ISSUE#9 2012-02-07 Chapter 4.2 updated
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 10 of 80 2 Overview The aim of this document is the description of some hardware solutions useful for developing a product with the Telit HE910 module. In this document all the basic functions of a mobile phone will be taken into account; for each one of them a proper hardware solution will be suggested and eventually the wrong solutions and common errors to be avoided will be evidenced. Obviously this document cannot embrace the whole hardware solutions and products that may be designed. The wrong solutions to be avoided shall be considered as mandatory, while the suggested hardware configurations shall not be considered mandatory, instead the information given shall be used as a guide and a starting point for properly developing your product with the Telit HE910 module. For further hardware details that may not be explained in this document refer to the Telit HE910 Product Description document where all the hardware information is reported. NOTICE: (EN) The integration of the GSM/GPRS/WCDMA HE910 cellular module within user application shall be done according to the design rules described in this manual. /WCDMA HE910 azioni progettuali descritte in questo manuale. (DE) Die Integration des HE910 GSM/GPRS/WCDMA Mobilfunk-Moduls in ein Gerät muß gemäß der in diesem Dokument beschriebenen Kunstruktionsregeln erfolgen. (SL) Integracija GSM/GPRS/WCDMA HE910 modula v uporabniški aplikaciji bo morala upoštevati projektna navodila, opisana v tem priročniku. (SP) La utilización del modulo GSM/GPRS/WCDMA HE910 debe ser conforme a los usos para los cuales ha sido deseñado descritos en este manual del usuario. du module cellulaire GSM/GPRS/WCDMA HE910 (HE) The information presented in this document is believed to be accurate and reliable. However, no responsibility is assumed by Telit Communications S.p.A. for its use, nor any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent rights of Telit Communications S.p.A. other than for circuitry embodied in Telit products. This document is subject to change without notice. HE910
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 11 of 80 3 HE910 module connections 3.1 PIN-OUT PAD Signal I/O Function Type COMMENT USB HS 2.0 COMMUNICATION PORT B15 USB_D+ I/O USB differential Data (+) C15 USB_D- I/O USB differential Data (-) A13 VUSB I Power sense for the internal USB transceiver. Asynchronous Serial Port (USIF0) - Prog. / Data + HW Flow Control N15 C103/TXD I Serial data input from DTE CMOS 1.8V M15 C104/RXD O Serial data output to DTE CMOS 1.8V M14 C108/DTR I Input for (DTR) from DTE CMOS 1.8V L14 C105/RTS I Input for Request to send signal (RTS) from DTE CMOS 1.8V P15 C106/CTS O Output for Clear to Send signal (CTS) to DTE CMOS 1.8V N14 C109/DCD O Output for (DCD) to DTE CMOS 1.8V P14 C107/DSR O Output for (DSR) to DTE CMOS 1.8V R14 C125/RING O Output for Ring (RI) to DTE CMOS 1.8V Asynchronous Auxiliary Serial Port (USIF1) D15 TX_AUX O Auxiliary UART (TX Data to DTE) CMOS 1.8V E15 RX_AUX I Auxiliary UART (RX Data from DTE) CMOS 1.8V D13 VDD_IO1 I IO1 SUPPLY Input This pin has to be connected to E13 E13 VIO1_1V8 O VIO1 Supply output (1.8V) To be used only to supply VDD_IO1 SIM card interface A6 SIMCLK O External SIM signal – Clock 1.8 / 3V A7 SIMRST O External SIM signal – Reset 1.8 / 3V A5 SIMIO I/O External SIM signal – Data I/O 1.8 / 3V A4 SIMIN I External SIM signal – Presence (active low) CMOS 1.8 A3 SIMVCC - External SIM signal – Power supply for the SIM 1.8 / 3V Digital Voice Interface (DVI) (See NOTE 1) B9 DVI_WA0 I/O Digital Audio Interface (WA0) CMOS 1.8V B6 DVI_RX I/O Digital Audio Interface (RX) CMOS 1.8V B7 DVI_TX I/O Digital Audio Interface (TX) CMOS 1.8V B8 DVI_CLK I/O Digital Audio Interface (CLK) CMOS 1.8V SPI D15 SPI_MOSI I SPI MOSI CMOS 1.8V Shared with TX_AUX
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 12 of 80 E15 SPI_MISO O SPI_MISO CMOS 1.8V Shared with RX_AUX F15 SPI_CLK I SPI Clock CMOS 1.8V H15 SPI_MRDY I SPI_MRDY CMOS 1.8V J15 SPI_SRDY O SPI_SRDY CMOS 1.8V DIGITAL IO C8 GPIO_01 I/O GPIO_01 /STAT LED CMOS 1.8V Alternate Function STAT LED C9 GPIO_02 I/O GPIO_02 CMOS 1.8V C10 GPIO_03 I/O GPIO_03 CMOS 1.8V C11 GPIO_04 I/O GPIO_04 CMOS 1.8V B14 GPIO_05 I/O GPIO_05 CMOS 1.8V C12 GPIO_06 I/O GPIO_06 CMOS 1.8V C13 GPIO_07 I/O GPIO_07 CMOS 1.8V K15 GPIO_08 I/O GPIO_08 CMOS 1.8V L15 GPIO_09 I/O GPIO_09 CMOS 1.8V G15 GPIO_10 I/O GPIO_10 CMOS 1.8V RF SECTION K1 ANTENNA I/O GSM/EDGE/UMTS Antenna (50 ohm) RF F1 ANT_DIV I Antenna Diversity Input (50 ohm) RF GPS SECTION (see NOTE1) R9 ANT_GPS I GPS Antenna (50 ohm) RF R7 GPS_LNA_EN O Output enable for External LNA supply CMOS 1.8V Miscellaneous Functions R13 RESET* I Reset input CMOS 1.8V Active low R12 ON_OFF* I Input command for power ON CMOS 1.8V Active low C14 VRTC I VRTC Backup capacitor Power backup for the embedded RTC supply R11 VAUX/PWRMON O Supply Output for external accessories / Power ON Monitor 1.8V Power Supply M1 VBATT - Main power supply (Baseband) Power M2 VBATT - Main power supply (Baseband) Power N1 VBATT_PA - Main power supply (Radio PA) Power N2 VBATT_PA - Main power supply (Radio PA) Power P1 VBATT_PA - Main power supply (Radio PA) Power P2 VBATT_PA - Main power supply (Radio PA) Power E1 GND - Ground Power G1 GND - Ground Power H1 GND - Ground Power J1 GND - Ground Power L1 GND - Ground Power
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 13 of 80 A2 GND - Ground Power E2 GND - Ground Power F2 GND - Ground Power G2 GND - Ground Power H2 GND - Ground Power J2 GND - Ground Power K2 GND - Ground Power L2 GND - Ground Power R2 GND - Ground Power M3 GND - Ground Power N3 GND - Ground Power P3 GND - Ground Power R3 GND - Ground Power D4 GND - Ground Power M4 GND - Ground Power N4 GND - Ground Power P4 GND - Ground Power R4 GND - Ground Power N5 GND - Ground Power P5 GND - Ground Power R5 GND - Ground Power N6 GND - Ground Power P6 GND - Ground Power R6 GND - Ground Power P8 GND - Ground Power R8 GND - Ground Power P9 GND - Ground Power P10 GND - Ground Power R10 GND - Ground Power M12 GND - Ground Power B13 GND - Ground Power P13 GND - Ground Power E14 GND - Ground Power RESERVED C1 RESERVED - RESERVED D1 RESERVED - RESERVED B2 RESERVED - RESERVED C2 RESERVED - RESERVED D2 RESERVED - RESERVED B3 RESERVED - RESERVED C3 RESERVED - RESERVED
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 14 of 80 D3 RESERVED - RESERVED E3 RESERVED - RESERVED F3 RESERVED - RESERVED G3 RESERVED - RESERVED H3 RESERVED - RESERVED J3 RESERVED - RESERVED K3 RESERVED - RESERVED L3 RESERVED - RESERVED B4 RESERVED - RESERVED C4 RESERVED - RESERVED B5 RESERVED - RESERVED C5 RESERVED - RESERVED C6 RESERVED - RESERVED C7 RESERVED - RESERVED N7 RESERVED - RESERVED P7 RESERVED - RESERVED N8 RESERVED - RESERVED N9 RESERVED - RESERVED A10 RESERVED - RESERVED N10 RESERVED - RESERVED N11 RESERVED - RESERVED P11 RESERVED - RESERVED B12 RESERVED - RESERVED D12 RESERVED - RESERVED N12 RESERVED - RESERVED P12 RESERVED - RESERVED F14 RESERVED - RESERVED G14 RESERVED - RESERVED H14 RESERVED - RESERVED J14 RESERVED - RESERVED K14 RESERVED - RESERVED N13 RESERVED - RESERVED L13 RESERVED - RESERVED J13 RESERVED - RESERVED M13 RESERVED - RESERVED K13 RESERVED - RESERVED H13 RESERVED - RESERVED G13 RESERVED - RESERVED F13 RESERVED - RESERVED A11 RESERVED - RESERVED A12 RESERVED - RESERVED B1 RESERVED - RESERVED
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 15 of 80 B11 RESERVED - RESERVED B10 RESERVED - RESERVED A9 RESERVED - RESERVED A8 RESERVED - RESERVED D14 RESERVED - RESERVED A14 RESERVED - RESERVED WARNING: Reserved pins must not be connected. NOTE1: The Audio and GPS functions are not supported on HE910-D The following PADS have to be considered as RESERVED: B6, B7, B8, B9, R7, R9
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 16 of 80 NOTE: If not used, almost all pins should be left disconnected. The only exceptions are the following pins: RTS pin should be connected to the GND (on the module side) if flow control is not used. The above pins are also necessary to debug the application when the module is assembled on it. PAD signal M1,M2,N1,N2,P1,P2 VBATT & VBATT_PA E1,G1,H1,J1,L1,A2,E2,F2,G2,H2, J2,K2,L2,R2,M3,N3,P3,R3,D4,M4, N4,P4,R4,N5,P5,R5,N6,P6,R6,P8, R8,P9,P10,R10,M12,B13,P13,E14 GND R12 ON/OFF* R13 RESET* B15 USB_D+ C15 USB_D- A13 VUSB N15 C103/TXD M15 C104/RXD L14 C105/RTS P15 C106/CTS D15 TXD_AUX E15 RXD_AUX D13 VDD_IO1 E13 VIO1_1V8
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 17 of 80 3.1.1 LGA Pads Layout (HE910 and HE910-GA) TOP VIEW A B C D E F G H J K L M N P R 1 RES RES RES GND ANT_DIV GND GND GND ANT GND VBATT VBATT_PA VBATT_PA 2 GND RES RES RES GND GND GND GND GND GND GND VBATT VBATT_PA VBATT_PA GND 3 SIMVCC RES RES RES RES RES RES RES RES RES RES GND GND GND GND 4 SIMIN RES RES GND GND GND GND GND 5 SIMIO RES RES GND GND GND 6 SIMCLK DVI_RX RES GND GND GND 7 SIMRST DVI_TX RES RES RES GPS_LNA_EN 8 RES DVI_CLK GPIO_01 RES GND GND 9 RES DVI_WA0 GPIO_02 RES GND ANT_GPS 10 RES RES GPIO_03 RES GND GND 11 RES RES GPIO_04 RES RES VAUX/PWRMON 12 RES RES GPIO_06 RES GND RES RES ON_OFF* 13 VUSB GND GPIO_07 VDD_IO1 VIO1_1V8 RES RES RES RES RES RES RES RES GND RESET* 14 RES GPIO_05 VRTC RES GND RES RES RES RES RES C105/RTS C108/DTR C109/DCD C107/DSR C125/RING 15 USB_D+ USB_D- TX AUX RX AUX SPI_CLK GPIO_10 SPI_MRDY SPI_SRDY GPIO_08 GPIO_09 C104/RXD C103/TXD C106/CTS NOTE: The pin defined as RES has to be considered RESERVED and not connected on any pin in the application.
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 18 of 80 3.1.2 LGA Pads Layout (HE910-D) TOP VIEW A B C D E F G H J K L M N P R 1 RES RES RES GND ANT_DIV GND GND GND ANT GND VBATT VBATT_PA VBATT_PA 2 GND RES RES RES GND GND GND GND GND GND GND VBATT VBATT_PA VBATT_PA GND 3 SIMVCC RES RES RES RES RES RES RES RES RES RES GND GND GND GND 4 SIMIN RES RES GND GND GND GND GND 5 SIMIO RES RES GND GND GND 6 SIMCLK RES RES GND GND GND 7 SIMRST RES RES RES RES RES 8 RES RES GPIO_01 RES GND GND 9 RES RES GPIO_02 RES GND RES 10 RES RES GPIO_03 RES GND GND 11 RES RES GPIO_04 RES RES VAUX/PWRMON 12 RES RES GPIO_06 RES GND RES RES ON_OFF* 13 VUSB GND GPIO_07 VDD_IO1 VIO1_1V8 RES RES RES RES RES RES RES RES GND RESET* 14 RES GPIO_05 VRTC RES GND RES RES RES RES RES C105/RTS C108/DTR C109/DCD C107/DSR C125/RING 15 USB_D+ USB_D- TX AUX RX AUX SPI_CLK GPIO_10 SPI_MRDY SPI_SRDY GPIO_08 GPIO_09 C104/RXD C103/TXD C106/CTS NOTE: The pin defined as RES has to be considered RESERVED and not connected on any pin in the application.
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 19 of 80 4 Hardware Commands 4.1 Turning ON the HE910 To turn on the HE910 the pad ON_OFF* must be tied low for at least 5 seconds and then released. The maximum current that can be drained from the ON# pad is 0,1 mA. A simple circuit to do it is: NOTE: Don't use any pull up resistor on the ON_OFF* line, it is internally pulled up. Using pull up resistor may bring to latch up problems on the HE910 power regulator and improper power on/off of the module. The line ON_OFF* must be connected only in open collector or open drain configuration.
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 20 of 80 NOTE: In this document all the lines that are inverted, hence have active low signals are labelled with a name that ends with or with a bar over the name. TIP: To check if the device has powered on, the hardware line PWRMON should be monitored. NOTE: It is mandatory to avoid sending data to the serial ports during the first 200ms of the module start-up.
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 21 of 80 A flow chart showing the proper turn on procedure is displayed below: NOTE: In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the HE910 when the module is powered off or during an ON/OFF transition. Modem ON Proc. Y Y HW unconditional SHUTDOWN AT init sequence. Start AT CMD. N PWMON = ON? PWMON = ON? AT answer in 1Sec ? N Y N Delay 1s DELAY= 300mSec ON_OFF = LOW Delay = 5 Sec ON_OFF = HIGH Enter AT<CR>
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 22 of 80 A flow chart showing the AT command managing procedure is displayed below: AT answer in 1Sec ? Y N Start AT CMD. DELAY= 300mSec Enter AT<CR> AT init sequence. Modem ON Proc. HW unconditional SHUTDOWN
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 23 of 80 For example: 1- Let's assume you need to drive the ON# pad with a totem pole output of a +3/5 V microcontroller (uP_OUT1): 2- Let's assume you need to drive the ON# pad directly with an ON/OFF button:
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 24 of 80 4.2 Turning OFF the HE910 Turning off of the device can be done in two ways: via AT command (see HE910 Software User Guide, AT#SHDN) by tying low pin ON_OFF* Either ways, the device issues a detach request to network informing that the device will not be reachable any more. To turn OFF the HE910 the pad ON_OFF* must be tied low for at least 2 seconds and then released.
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 25 of 80 The following flow chart shows the proper turnoff procedure: Modem OFF Proc. N Y HW unconditional SHUTDOWN N PWMON = ON? PWMON = ON? Y Delay 15s ON_OFF = LOW Delay = 2 Sec ON_OFF = HIGH Modem ON Proc. PWMON = ON? N Y
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 26 of 80 TIP: To check if the device has been powered off, the hardware line PWRMON must be monitored. The device is powered off when PWRMON goes low. NOTE: In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the HE910 when the module is powered off or during an ON/OFF transition.
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 27 of 80 4.3 HE910 Unconditional Shutdown The Unconditional Shutdown of the module could be activated using the RESET* line (pad R13). WARNING: The hardware unconditional Shutdown must not be used during normal operation of the device since it does not detach the device from the network. It shall be kept as an emergency exit procedure. To unconditionally shutdown the HE910, the pad RESET* must be tied low for at least 200 milliseconds and then released. NOTE: Do not use any pull up resistor on the RESET* line nor any totem pole digital output. Using pull up resistor may bring to latch up problems on the HE910 power regulator and improper functioning of the module. The line RESET* must be connected only in open collector configuration. The RESET* is generating an unconditional shutdown of the module without an automatic restart. TIP: The unconditional hardware shutdown must always be implemented on the boards and should be used only as an emergency exit procedure.
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 28 of 80 A typical circuit is the following: For example: 1- Let us assume you need to drive the RESET* pad with a totem pole output of a +3/5 V microcontroller (uP_OUT2): NOTE: In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the HE910 when the module is powered off or during an ON/OFF transition.
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 29 of 80 In the following flow chart is detailed the proper restart procedure: HW unconditional SHUTDOWN Reset# = LOW Delay 200ms Reset# = HIGH PWRMON = ON Delay 1s Modem ON Proc. N Y Disconnect PWR supply Modem ON Proc.
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 30 of 80 5 Power Supply The power supply circuitry and board layout are a very important part in the full product design and they strongly reflect on the product overall performances, hence read carefully the requirements and the guidelines that will follow for a proper design. 5.1 Power Supply Requirements The external power supply must be connected to VBATT & VBATT_PA signals and must fulfil the following requirements: POWER SUPPLY Nominal Supply Voltage 3.8 V Normal Operating Voltage Range 3.40 V÷ 4.20 V Extended Operating Voltage Range 3.20 V÷ 4.20 V NOTE: The Operating Voltage Range MUST never be exceeded; care must be taken in order to fulfil min/max voltage requirement. NOTE: Overshoot voltage (regarding MAX Extended Operating Voltage) and drop in voltage (regarding MIN Extended Operating Voltage) MUST never be exceeded; ely assumption and application of the HW User guide suggestions.
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 31 of 80 5.2 Power Consumption The HE910 power consumptions are described in the following table (Preliminary values): HE910 Mode Average (mA) Mode description Stand by mode (WCDMA) Stand By 3G 1.2* Disabled TX and RX; module is not registered on the network; DRX7 IDLE mode (GSM) Stand By 2G 1.1* Disabled TX and RX; module is not registered on the network, DRX5 Operative mode (WCDMA) WCDMA Voice 538 WCDMA voice call (23.5dBm; High Band) HSDPA 557 HSDPA data call (23.5dBm; High Band, CAT10) Operative mode (GSM) CSD TX and RX mode GSM VOICE CALL GSM900 CSD PL5 209 DCS1800 CSD PL0 176 * depending on network configuration and not under module control. The GSM system is made in a way that the RF transmission is not continuous, else it is packed into bursts at a base frequency of about 216 Hz, and the relative current peaks can be as high as about 2A. Therefore the power supply has to be designed in order to withstand with these current peaks without big voltage drops; this means that both the electrical design and the board layout must be designed for this current flow. If the layout of the PCB is not well designed a strong noise floor is generated on the ground and the supply; this will reflect on all the audio paths producing an audible annoying noise at 216 Hz; if the voltage drop during the peak current absorption is too much, then the device may even shutdown as a consequence of the supply voltage drop. NOTE: The electrical design for the Power supply should be made ensuring it will be capable of a peak current output of at least 2 A.
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 32 of 80 5.3 General Design Rules The principal guidelines for the Power Supply Design embrace three different design steps: the electrical design the thermal design the PCB layout. 5.3.1 Electrical Design Guidelines The electrical design of the power supply depends strongly from the power source where this power is drained. We will distinguish them into three categories: +5V input (typically PC internal regulator output) +12V input (typically automotive) Battery 5.3.1.1 + 5V input Source Power Supply Design Guidelines The desired output for the power supply is 3.8V, hence there's not a big difference between the input source and the desired output and a linear regulator can be used. A switching power supply will not be suited because of the low drop out requirements. When using a linear regulator, a proper heat sink shall be provided in order to dissipate the power generated. A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current absorption peaks close to the HE910, a 100μF tantalum capacitor is usually suited. Make sure the low ESR capacitor on the power supply output (usually a tantalum one) is rated at least 10V. A protection diode should be inserted close to the power input, in order to save the HE910 from power polarity inversion.
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 33 of 80 An example of linear regulator with 5V input is: 5.3.1.2 + 12V input Source Power Supply Design Guidelines The desired output for the power supply is 3.8V, hence due to the big difference between the input source and the desired output, a linear regulator is not suited and shall not be used. A switching power supply will be preferable because of its better efficiency especially with the 2A peak current load represented by the HE910. When using a switching regulator, a 500kHz or more switching frequency regulator is preferable because of its smaller inductor size and its faster transient response. This allows the regulator to respond quickly to the current peaks absorption. In any case the frequency and Switching design selection is related to the application to be developed due to the fact the switching frequency could also generate EMC interferences. For car PB battery the input voltage can rise up to 15,8V and this should be kept in mind when choosing components: all components in the power supply must withstand this voltage. A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current absorption peaks, a 100μF tantalum capacitor is usually suited. Make sure the low ESR capacitor on the power supply output (usually a tantalum one) is rated at least 10V. For Car applications a spike protection diode should be inserted close to the power input, in order to clean the supply from spikes.
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 34 of 80 A protection diode should be inserted close to the power input, in order to save the HE910 from power polarity inversion. This can be the same diode as for spike protection. An example of switching regulator with 12V input is in the below schematic:
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 35 of 80 5.3.1.3 Battery Source Power Supply Design Guidelines The desired nominal output for the power supply is 3.8V and the maximum voltage allowed is 4.2V, hence a single 3.7V Li-Ion cell battery type is suited for supplying the power to the Telit HE910 module. WARNING: The three cells Ni/Cd or Ni/MH 3,6 V Nom. battery types or 4V PB types MUST NOT BE USED DIRECTLY since their maximum voltage can rise over the absolute maximum voltage for the HE910 and damage it. NOTE: DON'T USE any Ni-Cd, Ni-MH, and Pb battery types directly connected with HE910. Their use can lead to overvoltage on the HE910 and damage it. USE ONLY Li-Ion battery types. A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current absorption peaks, a 100μF tantalum capacitor is usually suited. Make sure the low ESR capacitor (usually a tantalum one) is rated at least 10V. A protection diode should be inserted close to the power input, in order to save the HE910 from power polarity inversion. Otherwise the battery connector should be done in a way to avoid polarity inversions when connecting the battery. The battery capacity must be at least 500mAh in order to withstand the current peaks of 2A; the suggested capacity is from 500mAh to 1000mAh.
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 36 of 80 5.3.2 Thermal Design Guidelines The thermal design for the power supply heat sink should be done with the following specifications: Average current consumption during HSDPA transmission @PWR level max : 600 mA Average current during idle: 1.5 mA NOTE: The average consumption during transmissions depends on the power level at which the device is requested to transmit by the network. The average current consumption hence varies significantly. Considering the very low current during idle, especially if Power Saving function is enabled, it is possible to consider from the thermal point of view that the device absorbs current significantly only during calls. If we assume that the device stays into transmission for short periods of time (let's say few minutes) and then remains for a quite long time in idle (let's say one hour), then the power supply has always the time to cool down between the calls and the heat sink could be smaller than the calculated one for 600mA maximum RMS current, or even could be the simple chip package (no heat sink). Moreover in the average network conditions the device is requested to transmit at a lower power level than the maximum and hence the current consumption will be less than the 600mA, being usually around 150mA. For these reasons the thermal design is rarely a concern and the simple ground plane where the power supply chip is placed can be enough to ensure a good thermal condition and avoid overheating. For the heat generated by the HE910, you can consider it to be during transmission 1W max during CSD/VOICE calls and 2W max during class10 GPRS upload. This generated heat will be mostly conducted to the ground plane under the HE910; you must ensure that your application can dissipate it.
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 37 of 80 5.3.3 Power Supply PCB layout Guidelines As seen on the electrical design guidelines the power supply shall have a low ESR capacitor on the output to cut the current peaks and a protection diode on the input to protect the supply from spikes and polarity inversion. The placement of these components is crucial for the correct working of the circuitry. A misplaced component can be useless or can even decrease the power supply performances. The Bypass low ESR capacitor must be placed close to the Telit HE910 power input pads or in the case the power supply is a switching type it can be placed close to the inductor to cut the ripple provided the PCB trace from the capacitor to the HE910 is wide enough to ensure a dropless connection even during the 2A current peaks. The protection diode must be placed close to the input connector where the power source is drained. The PCB traces from the input connector to the power regulator IC must be wide enough to ensure no voltage drops occur when the 2A current peaks are absorbed. Note that this is not made in order to save power loss but especially to avoid the voltage drops on the power line at the current peaks frequency of 216 Hz that will reflect on all the components connected to that supply, introducing the noise floor at the burst base frequency. For this reason while a voltage drop of 300-400 mV may be acceptable from the power loss point of view, the same voltage drop may not be acceptable from the noise point of view. If your application doesn't have audio interface but only uses the data feature of the Telit HE910, then this noise is not so disturbing and power supply layout design can be more forgiving. The PCB traces to the HE910 and the Bypass capacitor must be wide enough to ensure no significant voltage drops occur when the 2A current peaks are absorbed. This is for the same reason as previous point. Try to keep this trace as short as possible. The PCB traces connecting the Switching output to the inductor and the switching diode must be kept as short as possible by placing the inductor and the diode very close to the power switching IC (only for switching power supply). This is done in order to reduce the radiated field (noise) at the switching frequency (100-500 kHz usually). The use of a good common ground plane is suggested. The placement of the power supply on the board should be done in such a way to guarantee that the high current return paths in the ground plane are not overlapped to any noise sensitive circuitry as the microphone amplifier/buffer or earphone amplifier. The power supply input cables should be kept separate from noise sensitive lines such as microphone/earphone cables.
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 38 of 80 6 GSM/WCDMA Antenna The antenna connection and board layout design are the most important aspect in the full product design as they strongly affect the product overall performances, hence read carefully and follow the requirements and the guidelines for a proper design. 6.1 GSM/WCDMA Antenna Requirements As suggested on the Product Description the antenna and antenna transmission line on PCB for a Telit HE910 device shall fulfil the following requirements: ANTENNA REQUIREMENTS Frequency range Depending by frequency band(s) provided by the network operator, the customer shall use the most suitable antenna for that/those band(s) Bandwidth (GSM/EDGE) 70 MHz in GSM850, 80 MHz in GSM900, 170 MHz in DCS & 140 MHz PCS band Bandwidth (WCDMA) 70 MHz in WCDMA Band V 80 MHz in WCDMA Band VIII 460 MHz in WCDMA Band IV (see NOTE1) 140 MHz in WCDMA Band II 250 MHz in WCDMA Band I Impedance 50 ohm Input power > 33dBm(2 W) peak power in GSM > 24dBm Average power in WCDMA VSWR absolute max ≤ 5:1 (limit to avoid permanent damage) VSWR recommended ≤ 2:1 (limit to fulfil all regulatory requirements) When using the HE910, since there's no antenna connector on the module, the antenna must be connected to the HE910 antenna pad (K1) by means of a transmission line implemented on the PCB. In the case the antenna is not directly connected at the antenna pad of the HE910, then a PCB line is needed in order to connect with it or with its connector.
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 39 of 80 This transmission line shall fulfil the following requirements: ANTENNA LINE ON PCB REQUIREMENTS Characteristic Impedance 50 ohm Max Attenuation 0,3 dB Coupling with other signals shall be avoided Cold End (Ground Plane) of antenna shall be equipotential to the HE910 ground pins Furthermore if the device is developed for the US market and/or Canada market, it shall comply with the FCC and/or IC approval requirements: This device is to be used only for mobile and fixed application. In order to re-use the Telit FCC/IC approvals the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. If antenna is installed with a separation distance of less than 20 cm from all persons or is co-located or operating in conjunction with any other antenna or transmitter then additional FCC/IC testing may be required. End-Users must be provided with transmitter operation conditions for satisfying RF exposure compliance. Antennas used for this OEM module must not exceed the following gains for mobile and fixed operating configurations: GSM 850/FDD V: 5.22 dBi PCS 1900/FDD II: 3.31 dBi FDD IV: 6.45 dBi NOTE1: The HE910-GA is not supporting the FDD BAND IV
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 40 of 80 6.2 GSM/WCDMA - PCB line Guidelines Make sure that the impedance is 50ohm ; Keep line on the PCB as short as possible, since the antenna line loss shall be less than around 0,3 dB; Line geometry should have uniform characteristics, constant cross section, avoid meanders and abrupt curves; Any kind of suitable geometry / structure (Microstrip, Stripline, Coplanar, Grounded Coplanar Waveguide...) can be used for implementing the printed transmission line afferent the antenna; If a Ground plane is required in line geometry, that plane has to be continuous and sufficiently extended, so the geometry can be as similar as possible to the related canonical model; Keep, if possible, at least one layer of the PCB used only for the Ground plane; If possible, use this layer as reference Ground plane for the transmission line; It is wise to surround (on both sides) the PCB transmission line with Ground, avoid having other signal tracks facing directly the antenna line track. Avoid crossing any un-shielded transmission line footprint with other signal tracks on different layers; The ground surrounding the antenna line on PCB has to be strictly connected to the main Ground Plane by means of via holes (once per 2mm at least), placed close to the ground edges facing line track; Place EM noisy devices as far as possible from HE910 antenna line; Keep the antenna line far away from the HE910 power supply lines; If EM noisy devices are present on the PCB hosting the HE910, such as fast switching ICs, take care of the shielding of the antenna line by burying it inside the layers of PCB and surround it with Ground planes, or shield it with a metal frame cover. If EM noisy devices are not present around the line, the use of geometries like Microstrip or Grounded Coplanar Waveguide has to be preferred, since they typically ensure less attenuation if compared to a Stripline having same length;
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 41 of 80 6.3 GSM/WCDMA Antenna - Installation Guidelines Install the antenna in a place covered by the GSM signal. If the device antenna is located greater then 20cm from the human body and there are no co-located transmitter then the Telit FCC/IC approvals can be re-used by the end product If the device antenna is located less then 20cm from the human body or there are no co-located transmitter then the additional FCC/IC testing may be required for the end product (Telit FCC/IC approvals cannot be reused) Antenna shall not be installed inside metal cases Antenna shall be installed also according Antenna manufacturer instructions.
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 42 of 80 6.4 Antenna Diversity Requirements This product is including an input for a second RX antenna to improve the radio sensitivity. The function is called Antenna Diversity. ANTENNA REQUIREMENTS Frequency range Depending by frequency band(s) provided by the network operator, the customer shall use the most suitable antenna for that/those band(s) Bandwidth (GSM/EDGE) 70 MHz in GSM850, 80 MHz in GSM900, 170 MHz in DCS & 140 MHz PCS band Bandwidth (WCDMA) 70 MHz in WCDMA Band V 80 MHz in WCDMA Band VIII 460 MHz in WCDMA Band IV (see NOTE1) 140 MHz in WCDMA Band II 250 MHz in WCDMA Band I Impedance 50 ohm When using the HE910, since there's no antenna connector on the module, the antenna must be connected to the HE910 antenna pad (F1) by means of a transmission line implemented on the PCB. In the case the antenna is not directly connected at the antenna pad of the HE910, then a PCB line is needed in order to connect with it or with its connector. The second Rx antenna should not be located in the close vicinity of main antenna. In order to improve Diversity Gain, Isolation and reduce mutual interaction, the two antennas should be located at the maximum reciprocal distance possible, taking into consideration the available space into the application. NOTE1: The HE910-GA is not supporting the FDD BAND IV
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 43 of 80 6.5 GPS Antenna Requirements (HE910 and HE910-GA) The HE910 module is already provided with an internal LNA amplifier so it is also possible to develop an application including a passive Antenna. The use of an active antenna is required to achieve a better performance especially when the GPS antenna distance from the module is quite high. The module is provided of a Digital Output signal to enable the external LNA (pad R7) 6.5.1 Combined GPS Antenna The use of combined GPS antennas is NOT recommended; this solution could generate an extremely poor GPS reception and also the combination antenna requires additional diplexer and adds a loss in the RF route. In addition, the combination of antennas requires an additional diplexer, which adds significant power losses in the RF path. 6.5.2 Linear and Patch GPS Antenna Using this type of antenna introduces at least 3 dB of loss if compared to a circularly polarized (CP) antenna. Having a spherical gain response instead of a hemispherical gain response could aggravate the multipath behaviour & create poor position accuracy. 6.5.3 LNA and Front End Design Considerations The optional external LNA (embedded or not inside antenna) should be dimensioned to compensate antenna line losses and to avoid an excessive LNA gain that can introduce jamming spurs, degrade 3IP, and saturate the receiver. The external active antenna for a Telit HE910 device must fulfill the following requirements: Antenna Requirements Frequency range 1575.42 MHz (GPS L1) Bandwidth ± 1.023 MHz Impedance 50ohm
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 44 of 80 When using the Telit HE910, since there is no antenna connector on the module, the antenna must be connected to the HE910 through the PCB with the antenna pad. In the case that the antenna is not directly developed on the same PCB, hence directly connected at the antenna pad of the HE910, then a PCB line is needed in order to connect with it or with its connector. This line of transmission must fulfill the following requirements: Antenna Line on PCB Requirements Impedance 50 ohm No coupling with other signals allowed Cold End (Ground Plane) of antenna must be equipotential to the HE910 ground pins Furthermore if the device is developed for the US and/or Canada market, it must comply with the FCC and/or IC approval requirements: This device is to be used only for mobile and fixed application. 6.5.4 GPS Antenna - PCB Line Guidelines Ensure that the antenna line impedance is 50ohm. Keep the antenna line on the PCB as short as possible to reduce the loss. Antenna line must have uniform characteristics, constant cross section, avoid meanders and abrupt curves. Keep one layer of the PCB used only for the Ground plane, if possible. Surround (on the sides, over and under) the antenna line on PCB with Ground, avoid having other signal tracks facing directly the antenna line of track. The ground around the antenna line on PCB has to be strictly connected to the Ground Plane by placing vias once per 2mm at least. Place EM noisy devices as far as possible from HE910 antenna line. Keep the antenna line far away from the HE910 power supply lines. Keep the antenna line far away from the HE910 GSM RF lines. If you have EM noisy devices around the PCB hosting the HE910, such as fast switching ICs, take care of the shielding of the antenna line by burying it inside the layers of PCB and surround it with Ground planes, or shield it with a metal frame cover.
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 45 of 80 If you do not have EM noisy devices around the PCB of HE910, use a strip-line on the superficial copper layer for the antenna line. The line attenuation will be lower than a buried one. 6.5.5 GPS Antenna - Installation Guidelines The HE910 due to its characteristics of sensitivity is capable to perform a Fix inside the buildings. (In any case the sensitivity could be affected by the building characteristics i.e. shielding). The Antenna must not be co-located or operating in conjunction with any other antenna or transmitter. Antenna must not be installed inside metal cases. Antenna must be installed also according to the Antenna manufacturer instructions.
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 46 of 80 7 Logic level specifications The following table shows the logic level specifications used in the HE910 interface circuits: Absolute Maximum Ratings -Not Functional Parameter Min Max Input level on any digital pin (CMOS 1.8) with respect to ground -0.3V 3.1V Operating Range - Interface levels (1.8V CMOS) Level Min Max Input high level 1.5V 1.9V Input low level 0V 0.35V Output high level 1.6V 1.9 Output low level 0V 0.2V Current characteristics (Preliminary values) Level Typical Output Current 100uA Input Current 1uA
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 47 of 80 7.1 Reset signal Signal Function I/O PAD RESET* Phone reset I R13 RESET* is used to reset the HE910. Whenever this signal is pulled low, the HE910 is reset. When the device is reset it stops any operation. After the release of the reset HE910 is unconditionally shut down, without doing any detach operation from the network where it is registered. This behaviour is not a proper shut down because any GSM device is requested to issue a detach request on turn off. For this reason the Reset signal must not be used to normally shutting down the device, but only as an emergency exit in the rare case the device remains stuck waiting for some network response. The RESET* is internally controlled on start-up to achieve always a proper power-on reset sequence, so there's no need to control this pin on start-up. It may only be used to reset a device already on that is not responding to any command. NOTE: Do not use this signal to power off the HE910. Use the ON/OFF signal to perform this function or the AT#SHDN command. Reset Signal Operating levels: Signal Min Max RESET Input high 1.5V 1.9V RESET Input low 0V 0.35V * this signal is internally pulled up so the pin can be left floating if not used. If unused, this signal may be left unconnected. If used, then it must always be connected with an open collector transistor, to permit to the internal circuitry the power on reset and under voltage lockout functions.
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 48 of 80 8 USB Port The HE910 includes one integrated universal serial bus (USB) transceiver: USB 2.0 HS 8.1 USB 2.0 HS This port is compliant with the USB 2.0 specifications. The following table is listing the available signals: PAD Signal I/O Function Type NOTE B15 USB_D+ I/O USB differential Data (+) 3.3V C15 USB_D- I/O USB differential Data (-) 3.3V A13 VUSB AI Power sense for the internal USB transceiver. 5V Accepted range: 4.4V to 5.25V The USB_DPLUS and USB_DMINUS signals have a clock rate of 480 MHz. The signal traces should be routed carefully. Trace lengths, number of vias and capacitive loading should be minimized. The impedance value should be as close as possible to 90 Ohms differential.
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 49 of 80 9 SPI port The HE910 Module is provided by one SPI interface. The SPI interface defines two handshake lines for flow control and mutual wake-up of the modem and the Application Processor: SRDY (slave ready) and MRDY (master ready). The AP has the master role, that is, it supplies the clock. The following table is listing the available signals: PAD Signal I/O Function Type COMMENT D15 SPI_MOSI I SPI MOSI CMOS 1.8V Shared with TX_AUX E15 SPI_MISO O SPI MISO CMOS 1.8V Shared with RX_AUX F15 SPI_CLK I SPI Clock CMOS 1.8V H15 SPI_MRDY I SPI_MRDY CMOS 1.8V J15 SPI_SRDY O SPI_SRDY CMOS 1.8V The signal VIO1_1V8 must be connected to the VDD_IO1 input pin to properly supply this digital section. NOTE: Due to the shared functions, when the SPI port is used, it is not possible to use the AUX_UART port.
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 50 of 80 9.1 SPI Connections SPI_MISO E15 D15 F15 H15 J15 D13 E13 D14 HE910 AP SPI_MOSI SPI_CLK SPI_MRDY SPI_SRDY VDD_IO1 VIO1_1V8 nc
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 51 of 80 10 Serial Ports The HE910 module is provided with by 2 Asynchronous serial ports: MODEM SERIAL PORT 1 (Main) MODEM SERIAL PORT 2 (Auxiliary) Several configurations can be designed for the serial port on the OEM hardware, but the most common are: RS232 PC com port microcontroller UART @ 1.8V (Universal Asynchronous Receive Transmit) microcontroller UART @ 5V or other voltages different from 1.8V Depending from the type of serial port on the OEM hardware a level translator circuit may be needed to make the system work. On the HE910 the ports are CMOS 1.8.. The electrical characteristics of the Serial ports are explained in the following tables: Absolute Maximum Ratings -Not Functional Parameter Min Max Input level on any digital pin (CMOS 1.8) with respect to ground -0.3V 3.1V Operating Range - Interface levels (1.8V CMOS) Level Min Max Input high level 1.5V 1.9V Input low level 0V 0.35V Output high level 1.6V 1.9 Output low level 0V 0.2V
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 52 of 80 10.1 MODEM SERIAL PORT 1 (USIF0) The serial port 1 on the HE910 is a +1.8V UART with all the 7 RS232 signals. It differs from the PC-RS232 in the signal polarity (RS232 is reversed) and levels. RS232 Pin # Signal HE910 Pad Number Name Usage 1 C109/DCD N14 Data Carrier Detect Output from the HE910 that indicates the carrier presence 2 C104/RXD M15 Transmit line *see Note Output transmit line of HE910 UART 3 C103/TXD N15 Receive line *see Note Input receive of the HE910 UART 4 C108/DTR M14 Data Terminal Ready Input to the HE910 that controls the DTE READY condition 5 GND M12, B13, P13, Ground Ground 6 C107/DSR P14 Data Set Ready Output from the HE910 that indicates the module is ready 7 C106/CTS P15 Clear to Send Output from the HE910 that controls the Hardware flow control 8 C105/RTS L14 Request to Send Input to the HE910 that controls the Hardware flow control 9 C125/RING R14 Ring Indicator Output from the HE910 that indicates the incoming call condition The following table shows the typical input value of internal pull-up resistors for RTS DTR and TXD input lines and in all module states: STATE RTS DTR TXD Pull up tied to ON 5K to 12K 1V8 OFF Schottky diode RESET Schottky diode POWER SAVING 5K to 12K 1V8 Line in OFF and RESET state can be treated as in picture below
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 53 of 80 NOTE: According to V.24, some signal names are referred to the application side, therefore on the HE910 side these signal are on the opposite direction: TXD on the application side will be connected to the receive line (here named C103/TXD) RXD on the application side will be connected to the transmit line (here named C104/RXD) NOTE: For a minimum implementation, only the TXD, RXD lines can be connected, the other lines can be left open provided a software flow control is implemented. NOTE: In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the HE910 when the module is powered off or during an ON/OFF transition.
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 54 of 80 10.2 MODEM SERIAL PORT 2 (USIF1) The secondary serial port on the HE910 is a CMOS1.8V with only the RX and TX signals. The signals of the HE910 serial port are: PAD Signal I/O Function Type COMMENT D15 TX_AUX O Auxiliary UART (TX Data to DTE) CMOS 1.8V SHARED WITH SPI_MTSR E15 RX_AUX I Auxiliary UART (RX Data from DTE) CMOS 1.8V SHARED WITH SPI_MRST The signal VIO1_1V8 must be connected to the VDD_IO1 input pin to properly supply this digital section. NOTE: In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the HE910 when the module is powered off or during an ON/OFF transition. NOTE: Due to the shared pins, when the Modem Serial port is used, it is not possible to use the SPI functions.
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 55 of 80 10.3 RS232 level translation In order to interface the HE910 with a PC com port or a RS232 (EIA/TIA-232) application a level translator is required. This level translator must: invert the electrical signal in both directions; Change the level from 0/1.8V to +15/-15V. Actually, the RS232 UART 16450, 16550, 16650 & 16750 chipsets accept signals with lower levels on the RS232 side (EIA/TIA-562), allowing a lower voltage-multiplying ratio on the level translator. Note that the negative signal voltage must be less than 0V and hence some sort of level translation is always required. The simplest way to translate the levels and invert the signal is by using a single chip level translator. There are a multitude of them, differing in the number of drivers and receivers and in the levels (be sure to get a true RS232 level translator not a RS485 or other standards). By convention the driver is the level translator from the 0-1.8V UART to the RS232 level. The receiver is the translator from the RS232 level to 0-1.8V UART. In order to translate the whole set of control lines of the UART you will need: 5 drivers 3 receivers
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 56 of 80 An example of RS232 level adaptation circuitry could be done using a MAXIM transceiver (MAX218) In this case the chipset is capable to translate directly from 1.8V to the RS232 levels (Example done on 4 signals only). The RS232 serial port lines are usually connected to a DB9 connector with the following layout:
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 57 of 80 11 Audio Section Overview The Audio of the HE910 Module is carried by DVI digital audio interface. The audio port can be directly connected to end device using digital interface, or via one of the several compliant codecs (in case an analog audio is needed). NOTE: Audio Supported by HE910 and HE910-GA only 11.1 Electrical Characteristics The product is providing the Digital Audio Interface (DVI) on the following Pins: Digital Voice Interface (DVI) PAD Signal I/O Function Note Type B9 DVI_WA0 I/O Digital Audio Interface (Word Alignment / LRCLK) CMOS 1.8V B6 DVI_RX I Digital Audio Interface (RX) CMOS 1.8V B7 DVI_TX O Digital Audio Interface (TX) CMOS 1.8V B8 DVI_CLK I/O Digital Audio Interface (BCLK) CMOS 1.8V 11.1.1 CODEC Examples Please refer to the HE910 Digital Audio Application note.
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 58 of 80 12 General Purpose I/O The HE910 module is provided by a set of Digital Input / Output pins Input pads can only be read; they report the digital value (high or low) present on the pad at the read time. Output pads can only be written or queried and set the value of the pad output. An alternate function pad is internally controlled by the HE910 firmware and acts depending on the function implemented. The following table shows the available GPIO on the HE910: PAD Signal I/O Function Type Drive strength Default State Note C8 GPIO_01 I/O Configurable GPIO CMOS 1.8V 0.1 mA INPUT Alternate function STAT LED C9 GPIO_02 I/O Configurable GPIO CMOS 1.8V 0.1 mA INPUT C10 GPIO_03 I/O Configurable GPIO CMOS 1.8V 0.1 mA INPUT C11 GPIO_04 I/O Configurable GPIO CMOS 1.8V 0.1 mA INPUT B14 GPIO_05 I/O Configurable GPIO CMOS 1.8V 0.1 mA INPUT C12 GPIO_06 I/O Configurable GPIO CMOS 1.8V 0.1 mA INPUT C13 GPIO_07 I/O Configurable GPIO CMOS 1.8V 0.1 mA INPUT K15 GPIO_08 I/O Configurable GPIO CMOS 1.8V 0.1 mA INPUT VDD_IO1 has to be connected to VIO1_1V8 L15 GPIO_09 I/O Configurable GPIO CMOS 1.8V 0.1 mA INPUT VDD_IO1 has to be connected to VIO1_1V8 G15 GPIO_10 I/O Configurable GPIO CMOS 1.8V 0.1 mA INPUT VDD_IO1 has to be connected to VIO1_1V8
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 59 of 80 12.1 GPIO Logic levels Where not specifically stated, all the interface circuits work at 1.8V CMOS logic levels. The following table shows the logic level specifications used in the HE910 interface circuits: Absolute Maximum Ratings -Not Functional Parameter Min Max Input level on any digital pin (CMOS 1.8) with respect to ground -0.3V 3.1V Operating Range - Interface levels (1.8V CMOS) Level Min Max Input high level 1.5V 1.9V Input low level 0V 0.35V Output high level 1.6V 1.9 Output low level 0V 0.2V
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 60 of 80 12.2 Using a GPIO Pad as INPUT The GPIO pads, when used as inputs, can be connected to a digital output of another device and report its status, provided this device has interface levels compatible with the 1.8V CMOS levels of the GPIO. If the digital output of the device to be connected with the GPIO input pad has interface levels different from the 1.8V CMOS, then it can be buffered with an open collector transistor with a 47K pull up to 1.8V. NOTE: In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the HE910 when the module is powered off or during an ON/OFF transition. 12.3 Using a GPIO Pad as OUTPUT The GPIO pads, when used as outputs, can drive 1.8V CMOS digital devices or compatible hardware. When set as outputs, the pads have a push-pull output and therefore the pull-up resistor may be omitted.
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 61 of 80 12.4 Indication of network service availability The STAT_LED pin status shows information on the network service availability and Call status. The function is available as alternate function of GPIO_01 In the HE910 modules, the STAT_LED needs an external transistor to drive an external LED. Therefore, the status indicated in the following table is reversed with respect to the pin status. LED status Device Status Permanently off Device off Fast blinking (Period 1s, Ton 0,5s) Net search / Not registered / turning off Slow blinking (Period 3s, Ton 0,3s) Registered full service Permanently on a call is active A schematic example could be:
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 62 of 80 12.5 RTC Bypass out The VRTC pin brings out the Real Time Clock supply, which is separate from the rest of the digital part, allowing having only RTC going on when all the other parts of the device are off. To this power output a backup capacitor can be added in order to increase the RTC autonomy during power off of the battery. NO Devices must be powered from this pin. 12.6 External SIM Holder Implementation Please refer to the related User Guide (SIM Holder Design Guides, 80000NT10001a). 12.7 VAUX Power Output A regulated power supply output is provided in order to supply small devices from the module. The signal is present on Pad R11 and it is in common with the PWRMON (module powered ON indication) function. This output is always active when the module is powered ON. The operating range characteristics of the supply are: Level Min Typical Max Output voltage 1.78V 1.80V 1.82V Output current - - 60mA Output bypass capacitor (inside the module) 1uF
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 63 of 80 13 Mounting the HE910 on the application 13.1 General The HE910 modules have been designed in order to be compliant with a standard lead-free SMT process. 13.2 Module finishing & dimensions Pad B1 Lead Free Alloy
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 64 of 80 13.3 Recommended foot print for the application In order to easily rework the HE910 is suggested to consider on the application a 1.5 mm placement inhibit area around the module. It is also suggested, as common rule for an SMT component, to avoid having a mechanical part of the application in direct contact with the module. Top View
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 65 of 80 13.4 Stencil suggest a thickness of stencil foil ≥ 120 µm. 13.5 PCB pad design Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB. PCB Copper Pad Pad Solder Mask SMD (Solder Mask Defined) NSMD (Non Solder Mask Defined)
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 66 of 80 13.6 Recommendations for PCB pad dimensions (mm): Solder resist openings
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 67 of 80 It is not recommended to place via or micro-via not covered by solder resist in an area of 0,3 mm around the pads unless it carries the same signal of the pad itself (see following figure). Holes in pad are allowed only for blind holes and not for through holes. Recommendations for PCB pad surfaces: Finish Layer thickness [µm] Properties Electro-less Ni / Immersion Au 3 7 / 0.05 0.15 good solder ability protection, high shear force values The PCB must be able to resist the higher temperatures which are occurring at the lead-free process. This issue should be discussed with the PCB-supplier. Generally, the wettability of tin-lead solder paste on the described surface plating is better compared to lead-free solder paste. Inhibit area for micro-via
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 68 of 80 13.7 Solder paste Lead free Solder paste Sn/Ag/Cu modules after assembly. 13.7.1 HE910 Solder reflow The following is the recommended solder reflow profile
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 69 of 80 Profile Feature Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max Preheat Temperature Min (Tsmin) Temperature Max (Tsmax) Time (min to max) (ts) 150°C 200°C 60-180 seconds Tsmax to TL Ramp-up Rate 3°C/second max Time maintained above: Temperature (TL) Time (tL) 217°C 60-150 seconds Peak Temperature (Tp) 245 +0/-5°C Time within 5°C of actual Peak Temperature (tp) 10-30 seconds Ramp-down Rate 6°C/second max. Time 25°C to Peak Temperature 8 minutes max. NOTE: All temperatures refer to topside of the package, measured on the package body surface WARNING: The HE910 module withstands one reflow process only. NOTE: It is not allowed to apply any pressure on the top surface of the module when used in the application
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 70 of 80 14 Packing system The HE910 modules are packaged on trays of 20 pieces each. These trays can be used in SMT processes for pick & place handling.
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 71 of 80
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 72 of 80 WARNING: These trays can withstand at the maximum temperature of 65° C. 14.1 Moisture sensitivity The HE910 is a Moisture Sensitive Device level 3, in according with standard IPC/JEDEC J-STD-020, take care all the relatives requirements for using this kind of components. Moreover, the customer has to take care of the following conditions: a) Calculated shelf life in sealed bag: 4 months at <40°C and <90% relative humidity (RH). b) Environmental condition during the production: 30°C / 60% RH according to IPC/JEDEC J-STD-033A paragraph 5. c) The maximum time between the opening of the sealed bag and the reflow process -STD- is respected d) Baking is required if conditions b) or c) are not respected e) Baking is required if the humidity indicator inside the bag indicates 10% RH or more
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 73 of 80 15 SAFETY RECOMMANDATIONS READ CAREFULLY Be sure the use of this product is allowed in the country and in the environment required. The use of this product may be dangerous and has to be avoided in the following areas:  Where it can interfere with other electronic devices in environments such as hospitals, airports, aircrafts, etc  Where there is risk of explosion such as gasoline stations, oil refineries, etc It is responsibility of the user to enforce the country regulation and the specific environment regulation. Do not disassemble the product; any mark of tampering will compromise the warranty validity. We recommend following the instructions of the hardware user guides for a correct wiring of the product. The product has to be supplied with a stabilized voltage source and the wiring has to be conforming to the security and fire prevention regulations. The product has to be handled with care, avoiding any contact with the pins because electrostatic discharges may damage the product itself. Same cautions have to be taken for the SIM, checking carefully the instruction for its use. Do not insert or remove the SIM when the product is in power saving mode. The system integrator is responsible of the functioning of the final product; therefore, care has to be taken to the external components of the module, as well as of any project or installation issue, because the risk of disturbing the GSM network or external devices or having impact on the security. Should there be any doubt, please refer to the technical documentation and the regulations in force. Every module has to be equipped with a proper antenna with specific characteristics. The antenna has to be installed with care in order to avoid any interference with other electronic devices and has to guarantee a minimum distance from the body (20 cm). In case of this requirement cannot be satisfied, the system integrator has to assess the final product against the SAR regulation.
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 74 of 80 The European Community provides some Directives for the electronic equipments Community website: http://europa.eu.int/comm/enterprise/rtte/dir99-5.htm The text of the Directive 99/05 regarding telecommunication equipments is available, while the applicable Directives (Low Voltage and EMC) are available at: http://europa.eu.int/comm/enterprise/electr_equipment/index_en.htm
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 75 of 80 16 Conformity assessment issues 16.1 1999/5/EC Directive The HE910, HE910-D and HE910-GA modules have been evaluated against the essential requirements of the 1999/5/EC Directive. Bulgarian С настоящето Telit Communications S.p.A. декларира, че 2G/3G module отговаря на съществените изисквания и другите приложими изисквания на Директива 1999/5/ЕС. Czech Telit Communications S.p.A. tímto prohlašuje, že tento 2G/3G module je ve shodě se základními požadavky a dalšími příslušnými ustanoveními směrnice 1999/5/ES. Danish Undertegnede Telit Communications S.p.A. erklærer herved, at følgende udstyr 2G/3G module overholder de væsentlige krav og øvrige relevante krav i direktiv 1999/5/EF. Dutch Hierbij verklaart Telit Communications S.p.A. dat het toestel 2G/3G module in overeenstemming is met de essentiële eisen en de andere relevante bepalingen van richtlijn 1999/5/EG. English Hereby, Telit Communications S.p.A., declares that this 2G/3G module is in compliance with the essential requirements and other relevant provisions of Directive 1999/5/EC. Estonian Käesolevaga kinnitab Telit Communications S.p.A. seadme 2G/3G module vastavust direktiivi 1999/5/EÜ põhinõuetele ja nimetatud direktiivist tulenevatele teistele asjakohastele sätetele. German Hiermit erklärt Telit Communications S.p.A., dass sich das Gerät 2G/3G module in Übereinstimmung mit den grundlegenden Anforderungen und den übrigen einschlägigen Bestimmungen der Richtlinie 1999/5/EG befindet. Greek ΜΕ ΣΗΝ ΠΑΡΟΤ΢Α Telit Communications S.p.A. ΔΗΛΩΝΕΙ ΟΣΙ 2G/3G module ΢ΤΜΜΟΡΦΩΝΕΣΑΙ ΠΡΟ΢ ΣΙ΢ ΟΤ΢ΙΩΔΕΙ΢ ΑΠΑΙΣΗ΢ΕΙ΢ ΚΑΙ ΣΙ΢ ΛΟΙΠΕ΢ ΢ΥΕΣΙΚΕ΢ ΔΙΑΣΑΞΕΙ΢ ΣΗ΢ ΟΔΗΓΙΑ΢ 1999/5/ΕΚ. Hungarian Alulírott, Telit Communications S.p.A. nyilatkozom, hogy a 2G/3G module megfelel a vonatkozó alapvetõ követelményeknek és az 1999/5/EC irányelv egyéb elõírásainak. Finnish Telit Communications S.p.A. vakuuttaa täten että 2G/3G module tyyppinen laite on direktiivin 1999/5/EY oleellisten vaatimusten ja sitä koskevien direktiivin muiden ehtojen mukainen. French Par la présente Telit Communications S.p.A. déclare que l'appareil 2G/3G module est conforme aux exigences essentielles et aux autres dispositions pertinentes de la directive 1999/5/CE. Icelandic Hér með lýsir Telit Communications S.p.A. yfir því að 2G/3G module er í samræmi við grunnkröfur og aðrar kröfur, sem gerðar eru í tilskipun 1999/5/EC Italian Con la presente Telit Communications S.p.A. dichiara che questo 2G/3G module è conforme ai requisiti essenziali ed alle altre disposizioni pertinenti stabilite dalla direttiva 1999/5/CE.
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 76 of 80 Latvian Ar šo Telit Communications S.p.A. deklarē, ka 2G/3G module atbilst Direktīvas 1999/5/EK būtiskajām prasībām un citiem ar to saistītajiem noteikumiem. Lithuanian Šiuo Telit Communications S.p.A. deklaruoja, kad šis 2G/3G module atitinka esminius reikalavimus ir kitas 1999/5/EB Direktyvos nuostatas. Maltese Hawnhekk, Telit Communications S.p.A., jiddikjara li dan 2G/3G module jikkonforma mal-ħtiġijiet essenzjali u ma provvedimenti oħrajn relevanti li hemm fid-Dirrettiva 1999/5/EC. Norwegian Telit Communications S.p.A. erklærer herved at utstyret 2G/3G module er i samsvar med de grunnleggende krav og øvrige relevante krav i direktiv 1999/5/EF. Polish Niniejszym Telit Communications S.p.A. oświadcza, że 2G/3G module jest zgodny z zasadniczymi wymogami oraz pozostałymi stosownymi postanowieniami Dyrektywy 1999/5/EC Portuguese Telit Communications S.p.A. declara que este 2G/3G module está conforme com os requisitos essenciais e outras disposições da Directiva 1999/5/CE. Slovak Telit Communications S.p.A. týmto vyhlasuje, že 2G/3G module spĺňa základné požiadavky a všetky príslušné ustanovenia Smernice 1999/5/ES. Slovenian Telit Communications S.p.A. izjavlja, da je ta 2G/3G module v skladu z bistvenimi zahtevami in ostalimi relevantnimi določili direktive 1999/5/ES. Spanish Por medio de la presente Telit Communications S.p.A. declara que el 2G/3G module cumple con los requisitos esenciales y cualesquiera otras disposiciones aplicables o exigibles de la Directiva 1999/5/CE. Swedish Härmed intygar Telit Communications S.p.A. att denna 2G/3G module står I överensstämmelse med de väsentliga egenskapskrav och övriga relevanta bestämmelser som framgår av direktiv 1999/5/EG. In order to satisfy the essential requirements of 1999/5/EC Directive, the HE910 and HE910-GA modules are compliant with the following standards: RF spectrum use (R&TTE art. 3.2) EN 300 440-2 V1.4.1 EN 301 511 V9.0.2 EN 301 908-1 V4.2.1 EN 301 908-2 V4.2.1 EMC (R&TTE art. 3.1b) EN 301 489-1 V1.8.1 EN 301 489-3 V1.4.1 EN 301 489-7 V1.3.1 EN 301 489-24 V1.5.1 Health & Safety (R&TTE art. 3.1a) EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 77 of 80 The HE910-D module is compliant with the following standards: RF spectrum use (R&TTE art. 3.2) EN 301 511 V9.02 EN 301 908-1 V4.2.1 EN 301 908-2 V4.2.1 EMC (R&TTE art. 3.1b) EN 301 489-1 V1.8.1 EN 301 489-7 V1.3.1 EN 301 489-24 V1.5.1 Health & Safety (R&TTE art. 3.1a) EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011 The conformity assessment procedure referred to in Article 10 and detailed in Annex IV of Directive 1999/5/EC has been followed with the involvement of the following Notified Body: AT4 wireless, S.A. Parque Tecnologico de Andalucía C/ Severo Ochoa 2 29590 Campanillas Málaga SPAIN Notified Body No: 1909 Thus, the following marking is included in the product: The full declaration of conformity can be found on the following address: http://www.telit.com/ There is no restriction for the commercialisation of the HE910, HE910-D and HE910-GA modules in all the countries of the European Union. 1909
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 78 of 80 Final product integrating this module must be assessed against essential requirements of the 1999/5/EC (R&TTE) Directive. It should be noted that assessment does not necessarily lead to testing. Telit Communications S.p.A. recommends carrying out the following assessments: RF spectrum use (R&TTE art. 3.2) It will depend on the antenna used on the final product. EMC (R&TTE art. 3.1b) Testing Health & Safety (R&TTE art. 3.1a) Testing Alternately, assessment of the final product against EMC (Art. 3.1b) and Electrical safety (Art. 3.1a) essential requirements can be done against the essential requirements of the EMC and the LVD Directives: Low Voltage Directive 2006/95/EC and product safety Directive EMC 2004/108/EC for conformity for EMC
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 79 of 80 16.2 FCC/IC Regulatory notices Modification statement Telit has not approved any changes or modifications to this device by the user. Any changes Interference statement This device complies with Part 15 of the FCC Rules and Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Wireless notice This equipment complies with FCC and IC radiation exposure limits set forth for an uncontrolled environment. The antenna should be installed and operated with minimum distance of 20 cm between the radiator and your body. Antenna gain must be below: GSM 850/FDD V: 5.22 dBi PCS 1900/FDD II: 3.31 dBi FDD IV: 6.45 dBi (not applicable to HE910-GA module) This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
HE910 Hardware User Guide 1vv0300925 Rev.9 – 07-02-2012 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 80 of 80 Cet appareil est conforme aux limites d'exposition aux rayonnements de la IC pour un environnement non contrôlé. L'antenne doit être installé de façon à garder une distance minimale de 20 centimètres entre la source de rayonnements et votre corps. Gain de l'antenne doit être ci-dessous: GSM 850/FDD V: 5.22 dBi PCS 1900/FDD II: 3.31 dBi au module HE910-GA) L'émetteur ne doit pas être colocalisé ni fonctionner conjointement avec à autre antenne ou autre émetteur. FCC Class B digital device notice This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: - Reorient or relocate the receiving antenna. - Increase the separation between the equipment and receiver. - Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. - Consult the dealer or an experienced radio/TV technician for help.

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