THALES DIS AlS Deutschland MC75 Quadband GSM/GPRS/EGPRS Module User Manual MC75

Gemalto M2M GmbH Quadband GSM/GPRS/EGPRS Module MC75

Contents

Users Manual Part 2

MC75 Hardware Interface Description Strictly confidential / Draft s MC75_V00.190a Page 71 of 91 15.02.2005 Function Signal name IO Signal form and level Comment VMIC O VOmin = 2.4V VOtyp = 2.5V VOmax = 2.6V Imax = 2mA Microphone supply for customer feeding circuits EPP2 O EPN2 O 1.0954Vpp (differential) typical 3.4Vpp differential maximal Audio mode TBD Measurement conditions TBD Minimum differential resp. single ended load 27 Ohms The audio output can directly operate a 32-Ohm-loudspeaker. If unused keep pins open. EPP1 O EPN1 O 1.0954Vpp (differential) typical 6.0 Vp-p differential maximal Audio mode TBD Measurement conditions TBD Minimum differential resp. single ended load 7.5 Ohms The audio output can directly operate an 8-Ohm-loudspeaker. If unused keep pins open. MICP1 I MICN1 I MICP2 I MICN2 I Full Scale Input Voltage 1.578 Vpp 0dBm0 Input Voltage 1.0954 Vpp At MICNx, apply external bias from 1.0V to 1.6V. Audio mode TBD Measurement conditions TBD Balanced or single ended microphone or line inputs with external feeding circuit (using VMIC and AGND). If unused keep pins open. Analog Audio interface AGND Analog Ground GND level for external audio circuits
MC75 Hardware Interface Description Strictly confidential / Draft s MC75_V00.190a Page 72 of 91 15.02.2005 5.4 Electrostatic Discharge The GSM engine is not protected against Electrostatic Discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates a MC75 module. Special ESD protection provided on MC75: Antenna interface: one spark discharge line (spark gap) SIM interface: clamp diodes for protection against overvoltage. The remaining ports of MC75 are not accessible to the user of the final product (since they are installed within the device) and therefore, are only protected according to the “Human Body Model” requirements. MC75 has been tested according to the EN 61000-4-2 standard. The measured values can be gathered from the following table. Table 17: Measured electrostatic values Specification / Requirements Contact discharge Air discharge ETSI EN 301 489-7 ESD at SIM port ± 4kV ± 8kV ESD at antenna port ± 4kV ± 8kV Human Body Model (Test conditions: 1.5 kΩ, 100 pF) ESD at USB interface ± 1kV ± 1kV ESD at SD card interface ± 1kV ± 1kV ESD at all other interfaces ± 1kV ± 1kV Note: Please note that the values may vary with the individual application design. For example, it matters whether or not the application platform is grounded over external devices like a computer or other equipment, such as the Siemens reference application described in Chapter 8.
MC75 Hardware Interface Description Strictly confidential / Draft s MC75_V00.190a Page 73 of 91 15.02.2005 5.5 Reliability Characteristics The test conditions stated below are an extract of the complete test specifications. Table 18: Summary of reliability test conditions Type of test Conditions Standard Vibration Frequency range: 10-20 Hz; acceleration: 3.1mm amplitude Frequency range: 20-500 Hz; acceleration: 5g Duration: 2h per axis = 10 cycles; 3 axes DIN IEC 68-2-6 Shock half-sinus Acceleration: 500g Shock duration: 1msec 1 shock per axis 6 positions (± x, y and z) DIN IEC 68-2-27 Dry heat Temperature: +70 ±2°C Test duration: 16 h Humidity in the test chamber: < 50% EN 60068-2-2 Bb ETS 300019-2-7 Temperature change (shock) Low temperature: -40°C ±2°C High temperature: +85°C ±2°C Changeover time: < 30s (dual chamber system) Test duration: 1 h Number of repetitions: 100 DIN IEC 68-2-14 Na ETS 300019-2-7 Damp heat cyclic High temperature: +55°C ±2°C Low temperature: +25°C ±2°C Humidity: 93% ±3% Number of repetitions: 6 Test duration: 12h + 12h DIN IEC 68-2-30 Db ETS 300019-2-5 Cold (constant exposure) Temperature: -40 ±2°C Test duration: 16 h DIN IEC 68-2-1
MC75 Hardware Interface Description Strictly confidential / Draft s MC75_V00.190a Page 74 of 91 15.02.2005 6 Mechanics 6.1 Mechanical Dimensions of MC75 Figure 35 shows the top view of MC75 and provides an overview of the board's mechanical dimensions. For further details see Figure 36. Figure 35: MC75 – top view Pin 80Pin 1
MC75 Hardware Interface Description Strictly confidential / Draft s MC75_V00.190a Page 75 of 91 15.02.2005 All dimensions in mm Figure 36: Dimensions of MC75
MC75 Hardware Interface Description Strictly confidential / Draft s MC75_V00.190a Page 76 of 91 15.02.2005 6.2 Mounting MC75 to the Application Platform There are many ways to properly install MC75 in the host device. An efficient approach is to mount the MC75 PCB to a frame, plate, rack or chassis. Fasteners can be M2 screws plus suitable washers, circuit board spacers, or customized screws, clamps, or brackets. In addition, the board-to-board connection can also be utilized to achieve better support. To help you find appropriate spacers a list of selected screws and distance sleeves for 3mm stacking height can be found in Section 9.2. When using the two small holes take care that the screws are inserted with the screw head on the bottom of the MC75 PCB. Screws for the large holes can be inserted from top or bottom. For proper grounding it is strongly recommended to use large ground plane on the bottom of board in addition to the five GND pins of the board-to-board connector. The ground plane may also be used to attach cooling elements, e.g. a heat sink or thermally conductive tape. To prevent mechanical damage, be careful not to force, bend or twist the module. Be sure it is positioned flat against the host device. All the information you need to install an antenna is summarized in Chapter 4. Note that the antenna pad on the bottom of the MC75 PCB must not be influenced by any other PCBs, components or by the housing of the host device. It needs to be surrounded by a restricted space as described in Section 4.1.
MC75 Hardware Interface Description Strictly confidential / Draft s MC75_V00.190a Page 77 of 91 15.02.2005 6.3 Board-to-Board Application Connector This section provides the specifications of the 80-pin board-to-board connector used to connect MC75 to the external application. Connector mounted on the MC75 module: Type: 52991-0808 SlimStack Receptacle 80 pins, 0.50mm pitch, for stacking heights from 3.0 to 4.0mm, see Figure 37 for details. Supplier: Molex www.molex.com Table 19: Technical specifications of Molex board-to-board connector Parameter Specification (80-pin B2B connector) Electrical Number of Contacts 80 Contact spacing 0.5mm (.020") Voltage 50V Rated current 0.5 A max per contact Contact resistance 50mΩ max per contact Insulation resistance > 100 MΩ Dielectric Withstanding Voltage 500 V AC (for 1 minute) Physical Insulator material (housing) White glass-filled LCP plastic, flammability UL 94V 0 Contact material Plating: Gold over nickel Insertion force 1st < 74.4 N Insertion force 30th < 65.6 N Withdrawal force 1st > 10.8 N Maximum connection cycles 30 (@ 70mΩ max per contact) Mating connector types for the customer's application offered by Molex: • 53748-0808 SlimStack Plug, 3mm stacking height, see Figure 38 for details. • 53916-0808 SlimStack Plug, 4mm stacking height
MC75 Hardware Interface Description Strictly confidential / Draft s MC75_V00.190a Page 78 of 91 15.02.2005 Figure 37: Molex board-to-board connector 52991-0808 on MC75
MC75 Hardware Interface Description Strictly confidential / Draft s MC75_V00.190a Page 79 of 91 15.02.2005 Figure 38: Mating board-to-board connector 53748-0808 on application
MC75 Hardware Interface Description Strictly confidential / Draft s MC75_V00.190a Page 80 of 91 15.02.2005 7 Sample Application Figure 39 shows a typical example of how to integrate a MC75 module into the GSM part of a mobile application. Usage of the various host interfaces depends on the desired features of the application. Audio interface 1 demonstrates the balanced connection of microphone and earpiece. This solution is particularly well suited for internal transducers. Audio interface 2 uses an unbalanced microphone and earpiece connection typically found in headset applications. The charging circuit is optimized for the charging stages (trickle charging and software controlled charging) as well as the battery and charger specifications described in Section 3.4. The PWR_IND line is an open collector that needs an external pull-up resistor which connects to the voltage supply of the microcontroller VCC µC. Low state of the open collector pulls the PWR_IND signal low and indicates that the MC75 module is active, high level notifies the Power-down mode. If the module is in Power-down mode avoid current flowing from any other source into the module circuit, for example reverse current from high state external control lines. Therefore, the controlling application must be designed to prevent reverse or return flow. This is not necessary for the USB interface. The SD memory card interface can be powered from an external supply or via the VEXT line of MC75. Figure 39 uses the VEXT line. The advantage of this solution is that when the module enters the Power-down mode, the SD memory card interface is shut down as well. If you prefer to connect an SD card to an external power supply, take care that the interface is shut down when the PWR_IND signal goes high in Power-down mode. The same applies to the I2C interface. The EMC measures are best practice recommendations. In fact, an adequate EMC strategy for an individual application is very much determined by the overall layout and, especially, the position of components. For example, mounting the internal acoustic transducers directly on the PCB eliminates the need to use the ferrite beads shown in the sample schematic. However, when connecting cables to the module’s interfaces it is strongly recommended to add appropriate ferrite beads for reducing RF radiation. Disclaimer No warranty, either stated or implied, is provided on the sample schematic diagram shown in Figure 39 and the information detailed in this section. As functionality and compliance with national regulations depend to a great amount on the used electronic components and the individual application layout manufacturers are required to ensure adequate design and operating safeguards for their products using MC75 modules.
MC75 Hardware Interface Description Strictly confidential / Draft s MC75_V00.190a Page 81 of 91 15.02.2005 RechargeableLithium batteryChargerESD protectionNTC2.7kSI3441DV0.3R47k100kVCC µC47kEMERG_RSTPWR_INDIGTBATT+VCHARGEBATTEMPVSENSEISENSECHARGEGATECCGNDCCCLKCCIOCCRSTCCINCCVCC200nFSIMVMIC (2.5V)GND AGNDMICP1MICP2EPN1EPP1EPP2EPN2MC75MICN1MICN21k1k2.2k2.2k5.6k100nF100nF22µFDigital Audio7100µFBC847BC847VEXT (2.9V)SYNC>8R>32R*)depends on final specificationCRS04All SIM components shall be close to card holder.1nF 27pF0R (not mounted)V 5.2V 0.2Vch ar ge+Serial InterfaceASC0Serial InterfaceASC1SD memorycard*)USB(Slave)*)MC75 Application(Draft) *)8834*)I2C22 x RP470R Figure 39: MC75 sample application (draft)
MC75 Hardware Interface Description Strictly confidential / Draft s MC75_V00.190a Page 82 of 91 15.02.2005 8 Reference Approval 8.1 Reference Equipment for Type Approval The Siemens reference setup submitted to type approve MC75 consists of the following components: • Siemens MC75 cellular engine • Development Support Box DSB75 • SIM card reader integrated on DSB75 • U.FL-R-SMT antenna connector and U.FL-LP antenna cable • Handset type Votronic HH-SI-30.3/V1.1/0 • Li-Ion battery • PC as MMI GSM enginePC Power supply SIMRS-232 DSB75Handset50 Ω antenna connector (ARP) B2B Li-Ion battery Figure 40: Reference equipment for Type Approval
MC75 Hardware Interface Description Strictly confidential / Draft s MC75_V00.190a Page 83 of 91 15.02.2005 8.2 Compliance with FCC Rules and Regulations The FCC Equipment Authorization Certification for the MC75 reference application described in Section 8.1 is listed under the FCC identifier QIPMC75 IC: 267W-MC75 granted to Siemens AG. The MC75 reference application registered under the above identifier is certified to be in accordance with the following Rules and Regulations of the Federal Communications Commission (FCC). Power listed is ERP for Part 22 and EIRP for Part 24 “This device contains GSM, GPRS Class12 and EGPRS Class 10 functions in the 900 and 1800MHz Band which are not operational in U.S. Territories. This device is to be used only for mobile and fixed applications. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. Users and installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF exposure com-pliance. Antennas used for this OEM module must not exceed 8.4dBi gain (GSM 1900) and 2.9dBi (GSM 850) for mobile and fixed operating configurations. This device is approved as a module to be installed in other devices. The FCC label of the module must be visible from the outside. If not, the host device is required to bear a second label stating, “Contains FCC ID QIPMC75”. IMPORTANT: Manufacturers of mobile or fixed devices incorporating MC75 modules are advised to • clarify any regulatory questions, • have their completed product tested, • have product approved for FCC compliance, and • include instructions according to above mentioned RF exposure statements in end product user manual. Please note that changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.
MC75 Hardware Interface Description Strictly confidential / Draft s MC75_V00.190a Page 84 of 91 15.02.2005 9 Appendix 9.1 List of Parts and Accessories Table 20: List of parts and accessories Description Supplier Ordering information MC75 Siemens Siemens ordering number: L36880-N8810-N100 Siemens Car Kit Portable Siemens Siemens ordering number: L36880-N3015-A117 DSB75 Support Box Siemens Siemens ordering number: Votronic Handset VOTRONIC Votronic HH-SI-30.3/V1.1/0 VOTRONIC Entwicklungs- und Produktionsgesellschaft für elektronische Geräte mbH Saarbrücker Str. 8 66386 St. Ingbert Germany Phone: +49-(0)6 89 4 / 92 55-0 Fax: +49-(0)6 89 4 / 92 55-88 e-mail: contact@votronic.com SIM card holder incl. push button ejector and slide-in tray Molex Ordering numbers: 91228 91236 Sales contacts are listed in Table 21. Board-to-board connector Molex Sales contacts are listed in Table 21. U.FL-R-SMT antenna connector Hirose See Section 4.3 for details on U.FL-R-SMT connector, mating plugs and cables. Sales contacts are listed in Table 22.
MC75 Hardware Interface Description Strictly confidential / Draft s MC75_V00.190a Page 85 of 91 15.02.2005 Table 21: Molex sales contacts (subject to change) Molex For further information please click: http://www.molex.com/ Molex Deutschland GmbH Felix-Wankel-Str. 11 4078 Heilbronn-Biberach Germany Phone: +49-7066-9555 0 Fax: +49-7066-9555 29 Email: mxgermany@molex.com American Headquarters Lisle, Illinois 60532 U.S.A. Phone: +1-800-78MOLEX Fax: +1-630-969-1352 Molex China Distributors Beijing, Room 1319, Tower B, COFCO Plaza No. 8, Jian Guo Men Nei Street, 100005 Beijing P.R. China Phone: +86-10-6526-9628 Phone: +86-10-6526-9728 Phone: +86-10-6526-9731 Fax: +86-10-6526-9730 Molex Singapore Pte. Ltd. Jurong, Singapore Phone: +65-268-6868 Fax: +65-265-6044 Molex Japan Co. Ltd. Yamato, Kanagawa, Japan Phone: +81-462-65-2324 Fax: +81-462-65-2366 Table 22: Hirose sales contacts (subject to change) Hirose Ltd. For further information please click: http://www.hirose.com Hirose Electric (U.S.A.) Inc 2688 Westhills Court Simi Valley, CA 93065 U.S.A. Phone: +1-805-522-7958 Fax: +1-805-522-3217 Hirose Electric GmbH Zeppelinstrasse 42 73760 Ostfildern Kemnat 4 Germany Phone: +49-711-4560-021 Fax +49-711-4560-729 E-mail info@hirose.de Hirose Electric UK, Ltd Crownhill Business Centre 22 Vincent Avenue, Crownhill Milton Keynes, MK8 OAB Great Britain Phone: +44-1908-305400 Fax: +44-1908-305401 Hirose Electric Co., Ltd. 5-23, Osaki 5 Chome, Shinagawa-Ku Tokyo 141 Japan Phone: +81-03-3491-9741 Fax: +81-03-3493-2933 Hirose Electric Co., Ltd. European Branche First class Building 4F Beechavenue 46 1119PV Schiphol-Rijk Netherlands Phone: +31-20-6557-460 Fax: +31-20-6557-469
MC75 Hardware Interface Description Strictly confidential / Draft s MC75_V00.190a Page 86 of 91 15.02.2005 9.2 Fasteners and Fixings for Electronic Equipment This section provides a list of suppliers and manufacturers offering fasteners and fixings for electronic equipment and PCB mounting. The content of this section is designed to offer basic guidance to various mounting solutions with no warranty on the accuracy and sufficiency of the information supplied. Please note that the list remains preliminary although it is going to be updated in later versions of this document. 9.2.1 Fasteners from German Supplier ETTINGER GmbH Sales contact: ETTINGER GmbH http://www.ettinger.de/main.cfm Phone: +4981 04 66 23 – 0 Fax: +4981 04 66 23 – 0 The following tables contain only article numbers and basic parameters of the listed components. For further detail and ordering information please contact Ettinger GmbH. Please note that some of the listed screws, spacers and nuts are delivered with the DSB75 Support Board. See comments below. Article number: 05.71.038 Spacer - Aluminum / Wall thickness = 0.8mm Length 3.0 mm Material AlMgSi-0,5 For internal diameter M2=2.0-2.3 Internal diameter d = 2.4 mm External diameter 4.0 mm Vogt AG No. x40030080.10
MC75 Hardware Interface Description Strictly confidential / Draft s MC75_V00.190a Page 87 of 91 15.02.2005 Article number: 07.51.403 Insulating Spacer for M2 Self-gripping *) Length 3.0 mm Material Polyamide 6.6 Surface Black Internal diameter 2.2 mm External diameter 4.0 mm Flammability rating UL94-HB *) 2 spacers are delivered with DSB75 Support Board Article number: 05.11.209 Threaded Stud M2.5 - M2 Type E / External thread at both ends Length 3.0 mm Material Stainless steel X12CrMoS17 Thread 1 / Length M2.5 / 6.0 mm Thread 2 / Length M2 / 8.0 mm Width across flats 5 Recess yes Type External / External
MC75 Hardware Interface Description Strictly confidential / Draft s MC75_V00.190a Page 88 of 91 15.02.2005 Article number: 01.14.131 Screw M2 *) DIN 84 - ISO 1207 Length 8.0 mm Material Steel 4.8 Surface Zinced A2K Thread M2 Head diameter D = 3.8 mm Head height 1.30 mm Type Slotted cheese head screw *) 2 screws are delivered with DSB75 Support Board Article number: 01.14.141 Screw M2 DIN 84 - ISO 1207 Length 10.0 mm Material Steel 4.8 Surface Zinced A2K Thread M2 Head diameter D = 3.8 mm Head height 1.30 mm Type Slotted cheese head screw
MC75 Hardware Interface Description Strictly confidential / Draft s MC75_V00.190a Page 89 of 91 15.02.2005 Article number: 02.10.011 Hexagon Nut *) DIN 934 - ISO 4032 Material Steel 4.8 Surface Zinced A2K Thread M2 Wrench size / Ø 4 Thickness / L 1.6 mm Type Nut DIN/UNC, DIN934 *) 2 nuts are delivered with DSB75 Support Board 9.3 Data Sheets of Recommended Batteries The following two data sheets have been provided by VARTA Microbattery GmbH. Click here for sales contacts and further information: http://www.varta-microbattery.com
MC75 Hardware Interface Description Strictly confidential / Draft s MC75_V00.190a Page 90 of 91 15.02.2005 Figure 41: Lithium Ion battery from VARTA
MC75 Hardware Interface Description Strictly confidential / Draft s MC75_V00.190a Page 91 of 91 15.02.2005 Figure 42: Lithium Polymer battery from VARTA

Navigation menu