Symbol Technologies MC7596 EDA (Enterprise Digital Assistant) User Manual HC25 Hardware Interface Overview

Symbol Technologies Inc EDA (Enterprise Digital Assistant) HC25 Hardware Interface Overview

Contents

WWAN module manual

sHC25 Siemens Cellular EngineVersion: 00.220DocId: HC25_HO_v00.220 Hardware Interface Overview
General NotesProduct is deemed accepted by Recipient and is provided without interface to Recipient´s products. TheProduct constitutes pre-release version and code and may be changed substantially before commercialrelease. The Product is provided on an “as is” basis only and may contain deficiencies or inadequacies.The Product is provided without warranty of any kind, express or implied. To the maximum extent per-mitted by applicable law, Siemens further disclaims all warranties, including without limitation anyimplied warranties of merchantability, fitness for a particular purpose and noninfringement of third-partyrights. The entire risk arising out of the use or performance of the Product and documentation remainswith Recipient. This Product is not intended for use in life support appliances, devices or systems wherea malfunction of the product can reasonably be expected to result in personal injury. Applications incor-porating the described product must be designed to be in accordance with the technical specificationsprovided in these guidelines. Failure to comply with any of the required procedures can result in malfunc-tions or serious discrepancies in results. Furthermore, all safety instructions regarding the use of mobiletechnical systems, including GSM products, which also apply to cellular phones must be followed. Sie-mens AG customers using or selling this product for use in any applications do so at their own risk andagree to fully indemnify Siemens for any damages resulting from illegal use or resale. To the maximumextent permitted by applicable law, in no event shall Siemens or its suppliers be liable for any conse-quential, incidental, direct, indirect, punitive or other damages whatsoever (including, without limitation,damages for loss of business profits, business interruption, loss of business information or data, or otherpecuniary loss) arising out the use of or inability to use the Product, even if Siemens has been advisedof the possibility of such damages. Subject to change without notice at any time.CopyrightTransmittal, reproduction, dissemination and/or editing of this document as well as utilization of its con-tents and communication thereof to others without express authorization are prohibited. Offenders willbe held liable for payment of damages. All rights created by patent grant or registration of a utility modelor design patent are reserved.Copyright © Siemens AG 2007HC25_HO_v00.220 Page 2 of 39 2007-03-20Confidential / PreliminaryHC25 Hardware Interface Overview2sDocument Name: HC25 Hardware Interface Overview Version: 00.220Date: 2007-03-20DocId: HC25_HO_v00.220Status: Confidential / PreliminarySupported Products: HC25
HC25 Hardware Interface Overview Contents39sHC25_HO_v00.220 Page 3 of 39 2007-03-20Confidential / PreliminaryContents1 Introduction ................................................................................................................. 61.1 Related Documents ........................................................................................... 61.2 Terms and Abbreviations................................................................................... 61.3 Regulatory and Type Approval Information ....................................................... 91.3.1 Directives and Standards...................................................................... 91.4 SAR requirements specific to portable mobiles ............................................... 111.4.1 SELV Requirements ........................................................................... 111.5 Safety Precautions........................................................................................... 122 Product Concept ....................................................................................................... 132.1 Key Features at a Glance ................................................................................ 133 Application Interface................................................................................................. 163.1 Operating Modes ............................................................................................. 164 Antenna Interface...................................................................................................... 174.1 Antenna Installation ......................................................................................... 174.2 Antenna Pad .................................................................................................... 184.3 Antenna Connector.......................................................................................... 195 Electrical, Reliability and Radio Characteristics.................................................... 235.1 Absolute Maximum Ratings ............................................................................. 235.2 Operating Temperatures.................................................................................. 245.3 Storage Conditions .......................................................................................... 255.4 Reliability Characteristics................................................................................. 266 Mechanics.................................................................................................................. 276.1 Mechanical Dimensions of HC25..................................................................... 276.2 Mounting HC25 to the Application Platform..................................................... 296.3 Board-to-Board Application Connector ............................................................ 297 Reference Approval .................................................................................................. 317.1 Reference Equipment for Type Approval......................................................... 317.2 Compliance with FCC Rules and Regulations................................................. 328 Appendix.................................................................................................................... 338.1 List of Parts and Accessories........................................................................... 338.2 Fasteners and Fixings for Electronic Equipment ............................................. 358.2.1 Fasteners from German Supplier ETTINGER GmbH......................... 358.3 Mounting Advice Sheet.................................................................................... 38
HC25 Hardware Interface Overview Tables4sHC25_HO_v00.220 Page 4 of 39 2007-03-20Confidential / PreliminaryTablesTable 1: Directives ......................................................................................................... 9Table 2: Standards of North American type approval .................................................... 9Table 3: Standards of European type approval.............................................................. 9Table 4: Requirements of quality ................................................................................. 10Table 5: Overview of operating modes ........................................................................ 16Table 6: Return loss in the active band........................................................................ 17Table 7: Product specifications of U.FL-R-SMT connector.......................................... 19Table 8: Material and finish of U.FL-R-SMT connector and recommended plugs ....... 20Table 9: Ordering information for Hirose U.FL Series.................................................. 22Table 10: Absolute maximum ratings............................................................................. 23Table 11: Board temperature......................................................................................... 24Table 12: Sample operating conditions without forced air circulation (according to IEC 60068-2)............................................................................ 24Table 13: Sample operating conditions with forced air circulation (air speed 0.9m/s) ... 24Table 14: Storage conditions ......................................................................................... 25Table 15: Summary of reliability test conditions............................................................. 26Table 16: Electrical and mechanical characteristics of the board-to-board connector... 29Table 17: List of parts and accessories.......................................................................... 33Table 18: Molex sales contacts (subject to change)...................................................... 34Table 19: Hirose sales contacts (subject to change) ..................................................... 34
HC25 Hardware Interface Overview Figures5HC25_HO_v00.220 Page 5 of 39 2007-03-20Confidential / PreliminarysFiguresFigure 1: Restricted area around antenna pad (side and bottom view) ......................... 18Figure 2: Mechanical dimensions of U.FL-R-SMT connector......................................... 19Figure 3: U.FL-R-SMT connector with U.FL-LP-040 plug.............................................. 20Figure 4: U.FL-R-SMT connector with U.FL-LP-066 plug.............................................. 20Figure 5: Specifications of U.FL-LP-(V)-040(01) plug .................................................... 21Figure 6: HC25 – Top and bottom view.......................................................................... 27Figure 7: Dimensions of HC25 (all dimensions in mm) .................................................. 28Figure 8: Mechanical dimensions of the board-to-board connector ............................... 30Figure 9: Reference equipment for Type Approval ........................................................ 31
HC25 Hardware Interface Overview1 Introduction12sHC25_HO_v00.220 Page 6 of 39 2007-03-20Confidential / Preliminary1 IntroductionThis document describes the hardware of the Siemens HC25 module that connects to the cel-lular device application and the air interface. It helps you quickly retrieve interface specifica-tions, electrical and mechanical details and information on the requirements to be consideredfor integrating further components. 1.1 Related Documents[1] HC25 AT Command Set 00.220[2] HC25 Release Notes 00.2201.2 Terms and AbbreviationsAbbreviation DescriptionANSI American National Standards InstituteAMR Adaptive MultirateARP Antenna Reference PointB2B Board-to-board connectorBB BasebandBEP Bit Error ProbabilityBTS Base Transceiver StationCB or CBM Cell Broadcast MessageCE Conformité Européene (European Conformity)CS Coding SchemeCS Circuit SwitchedCSD Circuit Switched DataDAC Digital-to-Analog ConverterdBm0 Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-lawDCS Digital Cellular SystemDL DownloadDRX Discontinuous ReceptionDSB Development Support BoardDSP Digital Signal ProcessorDTMF Dual Tone Multi FrequencyDTX Discontinuous TransmissionEDGE Enhanced Data rates for GSM EvolutionEFR Enhanced Full RateEGSM Enhanced GSM
HC25 Hardware Interface Overview1.2 Terms and Abbreviations12sHC25_HO_v00.220 Page 7 of 39 2007-03-20Confidential / PreliminaryEMC Electromagnetic CompatibilityERP Effective Radiated PowerESD Electrostatic DischargeETS European Telecommunication StandardETSI European Telecommunications Standards InstituteFCC Federal Communications Commission (U.S.)FDD Frequency Division DuplexFDMA Frequency Division Multiple AccessFR Full RateGPRS General Packet Radio ServiceGSM Global Standard for Mobile CommunicationsHiZ High ImpedanceHSDPA High Speed Downlink Packed AccessHR Half RateI/O Input/OutputIF Intermediate FrequencyIMEI International Mobile Equipment IdentityISO International Standards OrganizationITU International Telecommunications Unionkbps kbits per secondLED Light Emitting DiodeMbps Mbits per secondMCS Modulation and Coding SchemeMO Mobile OriginatedMS Mobile Station, also referred to as TEMT Mobile TerminatedNTC Negative Temperature CoefficientPBCCH Packet Switched Broadcast Control ChannelPCB Printed Circuit BoardPCL Power Control LevelPCM Pulse Code ModulationPCS Personal Communication System, also referred to as GSM 1900PS Packet SwitchedPDU Protocol Data UnitPSK Phase Shift KeyingR&TTE Radio and Telecommunication Terminal EquipmentAbbreviation Description
HC25 Hardware Interface Overview1.2 Terms and Abbreviations12sHC25_HO_v00.220 Page 8 of 39 2007-03-20Confidential / PreliminaryRACH Random Access ChannelRF Radio FrequencyRTC Real Time ClockRx Receive DirectionSAR Specific Absorption RateSELV Safety Extra Low VoltageSIM Subscriber Identification ModuleSLIC Subscriber Line Interface Circuit SMS Short Message ServiceSRAM Static Random Access MemorySRB Signalling Radio BearerTA Terminal adapter (e.g. GSM engine)TDMA Time Division Multiple AccessTE Terminal EquipmentTS Technical SpecificationTx Transmit DirectionUL UploadUMTS Universal Mobile Telecommunications SystemURC Unsolicited Result CodeUSB Universal Serial BusUICC USIM Integrated Circuit CardUSIM UMTS Subscriber Identification ModuleWCDMA Wideband Code Division Multiple AccessAbbreviation Description
HC25 Hardware Interface Overview1.3 Regulatory and Type Approval Information12sHC25_HO_v00.220 Page 9 of 39 2007-03-20Confidential / Preliminary1.3 Regulatory and Type Approval Information1.3.1 Directives and StandardsHC25 has been designed to comply with the directives and standards listed below.Table 1: Directives99/05/EC Directive of the European Parliament and of the council of 9 March 1999 on radio equipment and telecommunications terminal equipment and the mutual recognition of their conformity (in short referred to as R&TTE Direc-tive 1999/5/EC).The product is labeled with the CE conformity mark 2002/95/EC Directive of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equip-ment (RoHS)Table 2: Standards of North American type approvalCFR Title 47 Code of Federal Regulations, Part 22 and Part 24 (Telecommunications, PCS); US Equipment Authorization FCCUL 60 950 Product Safety Certification (Safety requirements) NAPRD.03 V3.9.1 Overview of PCS Type certification review board Mobile Equipment Type Certification and IMEI controlPCS Type Certification Review board (PTCRB)RSS132, RSS133 Canadian StandardTable 3: Standards of European type approval3GPP TS 51.010-1 Digital cellular telecommunications system (Release 5); Mobile Station (MS) conformance specificationETSI EN 301 511 V9.0.2 Candidate Harmonized European Standard (Telecommunications series) Global System for Mobile communications (GSM); Harmonized standard for mobile stations in the GSM 900 and DCS 1800 bands covering essen-tial requirements under article 3.2 of the R&TTE directive (1999/5/EC) (GSM 13.11 version 7.0.1 Release 1998)GCF-CC V3.23.1 Global Certification Forum - Certification CriteriaETSI EN 301 489-1 V1.4.1 Candidate Harmonized European Standard (Telecommunications series) Electro Magnetic Compatibility and Radio spectrum Matters (ERM); Elec-tro Magnetic Compatibility (EMC) standard for radio equipment and ser-vices; Part 1: Common Technical RequirementsETSI EN 301 489-7 V1.2.1 (2000-09) Candidate Harmonized European Standard (Telecommunications series) Electro Magnetic Compatibility and Radio spectrum Matters (ERM); Elec-tro Magnetic Compatibility (EMC) standard for radio equipment and ser-vices; Part 7: Specific conditions for mobile and portable radio and ancillary equipment of digital cellular radio telecommunications systems (GSM and DCS)IEC/EN 60950-1 (2001) Safety of information technology equipment (2000)
HC25 Hardware Interface Overview1.3 Regulatory and Type Approval Information12sHC25_HO_v00.220 Page 10 of 39 2007-03-20Confidential / PreliminaryEN 301 489-24 V1.2.1 Electromagnetic compatibility and Radio Spectrum Matters (ERM); Elec-tromagnetic Compatibility (EMC) standard for radio equipment and ser-vices; Part 24: Specific conditions for IMT-2000 CDMA Direct Spread (UTRA) for Mobile and portable (UE) radio and ancillary equipmentEN 301 908-01 V2.2.1 Electromagnetic compatibility and Radio spectrum Matters (ERM); Base Stations (BS) and User Equipment (UE) for IMT-2000 Third Generation cellular networks; Part 1: Harmonized EN for IMT-2000, introduction and common requirements of article 3.2 of the R&TTE DirectiveEN 301 908-02 V2.2.1 Electromagnetic compatibility and Radio spectrum Matters (ERM); Base Stations (BS) and User Equipment (UE) for IMT-2000 Third Generation cellular networks; Part 2: Harmonized EN for IMT-2000, CDMA Direct Spread (UTRA FDD) (UE) covering essential requirements of article 3.2 of the R&TTE Directive3GPP TS 34.124 Electromagnetic Compatibility (EMC) for mobile terminals and ancillary equipment.3GPP TS 34.121 Technical Specification Group Radio Access Network; Terminal conform-ance specification; Radio transmission and reception (FDD)3GPP TS 34.123-1 User Equipment (UE) conformance specification; Part 1: Protocol con-formance specification.3GPP TS 34.123-3 User Equipment (UE) conformance specification; Part 3: Abstract Test Suites.Table 4: Requirements of qualityIEC 60068 Environmental testingDIN EN 60529 IP codesTable 3: Standards of European type approval
HC25 Hardware Interface Overview1.4 SAR requirements specific to portable mobiles12sHC25_HO_v00.220 Page 11 of 39 2007-03-20Confidential / Preliminary1.4 SAR requirements specific to portable mobilesMobile phones, PDAs or other portable transmitters and receivers incorporating a GSM modulemust be in accordance with the guidelines for human exposure to radio frequency energy. Thisrequires the Specific Absorption Rate (SAR) of portable HC25 based applications to be evalu-ated and approved for compliance with national and/or international regulations. Since the SAR value varies significantly with the individual product design manufacturers areadvised to submit their product for approval if designed for portable use. For European and USmarkets the relevant directives are mentioned below. It is the responsibility of the manufacturerof the final product to verify whether or not further standards, recommendations or directivesare in force outside these areas. Products intended for sale on US marketsES 59005/ANSI C95.1Considerations for evaluation of human exposure to ElectromagneticFields (EMFs) from Mobile Telecommunication Equipment (MTE) in the frequency range 30MHz - 6GHz Products intended for sale on European marketsEN 50360 Product standard to demonstrate the compliance of mobile phones withthe basic restrictions related to human exposure to electromagneticfields (300MHz - 3GHz)IMPORTANT:Manufacturers of portable applications based on HC25 modules are required to have their finalproduct certified and apply for their own FCC Grant and Industry Canada Certificate related tothe specific portable mobile. See also Section 7.2.1.4.1 SELV RequirementsThe power supply connected to the HC25 module shall be in compliance with the SELVrequirements defined in EN 60950-1.
HC25 Hardware Interface Overview1.5 Safety Precautions12sHC25_HO_v00.220 Page 12 of 39 2007-03-20Confidential / Preliminary1.5 Safety PrecautionsThe following safety precautions must be observed during all phases of the operation, usage,service or repair of any cellular terminal or mobile incorporating HC25. Manufacturers of thecellular terminal are advised to convey the following safety information to users and operatingpersonnel and to incorporate these guidelines into all manuals supplied with the product. Fail-ure to comply with these precautions violates safety standards of design, manufacture andintended use of the product. Siemens AG assumes no liability for customer’s failure to complywith these precautions.When in a hospital or other health care facility, observe the restrictions on the use of mobiles. Switch the cellular terminal or mobile off, if instructed to do so by the guide-lines posted in sensitive areas. Medical equipment may be sensitive to RF energy.The operation of cardiac pacemakers, other implanted medical equipment and hearing aids can be affected by interference from cellular terminals or mobiles placed close to the device. If in doubt about potential danger, contact the physician or the manufac-turer of the device to verify that the equipment is properly shielded. Pacemaker patients are advised to keep their hand-held mobile away from the pacemaker, while it is on. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it can-not be switched on inadvertently. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communications systems. Failure to observe these instructions may lead to the suspension or denial of cellular services to the offender, legal action, or both.Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any electri-cal equipment in potentially explosive atmospheres can constitute a safety hazard.Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. Remember that interference can occur if it is used close to TV sets, radios, computers or inadequately shielded equipment. Follow any special regulations and always switch off the cellular terminal or mobile wherever forbidden, or when you suspect that it may cause interference or danger.Road safety comes first! Do not use a hand-held cellular terminal or mobile when driv-ing a vehicle, unless it is securely mounted in a holder for speakerphone operation. Before making a call with a hand-held terminal or mobile, park the vehicle. Speakerphones must be installed by qualified personnel. Faulty installation or opera-tion can constitute a safety hazard.IMPORTANT!Cellular terminals or mobiles operate using radio signals and cellular networks. Because of this, connection cannot be guaranteed at all times under all conditions. Therefore, you should never rely solely upon any wireless device for essential com-munications, for example emergency calls. Remember, in order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Some networks do not allow for emergency calls if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may need to deactivate those features before you can make an emergency call.Some networks require that a valid SIM card be properly inserted in the cellular termi-nal or mobile.
HC25 Hardware Interface Overview2 Product Concept15sHC25_HO_v00.220 Page 13 of 39 2007-03-20Confidential / Preliminary2 Product Concept2.1 Key Features at a GlanceFeature ImplementationGeneralFrequency bands UMTS/HSDPA: Triple band, 850//1900/2100MHzGSM/GPRS/EDGE: Quad band, 850/900/1800/1900MHzGSM class Small MSOutput power(according to Release 99)Class 4 (+33dBm ±2dB) for EGSM850Class 4 (+33dBm ±2dB) for EGSM900Class 1 (+30dBm ±2dB) for GSM1800Class 1 (+30dBm ±2dB) for GSM1900Class E2 (+27dBm ± 3dB) for GSM 850 8-PSKClass E2 (+27dBm ± 3dB) for GSM 900 8-PSKClass E2 (+26dBm +3 /-4dB) for GSM 1800 8-PSKClass E2 (+26dBm +3 /-4dB) for GSM 1900 8-PSKClass 3 (+24dBm +1/-3dB) for UMTS 2100, WCDMA FDD BdIClass 3 (+24dBm +1/-3dB) for UMTS 1900,WCDMA FDD BdIIClass 3 (+24dBm +1/-3dB) for UMTS 850, WCDMA FDD BdVPower supply 3.2V < VBATT+ < 4.2VPhysical Dimensions: 50mm x 34mm x 4.5mmWeight: approx. 10gRoHS All hardware components fully compliant with EU RoHS DirectiveHSDPA features3GPP Release 5 3.6 Mbps, UL 384 kbpsUE CAT. [1-6], 11, 12 supportedCompressed mode (CM) supported according to 3GPP TS25.212UMTS featuresRelease 99, June 2004, W-CDMA FDD standard PS data rate – 384 kbps DL / 384 kbps ULCS data rate – 64 kbps DL / 64 kbps UL
HC25 Hardware Interface Overview2.1 Key Features at a Glance15sHC25_HO_v00.220 Page 14 of 39 2007-03-20Confidential / PreliminaryGSM / GPRS / EGPRS featuresData transfer GPRS• Multislot Class 10• Full PBCCH support• Mobile Station Class B• Coding Scheme 1 – 4EGPRS• Multislot Class 10• EDGE E2 power class for 8 PSK• Downlink coding schemes – CS 1-4, MCS 1-9• Uplink coding schemes – CS 1-4, MCS 1-9• BEP reporting• SRB loopback and test mode B• 8-bit, 11-bit RACH• PBCCH support• 1 phase/2 phase access procedures• Link adaptation and IR• NACC, extended UL TBF• Mobile Station Class BCSD• V.110, RLP, non-transparent• 9.6 kbpsSMS Point-to-point MT and MOCell broadcastText and PDU modeFax Group 3; Class 1Audio Audio speech codecsGSM: AMR, EFR, FR, HR3GPP: AMROne ringing melody supportedCEPT supervisory tones supportedDTMF supported6 audio modes: Approval, Router, Handset, Headset, Speakerphone and Transparent modeTTY support selecting a dedicated audio modeDownload of audio parametersGains and volumes can be controlled by AT commandsSeveral additional ringing melodiesCEPT and ANSI supervisory tones supportedSoftwareAT commands AT-Hayes GSM 07.05 and 07.07, SiemensAT commands for RIL compatibility (NDIS/RIL)MicrosoftTM compatibility RIL / NDIS for Windows MobileTM SIM Application Toolkit SAT Class CFirmware update Firmware update from host application over USB.Feature Implementation
HC25 Hardware Interface Overview2.1 Key Features at a Glance15sHC25_HO_v00.220 Page 15 of 39 2007-03-20Confidential / PreliminaryInterfacesUSB Supports a USB 2.0 Full Speed (12Mbit/s) device interface. Wakeup Control Signal pin to wake up an inactive USB Host into an active state.Status Signal pins to indicate network connectivity status.Audio 1 analog interfaceUICC interface Supported chip cards: SIM / UICC 3V, 1.8VAntenna 50Ohms. External antenna can be connected via antenna connector or antenna pad (spring contact).Module interface 50-pin board-to-board connectorPower on/off, ResetPower on/off Switch-on by hardware pin IGTSwitch-off by hardware pin IGTSwitch-off by AT command Reset Orderly shutdown and reset by AT commandEmergency off by hardware pin EMERG_OFF and restart with hardware pin IGTEmergency off Emergency off by hardware pin EMERG_OFFEvaluation kitDSB DSB75 Evaluation Board designed to test and type approve Siemens cel-lular engines and provide a sample configuration for application engineer-ing. A special adapter is required to connect the module to the DSB75.Feature Implementation
HC25 Hardware Interface Overview3 Application Interface16sHC25_HO_v00.220 Page 16 of 39 2007-03-20Confidential / Preliminary3 Application InterfaceHC25 is equipped with a 50-pin board-to-board connector that connects to the external appli-cation and incorporates several sub-interfaces: power supply, USB interface, UICC/SIM inter-face, analog audio interface, as well as various status and control lines (see also Chapter 2).3.1 Operating ModesThe table below briefly summarizes the various operating modes referred to in the followingchapters. Table 5: Overview of operating modesMode FunctionNormal operation GSM / GPRS / UMTS / HSDPA SLEEPPower saving mode set automatically when no call is in progress and the USB connection is suspended by host or not present. GSM IDLE Software is active. Once registered to the GSM network, paging with BTS is carried out in order to achieve synchrony with the GSM network. The repetition rate depends on the parameter BSPA_Multiframe. The module is ready to send and receive.GSM TALK/GSM DATA Connection between two subscribers is in progress. Power consump-tion depends on the GSM network coverage and several connection settings (e.g. DTX off/on, FR/EFR/HR, hopping sequences and antenna connection). The following applies when power is to be mea-sured in TALK_GSM mode: DTX off, FR and no frequency hopping, otherwise same as for IDLE measurements.GPRS IDLE Module is attached and ready for GPRS data transfer, but no data is currently sent or received.GPRS DATA GPRS data transfer in progress. Power consumption depends on net-work settings (e.g. power control level), uplink / downlink data rates and GPRS configuration (e.g. used multislot settings).EGPRS DATA EGPRS data transfer in progress. Power consumption depends on net-work settings (e.g. power control level), uplink / downlink data rates and EGPRS configuration (e.g. used multislot settings).UMTS / HSDPA IDLE Module is attached and ready for UMTS / HSDPA data transfer, but no data is currently sent or received.UMTS TALK/UMTS DATA UMTS data transfer in progress. Power consumption depends on net-work settings (e.g. TPC Pattern) and data transfer rate.HSDPA DATA HSDPA data transfer in progress. Power consumption depends on net-work settings (e.g. TPC Pattern) and data transfer rate.Power Down The internal power section is shut down. The SW on the module is not active. The interfaces are not accessible.
HC25 Hardware Interface Overview4 Antenna Interface22sHC25_HO_v00.220 Page 17 of 39 2007-03-20Confidential / Preliminary4 Antenna InterfaceThe RF interface has an impedance of 50Ω. HC25 is capable of sustaining a total mismatch atthe antenna connector or pad without any damage, even when transmitting at maximum RFpower. The external antenna must be matched properly to achieve best performance regarding radi-ated power, DC-power consumption, modulation accuracy and harmonic suppression.Antenna matching networks are not included on the HC25 PCB and should be placed in thehost application. Regarding the return loss HC25 provides the following values in the active band:The connection of the antenna or other equipment must be decoupled from DC voltage. Thisis necessary because the antenna connector is DC coupled to ground via an inductor for ESDprotection. Note: The antenna must be isolated for ESD protection (to withstand a voltage resistance upto 8kV air discharge).4.1 Antenna InstallationTo suit the physical design of individual applications HC25 offers two alternative approachesto connecting the antenna: • Recommended approach: U.FL-R-SMT antenna connector from Hirose assembled on thetop side of the PCB. See Section 4.3 for connector details.• Antenna pad and grounding plane placed on the bottom side. See Section 4.2.The U.FL-R-SMT connector has been chosen as antenna reference point (ARP) for the Sie-mens reference equipment submitted to type approve HC25. All RF data specified throughoutthis manual are related to the ARP. IMPORTANT: Both solutions can only be applied alternatively. This means, whenever anantenna is plugged to the Hirose connector, the pad must not be used. Vice versa, if theantenna is connected to the pad, then the Hirose connector must be left empty. Table 6: Return loss in the active bandState of module Return loss of module Recommended return loss of applicationReceive > 8dB > 12dB Transmit not applicable > 12dB Idle < 5dB not applicable
HC25 Hardware Interface Overview4.2 Antenna Pad22sHC25_HO_v00.220 Page 18 of 39 2007-03-20Confidential / PreliminaryNo matter which option you choose, ensure that the antenna pad does not come into contactwith the holding device or any other components of the host application. It needs to be sur-rounded by a restricted area filled with air, which must also be reserved 1.4mm in height.Figure 1: Restricted area around antenna pad (side and bottom view)4.2 Antenna PadThe antenna can be attached via contact springs.If you decide to use the antenna pad take into account that the pad has not been intended asantenna reference point (ARP) for the Siemens HC25 type approval. The antenna pad is pro-vided only as an alternative option which can be used, for example, if the recommended Hiroseconnection does not fit into your antenna design. Also, consider that according to the GSM recommendations TS 45.005 and TS 51.010-01 a50Ω connector is mandatory for type approval measurements. This requires GSM devices withan integral antenna to be temporarily equipped with a suitable connector or a low loss RF cablewith adapter. HC25 material properties:HC25 PCB: FR4Antenna pad: Gold plated pad
HC25 Hardware Interface Overview4.3 Antenna Connector22sHC25_HO_v00.220 Page 19 of 39 2007-03-20Confidential / Preliminary4.3 Antenna Connector HC25 uses an ultra-miniature SMT antenna connector supplied from Hirose Ltd. The productname is:• U.FL-R-SMTFigure 2: Mechanical dimensions of U.FL-R-SMT connector Table 7: Product specifications of U.FL-R-SMT connectorItem Specification ConditionsRatingsNominal impedance 50ΩOperating temp:-40°C to + 90°COperating humidity: max. 90%Rated frequency DC to 3GHzMechanical characteristicsFemale contact holding force 0.15N min Measured with a Ø 0.475 pin gaugeRepetitive operation Contact resistance:Center 25mΩ Outside 15mΩ30 cycles of insertion and disengage-mentVibration No momentary disconnections of 1µs;No damage, cracks and looseness of partsFrequency of 10 to 100Hz, single amplitude of 1.5mm, acceleration of 59m/s2, for 5 cycles in the direction of each of the 3 axesShock No momentary disconnections of 1µs.No damage, cracks and looseness of parts.Acceleration of 735m/s2, 11ms duration for 6 cycles in the direction of each of the 3 axesEnvironmental characteristicsHumidity resistance No damage, cracks and looseness of parts.Insulation resistance: 100MΩ min. at high humidity500MΩ min. when dryExposure to 40°C, humidity of 95% for a total of 96 hours
HC25 Hardware Interface Overview4.3 Antenna Connector22sHC25_HO_v00.220 Page 20 of 39 2007-03-20Confidential / PreliminaryMating plugs and cables can be chosen from the Hirose U.FL Series. Examples are shownbelow and listed in Table 9. For latest product information please contact your Hirose dealer orvisit the Hirose home page, for example http://www.hirose.com. Figure 3: U.FL-R-SMT connector with U.FL-LP-040 plugFigure 4: U.FL-R-SMT connector with U.FL-LP-066 plugTemperature cycle No damage, cracks and looseness of parts.Contact resistance:Center 25mΩ Outside 15mΩTemperature: +40°C → 5 to 35°C → +90°C → 5 to 35°CTime: 30min → within 5min → 30min within 5minSalt spray test No excessive corrosion 48 hours continuous exposure to 5% salt waterTable 8: Material and finish of U.FL-R-SMT connector and recommended plugsPart Material FinishShell Phosphor bronze Silver platingMale center contact Brass Gold platingFemale center con-tact Phosphor bronze Gold platingInsulator Plug: PBTReceptacle: LCP BlackBeigeTable 7: Product specifications of U.FL-R-SMT connectorItem Specification Conditions
HC25 Hardware Interface Overview4.3 Antenna Connector22sHC25_HO_v00.220 Page 21 of 39 2007-03-20Confidential / PreliminaryIn addition to the connectors illustrated above, the U.FL-LP-(V)-040(01) version is offered asan extremely space saving solution. This plug is intended for use with extra fine cable (up toØ 0.81mm) and minimizes the mating height to 2mm. See Figure 5 which shows the Hirosedatasheet.Figure 5: Specifications of U.FL-LP-(V)-040(01) plug
HC25 Hardware Interface Overview4.3 Antenna Connector22sHC25_HO_v00.220 Page 22 of 39 2007-03-20Confidential / PreliminaryTable 9: Ordering information for Hirose U.FL SeriesItem Part number HRS numberConnector on HC25 U.FL-R-SMT CL331-0471-0-10Right-angle plug shell for Ø 0.81mm cable U.FL-LP-040 CL331-0451-2Right-angle plug for Ø 0.81mm cable U.FL-LP(V)-040 (01) CL331-053-8-01Right-angle plug for Ø 1.13mm cable U.FL-LP-068 CL331-0452-5Right-angle plug for Ø 1.32mm cable U.FL-LP-066 CL331-0452-5Extraction jig E.FL-LP-N CL331-04441-9
HC25 Hardware Interface Overview5 Electrical, Reliability and Radio Characteristics26sHC25_HO_v00.220 Page 23 of 39 2007-03-20Confidential / Preliminary5 Electrical, Reliability and Radio Characteristics5.1 Absolute Maximum RatingsThe absolute maximum ratings stated in Table 10 are stress ratings under any conditions.Stresses beyond any of these limits will cause permanent damage to HC25.Table 10: Absolute maximum ratingsParameter Min Max UnitSupply voltage BATT+ -0.3 4.5 VVoltage at digital pins in POWER DOWN mode -0.3 0.3 VVoltage at digital pins in normal operation -0.3 2.8 VVoltage at analog pins in POWER DOWN mode -0.3 0.3 VVoltage at analog pins in normal operation -0.3 2.5 VVoltage at STATSUSx pins -0.5 7.5 VVUSB -0.3 7.5 VUSB_DP, USB_DN -0.3 7.5 VPWR_IND -0.3 10 VVDDLP -0.3 3.25 V
HC25 Hardware Interface Overview5.2 Operating Temperatures26sHC25_HO_v00.220 Page 24 of 39 2007-03-20Confidential / Preliminary5.2 Operating TemperaturesThe values stated below are in compliance with GSM recommendation TS 51.010-01.Table 11 shows the temperatures for automatic shutdown as measured by the on-board mea-suring element NTC. The maximum allowable ambient temperature that causes the module toshut down depends on various conditions. The following tables Table 12 and Table 13 showsample lab environment conditions. Please be aware that the operating duration and the max-imum ambient temperature will vary significantly for your application.Note: Generally it is strongly recommended to implement additional measures to lead the heatout of the application, especially at maximum transmission power levels of WCDMA (24dBm),e.g. use of ground area for a heat sink or convection (see Section 6.1 for the ground area thatmay be used for a heat sink).Table 11: Board temperatureParameter Min Typ Max UnitOperating temperature range -20 +25 +85 °CAutomatic shutdown1Temperature measured on HC25 board1. Due to temperature measurement uncertainty, a tolerance on the stated shutdown thresholds may occur. The possible deviation is in the range of ± 3°C at the overtemperature limit and ± 5°C at the undertem-perature limit.< -30 --- >+85 °CTable 12: Sample operating conditions without forced air circulation (according to IEC 60068-2)Mode Ambient Temperature Voltage RF Power Operating DurationGSM,GPRS/EDGE Class 8 +65°C VBATT+ < 3.8V Max. ∞WCDMA +55°C VBATT+ < 3.4V < 10dBm ∞WCDMA +65°C VBATT+ < 3.4V < 0dBm ∞GRPS/EDGE Class10 +65°C VBATT+ < 3.8V Max. < 2minWCDMA +65°C VBATT+ < 3.8V Max. < 2minTable 13: Sample operating conditions with forced air circulation (air speed 0.9m/s)Mode AmbientTemperature Voltage RF Power Operating DurationGSM,GPRS/EDGE Class 8 +75°C VBATT+ < 3.8V Max. ∞WCDMA +60°C VBATT+ < 3.4V < 10dBm ∞WCDMA +70°C VBATT+ < 3.4V < 0dBm ∞GRPS/EDGE Class 10 +65°C VBATT+ < 3.8V Max. ∞WCDMA +60°C VBATT+ < 3.4V Max. ∞
HC25 Hardware Interface Overview5.3 Storage Conditions26sHC25_HO_v00.220 Page 25 of 39 2007-03-20Confidential / Preliminary5.3 Storage ConditionsThe conditions stated below are only valid for modules in their original packed state in weatherprotected, non-temperature-controlled storage locations. Normal storage time under theseconditions is 12 months maximum.Table 14: Storage conditionsType Condition Unit ReferenceAir temperature: LowHigh -40+85 °C ETS 300 019-2-1: T1.2, IEC 68-2-1 AbETS 300 019-2-1: T1.2, IEC 68-2-2 BbHumidity relative: LowHighCondens.1090 at 30°C90-100 at 30°C%---ETS 300 019-2-1: T1.2, IEC 68-2-56 CbETS 300 019-2-1: T1.2, IEC 68-2-30 DbAir pressure: LowHigh 70106 kPa IEC TR 60271-3-1: 1K4IEC TR 60271-3-1: 1K4Movement of surrounding air 1.0 m/s IEC TR 60271-3-1: 1K4Water: rain, dripping, icing and frosting Not allowed --- ---Radiation: SolarHeat 1120600 W/m2ETS 300 019-2-1: T1.2, IEC 68-2-2 BbETS 300 019-2-1: T1.2, IEC 68-2-2 BbChemically active substances Not recom-mended IEC TR 60271-3-1: 1C1LMechanically active substances Not recom-mended IEC TR 60271-3-1: 1S1Vibration sinusoidal:DisplacementAccelerationFrequency range1.552-9 9-200mmm/s2HzIEC TR 60271-3-1: 1M2Shocks:Shock spectrumDurationAccelerationsemi-sinusoidal150 msm/s2IEC 68-2-27 Ea
HC25 Hardware Interface Overview5.4 Reliability Characteristics26sHC25_HO_v00.220 Page 26 of 39 2007-03-20Confidential / Preliminary5.4 Reliability CharacteristicsThe test conditions stated below are an extract of the complete test specifications.Table 15: Summary of reliability test conditionsType of test Conditions StandardVibration Frequency range: 10-20Hz; acceleration: 3.1mm amplitudeFrequency range: 20-500Hz; acceleration: 5gDuration: 2h per axis = 10 cycles; 3 axesDIN IEC 68-2-6Shock half-sinus Acceleration: 500gShock duration: 1msec1 shock per axis6 positions (± x, y and z)DIN IEC 68-2-27Dry heat Temperature: +70 ±2×CTest duration: 16hHumidity in the test chamber: < 50%EN 60068-2-2 Bb ETS 300 019-2-7Temperature change (shock) Low temperature: -40×C ±2×CHigh temperature: +85×C ±2×CChangeover time: < 30s (dual chamber system)Test duration: 1hNumber of repetitions: 100DIN IEC 68-2-14 NaETS 300 019-2-7Damp heat cyclic High temperature: +55×C ±2×CLow temperature: +25×C ±2×CHumidity: 93% ±3%Number of repetitions: 6Test duration: 12h + 12hDIN IEC 68-2-30 DbETS 300 019-2-5Cold (constant exposure) Temperature: -40 ±2×CTest duration: 16h DIN IEC 68-2-1
HC25 Hardware Interface Overview6 Mechanics30sHC25_HO_v00.220 Page 27 of 39 2007-03-20Confidential / Preliminary6 Mechanics6.1 Mechanical Dimensions of HC25Length:50.00mmWidth: 34.00mmHeight:4.5mmFigure 6: HC25 – Top and bottom viewPin 1Pin 25Pin 50Pin 26GroundGround(for Heat Sink)GroundRF AntennaConnector
HC25 Hardware Interface Overview6.1 Mechanical Dimensions of HC2530sHC25_HO_v00.220 Page 28 of 39 2007-03-20Confidential / PreliminaryFigure 7: Dimensions of HC25 (all dimensions in mm)
HC25 Hardware Interface Overview6.2 Mounting HC25 to the Application Platform30sHC25_HO_v00.220 Page 29 of 39 2007-03-20Confidential / Preliminary6.2 Mounting HC25 to the Application PlatformThere are many ways to properly install HC25 in the host device. An efficient approach is tomount the HC25 PCB to a frame, plate, rack or chassis. Fasteners can be M2 screws plus suitable washers, circuit board spacers, or customizedscrews, clamps, or brackets. In addition, the board-to-board connection can also be utilized toachieve better support. To help you find appropriate spacers a list of selected screws and dis-tance sleeves for 3mm stacking height can be found in Section 8.2.When using the holes the screws can be inserted from top or bottom. For proper grounding it is strongly recommended to use the large ground plane on the bottomof board in addition to the five GND pins of the board-to-board connector. The ground planemay also be used to attach cooling elements, e.g. a heat sink or thermally conductive tape.Please take care that attached cooling elements do not touch the antenna pads on the mod-ule’s bottom side, as this may lead a short-circuit. To prevent mechanical damage, be careful not to force, bend or twist the module. Be sure it ispositioned flat against the host device (see also Section 8.3 with mounting advice sheet).6.3 Board-to-Board Application ConnectorThis section provides specifications for the 50-pin board-to-board (B2B) connector used to con-nect HC25 to the host application. For the module’s external interface the following connector series has been chosen: Supplier: Hirose ( www.hirose.com )Type: DF12C (3.0)-50DS-0.5V (SlimStack Receptacle)Height: 3.0 mmTable 16: Electrical and mechanical characteristics of the board-to-board connectorParameter Specification (50-way connector)Number of Contacts 50Quantity delivered 2000 Connectors per Tape & ReelVoltage 50VCurrent Rating 0.4A max per contactResistance 0.05 Ohm per contactDielectric Withstanding Voltage 150V RMS AC for 1minOperating Temperature -40°C...+85°CContact Material phosphor bronze finish: solder platingInsulator Material PPS, deep brown / Polyamide, beigeFFC/FPC Thickness 0.3mm ±0.05mm (0.012" ±0.002")Maximum connection cycles 20 (@ 50mOhm max)Cable FFC (Flat Flexible Cable), max. length 150mm from SIM interface
HC25 Hardware Interface Overview6.3 Board-to-Board Application Connector30sHC25_HO_v00.220 Page 30 of 39 2007-03-20Confidential / PreliminaryA recommended corresponding board-to-board connector series for external applications is:Supplier: Hirose ( www.hirose.com )Type: DF12x-50DP-0.5V (SlimStack Header)Height: 3.0 – 5.0 mmFor Hirose sales contacts see Chapter 8.Note: There is no inverse polarity protection for the board-to-board connector. It is thereforevery important that the board-to-board connector is connected correctly to the host application,i.e., pin1 must be connected to pin1, pin2 to pin 2, etc. Pin assignments are listed in Section5.5, pin locations are shown in Figure 6.Figure 8: Mechanical dimensions of the board-to-board connector
HC25 Hardware Interface Overview7 Reference Approval32sHC25_HO_v00.220 Page 31 of 39 2007-03-20Confidential / Preliminary7 Reference Approval7.1 Reference Equipment for Type ApprovalThe Siemens reference setup submitted to type approve HC25 consists of the following com-ponents:• Siemens HC25 cellular engine• Development Support Box DSB75 and HC15/HC25-DSB75-Adapter for mounting theHC25 module• SIM card reader integrated on DSB75• U.FL-LP antenna cable• Handset type Votronic HH-SI-30.3/V1.1/0•PC as MMIFigure 9: Reference equipment for Type Approval
HC25 Hardware Interface Overview7.2 Compliance with FCC Rules and Regulations32sHC25_HO_v00.220 Page 32 of 39 2007-03-20Confidential / Preliminary7.2 Compliance with FCC Rules and Regulations The Equipment Authorization Certification for the Siemens reference application described inSection 7.1 will be registered under the following identifiers:FCC Identifier: QIPHC25Industry Canada Certification Number: 267W-HC25Granted to Siemens AGManufacturers of mobile or fixed devices incorporating HC25 modules are authorized to usethe FCC Grants and Industry Canada Certificates of the HC25 modules for their own final prod-ucts according to the conditions referenced in these documents. In this case, the FCC label ofthe module shall be visible from the outside, or the host device shall bear a second label stating"Contains FCC ID QIPHC25".IMPORTANT:Manufacturers of portable applications incorporating HC25 modules are required to have theirfinal product certified and apply for their own FCC Grant and Industry Canada Certificaterelated to the specific portable mobile. This is mandatory to meet the SAR requirements for por-table mobiles (see Section 1.4 for detail).Changes or modifications not expressly approved by the party responsible for compliancecould void the user's authority to operate the equipment.Note: This equipment has been tested and found to comply with the limits for a Class B digitaldevice, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonableprotection against harmful interference in a residential installation. This equipment generates,uses and can radiate radio frequency energy and, if not installed and used in accordance withthe instructions, may cause harmful interference to radio communications. However, there isno guarantee that interference will not occur in a particular installation. If this equipment doescause harmful interference to radio or television reception, which can be determined by turningthe equipment off and on, the user is encouraged to try to correct the interference by one ormore of the following measures: • Reorient or relocate the receiving antenna. • Increase the separation between the equipment and receiver. • Connect the equipment into an outlet on a circuit different from that to which the receiver isconnected. • Consult the dealer or an experienced radio/TV technician for help.
HC25 Hardware Interface Overview8 Appendix39sHC25_HO_v00.220 Page 33 of 39 2007-03-20Confidential / Preliminary8 Appendix8.1 List of Parts and AccessoriesTable 17: List of parts and accessoriesDescription Supplier Ordering informationHC25 Siemens Standard module (Siemens IMEI)Siemens ordering number: L30960-N1050-A100Customer IMEI mode:Siemens Ordering number: L30960-N1060-A100Siemens Car Kit Portable Siemens Siemens ordering number: L36880-N3015-A117DSB75 Support Box Siemens Siemens ordering number: L36880-N8811-A100HC15/HC25-DSB75-Adapter Siemens Siemens ordering number: L30960-N1001-A100Votronic Handset VOTRONIC Votronic HH-SI-30.3/V1.1/0VOTRONIC Entwicklungs- und Produktionsgesellschaft für elek-tronische Geräte mbHSaarbrücker Str. 866386 St. IngbertGermanyPhone: +49-(0)6 89 4 / 92 55-0Fax: +49-(0)6 89 4 / 92 55-88e-mail: contact@votronic.comSIM card holder incl. push button ejector and slide-in trayMolex Ordering numbers: 91228 91236Sales contacts are listed in Table 18.Board-to-board connector Molex Sales contacts are listed in Table 18.Antenna connector Hirose Sales contacts are listed in Table 19.
HC25 Hardware Interface Overview8.1 List of Parts and Accessories39sHC25_HO_v00.220 Page 34 of 39 2007-03-20Confidential / PreliminaryTable 18: Molex sales contacts (subject to change)MolexFor further information please click:http://www.molex.comMolex Deutschland GmbHFelix-Wankel-Str. 114078 Heilbronn-BiberachGermanyPhone: +49-7066-9555 0Fax: +49-7066-9555 29Mail: mxgermany@molex.comAmerican HeadquartersLisle, Illinois 60532U.S.A.Phone: +1-800-78MOLEXFax: +1-630-969-1352Molex China DistributorsBeijing,Room 1319, Tower B, COFCO PlazaNo. 8, Jian Guo Men Nei Street, 100005BeijingP.R. ChinaPhone: +86-10-6526-9628Phone: +86-10-6526-972Phone: +86-10-6526-9731Fax: +86-10-6526-9730Molex Singapore Pte. Ltd.Jurong, SingaporePhone: +65-268-6868Fax: +65-265-6044Molex Japan Co. Ltd.Yamato, Kanagawa, Japan Phone: +81-462-65-2324Fax: +81-462-65-2366Table 19: Hirose sales contacts (subject to change)Hirose Ltd.For further information please click: http://www.hirose.comHirose Electric (U.S.A.) Inc2688 Westhills CourtSimi Valley, CA 93065U.S.A.Phone: +1-805-522-7958Fax: +1-805-522-3217Hirose Electric GmbHHerzog-Carl-Strasse 473760 OstfildernGermany Phone: +49-711-456002-1Fax: +49-711-456002-299Email info@hirose.deHirose Electric UK, LtdCrownhill Business Centre22 Vincent Avenue, CrownhillMilton Keynes, MK8 OABGreat BritainPhone: +44-1908-305400Fax: +44-1908-305401Hirose Electric Co., Ltd.5-23, Osaki 5 Chome, Shinagawa-KuTokyo 141JapanPhone: +81-03-3491-9741Fax: +81-03-3493-2933Hirose Electric Co., Ltd.European BranchFirst class Building 4FBeechavenue 461119PV Schiphol-RijkNetherlandsPhone: +31-20-6557-460Fax: +31-20-6557-469
HC25 Hardware Interface Overview8.2 Fasteners and Fixings for Electronic Equipment39sHC25_HO_v00.220 Page 35 of 39 2007-03-20Confidential / Preliminary8.2 Fasteners and Fixings for Electronic EquipmentThis section provides a list of suppliers and manufacturers offering fasteners and fixings forelectronic equipment and PCB mounting. The content of this section is designed to offer basicguidance to various mounting solutions with no warranty on the accuracy and sufficiency of theinformation supplied. Please note that the list remains preliminary although it is going to beupdated in later versions of this document.8.2.1 Fasteners from German Supplier ETTINGER GmbHSales contact:ETTINGER GmbHhttp://www.ettinger.de/main.cfmPhone: +49-81-046623-0Fax: +49-81-046623-99The following tables contain only article numbers and basic parameters of the listed compo-nents. For further detail and ordering information please contact Ettinger GmbH. Please note that some of the listed screws, spacers and nuts are delivered with the DSB75Support Board. See comments below.Article number: 05.71.038 Spacer - Aluminum /Wall thickness = 0.8mmLength 3.0mmMaterial AlMgSi-0,5For internal diameter M2=2.0-2.3 Internal diameter d = 2.4mmExternal diameter 4.0mmVogt AG No. x40030080.10
HC25 Hardware Interface Overview8.2 Fasteners and Fixings for Electronic Equipment39sHC25_HO_v00.220 Page 36 of 39 2007-03-20Confidential / PreliminaryArticle number: 07.51.403 Insulating Spacer for M2Self-gripping11. 2 spacers are delivered with DSB75 Support BoardLength 3.0mmMaterial Polyamide 6.6Surface BlackInternal diameter 2.2mmExternal diameter 4.0mmFlammability rating UL94-HBArticle number: 05.11.209 Threaded Stud M2.5 - M2 Type E /External thread at both endsLength 3.0mmMaterial Stainless steel X12CrMoS17Thread 1 / Length M2.5 / 6.0mmThread 2 / Length M2 / 8.0mmWidth across flats 5 Recess yesType External / External
HC25 Hardware Interface Overview8.2 Fasteners and Fixings for Electronic Equipment39sHC25_HO_v00.220 Page 37 of 39 2007-03-20Confidential / PreliminaryArticle number: 01.14.131 Screw M21 DIN 84 - ISO 12071. 2 screws are delivered with DSB75 Support BoardLength 8.0mmMaterial Steel 4.8Surface Zinced A2KThread M2 Head diameter D = 3.8mmHead height 1.30mmType Slotted cheese head screwArticle number: 01.14.141 Screw M2DIN 84 - ISO 1207Length 10.0mmMaterial Steel 4.8Surface Zinced A2KThread M2 Head diameter D = 3.8mmHead height 1.30mmType Slotted cheese head screw
HC25 Hardware Interface Overview8.3 Mounting Advice Sheet39sHC25_HO_v00.220 Page 38 of 39 2007-03-20Confidential / Preliminary8.3 Mounting Advice SheetTo prevent mechanical damage, be careful not to force, bend or twist the module. Be sure it ispositioned flat against the host device. The advice sheet on the next page shows a number ofexamples for the kind of bending that may lead to mechanical damage of the module.Article number: 02.10.011 Hexagon Nut1DIN 934 - ISO 40321. 2 nuts are delivered with DSB75 Support BoardMaterial Steel 4.8Surface Zinced A2KThread M2 Wrench size / Ø 4Thickness / L 1.6mmType Nut DIN/UNC, DIN934
HC25 Hardware Interface Overview8.3 Mounting Advice Sheet39sHC25_HO_v00.220 Page 39 of 39 2007-03-20Confidential / Preliminary

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