Summit Data Communications SDCMSD30AG 802.11ag Mini Compact Flash Module User Manual MSD30AG

Summit Data Communications, Inc. 802.11ag Mini Compact Flash Module User Manual MSD30AG

User Manual

Summit Data Communications, Inc., 526 South Main Street Suite 805 Akron, OH 44311 Tel: 866-434-4300 www.summitdatacom.com © 2006 – 2009 Summit Data Communications, Inc. All rights reserved. Hardware Integration Guide SDC-MSD30AG version 1.03
Hardware Integration Guide – SDC-MSD30AG 2 SDC-MSD30AG_HIG1.04© 2006 – 2010 Summit Data Communications, Inc. All rights reserved. Contents Scope ......................................................................................................................... .................................... 3 Specifications ................................................................................................................................................ 3 Pin Definitions and Interface Notes .............................................................................................................. 8 Pin Definitions ........................................................................................................................................... 8 Interface Notes ....................................................................................................................................... 10 Mechanical Specifications ..................................................................................................... ...................... 11 Connector Overview ............................................................................................................................... 11 Mounting ................................................................................................................................................. 11 Regulatory ................................................................................................................................................... 12 Certified Antennas .................................................................................................................................. 12 Documentation Requirements ............................................................................................................... 12 FCC ...................................................................................................................................................... 13 Industry Canada .................................................................................................................................. 14 European Union .................................................................................................................................. 16
Hardware Integration Guide – SDC-MSD30AG 3 SDC-MSD30AG_HIG1.04© 2006 – 2010 Summit Data Communications, Inc. All rights reserved. Scope This document describes key hardware aspects of the Summit MSD30AG 802.11a/b/g SDIO (Secure Digital Input/Output) Radio Module. This document is intended to assist device manufacturers and related parties with the integration of this radio into their host devices. Data in this document are drawn from a number of sources and includes information found in the Atheros AR6002 data sheet issued in April of 2008. The SDC-MSDAG is currently in pre-production and as such, this document is preliminary in nature. The information in this document is subject to change. Please contact Summit or visit the Summit website at www.summitdatacom.com to obtain the most recent version of this document. The device is labeled with all applicable regulatory information in a manner that’s compliant with all regulatory standards. Regulatory operational requirements are included with this document and are to be incorporated into the operating manual of any device into which the SDC-MSD30AG installed. The SDC-MSD30AG is designed for installation into mobile devices such as vehicle mount data terminals which typically operate at distances greater than 20 cm from the human body and portable devices such as handheld data terminals which typically operate at distances less than 20 cm from the human body. See “Documentation Requirements” for more information. Specifications Feature Description System Interface 4-bit Secure Digital I/O Molex 54722-0607 60-pin connector (mates to Molex 55560-0607 60-pin connector) Antenna Interface 2 Hirose U.FL connectors for dual-band antenna diversity on Wi-Fi Chip Set Atheros AR6002 Input Power Requirements 3.3 VDC +/- 10% Current Consumption (At maximum transmit power setting) 802.11a Transmit: 381 mA (1257 mW) Receive: 116 mA (383 mW) Standby: 3 mA (10 mW) 802.11b/g Transmit: 324 mA (1069 mW) Receive: 93 mA (307 mW) Standby: 2 mA (7 mW) Operating Temperature -25° to 75°C (-13° to 167°F) Operating Humidity 10 to 90% (non-condensing) Storage Temperature -30° to 85°C (-22° to 185°F) Storage Humidity 10 to 90% (non-condensing) Length 32 mm (1.26 in.) Width 22 mm (0.87 in.)
Hardware Integration Guide – SDC-MSD30AG 4 SDC-MSD30AG_HIG1.04© 2006 – 2010 Summit Data Communications, Inc. All rights reserved. Feature Description Thickness 4.5 mm (0.18 in.) Note: With the mating connector, the thickness is 5.1 mm above the board it plugs into. Weight 10 g (0.35 oz.) Mounting 60-pin connector 3 mounting holes (2.36 mm, 0.093 in.) Wi-Fi Wireless Media Direct Sequence-Spread Spectrum (DSSS) Orthogonal Frequency Divisional Multiplexing (OFDM) Wi-Fi Media Access Protocol Carrier sense multiple access with collision avoidance (CSMA/CA) Network Architecture Types Infrastructure and ad hoc Network Standards IEEE 802.11a, 802.11b, 802.11d, 802.11e, 802.11g, 802.11h, 802.11i Wi-Fi Data Rates Supported 802.11a (OFDM) 6, 9, 12, 18, 24, 36, 48, 54 Mbps 802.11b (DSSS) 1, 2, 5.5, 11 Mbps 802.11g (OFDM) 6, 9, 12, 18, 24, 36, 48, 54 Mbps Wi-Fi Modulation BPSK @ 1, 6, and 9 Mbps QPSK @ 2, 12, and 18 Mbps CCK @ 5.5 and 11 Mbps 16-QAM @ 24 and 36 Mbps 64-QAM @ 48 and 54 Mbps Regulatory Domain Support FCC (Americas, Parts of Asia, and Middle East) ETSI (Europe, Middle East, Africa, and Parts of Asia) TELEC (Japan) KCC (Korea) 2.4 GHz Frequency Bands ETSI 2.4 GHz to 2.483 GHz FCC 2.4 GHz to 2.473 GHz TELEC 2.4 GHz to 2.495 GHz KCC 2.4 GHz to 2.483 GHz 5 GHz Frequency Bands ETSI 5.15 GHz to 5.35 GHz 5.47 GHz to 5.725 GHz FCC 5.15 GHz to 5.35 GHz 5.47 GHz to 5.725 GHz 5.725 GHz to 5.82 GHz TELEC 5.15 GHz to 5.35 GHz KCC 5.15 GHz to 5.25 GHz 5.725 GHz to 5.82 GHz
Hardware Integration Guide – SDC-MSD30AG 5 SDC-MSD30AG_HIG1.04© 2006 – 2010 Summit Data Communications, Inc. All rights reserved. Feature Description 2.4 GHz Operating Channels ETSI: 13 (3 non-overlapping) FCC: 11 (3 non-overlapping) TELEC 14 (4 non-overlapping) KCC: 13 (3 non-overlapping) 5 GHz Operating Channels ETSI: 19 non-overlapping FCC: 23 non-overlapping TELEC: 8 non-overlapping KCC: 8 non-overlapping Wi-Fi Transmit Power Settings Note: Maximum transmit power varies according to individual country regulations. All values nominal, +/-2 dBm 802.11a 15 dBm (30 mW) 13 dBm (20 mW) 10 dBm (10 mW) 802.11b 18 dBm (63 mW) 17 dBm (50 mW) 15 dBm (30 mW) 13 dBm (20 mW) 10 dBm (10 mW) 7 dBm (5 mW) 0 dBm (1 mW) 802.11g 18 dBm (63 mW) 17 dBm (50 mW) 15 dBm (30 mW) 13 dBm (20 mW) 10 dBm (10 mW) 7 dBm (5 mW) 0 dBm (1 mW) Typical Receiver Sensitivity Note: All values nominal, +/-3 dBm. 802.11a: 6 Mbps -85 dBm 12 Mbps -83 dBm 18 Mbps -81 dBm 24 Mbps -75 dBm 36 Mbps -73 dBm 48 Mbps -68 dBm 54 Mbps -67 dBm (PER <= 10%) 802.11b: 1 Mbps -95 dBm 2 Mbps -94 dBm 5.5 Mbps -93 dBm 11 Mbps -89 dBm (PER <= 10%) 802.11g: 6 Mbps -93 dBm 12 Mbps -88 dBm 18 Mbps -85 dBm 24 Mbps -83 dBm 36 Mbps -77 dBm 48 Mbps -74 dBm 54 Mbps -72 dBm (PER <= 10%)
Hardware Integration Guide – SDC-MSD30AG 6 SDC-MSD30AG_HIG1.04© 2006 – 2010 Summit Data Communications, Inc. All rights reserved. Feature Description Wi-Fi Delay Spread 600 ns @ 1 Mbps 500 ns @ 2 Mbps 400 ns @ 5.5 Mbps 400 ns @ 6 Mbps 400 ns @ 9 Mbps 200 ns @ 11 Mbps 350 ns @ 12 Mbps 350 ns @ 18 Mbps 250 ns @ 24 Mbps 250 ns @ 36 Mbps 150 ns @ 48 Mbps 150 ns @ 54 Mbps Operating Systems Supported Windows Mobile 6.5 Windows Mobile 6.1 Windows Mobile 6.0 Windows Mobile 5.0 Pocket PC 2003 Windows Embedded CE 6.0 R2 Windows Embedded CE 6.0 Windows Embedded CE 5.0 Windows Embedded CE 4.2 Security Standards  Wireless Equivalent Privacy (WEP)  Wi-Fi Protected Access (WPA)  IEEE 802.11i (WPA2) Encryption  Wireless Equivalent Privacy (WEP, RC4 Algorithm)  Temporal Key Integrity Protocol (TKIP, RC4 Algorithm)  Advanced Encryption Standard (AES, Rijndael Algorithm) Encryption Key Provisioning  Static (40-bit and 128-bit lengths)  Pre-Shared (PSK)  Dynamic 802.1X Extensible Authentication Protocol Types  EAP-FAST  EAP-TLS  EAP-TTLS  PEAP-GTC  PEAP-MSCHAPv2  PEAP-TLS  LEAP
Hardware Integration Guide – SDC-MSD30AG 7 SDC-MSD30AG_HIG1.04© 2006 – 2010 Summit Data Communications, Inc. All rights reserved. Feature Description Compliance ETSI Regulatory Domain EN 300 328 EN 301 489-1 EN 301 489-17 EN 301 893 EN 60950-1 EU 2002/95/EC (RoHS) FCC Regulatory Domain Part 15.247 Subpart C  Initial Grant  Test Report Part 15.407 Subpart E  Initial Grant  Test Report  DTS Test Report Industry Canada RSS-210  Initial Grant  Test Report RSS-Gen Issue 2  Initial Grant  Test Report  DTS Test Report TELEC Regulatory Domain Article 2 Item 19, Category WW (2.4GHz Channels 1-13) Article 2 Item 19-2, Category GZ (2.4GHz Channel 14) Certifications Wi-Fi Alliance 802.11a, 802.11b, 802.11g WPA Enterprise WPA2 Enterprise Cisco Compatible Extensions (Version 4) Warranty Limited Lifetime All specifications are subject to change without notice
Hardware Integration Guide – SDC-MSD30AG 8 SDC-MSD30AG_HIG1.04© 2006 – 2010 Summit Data Communications, Inc. All rights reserved. Pin Definitions and Interface Notes Pin Definitions Note: In regards to GND (Ground) pins, only one must be tied down. The remaining pins identified as GND can either be tied down or floated, depending on individual radio board design needs. Pin Number Pin Name Type Description Note 1 GND Ground 2 No Connect Not Used. Leave Open (Float) 3 BT_PRIORITY Bluetooth Priority See Bluetooth Coexistence 4 BT_FREQ Bluetooth Frequency 5 No Connect Not Used. Leave Open (Float) 6 No Connect Not Used. Leave Open (Float) 7 No Connect Not Used. Leave Open (Float) 8 Wake on Wireless Wake on Wireless LAN See Pin 8 9 No Connect Not Used. Leave Open (Float) 10 CLK_32K 32k Ext Sleep Clock 11 No Connect Not Used. Leave Open (Float) 12 No Connect Not Used. Leave Open (Float) 13 VCC3_3 3.3V Module Power 14 No Connect Not Used. Leave Open (Float) 15 No Connect Not Used. Leave Open (Float) 16 No Connect Not Used. Leave Open (Float) 17 No Connect Not Used. Leave Open (Float) 18 No Connect Not Used. Leave Open (Float) 19 No Connect Not Used. Leave Open (Float) 20 No Connect Not Used. Leave Open (Float) 21 VDD_IO 3.3/1.8V I/O Power 22 No Connect Not Used. Leave Open (Float) 23 No Connect Not Used. Leave Open (Float) 24 No Connect Not Used. Leave Open (Float)
Hardware Integration Guide – SDC-MSD30AG 9 SDC-MSD30AG_HIG1.04© 2006 – 2010 Summit Data Communications, Inc. All rights reserved. Pin Number Pin Name Type Description Note 25 No Connect Not Used. Leave Open (Float) 26 SYS_RST_L Reset 27 SDIO_DATA_2 SDIO Data 2 28 WLAN_ACTIVE Bluetooth coexistence wireless LAN active signal. See Bluetooth Coexistence 29 VCC3_3 3.3V Module Power See Pin 29 30 GND Ground 31 GND Ground 32 No Connect Not Used. Leave Open (Float) 33 No Connect Not Used. Leave Open (Float) 34 No Connect Not Used. Leave Open (Float) 35 No Connect Not Used. Leave Open (Float) 36 BT_ACTIVE Bluetooth coexistence Bluetooth active signal. See Bluetooth Coexistence 37 No Connect Not Used. Leave Open (Float) 38 No Connect Not Used. Leave Open (Float) 39 No Connect Not Used. Leave Open (Float) 40 No Connect Not Used. Leave Open (Float) 41 No Connect Not Used. Leave Open (Float) 42 Slot0_nLED WLAN LED activity indicator 43 No Connect Not Used. Leave Open (Float) 44 No Connect Not Used. Leave Open (Float) 45 No Connect Not Used. Leave Open (Float) 46 No Connect Not Used. Leave Open (Float) 47 No Connect Not Used. Leave Open (Float) 48 CHIP_PWD_L Power Down 49 No Connect Not Used. Leave Open (Float) 50 No Connect Not Used. Leave Open (Float) 51 No Connect Not Used. Leave Open (Float) 52 No Connect Not Used. Leave Open (Float)
Hardware Integration Guide – SDC-MSD30AG 10 SDC-MSD30AG_HIG1.04© 2006 – 2010 Summit Data Communications, Inc. All rights reserved. Pin Number Pin Name Type Description Note 53 No Connect Not Used. Leave Open (Float) 54 No Connect Not Used. Leave Open (Float) 55 SDIO_CMD SDIO Command 56 SDIO_CLK SDIO Clock 57 SDIO_DATA_0 SDIO Data 0 58 SDIO_DATA_3 SDIO Data 3 59 SDIO_DATA_1 SDIO Data 1 60 GND Ground Interface Notes  Bluetooth coexistence – BT coexistence can be turned on or off in the SROM using the Summit Manufacturing Utility, or SMU. BT coexistence is through a three-wire interface with one additional reserved wire: - Pin 22: WLAN_ACTIVE – Driven by the Summit radio and is asserted when the transmitter of the Summit radio is active. - Pin 36: BT_ACTIVE – An input to the Summit radio. The Summit radio does not transmit if BT_ACTIVE is asserted. The Summit radio expects the Bluetooth radio to assert (raise high) BT_ACTIVE when it is transmitting and to refrain from transmitting when WLAN_ACTIVE is asserted. - Pin 3: BT_Priority – When high, Bluetooth is transmitting or receiving high priority packets. - Pin 4: BT_Frequency – Asserted (logic high) when the Bluetooth transceiver hops into the restricted channels defined by the coexistence mechanism. A Summit customer must provide any “glue” logic between the Summit radio and the Bluetooth radio to make sure that the interface is utilized properly.  Pin 8: Although the pin is present, Wake on Wireless is not currently supported in the software.  Pin 29: The VCC_Slot0 pin will appear with the ES5 samples and production versions.
Hardware Integration Guide – SDC-MSD30AG 11 SDC-MSD30AG_HIG1.04© 2006 – 2010 Summit Data Communications, Inc. All rights reserved. Mechanical Specifications Connector Overview MSD30AG connector: Molex 54722-0607 60-pin connector Mating connector (on board): Molex 55560-0607 60-pin connector Mounting Three through-hole mounting with a 60-pin connector. Summit recommends non-metallic screws and a 0.05 mm non-metallic bushing.
Hardware Integration Guide – SDC-MSD30AG 12 SDC-MSD30AG_HIG1.04© 2006 – 2010 Summit Data Communications, Inc. All rights reserved. Regulatory Certified Antennas The SDC-MSD30AG provides two Hirose U.FL type antenna connectors to support transmit and receive diversity. For single antenna, non-diversity applications, OEMs are advised to use the Main (not Aux) antenna connector and should disable transmit and receive diversity from the Global tab of the Summit Client Utility (SCU) software utility. The SDC-MSD30AG has been tested to the regulatory standards defined in the “Certifications” section of the Specifications table above. These tests were conducted with the following antennas: AIR-ANT 4941 (click for datasheet)  Form Factor: Whip  Type: Dipole  Maximum 2.4 GHz Gain: 2.2 dBi Radiall Larson Dipole (click for datasheet)  Form Factor: Whip  Type: Dipole  Maximum 2.4 GHz Gain: 1.6 dBi (not used during testing)  Maximum 5 GHz Gain: 5 dBi HUBER+SUHNER (click for datasheet)  Form Factor: Whip  Type: Monopole  Maximum 2.4 GHz Gain: 3 dBi  Maximum 5 GHz Gain: 6.5 dBi Antennas of differing types and higher gains may be integrated as well. If necessary, with the Summit Manufacturing Utility software utility, OEMs may reduce the transmit power of the SDC-MSD30AG to account for higher antenna gain. In some cases, OEMs may be able to reduce certification efforts by using antennas that are of like type and equal or lesser gain to the above listed antennas. Documentation Requirements In order to maintain regulatory compliance, when integrating the SDC-MSD30AG into a host device and leveraging Summit’s grants and certifications, it is necessary to meet the documentation requirements set forth by the applicable regulatory agencies. The following sections (FCC, Industry Canada, and European Union) outline the information that must be included in the user’s guide and external labels for the host devices into which the SDC-MSD30AG is integrated.
Hardware Integration Guide – SDC-MSD30AG 13 SDC-MSD30AG_HIG1.04© 2006 – 2010 Summit Data Communications, Inc. All rights reserved. FCC User’s Guide Requirements As outlined in the Operational Description, the SDC-MSD30AG complies with FCC Part 15 Rules for a Limited Modular Approval. To leverage Summit’s grant, the two conditions below must be met for the host device into which the SDC-MSD30AG is integrated: 1. The antenna is installed with 20 cm maintained between the antenna and users. 2. The transmitter module is not co-located with any other transmitter or antenna that is capable of simultaneous operation. As long as the two conditions above are met, further transmitter testing is typically not required. However, the OEM integrator is still responsible for testing its end-product for any additional compliance requirements required with this module installed, such as (but not limited to) digital device emissions and PC peripheral requirements. IMPORTANT! In the event that the two conditions above cannot be met (for example certain device configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. When using Summit’s FCC grant for the SDC-MSD30AG, the integrator must include specific information in the user’s guide for the device into which the SDC-MSD30AG is integrated. The integrator must not provide information to the end user regarding how to install or remove this RF module in the user’s manual of the device into which the SDC-MSD30AG is integrated. The following FCC statements must be added in their entirety and without modification into a prominent place in the user’s guide for the device into which the SDC-MSD30AG is integrated: “IMPORTANT NOTE: To comply with FCC RF exposure compliance requirements, the antenna used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter.” Federal Communication Commission Interference Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or
Hardware Integration Guide – SDC-MSD30AG 14 SDC-MSD30AG_HIG1.04© 2006 – 2010 Summit Data Communications, Inc. All rights reserved. television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures: 1. Reorient or relocate the receiving antenna. 2. Increase the separation between the equipment and receiver. 3. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. 4. Consult the dealer or an experienced radio/TV technician for help. FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. IMPORTANT NOTE: FCC Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. Labeling Requirements The final end product must be labeled in a visible area with the following notice: Contains FCC ID: TWG-SDCMSD30AG Industry Canada User’s Guide Requirements As outlined in the Operational Description, the SDC-MSD30AG complies with Industry Canada (IC) rules for a Limited Modular Approval. To leverage Summit’s grant, the two conditions below must be met for the host device into which the SDC-MSD30AG is integrated: 1. The antenna is installed with 20 cm maintained between the antenna and users. 2. The transmitter module is not co-located with any other transmitter or antenna that is capable of simultaneous operation. As long as the two conditions above are met, further transmitter testing is typically not required. However, the OEM integrator is still responsible for testing its end-product for any additional
Hardware Integration Guide – SDC-MSD30AG 15 SDC-MSD30AG_HIG1.04© 2006 – 2010 Summit Data Communications, Inc. All rights reserved. compliance requirements required with this module installed, such as (but not limited to) digital device emissions and PC peripheral requirements. IMPORTANT! In the event that the two conditions above cannot be met (for example certain device configurations or co-location with another transmitter), then the IC authorization is no longer considered valid and the IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate IC authorization. When using Summit’s IC grant for the SDC-MSD30AG, the integrator must include specific information in the user’s guide for the device into which the SDC-MSD30AG is integrated. The integrator must not provide information to the end user regarding how to install or remove this RF module in the user’s manual of the device into which the SDC-MSD30AG is integrated. In addition to the required FCC statements outlined above, the following IC statements must be added in their entirety and without modification into a prominent place in the user’s guide for the device into which the SDC-MSD30AG is integrated: To prevent radio interference to the licensed service, this device is intended to be operated indoors and away from windows to provide maximum shielding. Equipment (or its transmit antenna) that is installed outdoors is subject to licensing. The integrator must list out information for each antenna used with the host device into which the SDC-MSD30AG is integrated. The following examples are based on antennas with which the SDC-MSD30AG was certified and represent an acceptable format: AIR-ANT 4941  Form Factor: Whip  Type: Dipole  Maximum 2.4 GHz Gain: 2.2 dBi Radiall Larson Dipole  Form Factor: Whip  Type: Dipole  Maximum 2.4 GHz Gain: 1.6 dBi (not used during testing)  Maximum 5 GHz Gain: 5 dBi HUBER+SUHNER  Form Factor: Whip  Type: Monopole  Maximum 2.4 GHz Gain: 3 dBi  Maximum 5 GHz Gain: 6.5 dBi
Hardware Integration Guide – SDC-MSD30AG 16 SDC-MSD30AG_HIG1.04© 2006 – 2010 Summit Data Communications, Inc. All rights reserved. Labeling Requirements The final end product must be labeled in a visible area with the following notice: Contains IC ID: 6616A-SDCMSD30AG European Union User’s Guide Requirements The integrator must include specific information in the user’s guide for the device into which the SDC-MSD30AG is integrated. In addition to the required FCC and IC statements outlined above, the following R&TTE statements must be added in their entirety and without modification into a prominent place in the user’s guide for the device into which the SDC-MSD30AG is integrated: This device complies with the essential requirements of the R&TTE Directive 1999/5/EC. The following test methods have been applied in order to prove presumption of conformity with the essential requirements of the R&TTE Directive 1999/5/EC:  EN60950-1:2001 A11:2004 Safety of Information Technology Equipment  EN 300 328 V1.7.1: (2006-10) Electromagnetic compatibility and Radio spectrum Matters (ERM); Wideband Transmission systems; Data transmission equipment operating in the 2,4 GHz ISM band and using spread spectrum modulation techniques; Harmonized EN covering essential requirements under article 3.2 of the R&TTE Directive  EN 301 489-1 V1.6.1: (2005-09) Electromagnetic compatibility and Radio Spectrum Matters (ERM); ElectroMagnetic Compatibility (EMC) standard for radio equipment and services; Part 1: Common technical requirements  EN 301 489-17 V1.2.1 (2002-08) Electromagnetic compatibility and Radio spectrum Matters (ERM); ElectroMagnetic Compatibility (EMC) standard for radio equipment and services; Part 17: Specific conditions for 2,4 GHz wideband transmission systems and 5 GHz high performance RLAN equipment  EN 301 893 Electromagnetic compatibility and Radio spectrum Matters (ERM); Broadband Radio Access Networks (BRAN); Specific conditions for 5 GHz high performance RLAN equipment  EU 2002/95/EC (RoHS) Declaration of Compliance – EU Directive 2003/95/EC; Reduction of Hazardous Substances (RoHS) This device is a 2.4 GHz wideband transmission system (transceiver), intended for use in all EU member states and EFTA countries, except in France and Italy where restrictive use applies.
Hardware Integration Guide – SDC-MSD30AG 17 SDC-MSD30AG_HIG1.04© 2006 – 2010 Summit Data Communications, Inc. All rights reserved. In Italy the end-user should apply for a license at the national spectrum authorities in order to obtain authorization to use the device for setting up outdoor radio links and/or for supplying public access to telecommunications and/or network services. This device may not be used for setting up outdoor radio links in France and in some areas the RF output power may be limited to 10 mW EIRP in the frequency range of 2454 – 2483.5 MHz. For detailed information the end-user should contact the national spectrum authority in France. Česky [Czech] [Jméno výrobce] tímto prohlašuje, že tento [typ zařízení] je ve shodě se základními požadavky a dalšími příslušnými ustanoveními směrnice 1999/5/ES. Dansk [Danish] Undertegnede [fabrikantens navn] erklærer herved, at følgende udstyr [udstyrets typebetegnelse] overholder de væsentlige krav og øvrige relevante krav i direktiv 1999/5/EF. Deutsch [German] Hiermit erklärt [Name des Herstellers], dass sich das Gerät [Gerätetyp] in Übereinstimmung mit den grundlegenden Anforderungen und den übrigen einschlägigen Bestimmungen der Richtlinie 1999/5/EG befindet. Eesti [Estonian] Käesolevaga kinnitab [tootja nimi = name of manufacturer] seadme [seadme tüüp = type of equipment] vastavust direktiivi 1999/5/EÜ põhinõuetele ja nimetatud direktiivist tulenevatele teistele asjakohastele sätetele. English Hereby, [name of manufacturer], declares that this [type of equipment] is in compliance with the essential requirements and other relevant provisions of Directive 1999/5/EC. Español [Spanish] Por medio de la presente [nombre del fabricante] declara que el [clase de equipo] cumple con los requisitos esenciales y cualesquiera otras disposiciones aplicables o exigibles de la Directiva 1999/5/CE. Ελληνική [Greek] ΜΕ ΤΗΝ ΠΑΡΟΥΣΑ [name of manufacturer] ΔΗΛΩΝΕΙ ΟΤΙ [type of equipment] ΣΥΜΜΟΡΦΩΝΕΤΑΙ ΠΡΟΣ ΤΙΣ ΟΥΣΙΩΔΕΙΣ ΑΠΑΙΤΗΣΕΙΣ ΚΑΙ ΤΙΣ ΛΟΙΠΕΣ ΣΧΕΤΙΚΕΣ ΔΙΑΤΑΞΕΙΣ ΤΗΣ ΟΔΗΓΙΑΣ 1999/5/ΕΚ. Français [French] Par la présente [nom du fabricant] déclare que l'appareil [type d'appareil] est conforme aux exigences essentielles et aux autres dispositions pertinentes de la directive 1999/5/CE. Italiano [Italian] Con la presente [nome del costruttore] dichiara che questo [tipo di apparecchio] è conforme ai requisiti essenziali ed alle altre disposizioni pertinenti stabilite dalla direttiva 1999/5/CE. Latviski [Latvian] Ar šo [name of manufacturer / izgatavotāja nosaukums] deklarē, ka [type of equipment / iekārtas tips] atbilst Direktīvas 1999/5/EK būtiskajām prasībām un citiem ar to saistītajiem noteikumiem. Lietuvių [Lithuanian] Šiuo [manufacturer name] deklaruoja, kad šis [equipment type] atitinka esminius reikalavimus ir kitas 1999/5/EB Direktyvos nuostatas.
Hardware Integration Guide – SDC-MSD30AG 18 SDC-MSD30AG_HIG1.04© 2006 – 2010 Summit Data Communications, Inc. All rights reserved. Nederlands [Dutch] Hierbij verklaart [naam van de fabrikant] dat het toestel [type van toestel] in overeenstemming is met de essentiële eisen en de andere relevante bepalingen van richtlijn 1999/5/EG. Malti [Maltese] Hawnhekk, [isem tal-manifattur], jiddikjara li dan [il-mudel tal-prodott] jikkonforma mal-ħtiġijiet essenzjali u ma provvedimenti oħrajn relevanti li hemm fid-Dirrettiva 1999/5/EC. Magyar [Hungarian] Alulírott, [gyártó neve] nyilatkozom, hogy a [... típus] megfelel a vonatkozó alapvetõ követelményeknek és az 1999/5/EC irányelv egyéb elõírásainak. Polski [Polish] Niniejszym [nazwa producenta] oświadcza, że [nazwa wyrobu] jest zgodny z zasadniczymi wymogami oraz pozostałymi stosownymi postanowieniami Dyrektywy 1999/5/EC. Português [Portuguese] [Nome do fabricante] declara que este [tipo de equipamento] está conforme com os requisitos essenciais e outras disposições da Directiva 1999/5/CE. Slovensko [Slovenian] [Ime proizvajalca] izjavlja, da je ta [tip opreme] v skladu z bistvenimi zahtevami in ostalimi relevantnimi določili direktive 1999/5/ES. Slovensky [Slovak] [Meno výrobcu] týmto vyhlasuje, že [typ zariadenia] spĺňa základné požiadavky a všetky príslušné ustanovenia Smernice 1999/5/ES. Suomi [Finnish] [Valmistaja = manufacturer] vakuuttaa täten että [type of equipment = laitteen tyyppimerkintä] tyyppinen laite on direktiivin 1999/5/EY oleellisten vaatimusten ja sitä koskevien direktiivin muiden ehtojen mukainen. Svenska [Swedish] Härmed intygar [företag] att denna [utrustningstyp] står I överensstämmelse med de väsentliga egenskapskrav och övriga relevanta bestämmelser som framgår av direktiv 1999/5/EG. Labeling Requirements The final end product must be labeled in a visible area with the following notice:

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