Sony BE001011 CDMA 800 & 1900 MHz/AMPS 800 MHz (Class I) device User Manual CM52 Integrator s Manual

Sony Mobile Communications Inc CDMA 800 & 1900 MHz/AMPS 800 MHz (Class I) device CM52 Integrator s Manual

Manual

ConfidentialUSERS MANUAL 1(42)Document number Revision4/198 17-LXE 108 566 Uen PA7CM52 Integrator's Manual
ConfidentialUSERS MANUAL 2(42)Document number Revision4/198 17-LXE 108 566 Uen PA7Table of Contents1 Introduction to the Integrator’s Manual 51.1 OVERVIEW 51.2 HOW TO READ THE MANUAL 51.3 SERVICE AND SUPPORT 51.3.1 WEB PAGES 51.4 RELATED DOCUMENTS 61.5 ABBREVIATIONS 62 Integrating the CM52 Module 72.1 OVERVIEW 72.2 MECHANICAL DESCRIPTION 72.2.1 MECHANICAL DIMENSIONS 82.2.2 HEAT-SINK REQUIREMENTS 102.2.3 MOUNTING HOLES 102.3 SYSTEM CONNECTOR INTERFACE 112.3.1 MECHANICAL OVERVIEW 112.3.2 PINOUT 122.3.3 LOGIC LEVELS 132.4 POWER SUPPLY 132.4.1 POWER SUPPLY AND GROUND SIGNALS 132.4.1.1 POWER SUPPLY SIGNAL PINS 132.4.1.2 GROUND SIGNAL PINS 142.4.2 POWER CONSUMPTION 142.4.2.1 WAKEUP-INRUSH CURRENT 172.4.2.2 CONTACT-INRUSH CURRENT 172.4.2.3 POWER DOWN MODE (MINIMUM DC POWER CONSUMPTION) 172.4.3 VREF REQUIREMENTS 172.4.4 REAL TIME CLOCK (RTC) CIRCUIT 182.5 AUDIO INTERFACE 182.5.1 DIGITAL AUDIO 192.5.1.1 DATA FORMAT 192.5.1.2 TIMING 192.5.2 ANALOG AUDIO 212.6 SERIAL DATA INTERFACE 242.7 ANTENNA INTERFACE 252.7.1 ANTENNA CONNECTOR 252.7.2 RF OUTPUT POWER 272.7.3 CARRIER APPROVAL 272.7.4 ANTENNA DIAGNOSTICS 273 Recommended Circuitry 293.1 STATUS GROUP RECOMMENDED CIRCUITRY 293.1.1 MODULE_PWR_EN_B 303.1.2 VREF 303.1.3 HW_SD 303.2 DATA GROUP RECOMMENDED CIRCUITRY 313.2.1 VPPFLASH/DCD 323.3 PCM GROUP RECOMMENDED CIRCUITRY 333.4 ANALOG AUDIO GROUP RECOMMENDED CIRCUITRY 343.4.1 CREATING AN ANALOG GROUND 343.4.2 CREATING AN ANALOG REFERENCE VOLTAGE (BIAS) 343.4.3 ANALOG GROUND VS. AGND 353.4.4 MICROPHONE PATH 353.4.5 LOUDSPEAKER PATH 363.5 SYSTEM CONNECTOR IO FUNCTIONALITY 37
ConfidentialUSERS MANUAL 3(42)Document number Revision4/198 17-LXE 108 566 Uen PA74 Functional Description 405 Hints for Integrating the Module 405.1 PRECAUTIONS 405.2 WHERE TO INSTALL THE MODULE 405.3 SAFETY STANDARDS 405.4 ANTENNA 415.4.1 ANTENNA TYPE 415.4.2 ANTENNA PLACEMENT 415.5 POSSIBLE COMMUNICATION DISTURBANCES 416 Technical Data 42
ConfidentialUSERS MANUAL 4(42)Document number Revision4/198 17-LXE 108 566 Uen PA7TablesTABLE 1: SYSTEM CONNECTOR AND MATING PART NUMBERS........................................................................................................11TABLE 2: PIN-OUT OF THE SYSTEM CONNECTOR HEADER ..............................................................................................................12TABLE 3: CMOS OUTPUT / INPUT ELECTRICAL CHARACTERISTICS ................................................................................................13TABLE 4: CM52 POWER SUPPLY REQUIREMENTS..........................................................................................................................13TABLE 5: CM52 POWER SUPPLY SIGNALS ....................................................................................................................................14TABLE 6: CM52 GROUND SIGNALS...............................................................................................................................................14TABLE 7: VCC_AUX SUPPLY POWER CONSUMPTION ...................................................................................................................15TABLE 8: VCC_MAIN SUPPLY POWER CONSUMPTION..................................................................................................................16TABLE 9: VREF SUPPLY DETAILS.................................................................................................................................................17TABLE 10: CM52 AUDIO SIGNALS.................................................................................................................................................18TABLE 11: CM52 DIGITAL AUDIO SIGNALS....................................................................................................................................19TABLE 12: PCM TIMING PARAMETERS..........................................................................................................................................20TABLE 13: CM52 ANALOG AUDIO SIGNALS...................................................................................................................................21TABLE 14: AUDIO CHARACTERISTICS ............................................................................................................................................21TABLE 15: SERIAL DATA CHANNELS .............................................................................................................................................24TABLE 16: MOBILE STATION NOMINAL ANALOG POWER LEVELS....................................................................................................27TABLE 17: MOBILE STATION CDMA MAXIMUM OUTPUT POWER ....................................................................................................27 TABLE 18: PIN DIRECTION FOR GENERAL PURPOSE SIGNALS.........................................................................................................39FiguresFIGURE 1: CM52 PRIMARY SIDE .....................................................................................................................................................7FIGURE 2: CM52 SECONDARY SIDE ................................................................................................................................................7FIGURE 3: MECHANICAL DIMENSIONS DRAWING...............................................................................................................................8FIGURE 4: KEEP-OUT DRAWING OF CM52 .......................................................................................................................................9FIGURE 5: 40-PIN SYSTEM CONNECTOR ........................................................................................................................................11FIGURE 6: 40-PIN SYSTEM CONNECTOR PIN NUMBERING...............................................................................................................11FIGURE 7: RTC FUNCTIONAL BLOCK DIAGRAM .............................................................................................................................18FIGURE 8: PCM TIMING DIAGRAM .................................................................................................................................................20FIGURE 9: COLOR AND KEYING FOR VARIOUS FAKRA CONNECTORS .............................................................................................25FIGURE 10: ANTENNA DIAGNOSTIC CIRCUIT...................................................................................................................................28Revision HistoryRelease Date Summary of ChangesPA1 05/07/2004 Initial DraftPA2 09/01/2004 FormattingPA3 11/17/2004 Updated Chapters 1 & 2PA4 11/29/2004 Updated with review feedbackPA5 12/1/2004 Updated the List of Tables and FiguresPA6 06/16/2005 Current Consumption Table, RTC Block Diagram, Mechanical Drawing
ConfidentialUSERS MANUAL 5(42)Document number Revision4/198 17-LXE 108 566 Uen PA71 Introduction to the Integrator’s Manual1.1 OverviewThis manual is for use as a guide to the setup, installation, and use of the CM52 moduleinto your application. The module may be tested using the developer’s board, which issupplied together with all the necessary tools in the Developer’s Kit.1.2 How to read the manualThis manual is divided into six chapters:Chapter 1 gives a general view of the integrator’s manual. A list of related documentsas well as a list of abbreviations, used throughout the manual, is also included.Information concerning service and support is also presented.Chapter 2 focuses on helping the hardware developer to integrate the CM52 hardwareinto their application. An overview of the mechanical and electrical information isprovided. Also, interface specifications, RF output power, and power supply issues areincluded in this chapter.Chapter 3 contains information on recommended circuitry needed to ensure properperformance from the CM52 module.Chapter 4 describes several of the common cellular functions available with the CM52.Chapter 5 provides some hints for integrating the module.Chapter 6 provides a summary of the technical data for the CM52 module.1.3 Service and Support1.3.1 Web PagesPlease look at our web page for more information about where you can buy ourmodules or for recommendations of accessories and components. The address is:http://www.sonyericsson.com/m2mTo register for product news and announcements or for product questions, contact theSony Ericsson modules technical support group:•Telephone: 919-472-1122•Email: M2Msupport.Americas@sonyericsson.com
ConfidentialUSERS MANUAL 6(42)Document number Revision4/198 17-LXE 108 566 Uen PA71.4 Related DocumentsCM52 AT Command Manual – Details the AT command interface for the CM52The CM52 is based upon the following mobile standards:•IS-2000 Release 0 (1XRTT), MOB_P_REV – CDMA protocol•TIA/EIA/IS-91 –Mobile Station – Base Station Compatibility Standard for 800MHz Analog Cellular•TIA/EIA-98-D – Recommended Minimum Performance Standards for Dual-ModeSpread Spectrum Mobile Stations1.5 AbbreviationsAGND Analog ReferenceAMPS Advanced Mobile Phone SystemAT Attention CommandCDMA Code Division Multiple AccessCTS Clear to SendDCD Data Carrier DetectDFMS Data from Mobile StationDTMS Data to Mobile StationDTR Data Terminal ReadyEMI Electromagnetic InterferenceESD Electrostatic DischargeGND Chassis GrouNDIRA International Reference AlphabetLSB Least Significant BitME Mobile EquipmentMO Mobile OriginatedMS Mobile StationMT Mobile TerminatedOEM Original Equipment ManufacturerPCB Printed Circuit BoardPCM Pulse Code ModulationPIN Personal Identification NumberRD Receive Data, also known as DFMSRF Radio FrequencyRTS Request to SendSMS Short Message ServiceTD Transmit Data, also know as DTMS
ConfidentialUSERS MANUAL 7(42)Document number Revision4/198 17-LXE 108 566 Uen PA72 Integrating the CM52 Module2.1 OverviewThe CM52 is a dual band, dual mode CDMA transceiver module. It operates in the 800MHz band for CDMA and AMPS and in the 1900 MHz band for CDMA. It is designedfor consumer and OEM industrial voice and data applications.The CM52 module is intended for mounting into an application developer’s chassis toprovide wireless communication capability for the product. The target chassis could bein a wide variety of forms such as a residential electric meter, a point of sale terminal,an alarm panel, or an automobile console. All initial configuration, mode control, andoperational commands are issued to the module over an RS-232 serial port using aflexible AT command format. The module circuitry has been designed to meet theenvironmental requirements of a large range of commercial and industrial users.2.2 Mechanical DescriptionThe CM52 has no mechanical elements other than the main PCB assembly. All criticalelectronic components are shielded using six cans to prevent internal and externalelectromagnetic interference from degrading the module’s performance and to preventthe module from interfering with other nearby devices. The module is plugged into thefixed mating connector and secured with four screws.The antenna interface is provided via a board mounted RF connector at the oppositeend of the board from the system connector. See Section 2.8 for more information onantenna connector options.The module has no keypad, display, microphone, speaker, or battery. The followingfigures show a mechanical drawing and physical dimensions of the module.Note! All the measurements are in millimeters.Figure 1: CM52 Primary Side Figure 2: CM52 Secondary Side
ConfidentialUSERS MANUAL 8(42)Document number Revision4/198 17-LXE 108 566 Uen PA72.2.1 Mechanical DimensionsFigure 3: Mechanical Dimensions Drawing
ConfidentialUSERS MANUAL 9(42)Document number Revision4/198 17-LXE 108 566 Uen PA7Figure 4: Keep-out Drawing of CM52
ConfidentialUSERS MANUAL 10(42)Document number Revision4/198 17-LXE 108 566 Uen PA72.2.2 Heat-Sink RequirementsThe application is required to provide a heat-sink for the 3W AMPS capabilities of theCM52.The application should be designed to provide a heat sink with a thermal resistance of4.0 oC/W.For applications that disable the 3W mode (Class I) and only operate in 0.6W mode(Class III) a heat-sink is not required.2.2.3 Mounting HolesMounting holes and tabs are provided for proper mechanical support of the CM52module in the customer’s application. OEM application must provide sufficientmechanical retention using the mounting holes and/or tabs or some other means. Thesystem connector and RF connector connections should not be used as a means ofmechanical support. Also, please note that the mounting holes may not substitute forthe actual grounding pins provided via the system connector.
ConfidentialUSERS MANUAL 11(42)Document number Revision4/198 17-LXE 108 566 Uen PA72.3 System Connector Interface2.3.1 Mechanical OverviewExternal interfaces to the module are made primarily through a 40 pin, standard 0.050-inch pitch, ODU header show below.Figure 5: 40-Pin System ConnectorFigure 6: 40-Pin System Connector Pin NumberingDescription ODU Part Number Dimension A Dimension BSystem Connector 515.569.035.140.xxx 24.13 mm 22.86 mmMating Ribbon Connector 525.060.035.040.xxxSMT Mating Header 525.041.035.040.xxxRibbon cable, AWG 30 921.659.031.040.000Table 1: System Connector and Mating Part NumbersPlease consult the ODU site for more information on mating options: http://www.odu.de
ConfidentialUSERS MANUAL 12(42)Document number Revision4/198 17-LXE 108 566 Uen PA72.3.2 PinoutPin Signal DescriptionReserved1 I/O_1 / Timemark1 PPS output from GPS chip 12 VREF Logic Voltage ReferenceReserved3 I/O_3 / GPS_FIXLogic HIGH signal to indicate active GPS Fix 1Reserved4 I/O_4 / VRTCSupply pin for RTC 2and GPS regulators15 GND Chassis Ground6 GND Chassis Ground7 AFMS Analog Audio from module8 GND Chassis Ground9 AGND Analog Reference10 ATMS Analog Audio to moduleReserved11 INPUT1 / UART3_RXReceive Data for UART3 112 MODULE_PWR_EN_B Switches the module on/off (hardware-wise), active lowReserved13 OUTPUT1 / UART3_TXTransmit Data for UART3 114 OUTPUT2 Reserved15 HW_SD Hardware shutdown16 INPUT2 Reserved17 PCMCLK PCM Clock output from Module to Application18 PCMSYNC PCM Frame sync from Module to Application19 PCMULD PCM Voice input to Module from Application20 PCMDLD PCM Voice output from Module to Application21 GND Chassis Ground22 GND Chassis Ground23 DCD / VPPFLASH Data Carrier Detect & Flash programming voltage input24 RINGER Ringer output25 CTS Clear to send26 DTR Data Terminal Ready27 TD Transmit data, also known as DTMS28 RTS Request to Send29 VCC_AUX 13.8 VDC supply input30 RD Receive data, also known as DFMS31 VCC_AUX 13.8 VDC supply input32 VCC_AUX 13.8 VDC supply input33 VCC_MAIN 5 VDC regulated supply input34 VCC_MAIN 5 VDC regulated supply input35 SDA_SPI_IN Reserved36 SCL_SPI_CLK ReservedTransmit Data for UART237 SYS_DTM_2Transmit Data for GPS 138 SPI_OUT ReservedReceive Data for UART239 SYS_DFM_2Receive Data for GPS 140 RI Ring IndicatorTable 2: Pin-out of the System Connector Header1Default function if GPS option on board.2Default function if RTC option on board
ConfidentialUSERS MANUAL 13(42)Document number Revision4/198 17-LXE 108 566 Uen PA72.3.3 Logic LevelsMany of the signals present in the interface are CMOS signals where the followinglevels apply. The nominal voltage level for the CMOS signals is 2.9 V.LimitsParameters TestConditions Min Max UnitsHigh level output voltage (IOH = 800 µA) VOH 2.45 3.1 VoltsLow level output voltage (IOL= 800 µA) VOL0 0.45 VoltsHigh level input voltage (VIH= 800 µA) VIH1.9 3.1 VoltsLow level input voltage (VIL = 800 µA) VIL 0 0.9 VoltsTable 3: CMOS Output / Input Electrical Characteristics2.4 Power SupplyThe CM52 requires a dual DC power supply implementation in the application.VCC_MAIN provides power to the entire radio while VCC_AUX provides power for the3-Watt functionality and biasing for the RF switches. VCC_AUX must be present if the3W option is provided even if it is not used. If the 3W circuitry is not populated thenVCC_AUX is not required.The following table summarizes the power supply requirements from the application.Max. Current (Amps) Max. Ripple (mVpp)Input Supply Voltage(Volts DC) Operation 0- 4KHz 4 KHz-10MHzVCC_MAIN 5.00 ± 10% 1.0 100mVpp 50mVppVCC_AUX 13.8 ± 20% 1.3 600mVpp 240mVppVRTC(no GPS) 1.8 to 3.9 1.2 µVRTC(with GPS) 3.4 to 3.9 500 µTable 4: CM52 Power Supply Requirements2.4.1 Power Supply and Ground Signals2.4.1.1 Power Supply Signal PinsFollowing is a list of the power supply pins:
ConfidentialUSERS MANUAL 14(42)Document number Revision4/198 17-LXE 108 566 Uen PA7Pin Signal Description4VRTC31.8 V to 3.9V ( 3.4V to 3.9V if GPS mounted)29 VCC_AUX 13.8 volt ±20%31 VCC_AUX 13.8 volt ±20%32 VCC_AUX 13.8 volt ±20%33 VCC_MAIN 5 volt ±10% regulated34 VCC_MAIN 5 volt ±10% regulatedTable 5: CM52 Power Supply Signals2.4.1.2 Ground Signal Pins3The ground signal in the CM52 is Digital Ground, GND, connected to the systemconnector interface through pin numbers 5, 6, 8, 21 and 22.Following is a list of the ground pins:Pin Signal Description5GND Digital Ground6GND Digital Ground8GND Digital Ground21 GND Digital Ground22 GND Digital GroundTable 6: CM52 Ground SignalsDigital Ground (GND) is the logical reference of all digital signals in the SystemInterface as well as the DC return of the power supply signal, VCC_MAIN andVCC_AUX (used for AMPS Class I operation). All 5 ground pins in the module need tobe connected to the application ground. The PCB mounting holes will not substitute theregular ground connections.2.4.2 Power ConsumptionThe following tables show typical and maximum currents that can be expected from themodule for various conditions.3Only applicable to units with GPS or RTC functions
ConfidentialUSERS MANUAL 15(42)Document number Revision4/198 17-LXE 108 566 Uen PA7[VCC_AUX power supply supports the 3W mode AMPS circuitry]Parameter MinimumValue TypicalValue MaximumValue UnitsInput Voltage 11 13.8 16.6 VIn a Call on Power Level 0(Power Class I) 0.88 1.3 AIn a Call on Power Level 2 3.5 4.5 mAAMPS Burst Duration for networkupdate 0.16 sStand-by/Idle mode (RX ON) 0.5 1 µAPowered Down Current Draw 1 µAInrush Current (Entering PL0) 16 ADuration of Inrush (Entering PL0) 40 µsInrush Current (contact) 28 ADuration of Inrush (contact) 40 µsTable 7: VCC_AUX Supply Power ConsumptionNote: The typical values observed in AMPS call are made with voice channel set at358.
ConfidentialUSERS MANUAL 16(42)Document number Revision4/198 17-LXE 108 566 Uen PA7[VCC_MAIN supply is the primary CM52 power supply]Parameter MinimumValue TypicalValue MaximumValue UnitsInput Voltage 4.5 5 5.5 VIn AMPS Call on Power Level 0(Power Class I) 0.62 0.82 AIn AMPS Call on Power Level 2 0.94 1.4 AIn CDMA call-Cellular Mode 0.77 1.2 AIn CDMA call-PCS Mode 0.84 1.3 ACDMA burst duration for Networkupdate 1.2 sStandby/Idle Current Draw inSlotted Mode (CDMA)1.28 sec slot 9.6 mA2.56 sec slot 7.2 mA5.12 sec slot 4.5 mAStand-by/Idle mode (AMPS) 45 mAPowered Down Current Draw 1 5 µAInrush Current (on wake up) 2.2 3.3 ADuration of Inrush (on wake-up) 200 µsInrush Current (contact) 9.1 15 ADuration of Inrush (contact) 150 µsTable 8: VCC_MAIN Supply Power ConsumptionNotes1. The typical current measurements noted in CDMA mode are with the followingsettings:a. CDMA-Cellular (800MHz): Band = IS-2000, Cell-Power = -104dBm,Channel Number 358b. CDMA-PCS (1900MHz): Band = IS-2000, Cell-Power = -104dBm,Channel Number 563Maximum Slot Cycle Index for both 800MHz and 1900MHz modes = 12. The inrush current measurements noted here are with respect to the stand aloneCM52 module at room temperature, the results might vary when the CM52 is usedin the Customer Application.3. Measurements are based on worst case scenario—CM52 with 3W option. Valuesfor CM52 with no 3W option could be marginally lower.4. A +20% tolerance is considered for the listed maximum values.
ConfidentialUSERS MANUAL 17(42)Document number Revision4/198 17-LXE 108 566 Uen PA72.4.2.1 Wakeup-Inrush CurrentThe wakeup inrush current occurs when the MODULE_PWR_EN_B signal transitionsfrom High to Low. The wakeup-inrush event occurs on the VCC_MAIN supply input andnot the VCC_AUX supply. The magnitude of the inrush is dependent on power supplyoutput impedance.2.4.2.2 Contact-Inrush CurrentThe contact inrush current simulates application of power to the VCC_MAIN input linesand measures the impact of the input impedance of the module.While holding the MODULE_PWR_EN_B signal HIGH, a direct contact of VCC_MAINinput pins to the output of the corresponding VCC_MAIN power supply is made and thepeak current measured. Similarly the contact inrush current of the VCC_AUX lines wasmeasured by making a direct contact of VCC_AUX pins to the output of thecorresponding VCC_AUX power supply.2.4.2.3 Power Down Mode (Minimum DC Power Consumption)In power down mode the module is placed in a low power consumption state undercontrol of the host application. In this mode, the unit consumes approximately 1 uA ofcurrent as measured from the VCC_MAIN supply input and 1 uA of current asmeasured from the VCC_AUX supply input. To activate this mode, theModule_PWR_EN_B signal on pin 12 of the system connector is pulled to a logic level1, which puts the module into the low power state. The module will stay in the lowpower state until the Module_PWR_EN_B signal is driven low by an external opencollector transistor in the application circuitry. Turning the external open collectortransistor off will cause the Module_PWR_EN_B signal to float high and turn the moduleoff. The Module_PWR_EN_B line is tied to VCC_MAIN through a 220kpull-upresistor so the sink current in the external open collector transistor is minimal.2.4.3 VREF Signal DetailsThe following table defines the current sourcing capabilities and behavior of the VREFsignal.Parameter Min Typical Max UnitsSupply Voltage Reference 2.45 2.9 3.1 VOutput Current 1000 µAApplication Load 10 100 KRise Time 3300 µsFall Time 0.8 ms Table 9: VREF Supply Details
ConfidentialUSERS MANUAL 18(42)Document number Revision4/198 17-LXE 108 566 Uen PA72.5 Real Time Clock (RTC) CircuitThe purpose of this section is to detail the design of incorporating the Real Time Clockfeature into the CM52.Figure 7: RTC Functional Block Diagram2.6 Audio InterfaceThe audio-related signals are: the analog audio signals•ATMS (Audio to Mobile Station),•AFMS (Audio from Mobile Station),•PCM (Pulse Code Modulation) signals (PCMULD,PCMDLD,PCMCLK, andPCMSYNC).Pin Signal Description7AFMS Audio Output From Module.10 ATMS Audio Input to Module.9AGND Analog Reference17 PCMCLK PCM Clock Output from module.18 PCMSYNC PCM Frame Sync Output from module.19 PCMULD PCM Voice Input to module20 PCMDLD PCM Voice Output from module.Table 10: CM52 Audio SignalsRadioRTC(HH:MM)ApplicationBatteryModule_PWR_EN_B HW_SHDNUARTRing Indicator
ConfidentialUSERS MANUAL 19(42)Document number Revision4/198 17-LXE 108 566 Uen PA72.6.1 Digital AudioThe CM52 provides digital audio capability over the system connector. The digital audiosignals enable the connection of a digital audio source. The receiver is bypassing theanalog audio processing functions performed within the module. The digital audiointerface includes the following PCM signals:Pin CM52 Description17 PCMCLK PCM Clock Output from module.18 PCMSYNC PCM Frame Sync from module19 PCMULD PCM Voice Input to module.20 PCMDLD PCM Voice Output from module.Table 11: CM52 Digital Audio SignalsAlready defined CMOS output/input electrical characteristics apply (see Section 2.3.3).The PCM format (for PCMULD and PCMDLD) follows a linear PCM data format with13-bit data embedded in a 16-bit word. The data bits in PCMULD (input) and PCMDLD(output) are aligned so that the MSB in each word occurs on the same clock edge. Seetiming diagram in 2.6.1.2.2.6.1.1 Data FormatThe CM-52 module implements a 13-bit PCM with the 13-bit data embedded in a 16-bitword as follows.Each PCM word shall contain 16-bits D15 – D00. D15 – D03 is the 2´s-complementvalue of the 13-bit PCM, with D15 as the sign bit. D15 is the MSB while D03 is the LSB.Note that the MSB is sent in first place. Ensure that the read data from PCMDLD is rightshifted three times and sign extended before being used13-bit linear15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0MSB LSB x x xBit ContentsD15 –D03 Two complement of the 13-bit PCM.D02 –D00 Bits are undefined.2.6.1.2 TimingTiming shall be according to the following diagram (see Figure 8: PCM TimingDiagram). The signals in the diagram shall be interpreted according to the followingrelation.
ConfidentialUSERS MANUAL 20(42)Document number Revision4/198 17-LXE 108 566 Uen PA7Figure 8: PCM Timing DiagramThe meaning and value of the timing parameters are described in Table 12.Name Description Min Typical Max UnitPCM_SYNC cycle time. 125 µstSYNC PCM_SYNC frequency 8.0 kHztSYNCA PCM_SYNC asserted time. 62.4 62.5 µstSYNCD PCM_SYNC de-asserted time. 62.4 62.5 µstSU(SYNC) PCM_SYNC setup time to PCM_CLK rising. 1.95 µstH(SYNC) PCM_SYNC hold time after PCM_CLKfalling. 1.95 µsPCM_CLK cycle time. 7.8 µstCLK PCM_CLK frequency 128 kHztCLKH PCM_CLK high time. 3.8 3.9 µstCLKL PCM_CLK low time. 3.8 3.9 µstPDLD Propagation delay from PCM_CLK rising toPCM_DLD valid. 50 nsTSU(ULD)PCM_ULD setup time to PCM_CLK falling. 70 nsTH(ULD) PCM_ULD hold time after PCM_CLK falling. 20 nsTable 12: PCM Timing Parameters
ConfidentialUSERS MANUAL 21(42)Document number Revision4/198 17-LXE 108 566 Uen PA72.6.2 Analog AudioATMS is the analog audio input to the module. When it is active, it is connected to theradio via the audio processing stages in the module.The AFMS is the analog audio output from the module. When it is active it is connectedto the radio via the audio processing stages in the module.The AGND is the analog reference signal. ATMS and AFMS are referenced to thissignal, which is connected to GND in one place inside the module.Pin Signal Description7AFMS Audio Output From Module10 ATMS Audio Input To Module9AGND Analog ReferenceTable 13: CM52 Analog Audio SignalsSignal ParameterModule audio output 300 – 3400 HzOutput Impedance Rout 100 Drive capacity into 10 k3.77 VP-P max. or 2.5 dBVExternal Device audio inputimpedance Zin 10 kVolume control -81 dB from maximum > - 81 dB (mute)AFMSSensitivity 1004 Hz tone at 8kHz deviationgenerates 900+100 mVrms.Sources are preferably ACcoupled. Cout 2.2uFExternal Device audio sourceOutput resistance Rout 1.0 kModule audio input impedance Zin 10 kLevels from external audiosource (maximum) 3.77 VP-P max. or 2.5 dBVATMSSensitivity 1004 Hz tone at 900+100 mVrmsgenerates 8kHz deviation.Table 14: Audio CharacteristicsAnalog Reference (AGND)•The AGND lead is the analog audio reference ground. It is the return signal forAudio To Mobile Station (ATMS), Audio From Mobile Station (AFMS).•Electrical characteristics: Imax < 40 mA (peak)•The AGND is connected to the chassis Ground (GND) in the CM52 module, andonly there. The application should be connected to GND and only use AGND asreference for the audio lines ATMS and AFMS.•The PCM signals are referenced to digital ground.
ConfidentialUSERS MANUAL 22(42)Document number Revision4/198 17-LXE 108 566 Uen PA7Application Implementation:BIAS:An analog ground plane should be generated, which connects to GND in onepoint so that high frequency digital current is not floating through the analog ground.Connecting the analog ground in only one point also avoids ground currents from powersupplies and other high current circuitry from creating noise in the analog circuitry. Thevoltage supply for the analog circuitry should connect its ground pin as close aspossible to the point where the analog ground connects to GND. The BIAS reference isgenerated from this supply voltage and analog ground, and shall be used as areference for all analog circuitry in the application. Note that Analog Ground and AGNDare two different signals. Analog Ground is the ground plane used by the application. Itshould be connected to the application’s GND in one point preferably at the regulatorthat generates the analog supply voltage. AGND is the analog audio referencereceived from the phone. This is a signal with the intent to be used together with ATMSand AFMS as a semi differential interface between the module and the application.RegulatorVINGNDRRVCCBIASAnalog GroundATMS:An application using the analog audio interface must re-reference the signalfrom its own internal BIAS to AGND. The figure below shows an example of amicrophone implementation.0-+0VCC0-+0<=1kBIAS>=2.2uF ATMSAGND>=2.2uF++The microphone should preferably be connected to its pre-amplifier differentially, whichwill minimize noise pickup from possible ground current.
ConfidentialUSERS MANUAL 23(42)Document number Revision4/198 17-LXE 108 566 Uen PA7AFMS:An application using the analog audio interface must re-reference the AFMS-signal from AGND to its own internal BIAS. The figure shows a differentialimplementation. C1 is chosen to create the correct HP frequency response. R1 and R2determine the gain, and C2 and R2 determine the LP frequency response.0-+0R1>=10kR1>=10kR2R2C1C1C2C2 BIASAFMSAGNDInternal App +Internal App -
ConfidentialUSERS MANUAL 24(42)Document number Revision4/198 17-LXE 108 566 Uen PA72.7 Serial Data InterfaceThe serial channels are used as asynchronous communication links between theapplication system and the module. The following table shows the serial data channelsrelated signals:Pin Signal Description Dir23 DCD Data Carrier DetectThis signal is set default high. It goes low indicating that a data callis established (CONNECT received from the remote modem). Thesignal goes high when the data connection is disconnected.O25 CTS Clear ToSendThis signal is initially set high, indicating that the module is not readyto receive data. It is set low after the module is done performing itsstartup procedure indicating that it is ready to receive data.O26 DTR Data Terminal ReadyThis signal should be set low by the application during a data call. Alow to high transition will terminate the data call.I27 TD Transmit Serial Data To Module (DTMS)The application shall set this signal high at startup.I28 RTS Request ToSendThe application shall set this pin low when it is ready to receive data.I30 RD Receive Serial Data From Module (DFMS)The module will set this signal high at startup.OTable 15: Serial Data ChannelsThe common CMOS electrical specifications defined in Section 2.3.3 are valid for allthese signals. The standard character format is 1 start bit, 8 data bits, non-parity and 1stop bit. In all, there are 10 bits per character.Note! The signal levels do not match the standard RS-232 (V.28). If the applicationsignal levels are not compatible with the CMOS levels described in Table 3: CMOSOutput / Input Electrical Characteristics, then electrical protection level limiters orlevel conversion hardware will be necessary between the CM-52 module and theapplication.
ConfidentialUSERS MANUAL 25(42)Document number Revision4/198 17-LXE 108 566 Uen PA72.8 Antenna InterfaceThe antenna interface of the CM52 consists of a single or dual RF connector for theradio with optional antenna diagnostics, and a single RF connector for the optional GPSfunction.2.8.1 Antenna ConnectorA variety of antenna connectors are available for the CM-52 module including SMA,SMB, MCX, and BNC. A standard 5-pin, thru-hole pattern has been selected becauseof the wide variety of compatible connectors available and also for the maximummechanical strength.For automotive applications, a FAKRA-type connector is available which provides adouble locking mechanism as well as a keyed, color-coded interface as shown below:ABlackBNaturalCBlueDVioletEGreenFBrownGGrayHVioletIBeige KCurryZWaterblueFigure 9: Color and Keying for various FAKRA connectors
ConfidentialUSERS MANUAL 26(42)Document number Revision4/198 17-LXE 108 566 Uen PA7The physical dimensions of a sample SMA connector and mounting hole are shown inthe drawing below.Electrical performance parameters are valid only when the terminating impedance atthe output of the antenna connector exhibits a VSWR of less than 2:1 for all phaseangles in the frequency band of operation. High VSWR loads at the antenna connectoradversely affect current consumption, linearity, and power efficiency of the module andmay degrade operation; however, internal protection circuitry has been added to thedesign to prevent damage.The performance of the module as defined in Section 2.8.2 of this manual is referencedto the antenna connector. The antenna connectors must not negatively affect theperformance of the CM52. For this reason, all options are discrete connectors and thusdo not include cable assemblies.The table below lists several suppliers of antenna connectors that are available.Description Vendor / Part # Additional InformationRF Connectors and cabling ITT Cannon / Various http://www.ittcannon.comRF Connectors and cabling Amphenol RF / Various http://www.amphenolrf.comRF Connectors and cabling Hirschmann / Various http://portal.hirschmann.com
ConfidentialUSERS MANUAL 27(42)Document number Revision4/198 17-LXE 108 566 Uen PA72.8.2 RF Output PowerThe CM52 is able to operate in several modes and different output power level.Applications may require output power levels similar to those in a handheld cellularphone or higher levels commonly required in rural areas. The following tables show thenominal power provided by the CM52.Mobile Station Power Level (dBm)0 1 2 3 4 5 6 7Class I, AMPS 34.8 31 26.3 24 20 16 12 8Class III, AMPS 26.3 26.3 26.3 24 20 16 12 8Table 16: Mobile Station Nominal Analog Power LevelsNote: These numbers represent the Nominal Output Power4in AMPS mode and arereferenced to the antenna connector. Analog output power levels are as defined for aPower Class I device in Industry Specification EIA/TIA IS-91.Mobile Station Power Level (dBm)Lower Limit Upper LimitClass III, CDMA Band Class 0 23 dBm (0.2 Watts) 30 dBm (1.0 Watts)Class II, CDMA Band Class 1 23 dBm (0.2 Watts) 30 dBm (1.0 Watts)Table 17: Mobile Station CDMA Maximum Output Power2.8.3 Carrier ApprovalThe CM52 will undergo carrier qualification. Approval of the CM52 is sought referencedto the antenna connector. Any applications intending to use the CM52 will likely berequired to undergo similar testing with the CM52 integrated into the application. Forthis reason it is strongly recommended that the application is designed to accommodateexposing the antenna connector(s) of the CM52. This will help insure that thequalification of the application with the carrier will be successful.2.8.4 Antenna DiagnosticsThe antenna diagnostics function consists of one antenna detection circuit per RFconnector. Each detection circuit can support antenna resistance (RL) values of 1 Kto 20 Kand 49.9 K. Internal resistance (R) value is either 10 Kor 49.9 K, asrequired by the customer’s application.AT commands are provided to query the status, query the limits and set the limits forthe status: GOOD, OPEN, or SHORTED. These commands are detailed in the CM52Software User’s Guide and AT Command.The drawing below is a high level description of the antenna diagnostics circuit.4PL0 and PL1 require VCC_AUX = 13.8V
ConfidentialUSERS MANUAL 28(42)Document number Revision4/198 17-LXE 108 566 Uen PA7Figure 10: Antenna Diagnostic CircuitThe current antenna status is based on a comparison between the voltage measured atthe antenna connector and the limits set by the application for OPEN and SHORTED.
ConfidentialUSERS MANUAL 29(42)Document number Revision4/198 17-LXE 108 566 Uen PA73 Recommended CircuitryAbbreviations:•VCC - Represents the logic supply voltage used by the application.•VREF - Current amplified reference voltage used as supply voltage for all logicinterface circuitry.Component proposals:•Transistors not showing a base resistor should be interpreted as a BRT (Built inResistor Transistor) i.e. Toshiba RN1308.•The inverting buffers should preferably be Schmitt-Triggered, i.e. Toshiba TC7S14or similar.3.1 Status Group Recommended CircuitryThe status group contains four signals, one output signal from the application and threeinput signals to the application.Phone ModuleApplication12, MODULE_PWR_EN_B0 = Phone Module Power OFF1 = Phone Module Power ON+-00 - 1k0 -10 ohm5V2, VREF1M10uFVREF5VVREF40, RI1 - 100kVCCRing Indicator24, RINGERVCC15, HW_SD100Shutdown RequestShutdown Indicate
ConfidentialUSERS MANUAL 30(42)Document number Revision4/198 17-LXE 108 566 Uen PA73.1.1 MODULE_PWR_EN_BThis signal, located on pin 12 in the system connector, enables the main 5V supply inthe phone module so that it powers on. This is an open collector input to the phonemodule. Its reference voltage is the main 5V supply.3.1.2 VREFThis signal, located on pin 2 in the system connector, provides the application with itslogic supply voltage. The application can current-amplify this signal and use it to supplyits interface circuits.3.1.3 HW_SDThis signal, located on pin 15 in the system connector, provides the ability of performinga hardware shutdown of the module. It is a bi-directional signal that is pulled up insidethe phone module.Shut down sequence:1 To request a shutdown of the phone module, the application should provide anactive low pulse of 100 ± 25 ms on the HW_SD pin through an open collectoroutput.2 This pulse is detected by the module, which confirms the request by enabling itsHW_SD output, setting it active low.3 The application waits for the HW_SD pin to become inactive high.4 The module has performed its power down sequence and disables its outputresulting in HW_SD becoming inactive high.5 The application shuts down, disabling MODULE_PWR_EN_B.ShutdownIndicateShutdownRequest ShutdownConfirmShutdownDetectVREF15, HW_SDApplication Phone Module
ConfidentialUSERS MANUAL 31(42)Document number Revision4/198 17-LXE 108 566 Uen PA73.2 Data Group Recommended CircuitryThe data group contains six signals, three output signals from application, two inputsignals to application, and one I/O signal.HW_SDShutdownRequestShutdownConfirm1423MODULE_PWR_EN_B5
ConfidentialUSERS MANUAL 32(42)Document number Revision4/198 17-LXE 108 566 Uen PA73.2.1 VPPFLASH/DCDThis signal, located on pin 23 in the system connector, can be used by the applicationto enable flashing of the phone module. To enter flash-mode, the application shall setVPPFLASH_EN active high, then enable the MODULE_PWR_EN_B pin.VREF30, RD (DFMS)25, CTS1 - 100kVCCRxDCTSPhone ModuleApplicationVREF27, TD (DTMS)28, RTS26, DTR1 - 100kVREFTxDRTSDTRVREF23, VPPFLASH/DCD1 - 100kVCCDCD100kVREFVPPFLASH_EN1 - 100kVREF
ConfidentialUSERS MANUAL 33(42)Document number Revision4/198 17-LXE 108 566 Uen PA73.3 PCM Group Recommended CircuitryThe PCM group contains four signals, three input signals to the application, and oneoutput signal from the application.
ConfidentialUSERS MANUAL 34(42)Document number Revision4/198 17-LXE 108 566 Uen PA73.4 Analog Audio Group Recommended Circuitry3.4.1 Creating an analog groundAn analog ground plane should be generated, which connects to GND in one point sothat high frequency digital current is not floating through the analog ground. Connectingthe analog ground in only one point avoids ground currents from power supplies andother high current circuitry from creating noise in the analog circuitry. This commonpoint should be located where the analog supply voltage (VANA) is generated (at filter(A), or regulator (B) depending on implementation).3.4.2 Creating an analog reference voltage (BIAS)The BIAS reference should be generated from the analog supply voltage (VANA) andbe referenced to the analog ground. This reference shall be used to bias all analogcircuitry in the application.5V VANA12VVANARegulatorBA-+0100k100kVANABIAS
ConfidentialUSERS MANUAL 35(42)Document number Revision4/198 17-LXE 108 566 Uen PA7The bias can be tapped directly from the resistor voltage divider, but the amplifier willmake the bias more stable and less susceptible to noise.3.4.3 Analog ground vs. AGNDThe AGND signal output from the module is not a ground. It is an analog reference,which is connected to the main ground used by the module in one place inside themodule. It should not under any circumstances be used as a ground or connected to aground in the application.AGND must be treated as a signal. Together with ATMS and AFMS it creates a semidifferential interface. The analog ground shall be used as ground plane for the analogcircuitry of the application. It should not be connected to the AGND signal output fromthe phone module.3.4.4 Microphone pathAn application using the analog audio interface must re-reference the signal from itsown internal BIAS to AGND received from the module.The figure below shows an example of a microphone implementation.The microphone should preferably be connected to its pre-amplifier differentially, whichwill minimize noise picked up along the way from the microphone to its amplifier. If theimpedance is the same on both microphone lines, and the lines are run in parallel, thesame amount of noise is picked up on both lines. This noise is then removed in thedifferential amplifier stage.0-+0R2R2R3R3R1R1VCCC2C2C3C30-+0R4R4R5R5C5C5<=1kBIAS>=2.2uF ATMSAGND>=2.2uF++
ConfidentialUSERS MANUAL 36(42)Document number Revision4/198 17-LXE 108 566 Uen PA73.4.5 Loudspeaker pathAn application using the analog audio interface must re-reference the AFMS-signal fromAGND to its own internal BIAS. The figure shows a differential implementation. C1 ischosen to create the correct HP frequency response. R1 and R2 determine the gain,and C2 and R2 determine the LP frequency response.0-+0R1>=10kR1>=10kR2R2C1C1C2C2BIASAFMSAGNDInternal App +Internal App -
ConfidentialUSERS MANUAL 37(42)Document number Revision4/198 17-LXE 108 566 Uen PA73.5 System connector IO functionalityNote 1: The application IO can be one of the following listed types:•I Logic input (no pull up or pull down resistors required).•IOC Logic open-collector input.•O Logic output (no pull up or pull down resistors required).•OOC Logic open-collector output.•I/O Logic I/O.The pin direction in this table is referenced from the application’s point of view.Group Pin No Name Application Requirements App I/OHW flow control is by default enabled in the phone module.27 TD (DTMS) Logic output to phone module. The application shall set thisoutput high upon start-up. O30 RD (DFMS) Logic input from phone module. I28 RTS Logic output to phone module. Pulled down by the phonemodule (R > 20k). The application shall set this pin low whenready to receive data.O25 CTSLogic input from phone module. This signal is initially sethigh, indicating that the phone module is not ready to receivedata. It is set low when the phone module is ready to receivedata.I26 DTRLogic output to phone module. This signal is pulled up in thephone module (R > 20k).This signal should be set low by the application during a datacall. A low to high transition will terminate the data call.This signal is asserted by the application when it wishes toopen a communications channel. The phone module thenprepares the modem to be connected to the telephone circuit,and, once connected, maintains the connection. When DTR isde-asserted, the phone module is switched to "on-hook" toterminate the connection.OData23 VPPFLASH/DCDDCD: Logic input from phone module. This signal is setdefault high. It goes low indicating that a data call isestablished, (CONNECT) received from remote modem. Thesignal goes high when data connection is disconnected.Sent from the phone module (DCE) to the application (DTE) toindicate that it has received a basic carrier signal from a(remote) DCE.VPPFLASH: The application shall not apply a voltage to thispin unless they intend to use it as VPPFLASH in which case itbecomes a power output.I/O
ConfidentialUSERS MANUAL 38(42)Document number Revision4/198 17-LXE 108 566 Uen PA7Group Pin No Name Application Requirements App I/O19 PCMULD Logic output to phone module. O20 PCMDLD Logic input from phone module. I18 PCMSYNC Logic input from phone module. IPCM17 PCMCLK Logic input from phone module. I9 AGNDAnalog reference. This signal is an analog referenceoutput by the phone module. This signal is connectedto GND in one place in the phone module. Under nocircumstances shall it be connected to any ground orbe used as ground in the application.See 2.4 for more detailed information.I10 AUX1(ATMS) Single ended audio output to phone module. OAnalogAudio7 AUX0(AFMS) Single ended audio input from phone module. I12 MODULE_PWR_EN_B Logic open collector output that is set low by theapplication to enable power to the phone module. Thepull-up resistor resides in the phone module. OOC2 VREF Phone module logic voltage sense input to application.This signal provides the application with the logicsystem voltage level used by the phone module. I40 RIThis signal is used to indicate to the application of anincoming voice or data call or SMS. The event isindicated by the signals falling edge and remains lowfor 100 ms.I24 RINGER5Pulse Modulated logic input from phone module. Theapplication must provide power amplification if thecurrent draw is expected to exceed 1mA. IStatus15 HW_SD Bi-directional signal, default set to be an open collectoroutput from the application.OOCI39 CFMS No termination. Leave open. I37 CTMS No termination. Leave open. O36 Reserved No termination. Leave open. IOC35 Reserved No termination. Leave open. IOC38 Reserved No termination. Leave open. O4 IO_4_VRTC No termination. Leave open. I/O3 IO_3_GPS_FIX No termination. Leave open. I/OUnused1 IO_1_TIMEMARK No termination. Leave open. I/O5Not currently Implemented in the CM52.
ConfidentialUSERS MANUAL 39(42)Document number Revision4/198 17-LXE 108 566 Uen PA713 OUTPUT1 No termination. Leave open. I16 INPUT2 No termination. Leave open. O11 INPUT1 No termination. Leave open. OReserved14 OUTPUT2 No termination. Leave open. ITable 18: Pin Direction for General Purpose Signals
ConfidentialUSERS MANUAL 40(42)Document number Revision4/198 17-LXE 108 566 Uen PA74 Functional DescriptionThe CM52 module performs a set of telecom services according to TIA/EIA-IS-2000.The functions of the display and keypad, usually used to make calls, are implementedby issuing AT Commands over the serial interface.See the CM52 Software User's Guide and AT Command Manual for a completefunctional description and user scenarios for the CM52.5 Hints for Integrating the ModuleThis section, which gives you advice and helpful hints on how to integrate the CM-52with the application, should be taken as a guide.Note! The circuits on the test board are not shielded. Therefore, take properprecautions for avoiding ESD and EMI.5.1 PrecautionsHere is a list of preparations that you should make before beginning the integrationwork that is described in this section.•Where to install the module.•Safety standards•Network and subscription•Antenna5.2 Where to Install the ModuleMake sure that the module is installed so that the environmental conditions, such astemperature, humidity, vibration, etc., are not beyond the limits specified for it.Make sure that the signal strength is sufficient. To improve signal strength, move theantenna to another position. Signal strength may depend on how close the module is toa radio base station. Degradation in signal strength could be a result of disturbancefrom another source, for example, an electronic device nearby.You can verify signal strength by issuing the AT command AT+CSQ. See the CM52Software User’s Guide and AT Command for a description of this and other useful ATcommands.Tip! Before installing the module, use an ordinary mobile telephone to check a possiblelocation for it. Consider signal strength as well as cable length in determining thelocation for the module and antenna. That way, you will find out if it is practical to installthe module where you intended.5.3 Safety StandardsYou are responsible for observing your country’s safety standards and the relevantwiring rules, where applicable.
ConfidentialUSERS MANUAL 41(42)Document number Revision4/198 17-LXE 108 566 Uen PA75.4 Antenna5.4.1 Antenna TypeWhen choosing an antenna for your application you must consider the followingrequirements:•The antenna must be designed for the AMPS/CDMA 800 and CDMA 1900 MHzfrequency band (dual band) for the CM-52.•The impedance of the antenna and antenna cable must be 50 .•The VSWR value should be less than 2:1.5.4.2 Antenna PlacementAlways follow the instructions supplied by the antenna manufacturer.You should place the antenna away from electronic devices or other antennas. Therecommended minimum distance between adjacent antennas operating in a similarradio frequency band is at least 50 centimeters.If the module is used in the Class I AMPS mode, a separation distance of at least 23centimeters must be maintained between the radiating antenna and the user or nearbypersons. In this mode of operation, the combined connection cable path loss andantenna gain must also be no greater than 1 dBi.5.5 Possible Communication DisturbancesNoise can be caused by electronic devices and radio transmitters.Free Space Path-loss occurs as the strength of the received signal steadily decreaseswith the distance from the transmitter.Shadowing is a form of environmental attenuation of radio signals that is caused by hills,buildings, trees or even vehicles. Inside buildings this can cause problems, especially ifthe walls are thick and reinforced.Multi-path fading is a sudden decrease or increase in the signal strength. This is theresult of interference caused when direct and reflected signals reach the mobile phonesimultaneously. Flat surfaces such as buildings, streets, vehicles, etc, can reflectsignals.
ConfidentialUSERS MANUAL 42(42)Document number Revision4/198 17-LXE 108 566 Uen PA76 Technical DataMechanical specificationsMaximum length: 114 mmMaximum width: 49.50 mmMaximum thickness: 18.97 mmWeight: 68.2 gPower supply voltage, normal operation VCC_MAIN VCC_AUXNominal Voltage: 5.00 Volts 13.8 VoltsVoltage range: 4.50 – 5.50 Volts 11.0 – 16.5 VoltsRadio specifications AMPS CDMA (BC-0) CDMA (BC-1)Frequency range: TX: 824 – 849RX: 869 – 894 TX: 824 – 849RX: 869 – 894 TX: 1850-1910RX: 1930-1990Antenna impedance: 50 50 50 VSWR (Maximum): 2:1 2:1 2:1Environmental specificationsOperating temperature range: -30°C to +70°C: EIA/TIA/IS-2000+70°C to +85°C: –3dB Degradation beyond +70°C SpecStorage temperature range: -40 0C to +85 0CMaximum relative humidity: 95% ±3% at +40 0CStationary vibration, random Acceleration spectral density (m2/s2): 0.96 2.88 0.96Frequency range: 5-10 10-200 200-50060 min per/axisNon-stationary vibration, including shock Shock response spectrum I, peak acceleration:- 3 shocks in each axis and direction: 300 m/s2, 11 msShock response spectrum II, peak acceleration:- 3 shocks in each axis and direction: 1000 m/s2, 6 msBump: Acceleration 250 m/s2Free fall transportation: 1.0 mRolling pitching transportation: Angle: 35 degrees, period: 8sStatic load: 10 kPaLow air pressure/high air pressure: 70 kPa / 106 kPa

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