Sierra Wireless MC7475 Radio Module User Manual AirPrime MC7475 Product Technical Specification

Sierra Wireless Inc. Radio Module AirPrime MC7475 Product Technical Specification

Contents

MC7475 User Manual_r3

AirPrime MC7475Product Technical Specification41110251Rev 3Proprietary and ConfidentialContents subject to change
Product Technical SpecificationRev 3 Sep.17 2 41110251Important NoticeDue to the nature of wireless communications, transmission and reception of data can never be guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost. Although significant delays or losses of data are rare when wireless devices such as the Sierra Wireless modem are used in a normal manner with a well-constructed network, the Sierra Wireless modem should not be used in situations where failure to transmit or receive data could result in damage of any kind to the user or any other party, including but not limited to personal injury, death, or loss of property. Sierra Wireless accepts no responsibility for damages of any kind resulting from delays or errors in data transmitted or received using the Sierra Wireless modem, or for failure of the Sierra Wireless modem to transmit or receive such data.Safety and HazardsDo not operate the Sierra Wireless modem in areas where blasting is in progress, where explosive atmospheres may be present, near medical equipment, near life support equipment, or any equipment which may be susceptible to any form of radio interference. In such areas, the Sierra Wireless modem MUST BE POWERED OFF. The Sierra Wireless modem can transmit signals that could interfere with this equipment.Do not operate the Sierra Wireless modem in any aircraft, whether the aircraft is on the ground or in flight. In aircraft, the Sierra Wireless modem MUST BE POWERED OFF. When operating, the Sierra Wireless modem can transmit signals that could interfere with various onboard systems.Note: Some airlines may permit the use of cellular phones while the aircraft is on the ground and the door is open. Sierra Wireless modems may be used at this time.The driver or operator of any vehicle should not operate the Sierra Wireless modem while in control of a vehicle. Doing so will detract from the driver or operator's control and operation of that vehicle. In some states and provinces, operating such communications devices while in control of a vehicle is an offence.Limitation of LiabilityThe information in this manual is subject to change without notice and does not represent a commitment on the part of Sierra Wireless. SIERRA WIRELESS AND ITS AFFILIATES SPECIFICALLY DISCLAIM LIABILITY FOR ANY AND ALL DIRECT, INDIRECT, SPECIAL, GENERAL, INCIDENTAL, CONSEQUENTIAL, PUNITIVE OR EXEMPLARY DAMAGES INCLUDING, BUT NOT LIMITED TO, LOSS OF PROFITS OR REVENUE OR ANTICIPATED PROFITS OR REVENUE ARISING OUT OF THE USE OR INABILITY TO USE ANY SIERRA WIRELESS PRODUCT, EVEN IF SIERRA WIRELESS AND/OR ITS AFFILIATES HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES OR THEY ARE FORESEEABLE OR FOR CLAIMS BY ANY THIRD PARTY.Notwithstanding the foregoing, in no event shall Sierra Wireless and/or its affiliates aggregate liability arising under or in connection with the Sierra Wireless product, regardless of the number of events, occurrences, or claims giving rise to liability, be in excess of the price paid by the purchaser for the Sierra Wireless product.
PrefaceRev 3 Sep.17 3 41110251Copyright ©2017 Sierra Wireless. All rights reserved.Trademarks Sierra Wireless®, AirPrime®, AirLink®, AirVantage® and the Sierra Wireless logo are registered trademarks of Sierra Wireless, Inc.Windows® and Windows Vista® are registered trademarks of Microsoft Corporation.Other trademarks are the property of their respective owners.Contact InformationRevision History Sales information and technical support, including warranty and returns Web: sierrawireless.com/company/contact-us/Global toll-free number: 1-877-687-77956:00 am to 5:00 pm PSTCorporate and product information Web: sierrawireless.comRevision number Release date Changes1June 2017 Initial release2June 2017 Updated Miscellaneous DC Power Consumption table:·Updated notes, corrected module number typo3September 2017 Updated Regulatory section (antenna gain, EIRP limit, FCC ID, FCC Part 27 notice)Updated GPS Specifications—Acquisition timesUpdated module dimensionsUpdated dimensioned view figureUpdated sample labelUpdated Copper Pad Location figure
Rev 3 Sep.17 4 41110251ContentsIntroduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9Supported RF Bands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9Physical Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9Application Interface Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9Modem Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10LTE Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10Position Location (GPS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10Supporting Documents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10Required Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11Integration Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11Standards Compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13Host Interface Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18USB Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18USB Throughput Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18SIM Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19SIM Implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21Control Interface (Signals) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22WAKE_N — Wake Host . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22WAN_LED_N—LED Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22SYSTEM_RESET_N—Reset Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23Antenna Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23RF Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24RF Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24Shielding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24Antenna and Cabling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25Ground Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
ContentsRev 3 Sep.17 5 41110251Interference and Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26Interference From Other Wireless Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26Host-generated RF Interference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26Device-generated RF Interference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26Methods to Mitigate Decreased Rx Performance . . . . . . . . . . . . . . . . . . . . . . . . . . 27Radiated Spurious Emissions (RSE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27Radiated Sensitivity Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27Sierra Wireless’ Sensitivity Testing and Desensitization Investigation . . . . . . . . . . 27Sensitivity vs. Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28Supported Frequencies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28Conducted Rx Sensitivity / Tx Power. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28GPS Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30Power Consumption. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30Power Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31Power Ramp-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31Power-On/Off Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31Power Supply Noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33Mechanical and Environmental Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34Device Views . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35Labeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36Electrostatic Discharge (ESD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36Thermal Considerations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37Regulatory Compliance and Industry Certifications . . . . . . . . . . . . . . . . . . . . . . . . . . . 40Important Notice. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40Safety and Hazards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40Important Compliance Information for the United States of America. . . . . . . . . . . . . . 41Antenna Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43Recommended Main/Rx Diversity Antenna Specifications . . . . . . . . . . . . . . . . . . . . . 43
Product Technical SpecificationRev 3 Sep.17 6 41110251Recommended GPS Antenna Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45Antenna Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45Design Checklist . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51Sierra Wireless Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51Command Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51Industry/Other Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51Acronyms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52Index. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Rev 3 Sep.17 7 41110251List of TablesTable 1-1: Supported RF Bands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9Table 1-2: Required Host-Module Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11Table 2-1: Standards Compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12Table 3-1: Connector Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14Table 3-2: Power and Ground Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18Table 3-3: USB Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18Table 3-4: SIM Interface Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19Table 3-5: Module Control Signals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22Table 3-6: Antenna Control Signals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23Table 4-1: LTE Frequency Bands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28Table 4-2: Conducted Rx (Receive) Sensitivity—LTE Bands . . . . . . . . . . . . . . . . . . . . . . 28Table 4-3: Conducted Tx (Transmit) Power Tolerances . . . . . . . . . . . . . . . . . . . . . . . . . . 28Table 4-4: GPS Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29Table 5-1: Averaged Standby DC Power Consumption. . . . . . . . . . . . . . . . . . . . . . . . . . . 30Table 5-2: Averaged Call Mode DC Power Consumption . . . . . . . . . . . . . . . . . . . . . . . . . 31Table 5-3: Miscellaneous DC Power Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31Table 5-4: USB 2.0 Power-On/Off Timing Parameters (Double Enumeration) . . . . . . . . . 32Table 5-5: USB 2.0 Power-On/Off Timing Parameters (Single Enumeration) . . . . . . . . . . 32Table 6-1: Mechanical and Environmental Specifications . . . . . . . . . . . . . . . . . . . . . . . . . 34Table 7-1: Antenna Gain Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41Table 7-2: Collocated Radio Transmitter Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . 42Table 8-1: Antenna Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43Table 8-2: GPS Antenna Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45Table 9-1: Hardware Integration Design Considerations. . . . . . . . . . . . . . . . . . . . . . . . . . 47Table A-1: Acronyms and Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Rev 3 Sep.17 8 41110251List of FiguresFigure 3-1: System Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13Figure 3-2: SIM Application Interface (applies to both SIM interfaces) . . . . . . . . . . . . . . . 20Figure 3-3: SIM Card Contacts (Contact View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20Figure 3-4: Recommended WAKE_N Connection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22Figure 3-5: Example LED. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23Figure 4-1: Module Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24Figure 5-1: Signal Timing (USB Enumeration). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32Figure 6-1: Top View . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35Figure 6-2: Dimensioned View. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35Figure 6-3: Sample Unit Label . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36Figure 6-4: Shield locations (Top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37Figure 6-5: Copper Pad Location on Bottom Side of Module . . . . . . . . . . . . . . . . . . . . . . 38Figure 10-1: Device Placement in Module Tray. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49Figure 10-2: Shipping Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50Figure 10-3: Outer (shipping) Box . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Rev 3 Sep.17 9 4111025111: IntroductionThe Sierra Wireless MC7475 PCI Express Mini Card is a compact, lightweight, wireless modem that provides LTE and GPS connectivity for M2M applications, notebook, ultrabook and tablet computers over several radio frequency bands.Supported RF BandsThe modem, based on the Altair FourGee6300 baseband processor, supports data operation on LTE networks over the bands described in Table 1-1.Physical Features•Small form factor—conforms to type F2 as specified in PCI Express Mini Card Electromechanical Specification Revision 1.2.•Ambient operating temperature range:·Class A (3GPP compliant): -20°C to +70°C·Class B (operational, non-3GPP compliant): -30°C to +85°C (reduced operating parameters required)Important: The internal module temperature must be kept below 90°C. For best perfor-mance, the internal module temperature should be kept below 80°C. Proper mounting, heat sinks, and active cooling may be required, depending on the integrated application.Application Interface Features•USB interface•AT command interface•Support for active antenna control via dedicated antenna control signals (ANT_CTRL0:3)•Dynamic power reduction support via software and dedicated signal (DPR)Table 1-1: Supported RF BandsTechnology Bands NotesLTE 2, 4, 12, 125 Data rates:•Downlink (Cat 4):FDD: 150 Mbps•Uplink (Cat 4):FDD: 50 MbpsGPS 1575.42 MHz
Product Technical SpecificationRev 3 Sep.17 10 41110251Modem Features•Traditional modem COM port support for AT commands•USB suspend / resume•Sleep mode for minimum idle power draw•Enhanced Operator Name String (EONS)•Mobile-originated PDP context activation / deactivation•Static and Dynamic IP address. The network may assign a fixed IP address or dynamically assign one using DHCP (Dynamic Host Configuration Protocol).•PAP and CHAP support•PDP context type (IPv4, IPv6, or IPv4v6). IP Packet Data Protocol context supports dual IPv4v6.LTE Features•CQI/RI/PMI reporting•Paging procedures·Paging in Idle and Connected mode•Dedicated bearer·Network-initiated dedicated bearer·UE-initiated dedicated bearer•Multiple PDN connections (IPv4 and IPv6 combinations), subject to operating system support.•Connected mode intra-LTE mobility•Idle mode intra-LTE mobility•Detach procedure·Network-initiated detach with reattach required·Network-initiated detach followed by connection releasePosition Location (GPS)•Customizable tracking session•Automatic tracking session on startupSupporting DocumentsSeveral additional documents describe Mini Card design, usage, integration, and other features. See References on page 51.
IntroductionRev 3 Sep.17 11 41110251Required ConnectorsTable 1-2 describes the connectors used to integrate AirPrime MC-series modules into your host device.Ordering InformationTo order, contact the Sierra Wireless Sales Desk at +1 (604) 232-1488 between 8 AM and 5 PM Pacific Time.Integration RequirementsSierra Wireless provides, in the document suite, guidelines for successful Mini Card integration and offers integration support services as necessary.When integrating the MC7475 PCI-Express Mini Card, the following items need to be addressed:•Mounting—Effect on temperature, shock, and vibration performance•Power supply—Impact on battery drain and possible RF interference•Antenna location and type—Impact on RF performance•Regulatory approvals—As discussed in Regulatory Compliance and Industry Certifications on page 40.•Service provisioning—Manufacturing process •Host Interface—Compliance with interface voltage levelsTable 1-2: Required Host-Module Connectorsaa. Manufacturers/part numbers are for reference only and are subject to change. Choose connectors that are appropriate for your own design.Connector type DescriptionRF cables •Mate with Hirose U.FL connectors (model U.FL #CL331-0471-0-10)•Three connector jacksEDGE (52-pin) •Industry-standard mating connector•Some manufacturers include Tyco, Foxconn, Molex•Example: UDK board uses Molex 67910-0001SIM •Industry-standard connector. Type depends on how host device exposes the SIM socket•Example: UDK board uses ITT CCM03-3518
Rev 3 Sep.17 12 4111025122: Standards ComplianceThe MC7475 Mini Card complies with the mandatory requirements described in the following standards. The exact set of requirements supported is network operator-dependent.Table 2-1: Standards ComplianceTechnology StandardsLTE •3GPP Release 11
Rev 3 Sep.17 13 4111025133: Electrical SpecificationsThe system block diagram in Figure 3-1 on page 13 represents the MC7475 module integrated into a host system. The module includes the following interfaces to the host:•Power—Supplied to the module by the host.•WAKE_N— Signal used to wake the host when specific events occur.•WAN_LED_N—Active-low LED drive signal provides an indication of RADIO ON state, either WAN or GPS.•SYSTEM_RESET_N—Active-low reset input.•Antenna—Three U.FL RF connectors (main (Rx/Tx), GPS, and auxiliary (Rx diversity). For details, see RF Specifications on page 24.•Antenna control—Three signals that can be used to control external antenna switches.•Dual SIM—Supported through the interface connector. The SIM cavities /connectors must be placed on the host device for this feature.•USB—USB 2.0 interface to the host for data, control, and status information.The MC7475 has two main interface areas—the host I/O connector and the RF ports. Details of these interfaces are described in the sections that follow.Figure 3-1: System Block Diagram
Product Technical SpecificationRev 3 Sep.17 14 41110251Host Interface Pin AssignmentsThe MC7475 host I/O connector provides pins for power, serial communications, and control. Pin assignments are listed in Table 3-1.Refer to the following tables for pin details based on interface types:•Table 3-2, Power and Ground Specifications, on page 18•Table 3-3, USB Interfaces, on page 18•Table 3-4, SIM Interface Signals, on page 19•Table 3-5, Module Control Signals, on page 22Note: On any given interface (USB, SIM, etc.), leave unused inputs and outputs as no-connects.Note: The host should not drive any signals to the module until the power-on sequence is complete.Table 3-1: Connector Pin AssignmentsaPin Signal namePin typebDescription DirectioncActive stateVoltage levels (V)Min Typ Max1WAKE_N OC Wake host Output Low - - 0.102VCC VPower supply Input Power 3.135 3.30 3.603ANT_CTRL0 /GPIO1 -(ANT_CTRL0)Customer-defined external switch control for multiple antennasOutput High 1.35 1.80 1.90Output Low 0 - 0.8(GPIO1)General purpose I/OInput High 1.53 1.80 2.10Input Low -0.30 0.45Output High 1.35 1.80 1.90Output Low 0.00 0.84GND VGround Input Power - 0 -5ANT_CTRL1 /GPIO2 -(ANT_CTRL1)Customer-defined external switch control for multiple antennasOutput High 1.35 1.80 1.90Output Low 0 - 0.8(GPIO2)General purpose I/OInput High 1.53 1.80 2.10Input Low -0.30 0.45Output High 1.35 1.80 1.90Output Low 0.00 0.86NC -No connect - - - - -
Electrical SpecificationsRev 3 Sep.17 15 411102517USIM2_RST -SIM 2 Reset Output Low 0 - 0.45High 2.55 (3V SIM)1.35 (1.8V SIM)-3.10 (3V SIM)1.90 (1.8V SIM)8USIM_PWR -SIM VCC supply Output Power 2.90 (3V SIM)1.75 (1.8V SIM)3.00 (3V SIM)1.80 (1.8V SIM)3.10 (3V SIM)1.85 (1.8V SIM)9GND VGround Input Power - 0 -10 USIM_DATA -SIM IO pin Input Low -0.30 (3V SIM)-0.30 (1.8V SIM)-0.60 (3V SIM)0.35 (1.8V SIM)High 2.10 (3V SIM)1.17 (1.8V SIM)3.00 (3V SIM)1.80 (1.8V SIM)3.30 (3V SIM)2.10 (1.8V SIM)Output Low 0 - 0.40High 2.55 (3V SIM)1.35 (1.8V SIM)3.00 (3V SIM)1.80 (1.8V SIM)3.10 (3V SIM)1.90 (1.8V SIM)11 VREF_1.8Vd-1.8V reference voltage output Output Power 1.75 1.80 1.8512 USIM_CLK -SIM Clock Output Low 0 - 0.45High 2.55 (3V SIM)1.35 (1.8V SIM)3.00 (3V SIM)1.80 (1.8V SIM)3.10 (3V SIM)1.90 (1.8V SIM)13 USIM2_PWR -SIM 2 VCC supply Output Power 2.90 (3V SIM)1.75 (1.8V SIM)3.00 (3V SIM)1.80 (1.8V SIM)3.10 (3V SIM)1.85 (1.8V SIM)14 USIM_RST -SIM Reset Output Low 0 - 0.45High 2.55 (3V SIM)1.35 (1.8V SIM)3.00 (3V SIM)1.80 (1.8V SIM)3.10 (3V SIM)1.90 (1.8V SIM)15 GND VGround Input Power - 0 -16 NC -No connect - - - - -17 USIM2_CLK -SIM 2 Clock Output Low 0 - 0.45High 2.55 (3V SIM)1.35 (1.8V SIM)3.00 (3V SIM)1.80 (1.8V SIM)3.10 (3V SIM)1.90 (1.8V SIM)18 GND VGround Input Power - 0 -Table 3-1: Connector Pin Assignmentsa (Continued)Pin Signal namePin typebDescription DirectioncActive stateVoltage levels (V)Min Typ Max
Product Technical SpecificationRev 3 Sep.17 16 4111025119 USIM2_DATA -SIM 2 IO pin Input Low -0.30 (3V SIM)-0.30 (1.8V SIM)-0.60 (3V SIM)0.35 (1.8V SIM)High 2.10 (3V SIM)1.17 (1.8V SIM)3.00 (3V SIM)1.80 (1.8V SIM)3.30 (3V SIM)2.10 (1.8V SIM)Output Low 0 - 0.40High 2.55 (3V SIM)1.35 (1.8V SIM)3.00 (3V SIM)1.80 (1.8V SIM)3.10 (3V SIM)1.90 (1.8V SIM)20 NC -No connect - - - - -21 GND VGround Input Power - 0 -22 SYSTEM_RESET_NeOC Reset Input Low -0.30 -0.6323 Reserved24 VCC VPower supply Input Power 3.135 3.30 3.6025 Reserved26 GND VGround Input Power - 0 -27 GND VGround Input Power - 0 -28 NC -No connect - - - - -29 GND VGround Input Power - 0 -30 NC Reserved—Host must not repurpose this pin.31 Reserved32 NC Reserved—Host must not repurpose this pin.33 Reserved34 GND VGround Input Power - 0 -35 GND VGround Input Power - 0 -36 USB_D- -USB data negative Input/Output Differential - - -37 GND VGround Input Power - 0 -38 USB_D+ -USB data positive Input/Output Differential - - -39 VCC VPower supply Input Power 3.135 3.30 3.6040 GND VGround Input Power - 0 -41 VCC VPower supply Input Power 3.135 3.30 3.60Table 3-1: Connector Pin Assignmentsa (Continued)Pin Signal namePin typebDescription DirectioncActive stateVoltage levels (V)Min Typ Max
Electrical SpecificationsRev 3 Sep.17 17 4111025142 WAN_LED_N OC LED Driver Output Low 0 - 0.15f43 GND VGround Input Power - 0 -44 ANT_CTRL2 /GPIO3 -(ANT_CTRL2)Customer-defined external switch control for multiple antennasOutput High 1.35 1.80 1.90Output Low 0 - 0.8(GPIO3)General purpose I/OInput High 1.53 1.80 2.10Input Low -0.30 0.45Output High 1.35 1.80 1.90Output Low 0.00 0.845 NC Reserved—Host must not repurpose this pin.46 ANT_CTRL3/GPIO4 -(ANT_CTRL3)Customer-defined external switchInput High 1.35 1.80 1.90Input Low 0 - 0.8(GPIO4)General purpose I/OInput High 1.53 1.80 2.10Input Low -0.30 0.45Output High 1.35 1.80 1.90Output Low 0.00 0.847 NC Reserved—Host must not repurpose this pin.48 NC -No connect - - - - -49 NC Reserved—Host must not repurpose this pin.50 GND VGround Input Power - 0 -51 NC Reserved—Host must not repurpose this pin.52 VCC VPower supply Input Power 3.135 3.30 3.60a. The host should leave all ‘NC’ (‘no connect) pins unconnected.b. A—Analog; I—Input; NP—No pull; O—Digital output; OC—Open Collector; PU—Digital input (internal pull up); PD—Digital output (internal pull down); V—Power or groundc. Signal directions are from module’s point of view (e.g. ‘Output’ from module to host, ‘Input’ to module from host.)d. To avoid adverse effects on module operation, do not draw more than 10 mA current on pin 11.Table 3-1: Connector Pin Assignmentsa (Continued)Pin Signal namePin typebDescription DirectioncActive stateVoltage levels (V)Min Typ Max
Product Technical SpecificationRev 3 Sep.17 18 41110251Power SupplyThe host provides power to the MC7475 through multiple power and ground pins as summarized in Table 3-2.The host must provide safe and continuous power at all times; the module does not have an independent power supply, or protection circuits to guard against electrical issues.USB InterfaceImportant: Host support for USB 2.0 signals is required.The device supports a USB 2.0 interface for communication between the host and module.The interface complies with the [7] Universal Serial Bus Specification, Rev 2.0, and the host device must be designed to the same standards (subject to details shown in Table 3-3 below). (Note: When designing the host device, careful PCB layout practices must be followed.)USB Throughput PerformanceThis device has been designed to achieve optimal performance and maximum throughput using USB high-speed mode (USB 2.0). Although the device may operate with a high speed host, throughput performance will be on an “as is” e. The module must not be plugged into a port that supports PCI Express—the pin is used by a PCIE signal, which can cause the module to be in reset state or occasionally reset.f. Max voltage level when current < 100 mA.Table 3-2: Power and Ground SpecificationsName Pins Specification Min Typ Max UnitsVCC 2, 24, 39, 41, 52 Voltage range See Table 3-1 on page 14.Ripple voltage --100 mVppGND 4, 9, 15, 18, 21, 26, 27, 29, 34, 35, 37, 40, 43, 50- - 0 - VTable 3-3: USB InterfacesName Pin DescriptionUSB 2.0 USB_D- 36 USB data negativeUSB_D+ 38 USB data positive
Electrical SpecificationsRev 3 Sep.17 19 41110251basis and needs to be characterized by the OEM. Note that throughput will be reduced and may vary significantly based on packet size, host interface, and firmware revision.SIM InterfaceNote: Host support for SIM interface signals is required.The module supports up to two SIMs (Subscriber Identity Module) (1.8 V or 3 V). Each SIM holds information for a unique account, allowing users to optimize their use of each account on multiple devices.The SIM pins (Table 3-4) provide the connections necessary to interface to SIM sockets located on the host device as shown in Figure 3-2 on page 20. Voltage levels over this interface comply with 3GPP standards.The types of SIM connectors used depends on how the host device exposes the SIM sockets. Table 3-4: SIM Interface SignalsSIM Name Pin DescriptionSIM contact numberaNotesPrimary USIM_PWR 8SIM voltage 1Power supply for SIMUSIM_DATA 10 Data I/O 7Bi-directional SIM data lineUSIM_CLK 12 Serial clock 3Serial clock for SIM dataUSIM_RST 14 Reset 2Active low SIM resetUSIM_GND Ground 5Ground referenceUSIM_GND is common to module groundSecondary USIM2_PWR 13 SIM voltage 2Power supply for SIM 2USIM2_DATA 19 Data I/O 3Bi-directional SIM 2 data lineUSIM2_CLK 17 Serial clock 7Serial clock for SIM 2 dataUSIM2_RST 7Reset 1Active low SIM 2 resetUSIM2_GND SIM indication -Ground referenceUSIM2_GND is common to module grounda. See Figure 3-3 on page 20 for SIM card contacts.
Product Technical SpecificationRev 3 Sep.17 20 41110251Figure 3-2: SIM Application Interface (applies to both SIM interfaces)Figure 3-3: SIM Card Contacts (Contact View)AirPrime embedded moduleSIM card connector(Optional. Locate near the SIM socket)47 pF, 51 4.7uFX5Rtyp(C1)USIM_PWRUSIM_CLKUSIM_DATAUSIM_RSTLocated near SIM socketLocated near SIM socket.NOTE: Carefully consider if ESD protection is required – it may increase signal rise time and lead to certification failureUSIM_GNDESD protection(C3)(C7)(C2)(C5)(Optional. Locate near the SIM socket)15 k - 30 k0.1uFNOTE: UIM signals refer to both USIM1 and USIM2.C8C7C6C5C4C3C2C1GND VCCVPP RSTI/O CLKRFU RFUContact View (notched corner at top left)
Electrical SpecificationsRev 3 Sep.17 21 41110251SIM ImplementationNote: For interface design requirements, refer to ETSI TS 102 230 V5.5.0, section 5.2.When designing the remote SIM interface, you must make sure that SIM signal integrity is not compromised.Some design recommendations include:•Total impedance of the VCC and GND connections to the SIM, measured at the module connector, should be less than 1  to minimize voltage drop (includes any trace impedance and lumped element components—inductors, filters, etc.).•Position the SIM connector 10 cm from the module. If a longer distance is required because of the host device design, use a shielded wire assembly—connect one end as close as possible to the SIM connector and the other end as close as possible to the module connector. The shielded assembly may help shield the SIM interface from system noise.•Avoid routing the clock and data lines for each SIM (USIM_CLK/USIM_DATA, USIM2_CLK/USIM2_DATA) in parallel over distances 2 cm—cross-coupling of a clock and data line pair can cause failures.•3GPP has stringent requirements for I/O rise time (<1 µs), signal level limits, and noise immunity—consider this carefully when developing your PCB layout.·Keep signal rise time <1 µs—keep SIM signals as short as possible, and keep very low capacitance traces on the data and clock signals (USIM_CLK, USIM_DATA, USIM2_CLK, USIM2_DATA). High capacitance increases signal rise time, potentially causing your device to fail certification tests.•Add external pull-up resistors (15 k–30 k), if required, between the data and power lines for each SIM (USIM_DATA/USIM_PWR, USIM2_DATA/USIM2_PWR) to optimize the signal rise time.•VCC line should be decoupled close to the SIM socket.•SIM is specified to run up to 5 MHz (SIM clock rate). Take note of this speed in the placement and routing of the SIM signals and connectors.•You must decide whether additional ESD protection is required for your product, as it is dependent on the application, mechanical enclosure, and SIM connector design. The SIM pins will require additional ESD protection if they are exposed to high ESD levels (i.e. can be touched by a user).•Putting optional decoupling capacitors on the SIM power lines (USIM_PWR, USIM2_PWR) near the SIM sockets is recommended—the longer the trace length (impedance) from the socket to the module, the greater the capaci-tance requirement to meet compliance tests.•Putting an optional series capacitor and resistor termination (to ground) on the clock lines (USIM_CLK, USIM2_CLK) at the SIM sockets to reduce EMI and increase signal integrity is recommended if the trace length between the SIM socket and module is long—47 pF and 50  resistor are recommended.•Test your first prototype host hardware with a Comprion IT3 SIM test device at a suitable testing facility.
Product Technical SpecificationRev 3 Sep.17 22 41110251Control Interface (Signals)The MC7475 provides signals for:•Waking the host when specific events occur•LED driver outputThese signals are summarized in Table 3-5 and paragraphs that follow.WAKE_N — Wake HostNote: Host support for WAKE_N is optional.The module uses WAKE_N to wake the host when specific events occur.The host must provide a 5 k–100 k pullup resistor that considers total line capacitance (including parasitic capacitance) such that when WAKE_N is deasserted, the line will rise to 3.3 V (Host power rail) in < 100 ns.See Figure 3-4 on page 22 for a recommended implementation.Figure 3-4: Recommended WAKE_N ConnectionWAN_LED_N—LED OutputNote: Host support for WAN_LED_N is optional.The module drives the LED output according to [6] PCI Express Mini Card Electromechanical Specification Revision 2.1.Note: The LED configuration is customizable. Contact your Sierra Wireless account repre-sentative for details.Table 3-5: Module Control SignalsName Pin Description Typeaa. OC—Open Collector; PU—Digital pin Input, internal pull upWAKE_N 1Wake host OCWAN_LED_N 42 LED driver OCControlRWAKE_N123Q5k-100kHostVCCMiniCard
Electrical SpecificationsRev 3 Sep.17 23 41110251 Figure 3-5: Example LEDSYSTEM_RESET_N—Reset InputNote: Host support for SYSTEM_RESET_N is optional.SYSTEM_RESET_N has an internal 1.8 V internal pull up that requires an open collector input from the host. Set this signal to active low to reset the device. Note that the minimum pulse width is 2 s.Note: The module must not be plugged into a port that supports PCI Express—SYSTEM_RESET_N is carried on a pin that is used for a PCIE signal, which can cause the module to be in reset state or occasionally reset.Antenna ControlNote: Host support for antenna control signals is optional.The MC7475 Mini Card provides three output signals (listed in Table 3-6) that may be used for host designs that incorporate tunable antennas.Current limiting ResistorLEDVCCMIOMiniCard WAN_LED_NTable 3-6: Antenna Control SignalsName Pin DescriptionANT_CTRL0 3Customer-defined external switch control for tunable antennasANT_CTRL1 5ANT_CTRL2 44ANT_CTRL3 46
Rev 3 Sep.17 24 4111025144: RF SpecificationsThe MC7475 includes three RF connectors for use with host-supplied antennas:•Main RF connector—Tx/Rx path•GPS RF connector—Dedicated GPS•Auxiliary RF connector—Rx diversityThe module does not have integrated antennas.Figure 4-1: Module ConnectorsRF ConnectionsWhen attaching antennas to the module:•Use Hirose U.FL connectors (3 mm x 3 mm, low profile; model U.FL #CL331-0471-0-10) to attach antennas to connection points on the module, as shown in Figure 4-1 on page 24.Note: To disconnect the antenna, make sure you use the Hirose U.FL connector removal tool (P/N UFL-LP-N-2(01)) to prevent damage to the module or coaxial cable assembly.•Match coaxial connections between the module and the antenna to 50 .•Minimize RF cable losses to the antenna; the recommended maximum cable loss for antenna cabling is 0.5 dB.•To ensure best thermal performance, mounting holes must be used to attach (ground) the device to the main PCB ground or a metal chassis.Note: If the antenna connection is shorted or open, the modem will not sustain permanent damage.ShieldingThe module is fully shielded to protect against EMI and the shield must not be removed.I/O connectorMain RF connectorGPS RF connectorAuxiliary (Rx diversity)RF connector
RF SpecificationsRev 3 Sep.17 25 41110251Antenna and CablingWhen selecting the antenna and cable, it is critical to RF performance to optimize antenna gain and cable loss.Note: For detailed electrical performance criteria, see Appendix 8: Antenna Specification on page 43.Choosing the Correct Antenna and CablingWhen matching antennas and cabling:•The antenna (and associated circuitry) should have a nominal impedance of 50  with a recommended return loss of better than 10 dB across each frequency band of operation.•The system gain value affects both radiated power and regulatory (FCC) test results.Designing Custom AntennasConsider the following points when designing custom antennas:•A skilled RF engineer should do the development to ensure that the RF performance is maintained.•If both CDMA and UMTS modules will be installed in the same platform, you may want to develop separate antennas for maximum performance.Determining the Antenna’s LocationWhen deciding where to put the antennas:•Antenna location may affect RF performance. Although the module is shielded to prevent interference in most applications, the placement of the antenna is still very important—if the host device is insufficiently shielded, high levels of broadband noise or spurious interference can degrade the module’s performance.•Connecting cables between the module and the antenna must have 50  impedance. If the impedance of the module is mismatched, RF performance is reduced significantly.•Antenna cables should be routed, if possible, away from noise sources (switching power supplies, LCD assemblies, etc.). If the cables are near the noise sources, the noise may be coupled into the RF cable and into the antenna. See Interference From Other Wireless Devices on page 26.Ground ConnectionWhen connecting the module to system ground:•Prevent noise leakage by establishing a very good ground connection to the module through the host connector.•Connect to system ground using the two mounting holes at the top of the module (shown in Figure 4-1 on page 24).•Minimize ground noise leakage into the RF.Depending on the host board design, noise could potentially be coupled to
Product Technical SpecificationRev 3 Sep.17 26 41110251the module from the host board. This is mainly an issue for host designs that have signals traveling along the length of the module, or circuitry operating at both ends of the module interconnects.Interference and SensitivitySeveral interference sources can affect the module’s RF performance (RF desense). Common sources include power supply noise and device-generated RF.RF desense can be addressed through a combination of mitigation techniques (Methods to Mitigate Decreased Rx Performance on page 27) and radiated sensitivity measurement (Radiated Sensitivity Measurement on page 27).Interference From Other Wireless DevicesWireless devices operating inside the host device can cause interference that affects the module.To determine the most suitable locations for antennas on your host device, evaluate each wireless device’s radio system, considering the following:•Any harmonics, sub-harmonics, or cross-products of signals generated by wireless devices that fall in the module’s Rx range may cause spurious response, resulting in decreased Rx performance.•The Tx power and corresponding broadband noise of other wireless devices may overload or increase the noise floor of the module’s receiver, resulting in Rx desense.The severity of this interference depends on the closeness of the other antennas to the module’s antenna. To determine suitable locations for each wireless device’s antenna, thoroughly evaluate your host device’s design.Host-generated RF InterferenceAll electronic computing devices generate RF interference that can negatively affect the receive sensitivity of the module.Proximity of host electronics to the antenna in wireless devices can contribute to decreased Rx performance. Components that are most likely to cause this include:•Microprocessor and memory•Display panel and display drivers•Switching-mode power suppliesDevice-generated RF InterferenceThe module can cause interference with other devices. Wireless devices such as AirPrime embedded modules transmit in bursts (pulse transients) for set durations (RF burst frequencies). Hearing aids and speakers convert these burst frequencies into audible frequencies, resulting in audible noise.
RF SpecificationsRev 3 Sep.17 27 41110251Methods to Mitigate Decreased Rx PerformanceIt is important to investigate sources of localized interference early in the design cycle. To reduce the effect of device-generated RF on Rx performance:•Put the antenna as far as possible from sources of interference. The drawback is that the module may be less convenient to use.•Shield the host device. The module itself is well shielded to avoid external interference. However, the antenna cannot be shielded for obvious reasons. In most instances, it is necessary to employ shielding on the components of the host device (such as the main processor and parallel bus) that have the highest RF emissions. •Filter out unwanted high-order harmonic energy by using discrete filtering on low frequency lines.•Form shielding layers around high-speed clock traces by using multi-layer PCBs.•Route antenna cables away from noise sources.Radiated Spurious Emissions (RSE)When designing an antenna for use with AirPrime embedded modules, the host device with an AirPrime embedded module must satisfy any applicable standards/local regulatory bodies for radiated spurious emission (RSE) for receive-only mode and for transmit mode (transmitter is operating).Note that antenna impedance affects radiated emissions, which must be compared against the conducted 50-ohm emissions baseline. (AirPrime embedded modules meet the 50-ohm conducted emissions requirement.)Radiated Sensitivity MeasurementA wireless host device contains many noise sources that contribute to a reduction in Rx performance.To determine the extent of any receiver performance desensitization due to self-generated noise in the host device, over-the-air (OTA) or radiated testing is required. This testing can be performed by Sierra Wireless or you can use your own OTA test chamber for in-house testing.Sierra Wireless’ Sensitivity Testing and Desensitization InvestigationAlthough AirPrime embedded modules are designed to meet network operator requirements for receiver performance, they are still susceptible to various performance inhibitors.As part of the Engineering Services package, Sierra Wireless offers modem OTA sensitivity testing and desensitization (desense) investigation. For more information, contact your account manager or the Sales Desk (see Contact Information on page 3).
Product Technical SpecificationRev 3 Sep.17 28 41110251Note: Sierra Wireless has the capability to measure TIS (Total Isotropic Sensitivity) and TRP (Total Radiated Power) according to CTIA's published test procedure.Sensitivity vs. FrequencyFor LTE bands, sensitivity is defined as the RF level at which throughput is 95% of maximum.Supported FrequenciesThe MC7475 supports:•Multiple-band LTE—See Table 4-1 on page 28 (supported bands)•GPSConducted Rx Sensitivity / Tx PowerTable 4-1: LTE Frequency BandsBand Frequency (Tx) Frequency (Rx)Band 2 1850–1910 MHz 1930–1990 MHzBand 4 1710–1755 2110–2155 MHzBand 12 699–716 MHz 729–746 MHzBand 125 2315–2318 MHz 2347–2350 MHzTable 4-2: Conducted Rx (Receive) Sensitivity—LTE BandsLTE bands Bandwidth(MHz) Conducted Rx sensitivity (dBm)LTE Band 2 5-100.6LTE Band 4 5-102.8LTE Band 12 5-103.2LTE Band 125 3-102.6Table 4-3: Conducted Tx (Transmit) Power TolerancesParameter Conducted transmit power NotesLTELTE Band 2,4,12 +23 dBm  1dBLTE Band 125 +13 dBm  1dB QPSK full RB
RF SpecificationsRev 3 Sep.17 29 41110251GPS SpecificationsNote: For detailed electrical performance criteria, see Recommended GPS Antenna Specifications on page 45.Table 4-4: GPS SpecificationsParameter/feature DescriptionSatellite channels Maximum 12 channels, simultaneous trackingProtocols NMEA 0183 V3.0Acquisition time Hot start: 5 sCold start: 37 sNote: Measured with signal strength = -135 dBm.Sensitivity Trackinga: -160 dBmAcquisition (Standalone)b: -145 dBma. Tracking sensitivity is the lowest GPS signal level for which the device can still detect an in-view satellite 50% of the time when in sequential tracking mode.b. Acquisition sensitivity is the lowest GPS signal level for which the device can still detect an in-view satellite 50% of the time.Operational limits Altitude <6000 m or velocity <100 m/s(Either limit may be exceeded, but not both.)
Rev 3 Sep.17 30 4111025155: PowerPower ConsumptionPower consumption measurements in the tables below are for the MC7475 Mini Card module connected to the host PC via USB.The module does not have its own power source and depends on the host device for power. For a description of input voltage requirements, see Power Supply on page 18. Table 5-1: Averaged Standby DC Power ConsumptionSignal Description BandsaCurrent Notes / configurationTyp MaxbUnitVCC Standby current consumption (Sleep mode deactivatedc)LTE Band 2 13.5 21 mA DRX cycle = 8 (2.56 s)Band 4 13.5 22 mABand 12 13 22 mABand 125 13 21 mAa. For supported bands, see Table 4-1, LTE Frequency Bands, on page 28.b. Measured at nominal 3.3 V voltage.c. Assumes USB bus is fully suspended during measurements
PowerRev 3 Sep.17 31 41110251Power InterfacePower Ramp-upOn initial power up, inrush current depends on the power supply rise time—turn on time >100 µs is required for < 3A inrush current.The supply voltage must remain within specified tolerances while this is occurring.Power-On/Off TimingFigure 5-1 describes the timing sequence for powering the module on and off.Note: The host should not drive any signals to the module until the power-on sequence is complete.Table 5-2: Averaged Call Mode DC Power ConsumptionDescription Tx power BandCurrentaNotesTyp UnitLTE 23 dBm B2/B4 900 mA 100/50 Mbps, 20 MHz BWB12 828 mA 60/25 Mbps, 10 MHz BWB125 647 mA 7.2/12.6 Mbps, 3 MHz BWPeak current(averaged over 100 s) 1012 mA All LTE bandsa. Measured at 25ºC/nominal 3.3 V voltageTable 5-3: Miscellaneous DC Power ConsumptionSignal DescriptionCurrent/VoltageUnit Notes/configurationMin Typ MaxVCC Maximum current — — 1.5 A•Across all bands, all temperature ranges•3.3 V supplyGPS Signalconnector Active bias on GPS port— — 100 mA •See GPS RF connector in Figure 4-1 on page 24•GNSS active antenna specifications:·DC voltage range: 3.0–3.25 V·Within specified DC voltage range, MC7475 will drive current up to 100 mA (depending on antenna load).·Specifications valid over operating input DC voltage (VCC) and temperature range.3.00 3.15 3.25 V
Product Technical SpecificationRev 3 Sep.17 32 41110251Figure 5-1: Signal Timing (USB Enumeration)USB EnumerationThe unit supports single and double USB enumeration with the host:•Single enumeration:·Enumeration starts within maximum t_pwr_on_seq seconds of power-on.•Double enumeration—As shown in Figure 5-1 on page 32:·First enumeration starts within t_pwr_on_seq seconds of power-on (while USB_D+ is high)·Second enumeration starts after t_USB_suspend (when USB_D+ goes high again)Disconnected Power-on SequenceUSB_D+(Double enumeration)Power-off Sequence DisconnectedActiveDEVICE STATEHighLowOff OffHighVCC Lowt_pwr_on_seqt_USB_activet_USB_suspendt_pwr_off_seqUSB_D+(Single enumeration)HighLowt_pwr_on_seqt_pwr_off_seqTable 5-4: USB 2.0 Power-On/Off Timing Parameters (Double Enumeration)Parameter Typical (s) Maximum (s)t_pwr_on_seq TBD TBDt_USB_active TBD TBDt_USB_suspend TBD TBDt_pwr_off_seq TBD TBDTable 5-5: USB 2.0 Power-On/Off Timing Parameters (Single Enumeration)Parameter Typical (s) Maximum (s)t_pwr_on_seq TBD TBDt_pwr_off_seq TBD TBD
PowerRev 3 Sep.17 33 41110251Power Supply NoiseNoise in the power supply can lead to noise in the RF signal. The power supply ripple limit for the module is no more than 100 mVp-p 1 Hz to 100 kHz. This limit includes voltage ripple due to transmitter burst activity.Additional decoupling capacitors can be added to the main VCC line to filter noise into the device.
Rev 3 Sep.17 34 4111025166: Mechanical and Environmental Speci-ficationsThe MC7475 module complies with the mechanical and environmental specifications in Table 6-1. Final product conformance to these specifications depends on the OEM device implementation.Table 6-1: Mechanical and Environmental SpecificationsMode DetailsAmbient temperature Operational Class A -20ºC to +70ºC – 3GPP compliantOperational Class B -30ºC to +85ºC – non-3GPP compliant (reduced operating parameters required)Non-operational -40ºC to +85ºC, 96 hours(from MIL-STD 202 Method 108)Relative humidity Non-operational 85ºC, 85% relative humidity for 48 hours (non-condensing)Vibration Non-operational Random vibration, 10 to 2000 Hz, 0.1 g2/Hz to 0.0005 g2/Hz, in each of three mutually perpendicular axes. Test duration of 60 minutes for each axis, for a total test time of three hours.Shock Non-operational Half sine shock, 11 ms, 30 g, 8x each axis.Half sine shock, 6 ms, 100 g, 3x each axis.Drop Non-operational 1 m on concrete on each of six faces, two times (module only).Thermal considerations See Thermal Considerations on page 37.Form factor PCI-Express Mini Card shielded with metal and metalized fabric (F2 specification)Dimensions Length: 50.8 mmWidth: 29.85 mmThickness: 2.75 mm (max)Weight: 8.7 g
Mechanical and Environmental SpecificationsRev 3 Sep.17 35 41110251Device ViewsFigure 6-1: Top ViewFigure 6-2: Dimensioned View(Note: All dimensions shown in mm.)50.8±0.1548.05±0.14±0.12.6±0.1 29.85±0.1524.2±0.18.25±0.13.85±0.11.65±0.14±0.0513.6±0.055.6±0.051.5±0.1PIN #1PIN #512.55±0.1 TYP0.25±0.1 MAX0.6±0.05 TYP2.6 +0.15-0.104.88±0.2514.5±0.2519.29±0.251±0.11.6 +0.15-0.05TOP SIDE0.8±0.03 pitch TYP
Product Technical SpecificationRev 3 Sep.17 36 41110251LabelingFigure 6-3: Sample Unit LabelNote: The displayed label is an example only. The production label will vary by SKU.The MC7475 label is non-removable and contains:•Sierra Wireless logo and product name•IMEI number in Code-128 barcode format•SKU number (when required)•Factory Serial Number (FSN) in alphanumeric format•Manufacturing date code (incorporated into FSN)•Licensed vendor logo•Applicable certification marks/details (e.g. FCC ID, etc. Example shows FCC ID.)Note: The MC7475 supports OEM partner-specific label requirements.Electrostatic Discharge (ESD)The OEM is responsible for ensuring that the Mini Card host interface pins are not exposed to ESD during handling or normal operation. (See Table 6-1 on page 34 for specifications.)ESD protection is highly recommended for the SIM connector at the point where the contacts are exposed, and for any other signals from the host interface that would be subjected to ESD by the user of the product. (The device includes ESD protection on the antenna.)FCC ID: N7NxxxxxxPRODUCT OF CHINAFPPDDDYNNNNHH |||||||||||||||||||||||||||||||||||BBIMEI # 352678011234569MC7430
Mechanical and Environmental SpecificationsRev 3 Sep.17 37 41110251Thermal ConsiderationsEmbedded modules can generate significant amounts of heat that must be dissipated in the host device for safety and performance reasons.Figure 6-4: Shield locations (Top view)The amount of thermal dissipation required depends on:•Supply voltage—Maximum power dissipation for the module can be up to 3.5 W at voltage supply limits.•Usage—Typical power dissipation values depend on the location within the host product, throughput, amount of data transferred, etc.Specific areas requiring heat dissipation are shown in Figure 6-4:•RF—Bottom face of module near RF connectors. Likely to be the hottest area.•Baseband—Bottom face of module, below the baseband area.To enhance heat dissipation:•It is recommended to add a heat sink that mounts the module to the main PCB or metal chassis (a thermal compound or pads must be used between the module and the heat sink).RFBaseband
Product Technical SpecificationRev 3 Sep.17 38 41110251Figure 6-5: Copper Pad Location on Bottom Side of Module•Maximize airflow over/around the module.•Locate the module away from other hot components.•Module mounting holes must be used to attach (ground) the device to the main PCB ground or a metal chassis.•You may also need active cooling to pull heat away from the module.Note: Adequate dissipation of heat is necessary to ensure that the module functions properly.Module Integration TestingWhen testing your integration design:•Test to your worst case operating environment conditions (temperature and voltage)•Test using worst case operation (transmitter on 100% duty cycle, maximum power)•Monitor temperature on the underside of the module. Attach thermocouples to the areas indicated in Figure 6-4 on page 37 (Baseband, RF).Note: Make sure that your system design provides sufficient cooling for the module—proper mounting, heat sinks, and active cooling may be required, depending on the integrated application.The internal module temperature must be kept to <90°C when integrated to prevent damage to the module’s components. For best performance, keep the internal module temperature below 80°C. 29.5±0.2Copper Pad
Mechanical and Environmental SpecificationsRev 3 Sep.17 39 41110251(For acceptance, certification, quality, and production (including RF) test suggestions, see Testing on page 15.)
Rev 3 Sep.17 40 4111025177: Regulatory Compliance and Industry CertificationsThis module is designed to meet, and upon commercial release, will meet the requirements of the following regulatory bodies and regulations, where applicable:•Federal Communications Commission (FCC) of the United StatesUpon commercial release, the following industry certifications will have been obtained, where applicable:•PTCRBAdditional certifications and details on specific country approvals may be obtained upon customer request—contact your Sierra Wireless account representative for details.Additional testing and certification may be required for the end product with an embedded MC7475 module and are the responsibility of the OEM. Sierra Wireless offers professional services-based assistance to OEMs with the testing and certification process, if required.Important NoticeBecause of the nature of wireless communications, transmission and reception of data can never be guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost. Although significant delays or losses of data are rare when wireless devices such as the Sierra Wireless module are used in a normal manner with a well-constructed network, the Sierra Wireless module should not be used in situations where failure to transmit or receive data could result in damage of any kind to the user or any other party, including but not limited to personal injury, death, or loss of property. Sierra Wireless and its affiliates accept no responsibility for damages of any kind resulting from delays or errors in data transmitted or received using the Sierra Wireless module, or for failure of the Sierra Wireless module to transmit or receive such data.Safety and HazardsDo not operate your MC7475 module:•In areas where blasting is in progress•Where explosive atmospheres may be present including refuelling points, fuel depots, and chemical plants•Near medical equipment, life support equipment, or any equipment which may be susceptible to any form of radio interference. In such areas, the MC7475 module MUST BE POWERED OFF. Otherwise, the MC7475 module can transmit signals that could interfere with this equipment.In an aircraft, the MC7475 module MUST BE POWERED OFF. Otherwise, the MC7475 module can transmit signals that could interfere with various onboard systems and may be dangerous to the operation of the aircraft or disrupt the cellular
Regulatory Compliance and Industry CertificationsRev 3 Sep.17 41 41110251network. Use of a cellular phone in an aircraft is illegal in some jurisdictions. Failure to observe this instruction may lead to suspension or denial of cellular telephone services to the offender, or legal action or both.Some airlines may permit the use of cellular phones while the aircraft is on the ground and the door is open. The MC7475 module may be used normally at this time.Important Compliance Information for the United States of AmericaNote: Details are preliminary and subject to change.The MC7475 module, upon commercial release, will have been granted modular approval for mobile and fixed applications. Integrators may use the MC7475 module in their final products without additional FCC certification if they meet the following conditions. Otherwise, additional FCC approvals must be obtained.1. At least 20 cm separation distance between the antenna and the user’s body must be maintained at all times.2. To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, the maximum antenna gain including cable loss in a mobile-only exposure condition must not exceed the limits stipulated in Table 7-1 on page 41.Important: Mobile carriers often have limits on total radiated power (TRP), which requires an efficient antenna. The end product with an embedded module must output sufficient power to meet the TRP requirement but not too much to exceed FCC EIRP limit. If you need assistance in meeting this requirement, please contact Sierra Wireless.3. The MC7475 module may transmit simultaneously with other collocated radio transmitters within a host device, provided the following conditions are met:·Each collocated radio transmitter has been certified by FCC for mobile application.·At least 20 cm separation distance between the antennas of the collocated transmitters and the user’s body must be maintained at all times.Table 7-1: Antenna Gain SpecificationsDevice Technology Band Frequency(MHz) Maximum antenna gain (dBi)MC7475 Mini Card LTE 21850–1910 641710–1755 612 699–716 6125 2315–2318 10
Product Technical SpecificationRev 3 Sep.17 42 41110251·The output power and antenna gain in a collocated configuration must not exceed the limits and configurations stipulated in Table 7-2. 4. A label must be affixed to the outside of the end product into which the MC7475 module is incorporated, with a statement similar to the following:· This device contains FCC ID: N7NMC7475.5. A user manual with the end product must clearly indicate the operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines.The end product with an embedded MC7475 module may also need to pass the FCC Part 15 unintentional emission testing requirements and be properly authorized per FCC Part 15.Note: If this module is intended for use in a portable device, you are responsible for separate approval to satisfy the SAR requirements of FCC Part 2.1093.Note: Per FCC Part 27, mobile and portable stations containing MC7475 modules are not permitted to transmit using LTE B125 (2315–2318 MHz).Table 7-2: Collocated Radio Transmitter SpecificationsDevice Technology Frequency(MHz) EIRP Limit(dBm)Collocated transmittersaa. Valid collocated transmitter combinations: WLAN+BT; WiMAX+BT.(WLAN+WiMAX+BT is not permitted.)WLAN 2400–2500 235150–5850 23WiMAX 2300–2400 252500–2700 253300–3800 25BT 2400–2500 15
Rev 3 Sep.17 43 4111025188: Antenna SpecificationThis appendix describes recommended electrical performance criteria for main path, Rx diversity path, and GPS antennas used with AirPrime embedded modules.The performance specifications described in this section are valid while antennas are mounted in the host device with antenna feed cables routed in their final application configuration.Note: Antennas should be designed before the industrial design is finished to make sure that the best antennas can be developed.Recommended Main/Rx Diversity Antenna SpecificationsTable 8-1: Antenna Requirements a Parameter Requirements CommentsAntenna system External multi-band antenna system with Rx diversity (Ant1/Ant2)b Operating bands—Antenna 1 669–746 MHz1710–1990 MHz2110–2155 MHz2315–2350 MHzOperating bands—Antenna 2 729–746 MHz1930–1990 MHz2110–2155 MHz2347–2350 MHzVSWR of Ant1 and Ant2 •< 2:1 (recommended)•< 3:1 (worst case)On all bands including band edges
Product Technical SpecificationRev 3 Sep.17 44 41110251Total radiated efficiency of Ant1 and Ant2 > 50% on all bands •Measured at the RF connector.•Includes mismatch losses, losses in the matching circuit, and antenna losses, excluding cable loss.•Sierra Wireless recommends using antenna efficiency as the primary parameter for evaluating the antenna system.Peak gain is not a good indication of antenna performance when integrated with a host device (the antenna does not provide omni-directional gain patterns). Peak gain can be affected by antenna size, location, design type, etc.—the antenna gain patterns remain fixed unless one or more of these parameters change.Radiation patterns of Ant1 and Ant2 Nominally Omni-directional radiation pattern in azimuth plane.Envelope correlation coefficient between Ant1 and Ant2•< 0.4 on low Rx bands (up to 1500 MHz)•< 0.2 on high Rx bands (over 1500 MHz)Mean Effective Gain of Ant1 and Ant2 (MEG1, MEG2) -3 dBiAnt1 and Ant2 Mean Effective Gain Imbalance I MEG1 / MEG2 I< 6 dB for Rx diversity operationMaximum antenna gain Must not exceed antenna gains due to RF exposure and ERP/EIRP limits, as listed in the module’s FCC grant.See Important Compliance Information for the United States of America on page 41.Isolation between Ant1 and Ant2 (S21) > 10 dB •If antennas can be moved, test all positions for both antennas.•Make sure all other wireless devices (Bluetooth or WLAN antennas, etc.) are turned OFF to avoid interference.Power handling •> 2 W RF power on low bands•> 1 W on high bands•Measure power endurance over 4 hours (estimated talk time) using a 2 W CW signal—set the CW test signal frequency to the middle of the PCS Tx band (1880 MHz for PCS).•Visually inspect device to ensure there is no damage to the antenna structure and matching components.•VSWR/TIS/TRP measurements taken before and after this test must show similar results.Table 8-1: Antenna Requirements (Continued)a Parameter Requirements Comments
Antenna SpecificationRev 3 Sep.17 45 41110251Recommended GPS Antenna SpecificationsAntenna TestsThe following guidelines apply to the requirements described in Table 8-1 on page 43 and Table 8-2 on page 45:•Perform electrical measurements at room temperature (+20°C to +26°C) unless otherwise specified•For main and Rx diversity path antennas, make sure the antennas (including contact device, coaxial cable, connectors, and matching circuit with no more than six components, if required) have nominal impedances of 50  across supported frequency bands.a. These worst-case VSWR figures for the transmitter bands may not guarantee RSE levels to be within regulatory limits. The device alone meets all regulatory emissions limits when tested into a cabled (conducted) 50 ohm system. With antenna designs with up to 2.5:1 VSWR or worse, the radiated emissions could exceed limits. The antenna system may need to be tuned in order to meet the RSE limits as the complex match between the module and antenna can cause unwanted levels of emissions. Tuning may include antenna pattern changes, phase/delay adjustment, passive component matching. Examples of the application test limits would be included in FCC Part 22, Part 24 and Part 27, test case 4.2.2 for WCDMA (ETSI EN 301 908-1), where applicable.b. Ant1—Primary, Ant2—Secondary (Rx Diversity)Table 8-2: GPS Antenna RequirementsParameter Requirements CommentsFrequency range 1575.42 MHz ±2MHz minimumField of view (FOV) •Omni-directional in azimuth•-45° to +90° in elevationPolarization(average Gv/Gh) >0dB Vertical linear polarization is sufficient.Free space average gain (Gv+Gh) over FOV > -6 dBi (preferably > -3 dBi) Gv and Gh are measured and averaged over -45° to +90° in elevation, and ±180° in azimuth.Gain •Maximum gain and uniform coverage in the high elevation angle and zenith.•Gain in azimuth plane is not desired.Average 3D gain >-5dBiIsolation between GPS and Ant1 > 10 dB in all uplink bandsTypical VSWR < 2.5:1Polarization Any other than LHCP (left-hand circular polarized) is acceptable.
Product Technical SpecificationRev 3 Sep.17 46 41110251•All tests (except isolation/correlation coefficient)—Test the main or Rx diversity antenna with the other antenna terminated.•Any metallic part of the antenna system that is exposed to the outside environment needs to meet the electrostatic discharge tests per IEC61000-4-2 (conducted discharge +8kV).•The functional requirements of the antenna system are tested and verified while the embedded module’s antenna is integrated in the host device. Note: Additional testing, including active performance tests, mechanical, and accelerated life tests can be discussed with Sierra Wireless’ engineering services. Contact your Sierra Wireless representative for assistance.
Rev 3 Sep.17 47 4111025199: Design ChecklistThis chapter provides a summary of the design considerations mentioned throughout this guide. This includes items relating to the power interface, RF integration, thermal considerations, cabling issues, and so on.Note: This is NOT an exhaustive list of design considerations. It is expected that you will employ good design practices and engineering principles in your integration.Table 9-1: Hardware Integration Design ConsiderationsSuggestion Section where discussedComponent placementProtect the SIM socket so the SIM cannot be removed while the host is powered up. SIM Implementation on page 21If an ESD suppressor is not used, allow space on the SIM connector for series resistors in layout. (Up to 100  may be used depending on ESD testing requirements).SIM Implementation on page 21Minimize RF cable losses as these affect performance values listed in product specification documents. RF Connections on page 24AntennasMatch the module/antenna coax connections to 50 —mismatched antenna impedance and cable loss negatively affect RF performance. RF Connections on page 24If installing CDMA and UMTS modules in the same device, consider using separate antennas for maximum performance. Antenna and Cabling on page 25PowerMake sure the power supply can handle the maximum current specified for the module type. Power Consumption on page 30Limit the total impedance of VCC and GND connections to the SIM at the connector to less than 1  (including any trace impedance and lumped element components—inductors, filters, etc.). All other lines must have a trace impedance less than 2 .SIM Implementation on page 21Decouple the VCC line close to the SIM socket. The longer the trace length (impedance) from socket to module, the greater the capacitance requirement to meet compliance tests.SIM Implementation on page 21PCB signal routingUSB 2.0—Route these signals over 90  differential lines on the PCB.EMI/ESDInvestigate sources of localized interference early in the design cycle. Methods to Mitigate Decreased Rx Performance on page 27Provide ESD protection for the SIM connector at the exposed contact point (in particular, the CLK, VCC, IO, and RESET lines). SIM Implementation on page 21
Product Technical SpecificationRev 3 Sep.17 48 41110251Keep very low capacitance traces on the USIM_DATA and USIM_CLK signals. SIM Implementation on page 21To minimize noise leakage, establish a very good ground connection between the module and host. Ground Connection on page 25Route cables away from noise sources (for example, power supplies, LCD assemblies, etc.). Methods to Mitigate Decreased Rx Performance on page 27Shield high RF-emitting components of the host device (for example, main processor, parallel bus, etc.). Methods to Mitigate Decreased Rx Performance on page 27Use discrete filtering on low frequency lines to filter out unwanted high-order harmonic energy. Methods to Mitigate Decreased Rx Performance on page 27Use multi-layer PCBs to form shielding layers around high-speed clock traces. Methods to Mitigate Decreased Rx Performance on page 27ThermalTest to worst case operating conditions—temperature, voltage, and operation mode (transmitter on 100% duty cycle, maximum power).Thermal Considerations on page 37Use appropriate techniques to reduce module temperatures (for example, airflow, heat sinks, heat-relief tape, module placement, etc.). Thermal Considerations on page 37Host/Modem communicationMake sure the host USB driver supports remote wakeup, resume, and suspend operations, and serial port emulation.When no valid data is being sent, do not send SOF tokens from the host (causes unnecessary power consumption).Table 9-1: Hardware Integration Design Considerations (Continued)Suggestion Section where discussed
Rev 3 Sep.17 49 411102511010: PackagingSierra Wireless AirPrime Mini Cards are packaged in sealed manufacturing boxes, each containing a single tray with a capacity of 100 modules (Figure 10-1 and Figure 10-2). Groups of three manufacturing boxes are then inserted into an outer box for shipping (Figure 10-3).In the standard packaging:1. Mini Cards are inserted, system connector first, into the base portion (T1) of a two-part tray. all facing the same direction. This allows the top edge of each Mini Card to contact the top of the triangular features in the tray cover (T2) (see Detail A).2. The tray base and tray cover snap together at four connection points.Figure 10-1: Device Placement in Module Tray3. The tray cover (T2) is secured to the tray base (T1) with ESD-safe tape (EP1) at four locations.4. The tray is placed in a manufacturing box (T2 at the top), sealed with a security tape (P1), and a manufacturing label (L3) is placed on the bottom-right corner, above the security tape. If required for the SKU, an additional label (L4) can be placed beside L3.Triangular recesseshold top edges ofMini CardsT2Tray connectionpointsSee Detail A T1System connectorDetail A
Product Technical SpecificationRev 3 Sep.17 50 41110251 Figure 10-2: Shipping Package5. Three manufacturing boxes are placed in an outer shipping box (B2). If fewer than three manufacturing boxes are being shipped, empty boxes are added to the outer box6. The outer box is sealed with security tape (P1) and a label (L5) is placed on the box. Figure 10-3: Outer (shipping) BoxT1T2EP1B1P1L4L3B1B1B2 B2P1L5
Rev 3 Sep.17 51 411102511111: ReferencesThis guide deals specifically with hardware integration issues that are unique to AirPrime embedded modules.Sierra Wireless DocumentsFor additional documents describing embedded module design, usage, and integration issues, contact your Sierra Wireless account representative.Command Documents[1] AT Command Set for User Equipment (UE) (Release 6) (3GPP TS 27.007)Industry/Other DocumentsThe following non-Sierra Wireless references are not included in your documentation package:[2] FCC Regulations - Part 15 - Radio Frequency Devices[3] IEC-61000-4-2 level 3[4] IEC-61000-4-2 level (Electrostatic Discharge Immunity Test)[5] Mobile Station (MS) Conformance Specification; Part 4: Subscriber Interface Module (Doc# 3GPP TS 11.10-4)[6] PCI Express Mini Card Electromechanical Specification Revision 2.1[7] Universal Serial Bus Specification, Rev 2.0[8] JESD22-A114-B[9] JESD22-C101
Rev 3 Sep.17 52 41110251AA: AcronymsTable A-1: Acronyms and DefinitionsAcronym or term Definition3GPP 3rd Generation Partnership Project8PSK Octagonal Phase Shift KeyingAGC Automatic Gain ControlAPI Application Programming InterfaceBER Bit Error Rate—A measure of receive sensitivityBLER Block Error Ratebluetooth Wireless protocol for data exchange over short distancesCQI Channel Quality IndicationCOM Communication portCS Circuit-switchedCSG Closed Subscriber GroupCW Continuous waveformdB Decibel = 10 x log10 (P1/P2)P1 is calculated power; P2 is reference powerDecibel = 20 x log10 (V1/V2)V1 is calculated voltage, V2 is reference voltagedBm A logarithmic (base 10) measure of relative power (dB for decibels); relative to milliwatts (m). A dBm value will be 30 units (1000 times) larger (less negative) than a dBW value, because of the difference in scale (milliwatts vs. watts).DC-HSPA+ Dual Carrier HSPA+DCS Digital Cellular SystemA cellular communication infrastructure that uses the 1.8 GHz radio spectrum.DL Downlink (network to mobile)DRX Discontinuous ReceptionDSM Distributed Shared MemoryDUT Device Under TesteICIC Enhanced Inter-Cell Interference CoordinationEIRP Effective (or Equivalent) Isotropic Radiated PowerEMC Electromagnetic CompatibilityEMI Electromagnetic Interference
AcronymsRev 3 Sep.17 53 41110251ERP Effective Radiated PowerESD Electrostatic DischargeFCC Federal Communications CommissionThe U.S. federal agency that is responsible for interstate and foreign communications. The FCC regulates commercial and private radio spectrum management, sets rates for communications services, determines standards for equipment, and controls broadcast licensing. Consult www.fcc.gov.FDD Frequency Division DuplexingFDMA Frequency Division Multiple AccessfeICIC Further Enhanced Inter-Cell Interference CoordinationFER Frame Error Rate—A measure of receive sensitivity.firmware Software stored in ROM or EEPROM; essential programs that remain even when the system is turned off. Firmware is easier to change than hardware but more permanent than software stored on disk.FOTA Firmware Over The Air—Technology used to download firmware upgrades directly from the service provider, over the air.FOV Field Of ViewFSN Factory Serial Number—A unique serial number assigned to the mini card during manufacturing.GMSK Gaussian Minimum Shift Keying modulationGPS Global Positioning SystemAn American system that uses a series of 24 satellites in middle circular orbit to provide navigational data.Host The device into which an embedded module is integratedHSDPA High Speed Downlink Packet AccessHSPA+ Enhanced HSPA, as defined in 3GPP Release 7 and beyondHSUPA High Speed Uplink Packet AccessHz Hertz = 1 cycle/secondIF Intermediate FrequencyIMEI International Mobile Equipment IdentityIMS IP Multimedia Subsystem—Architectural framework for delivering IP multimedia services.inrush current Peak current drawn when a device is connected or powered oninter-RAT Radio Access TechnologyIOT Interoperability TestingTable A-1: Acronyms and Definitions (Continued)Acronym or term Definition
Product Technical SpecificationRev 3 Sep.17 54 41110251IS Interim Standard.After receiving industry consensus, the TIA forwards the standard to ANSI for approval.ISIM IMS Subscriber Identity Module (Also referred to as a SIM card)LED Light Emitting Diode.A semiconductor diode that emits visible or infrared light.LHCP Left-Hand Circular PolarizedLNA Low Noise AmplifierLPM Low Power ModeLPT Line Print TerminalLTE Long Term Evolution—a high-performance air interface for cellular mobile communication systems.MCS Modulation and Coding SchemeMHz Megahertz = 10e6 HzNAS/AS Network Access ServerNC No ConnectNIC Network Interface CardNLIC Non-Linear Interference CancellationNMEA National Marine Electronics AssociationOEM Original Equipment Manufacturer—a company that manufactures a product and sells it to a reseller.OFDMA Orthogonal Frequency Division Multiple AccessOMA DM Open Mobile Alliance Device Management—A device management protocol.OTA ‘Over the air’ (or radiated through the antenna)PA Power Amplifierpacket A short, fixed-length block of data, including a header, that is transmitted as a unit in a communications network.PCB Printed Circuit BoardPCC Primary Component CarrierPCS Personal Communication SystemA cellular communication infrastructure that uses the 1.9 GHz radio spectrum.PDN Packet Data NetworkPMI Pre-coding Matrix IndexTable A-1: Acronyms and Definitions (Continued)Acronym or term Definition
AcronymsRev 3 Sep.17 55 41110251PSS Primary synchronisation signalPST Product Support ToolsPTCRB PCS Type Certification Review BoardQAM Quadrature Amplitude Modulation.This form of modulation uses amplitude, frequency, and phase to transfer data on the carrier wave.QOS Quality of ServiceQPSK Quadrature Phase-Shift KeyingRAT Radio Access TechnologyRF Radio FrequencyRI Ring Indicatorroaming A cellular subscriber is in an area where service is obtained from a cellular service provider that is not the subscriber’s provider.RSE Radiated Spurious EmissionsRSSI Received Signal Strength IndicationSCC Secondary Component CarrierSDK Software Development KitSED Smart Error DetectionSensitivity Measure of lowest power signal that the receiver can measure.Sensitivity (RF) Measure of lowest power signal at the receiver input that can provide a prescribed BER/BLER/SNR value at the receiver output.SIB System Information BlockSIM Subscriber Identity Module. Also referred to as USIM or UICC.SIMO Single Input Multiple Output—smart antenna technology that uses a single antenna at the transmitter side and multiple antennas at the receiver side. This improves performance and security.SISO Single Input Single Output—antenna technology that uses a single antenna at both the transmitter side and the receiver side.SKU Stock Keeping Unit—identifies an inventory item: a unique code, consisting of numbers or letters and numbers, assigned to a product by a retailer for purposes of identification and inventory control.S/N Signal-to-noise (ratio)SNR Signal-to-Noise RatioSOF Start of Frame—A USB function.Table A-1: Acronyms and Definitions (Continued)Acronym or term Definition
Product Technical SpecificationRev 3 Sep.17 56 41110251SSS Secondary synchronisation signal.SUPL Secure User Plane LocationTDD Time Division DuplexingTIA/EIA Telecommunications Industry Association / Electronics Industry Association.A standards setting trade organization, whose members provide communications and information technology products, systems, distribution services and professional services in the United States and around the world. Consult www.tiaonline.org.TIS Total Isotropic SensitivityTRP Total Radiated PowerUDK Universal Development Kit (for PCI Express Mini Cards)UE User EquipmentUICC Universal Integrated Circuit Card (Also referred to as a SIM card.)UL Uplink (mobile to network)UMTS Universal Mobile Telecommunications SystemUSB Universal Serial BusUSIM Universal Subscriber Identity Module (UMTS)VCC Supply voltageVSWR Voltage Standing Wave RatioWAN Wide Area NetworkWLAN Wireless Local Area NetworkZIF Zero Intermediate FrequencyZUC ZUC stream cypherTable A-1: Acronyms and Definitions (Continued)Acronym or term Definition
Rev 3 Sep.17 57 41110251IndexNumerics3D gain, averagegain3D average (GNSS), 453GPP complianceLTE, 12Aacronyms and definitions, 52– 56antennaconnection considerations, 24connectors, 13custom, design, 25GNSS, specifications, recommended, 45limit, matching coaxial connections, 24location, considerations, 25matching, considerations, 25maximum cable loss, 24routing, 25specification, 43– 46specifications, recommended, 43testing, 45antennasdesign checklist, 47application interface features, 9approvals, regulatory and industry, 40averaged call mode DC power consumption, 31averaged standby DC power consumption, 30Bbands supported, RFsummary, 9LTE, 28bearers, dedicated, 10block diagramsystem, 13bottom view, 35Ccable lossantenna, maximum, 24capacitorswith SIM, 21with XIM_DATA / XIM_CLK, 21checklist, design, 47communications, host to modemdesign checklist, 48conducted Tx power tolerances, 28connectiongrounding, 25connectors, 24connectors, requiredhost-module, 11control interface, 22CQI, 10DDC power consumptionaveraged call mode, 31averaged standby, 30desense. See RFdesign checklistantennas, 47component placement, 47EMI/ESD, 47host/modem communications, 48power, 47thermal, 48USB3, 47detach procedure, 10digital interface, 23dimensioned view, 35dimensions, 34, 35diversity connector, location, 24drop specifications, 34EEDGEconnector, required, 11electrical specifications, 13electrostatic discharge. See ESDenvelope correlation coefficient, 44environmental specifications, 34– 36ESDdesign checklist, 47protection requirements, 36Ffield of view, 45filtering, RF desense, 27form factor, 34FOV, 45free space average gain, 45frequencies supported, 28frequency band supportLTE, 28
Product Technical SpecificationRev 3 Sep.17 58 41110251GgainGNSS, 45maximum, 41, 44mean effective, 44mean effective imbalance, 44GNSSantenna specifications, recommended, 45connector location, 24features supported, 10GPSspecifications, 29ground specifications, 18groundingconnection considerations, 25Hhost interfacepin assignments, 14humidity specifications, 34II/O connector location, 24I/O rise time requirements, 21impedancemodule–antenna, 25SIM, 21industry approvals, 40integration requirements, 11interfacecontrol interface, 22digital interface, 23feature summary, 9host, pin assignments, 14SIM, 19USB, 18interferencedevice generated, 26host-generated, 26power supply noise, 33wireless devices, 26intra-LTE mobility, 10isolation, 44, 45Llabeling, 36LEDexample, 23LED output, 13, 22LTE3GPP compliance, 12features, 10frequency band support, 28Mmean effective gain, 44mean effective gain imbalance, 44mechanical specifications, 34– 36Nnoiseleakage, minimizing, 25RF interference, power supply, 33OOEMlabeling, 36ordering information, 11Ppackaging, 49paging procedures, 10PCBmulti-layer, shielding for RF desense, 27PDN connections, multiple, 10pin assignments, host interface, 14PMI, 10polarization, 45position location, 10powerdesign checklist, 47handling, 44power-up timing, 31ramp-up timing, 31supply, RF interference, 33supply, ripple limit, 33power consumption, DCaveraged call mode, 31averaged standby, 30power specifications, 18power tolerances, conducted Tx, 28Rradiated efficiency, total, 44radiated sensitivity measurement, 27radiated spurious emissions, 27radiation patterns, 44references, 51regulatory approvals, 40regulatory information, 40– 42FCC, 41limitation of liability, 40safety and hazards, 40reset device, 23resistors, external pull-up, 21
IndexRev 3 Sep.17 59 41110251RFantenna cable loss, maximum, 24antenna connection, considerations, 24connectors, required, 11desensedevice-generated, 26harmonic energy, filtering, 27mitigation suggestions, 27shielding suggestions, 27interferenceother devices, 26power supply, 33wireless devices, 26RF bands supportedsummary, 9LTE, 28RF connector location, 24RF specifications, 24–??RI, 10RSE, 27Rx sensitivityconducted, 28Ssalesordering, 11sensitivityconducted, RF parameter, 28defined, 28radiated measurement, overview, 27testing, overview, 27shieldingmodule, compliance, 24reducing RF desense, 27shock specifications, 34signals, 22SYSTEM_RESET_N, 23WAKE_N, 22WLAN_LED_N, 22SIMcapacitor recommendations, 21card contacts, 20clock rate, 21connector, required, 11electrical specifications, 21impedance, connectors, 21interface, 19interface diagram, 20operation, 21specificationselectrical, 13environmental specifications, 34– 36GPS, 29mechanical, 34– 36RF, 24–??standby DC power consumption, averaged, 30system block diagram, 13SYSTEM_RESET_N, 23Ttemperature specifications, 34temperature, module. See thermalthermalconsiderations, 37– 38design checklist, 48dissipation, factors affecting, 37dissipation, suggestions, 37internal temperature, maximum, 38testing, module, 38timingpower ramp-up, 31power-up, 31top view, 35tracking sessionautomatic, 10standalone, 10Tx power tolerances, conducted, 28UUSBhigh / full speed throughput performance, 18interface, 18USB3design checklist, 47Vvibration specifications, 34VSWR, 43, 45WWAKE_N, 13, 22WLAN_LED_N, 22

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