Quectel Wireless Solutions 201808EC25AF LTE Module User Manual

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201808EC25AF User Manual

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EC25 Hardware Design LTE Module Series Rev. EC25_Hardware_Design_V1.5 Date: 2018-04-20 Status: Released www.quectel.com

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 1 / 112 Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters: Quectel Wireless Solutions Co., Ltd. 7th Floor, Hongye Building, No.1801 Hongmei Road, Xuhui District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit: http://quectel.com/support/sales.htm For technical support, or to report documentation errors, please visit: http://quectel.com/support/technical.htm Or Email to: support@quectel.com GENERAL NOTES QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO CHANGE WITHOUT PRIOR NOTICE. COPYRIGHT THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE FORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN. Copyright © Quectel Wireless Solutions Co., Ltd. 2018. All rights reserved.

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 2 / 112 About the Document History Revision Date Author Description 1.0 2016-04-01 Woody WU Initial 1.1 2016-09-22 Lyndon LIU/ Frank WANG 1. Updated EC25 series frequency bands in Table 1. 2. Updated transmitting power, supported maximum baud rate of main UART/internal protocols/USB drivers of USB interface, firmware upgrade and temperature range in Table 2. 3. Updated timing of turning on module in Figure 12. 4. Updated timing of turning off module in Figure 13. 5. Updated timing of resetting module in Figure 16. 6. Updated supported baud rates of main UART in Chapter 3.11. 7. Added notes for ADC interface in Chapter 3.13. 8. Updated GNSS performance in Table 21. 9. Updated operating frequencies of module in Table 23.10. Added current consumption in Chapter 6.4. 11. Updated RF output power in Chapter 6.5. 12. Added RF receiving sensitivity in Chapter 6.6. 1.2 2016-11-04 Lyndon LIU/ Michael ZHANG 1. Added SGMII and WLAN interfaces in Table 2. 2. Updated function diagram in Figure 1. 3. Updated pin assignment (Top View) in Figure 2. 4. Added description of SGMII and WLAN interfaces in Table 4. 5. Added SGMII interface in Chapter 3.17. 6. Added WLAN interface in Chapter 3.18. 7. Added USB_BOOT interface in Chapter 3.19. 8. Added reference design of RF layout in Chapter 5.1.4.9. Added note about SIMO in Chapter 6.6. 1.3 2017-01-24 Lyndon LIU/ Frank WANG 1. Updated function diagram in Figure 1. 2. Updated pin assignment (top view) in Figure 2.

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 3 / 112 3. Added BT interface in Chapter 3.18.2. 4. Updated GNSS performance in Table 24. 5. Updated reference circuit of wireless connectivity interfaces with FC20 module in Figure 29. 6. Updated current consumption of EC25-E module in Table 33. 7. Updated EC25-A conducted RF receiving sensitivity in Table 38. 8. AddedEC25-J conducted RF receiving sensitivity in Table 40. 1.4 2018-03-05 AnniceZHANG/ Lyndon LIU/ Frank WANG 1. Updated functional diagram in Figure 1. 2. Updated frequency bands in Table 1. 3. Updated LTE, UMTS and GSM features in Table 2. 4. Updated description of pin 40/136/137/138. 5. Updated PWRKEY pulled down time to 500ms in Chapter 3.7.1 and reference circuit in Figure 10. 6. Updated reference circuit of (U)SIM interface in Figure 17&18. 7. Updated reference circuit of USB interface in Figure 19. 8. Updated PCM mode in Chapter 3.12. 9. Added SD card interface in Chapter 3.13. 10. Updated USB_BOOT reference circuit in Chapter 3.20. 11. Updated module operating frequencies in Table 26. 12. Updated antenna requirements in Table 30. 13. Updated EC25 series module current consumption in Chapter 6.4. 14. Updated EC25 series module conducted RF receiving sensitivity in Chapter 6.6. 15. Added thermal consideration description in Chapter 6.8. 16. Added dimension tolerance information in Chapter 7. 17. Added storage temperature range in Table 2 and Chapter 6.3. 18. Updated RF output power in Table 41. 19. Updated GPRS multi-slot classes in Table 53. 20. Updated storage information in Chapter 8.1. 1.5 2018-04-20 Kinsey ZHANG 1. Added information of EC25-AF in Table 1. 2. Updated module operating frequencies in Table 27. 3. Added current consumption of EC25-AF module in Table 40. 4. Changed GNSS current consumption of EC25 series module into Table 41.

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 4 / 112 5. Added EC25-AF conducted RF receiving sensitivity in Table 50.

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 5 / 112 Contents About the Document ................................................................................................................................ 2 Contents .................................................................................................................................................... 5 Table Index ............................................................................................................................................... 8 Figure Index ............................................................................................................................................ 10 1 Introduction ..................................................................................................................................... 12 1.1. Safety Information ................................................................................................................. 13 2 Product Concept ............................................................................................................................. 14 2.1. General Description .............................................................................................................. 14 2.2. Key Features ......................................................................................................................... 15 2.3. Functional Diagram ............................................................................................................... 18 2.4. Evaluation Board ................................................................................................................... 19 3 Application Interfaces ..................................................................................................................... 20 3.1. General Description .............................................................................................................. 20 3.2. Pin Assignment ..................................................................................................................... 21 3.3. Pin Description ...................................................................................................................... 22 3.4. Operating Modes .................................................................................................................. 34 3.5. Power Saving ........................................................................................................................ 34 3.5.1. Sleep Mode.................................................................................................................. 34 3.5.1.1. UART Application .............................................................................................. 34 3.5.1.2. USB Application with USB Remote Wakeup Function ....................................... 35 3.5.1.3. USB Application with USB Suspend/Resume and RI Function.......................... 36 3.5.1.4. USB Application without USB Suspend Function .............................................. 37 3.5.2. Airplane Mode .............................................................................................................. 37 3.6. Power Supply ........................................................................................................................ 38 3.6.1. Power Supply Pins ....................................................................................................... 38 3.6.2. Decrease Voltage Drop ............................................................................................... 39 3.6.3. Reference Design for Power Supply ............................................................................ 40 3.6.4. Monitor the Power Supply ............................................................................................ 40 3.7. Turn on and off Scenarios ..................................................................................................... 40 3.7.1. Turn on Module Using the PWRKEY ........................................................................... 40 3.7.2. Turn off Module ............................................................................................................ 42 3.7.2.1. Turn off Module Using the PWRKEY Pin ........................................................... 42 3.7.2.2. Turn off Module Using AT Command ................................................................ 43 3.8. Reset the Module .................................................................................................................. 43 3.9. (U)SIM Interface .................................................................................................................... 45 3.10. USB Interface ........................................................................................................................ 47 3.11. UART Interfaces ................................................................................................................... 49 3.12. PCM and I2C Interfaces ........................................................................................................ 51 3.13. SD Card Interface ................................................................................................................. 54 3.14. ADC Interfaces ...................................................................................................................... 56

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 6 / 112 3.15. Network Status Indication ..................................................................................................... 57 3.16. STATUS ................................................................................................................................ 58 3.17. Behaviors of RI ..................................................................................................................... 59 3.18. SGMII Interface ..................................................................................................................... 60 3.19. Wireless Connectivity Interfaces ........................................................................................... 62 3.19.1. WLAN Interface ........................................................................................................... 64 3.19.2. BT Interface* ................................................................................................................ 64 3.20. USB_BOOT Interface............................................................................................................ 65 4 GNSS Receiver ................................................................................................................................ 66 4.1. General Description .............................................................................................................. 66 4.2. GNSS Performance .............................................................................................................. 66 4.3. Layout Guidelines ................................................................................................................. 67 5 Antenna Interfaces .......................................................................................................................... 68 5.1. Main/Rx-diversity Antenna Interfaces.................................................................................... 68 5.1.1. Pin Definition ................................................................................................................ 68 5.1.2. Operating Frequency ................................................................................................... 68 5.1.3. Reference Design of RF Antenna Interface ................................................................. 70 5.1.4. Reference Design of RF Layout ................................................................................... 70 5.2. GNSS Antenna Interface ....................................................................................................... 72 5.3. Antenna Installation .............................................................................................................. 74 5.3.1. Antenna Requirement .................................................................................................. 74 5.3.2. Recommended RF Connector for Antenna Installation ................................................ 75 6 Electrical, Reliability and Radio Characteristics .......................................................................... 77 6.1. Absolute Maximum Ratings .................................................................................................. 77 6.2. Power Supply Ratings ........................................................................................................... 78 6.3. Operation and Storage Temperatures .................................................................................. 78 6.4. Current Consumption ............................................................................................................ 79 6.5. RF Output Power .................................................................................................................. 90 6.6. RF Receiving Sensitivity ....................................................................................................... 91 6.7. Electrostatic Discharge ......................................................................................................... 95 6.8. Thermal Consideration .......................................................................................................... 95 7 Mechanical Dimensions.................................................................................................................. 98 7.1. Mechanical Dimensions of the the Module ............................................................................ 98 7.2. Recommended Footprint ..................................................................................................... 100 7.3. Design Effect Drawings of the Module ................................................................................ 101 8 Storage, Manufacturing and Packaging ...................................................................................... 102 8.1. Storage ............................................................................................................................... 102 8.2. Manufacturing and Soldering .............................................................................................. 103 8.3. Packaging ........................................................................................................................... 104 9 Appendix A References ................................................................................................................ 105 10 Appendix B GPRS Coding Schemes ........................................................................................... 109

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 7 / 112 11 Appendix C GPRS Multi-slot Classes .......................................................................................... 110 12 Appendix D EDGE Modulationand Coding Schemes ................................................................. 112

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 8 / 112 Table Index TABLE 1: FREQUENCY BANDS OF EC25 SERIES MODULE ....................................................................... 14 TABLE 2: KEY FEATURES OF EC25 MODULE .............................................................................................. 15 TABLE 3: I/O PARAMETERS DEFINITION ...................................................................................................... 22 TABLE 4: PIN DESCRIPTION ........................................................................................................................... 22 TABLE 5: OVERVIEW OF OPERATING MODES ............................................................................................ 34 TABLE 6: VBAT AND GND PINS ...................................................................................................................... 38 TABLE 7: PIN DEFINITION OF PWRKEY ........................................................................................................ 41 TABLE 8: RESET_N PIN DESCRIPTION ......................................................................................................... 43 TABLE 9: PIN DEFINITION OF THE (U)SIM INTERFACE ............................................................................... 45 TABLE 10: PIN DESCRIPTION OF USB INTERFACE ..................................................................................... 47 TABLE 11: PIN DEFINITION OF MAIN UART INTERFACE ............................................................................ 49 TABLE 12: PIN DEFINITION OF DEBUG UART INTERFACE......................................................................... 49 TABLE 13: LOGIC LEVELS OF DIGITAL I/O ................................................................................................... 50 TABLE 14: PIN DEFINITION OF PCM AND I2C INTERFACES ...................................................................... 52 TABLE 15: PIN DEFINITION OF SD CARD INTERFACE ................................................................................ 54 TABLE 16: PIN DEFINITION OF ADC INTERFACES ...................................................................................... 56 TABLE 17: CHARACTERISTIC OF ADC .......................................................................................................... 56 TABLE 18: PIN DEFINITION OF NETWORK CONNECTION STATUS/ACTIVITY INDICATOR .................... 57 TABLE 19: WORKING STATE OF THE NETWORK CONNECTION STATUS/ACTIVITY INDICATOR ......... 57 TABLE 20: PIN DEFINITION OF STATUS ....................................................................................................... 58 TABLE 21: BEHAVIOR OF RI ........................................................................................................................... 59 TABLE 22: PIN DEFINITION OF THE SGMII INTERFACE .............................................................................. 60 TABLE 23: PIN DEFINITION OF WIRELESS CONNECTIVITY INTERFACES ............................................... 62 TABLE 24: PIN DEFINITION OF USB_BOOT INTERFACE............................................................................. 65 TABLE 25: GNSS PERFORMANCE ................................................................................................................. 66 TABLE 26: PIN DEFINITION OF RF ANTENNA ............................................................................................... 68 TABLE 27: MODULE OPERATING FREQUENCIES ....................................................................................... 68 TABLE 28: PIN DEFINITION OF GNSS ANTENNA INTERFACE .................................................................... 72 TABLE 29: GNSS FREQUENCY ...................................................................................................................... 73 TABLE 30: ANTENNA REQUIREMENTS ......................................................................................................... 74 TABLE 31: ABSOLUTE MAXIMUM RATINGS ................................................................................................. 77 TABLE 32: THE MODULE POWER SUPPLY RATINGS .................................................................................. 78 TABLE 33: OPERATION AND STORAGE TEMPERATURES ......................................................................... 78 TABLE 34: EC25-E CURRENT CONSUMPTION ............................................................................................. 79 TABLE 35: EC25-A CURRENT CONSUMPTION ............................................................................................. 81 TABLE 36: EC25-V CURRENT CONSUMPTION ............................................................................................. 82 TABLE 37: EC25-J CURRENT CONSUMPTION ............................................................................................. 83 TABLE 38: EC25-AU CURRENT CONSUMPTION .......................................................................................... 84 TABLE 39: EC25-AUT CURRENT CONSUMPTION ........................................................................................ 87 TABLE 40: EC25-AF CURRENT CONSUMPTION ........................................................................................... 88 TABLE 41: GNSS CURRENT CONSUMPTION OF EC25 SERIES MODULE ................................................ 90

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 9 / 112 TABLE 42: RF OUTPUT POWER ..................................................................................................................... 90 TABLE 43: EC25-E CONDUCTED RF RECEIVING SENSITIVITY .................................................................. 91 TABLE 44: EC25-A CONDUCTED RF RECEIVING SENSITIVITY .................................................................. 91 TABLE 45: EC25-V CONDUCTED RF RECEIVING SENSITIVITY .................................................................. 92 TABLE 46: EC25-J CONDUCTED RF RECEIVING SENSITIVITY .................................................................. 92 TABLE 47: EC25-AU CONDUCTED RF RECEIVING SENSITIVITY ............................................................... 93 TABLE 48: EC25-AUT CONDUCTED RF RECEIVING SENSITIVITY ............................................................. 93 TABLE 49: EC25-AUTL CONDUCTED RF RECEIVING SENSITIVITY ........................................................... 94 TABLE 50: EC25-AF CONDUCTED RF RECEIVING SENSITIVITY ............................................................... 94 TABLE 51: ELECTROSTATICS DISCHARGE CHARACTERISTICS .............................................................. 95 TABLE 52: RELATED DOCUMENTS ............................................................................................................. 105 TABLE 53: TERMS AND ABBREVIATIONS ................................................................................................... 105 TABLE 54: DESCRIPTION OF DIFFERENT CODING SCHEMES ................................................................ 109 TABLE 55: GPRS MULTI-SLOT CLASSES .................................................................................................... 110 TABLE 56: EDGE MODULATION AND CODING SCHEMES ........................................................................ 112

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 10 / 112 Figure Index FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 19 FIGURE 2: PIN ASSIGNMENT (TOP VIEW) .................................................................................................... 21 FIGURE 3: SLEEP MODE APPLICATION VIA UART ...................................................................................... 35 FIGURE 4: SLEEP MODE APPLICATION WITH USB REMOTE WAKEUP .................................................... 36 FIGURE 5: SLEEP MODE APPLICATION WITH RI ......................................................................................... 36 FIGURE 6: SLEEP MODE APPLICATION WITHOUT SUSPEND FUNCTION ................................................ 37 FIGURE 7: POWER SUPPLY LIMITS DURING BURST TRANSMISSION ..................................................... 39 FIGURE 8: STAR STRUCTURE OF THE POWER SUPPLY ........................................................................... 39 FIGURE 9: REFERENCE CIRCUIT OF POWER SUPPLY .............................................................................. 40 FIGURE 10: TURN ON THE MODULE BY USING DRIVING CIRCUIT ........................................................... 41 FIGURE 11: TURN ON THE MODULE BY USING BUTTON ........................................................................... 41 FIGURE 12: TIMING OF TURNING ON MODULE ........................................................................................... 42 FIGURE 13: TIMING OF TURNING OFF MODULE ......................................................................................... 43 FIGURE 14: REFERENCE CIRCUIT OF RESET_N BY USING DRIVING CIRCUIT ...................................... 44 FIGURE 15: REFERENCE CIRCUIT OF RESET_N BY USING BUTTON ...................................................... 44 FIGURE 16: TIMING OF RESETTING MODULE ............................................................................................. 44 FIGURE 17: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH AN 8-PIN (U)SIM CARD CONNECTOR ................................................................................................................................................................... 46 FIGURE 18: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR 46 FIGURE 19: REFERENCE CIRCUIT OF USB APPLICATION ......................................................................... 48 FIGURE 20: REFERENCE CIRCUIT WITH TRANSLATOR CHIP ................................................................... 50 FIGURE 21: REFERENCE CIRCUIT WITH TRANSISTOR CIRCUIT .............................................................. 51 FIGURE 22: PRIMARY MODE TIMING ............................................................................................................ 52 FIGURE 23: AUXILIARY MODE TIMING .......................................................................................................... 52 FIGURE 24: REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC ................................... 53 FIGURE 25: REFERENCE CIRCUIT OF SD CARD ......................................................................................... 55 FIGURE 26: REFERENCE CIRCUIT OF THE NETWORK INDICATOR ......................................................... 58 FIGURE 27: REFERENCE CIRCUITS OF STATUS ........................................................................................ 59 FIGURE 28: SIMPLIFIED BLOCK DIAGRAM FOR ETHERNET APPLICATION ............................................. 61 FIGURE 29: REFERENCE CIRCUIT OF SGMII INTERFACE WITH PHY AR8033 APPLICATION ................ 61 FIGURE 30: REFERENCE CIRCUIT OF WIRELESS CONNECTIVITY INTERFACES WITH FC20 MODULE ................................................................................................................................................................... 63 FIGURE 31: REFERENCE CIRCUIT OF USB_BOOT INTERFACE ................................................................ 65 FIGURE 32: REFERENCE CIRCUIT OF RF ANTENNA INTERFACE ............................................................ 70 FIGURE 33: MICROSTRIP LINE DESIGN ON A 2-LAYER PCB ..................................................................... 71 FIGURE 34: COPLANAR WAVEGUIDE LINE DESIGN ON A 2-LAYER PCB ................................................. 71 FIGURE 35: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 3 AS REFERENCE GROUND) .................................................................................................................................................. 71 FIGURE 36: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 4 AS REFERENCE GROUND) .................................................................................................................................................. 72 FIGURE 37: REFERENCE CIRCUIT OF GNSS ANTENNA ............................................................................. 73

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 12 / 112 1 Introduction This document defines the EC25 module and describes its air interface and hardware interface which are connected with customers’ applications. This document can help customers quickly understand module interface specifications, electrical and mechanical details, as well as other related information of EC25 module. Associated with application note and user guide, customers can use EC25 module to design and set up mobile applications easily.

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 13 / 112 1.1. Safety Information The following safety precautions must be observed during all phases of the operation, such as usage, service or repair of any cellular terminal or mobile incorporating EC25 module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for the customers’ failure to comply with these precautions. Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a hands free kit) causes distraction and can lead to an accident. You must comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is switched off. The operation of wireless appliances in an aircraft is forbidden, so as to prevent interference with communication systems. Consult the airline staff about the use of wireless devices on boarding the aircraft, if your device offers an Airplane Mode which must be enabled prior to boarding an aircraft. Switch off your wireless device when in hospitals,clinics or other health care facilities. These requests are designed to prevent possible interference with sensitive medical equipment. Cellular terminals or mobiles operating over radio frequency signal and cellular network cannot be guaranteed to connect in all conditions, for example no mobile fee or with an invalid (U)SIM card. While you are in this condition and need emergent help, please remember using emergency call. In order to make or receive a call, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Your cellular terminal or mobile contains a transmitter and receiver. When it is ON, it receives and transmits radio frequency energy. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment. In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals. Areas with potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders, etc.

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 14 / 112 2 Product Concept 2.1. General Description EC25 is a series of LTE-FDD/LTE-TDD/WCDMA/GSM wireless communication module with receive diversity. It provides data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA, WCDMA, EDGE and GPRS networks. It also provides GNSS1) and voice functionality2) for customers’ specific application. EC25 contains seven variants: EC25-E, EC25-A, EC25-V, EC25-J, EC25-AU, EC25-AUT, EC25-AF and EC25-AUTL. Customers can choose a dedicated type based on the region or operator. The following table shows the frequency bands of EC25 series module. Table 1: Frequency Bands of EC25 Series Module Modules2) LTE Bands WCDMA Bands GSM Bands Rx- diversity GNSS1) EC25-E FDD: B1/B3/B5/B7/B8/B20 TDD: B38/B40/B41 B1/B5/B8 900/1800MHz Y GPS, GLONASS, BeiDou/ Compass, Galileo, QZSS EC25-A FDD: B2/B4/B12 B2/B4/B5 N Y EC25-V FDD: B4/B13 N N Y EC25-J FDD: B1/B3/B8/B18/B19/ B26 TDD: B41 B1/B6/B8/B19 N Y EC25-AU3) FDD: B1/B2/B3/B4/B5/B7/ B8/B28 TDD: B40 B1/B2/B5/B8 850/900/ 1800/1900MHz Y EC25-AUT FDD: B1/B3//B5/B7/B28 B1/B5 N Y EC25-AF FDD: B2/B4//B5/B12/B13/ B14/B66/B71 B2/B4/B5 N Y EC25-AUTL FDD: B3/B7/B28 N N Y N

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 16 / 112 LTE-TDD: Max 130Mbps (DL)/30Mbps (UL) UMTS Features Support 3GPP R8 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA Support QPSK, 16-QAM and 64-QAM modulation DC-HSDPA: Max 42Mbps (DL) HSUPA: Max 5.76Mbps (UL) WCDMA: Max 384Kbps (DL)/384Kbps (UL) GSM Features GPRS: Support GPRS multi-slot class 33 (33 by default) Coding scheme: CS-1, CS-2, CS-3 and CS-4 Max 107Kbps (DL)/85.6Kbps (UL) EDGE: Support EDGE multi-slot class 33 (33 by default) Support GMSK and 8-PSK for different MCS (Modulation and Coding Scheme) Downlink coding schemes: CS 1-4 and MCS 1-9 Uplink coding schemes: CS 1-4 and MCS 1-9 Max 296Kbps (DL)/236.8Kbps (UL) Internet Protocol FeaturesSupport TCP/UDP/PPP/FTP/HTTP/NTP/PING/QMI/CMUX*/HTTPS*/SMTP*/ MMS*/FTPS*/SMTPS*/SSL*/FILE* protocols Support PAP (Password Authentication Protocol) and CHAP (Challenge Handshake Authentication Protocol) protocols which are usually used for PPP connections SMS Text and PDU mode Point to point MO and MT SMS cell broadcast SMS storage: ME by default (U)SIM Interface Support USIM/SIM card: 1.8V, 3.0V Audio Features Support one digital audio interface: PCM interface GSM: HR/FR/EFR/AMR/AMR-WB WCDMA: AMR/AMR-WB LTE: AMR/AMR-WB Support echo cancellation and noise suppression PCM Interface Used for audio function with external codec Support 16-bit linear data format Support long frame synchronization and short frame synchronization Support master and slave modes, but must be the master in long frame synchronization USB Interface Compliant with USB 2.0 specification (slave only); the data transfer rate can reach up to 480Mbps Used for AT command communication, data transmission, GNSS NMEA output, software debugging, firmware upgrade and voice over USB*

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 17 / 112 1. 1) Within operation temperature range, the module is 3GPP compliant. 2. 2) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to the normal operating temperature levels, the module will meet 3GPP specifications again. 3. “*” means under development. Support USB serial drivers for: Windows 7/8/8.1/10, Windows CE 5.0/6.0/7.0*, Linux 2.6/3.x/4.1~4.14, Android 4.x/5.x/6.x/7.x UART Interface Main UART: Used for AT command communication and data transmission Baud rates reach up to 921600bps, 115200bps by default Support RTS and CTS hardware flow control Debug UART: Used for Linux console and log output 115200bps baud rate SD Card Interface Support SD 3.0 protocol SGMII Interface Support 10M/100M/1000M Ethernet work mode Support maximum 150Mbps (DL)/50Mbps (UL) for 4G network Wireless Connectivity Interfaces Support a low-power SDIO 3.0 interface for WLAN and UART/PCM interface for Bluetooth* Rx-diversity Support LTE/WCDMA Rx-diversity GNSS Features Gen8C Lite of Qualcomm Protocol: NMEA 0183 AT Commands Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT commands Network Indication Two pins including NET_MODE and NET_STATUS to indicate network connectivity status Antenna Interfaces Including main antenna interface (ANT_MAIN), Rx-diversity antenna interface (ANT_DIV) and GNSS antenna interface (ANT_GNSS) Physical Characteristics Size: (29.0±0.15)mm × (32.0±0.15)mm × (2.4±0.2)mm Weight: approx. 4.9g Temperature Range Operation temperature range: -35°C ~ +75°C1) Extended temperature range: -40°C ~ +85°C2) Storage temperature range: -40°C~ +90°C Firmware Upgrade USB interface and DFOTA* RoHS All hardware components are fully compliant with EU RoHS directive NOTES

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 18 / 112 2.3. Functional Diagram The following figure shows a block diagram of EC25 and illustrates the major functional parts.  Power management  Baseband  DDR+NAND flash  Radio frequency  Peripheral interfaces

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 19 / 112 BasebandPMICTransceiverNANDDDR2SDRAMPAPAMLNASwitchANT_MAIN ANT_DIVANT_GNSSVBAT_BBVBAT_RFAPTPWRKEYADCsVDD_EXT USB USIM PCM UARTsI2CRESET_N19.2MXOSTATUSGPIOsSAWControlIQ ControlDuplexSAWTxPRx DRxWLAN SDBT*SGMII Figure 1: Functional Diagram “*” means under development. 2.4. Evaluation Board In order to help customers develop applications with EC25, Quectel supplies an evaluation board (EVB), USB to RS-232 converter cable, earphone, antenna and other peripherals to control or test the module.NOTE

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 20 / 112 3 Application Interfaces 3.1. General Description EC25 is equipped with 80 LCC pads plus 64 LGA pads that can be connected to cellular application platform. Sub-interfaces included in these pads are described in detail in the following chapters:  Power supply  (U)SIM interface  USB interface  UART interfaces  PCM and I2C interfaces  SD card interface  ADC interfaces  Status indication  SGMII interface  Wireless connectivity interfaces  USB_BOOT interface

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 21 / 112 3.2. Pin Assignment The following figure shows the pin assignment of EC25 module. Figure 2: Pin Assignment (Top View) 1. 1) means that these pins cannot be pulled up before startup. 2. 2) PWRKEY output voltage is 0.8V because of the diode drop in the Qualcomm chipset. 3. 3) means these interface functions are only supported on Telematics version. 4. Pads 37~40, 118, 127 and 129~139 are used for wireless connectivity interfaces, among which pads 118, 127 and 129~138 are WLAN function pins, and the rest are Bluetooth (BT) function pins. BT function is under development. 5. Pads 119~126 and 128 are used for SGMII interface. NOTES

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 22 / 112 6. Pads 24~27 are multiplexing pins used for audio design on the EC25 module and BT function on the BT module. 7. Keep all RESERVED pins and unused pins unconnected. 8. GND pads 85~112 should be connected to ground in the design, and RESERVED pads 73~84 should not be designed in schematic and PCB decal, and these pins should be served as a keep out area. 9. “*” means under development. 3.3. Pin Description The following tables show the pin definition of EC25 modules. Table 3: I/O Parameters Definition Table 4: Pin Description Type Description IO Bidirectional DI Digital input DO Digital output PI Power input PO Power output AI Analog input AO Analog output OD Open drain Power Supply Pin Name Pin No. I/O Description DC Characteristics Comment VBAT_BB 59, 60 PI Power supply for module’s baseband part Vmax=4.3V Vmin=3.3V Vnorm=3.8V It must be able to provide sufficient current up to 0.8A.

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 23 / 112 VBAT_RF 57, 58 PI Power supply for module’s RF part Vmax=4.3V Vmin=3.3V Vnorm=3.8V It must be able to provide sufficient current up to 1.8A in a burst transmission. VDD_EXT 7 PO Provide 1.8V for external circuit Vnorm=1.8V IOmax=50mA Power supply for external GPIO’s pull-up circuits. GND 8, 9, 19, 22, 36, 46, 48, 50~54, 56, 72, 85~112 Ground Turn on/off Pin Name Pin No. I/O Description DC Characteristics Comment PWRKEY 21 DI Turn on/off the module VIHmax=2.1V VIHmin=1.3V VILmax=0.5V The output voltage is 0.8V because of the diode drop in the Qualcomm chipset. RESET_N 20 DI Reset the module VIHmax=2.1V VIHmin=1.3V VILmax=0.5V If unused, keep it open. Status Indication Pin Name Pin No. I/O Description DC Characteristics Comment STATUS 61 OD Indicate the module operating status The drive current should be less than 0.9mA. An external pull-up resistor is required. If unused, keep it open.NET_MODE 5 DO Indicate the module network registration mode VOHmin=1.35V VOLmax=0.45V 1.8V power domain. Cannot be pulled up before startup. If unused, keep it open. NET_ STATUS 6 DO Indicate the module network activity status VOHmin=1.35V VOLmax=0.45V 1.8V power domain. If unused, keep it open. USB Interface Pin Name Pin No. I/O Description DC Characteristics Comment USB_VBUS 71 PI USB detection Vmax=5.25V Vmin=3.0V Vnorm=5.0V Typical: 5.0V If unused, keep it open.

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 24 / 112 USB_DP 69 IO USB differential data bus (+) Compliant with USB 2.0 standard specification. Require differential impedance of 90Ω. If unused, keep it open. USB_DM 70 IO USB differential data bus (-) Compliant with USB 2.0 standard specification. Require differential impedance of 90Ω. If unused, keep it open. (U)SIM Interface Pin Name Pin No. I/O Description DC Characteristics Comment USIM_GND 10 Specified ground for (U)SIM card USIM_ PRESENCE 13 DI (U)SIM card insertion detection VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. USIM_VDD 14 PO Power supply for (U)SIM card For 1.8V(U)SIM: Vmax=1.9V Vmin=1.7V For 3.0V(U)SIM: Vmax=3.05V Vmin=2.7V IOmax=50mA Either 1.8V or 3.0V is supported by the module automatically.USIM_DATA 15 IO Data signal of (U)SIM card For 1.8V (U)SIM: VILmax=0.6V VIHmin=1.2V VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM: VILmax=1.0V VIHmin=1.95V VOLmax=0.45V VOHmin=2.55V USIM_CLK 16 DO Clock signal of (U)SIM card For 1.8V (U)SIM: VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM: VOLmax=0.45V VOHmin=2.55V

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 25 / 112 USIM_RST 17 DO Reset signal of (U)SIM card For 1.8V (U)SIM: VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM: VOLmax=0.45V VOHmin=2.55V Main UART Interface Pin Name Pin No. I/O Description DC Characteristics Comment RI 62 DO Ring indicator VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. DCD 63 DO Data carrier detection VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. CTS 64 DO Clear to send VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. RTS 65 DI Request to send VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. DTR 66 DI Data terminal ready, sleep mode control VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. Pulled up by default. Low level wakes up the module. If unused, keep it open. TXD 67 DO Transmit data VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. RXD 68 DI Receive data VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. Debug UART Interface Pin Name Pin No. I/O Description DC Characteristics Comment DBG_TXD 12 DO Transmit data VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. DBG_RXD 11 DI Receive data VILmin=-0.3V 1.8V power domain.

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 26 / 112 VILmax=0.6V VIHmin=1.2V VIHmax=2.0V If unused, keep it open. ADC Interface Pin Name Pin No. I/O Description DC Characteristics Comment ADC0 45 AI General purpose analog to digital converter Voltage range: 0.3V to VBAT_BB If unused, keep it open. ADC1 44 AI General purpose analog to digital converter Voltage range: 0.3V to VBAT_BB If unused, keep it open. PCM Interface Pin Name Pin No. I/O Description DC Characteristics Comment PCM_IN 24 DI PCM data input VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. PCM_OUT 25 DO PCM data output VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. PCM_SYNC 26 IO PCM data frame synchronization signal VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. In master mode, it is an output signal. In slave mode, it is an input signal. If unused, keep it open. PCM_CLK 27 IO PCM clock VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. In master mode, it is an output signal. In slave mode, it is an input signal. If unused, keep it open. I2C Interface Pin Name Pin No. I/O Description DC Characteristics Comment I2C_SCL 41 OD I2C serial clock Used for external codec. External pull-up resistor is required. 1.8V only. If unused, keep it open.

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 27 / 112 I2C_SDA 42 OD I2C serial dataUsed for external codec. External pull-up resistor is required. 1.8V only. If unused, keep it open. SD Card Interface Pin Name Pin No. I/O Description DC Characteristics Comment SDC2_ DATA3 28 IO SD card SDIO bus DATA3 1.8V signaling: VOLmax=0.45V VOHmin=1.4V VILmin=-0.3V VILmax=0.58V VIHmin=1.27V VIHmax=2.0V 3.0V signaling: VOLmax=0.38V VOHmin=2.01V VILmin=-0.3V VILmax=0.76V VIHmin=1.72V VIHmax=3.34V SDIO signal level can be selected according to SD card supported level, please refer to SD 3.0 protocol for more details. If unused, keep it open. SDC2_ DATA2 29 IO SD card SDIO bus DATA2 1.8V signaling: VOLmax=0.45V VOHmin=1.4V VILmin=-0.3V VILmax=0.58V VIHmin=1.27V VIHmax=2.0V 3.0V signaling: VOLmax=0.38V VOHmin=2.01V VILmin=-0.3V VILmax=0.76V VIHmin=1.72V VIHmax=3.34V SDIO signal level can be selected according to SD card supported level, please refer to SD 3.0 protocol for more details. If unused, keep it open. SDC2_ DATA1 30 IO SD card SDIO bus DATA1 1.8V signaling: VOLmax=0.45V VOHmin=1.4V VILmin=-0.3V VILmax=0.58V VIHmin=1.27V SDIO signal level can be selected according to SD card supported

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 28 / 112 VIHmax=2.0V 3.0V signaling: VOLmax=0.38V VOHmin=2.01V VILmin=-0.3V VILmax=0.76V VIHmin=1.72V VIHmax=3.34V level, please refer to SD 3.0 protocol for more details. If unused, keep it open. SDC2_ DATA0 31 IO SD card SDIO bus DATA0 1.8V signaling: VOLmax=0.45V VOHmin=1.4V VILmin=-0.3V VILmax=0.58V VIHmin=1.27V VIHmax=2.0V 3.0V signaling: VOLmax=0.38V VOHmin=2.01V VILmin=-0.3V VILmax=0.76V VIHmin=1.72V VIHmax=3.34V SDIO signal level can be selected according to SD card supported level, please refer to SD 3.0 protocol for more details. If unused, keep it open. SDC2_CLK 32 DO SD card SDIO bus clock 1.8V signaling: VOLmax=0.45V VOHmin=1.4V 3.0V signaling: VOLmax=0.38V VOHmin=2.01V SDIO signal level can be selected according to SD card supported level, please refer to SD 3.0 protocol for more details. If unused, keep it open. SDC2_CMD 33 IO SD card SDIO bus command 1.8V signaling: VOLmax=0.45V VOHmin=1.4V VILmin=-0.3V VILmax=0.58V VIHmin=1.27V VIHmax=2.0V 3.0V signaling: VOLmax=0.38V VOHmin=2.01V VILmin=-0.3V SDIO signal level can be selected according to SD card supported level, please refer to SD 3.0 protocol for more details. If unused, keep it open.

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 29 / 112 VILmax=0.76V VIHmin=1.72V VIHmax=3.34V SD_INS_ DET 23 DI SD card insertion detect VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. VDD_SDIO 34 PO SD card SDIO bus pull-up power IOmax=50mA 1.8V/2.85V configurable. Cannot be used for SD card power. If unused, keep it open. SGMII Interface Pin Name Pin No. I/O Description DC Characteristics Comment EPHY_RST_N 119 DO Ethernet PHY reset For 1.8V: VOLmax=0.45V VOHmin=1.4V For 2.85V: VOLmax=0.35V VOHmin=2.14V 1.8V/2.85V power domain. If unused, keep it open. EPHY_INT_N 120 DI Ethernet PHY interrupt VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. SGMII_ MDATA 121 IO SGMII MDIO (Management Data Input/Output) data For 1.8V: VOLmax=0.45V VOHmin=1.4V VILmax=0.58V VIHmin=1.27V For 2.85V: VOLmax=0.35V VOHmin=2.14V VILmax=0.71V VIHmin=1.78V 1.8V/2.85V power domain. If unused, keep it open. SGMII_ MCLK 122 DO SGMII MDIO (Management Data Input/Output) clock For 1.8V: VOLmax=0.45V VOHmin=1.4V For 2.85V: VOLmax=0.35V VOHmin=2.14V 1.8V/2.85V power domain. If unused, keep it open.

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 30 / 112 USIM2_VDD 128 PO SGMII MDIO pull-up power source Configurable power source. 1.8V/2.85V power domain. External pull-up for SGMII MDIO pins. If unused, keep it open. SGMII_TX_M 123 AO SGMII transmission - minus Connect with a 0.1uF capacitor, close to the PHY side. If unused, keep it open. SGMII_TX_P 124 AO SGMII transmission - plus Connect with a 0.1uF capacitor, close to the PHY side. If unused, keep it open. SGMII_RX_P 125 AI SGMII receiving - plus Connect with a 0.1uF capacitor, close to EC25 module. If unused, keep it open. SGMII_RX_M 126 AI SGMII receiving -minus Connect with a 0.1uF capacitor, close to EC25 module. If unused, keep it open. Wireless Connectivity Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment SDC1_ DATA3 129 IO WLAN SDIO data bus D3 VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. SDC1_ DATA2 130 IO WLAN SDIO data bus D2 VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open.

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 31 / 112 SDC1_ DATA1 131 IO WLAN SDIO data bus D1 VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. SDC1_ DATA0 132 IO WLAN SDIO data bus D0 VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. SDC1_CLK 133 DO WLAN SDIO bus clock VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. SDC1_CMD 134 DO WLAN SDIO bus command VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. PM_ENABLE 127 DO External power control VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. WAKE_ON_WIRELESS 135 DI Wake up the host (EC25 module) by FC20 module VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. Active low. If unused, keep it open. WLAN_EN 136 DO WLAN function control via FC20 module VOLmax=0.45V VOHmin=1.35V 1.8V power domain. Active high. Cannot be pulled up before startup. If unused, keep it open. COEX_UART_RX 137 DI LTE/WLAN&BT coexistence signal VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. Cannot be pulled up before startup. If unused, keep it open. COEX_UART_TX 138 DO LTE/WLAN&BT coexistence signal VOLmax=0.45V VOHmin=1.35V 1.8V power domain. Cannot be pulled up before startup. If unused, keep it open. WLAN_SLP_CLK 118 DO WLAN sleep clock If unused, keep it open.

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 32 / 112 BT_RTS* 37 DI BT UART request to send VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. BT_TXD* 38 DO BT UART transmit data VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. BT_RXD* 39 DI BT UART receive data VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. BT_CTS* 40 DO BT UART clear to send VOLmax=0.45V VOHmin=1.35V 1.8V power domain. Cannot be pulled up before startup. If unused, keep it open. BT_EN* 139 DO BT function control via the BT module VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. RF Interface Pin Name Pin No. I/O Description DC Characteristics Comment ANT_DIV 35 AI Diversity antenna pad 50Ω impedance If unused, keep it open. ANT_MAIN 49 IO Main antenna pad 50Ω impedance ANT_GNSS 47 AI GNSS antenna pad 50Ω impedance If unused, keep it open. GPIO Pins Pin Name Pin No. I/O Description DC Characteristics Comment WAKEUP_IN 1 DI Sleep mode control VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. Cannot be pulled up before startup. Low level wakes up the module. If unused, keep it open. W_DISABLE# 4 DI Airplane mode control VILmin=-0.3V VILmax=0.6V VIHmin=1.2V 1.8V power domain. Pull-up by default. At low voltage level,

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 33 / 112 1. “*” means under development. 2. Pads 24~27 are multiplexing pins used for audio design on the EC25 module and BT function on the BT module. VIHmax=2.0V module can enter into airplane mode. If unused, keep it open. AP_READY 2 DI Application processor sleep state detection VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. USB_BOOT Interface Pin Name Pin No. I/O Description DC Characteristics Comment USB_BOOT 115 DI Force the module to enter into emergency download mode VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. Cannot be pulled up before startup. It is recommended to reserve test point. RESERVED Pins Pin Name Pin No. I/O Description DC Characteristics Comment RESERVED 3, 18, 43, 55, 73~84, 113, 114, 116, 117, 140-144. Reserved Keep these pins unconnected. NOTES

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 34 / 112 3.4. Operating Modes The table below briefly summarizes the various operating modes referred in the following chapters. Table 5: Overview of Operating Modes 3.5. Power Saving 3.5.1. Sleep Mode EC25 is able to reduce its current consumption to a minimum value during the sleep mode. The following section describes power saving procedures of EC25 module. 3.5.1.1. UART Application If the host communicates with module via UART interface, the following preconditions can let the module enter into sleep mode.  Execute AT+QSCLK=1 command to enable sleep mode.  Drive DTR to high level. Mode Details Normal Operation Idle Software is active. The module has registered on the network, and it is ready to send and receive data. Talk/Data Network connection is ongoing. In this mode, the power consumption is decided by network setting and data transfer rate. Minimum Functionality Mode AT+CFUN command can set the module to a minimum functionality mode without removing the power supply. In this case, both RF function and (U)SIM card will be invalid. Airplane Mode AT+CFUN command or W_DISABLE# pin can set the module to airplane mode. In this case, RF function will be invalid. Sleep Mode In this mode, the current consumption of the module will be reduced to the minimal level. During this mode, the module can still receive paging message, SMS, voice call and TCP/UDP data from the network normally. Power Down Mode In this mode, the power management unit shuts down the power supply. Software is not active. The serial interface is not accessible. Operating voltage (connected to VBAT_RF and VBAT_BB) remains applied.

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 35 / 112 The following figure shows the connection between the module and the host. Figure 3: Sleep Mode Application via UART  Driving the host DTR to low level will wake up the module.  When EC25 has a URC to report, RI signal will wake up the host. Please refer to Chapter 3.17 for details about RI behaviors.  AP_READY will detect the sleep state of the host (can be configured to high level or low level detection). Please refer to AT+QCFG="apready"* command for details. “*” means under development. 3.5.1.2. USB Application with USB Remote Wakeup Function If the host supports USB suspend/resume and remote wakeup function, the following three preconditions must be met to let the module enter into the sleep mode.  Execute AT+QSCLK=1 command to enable sleep mode.  Ensure the DTR is held at high level or keep it open.  The host’s USB bus, which is connected with the module’s USB interface, enters into suspended state. NOTE

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 36 / 112 The following figure shows the connection between the module and the host. Figure 4: Sleep Mode Application with USB Remote Wakeup  Sending data to EC25 through USB will wake up the module.  When EC25 has a URC to report, the module will send remote wake-up signals via USB bus so as to wake up the host. 3.5.1.3. USB Application with USB Suspend/Resume and RI Function If the host supports USB suspend/resume, but does not support remote wake-up function, the RI signal is needed to wake up the host. There are three preconditions to let the module enter into the sleep mode.  Execute AT+QSCLK=1 command to enable the sleep mode.  Ensure the DTR is held at high level or keep it open.  The host’s USB bus, which is connected with the module’s USB interface, enters into suspended state. The following figure shows the connection between the module and the host. Figure 5: Sleep Mode Application with RI

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 37 / 112  Sending data to EC25 through USB will wake up the module.  When EC25 has a URC to report, RI signal will wake up the host. 3.5.1.4. USB Application without USB Suspend Function If the host does not support USB suspend function, USB_VBUS should be disconnected via an additional control circuit to let the module enter into sleep mode.  Execute AT+QSCLK=1 command to enable sleep mode.  Ensure the DTR is held at high level or keep it open.  Disconnect USB_VBUS. The following figure shows the connection between the module and the host. Figure 6: Sleep Mode Application without Suspend Function Switching on the power switch to supply power to USB_VBUS will wake up the module. Please pay attention to the level match shown in dotted line between the module and the host. For more details about EC25 power management application, please refer to document [1]. 3.5.2. Airplane Mode When the module enters into airplane mode, the RF function does not work, and all AT commands correlative with RF function will be inaccessible. This mode can be set via the following ways. NOTE

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 38 / 112 Hardware: The W_DISABLE# pin is pulled up by default; driving it to low level will let the module enter into airplane mode. Software: AT+CFUN command provides the choice of the functionality level through setting <fun> into 0, 1 or 4.  AT+CFUN=0: Minimum functionality mode. Both (U)SIM and RF functions are disabled.  AT+CFUN=1: Full functionality mode (by default).  AT+CFUN=4: Airplane mode. RF function is disabled. 1. The W_DISABLE# control function is disabled in firmware by default. It can be enabled by AT+QCFG="airplanecontrol" command, and this command is under development. 2. The execution of AT+CFUN command will not affect GNSS function. 3.6. Power Supply 3.6.1. Power Supply Pins EC25 provides four VBAT pins to connect with the external power supply, and there are two separate voltage domains for VBAT.  Two VBAT_RF pins for module’s RF part  Two VBAT_BB pins for module’s baseband part The following table shows the details of VBAT pins and ground pins. Table 6: VBAT and GND Pins Pin Name Pin No. Description Min. Typ. Max. Unit VBAT_RF 57, 58 Power supply for module’s RF part 3.3 3.8 4.3 V VBAT_BB 59, 60 Power supply for module’s baseband part 3.3 3.8 4.3 V GND 8, 9, 19, 22, 36, 46, 48, 50~54, 56, 72, 85~112 Ground - 0 - V NOTES

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 39 / 112 3.6.2. Decrease Voltage Drop The power supply range of the module is from 3.3V to 4.3V. Please make sure that the input voltage will never drop below 3.3V. The following figure shows the voltage drop during burst transmission in 2G network. The voltage drop will be less in 3G and 4G networks. Figure 7: Power Supply Limits during Burst Transmission To decrease voltage drop, a bypass capacitor of about 100µF with low ESR (ESR=0.7Ω) should be used, and a multi-layer ceramic chip (MLCC) capacitor array should also be reserved due to its ultra-low ESR. It is recommended to use three ceramic capacitors (100nF, 33pF, 10pF) for composing the MLCC array, and place these capacitors close to VBAT_BB/VBAT_RF pins. The main power supply from an external application has to be a single voltage source and can be expanded to two sub paths with star structure. The width of VBAT_BB trace should be no less than 1mm; and the width of VBAT_RF trace should be no less than 2mm. In principle, the longer the VBAT trace is, the wider it will be. In addition, in order to get a stable power source, it is suggested that a zener diode whose reverse zener voltage is 5.1V and dissipation power is more than 0.5W should be used. The following figure shows the star structure of the power supply. Figure 8: Star Structure of the Power Supply

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 40 / 112 3.6.3. Reference Design for Power Supply Power design for the module is very important, as the performance of the module largely depends on the power source. The power supply should be able to provide sufficient current up to 2A at least. If the voltage drop between the input and output is not too high, it is suggested that an LDO should be used to supply power for the module. If there is a big voltage difference between the input source and the desired output (VBAT), a buck converter is preferred to be used as the power supply. The following figure shows a reference design for +5V input power source. The typical output of the power supplyis about 3.8V and the maximum load current is 3A. Figure 9: Reference Circuit of Power Supply In order to avoid damaging internal flash, please do not switch off the power supply when the module works normally. Only after the module is shutdown by PWRKEY or AT command, then the power supply can be cut off. 3.6.4. Monitor the Power Supply AT+CBC command can be used to monitor the VBAT_BB voltage value. For more details, please refer to document [2]. 3.7. Turn on and off Scenarios 3.7.1. Turn on Module Using the PWRKEY The following table shows the pin definition of PWRKEY. NOTE

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 41 / 112 Table 7: Pin Definition of PWRKEY When EC25 is in power down mode, it can be turned on to normal mode by driving the PWRKEY pin to a low level for at least 500ms. It is recommended to use an open drain/collector driver to control the PWRKEY. After STATUS pin (require external pull-up) outputting a low level, PWRKEY pin can be released. A simple reference circuit is illustrated in the following figure. Turn on pulsePWRKEY4.7K47K≥ 500ms10nF Figure 10: Turn on the Module by Using Driving Circuit The other way to control the PWRKEY is using a button directly. When pressing the key, electrostatic strike may generate from finger. Therefore, a TVS component is indispensable to be placed nearby the button for ESD protection. A reference circuit is shown in the following figure. Figure 11: Turn on the Module by Using Button Pin Name Pin No. I/O Description Comment PWRKEY 21 DI Turn on/off the module The output voltage is 0.8V because of the diode drop in the Qualcomm chipset.

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 42 / 112 The turn on scenario is illustrated in the following figure. Figure 12: Timing of Turning on Module Please make sure that VBAT is stable before pulling down PWRKEY pin. The time between them should be no no less than 30ms. 3.7.2. Turn off Module The following procedures can be used to turn off the module:  Normal power down procedure: Turn off the module using the PWRKEY pin.  Normal power down procedure: Turn off the module using AT+QPOWD command. 3.7.2.1. Turn off Module Using the PWRKEY Pin Driving the PWRKEY pin to a low level voltage for at least 650ms, the module will execute power-down procedure after the PWRKEY is released. The power-down scenario is illustrated in the following figure. NOTE

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 43 / 112 Figure 13: Timing of Turning off Module 3.7.2.2. Turn off Module Using AT Command It is also a safe way to use AT+QPOWD command to turn off the module, which is similar to turning off the module via PWRKEY pin. Please refer to document [2] for details about AT+QPOWD command. 1. Inorder to avoid damaging internal flash, please do not switch off the power supply when the module works normally. Only after the module is shut down by PWRKEY or AT command, then the power supply can be cut off. 2. When turn off module with AT command, please keep PWRKEY at high level after the execution of power-off command. Otherwise the module will be turned on again after successfully turn-off. 3.8. Reset the Module The RESET_N pin can be used to reset the module. The module can be reset by driving RESET_N to a low level voltage for time between 150ms and 460ms. Table 8: RESET_N Pin Description Pin Name Pin No. I/O Description Comment RESET_N 20 DI Reset the module 1.8V power domain NOTES

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 44 / 112 The recommended circuit is similar to the PWRKEY control circuit. An open drain/collector driver or button can be used to control the RESET_N. Figure 14: Reference Circuit of RESET_N by Using Driving Circuit Figure 15: Reference Circuit of RESET_N by Using Button The reset scenario is illustrated inthe following figure. Figure 16: Timing of Resetting Module

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 45 / 112 1. Use RESET_N only when turning off the module by AT+QPOWD command and PWRKEY pin failed. 2. Ensure that there is no large capacitance on PWRKEY and RESET_N pins. 3.9. (U)SIM Interface The(U)SIM interface circuitry meets ETSI and IMT-2000 requirements. Both 1.8V and 3.0V (U)SIM cards are supported. Table 9: Pin Definition of the (U)SIM Interface EC25 supports (U)SIM card hot-plug via the USIM_PRESENCE pin. The function supports low level and high level detections, and it is disabled by default. Please refer to document [2] for more details about AT+QSIMDET command. Pin Name Pin No. I/O Description Comment USIM_VDD 14 PO Power supply for (U)SIM card Either 1.8V or 3.0V is supported by the module automatically. USIM_DATA 15 IO Data signal of (U)SIM card USIM_CLK 16 DO Clock signal of (U)SIM card USIM_RST 17 DO Reset signal of (U)SIM card USIM_ PRESENCE 13 DI (U)SIM card insertion detection USIM_GND 10 Specified ground for (U)SIM card NOTES

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 46 / 112 The following figure shows a reference design for (U)SIM interface with an 8-pin (U)SIM card connector. Figure 17: Reference Circuit of (U)SIM Interface with an 8-Pin (U)SIM Card Connector If (U)SIM card detection function is not needed, please keep USIM_PRESENCE unconnected. A reference circuit for (U)SIM interface with a 6-pin (U)SIM card connector is illustrated in the following figure. Figure 18: Reference Circuit of (U)SIM Interface with a 6-Pin (U)SIM Card Connector In order to enhance the reliability and availability of the (U)SIM card in customers’ applications, please follow the criteria below in (U)SIM circuit design:

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 47 / 112  Keep placement of (U)SIM card connector to the module as close as possible. Keep the trace length as less than 200mm as possible.  Keep (U)SIM card signals away from RF and VBAT traces.  Assure the ground between the module and the (U)SIM card connector short and wide. Keep the trace width of ground and USIM_VDD no less than 0.5mm to maintain the same electric potential. Make sure the bypass capacitor between USIM_VDD and USIM_GND less than 1uF, and place it as close to (U)SIM card connector as possible. If the ground is complete on customers’ PCB, USIM_GND can be connected to PCB ground directly.  To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with surrounded ground.  In order to offer good ESD protection, it is recommended to add a TVS diode array whose parasitic capacitance should not be more than 15pF. The 0Ω resistors should be added in series between the module and the (U)SIM card to facilitate debugging. The 33pF capacitors are used for filtering interference of EGSM900. Please note that the (U)SIM peripheral circuit should be close to the (U)SIM card connector.  The pull-up resistor on USIM_DATA line can improve anti-jamming capability when long layout trace and sensitive occasion are applied, and it should be placed close to the (U)SIM card connector. 3.10. USB Interface EC25 contains one integrated Universal Serial Bus (USB) interface which complies with the USB 2.0 specification and supports high-speed (480Mbps) and full-speed (12Mbps) modes. The USB interface is used for AT command communication, data transmission, GNSS NMEA sentences output, software debugging, firmware upgrade and voice over USB*. The following table shows the pin definition of USB interface. Table 10: Pin Description of USB Interface For more details about the USB 2.0 specifications, please visit http://www.usb.org/home. Pin Name Pin No. I/O Description Comment USB_DP 69 IO USB differential data bus (+) Require differential impedance of 90Ω USB_DM 70 IO USB differential data bus (-) Require differential impedance of 90Ω USB_VBUS 71 PI USB connection detection Typical 5.0V GND 72 Ground

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 48 / 112 The USB interface is recommended to be reserved for firmware upgrade in customers’ designs. The following figure shows a reference circuit of USB interface. Figure 19: Reference Circuit of USB Application A common mode choke L1 is recommended to be added in series between the module and customer’s MCU in order to suppress EMI spurious transmission. Meanwhile, the 0Ω resistors (R3 and R4) should be added in series between the module and the test points so as to facilitate debugging, and the resistors are not mounted by default. In order to ensure the integrity of USB data line signal, L1/R3/R4 components must be placed close to the module, and also these resistors should be placed close to each other. The extra stubs of trace must be as short as possible. The following principles should be complied with when design the USB interface, so as to meet USB 2.0 specification.  It is important to route the USB signal traces as differential pairs with total grounding. The impedance of USB differential trace is 90Ω.  Do not route signal traces under crystals, oscillators, magnetic devices and RF signal traces. It is important to route the USB differential traces in inner-layer with ground shielding on not only upper and lower layers but also right and left sides.  Pay attention to the influence of junction capacitance of ESD protection components on USB data lines. Typically, the capacitance value should be less than 2pF.  Keep the ESD protection components to the USB connector as close as possible. 1. EC25 module can only be used as a slave device. 2. “*” means under development. NOTES

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 49 / 112 3.11. UART Interfaces The module provides two UART interfaces: the main UART interface and the debug UART interface. The following shows their features.  The main UART interface supports 4800bps, 9600bps, 19200bps, 38400bps, 57600bps, 115200bps, 230400bps, 460800bps and 921600bps baud rates, and the default is 115200bps. This interface is used for data transmission and AT command communication.  The debug UART interface supports 115200bps baud rate. It is used for Linux console and log output. The following tables show the pin definition of the UART interfaces. Table 11: Pin Definition of Main UART Interface Table 12: Pin Definition of Debug UART Interface Pin Name Pin No. I/O Description Comment RI 62 DO Ring indicator 1.8V power domain DCD 63 DO Data carrier detection CTS 64 DO Clear to send RTS 65 DI Request to send DTR 66 DI Data terminal ready TXD 67 DO Transmit data RXD 68 DI Receive data Pin Name Pin No. I/O Description Comment DBG_TXD 12 DO Transmit data 1.8V power domain DBG_RXD 11 DI Receive data

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 50 / 112 The logic levels are described in the following table. Table 13: Logic Levels of Digital I/O The module provides 1.8V UART interface. A level translator should be used if customers’ application is equipped with a 3.3V UART interface. A level translator TXS0108EPWR provided by Texas Instruments is recommended. The following figure shows a reference design. Figure 20: Reference Circuit with Translator Chip Please visit http://www.ti.com for more information. Another example with transistor translation circuit is shown as below. The circuit design of dotted line section can refer to the design of solid line section, in terms of both module’s input and output circuit designs, but please pay attention to the direction of connection. Parameter Min. Max. Unit VIL -0.3 0.6 V VIH 1.2 2.0 V VOL 0 0.45 V VOH 1.35 1.8 V

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 51 / 112 Figure 21: Reference Circuit with Transistor Circuit Transistor circuit solution is not suitable for applications with high baud rates exceeding 460Kbps. 3.12. PCM and I2C Interfaces EC25 provides one Pulse Code Modulation (PCM) digital interface for audio design, which supports the following modes and one I2C interface:  Primary mode (short frame synchronization, works as both master and slave)  Auxiliary mode (long frame synchronization, works as master only) In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC falling edge represents the MSB. In this mode, the PCM interface supports 256kHz, 512kHz, 1024kHz or 2048kHz PCM_CLK at 8kHz PCM_SYNC, and also supports 4096kHz PCM_CLK at 16kHz PCM_SYNC. In auxiliary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC rising edge represents the MSB. In this mode, the PCM interface operates with a 256kHz, 512kHz, 1024kHz or 2048kHz PCM_CLK and an 8kHz, 50% duty cycle PCM_SYNC. EC25 supports 16-bit linear data format. The following figures show the primary mode’s timing relationship with 8KHz PCM_SYNC and 2048KHz PCM_CLK, as well as the auxiliary mode’s timing relationship with 8KHz PCM_SYNC and 256KHz PCM_CLK. NOTE

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 52 / 112 Figure 22: Primary Mode Timing Figure 23: Auxiliary Mode Timing The following table shows the pin definition of PCM and I2C interfaces which can be applied on audio codec design. Table 14: Pin Definition of PCM and I2C Interfaces Pin Name Pin No. I/O Description Comment PCM_IN 24 DI PCM data input 1.8V power domain

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 53 / 112 Clock and mode can be configured by AT command, and the default configuration is master mode using short frame synchronization format with 2048KHz PCM_CLK and 8KHz PCM_SYNC. Please refer to document [2] for more details about AT+QDAI command. The following figure shows a reference design of PCM interface with external codec IC. Figure 24: Reference Circuit of PCM Application with Audio Codec 1. It is recommended to reserve an RC (R=22Ω, C=22pF) circuits on the PCM lines, especially for PCM_CLK. 2. EC25 works as a master device pertaining to I2C interface. PCM_OUT 25 DO PCM data output 1.8V power domain PCM_SYNC 26 IO PCM data frame synchronization signal 1.8V power domain PCM_CLK 27 IO PCM data bit clock 1.8V power domain I2C_SCL 41 OD I2C serial clock Require external pull-up to 1.8V I2C_SDA 42 OD I2C serial data Require external pull-up to 1.8V NOTES

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 54 / 112 3.13. SD Card Interface EC25 supports SDIO 3.0 interface for SD card. The following table shows the pin definition of SD card interface. Table 15: Pin Definition of SD Card Interface Pin Name Pin No. I/O Description Comment SDC2_DATA3 28 IO SD card SDIO bus DATA3 SDIO signal level can be selected according to SD card supported level, please refer to SD 3.0 protocol for more details. If unused, keep it open. SDC2_DATA2 29 IO SD card SDIO bus DATA2 SDIO signal level can be selected according to SD card supported level, please refer to SD 3.0 protocol for more details. If unused, keep it open. SDC2_DATA1 30 IO SD card SDIO bus DATA1 SDIO signal level can be selected according to SD card supported level, please refer to SD 3.0 protocol for more details. If unused, keep it open. SDC2_DATA0 31 IO SD card SDIO bus DATA0 SDIO signal level can be selected according to SD card supported level, please refer to SD 3.0 protocol for more details. If unused, keep it open. SDC2_CLK 32 DO SD card SDIO bus clock SDIO signal level can be selected according to SD card supported level, please refer to SD 3.0 protocol for more details. If unused, keep it open. SDC2_CMD 33 IO SD card SDIO bus command SDIO signal level can be selected according to SD

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 55 / 112 The following figure shows a reference design of SD card. Figure 25: Reference Circuit of SD card In SD card interface design, in order to ensure good communication performance with SD card, the following design principles should be complied with:  SD_INS_DET must be connected.  The voltage range of SD card power supply VDD_3V is 2.7V~3.6V and a sufficient current up to 0.8A should be provided. As the maximum output current of VDD_SDIO is 50mA which can only be used for SDIO pull-up resistors, an externally power supply is needed for SD card.  To avoid jitter of bus, resistors R7~R11 are needed to pull up the SDIO to VDD_SDIO. Value of these resistors is among 10KΩ~100KΩ and the recommended value is 100KΩ. VDD_SDIO should be used as the pull-up power.  In order to adjust signal quality, it is recommended to add 0Ω resistors R1~R6 in series between the module and the SD card. The bypass capacitors C1~C6 are reserved and not mounted by default. All resistors and bypass capacitors should be placed close to the module.  In order to offer good ESD protection, it is recommended to add a TVS diode on SD card pins near the SD card connector with junction capacitance less than 15pF. card supported level, please refer to SD 3.0 protocol for more details. If unused, keep it open. VDD_SDIO 34 PO SD card SDIO bus pull up power 1.8V/2.85V configurable. Cannot be used for SD card power. If unused, keep it open. SD_INS_DET 23 DI SD card insertion detection 1.8V power domain. If unused, keep it open.

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 56 / 112  Keep SDIO signals far away from other sensitive circuits/signals such as RF circuits, analog signals, etc., as well as noisy signals such as clock signals, DCDC signals, etc.  It is important to route the SDIO signal traces with total grounding. The impedance of SDIO data trace is 50Ω (±10%).  Make sure the adjacent trace spacing is two times of the trace width and the load capacitance of SDIO bus should be less than 15pF.  It is recommended to keep the trace length difference between CLK and DATA/CMD less than 1mm and the total routing length less than 50mm. The total trace length inside the module is 27mm, so the exterior total trace length should be less than 23mm. 3.14. ADC Interfaces The module provides two analog-to-digital converter (ADC) interfaces. AT+QADC=0 command can be used to read the voltage value on ADC0 pin. AT+QADC=1 command can be used to read the voltage value on ADC1 pin. For more details about these AT commands, please refer to document [2]. In order to improve the accuracy of ADC, the trace of ADC should be surrounded by ground. Table 16: Pin Definition of ADC Interfaces The following table describes the characteristic of ADC function. Table 17: Characteristic of ADC Pin Name Pin No. Description ADC0 45 General purpose analog to digital converter ADC1 44 General purpose analog to digital converter Parameter Min. Typ. Max. Unit ADC0 Voltage Range 0.3 VBAT_BB V ADC1 Voltage Range 0.3 VBAT_BB V ADC Resolution 15 Bits

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 57 / 112 1. ADC input voltage must not exceed VBAT_BB. 2. It is prohibited to supply any voltage to ADC pins when VBAT is removed. 3. It is recommended to use a resistor divider circuit for ADC application. 3.15. Network Status Indication The network indication pins can be used to drive network status indication LEDs. The module provides two pins which are NET_MODE and NET_STATUS. The following tables describe the pin definition and logic level changes in different network status. Table 18: Pin Definition of Network Connection Status/Activity Indicator Table 19: Working State of the Network Connection Status/Activity Indicator Pin Name Pin No. I/O Description Comment NET_MODE 5 DO Indicate the module network registration mode. 1.8V power domain Cannot be pulled up before startup NET_STATUS 6 DO Indicate the module network activity status. 1.8V power domain Pin Name Logic Level Changes Network Status NET_MODE Always High Registered on LTE network Always Low Others NET_STATUS Flicker slowly (200ms High/1800ms Low) Network searching Flicker slowly (1800ms High/200ms Low) Idle Flicker quickly (125ms High/125ms Low) Data transfer is ongoing Always High Voice calling NOTES

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 58 / 112 A reference circuit is shown in the following figure. Figure 26: Reference Circuit of the Network Indicator 3.16. STATUS The STATUS pin is an open drain output for indicating the module’s operation status. It can be connected to a GPIO of DTE with a pull-up resistor, or as LED indication circuit as below. When the module is turned on normally, the STATUS will present the low state. Otherwise, the STATUS will present high-impedance state. Table 20: Pin Definition of STATUS The following figure shows different circuit designs of STATUS, and customers can choose either one according to customers’ application demands. Pin Name Pin No. I/O Description Comment STATUS 61 OD Indicate the module’s operation status An external pull-up resistor is required. If unused, keep it open.

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 59 / 112 Figure 27: Reference Circuits of STATUS 3.17. Behaviors of RI AT+QCFG="risignaltype","physical" command can be used to configure RI behavior. No matter on which port URC is presented, URC will trigger the behavior of RI pin. URC can be outputted from UART port, USB AT port and USB modem port through configuration via AT+QURCCFG command. The default port is USB AT port. In addition, RI behavior can be configured flexibly. The default behavior of the RI is shown as below. Table 21: Behavior of RI The RI behavior can be changed by AT+QCFG="urc/ri/ring" command. Please refer to document [2] for details. State Response Idle RI keeps at high level URC RI outputs 120ms low pulse when a new URC returns NOTE

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 60 / 112 3.18. SGMII Interface EC25 includes an integrated Ethernet MAC with an SGMII interface and two management interfaces, key features of the SGMII interface are shown below:  IEEE802.3 compliance  Support 10M/100M/1000M Ethernet work mode  Support maximum 150Mbps (DL)/50Mbps (UL) for 4G network  Support VLAN tagging  Support IEEE1588 and Precision Time Protocol (PTP)  Can be used to connect to external Ethernet PHY like AR8033, or to an external switch  Management interfaces support dual voltage 1.8V/2.85V The following table shows the pin definition of SGMII interface. Table 22: Pin Definition of the SGMII Interface Pin Name Pin No. I/O Description Comment Control Signal Part EPHY_RST_N 119 DO Ethernet PHY reset 1.8V/2.85V power domain EPHY_INT_N 120 DI Ethernet PHY interrupt 1.8V power domain SGMII_MDATA 121 IO SGMII MDIO (Management Data Input/Output) data 1.8V/2.85V power domain SGMII_MCLK 122 DO SGMII MDIO (Management Data Input/Output) clock 1.8V/2.85V power domain USIM2_VDD 128 PO SGMII MDIO pull-up power sourceConfigurable power source. 1.8V/2.85V power domain. External pull-up power source for SGMII MDIO pins. SGMII Signal Part SGMII_TX_M 123 AO SGMII transmission-minus Connect with a 0.1uF capacitor, close to the PHY side. SGMII_TX_P 124 AO SGMII transmission-plus Connect with a 0.1uF capacitor, close to the PHY side. SGMII_RX_P 125 AI SGMII receiving-plus Connect with a 0.1uF capacitor, close to EC25 module. SGMII_RX_M 126 AI SGMII receiving-minus Connect with a 0.1uF capacitor, close to EC25 module.

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 61 / 112 The following figure shows the simplified block diagram for Ethernet application. Figure 28: Simplified Block Diagram for Ethernet Application The following figure shows a reference design of SGMII interface with PHY AR8033 application. Figure 29: Reference Circuit of SGMII Interface with PHY AR8033 Application In order to enhance the reliability and availability in customers’ applications, please follow the criteria below in the Ethernet PHY circuit design:  Keep SGMII data and control signals away from other sensitive circuits/signals such as RF circuits, analog signals, etc., as well as noisy signals such as clock signals, DCDC signals, etc.  Keep the maximum trace length less than 10-inch and keep skew on the differential pairs less than 20mil.  The differential impedance of SGMII data trace is 100Ω±10%, and the reference ground of the area should be complete.  Make sure the trace spacing between SGMII RX and TX is at least 3 times of the trace width, and the same to the adjacent signal traces.

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 62 / 112 3.19. Wireless Connectivity Interfaces EC25 supports a low-power SDIO 3.0 interface for WLAN and a UART/PCM interface for BT. The following table shows the pin definition of wireless connectivity interfaces. Table 23: Pin Definition of Wireless Connectivity Interfaces Pin Name Pin No. I/O Description Comment WLAN Part SDC1_DATA3 129 IO WLAN SDIO data bus D3 1.8V power domain SDC1_DATA2 130 IO WLAN SDIO data bus D2 1.8V power domain SDC1_DATA1 131 IO WLAN SDIO data bus D1 1.8V power domain SDC1_DATA0 132 IO WLAN SDIO data bus D0 1.8V power domain SDC1_CLK 133 DO WLAN SDIO bus clock 1.8V power domain SDC1_CMD 134 IO WLAN SDIO bus command 1.8V power domain WLAN_EN 136 DO WLAN function control via FC20 module. 1.8V power domain. Active high. Cannot be pulled up before startup. Coexistence and Control Part PM_ENABLE 127 DO External power control 1.8V power domain Active high. WAKE_ON_ WIRELESS 135 DI Wake up the host (EC25 module) by FC20 module 1.8V power domain COEX_UART_RX 137 DI LTE/WLAN&BT coexistence signal 1.8V power domain. Cannot be pulled up before startup. COEX_UART_TX 138 DO LTE/WLAN&BT coexistence signal 1.8V power domain. Cannot be pulled up before startup. WLAN_SLP_CLK 118 DO WLAN sleep clock BT Part* BT_RTS* 37 DI BT UART request to send 1.8V power domain BT_TXD* 38 DO BT UART transmit data 1.8V power domain

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 63 / 112 The following figure shows a reference design of wireless connectivity interfaces with Quectel FC20 module. ModuleWAKE_ ON_WIRELESSWLAN_SL P_CLKPM_ENAB LEDCDC/LDO32K HZ_I NWAKE_ ON_WIRELE SSFC20 ModuleVDD_3V3POWERSDC1_DATA3SDC1_DATA2SDC1_DATA1SDC1_DATA0SDC1_CLKSDC1_CMDWLAN_ENSDIO_D3SDIO_D2SDIO_D1SDIO_D0SDIO_CLKSDIO_CMDWLAN_ENWLANVDD_EXT VIOCOEX_UART_TXCOEX_ UART_RX LTE_UART_TXDLTE_UART_RXDCOEX Figure 30: Reference Circuit of Wireless Connectivity Interfaces with FC20 Module 1. FC20 module can only be used as a slave device. 2. When BT function is enabled on EC25 module, PCM_SYNC and PCM_CLK pins are only used to output signals. 3. For more information about wireless connectivity interfaces, please refer to document [5]. BT_RXD* 39 DI BT UART receive data 1.8V power domain BT_CTS* 40 DO BT UART clear to send 1.8V power domain. Cannot be pulled up before startup. PCM_IN1) 24 DI PCM data input 1.8V power domain PCM_OUT1) 25 DO PCM data output 1.8V power domain PCM_SYNC1) 26 IO PCM data frame synchronization signal 1.8V power domain PCM_CLK1) 27 IO PCM data bit clock 1.8V power domain BT_EN* 139 DO BT function control via BT module. 1.8V power domain Active high. NOTES

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 64 / 112 4. “*” means under development. 5. 1) Pads 24~27 are multiplexing pins used for audio design on EC25 module and BT function on BT module. 3.19.1. WLAN Interface EC25 provides a low power SDIO 3.0 interface and control interface for WLAN design. SDIO interface supports the SDR mode (up to 50MHz). As SDIO signals are very high-speed, in order to ensure the SDIO interface design corresponds with the SDIO 3.0 specification, please comply with the following principles:  It is important to route the SDIO signal traces with total grounding. The impedance of SDIO signal trace is 50Ω±10%.  Keep SDIO signals far away from other sensitive circuits/signals such as RF circuits, analog signals,  etc., as well as noisy signals such as clock signals, DCDC signals, etc.  It is recommended to keep matching length between CLK andDATA/CMD less than 1mm and total routing length less than 50mm.  Keep termination resistors within 15Ω~24Ω on clock lines near the module and keep the route distance from the module clock pins to termination resistors less than 5mm.  Make sure the adjacent trace spacing is 2 times of the trace width and bus capacitance is less than 15pF.  WLAN is an optional function for EC25-AF which not included in current product. 3.19.2. BT Interface* EC25 supports a dedicated UART interface and a PCM interface for BT application. Further information about BT interface will be added in future version of this document. “*” means under development. BT is an optional function for EC25-AF which not included in current product. NOTE NOTE

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 65 / 112 3.20. USB_BOOT Interface EC25 provides a USB_BOOT pin. Developers can pull up USB_BOOT to VDD_EXT before powering on the module, thus the module will enter into emergency download mode when powered on. In this mode, the module supports firmware upgrade over USB interface. Table 24: Pin Definition of USB_BOOT Interface The following figure shows a reference circuit of USB_BOOT interface. ModuleUSB_BOOTVDD_EXT4.7KTest pointTVSClose to test po int Figure 31: Reference Circuit of USB_BOOT Interface Pin Name Pin No. I/O Description Comment USB_BOOT 115 DI Force the module enter into emergency download mode 1.8V power domain. Active high. It is recommended to reserve test point.

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 66 / 112 4 GNSS Receiver 4.1. General Description EC25 includes a fully integrated global navigation satellite system solution that supports Gen8C-Lite of Qualcomm (GPS, GLONASS, BeiDou, Galileo and QZSS). EC25 supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1Hz data update rate via USB interface by default. By default, EC25 GNSS engine is switched off. It has to be switched on via AT command. For more details about GNSS engine technology and configurations, please refer to document [3]. 4.2. GNSS Performance The following table shows GNSS performance of EC25. Table 25: GNSS Performance Parameter Description Conditions Typ. Unit Sensitivity (GNSS) Cold start Autonomous -146 dBm Reacquisition Autonomous -157 dBm Tracking Autonomous -157 dBm TTFF (GNSS) Cold start @open sky Autonomous 35 s XTRA enabled 18 s Warm start @open sky Autonomous 26 s XTRA enabled 2.2 s

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 67 / 112 1. Tracking sensitivity: the lowest GNSSsignal value at the antenna port on which the module can keep on positioning for 3 minutes. 2. Reacquisition sensitivity: the lowest GNSS signal value at the antenna port on which the module can fix position again within 3 minutes after loss of lock. 3. Cold start sensitivity: the lowest GNSS signal value at the antenna port on which the module fixes position within 3 minutes after executing cold start command. 4.3. Layout Guidelines The following layout guidelines should be taken into account in customers’ designs.  Maximize the distance among GNSS antenna, main antenna and Rx-diversity antenna.  Digital circuits such as (U)SIM card, USB interface, camera module and display connector should be kept away from the antennas.  Use ground vias around the GNSS trace and sensitive analog signal traces to provide coplanar isolation and protection.  Keep 50Ω characteristic impedance for the ANT_GNSS trace. Please refer to Chapter 5 for GNSS antenna reference design and antenna installation information. Hot start @open sky Autonomous 2.5 s XTRA enabled 1.8 s Accuracy (GNSS) CEP-50 Autonomous @open sky <1.5 m NOTES

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 68 / 112 5 Antenna Interfaces EC25 antenna interfaces include a main antenna interface, an Rx-diversity antenna interface which is used to resist the fall of signals caused by high speed movement and multipath effect, and a GNSS antenna interface. The impedance of the antenna port is 50Ω. 5.1. Main/Rx-diversity Antenna Interfaces 5.1.1. Pin Definition The pin definition of main antenna and Rx-diversityantenna interfaces is shown below. Table 26: Pin Definition of RF Antenna 5.1.2. Operating Frequency Table 27: Module Operating Frequencies Pin Name Pin No. I/O Description Comment ANT_MAIN 49 IO Main antenna pad 50Ω impedance ANT_DIV 35 AI Receive diversity antenna pad 50Ω impedance If unused, keep it open. 3GPP Band Transmit Receive Unit GSM850 824~849 869~894 MHz EGSM900 880~915 925~960 MHz DCS1800 1710~1785 1805~1880 MHz PCS1900 1850~1910 1930~1990 MHz WCDMA B1 1920~1980 2110~2170 MHz

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 69 / 112 WCDMA B2 1850~1910 1930~1990 MHz WCDMA B4 1710~1755 2110~2155 MHz WCDMA B5 824~849 869~894 MHz WCDMA B6 830~840 875~885 MHz WCDMA B8 880~915 925~960 MHz WCDMA B19 830~845 875~890 MHz LTE FDD B1 1920~1980 2110~2170 MHz LTE FDD B2 1850~1910 1930~1990 MHz LTE FDD B3 1710~1785 1805~1880 MHz LTE FDD B4 1710~1755 2110~2155 MHz LTE FDD B5 824~849 869~894 MHz LTE FDD B7 2500~2570 2620~2690 MHz LTE FDD B8 880~915 925~960 MHz LTE FDD B12 699~716 729~746 MHz LTE FDD B13 777~787 746~756 MHZ LTE FDD B14 788~798 758~768 MHZ LTE FDD B18 815~830 860~875 MHz LTE FDD B19 830~845 875~890 MHz LTE FDD B20 832~862 791~821 MHz LTE FDD B28 703~748 758~803 MHz LTE TDD B38 2570~2620 2570~2620 MHz LTE TDD B40 2300~2400 2300~2400 MHz LTE TDD B41 2555~2655 2555~2655 MHz LTE TDD B66 1710~1780 2100~2200 MHz LTE TDD B71 663~698 617~652 MHz

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 70 / 112 5.1.3. Reference Design of RF Antenna Interface Areference design of ANT_MAIN and ANT_DIV antenna pads is shown as below. A π-type matching circuit should be reserved for better RF performance. The capacitors are not mounted by default. Figure 32: Reference Circuit of RF Antenna Interface 1. Keep a proper distance between the main antenna and the Rx-diversity antenna to improve the receiving sensitivity. 2. ANT_DIV function is enabled by default. 3. Place the π-type matching components (R1&C1&C2, R2&C3&C4) as close to the antenna as possible. 5.1.4. Reference Design of RF Layout For user’s PCB, the characteristic impedance of all RF traces should be controlled as 50Ω. The impedance of the RF traces is usually determined by the trace width (W), the materials’ dielectric constant, the distance between signal layer and reference ground (H), and the clearance between RF trace and ground (S). Microstrip line or coplanar waveguide line is typically used in RF layout for characteristic impedance control. The following are reference designs of microstrip line or coplanar waveguide line with different PCB structures NOTES

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 71 / 112 . Figure 33: Microstrip Line Design on a 2-layer PCB Figure 34: Coplanar Waveguide Line Design on a 2-layer PCB Figure 35: Coplanar Waveguide Line Design on a 4-layer PCB (Layer 3 as Reference Ground)

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 72 / 112 Figure 36: Coplanar Waveguide Line Design on a 4-layer PCB (Layer 4 as Reference Ground) In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design:  Please use an impedance simulation tool to control the characteristic impedance of RF traces as 50Ω.  The GND pins adjacent to RF pins should not be designed as thermal relief pads, and they should be fully connected to ground.  The distance between the RF pins and the RF connector should be as short as possible, and all the right angle traces should be changed to curved ones.  There should be clearance area under the signal pin of the antenna connector or solder joint.  The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be no less than two times the width of RF signal traces (2*W). For more details about RF layout, please refer to document [6]. 5.2. GNSS Antenna Interface The following tables show pin definition and frequency specification of GNSS antenna interface. Table 28: Pin Definition of GNSS Antenna Interface Pin Name Pin No. I/O Description Comment ANT_GNSS 47 AI GNSS antenna 50Ω impedance If unused, keep it open.

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 73 / 112 Table 29: GNSS Frequency A reference design of GNSS antenna is shown as below. Figure 37: Reference Circuit of GNSS Antenna 1. An external LDO can be selected to supply power according to the active antenna requirement. 2. If the module is designed with a passive antenna, then the VDD circuit is not needed. Type Frequency Unit GPS/Galileo/QZSS 1575.42±1.023 MHz GLONASS 1597.5~1605.8 MHz BeiDou 1561.098±2.046 MHz NOTES

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 74 / 112 5.3. Antenna Installation 5.3.1. Antenna Requirement The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna. Table 30: Antenna Requirements 1) It is recommended to use a passive GNSS antenna when LTE B13 or B14 is supported, as the use of active antenna may generate harmonics which will affect the GNSS performance. Type Requirements GNSS1) Frequency range: 1561MHz~1615MHz Polarization: RHCP or linear VSWR: < 2 (Typ.) Passive antenna gain: > 0dBi Active antenna noise figure: < 1.5dB Active antenna gain: > 0dBi Active antenna embedded LNA gain: < 17 dB GSM/WCDMA/LTE VSWR: ≤ 2 Efficiency: > 30% Max Input Power: 50W Input Impedance: 50Ω Cable Insertion Loss: < 1dB (GSM850, GSM 900, WCDMA B5/B6/B8/B19, LTE-FDD B5/B8/B12/B13/B14/B18/B19/B20/B26/B28/B71) Cable Insertion Loss: < 1.5dB (DCS1800, PCS1900, WCDMA B1/B2/B4, LTE-FDD B1/B2/B3/B4/B66) Cable Insertion loss: < 2dB (LTE-FDD B7, LTE-TDD B38/B40/B41) NOTE

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 75 / 112 5.3.2. Recommended RF Connector for Antenna Installation If RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connector provided by Hirose. Figure 38: Dimensions of the U.FL-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 39: Mechanicals of U.FL-LP Connectors

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 76 / 112 The following figure describes the space factor of mated connector. Figure 40: Space Factor of Mated Connector (Unit: mm) For more details, please visit http://hirose.com.

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 77 / 112 6 Electrical, Reliability and Radio Characteristics 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 31: Absolute Maximum Ratings Parameter Min. Max. Unit VBAT_RF/VBAT_BB -0.3 4.7 V USB_VBUS -0.3 5.5 V Peak Current of VBAT_BB 0 0.8 A Peak Current of VBAT_RF 0 1.8 A Voltage at Digital Pins -0.3 2.3 V Voltage at ADC0 0 VBAT_BB V Voltage at ADC1 0 VBAT_BB V

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 78 / 112 6.2. Power Supply Ratings Table 32: The Module Power Supply Ratings 6.3. Operation and Storage Temperatures The operation and storage temperatures are listed in the following table. Table 33: Operation and Storage Temperatures 1. 1) Within operation temperature range, the module is 3GPP compliant. 2. 2) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature Parameter Description Conditions Min. Typ. Max. Unit VBAT VBAT_BB and VBAT_RF The actual input voltages must stay between the minimum and maximum values. 3.3 3.8 4.3 V Voltage drop during burst transmission Maximum power control level on EGSM900. 400 mV IVBAT Peak supply current (during transmission slot) Maximum power control level on EGSM900. 1.8 2.0 A USB_VBUS USB detection 3.0 5.0 5.25 V Parameter Min. Typ. Max. Unit OperationTemperature Range1) -35 +25 +75 ºC Extended Operation Range2) -40 +85 ºC Storage Temperature Range -40 +90 ºC NOTES

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 79 / 112 returns to the normal operating temperature levels, the module will meet 3GPP specifications again. 6.4. Current Consumption The values of current consumption are shown below. Table 34: EC25-E Current Consumption Parameter Description Conditions Typ. Unit IVBAT OFF state Power down 11 uA Sleep state AT+CFUN=0 (USB disconnected) 1.16 mA GSM DRX=2 (USB disconnected) 2.74 mA GSM DRX=9 (USB disconnected) 2.0 mA WCDMA PF=64 (USB disconnected) 2.15 mA WCDMA PF=128 (USB disconnected) 1.67 mA LTE-FDD PF=64 (USB disconnected) 2.60 mA LTE-FDD PF=128 (USB disconnected) 1.90 mA LTE-TDD PF=64 (USB disconnected) 2.79 mA LTE-TDD PF=128 (USB disconnected) 2.00 mA Idle state GSM DRX=5 (USB disconnected) 19.5 mA GSM DRX=5 (USB connected) 29.5 mA WCDMA PF=64 (USB disconnected) 21.0 mA WCDMA PF=64 (USB connected) 31.0 mA LTE-FDD PF=64 (USB disconnected) 20.7 mA LTE-FDD PF=64 (USB connected) 30.8 mA LTE-TDD PF=64 (USB disconnected) 20.8 mA

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 80 / 112 LTE-TDD PF=64 (USB connected) 32.0 mA GPRS data transfer (GNSS OFF) EGSM900 4DL/1UL @33.22dBm 271.0 mA EGSM900 3DL/2UL @33.0dBm 464.0 mA EGSM900 2DL/3UL @30.86dBm 524.0 mA EGSM900 1DL/4UL @29.58dBm 600 mA DCS1800 4DL/1UL @29.92dBm 192.0 mA DCS1800 3DL/2UL @29.84dBm 311.0 mA DCS1800 2DL/3UL @29.67dBm 424.0 mA DCS1800 1DL/4UL @29.48dBm 539.0 mA EDGE data transfer (GNSS OFF) EGSM900 4DL/1UL PCL=8 @27.40dBm 174.0 mA EGSM900 3DL/2UL PCL=8 @27.24dBm 281.0 mA EGSM900 2DL/3UL PCL=8 @27.11dBm 379.0 mA EGSM900 1DL/4UL PCL=8 @26.99dBm 480.0 mA DCS1800 4DL/1UL PCL=2 @25.82dBm 159.0 mA DCS1800 3DL/2UL PCL=2 @25.85dBm 251.0 mA DCS1800 2DL/3UL PCL=2 @25.68dBm 340.0 mA DCS1800 1DL/4UL PCL=2 @25.57dBm 433.0 mA WCDMA datatransfer (GNSS OFF) WCDMA B1 HSDPA @22.47dBm 613.0 mA WCDMA B1 HSUPA @22.44dBm 609.0 mA WCDMA B5 HSDPA @23.07dBm 671.0 mA WCDMA B5 HSUPA @23.07dBm 669.0 mA WCDMA B8 HSDPA @22.67dBm 561.0 mA WCDMA B8 HSUPA @22.39dBm 557.0 mA LTE datatransfer (GNSS OFF) LTE-FDD B1 @23.27dBm 754.0 mA LTE-FDD B3 @23.54dBm 774.0 mA

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 81 / 112 Table 35: EC25-A Current Consumption LTE datatransfer (GNSS OFF) LTE-FDD B5 @22.83dBm 762.0 mA LTE-FDD B7 @23.37dBm 842.0 mA LTE-FDD B8 @23.48dBm 720.0 mA LTE-FDD B20 @22.75dBm 714.0 mA LTE-TDD B38 @23.05dBm 481.0 mA LTE-TDD B40 @23.17dBm 431.8 mA LTE-TDD B41 @23.02dBm 480.0 mA GSM voice call EGSM900 PCL=5 @33.08dBm 264.0 mA DCS1800 PCL=0 @29.75dBm 190.0 mA WCDMA voice call WCDMA B1 @23.22dBm 680.0 mA WCDMA B5 @23.18dBm 677.0 mA WCDMA B8 @23.54dBm 618.0 mA Parameter Description Conditions Typ. Unit IVBAT OFF state Power down 10 uA Sleep state AT+CFUN=0 (USB disconnected) 1.1 mA WCDMA PF=64 (USB disconnected) 1.8 mA WCDMA PF=128 (USB disconnected) 1.5 mA LTE-FDD PF=64 (USB disconnected) 2.2 mA LTE-FDD PF=128 (USB disconnected) 1.6 mA Idle state WCDMA PF=64 (USB disconnected) 21.0 mA WCDMA PF=64 (USB connected) 31.0 mA LTE-FDD PF=64 (USB disconnected) 21.0 mA LTE-FDD PF=64 (USB connected) 31.0 mA

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 82 / 112 Table 36: EC25-V Current Consumption WCDMA datatransfer (GNSS OFF) WCDMA B2 HSDPA @21.9dBm 591.0 mA WCDMA B2 HSUPA @21.62dBm 606.0 mA WCDMA B4 HSDPA @22.02dBm 524.0 mA WCDMA B4 HSUPA @21.67dBm 540.0 mA WCDMA B5 HSDPA @22.71dBm 490.0 mA WCDMA B5 HSUPA @22.58dBm 520.0 mA LTE datatransfer (GNSS OFF) LTE-FDD B2 @22.93dBm 715.0 mA LTE-FDD B4 @22.96dBm 738.0 mA LTE-FDD B12 @23.35dBm 663.0 mA WCDMA voice call WCDMA B2 @22.93dBm 646.0 mA WCDMA B4 @23dBm 572.0 mA WCDMA B5 @23.78dBm 549.0 mA Parameter Description Conditions Typ. Unit IVBAT OFF state Power down 10 uA Sleep state AT+CFUN=0 (USB disconnected) 0.85 mA LTE-FDD PF=64 (USB disconnected) 2.0 mA LTE-FDD PF=128 (USB disconnected) 1.5 mA Idle state LTE-FDD PF=64 (USB disconnected) 20.0 mA LTE-FDD PF=64 (USB connected) 31.0 mA WCDMA B2 HSUPA @21.62dBm 606.0 mA WCDMA B4 HSDPA @22.02dBm 524.0 mA WCDMA B4 HSUPA @21.67dBm 540.0 mA WCDMA B5 HSDPA @22.71dBm 490.0 mA

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 83 / 112 Table 37: EC25-J Current Consumption WCDMA B5 HSUPA @22.58dBm 520.0 mA LTE datatransfer (GNSS OFF) LTE-FDD B4 @23.14dBm 770.0 mA LTE-FDD B13 @23.48dBm 531.0 mA Parameter Description Conditions Typ. Unit IVBAT OFF state Power down 10 uA Sleep state AT+CFUN=0 (USB disconnected) 1.1 mA WCDMA PF=64 (USB disconnected) 1.9 mA WCDMA PF=128 (USB disconnected) 1.5 mA LTE-FDD PF=64 (USB disconnected) 2.5 mA LTE-FDD PF=128 (USB disconnected) 1.8 mA LTE-TDD PF=64 (USB disconnected) 2.6 mA LTE-TDD PF=128 (USB disconnected) 1.9 mA Idle state WCDMA PF=64 (USB disconnected) 21.0 mA WCDMA PF=64 (USB connected) 31.0 mA LTE-FDD PF=64 (USB disconnected) 21.0 mA LTE-FDD PF=64 (USB connected) 32.0 mA LTE-TDD PF=64 (USB disconnected) 21.0 mA LTE-TDD PF=64 (USB connected) 32.0 mA WCDMA datatransfer (GNSS OFF) WCDMA B1 HSDPA @22.32dBm 550.0 mA WCDMA B1 HSUPA @22.64dBm 516.0 mA WCDMA B6 HSDPA @22.02dBm 524.0 mA WCDMA B6 HSUPA @22.33dBm 521.0 mA WCDMA B19 HSDPA @22.67dBm 517.0 mA

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 84 / 112 Table 38: EC25-AU Current Consumption WCDMA B19 HSUPA @22.33dBm 522.0 mA LTE datatransfer (GNSS OFF) LTE-FDD B1 @23.16dBm 685.0 mA LTE-FDD B3 @23.22dBm 766.0 mA LTE-FDD B8 @23.22dBm 641.0 mA LTE-FDD B18 @23.35dBm 661.0 mA LTE-FDD B19 @23.16dBm 677.0 mA LTE-FDD B26 @22.87dBm 690.0 mA LTE-TDD B41 @22.42dBm 439.0 mA WCDMA voice call WCDMA B1 @22.33dBm 605.0 mA WCDMA B6 @23.28dBm 549.0 mA WCDMA B19 @23.28dBm 549.0 mA Parameter Description Conditions Typ. Unit IVBAT OFF state Power down 11 uA Sleep state AT+CFUN=0 1.3 mA AT+CFUN=0 (USB disconnected) 1.46 mA GSM850 DRX=5 (USB disconnected) 1.8 mA EGSM900 DRX=5 (USB disconnected) 2.0 mA DCS1800 DRX=5 (USB disconnected) 1.9 mA PCS1900 DRX=5 (USB disconnected) 1.9 mA WCDMA PF=64 (USB disconnected) 2.0 mA WCDMA PF=128 (USB disconnected) 1.6 mA LTE-FDD PF=64 (USB disconnected) 2.2 mA LTE-FDD PF=128 (USB disconnected) 1.6 mA

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 85 / 112 LTE-TDD PF=64 (USB disconnected) 2.3 mA LTE-TDD PF=128 (USB disconnected) 1.6 mA Idle state EGSM900 DRX=5 (USB disconnected) 22.0 mA EGSM900 DRX=5 (USB connected) 34.0 mA WCDMA PF=64 (USB disconnected) 22.0 mA WCDMA PF=64 (USB connected) 33.0 mA LTE-FDD PF=64 (USB disconnected) 24.0 mA LTE-FDD PF=64 (USB connected) 35.0 mA LTE-TDD PF=64 (USB disconnected) 24.0 Ma LTE-TDD PF=64 (USB connected) 35.0 mA GPRS data transfer (GNSS OFF) GSM850 1UL/4DL @32.53dBm 232.0 mA GSM850 2UL/3DL @32.34dBm 384.0 mA GSM850 3UL/2DL @30.28dBm 441.0 mA GSM850 4UL/1DL @29.09dBm 511.0 mA EGSM900 1UL/4DL @32.34dBm 241.0 mA EGSM900 2UL/3DL @32.19dBm 397.0 mA EGSM900 3UL/2DL @30.17dBm 459.0 mA EGSM900 4UL/1DL @28.96dBm 533.0 mA DCS1800 1UL/4DL @29.71dBm 183.0 mA DCS1800 2UL/3DL @29.62dBm 289.0 mA DCS1800 3UL/2DL @29.49dBm 392.0 mA DCS1800 4UL/1DL @29.32dBm 495.0 mA PCS1900 1UL/4DL @29.61dBm 174.0 mA PCS1900 1UL/4DL @29.48dBm 273.0 mA PCS1900 1UL/4DL @29.32dBm 367.0 mA

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 86 / 112 PCS1900 1UL/4DL @29.19dBm 465.0 mA EDGE data transfer (GNSS OFF) GSM850 1UL/4DL @27.09dBm 154.0 mA GSM850 2UL/3DL @26.94dBm 245.0 mA GSM850 3UL/2DL @26.64dBm 328.0 mA GSM850 4UL/1DL @26.53dBm 416.0 mA EGSM900 1UL/4DL @26.64dBm 157.0 mA EGSM900 2UL/3DL @26.95dBm 251.0 mA EGSM900 3UL/2DL @26.57dBm 340.0 mA EGSM900 4UL/1DL @26.39dBm 431.0 mA DCS18001 UL/4DL @26.03dBm 152.0 mA DCS1800 2UL/3DL @25.62dBm 240.0 mA DCS1800 3UL/2DL @25.42dBm 325.0 mA DCS1800 4UL/1DL @25.21dBm 415.0 mA PCS1900 1UL/4DL @25.65dBm 148.0 mA PCS1900 1UL/4DL @25.63dBm 232.0 mA PCS1900 1UL/4DL @25.54dBm 313.0 mA PCS1900 1UL/4DL @25.26dBm 401.0 mA WCDMA data (GNSS OFF) WCDMA B1 HSDPA @22.34dBm 625.0 mA WCDMA B1 HSUPA @21.75dBm 617.0 mA WCDMA B2 HSDPA @22.51dBm 610.0 mA WCDMA B2 HSUPA @22. 14dBm 594.0 mA WCDMA B5 HSDPA @22.98dBm 576.0 mA WCDMA B5 HSUPA @22.89dBm 589.0 mA WCDMA B8 HSDPA @22.31dBm 556.0 mA WCDMA B8 HSUPA @22.11dBm 572.0 mA

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 87 / 112 Table 39: EC25-AUT Current Consumption LTE datatransfer (GNSS OFF) LTE-FDD B1 @23.28dBm 817.0 mA LTE-FDD B2 @23.34dBm 803.0 mA LTE-FDD B3 @23.2dBm 785.0 mA LTE-FDD B4 @22.9dBm 774.0 mA LTE-FDD B5 @23.45dBm 687.0 mA LTE-FDD B7 @22.84dBm 843.0 mA LTE-FDD B8 @22.92dBm 689.0 mA LTE-FDD B28 @23.23dBm 804.0 mA LTE-TDD B40 @23.3dBm 429.0 mA GSM voice call GSM850 PCL5 @32.66dBm 228.0 mA EGSM900 PCL5 @32.59dBm 235.0 mA DCS1800 PCL0 @29.72dBm 178.0 mA PCS1900 PCL0 @29.82dBm 170.0 mA WCDMA voice call WCDMA B1 @23.27dBm 687.0 mA WCDMA B2 @23.38dBm 668.0 mA WCDMA B5 @23.38dBm 592.0 mA WCDMA B8 @23.32dBm 595.0 mA Parameter Description Conditions Typ. Unit IVBAT OFF state Power down 10 uA Sleep state AT+CFUN=0 (USB disconnected) 1.0 mA WCDMA PF=64 (USB disconnected) 1.9 mA WCDMA PF=128 (USB disconnected) 1.5 mA LTE-FDD PF=64 (USB disconnected) 2.3 mA LTE-FDD PF=128 (USB disconnected) 1.9 mA

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 88 / 112 Table 40: EC25-AF Current Consumption IVBAT Idle state WCDMA PF=64 (USB disconnected) 23.0 mA WCDMA PF=64 (USB connected) 33.0 mA LTE-FDD PF=64 (USB disconnected) 17.0 mA LTE-FDD PF=64 (USB connected) 29.0 mA LTE-TDD PF=64 (USB disconnected) 21.0 mA LTE-TDD PF=64 (USB connected) 32.0 mA WCDMA datatransfer (GNSS OFF) WCDMA B1 HSDPA @22.24dBm 500.0 mA WCDMA B1 HSUPA @22.05dBm 499.0 mA WCDMA B5 HSDPA @22.39dBm 418.0 mA WCDMA B5 HSUPA @22dBm 486.0 mA LTE datatransfer (GNSS OFF) LTE-FDD B1 @23.28dBm 707.0 mA LTE-FDD B3 @23.36dBm 782.0 mA LTE-FDD B5 @23.32dBm 588.0 mA LTE-FDD B7 @23.08dBm 692.0 mA LTE-FDD B28-A @23.37dBm 752.0 mA LTE-FDD B28-B @23.48dBm 770.0 mA WCDMA voice call WCDMA B1 @23.22dBm 546.0 mA WCDMA B5 @23.01dBm 511.0 mA Parameter Description Conditions Typ. Unit IVBAT OFF state Power down 10 uA Sleep state AT+CFUN=0 (USB disconnected) 1.0 mA WCDMA PF=64 (USB disconnected) 1.8 mA WCDMA PF=128 (USB disconnected) 1.4 mA

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 89 / 112 IVBAT LTE-FDD PF=64 (USB disconnected) 2.2 mA LTE-FDD PF=128 (USB disconnected) 1.8 mA Idle state WCDMA PF=64 (USB disconnected) 23.3 mA WCDMA PF=64 (USB connected) 33.4 mA LTE-FDD PF=64 (USB disconnected) 17.6 mA LTE-FDD PF=64 (USB connected) 29.4 mA WCDMA datatransfer (GNSS OFF) WCDMA B2 HSDPA @22.36dBm 509.0 mA WCDMA B2 HSUPA @22.27dBm 511.0 mA WCDMA B4 HSDPA @22.22dBm 521.0 mA WCDMA B4 HSUPA @22.31dBm 518.0 mA WCDMA B5 HSDPA @22.39dBm 496.0 mA WCDMA B5 HSUPA @22dBm 502.0 mA LTE datatransfer (GNSS OFF) LTE-FDD B2 @23.2dBm 600.0 mA LTE-FDD B4 @23.85dBm 634.0 mA LTE-FDD B5 @23.0dBm 600.0 mA LTE-FDD B12 @23.08dBm 692.0 mA LTE-FDD B13 @23.1dBm 660.0 mA LTE-FDD B14 @23.5dBm 676.0 mA LTE-FDD B66 @22.9dBm 662.0 mA LTE-FDD B71 @22.88dBm 600.0 mA WCDMA voice call WCDMA B2 @23.24dBm 570.0 mA WCDMA B4 @23.2dBm 581.0 mA WCDMA B5 @23.4dBm 500.0 mA

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 90 / 112 Table 41: GNSS Current Consumption of EC25 Series Module 6.5. RF Output Power The following table shows the RF output power of EC25 module. Table 42: RF Output Power In GPRS 4 slots TX mode, the maximum output power is reduced by 3dB. The design conforms to the GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1. Parameter Description Conditions Typ. Unit IVBAT (GNSS) Searching (AT+CFUN=0) Cold start @Passive Antenna 54.0 mA Lost state @Passive Antenna 53.9 mA Tracking (AT+CFUN=0) Instrument Environment 30.5 mA Open Sky @Passive Antenna 33.2 mA Open Sky @Active Antenna 40.8 mA Frequency Max. Min. GSM850/EGSM900 33dBm±2dB 5dBm±5dB DCS1800/PCS1900 30dBm±2dB 0dBm±5dB GSM850/EGSM900 (8-PSK) 27dBm±3dB 5dBm±5dB DCS1800/PCS1900 (8-PSK) 26dBm±3dB 0dBm±5dB WCDMA bands 24dBm+1/-3dB <-49dBm LTE-FDD bands 23dBm±2dB <-39dBm LTE-TDD bands 23dBm±2dB <-39dBm NOTE

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 91 / 112 6.6. RF Receiving Sensitivity The following tables show conducted RF receiving sensitivity of EC25 series module. Table 43: EC25-E Conducted RF Receiving Sensitivity Table 44: EC25-A Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) EGSM900 -109.0dBm / / -102.0dBm DCS1800 -109.0dBm / / -102.0dbm WCDMA B1 -110.5dBm / / -106.7dBm WCDMA B5 -110.5dBm / / -104.7dBm WCDMA B8 -110.5dBm / / -103.7dBm LTE-FDD B1 (10M) -98.0dBm -98.0dBm -101.5dBm -96.3dBm LTE-FDD B3 (10M) -96.5dBm -98.5dBm -101.5dBm -93.3dBm LTE-FDD B5 (10M) -98.0dBm -98.5dBm -101.0dBm -94.3dBm LTE-FDD B7 (10M) -97.0dBm -94.5dBm -99.5dBm -94.3dBm LTE-FDD B8 (10M) -97.0dBm -97.0dBm -101.0dBm -93.3dBm LTE-FDD B20 (10M) -97.5dBm -99.0dBm -102.5dBm -93.3dBm LTE-TDD B38 (10M) -96.7dBm -97.0dBm -100.0dBm -96.3dBm LTE-TDD B40 (10M) -96.3dBm -98.0dBm -101.0dBm -96.3dBm LTE-TDD B41 (10M) -95.2dBm -95.7dBm -99.0dBm -94.3dBm Frequency Primary Diversity SIMO1) 3GPP (SIMO) WCDMA B2 -110.0dBm / / -104.7dBm WCDMA B4 -110.0dBm / / -106.7dBm WCDMA B5 -110.5dBm / / -104.7dBm

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 92 / 112 Table 45: EC25-V Conducted RF Receiving Sensitivity Table 46: EC25-J Conducted RF Receiving Sensitivity LTE-FDD B2 (10M) -98.0dBm -98.0dBm -101.0dBm -94.3dBm LTE-FDD B4 (10M) -97.5dBm -99.0dBm -101.0dBm -96.3dBm LTE-FDD B12 (10M) -96.5dBm -98.0dBm -101.0dBm -93.3dBm Frequency Primary Diversity SIMO1) 3GPP (SIMO) LTE-FDD B4 (10M) -97.5dBm -99.0dBm -101.0dBm -96.3dBm LTE-FDD B13 (10M) -95.0dBm -97.0dBm -100.0dBm -93.3dBm Frequency Primary Diversity SIMO1) 3GPP (SIMO) WCDMA B1 -110.0dBm / / -106.7dBm WCDMA B6 -110.5dBm / / -106.7dBm WCDMA B8 -110.5dBm / / -103.7dBm WCDMA B19 -110.5dBm / / -106.7dBm LTE-FDD B1 (10M) -97.5dBm -98.7dBm -100.2dBm -96.3dBm LTE-FDD B3 (10M) -96.5dBm -97.1dBm -100.5dBm -93.3dBm LTE-FDD B8 (10M) -98.4dBm -99.0dBm -101.2dBm -93.3dBm LTE-FDD B18 (10M) -99.5dBm -99.0dBm -101.7dBm -96.3dBm LTE-FDD B19 (10M) -99.2dBm -99.0dBm -101.4dBm -96.3dBm LTE-FDD B26 (10M) -99.5dBm -99.0dBm -101.5dBm -93.8dBm LTE-TDD B41 (10M) -95.0dBm -95.7dBm -99.0dBm -94.3dBm

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 93 / 112 Table 47: EC25-AU Conducted RF Receiving Sensitivity Table 48: EC25-AUT Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) WCDMA B1 -110.0dBm / / -106.7dBm WCDMA B5 -110.5dBm / / -104.7dBm LTE-FDD B1 (10M) -98.5dBm -98.0dBm -101.0dBm -96.3dBm Frequency Primary Diversity SIMO1) 3GPP (SIMO) GSM850 -109.0dBm / / -102.0dBm EGSM900 -109.0dBm / / -102.0dBm DCS1800 -109.0dBm / / -102.0dBm PCS1900 -109.0dBm / / -102.0dBm WCDMA B1 -110.0dBm / / -106.7dBm WCDMA B2 -110.0dBm / / -104.7dBm WCDMA B5 -111.0dBm / / -104.7dBm WCDMA B8 -111.0dBm / / -103.7dBm LTE-FDD B1 (10M) -97.2dBm -97.5dBm -100.2dBm -96.3dBm LTE-FDD B2 (10M) -98.2dBm / / -94.3dBm LTE-FDD B3 (10M) -98.7dBm -98.6dBm -102.2dBm -93.3dBm LTE-FDD B4 (10M) -97.7dBm -97.4dBm -100.2dBm -96.3dBm LTE-FDD B5 (10M) -98.0dBm -98.2dBm -101.0dBm -94.3dBm LTE-FDD B7 (10M) -97.7dBm -97.7dBm -101.2dBm -94.3dBm LTE-FDD B8 (10M) -99.2dBm -98.2dBm -102.2dBm -93.3dBm LTE-FDD B28 (10M) -98.6dBm -98.7dBm -102.0dBm -94.8dBm LTE-TDD B40 (10M) -97.2dBm -98.4dBm -101.2dBm -96.3dBm

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 94 / 112 LTE-FDD B3 (10M) -98.0dBm -96.0dBm -100.0dBm -93.3dBm LTE-FDD B5 (10M) -98.0dBm -99.0dBm -102.5dBm -94.3dBm LTE-FDD B7 (10M) -97.0dBm -95.0dBm -98.5dBm -94.3dBm LTE-FDD B28 (10M) -97.0dBm -99.0dBm -102.0dBm -94.8dBm Table 49: EC25-AUTL Conducted RF Receiving Sensitivity Table 50: EC25-AF Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) LTE-FDD B3 (10M) -98.0dBm -96.0dBm -100.0dBm -93.3dBm LTE-FDD B7 (10M) -97.0dBm -95.0dBm -98.5dBm -94.3dBm LTE-FDD B28 (10M) -97.0dBm -99.0dBm -102.0dBm -94.8dBm Frequency Primary Diversity SIMO1) 3GPP (SIMO) WCDMA B2 -109.5dBm -111dbm -113dbm -104.7dBm WCDMA B4 -108dBm -111dbm -111.5dbm -106.7dBm WCDMA B5 -110.5dBm -111.5dbm -114dbm -104.7dBm LTE-FDD B2 (10M) -98.2dBm -99.1dBm -101.7dBm -94.3dBm LTE-FDD B4 (10M) -97.3dBm -98.6dBm -101.1dBm -96.3dBm LTE-FDD B5 (10M) -99dBm -100.3dBm -101.3dBm -94.3Bm LTE-FDD B12 (10M) -99dBm -99.2dBm -102.1dBm -93.3dBm LTE-FDD B13 (10M) -98.1dBm -98.4dBm -100.2dBm -93.3dBm LTE-FDD B14 (10M) -97.9dBm -98.6dBm -99.5dBm -93.3dBm LTE-FDD B66 (10M) -96.7dBm -98.1dBm -99.4dBm -96.5dBm LTE-FDD B71 (10M) -99.2dBm -99.4dBm -101.5dBm -94.2dBm

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 95 / 112 1) SIMO is a smart antenna technology that uses a single antenna at the transmitter side and two antennas at the receiver side, which can improve RX performance. 6.7. Electrostatic Discharge The module is not protected against electrostatics discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates the module. The following table shows the module electrostatics discharge characteristics. Table 51: Electrostatics Discharge Characteristics 6.8. Thermal Consideration In order to achieve better performance of the module, it is recommended to comply with the following principles for thermal consideration:  On customers’ PCB design, please keep placement of the module away from heating sources, especially high power components such as ARM processor, audio power amplifier, power supply, etc.  Do not place components on the opposite side of the PCB area where the module is mounted, in order to facilitate adding of heatsink when necessary.  Do not apply solder mask on the opposite side of the PCB area where the module is mounted, so as to ensure better heat dissipation performance.  The reference ground of the area where the module is mounted should be complete, and add ground vias as many as possible for better heat dissipation.  Make sure the ground pads of the module and PCB are fully connected. Tested Points Contact Discharge Air Discharge Unit VBAT, GND ±5 ±10 kV All Antenna Interfaces ±4 ±8 kV Other Interfaces ±0.5 ±1 kV NOTE

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 96 / 112  According to customers’ application demands, the heatsink can be mounted on the top of the module, or the opposite side of the PCB area where the module is mounted, or both of them.  The heatsink should be designed with as many fins as possible to increase heat dissipation area. Meanwhile, a thermal pad with high thermal conductivity should be used between the heatsink and module/PCB. The following shows two kinds of heatsink designs for reference and customers can choose one or both of them according to their application structure. Figure 41: Referenced Heatsink Design (Heatsink at the Top of the Module) Figure 42: Referenced Heatsink Design (Heatsink at the Backside of Customers’ PCB)

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 97 / 112 The module offers the best performance when the internal BB chip stays below 105°C. When the maximum temperature of the BB chip reaches or exceeds 105°C, the module works normal but provides reduced performance (such as RF output power, data rate, etc.). When the maximum BB chip temperature reaches or exceeds 115°C, the module will disconnect from the network, and it will recover to network connected state after the maximum temperature falls below 115°C. Therefore, the thermal design should be maximally optimized to make sure the maximum BB chip temperature always maintains below 105°C. Customers can execute AT+QTEMP command and get the maximum BB chip temperature from the first returned value. NOTE

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 98 / 112 7 Mechanical Dimensions This chapter describes the mechanical dimensions of the module. All dimensions are measured in mm. The tolerances for dimensions without tolerance values are ±0.05mm. 7.1. Mechanical Dimensions of the the Module 32.0±0.1529.0±0.150.82.4±0.2 Figure 43: Module Top and Side Dimensions

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 99 / 112 Figure 44: Module Bottom Dimensions (Bottom View)

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 100 / 112 7.2. Recommended Footprint Figure 45: Recommended Footprint (Top View) 1. The keepout area should not be designed. 2. For easy maintenance of the module, please keep about 3mm between the module and other components in thehost PCB. NOTES

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 101 / 112 7.3. Design Effect Drawings of the Module Figure 46: Top View of the Module Figure 47: Bottom View of the Module These are design effect drawings of EC25 module. For more accurate pictures, please refer to the module that you get from Quectel. NOTE

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 102 / 112 8 Storage, Manufacturing and Packaging 8.1. Storage EC25 is stored in a vacuum-sealed bag. It is rated at MSL 3, and its storage restrictions are listed below. 1. Shelf life in vacuum-sealed bag: 12 months at <40ºC/90%RH. 2. After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other high temperature processes must be:  Mounted within 168 hours at the factory environment of ≤30ºC/60%RH.  Stored at <10% RH. 3. Devices require bake before mounting, if any circumstances below occurs:  When the ambient temperature is 23ºC±5ºC and the humidity indicator card shows the humidity is >10% before opening the vacuum-sealed bag.  Device mounting cannot be finished within 168 hours at factory conditions of ≤30ºC/60%RH. 4. If baking is required, devices may be baked for 8 hours at 120ºC±5ºC. As the plastic packagecannot be subjected to high temperature, it should be removed from devices before high temperature (120ºC) baking. If shorter baking time is desired, please refer to IPC/JEDECJ-STD-033 for baking procedure. NOTE

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 104 / 112 8.3. Packaging EC25 is packaged in tap andreel carriers. One reel is 11.88m long and contains 250pcs modules. The figure below shows the package details, measured in mm. 30.3±0.1529.3±0.1530.3±0.1532.5±0.1533.5±0.150.35± 0.054.2±0.153.1±0.1532.5± 0.1533.5± 0.154.00±0.12.00±0.11.75±0.120.20±0.1544.00±0.344.00±0.11.50±0.1 1310044.5+0.20-0.0048.5 Figure 49: Tape and Reel Specifications

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 105 / 112 9 Appendix A References Table 52: Related Documents Table 53: Terms and Abbreviations SN Document Name Remark [1] Quectel_EC2x&EG9x&EM05_Power_Management_Application_Note Power management application notefor EC25, EC21, EC20 R2.0, EC20 R2.1, EG95, EG91 and EM05 modules [2] Quectel_EC25&EC21_AT_Commands_Manual EC25 and EC21 AT commands manual[3] Quectel_EC25&EC21_GNSS_AT_Commands_ Manual EC25 and EC21 GNSS AT commands manual [4] Quectel_Module_Secondary_SMT_User_Guide Module secondary SMT user guide [5] Quectel_EC25_Reference_Design EC25 reference design [6] Quectel_RF_Layout_Application_Note RF layout application note Abbreviation Description AMR Adaptive Multi-rate bps Bits Per Second CHAP Challenge Handshake Authentication Protocol CS Coding Scheme CSD Circuit Switched Data CTS Clear To Send DC-HSPA+ Dual-carrier High Speed Packet Access DFOTA Delta Firmware Upgrade Over The Air

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 106 / 112 DL Downlink DTR Data Terminal Ready DTX Discontinuous Transmission EFR Enhanced Full Rate ESD Electrostatic Discharge FDD Frequency Division Duplex FR Full Rate GLONASS GLObalnaya NAvigatsionnaya Sputnikovaya Sistema, the Russian Global Navigation Satellite System GMSK Gaussian Minimum Shift Keying GNSS Global Navigation Satellite System GPS Global Positioning System GSM Global System for Mobile Communications HR Half Rate HSPA High Speed Packet Access HSDPA High Speed Downlink Packet Access HSUPA High Speed Uplink Packet Access I/O Input/Output Inorm Normal Current LED Light Emitting Diode LNA Low Noise Amplifier LTE Long Term Evolution MIMO Multiple Input Multiple Output MO Mobile Originated MS Mobile Station (GSM engine) MT Mobile Terminated

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 107 / 112 PAP Password Authentication Protocol PCB Printed Circuit Board PDU Protocol Data Unit PPP Point-to-Point Protocol QAM Quadrature Amplitude Modulation QPSK Quadrature Phase Shift Keying RF Radio Frequency RHCP Right Hand Circularly Polarized Rx Receive SIM Subscriber Identification Module SIMO Single Input Multiple Output SMS Short Message Service TDD Time Division Duplexing TDMA Time Division Multiple Access TD-SCDMA Time Division-Synchronous Code Division Multiple Access TX Transmitting Direction UL Uplink UMTS Universal Mobile Telecommunications System URC Unsolicited Result Code USIM Universal Subscriber Identity Module Vmax Maximum Voltage Value Vnorm Normal Voltage Value Vmin Minimum Voltage Value VIHmax Maximum Input High Level Voltage Value VIHmin Minimum Input High Level Voltage Value

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 108 / 112 VILmax Maximum Input Low Level Voltage Value VILmin Minimum Input Low Level Voltage Value VImax Absolute Maximum Input Voltage Value VImin Absolute Minimum Input Voltage Value VOHmax Maximum Output High Level Voltage Value VOHmin Minimum Output High Level Voltage Value VOLmax Maximum Output Low Level Voltage Value VOLmin Minimum Output Low Level Voltage Value VSWR Voltage Standing Wave Ratio WCDMA Wideband Code Division Multiple Access WLAN Wireless Local Area Network

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 109 / 112 10 Appendix B GPRS Coding Schemes Table 54: Description of Different Coding Schemes Scheme CS-1 CS-2 CS-3 CS-4 Code Rate 1/2 2/3 3/4 1 USF 3 3 3 3 Pre-coded USF 3 6 6 12 Radio Block excl.USF and BCS 181 268 312 428 BCS 40 16 16 16 Tail 4 4 4 - Coded Bits 456 588 676 456 Punctured Bits 0 132 220 - Data Rate Kb/s 9.05 13.4 15.6 21.4

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 110 / 112 11 Appendix C GPRS Multi-slot Classes Twenty-nine classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot classes are product dependent, and determine the maximum achievable data rates in both the uplink and downlink directions. Written as 3+1 or 2+2, the first number indicates the amount of downlink timeslots, while the second number indicates the amount of uplink timeslots. The active slots determine the total number of slots the GPRS device can use simultaneously for both uplink and downlink communications. The description of different multi-slot classes is shown in the following table. Table 55: GPRS Multi-slot Classes Multislot Class Downlink Slots Uplink Slots Active Slots 1 1 1 2 2 2 1 3 3 2 2 3 4 3 1 4 5 2 2 4 6 3 2 4 7 3 3 4 8 4 1 5 9 3 2 5 10 4 2 5 11 4 3 5 12 4 4 5 13 3 3 NA 14 4 4 NA

LTE Module Series EC25 Hardware Design EC25_Hardware_Design 111 / 112 15 5 5 NA 16 6 6 NA 17 7 7 NA 18 8 8 NA 19 6 2 NA 20 6 3 NA 21 6 4 NA 22 6 4 NA 23 6 6 NA 24 8 2 NA 25 8 3 NA 26 8 4 NA 27 8 4 NA 28 8 6 NA 29 8 8 NA 30 5 1 6 31 5 2 6 32 5 3 6 33 5 4 6

LTE Module Sires EC25Hardware Design EC25_Hardware_Design 112 / 112 12 Appendix D EDGE Modulationand Coding Schemes Table 56: EDGE Modulation and Coding Schemes Coding Scheme Modulation Coding Family 1 Timeslot 2 Timeslot 4 TimeslotCS-1: GMSK / 9.05kbps 18.1kbps 36.2kbps CS-2: GMSK / 13.4kbps 26.8kbps 53.6kbps CS-3: GMSK / 15.6kbps 31.2kbps 62.4kbps CS-4: GMSK / 21.4kbps 42.8kbps 85.6kbps MCS-1 GMSK C 8.80kbps 17.60kbps 35.20kbps MCS-2 GMSK B 11.2kbps 22.4kbps 44.8kbps MCS-3 GMSK A 14.8kbps 29.6kbps 59.2kbps MCS-4 GMSK C 17.6kbps 35.2kbps 70.4kbps MCS-5 8-PSK B 22.4kbps 44.8kbps 89.6kbps MCS-6 8-PSK A 29.6kbps 59.2kbps 118.4kbps MCS-7 8-PSK B 44.8kbps 89.6kbps 179.2kbps MCS-8 8-PSK A 54.4kbps 108.8kbps 217.6kbps MCS-9 8-PSK A 59.2kbps 118.4kbps 236.8kbps

LTE Module Sires EC25Hardware Design EC25_Hardware_Design 113 / 113 FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met: 1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based time- averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the user’s body and must not transmit simultaneously with any other antenna or transmitter. 3.A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR201808EC25AF. 4.To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed: ❒ WCDMA B2/LTE B2: <8dBi ❒ WCDMA B4LTE B4/B66: <5dBi ❒ WCDMA B5/LTE B5: <9.416dBi ❒ LTE B14: <9.255dBi ❒ LTE B13: <9.173dBi ❒ LTE B12: <8.734dBi ❒ LTE B71: <8.545dBi 5. This module must not transmit simultaneously with any other antenna or transmitter 6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093

LTE Module Sires EC25Hardware Design EC25_Hardware_Design 114 / 114 If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs: A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the module’s FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible; then an additional permanent label referring to the enclosed module:“Contains Transmitter Module FCC ID: XMR201808EC25AF” or “Contains FCC ID: XMR201808EC25AF” must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The user’s manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

LTE Module Sires EC25Hardware Design EC25_Hardware_Design 115 / 115 (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the user’s authority to operate the equipment. To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring compliance with the module(s) installed and fully operational. For example, if a host was previously authorized as an unintentional radiator under the Declaration of Conformity procedure without a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring that the after the module is installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements. IC Statement IRSS-GEN "This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device." or "Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes : 1) l’appareil ne doit pas produire de brouillage; 2) l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement." Déclaration sur l'exposition aux rayonnements RF L'autre utilisé pour l'émetteur doit être installé pour fournir une distance de séparation d'au moins 20 cm de toutes les personnes et ne doit pas être colocalisé ou fonctionner conjointement avec une autre antenne ou un autre émetteur. The host product shall be properly labeled to identify the modules within the host product. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labeled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the word “Contains” or similar wording expressing the same meaning, as follows: “Contains IC: 10224A-2018EC25AF” or “where: 10224A-2018EC25AF is the module’s certification number”. Le produit hôte doit être correctement étiqueté pour identifier les modules dans le produit hôte.

LTE Module Sires EC25Hardware Design EC25_Hardware_Design 116 / 116 L'étiquette de certification d'Innovation, Sciences et Développement économique Canada d'un module doit être clairement visible en tout temps lorsqu'il est installédans le produit hôte; sinon, le produit hôte doit porter une étiquette indiquant le numéro de certification d'Innovation, Sciences et Développement économique Canada pour le module, précédé du mot «Contient» ou d'un libellé semblable exprimant la même signification, comme suit: "Contient IC: 10224A-2018EC25AF" ou "où: 10224A-2018EC25AF est le numéro de certification du module".

EC25 Mini PCIe Hardware Design LTE Module Series Rev. EC25_Mini_PCIe_Hardware_Design_V1.1 Date: 2017-01-24 www.quectel.com

LTE Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design Confidential / Released 1 / 46 Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters: Quectel Wireless Solutions Co., Ltd. Office 501, Building 13, No.99, Tianzhou Road, Shanghai, China, 200233 Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit: http://www.quectel.com/support/salesupport.aspx For technical support, or to report documentation errors, please visit: http://www.quectel.com/support/techsupport.aspx Or email to: Support@quectel.com GENERAL NOTES QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION. THE INFORMATION SUPPLIED HEREIN IS SUBJECT TO CHANGE WITHOUT PRIOR NOTICE. COPYRIGHT THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE FORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN. Copyright © Quectel Wireless Solutions Co., Ltd. 2017. All rights reserved.

LTE Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design Confidential / Released 2 / 46 About the Document History Revision Date Author Description 1.0 2016-06-07 Mountain ZHOU/ Frank WANG Initial 1.1 2017-01-24 Lyndon LIU/ Frank WANG 1. Deleted description of EC25-AUT Mini PCIe in Table 1. 2. Added description of EC25-AU and EC25-J Mini PCIe in Table 1. 3. Updated key features of EC25 Mini PCIe in Table 2. 4. Added current consumption in Chapter 4.7. 5. Updated conducted RF receiving sensitivity of EC25-A Mini PCIe in Table 17. 6. Added conducted RF receiving sensitivity of EC25-J Mini PCIe in Table 18.

LTE Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design Confidential / Released 3 / 46 Contents About the Document ................................................................................................................................ 2 Contents .................................................................................................................................................... 3 Table Index ............................................................................................................................................... 5 Figure Index .............................................................................................................................................. 6 1 Introduction ....................................................................................................................................... 7 1.1. Safety Information ................................................................................................................... 8 2 Product Concept ............................................................................................................................... 9 2.1. General Description ................................................................................................................ 9 2.2. Description of Product Series ................................................................................................ 10 2.3. Key Features ..........................................................................................................................11 2.4. Functional Diagram ............................................................................................................... 13 3 Application Interface ....................................................................................................................... 14 3.1. General Description .............................................................................................................. 14 3.2. EC25 Mini PCIe Interface ...................................................................................................... 14 3.2.1. Definition of Interface ................................................................................................... 14 3.2.2. Pin Assignment ............................................................................................................ 17 3.3. Power Supply ........................................................................................................................ 18 3.4. USIM Card Interface ............................................................................................................. 19 3.5. USB Interface ........................................................................................................................ 20 3.6. UART Interface ..................................................................................................................... 21 3.7. PCM and I2C Interfaces ........................................................................................................ 22 3.8. Control Signals ...................................................................................................................... 24 3.8.1. RI Signal ...................................................................................................................... 25 3.8.2. DTR Signal .................................................................................................................. 25 3.8.3. W_DISABLE# Signal ................................................................................................... 25 3.8.4. PERST# Signal ............................................................................................................ 25 3.8.5. LED_WWAN# Signal ................................................................................................... 26 3.8.6. WAKE# Signal ............................................................................................................. 27 3.9. Antenna Interfaces ................................................................................................................ 27 4 Electrical and Radio Characteristics ............................................................................................. 29 4.1. General Description .............................................................................................................. 29 4.2. Power Supply Requirements ................................................................................................. 29 4.3. I/O Requirements .................................................................................................................. 30 4.4. RF Characteristics ................................................................................................................ 30 4.5. GNSS Receiver ..................................................................................................................... 32 4.6. ESD Characteristics .............................................................................................................. 33 4.7. Current Consumption ............................................................................................................ 33 5 Dimensions and Packaging ............................................................................................................ 38 5.1. General Description .............................................................................................................. 38

LTE Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design Confidential / Released 4 / 46 5.2. Mechanical Dimensions of EC25 Mini PCIe .......................................................................... 38 5.3. Standard Dimensions of Mini PCI Express ............................................................................ 39 5.4. Packaging Specification ........................................................................................................ 40 6 Appendix References ..................................................................................................................... 41

LTE Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design Confidential / Released 5 / 46 Table Index TABLE 1: DESCRIPTION OF EC25 MINI PCIE ................................................................................................ 10TABLE 2: KEY FEATURES OF EC25 MINI PCIE .............................................................................................. 11TABLE 3: DEFINITION OF I/O PARAMETERS ................................................................................................. 14TABLE 4: DESCRIPTION OF PINS .................................................................................................................. 15TABLE 5: DEFINITION OF VCC_3V3 AND GND PINS .................................................................................... 18TABLE 6: USIM PIN DEFINITION ..................................................................................................................... 19TABLE 7: PIN DEFINITION OF USB INTERFACE ........................................................................................... 20TABLE 8: PIN DEFINITION OF THE UART INTERFACE ................................................................................. 21TABLE 9: PIN DEFINITION OF PCM AND I2C INTERFACES ......................................................................... 22TABLE 10: PIN DEFINITION OF CONTROL SIGNALS .................................................................................... 24TABLE 11: RADIO OPERATIONAL STATES ..................................................................................................... 25TABLE 12: INDICATIONS OF NETWORK STATUS ......................................................................................... 26TABLE 13: ANTENNA REQUIREMENTS .......................................................................................................... 27TABLE 14: POWER SUPPLY REQUIREMENTS .............................................................................................. 29TABLE 15: I/O REQUIREMENTS ...................................................................................................................... 30TABLE 16: EC25 MINI PCIE CONDUCTED RF OUTPUT POWER ................................................................. 30TABLE 17: EC25-A MINI PCIE CONDUCTED RF RECEIVING SENSITIVITY ................................................ 31TABLE 18: EC25-J MINI PCIE CONDUCTED RF RECEIVING SENSITIVITY ................................................ 31TABLE 19: EC25-E MINI PCIE CONDUCTED RF RECEIVING SENSITIVITY ................................................ 32TABLE 20: EC25-V MINI PCIE CONDUCTED RF RECEIVING SENSITIVITY ................................................ 32TABLE 21: ESD CHARACTERISTICS OF EC25 MINI PCIE ............................................................................ 33TABLE 22: CURRENT CONSUMPTION OF EC25-A MINI PCIE ..................................................................... 33TABLE 23: CURRENT CONSUMPTION OF EC25-E MINI PCIE ..................................................................... 34TABLE 24: CURRENT CONSUMPTION OF EC25-V MINI PCIE ..................................................................... 37TABLE 25: GNSS CURRENT CONSUMPTION OF EC25 MINI PCIE SERIES MODULE ............................... 37TABLE 26: RELATED DOCUMENTS ................................................................................................................ 41TABLE 27: TERMS AND ABBREVIATIONS ...................................................................................................... 41

LTE Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design Confidential / Released 6 / 46 Figure Index FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 13FIGURE 2: PIN ASSIGNMENT ......................................................................................................................... 17FIGURE 3: REFERENCE DESIGN OF POWER SUPPLY ............................................................................... 18FIGURE 4: REFERENCE CIRCUIT OF USIM CARD INTERFACE WITH A 6-PIN USIM CARD CONNECTOR ........................................................................................................................................................................... 19FIGURE 5: REFERENCE CIRCUIT OF USB INTERFACE .............................................................................. 20FIGURE 6: TIMING IN PRIMARY MODE .......................................................................................................... 23FIGURE 7: TIMING IN AUXILIARY MODE ....................................................................................................... 23FIGURE 8: REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC ...................................... 24FIGURE 9: RI BEHAVIOR ................................................................................................................................. 25FIGURE 10: TIMING OF RESETTING MODULE ............................................................................................. 26FIGURE 11: LED_WWAN# SIGNAL REFERENCE CIRCUIT DIAGRAM ......................................................... 26FIGURE 12: WAKE# BEHAVIOR ...................................................................................................................... 27FIGURE 13: DIMENSIONS OF THE RF CONNECTOR (UNIT: MM) ............................................................... 28FIGURE 14: MECHANICALS OF U.FL-LP CONNECTORS ............................................................................. 28FIGURE 15: MECHANICAL DIMENSIONS OF EC25 MINI PCIE (UNIT: MM) ................................................. 38FIGURE 16: STANDARD DIMENSIONS OF MINI PCI EXPRESS (UNIT: MM) ............................................... 39FIGURE 17: DIMENSIONS OF THE MINI PCI EXPRESS CONNECTOR (MOLEX 679100002, UNIT: MM) .. 40

LTE Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design Confidential / Released 7 / 46 1 Introduction This document defines EC25 Mini PCIe module, and describes its hardware interfaces which are connected with your application as well as its air interfaces. This document can help you to quickly understand the interface specifications, electrical and mechanical details as well as other related information of EC25 Mini PCIe module. To facilitate its application in different fields, relevant reference design documents are also provided. Associated with application note and user guide of EC25 Mini PCIe module, you can use the module to design and set up mobile applications easily.

LTE Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design Confidential / Released 8 / 46 1.1. Safety Information The following safety precautions must be observed during all phases of the operation, such as usage, service or repair of any cellular terminal or mobile incorporating EC25 Mini PCIe module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for customers’ failure to comply with these precautions. Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. You must comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is switched off. The operation of wireless appliances in an aircraft is forbidden, so as to prevent interference with communication systems. Consult the airline staff about the use of wireless devices on boarding the aircraft, if your device offers an Airplane Mode which must be enabled prior to boarding an aircraft. Switch off your wireless device when in hospitals, clinics or other health care facilities. These requests are desinged to prevent possible interference with sensitive medical equipment. Cellular terminals or mobiles operating over radio frequency signal and cellular network cannot be guaranteed to connect in all conditions, for example no mobile fee or with an invalid USIM/SIM card. While you are in this condition and need emergent help, please remember using emergency call. In order to make or receive a call, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Your cellular terminal or mobile contains a transmitter and receiver. When it is ON, it receives and transmits radio frequency energy. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment. In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals. Areas with potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders, etc.

LTE Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design Confidential / Released 9 / 46 2 Product Concept 2.1. General Description EC25 Mini PCIe module provides data connectivity on LTE-FDD, LTE-TDD, WCDMA and GSM networks with PCI Express Mini Card 1.2 standard interface. It supports embedded operating systems such as WinCE, Linux, Android, etc., and also provides audio, high-speed data transmission and GNSS functionalities for your applications. EC25 Mini PCIe module can be applied in the following fields:  PDA and Laptop Computer  Remote Monitor System  Vehicle System  Wireless POS System  Intelligent Meter Reading System  Wireless Router and Switch  Other Wireless Terminal Devices This chapter generally introduces the following aspects of EC25 Mini PCIe module:  Product Series  Key Features  Functional Diagram  EC25 Mini PCIe contains Telematics version and Data-only version. Telematics version supports voice and data functions, while Data-only version only supports data function. NOTE

LTE Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design Confidential / Released 10 / 46 2.2. Description of Product Series The following table shows the product series of EC25 Mini PCIe module. Table 1: Description of EC25 Mini PCIe 1. 1) GNSS function is optional. 2. 2) Digital audio (PCM) function is only supported in Telematics version. Product Series Description EC25-A Mini PCIe Support WCDMA: B2/B4/B5 Support LTE-FDD: B2/B4/B12 Support LTE/WCDMA receive diversity Support GNSS1) Support digital audio2) EC25-AU Mini PCIe3) Support GSM: 850/900/1800/1900MHz Support WCDMA: B1/B2/B5/B8 Support LTE-FDD: B1/B2/B3/B4/B5/B7/B8/B28 Support LTE-TDD: B40 Support LTE/WCDMA receive diversity3) Support GNSS1) Support digital audio2) EC25-J Mini PCIe Support WCDMA: B1/B6/B8/B19 Support LTE-FDD: B1/B3/B8/B18/B19/B26 Support LTE-TDD: B41 Support LTE/WCDMA receive diversity Support GNSS1) Support digital audio2) EC25-E Mini PCIe Support GSM: 900/1800MHz Support WCDMA: B1/B5/B8 Support LTE-FDD: B1/B3/B5/B7/B8/B20 Support LTE-TDD: B38/B40/B41 Support LTE/WCDMA receive diversity Support GNSS1) Support digital audio2) EC25-V Mini PCIe Support LTE-FDD: B4/B13 Support LTE receive diversity Support GNSS1) Support digital audio2) NOTES

LTE Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design Confidential / Released 11 / 46 3. 3) B2 band on EC25-AU Mini PCIe module does not support receive diversity. 2.3. Key Features The following table describes the detailed features of EC25 Mini PCIe module. Table 2: Key Features of EC25 Mini PCIe Feature Details Function Interface PCI Express Mini Card 1.2 Standard Interface Power Supply Supply voltage: 3.0~3.6V Typical supply voltage: 3.3V Transmitting Power Class 4 (33dBm±2dB) for GSM850 Class 4 (33dBm±2dB) for GSM900 Class 1 (30dBm±2dB) for DCS1800 Class 1 (30dBm±2dB) for PCS1900 Class E2 (27dBm±3dB) for GSM850 8-PSK Class E2 (27dBm±3dB) for GSM900 8-PSK Class E2 (26dBm±3dB) for DCS1800 8-PSK Class E2 (26dBm±3dB) for PCS1900 8-PSK Class 3 (24dBm+1/-3dB) for WCDMA bands Class 3 (23dBm±2dB) for LTE-FDD bands Class 3 (23dBm±2dB) for LTE-TDD bands LTE Features Support up to non-CA Cat 4 Support 1.4 to 20MHz RF bandwidth Support MIMO in DL direction FDD: Max 50Mbps (UL), 150Mbps (DL) TDD: Max 35Mbps (UL), 130Mbps (DL) WCDMA Features Support 3GPP R8 DC-HSPA+ Support 16-QAM, 64-QAM and QPSK modulation 3GPP R6 Cat 6 HSUPA: Max 5.76Mbps (UL) 3GPP R8 Cat 24 DC-HSPA+: Max 42Mbps (DL) GSM Features R99: CSD: 9.6kbps, 14.4kbps GPRS: Support GPRS multi-slot class 12 (12 by default) Coding scheme: CS-1, CS-2, CS-3 and CS-4 Maximum of four Rx time slots per frame

LTE Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design Confidential / Released 12 / 46 EDGE: Support EDGE multi-slot class 12 (12 by default) Support GMSK and 8-PSK for different MCS (Modulation and Coding Scheme) Downlink coding schemes: CS 1-4, MCS 1-9 Uplink coding schemes: CS 1-4, MCS 1-9 Internet Protocol FeaturesSupport TCP/UDP/PPP/FTP/HTTP/NTP/PING/QMI/HTTPS*/SMTP*/ MMS*/FTPS*/SMTPS*/SSL* protocols Support the protocols PAP (Password Authentication Protocol) and CHAP (Challenge Handshake Authentication Protocol) usually used for PPP connections SMS Text and PDU mode Point to point MO and MT SMS cell broadcast SMS storage: ME by default USIM Interface Support USIM/SIM card: 1.8V, 3.0V UART Interface Baud rate can reach up to 230400bps, 115200bps by default Used for AT command communication Audio Feature Support one digital audio interface: PCM interface GSM: HR/FR/EFR/AMR/AMR-WB WCDMA: AMR/AMR-WB LTE: AMR/AMR-WB Support echo cancellation and noise suppression PCM Interface Support 8-bit A-law*, μ-law* and 16-bit linear data formats Support long frame synchronization and short frame synchronization Support master and slave mode, but must be the master in long frame synchronization USB Interface Compliant with USB 2.0 specification (slave only); the data transfer rate can reach up to 480Mbps Used for AT command communication, data transmission, firmware upgrade, software debugging, GNSS NMEA output and voice over USB* USB Driver: Windows XP, Windows Vista, Windows 7, Windows 8/8.1, Windows 10, Linux 2.6 or later, Android 4.0/4.2/4.4/5.0/5.1/6.0 Antenna Interface Include main antenna, diversity antenna and GNSS antenna Rx-diversity Support LTE/WCDMA Rx-diversity GNSS Features Gen8C Lite of Qualcomm Protocol: NMEA 0183 AT Commands Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT commands Physical Characteristics Size: (51.0±0.1) × (30.0±0.1) × (4.9±0.2 mm) Weight: approx. 9.8g

LTE Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design Confidential / Released 13 / 46 1. “*” means under development. 2. 1) Within operating temperature range, the module is 3GPP compliant. 3. 2) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction; there are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to normal operating temperature levels, the module is compliant with 3GPP specification again. 2.4. Functional Diagram The following figure shows the block diagram of EC25 Mini PCIe. Figure 1: Functional Diagram Temperature Range Operation temperature range: -35°C ~ +75°C1) Extended temperature range: -40°C ~ +80°C2) Firmware Upgrade USB interface and DFOTA* RoHS All hardware components are fully compliant with EU RoHS directive NOTES

LTE Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design Confidential / Released 14 / 46 3 Application Interface 3.1. General Description The physical connections and signal levels of EC25 Mini PCIe comply with PCI Express Mini CEM specifications. This chapter mainly describes the following interfaces’ definition and application of EC25 Mini PCIe:  Power supply  USIM card interface  USB interface  UART interface  PCM&I2C interfaces  Control signals  Antenna interface 3.2. EC25 Mini PCIe Interface 3.2.1. Definition of Interface The following tables show the pin definition and description of EC25 Mini PCIe on the 52-pin application. Table 3: Definition of I/O Parameters Type Description IO Bidirectional DI Digital input DO Digital output OC Open collector PI Power input PO Power output

LTE Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design Confidential / Released 15 / 46 Table 4: Description of Pins Pin No. Mini PCI Express Standard Name EC25 Mini PCIe Pin Name I/O Description Comment 1 WAKE# WAKE# OC Output signal can be used to wake up the host. 2 3.3Vaux VCC_3V3 PI 3.3V DC supply 3 COEX1 RESERVED Reserved 4 GND GND Mini card ground 5 COEX2 RESERVED Reserved 6 1.5V NC 7 CLKREQ# RESERVED Reserved 8 UIM_PWR USIM_VDD PO Power source for the USIM card 9 GND GND Mini card ground 10 UIM_DATA USIM_DATA IO USIM data signal 11 REFCLK- UART_RX DI UART receive data Connect to DTE’s TX 12 UIM_CLK USIM_CLK DO USIM clock signal 13 REFCLK+ UART_TX DO UART transmit data Connect to DTE’s RX 14 UIM_RESET USIM_RST DO USIM reset signal 15 GND GND Mini card ground 16 UIM_VPP RESERVED Reserved 17 RESERVED RI DO Output signal can be used to wake up the host. 18 GND GND Mini card ground 19 RESERVED RESERVED Reserved 20 W_DISABLE# W_DISABLE# DI Disable wireless communications Pull-up by default Active low 21 GND GND Mini card ground 22 PERST# PERST# DI Functional reset to the card Active low 23 PERn0 UART_CTS DI UART clear to send Connect to DTE’s RTS

LTE Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design Confidential / Released 16 / 46 24 3.3Vaux RESERVED Reserved 25 PERp0 UART_RTS DO UART request to send Connect to DTE’s CTS26 GND GND Mini card ground 27 GND GND Mini card ground 28 1.5V NC 29 GND GND Mini card ground 30 SMB_CLK I2C_SCL DO I2C serial clock Require external pull-up to 1.8V. 31 PETn0 DTR DI Sleep mode control 32 SMB_DATA I2C_SDA IO I2C serial data Require external pull-up to 1.8V. 33 PETp0 RESERVED Reserved 34 GND GND Mini card ground 35 GND GND Mini card ground 36 USB_D- USB_DM IO USB differential data (-) 37 GND GND Mini card ground 38 USB_D+ USB_DP IO USB differential data (+) 39 3.3Vaux VCC_3V3 PI 3.3V DC supply 40 GND GND Mini card ground 41 3.3Vaux VCC_3V3 PI 3.3V DC supply 42 LED_WWAN# LED_WWAN# OC Active-low. LED signal for indicating the state of the card. 43 GND GND Mini card ground 44 LED_WLAN# RESERVED Reserved 45 RESERVED PCM_CLK* IO PCM clock signal 46 LED_WPAN# RESERVED Reserved 47 RESERVED PCM_DOUT* DO PCM data output

LTE Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design Confidential / Released 17 / 46 1. Keep all NC, reserved and unused pins unconnected. 2. “*” means the digital audio (PCM) function is only supported on Telematics version. 3.2.2. Pin Assignment The following figure shows the pin assignment of EC25 Mini PCIe module. The top side contains EC25 module and antenna connectors. PIN2PIN52BOTPIN1PIN51TOP Figure 2: Pin Assignment 48 1.5V NC 49 RESERVED PCM_DIN* DI PCM data input 50 GND GND Mini card ground 51 RESERVED PCM_SYNC* IO PCM frame synchronization 52 3.3Vaux VCC_3V3 PI 3.3V DC supply NOTES

LTE Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design Confidential / Released 18 / 46 3.3. Power Supply The following table shows pin definition of VCC_3V3 pins and ground pins. Table 5: Definition of VCC_3V3 and GND Pins The typical supply voltage of EC25 Mini PCIe is 3.3V. In the 2G networks, the input peak current may reach to 2.7A during the transmitting time. Therefore, the power supply must be able to provide enough current, and a bypass capacitor of no less than 470µF with low ESR should be used to prevent the voltage from dropping. The following figure shows a reference design of power supply. The precision of resistor R2 and R3 is 1%, and the capacitor C3 needs a low ESR. Figure 3: Reference Design of Power Supply Pin No. Pin Name I/O Power Domain Description 2, 39, 41, 52 VCC_3V3 PI 3.0~3.6V 3.3V DC supply 4, 9, 15, 18, 21, 26, 27, 29, 34, 35, 37, 40, 43, 50 GND Mini card ground

LTE Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design Confidential / Released 19 / 46 3.4. USIM Card Interface The following table shows the pin definition of USIM card interface. Table 6: USIM Pin Definition EC25 Mini PCIe supports 1.8V and 3.0V USIM cards. The following figure shows a reference design for a 6-pin USIM card connector. Figure 4: Reference Circuit of USIM Card Interface with a 6-Pin USIM Card Connector In order to enhance the reliability and availability of the USIM card in your application, please follow the criteria below in USIM circuit design:  Keep layout of USIM card as close to the module as possible. Keep the trace length as less than 200mm as possible.  Keep USIM card signal away from RF and power supply traces.  Keep the trace width of ground and USIM_VDD no less than 0.5mm to maintain the same electric potential. The decouple capacitor of USIM_VDD should be less than 1uF and must near to USIM card connector. Pin No. Pin Name I/O Power Domain Description 8 USIM_VDD PO 1.8V/3.0V Power source for the USIM card 10 USIM_DATA IO 1.8V/3.0V USIM data signal 12 USIM_CLK DO 1.8V/3.0V USIM clock signal 14 USIM_RST DO 1.8V/3.0V USIM reset signal

LTE Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design Confidential / Released 20 / 46  To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with surrounded ground.  In order to offer good ESD protection, it is recommended to add a TVS whose parasitic capacitance should not be more than 50pF. The 22 ohm resistors should be added in series between the module and the USIM card so as to suppress EMI spurious transmission and enhance ESD protection. The 33pF capacitors are used for filtering interference of GSM900. Please note that the USIM peripheral circuit should be close to the USIM card connector.  The pull-up resistor on USIM_DATA line can improve anti-jamming capability when long layout trace and sensitive occasion are applied, and should be placed close to the USIM card connector. 3.5. USB Interface The following table shows the pin definition of USB interface. Table 7: Pin Definition of USB Interface EC25 Mini PCIe is compliant with USB 2.0 specification. It can only be used as a slave device. Meanwhile, it supports high speed (480Mbps) mode and full speed (12Mbps) mode. The USB interface is used for AT command communication, data transmission, GNSS NMEA output, software debugging, firmware upgrade and voice over USB*. The following figure shows a reference circuit of USB interface. Figure 5: Reference Circuit of USB Interface Pin No. Pin Name I/O Description Comment 36 USB_DM IO USB differential data (-) Require differential impedance of 90Ω 38 USB_DP IO USB differential data (+) Require differential impedance of 90Ω

LTE Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design Confidential / Released 21 / 46 In order to ensure the integrity of USB data line signal, components R1, R2, R3 and R4 must be placed close to the module, and also these resistors should be placed close to each other. The extra stubs of trace must be as short as possible. In order to ensure the USB interface design corresponding with the USB 2.0 specification, please comply with the following principles:  It is important to route the USB signal traces as differential pairs with total grounding. The impedance of USB differential trace is 90 ohm.  Do not route signal traces under crystals, oscillators, magnetic devices or RF signal traces. It is important to route the USB differential traces in inner-layer with ground shielding on not only upper and lower layers but also right and left sides.  If USB connector is used, please keep the ESD protection components to the USB connector as close as possible. Pay attention to the influence of junction capacitance of ESD protection components on USB data lines. Typically, the capacitance value should be less than 2pF.  Keep traces of USB data test points short to avoid noise coupled on USB data lines. If possible, reserve a 0R resistor on these two lines. 1. There are three preconditions when enabling EC25 Mini PCIe to enter into the sleep mode: a) Execute AT+QSCLK=1 command to enable the sleep mode. Please refer to document [2] for details. b) DTR pin should be kept in high level (pull-up internally). c) USB interface on Mini PCIe must be connected with the USB interface of the host and please guarantee the USB of the host is in suspended state. 2. “*” means under development. 3.6. UART Interface The following table shows the pin definition of the UART interface. Table 8: Pin Definition of the UART Interface Pin No. EC25 Mini PCIe Pin Name I/O Power Domain Description 11 UART_RX DI 3.3V UART receive data 13 UART_TX DO 3.3V UART transmit data 23 UART_CTS DI 3.3V UART clear to send 25 UART_RTS DO 3.3V UART request to send NOTES

LTE Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design Confidential / Released 22 / 46 The UART interface supports 9600, 19200, 38400, 57600, 115200 and 230400bps baud rate. The default is 115200bps. This interface can be used for AT command communication. AT+IPR command can be used to set the baud rate of the UART, and AT+IFC command can be used to set the hardware flow control (hardware flow control is disabled by default). Please refer to document [2] for details. 3.7. PCM and I2C Interfaces The following table shows the pin definition of PCM and 12C interfaces that can be applied in audio codec design. Table 9: Pin Definition of PCM and I2C Interfaces EC25 Mini PCIe provides one PCM digital interface, which supports 8-bit A-law* and μ-law*, and also supports 16-bit linear data formats and the following modes:  Primary mode (short frame synchronization, works as either master or slave)  Auxiliary mode (long frame synchronization, works as master only) “*” means under development. Pin No. Pin Name I/O Power Domain Description 45 PCM_CLK IO 1.8V PCM clock signal 47 PCM_DOUT DO 1.8V PCM data output 49 PCM_DIN DI 1.8V PCM data input 51 PCM_SYNC IO 1.8V PCM frame synchronization 30 I2C_SCL DO 1.8V I2C serial clock, require external pull-up to 1.8V. 32 I2C_SDA IO 1.8V I2C serial data, require external pull-up to 1.8V. NOTE NOTE

LTE Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design Confidential / Released 23 / 46 In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC falling edge represents the MSB. In this mode, PCM_CLK supports 128, 256, 512, 1024 and 2048kHz for different speed codecs. The following figure shows the timing relationship in primary mode with 8kHz PCM_SYNC and 2048kHz PCM_CLK. Figure 6: Timing in Primary Mode In auxiliary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge; while the PCM_SYNC rising edge represents the MSB. In this mode, PCM interface operates with a 128kHz PCM_CLK and an 8kHz, 50% duty cycle PCM_SYNC only. The following figure shows the timing relationship in auxiliary mode with 8kHz PCM_SYNC and 128kHz PCM_CLK. Figure 7: Timing in Auxiliary Mode

LTE Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design Confidential / Released 24 / 46 Clock and mode can be configured by AT command, and the default configuration is master mode using short frame synchronization format with 2048kHz PCM_CLK and 8kHz PCM_SYNC. In addition, EC25 Mini PCIe’s firmware has integrated the configuration on some PCM codec’s application with I2C interface. Please refer to document [2] for details about AT+QDAI command. The following figure shows a reference design of PCM interface with an external codec IC. Figure 8: Reference Circuit of PCM Application with Audio Codec 3.8. Control Signals The following table shows the pin definition of control signals. Table 10: Pin Definition of Control Signals Pin No. Pin Name I/O Power Domain Description 17 RI DO 3.3V Output signal can be used to wake up the host. 31 DTR DI 3.3V Sleep mode control 20 W_DISABLE# DI 3.3V Disable wireless communications; pull-up by default, active low. 22 PERST# DI 3.3V Functional reset to the card; active low. 42 LED_WWAN# OC Active-low. LED signal for indicating the state of the module. 1 WAKE# OC Output signal can be used to wake up the host.

LTE Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design Confidential / Released 25 / 46 3.8.1. RI Signal The RI signal can be used to wake up the host. When URC returns, there will be the following behavior on the RI pin after executing AT+QCFG=“risignaltype”,“physical” command. Figure 9: RI Behavior 3.8.2. DTR Signal The DTR signal supports sleep control function. Driving it to low level will wake up the module. 3.8.3. W_DISABLE# Signal EC25 Mini PCIe provides W_DISABLE# signal to disable wireless communications through hardware operation. The following table shows the radio operational states of the module. Please refer to document [2] for related AT commands. Table 11: Radio Operational States 3.8.4. PERST# Signal The PERST# signal can be used to force a hardware reset on the card. You can reset the module by driving the PERST# to a low level voltage with the time frame of 150~460ms and then releasing it. The reset scenario is illustrated in the following figure. W_DISABLE# AT Commands Radio Operation High Level AT+CFUN=1 Enabled High Level AT+CFUN=0 AT+CFUN=4 Disabled Low Level AT+CFUN=0 AT+CFUN=1 AT+CFUN=4 Disabled

LTE Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design Confidential / Released 26 / 46 Figure 10: Timing of Resetting Module 3.8.5. LED_WWAN# Signal The LED_WWAN# signal of EC25 Mini PCIe is used to indicate the network status of the module, which can absorb the current up to 40mA. According to the following circuit, in order to reduce the current of the LED, a resistor must be placed in series with the LED. The LED is emitting light when the LED_WWAN# output signal is active low. Figure 11: LED_WWAN# Signal Reference Circuit Diagram The following table shows the network status indications of the LED_WWAN# signal. Table 12: Indications of Network Status LED_WWAN# Description Low Level (Light on) Registered on network High-impedance (Light off)  No network coverage or not registered  W_DISABLE# signal is at low level. (Disable the RF)  AT+CFUN=0, AT+CFUN=4

LTE Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design Confidential / Released 27 / 46 3.8.6. WAKE# Signal The WAKE# signal is an open collector signal which is similar to RI signal, but a host pull-up resistor and AT+QCFG=“risignaltype”,“physical” command are required. When URC returns, there will be 120ms low level pulse output as below. Figure 12: WAKE# Behavior 3.9. Antenna Interfaces EC25 Mini PCIe antenna interfaces include a main antenna interface, an Rx-diversity antenna interface and a GNSS antenna interface. And Rx-diversity function is enabled by default. The following table shows the requirement on main antenna, Rx-diversity antenna and GNSS antenna. Table 13: Antenna Requirements Type Requirements GNSS Frequency range: 1561~1615MHz Polarization: RHCP or linear VSWR: <2 (Typ.) Passive antenna gain: >0dBi GSM/WCDMA/LTE VSWR: ≤2 Gain (dBi): 1 Max Input Power (W): 50 Input Impedance (ohm): 50 Polarization Type: Vertical Cable Insertion Loss: <1dB (GSM900, WCDMA B5/B8, LTE B5/B8/B12/B17/B20) Cable Insertion Loss: <1.5dB (GSM1800, WCDMA B1/B2/B3/B4, LTE B1/B2/B3/B4) Cable insertion loss: <2dB (LTE B7/B38/B40/B41)

LTE Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design Confidential / Released 28 / 46 The following figure shows the overall sizes of RF connector. Figure 13: Dimensions of the RF Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the RF connector. Figure 14: Mechanicals of U.FL-LP Connectors

LTE Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design Confidential / Released 29 / 46 4 Electrical and Radio Characteristics 4.1. General Description This chapter mainly describes the following electrical and radio characteristics of EC25 Mini PCIe:  Power supply requirements  I/O requirements  Current consumption  RF characteristics  GNSS receiver  ESD characteristics 4.2. Power Supply Requirements The input voltage of EC25 Mini PCIe is 3.3V±9%, as specified by PCI Express Mini CEM Specifications 1.2. The following table shows the power supply requirements of EC25 Mini PCIe. Table 14: Power Supply Requirements Parameter Description Min. Typ. Max. Unit VCC_3V3 Power Supply 3.0 3.3 3.6 V

LTE Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design Confidential / Released 30 / 46 4.3. I/O Requirements The following table shows the I/O requirements of EC25 Mini PCIe. Table 15: I/O Requirements 1. The PCM and I2C interfaces belong to 1.8V power domain and other I/O interfaces belong to VCC_3V3 power domain. 2. The maximum voltage value of VIL for PERST# signal and W_DISABLE# signal is 0.5V. 4.4. RF Characteristics The following tables show the conducted RF output power and receiving sensitivity of EC25 Mini PCIe module. Table 16: EC25 Mini PCIe Conducted RF Output Power Parameter Description Min. Max. Unit VIH Input High Voltage 0.7 × VCC_3V3 VCC_3V3+0.3 V VIL Input Low Voltage -0.3 0.3 × VCC_3V3 V VOH Output High Voltage VCC_3V3-0.5 VCC_3V3 V VOL Output Low Voltage 0 0.4 V Frequency Max. Min. GSM850/GSM900 33dBm±2dB 5dBm±5dB DCS1800/PCS1900 30dBm±2dB 0dBm±5dB GSM850/GSM900 (8-PSK) 27dBm±3dB 5dBm±5dB DCS1800/PCS1900 (8-PSK) 26dBm±3dB 0dBm±5dB WCDMA bands 24dBm+1/-3dB <-50dBm LTE-FDD bands 23dBm±2dB <-44dBm NOTES

LTE Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design Confidential / Released 31 / 46 Table 17: EC25-A Mini PCIe Conducted RF Receiving Sensitivity Table 18: EC25-J Mini PCIe Conducted RF Receiving Sensitivity LTE-TDD bands 23dBm±2dB <-44dBm Frequency Primary Diversity SIMO 3GPP (SIMO) WCDMA B2 -110.0dBm / / -104.7dBm WCDMA B4 -110.0dBm / / -106.7dBm WCDMA B5 -110.5dBm / / -104.7dBm LTE FDD B2 (10M) -98.0dBm -98.0dBm -101.0dBm -94.3dBm LTE FDD B4 (10M) -97.5dBm -99.0dBm -101.0dBm -96.3dBm LTE FDD B12 (10M) -96.5dBm -98.0dBm -101.0dBm -93.3dBm Frequency Primary Diversity SIMO 3GPP (SIMO) WCDMA B1 -110.0dBm / / -106.7dBm WCDMA B6 -110.5dBm / / -106.7dBm WCDMA B8 -110.5dBm / / -106.7dBm WCDMA B19 -110.5dBm / / -106.7dBm LTE-FDD B1 (10M) -97.5dBm -98.7dBm -100.2dBm -96.3dBm LTE-FDD B3 (10M) -96.5dBm -97.1dBm -100.5dBm -93.3dBm LTE-FDD B8 (10M) -98.4dBm -99.0dBm -101.2dBm -93.3dBm LTE-FDD B18 (10M) -99.5dBm -99.0dBm -101.7dBm -96.3dBm LTE-FDD B19 (10M) -99.2dBm -99.0dBm -101.4dBm -96.3dBm LTE-FDD B26 (10M) -99.5dBm -99.0dBm -101.5dBm -93.8dBm LTE-TDD B41 (10M) -95.0dBm -95.7dBm -99.0dBm -94.3dBm

LTE Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design Confidential / Released 32 / 46 Table 19: EC25-E Mini PCIe Conducted RF Receiving Sensitivity Table 20: EC25-V Mini PCIe Conducted RF Receiving Sensitivity 4.5. GNSS Receiver EC25 Mini PCIe integrates a GNSS receiver that supports IZat Gen 8C Lite of Qualcomm (GPS, GLONASS, BeiDou, Galileo, QZSS). Meanwhile, it supports Qualcomm gpsOneXTRA technology (one kind of A-GNSS). This technology will download XTRA file from the internet server to enhance the TTFF. Frequency Primary Diversity SIMO 3GPP (SIMO) GSM900 -109.0dBm / / -102.0dBm DCS1800 -109.0dBm / / -102.0dbm WCDMA B1 -110.5dBm / / -106.7dBm WCDMA B5 -110.5dBm / / -104.7dBm WCDMA B8 -110.5dBm / / -103.7dBm LTE-FDD B1 (10M) -98.0dBm -98.0dBm -101.5dBm -96.3dBm LTE-FDD B3 (10M) -96.5dBm -98.5dBm -101.5dBm -93.3dBm LTE-FDD B5 (10M) -98.0dBm -98.5dBm -101.0dBm -94.3dBm LTE-FDD B7 (10M) -97.0dBm -94.5dBm -99.5dBm -94.3dBm LTE-FDD B8 (10M) -97.0dBm -97.0dBm -101.0dBm -93.3dBm LTE-FDD B20 (10M) -97.5dBm -99.0dBm -102.5dBm -93.3dBm LTE-TDD B38 (10M) -96.7dBm -97.0dBm -100.0dBm -96.3dBm LTE-TDD B40 (10M) -96.3dBm -98.0dBm -101.0dBm -96.3dBm LTE-TDD B41 (10M) -95.2dBm -95.7dBm -99.0dBm -94.3dBm Frequency Primary Diversity SIMO 3GPP (SIMO) LTE-FDD B4 (10M) -97.5dBm -99.0dBm -101.0dBm -96.3dBm LTE-FDD B13 (10M) -95.0dBm -97.0dBm -100.0dBm -93.3dBm

LTE Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design Confidential / Released 33 / 46 XTRA file contains predicted GPS and GLONASS satellites coordinates and clock biases valid for up to 7 days. It is best if XTRA file is downloaded every 1-2 days. Additionally, EC25 Mini PCIe can support standard NMEA-0183 protocol and output NMEA messages with 1Hz via USB NMEA interface. EC25 Mini PCIe GNSS engine is switched off by default. You must switch on it by AT command. Please refer to document [3] for more details about GNSS engine technology and configurations. A passive antenna should be used for the GNSS engine. 4.6. ESD Characteristics The following table shows the ESD characteristics of EC25 Mini PCIe. Table 21: ESD Characteristics of EC25 Mini PCIe 4.7. Current Consumption The following tables describe the current consumption of EC25 Mini PCIe series module. Table 22: Current Consumption of EC25-A Mini PCIe Parameter Description Conditions Typ. Unit IVBAT Sleep state AT+CFUN=0 (USB disconnected) 3.6 mA WCDMA PF=64 (USB disconnected) 4.4 mA WCDMA PF=128 (USB disconnected) 3.8 mA LTE-FDD PF=64 (USB disconnected) 5.9 mA Part Contact Discharge Air Discharge Unit Power Supply and GND +/-5 +/-10 kV Antenna Interface +/-4 +/-8 kV USB Interface +/-4 +/-8 kV USIM Interface +/-4 +/-8 kV Others +/-0.5 +/-1 kV

LTE Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design Confidential / Released 34 / 46 LTE-FDD PF=128 (USB disconnected) 4.8 mA Idle state WCDMA PF=64 (USB disconnected) 27.0 mA WCDMA PF=64 (USB connected) 40.0 mA LTE-FDD PF=64 (USB disconnected) 43.0 mA LTE-FDD PF=64 (USB connected) 59.0 mA WCDMA data transfer (GNSS OFF) WCDMA B2 HSDPA @22.63dBm 764.0 mA WCDMA B2 HSUPA @23.19dBm 741.0 mA WCDMA B4 HSDPA @22.45dBm 745.0 mA WCDMA B4 HSUPA @22.57dBm 752.0 mA WCDMA B5 HSDPA @22.49dBm 616.0 mA WCDMA B5 HSUPA @22.43dBm 637.0 mA LTE data transfer (GNSS OFF) LTE-FDD B2 @22.92dBm 977.0 mA LTE-FDD B4 @23.42dBm 1094.0 mA LTE-FDD B12 @23.39dBm 847.0 mA WCDMA voice call WCDMA B2 @23.59dBm 861.0 mA WCDMA B4 @23.47dBm 812.0 mA WCDMA B5 @23.46dBm 683.0 mA Table 23: Current Consumption of EC25-E Mini PCIe Parameter Description Conditions Typ. Unit IVBAT Sleep state AT+CFUN=0 (USB disconnected) 3.9 mA GSM DRX=2 (USB disconnected) 5.1 mA GSM DRX=9 (USB disconnected) 4.3 mA WCDMA PF=64 (USB disconnected) 5.5 mA WCDMA PF=128 (USB disconnected) 4.8 mA LTE-FDD PF=64 (USB disconnected) 5.8 mA

LTE Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design Confidential / Released 35 / 46 LTE-FDD PF=128 (USB disconnected) 5.0 mA LTE-TDD PF=64 (USB disconnected) 5.8 mA LTE-TDD PF=128 (USB disconnected) 4.9 mA Idle state GSM DRX=5 (USB disconnected) 30.0 mA GSM DRX=5 (USB connected) 43.0 mA WCDMA PF=64 (USB disconnected) 31.0 mA WCDMA PF=64 (USB connected) 45.0 mA LTE-FDD PF=64 (USB disconnected) 31.0 mA LTE-FDD PF=64 (USB connected) 44.0 mA LTE-TDD PF=64 (USB disconnected) 32.0 mA LTE-TDD PF=64 (USB connected) 44.0 mA GPRS data transfer (GNSS OFF) GSM900 4DL/1UL @33.08dBm 372.0 mA GSM900 3DL/2UL @31.03dBm 626.0 mA GSM900 2DL/3UL @29.86dBm 706.0 mA GSM900 1DL/4UL @29.44dBm 767.0 mA DCS1800 4DL/1UL @30.39dBm 262.0 mA DCS1800 3DL/2UL @30.19dBm 417.0 mA DCS1800 2DL/3UL @30.02dBm 564.0 mA DCS1800 1DL/4UL @29.86dBm 709.0 mA EDGE data transfer (GNSS OFF) GSM900 4DL/1UL @27.59dBm 233.0 mA GSM900 3DL/2UL @27.45dBm 370.0 mA GSM900 2DL/3UL @27.31dBm 500.0 mA GSM900 1DL/4UL @27.14dBm 623.0 mA DCS1800 4DL/1UL @26.24dBm 224.0 mA DCS1800 3DL/2UL @26.13dBm 334.0 mA

LTE Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design Confidential / Released 36 / 46 DCS1800 2DL/3UL @25.97dBm 440.0 mA DCS1800 1DL/4UL @25.82dBm 553.0 mA WCDMA data transfer (GNSS OFF) WCDMA B1 HSDPA @22.49dBm 798.0 mA WCDMA B1 HSUPA @21.87dBm 788.0 mA WCDMA B5 HSDPA @22.66dBm 781.0 mA WCDMA B5 HSUPA @21.99dBm 770.0 mA WCDMA B8 HSDPA @22.23dBm 655.0 mA WCDMA B8 HSUPA @21.68dBm 659.0 mA LTE data transfer (GNSS OFF) LTE-FDD B1 @23.12dBm 940.0 mA LTE-FDD B3 @22.75dBm 989.0 mA LTE-FDD B5 @22.92dBm 962.0 mA LTE-FDD B7 @23.42dBm 1188.0 mA LTE-FDD B8 @22.97dBm 911.0 mA LTE-FDD B20 @22.51dBm 946.0 mA LTE-TDD B38 @22.58dBm 686.0 mA LTE-TDD B40 @22.31dBm 576.0 mA LTE-TDD B41 @22.03dBm 611.0 mA GSM voice call GSM900 PCL=5 @33.31dBm 367.0 mA DCS1800 PCL=0 @20.48dBm 248.0 mA WCDMA voice call WCDMA B1 @23.18dBm 868.0 mA WCDMA B5 @22.62dBm 808.0 mA WCDMA B8 @23.02dBm 728.0 mA

LTE Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design Confidential / Released 37 / 46 Table 24: Current Consumption of EC25-V Mini PCIe Parameter Description Conditions Typ. Unit IVBAT Sleep state AT+CFUN=0 (USB disconnected) 3.4 mA LTE-FDD PF=64 (USB disconnected) 4.8 mA LTE-FDD PF=128 (USB disconnected) 4.3 mA Idle state LTE-FDD PF=64 (USB disconnected) 30.0 mA LTE-FDD PF=64 (USB connected) 42.0 mA LTE data transfer (GNSS OFF) LTE-FDD B4 @23.3dBm 873.0 mA LTE-FDD B13 @22.13dBm 638.0 mA Table 25: GNSS Current Consumption of EC25 Mini PCIe Series Module Parameter Description Conditions Typ. Unit IVBAT (GNSS) Searching (AT+CFUN=0)Cold start @Passive Antenna 75.0 mA Lost state @Passive Antenna 74.0 mA Tracking (AT+CFUN=0)Instrument environment 44.0 mA Open Sky @Passive Antenna 53.0 mA Open Sky @Active Antenna 58.0 mA

LTE Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design Confidential / Released 38 / 46 5 Dimensions and Packaging 5.1. General Description This chapter mainly describes mechanical dimensions as well as packaging specification of EC25 Mini PCIe module. 5.2. Mechanical Dimensions of EC25 Mini PCIe 10.35±0.1034.30±0.204.00±0.1048.05±0.206.35±0.103x3.00 5.98±0.106.38±0.105.45±0.108.25±0.10 24.20±0.2030.00±0.20Pin1 Pin51Top View1.007.26±0.101.404.90±0.200.612.35±0.1050.95±0.209.90±0.10Side View2xΦ2.60 Figure 15: Mechanical Dimensions of EC25 Mini PCIe (Unit: mm)

LTE Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design Confidential / Released 39 / 46 5.3. Standard Dimensions of Mini PCI Express The following figure shows the standard dimensions of Mini PCI Express. Please refer to document [1] for detailed A and B. Figure 16: Standard Dimensions of Mini PCI Express (Unit: mm)

LTE Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design Confidential / Released 40 / 46 EC25 Mini PCIe adopts a standard Mini PCI Express connector which compiles with the directives and standards listed in the document [1]. The following figure takes the Molex 679100002 as an example. Figure 17: Dimensions of the Mini PCI Express Connector (Molex 679100002, Unit: mm) 5.4. Packaging Specification The EC25 Mini PCIe is packaged in a tray. Each tray contains 10pcs of modules. The smallest package of EC25 Mini PCIe contains 100pcs.

LTE Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design Confidential / Released 41 / 46 6 Appendix References Table 26: Related Documents Table 27: Terms and Abbreviations SN Document Name Remark [1] PCI Express Mini Card Electromechanical Specification Revision 1.2 Mini PCI Express Specification [2] Quectel_EC25&EC21_AT_Commands_Manual EC25 and EC21 AT Commands Manual [3] Quectel_EC25&EC21_GNSS_AT_Commands_ Manual EC25 and EC21 GNSS AT Commands Manual Abbreviation Description AMR Adaptive Multi-rate bps Bits Per Second CS Coding Scheme DC-HSPA+ Dual-carrier High Speed Packet Access DFOTA Delta Firmware Upgrade Over The Air DL Down Link EFR Enhanced Full Rate ESD Electrostatic Discharge FDD Frequency Division Duplexing FR Full Rate GLONASS GLObalnaya Navigatsionnaya Sputnikovaya Sistema, the Russian Global Navigation Satellite System GMSK Gaussian Minimum Shift Keying

LTE Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design Confidential / Released 42 / 46 GNSS Global Navigation Satellite System GPS Global Positioning System GSM Global System for Mobile Communications HR Half Rate kbps Kilo Bits Per Second LED Light Emitting Diode LTE Long-Term Evolution Mbps Million Bits Per Second ME Mobile Equipment (Module) MIMO Multiple-Input Multiple-Output MMS Multimedia Messaging Service MO Mobile Originated MT Mobile Terminated PCM Pulse Code Modulation PDU Protocol Data Unit PPP Point-to-Point Protocol RF Radio Frequency Rx Receive USIM Universal Subscriber Identification Module SIMO Single Input Multiple Output SMS Short Message Service UART Universal Asynchronous Receiver & Transmitter UL Up Link URC Unsolicited Result Code WCDMA Wideband Code Division Multiple Access

LTE Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design Confidential / Released 43 / 46 FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met: 1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based time- averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the user’s body and must not transmit simultaneously with any other antenna or transmitter. 3.A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR201808EC25AF. 4.To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed: ❒ WCDMA B2/LTE B2: <8dBi ❒ WCDMA B4LTE B4/B66: <5dBi ❒ WCDMA B5/LTE B5: <9.416dBi ❒ LTE B14: <9.255dBi ❒ LTE B13: <9.173dBi ❒ LTE B12: <8.734dBi ❒ LTE B71: <8.545dBi 5. This module must not transmit simultaneously with any other antenna or transmitter 6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093

LTE Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design Confidential / Released 44 / 46 If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs: A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the module’s FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible; then an additional permanent label referring to the enclosed module:“Contains Transmitter Module FCC ID: XMR201808EC25AF” or “Contains FCC ID: XMR201808EC25AF” must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The user’s manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

LTE Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design Confidential / Released 45 / 46 (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the user’s authority to operate the equipment. To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring compliance with the module(s) installed and fully operational. For example, if a host was previously authorized as an unintentional radiator under the Declaration of Conformity procedure without a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring that the after the module is installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements. IC Statement IRSS-GEN "This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device." or "Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes : 1) l’appareil ne doit pas produire de brouillage; 2) l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement." Déclaration sur l'exposition aux rayonnements RF L'autre utilisé pour l'émetteur doit être installé pour fournir une distance de séparation d'au moins 20 cm de toutes les personnes et ne doit pas être colocalisé ou fonctionner conjointement avec une autre antenne ou un autre émetteur. The host product shall be properly labeled to identify the modules within the host product. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labeled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the word “Contains” or similar wording expressing the same meaning, as follows: “Contains IC: 10224A-2018EC25AF” or “where: 10224A-2018EC25AF is the module’s certification number”. Le produit hôte doit être correctement étiqueté pour identifier les modules dans le produit hôte.

LTE Module Series EC25 Mini PCIe Hardware Design EC25_Mini_PCIe_Hardware_Design Confidential / Released 46 / 46 L'étiquette de certification d'Innovation, Sciences et Développement économique Canada d'un module doit être clairement visible en tout temps lorsqu'il est installédans le produit hôte; sinon, le produit hôte doit porter une étiquette indiquant le numéro de certification d'Innovation, Sciences et Développement économique Canada pour le module, précédé du mot «Contient» ou d'un libellé semblable exprimant la même signification, comme suit: "Contient IC: 10224A-2018EC25AF" ou "où: 10224A-2018EC25AF est le numéro de certification du module".

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