Quectel Wireless Solutions 201707BG96 Quectel BG96 User Manual

Quectel Wireless Solutions Company Limited Quectel BG96 Users Manual

Contents

Users Manual

BG96 Hardware Design LTE Module Series Rev. BG96_Hardware_Design_V1.5 Date: 2017-05-31 www.quectel.com
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 1 / 71 Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters: Quectel Wireless Solutions Co., Ltd. Office 501, Building 13, No.99, Tianzhou Road, Shanghai, China, 200233 Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit: http://www.quectel.com/support/salesupport.aspx For technical support, or to report documentation errors, please visit: http://www.quectel.com/support/techsupport.aspx Or email to: Support@quectel.com GENERAL NOTES QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO CHANGE WITHOUT PRIOR NOTICE. COPYRIGHT THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE FORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN. Copyright © Quectel Wireless Solutions Co., Ltd. 2017. All rights reserved.
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 2 / 71 About the Document History Revision Date Author Description 1.0 2017-01-05 Lyndon LIU/ Daryl DU/ Allen WANG Initial 1.1 2017-03-16 Allen WANG 1. Updated operating frequencies of the module in Table 1. 2. Added GSM features in Table 2. 1.2 2017-03-28 Allen WANG/ Lyndon LIU 1. Updated function diagram in Figure 1. 2. Updated pin assignment (top view) in Figure 2. 3. Added the description of SPI interface in Chapter 3.12. 1.3 2017-04-11 Allen WANG 1. Updated model and frequency band of the module in Table1. 2. Updated download and upload rates of the module in Table 2. 3. Added the description of NEMA UART interface in Table 4 and Table 13. 1.4 2017-04-28 Allen WANG 1. Updated the function diagram in Figure 1. 2. Updated the pin assignment (top view) in Figure 2. 3. Added the reference circuit of I2S application with audio codec (Figure 20). 4. Added the description of power saving mode (PSM) and the note in Chapter 3.3. 5. Updated the timing of resetting module in Figure 14. 1.5 2017-05-31 Allen WANG 1. Updated the functional diagram (Figure 1). 2. Added specification requirements for GNSS antenna in Table 27. 3. Updated the recommended footprint (Figure 35). 4. Added the recommended stencil design (Figure 36).
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 3 / 71 Contents About the Document ................................................................................................................................... 2 Contents ....................................................................................................................................................... 3 Table Index ................................................................................................................................................... 6 Figure Index ................................................................................................................................................. 7 1 Introduction .......................................................................................................................................... 9 1.1. Safety Information.................................................................................................................... 10 2 Product Concept ................................................................................................................................ 11 2.1. General Description ................................................................................................................. 11 2.2. Directives and Standards ........................................................................................................ 12 2.2.1. FCC Statement .............................................................................................................. 12 2.3. Key Features ........................................................................................................................... 13 2.4. Functional Diagram ................................................................................................................. 15 2.5. Evaluation Board ..................................................................................................................... 16 3 Application Interfaces ....................................................................................................................... 17 3.1. Pin Assignment ........................................................................................................................ 18 3.2. Pin Description ......................................................................................................................... 19 3.3. Operating Modes ..................................................................................................................... 25 3.4. Power Saving ........................................................................................................................... 26 3.4.1. Sleep Mode .................................................................................................................... 26 3.4.1.1. UART Application ................................................................................................. 26 3.4.1.2. USB Application with USB Remote Wakeup Function ........................................ 27 3.4.1.3. USB Application with USB Suspend/Resume and RI Function .......................... 27 3.4.1.4. USB Application without USB Suspend Function ................................................ 28 3.4.2. Airplane Mode ................................................................................................................ 29 3.5. Power Supply ........................................................................................................................... 29 3.5.1. Power Supply Pins ......................................................................................................... 29 3.5.2. Decrease Voltage Drop .................................................................................................. 30 3.5.3. Monitor the Power Supply .............................................................................................. 31 3.6. Turn on and off Scenarios ....................................................................................................... 31 3.6.1. Turn on Module Using the PWRKEY Pin ....................................................................... 31 3.6.2. Turn off Module .............................................................................................................. 33 3.6.2.1. Turn off Module Using the PWRKEY Pin ............................................................. 33 3.6.2.2. Turn off Module Using AT Command ................................................................... 33 3.7. Reset the Module..................................................................................................................... 34 3.8. (U)SIM Card Interface ............................................................................................................. 35 3.9. USB Interface .......................................................................................................................... 37 3.10. UART Interfaces ...................................................................................................................... 39 3.11. I2S* and I2C Interfaces ........................................................................................................... 41
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 4 / 71 3.12. SPI* Interface ........................................................................................................................... 42 3.13. Network Status Indication ........................................................................................................ 43 3.14. STATUS ................................................................................................................................... 44 3.15. Behaviors of RI ........................................................................................................................ 45 3.16. USB_BOOT Interface .............................................................................................................. 45 4 GNSS Receiver ................................................................................................................................... 47 4.1. General Description ................................................................................................................. 47 4.2. GNSS Performance ................................................................................................................. 47 4.3. Layout Guidelines .................................................................................................................... 48 5 Antenna Interfaces ............................................................................................................................. 49 5.1. Main Antenna Interface ........................................................................................................... 49 5.1.1. Pin Definition .................................................................................................................. 49 5.1.2. Operating Frequency ..................................................................................................... 49 5.1.3. Reference Design of RF Antenna Interface ................................................................... 50 5.1.4. Reference Design of RF Layout..................................................................................... 50 5.2. GNSS Antenna Interface ......................................................................................................... 52 5.3. Antenna Installation ................................................................................................................. 54 5.3.1. Antenna Requirements .................................................................................................. 54 5.3.2. Recommended RF Connector for Antenna Installation ................................................. 54 5.3.3. RF Reference Schematic Diagram ................................................................................ 56 5.3.4. Coplanar Waveguide Structure Design.......................................................................... 58 5.3.5. Coplanar WG PCB Layout Example and Guidelines..................................................... 60 6 Electrical, Reliability and Radio Characteristics ............................................................................ 62 6.1. Absolute Maximum Ratings ..................................................................................................... 62 6.2. Power Supply Ratings ............................................................................................................. 62 6.3. Operation Temperature ............................................................................................................ 63 6.4. Current Consumption .............................................................................................................. 63 6.5. RF Output Power ..................................................................................................................... 63 6.6. RF Receiving Sensitivity .......................................................................................................... 64 6.7. Electrostatic Discharge ............................................................................................................ 64 7 Mechanical Dimensions .................................................................................................................... 65 7.1. Mechanical Dimensions of the Module.................................................................................... 65 7.2. Recommended Footprint and Stencil Design .......................................................................... 67 7.3. Design Effect Drawings of the Module .................................................................................... 69 8 Storage, Manufacturing and Packaging .......................................................................................... 70 8.1. Storage .................................................................................................................................... 70 8.2. Manufacturing and Soldering .................................................................................................. 70 8.3. Packaging ................................................................................................................................ 71 9 Appendix A References ..................................................................................................................... 72 10 Appendix B GPRS Coding Schemes ............................................................................................... 75
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 5 / 71 11 Appendix C GPRS Multi-slot Classes .............................................................................................. 76 12 Appendix D EDGE Modulation and Coding Schemes ................................................................... 77
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 6 / 71 Table Index TABLE 1: FREQUENCY BANDS OF BG96 MODULE ....................................................................................... 11 TABLE 2: KEY FEATURES OF BG96 ............................................................................................................... 13 TABLE 3: DEFINITION OF I/O PARAMETERS ................................................................................................. 19 TABLE 4: PIN DESCRIPTION ........................................................................................................................... 19 TABLE 5: OVERVIEW OF OPERATING MODES ............................................................................................. 25 TABLE 6: VBAT AND GND PINS ....................................................................................................................... 30 TABLE 7: PIN DEFINITION OF PWRKEY ........................................................................................................ 31 TABLE 8: RESET_N PIN DESCRIPTION ......................................................................................................... 34 TABLE 9: PIN DEFINITION OF (U)SIM CARD INTERFACE ............................................................................ 35 TABLE 10: PIN DEFINITION OF USB INTERFACE ......................................................................................... 37 TABLE 11: PIN DEFINITION OF UART1 INTERFACE ..................................................................................... 39 TABLE 12: PIN DEFINITION OF UART2 INTERFACE ..................................................................................... 39 TABLE 13: PIN DEFINITION OF UART3 INTERFACE ..................................................................................... 40 TABLE 14: LOGIC LEVELS OF DIGITAL I/O .................................................................................................... 40 TABLE 15: PIN DEFINITION OF I2S* AND I2C INTERFACES ........................................................................ 41 TABLE 16: PIN DEFINITION OF SPI* INTERFACE ......................................................................................... 43 TABLE 17: PIN DEFINITION OF NETWORK STATUS INDICATOR ................................................................ 43 TABLE 18: WORKING STATE OF THE NETWORK STATUS INDICATOR ...................................................... 43 TABLE 19: PIN DEFINITION OF STATUS ........................................................................................................ 44 TABLE 20: DEFAULT BEHAVIORS OF RI ........................................................................................................ 45 TABLE 21: PIN DEFINITION OF USB_BOOT INTERFACE ............................................................................. 45 TABLE 22: GNSS PERFORMANCE ................................................................................................................. 47 TABLE 23: PIN DEFINITION OF MAIN ANTENNA INTERFACE ...................................................................... 49 TABLE 24: MODULE OPERATING FREQUENCIES ........................................................................................ 49 TABLE 25: PIN DEFINITION OF GNSS ANTENNA INTERFACE ..................................................................... 52 TABLE 26: GNSS FREQUENCY ....................................................................................................................... 53 TABLE 27: ANTENNA REQUIREMENTS .......................................................................................................... 54 TABLE 28: ABSOLUTE MAXIMUM RATINGS .................................................................................................. 62 TABLE 29: POWER SUPPLY RATINGS ........................................................................................................... 62 TABLE 30: OPERATION TEMPERATURE ........................................................................................................ 63 TABLE 31: RF OUTPUT POWER ........................................................................................... 错误!未定义书签。 TABLE 32: BG96 CONDUCTED RF RECEIVING SENSITIVITY ..................................................................... 64 TABLE 33: RELATED DOCUMENTS ................................................................................................................ 72 TABLE 34: TERMS AND ABBREVIATIONS ...................................................................................................... 72 TABLE 35: DESCRIPTION OF DIFFERENT CODING SCHEMES .................................................................. 75 TABLE 36: GPRS MULTI-SLOT CLASSES ...................................................................................................... 76 TABLE 37: EDGE MODULATION AND CODING SCHEMES ........................................................................... 77
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 7 / 71 Figure Index FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 16 FIGURE 2: PIN ASSIGNMENT (TOP VIEW)..................................................................................................... 18 FIGURE 3: SLEEP MODE APPLICATION VIA UART ....................................................................................... 26 FIGURE 4: SLEEP MODE APPLICATION WITH USB REMOTE WAKEUP .................................................... 27 FIGURE 5: SLEEP MODE APPLICATION WITH RI ......................................................................................... 28 FIGURE 6: SLEEP MODE APPLICATION WITHOUT SUSPEND FUNCTION ................................................ 28 FIGURE 7: STAR STRUCTURE OF THE POWER SUPPLY............................................................................ 30 FIGURE 8: TURN ON THE MODULE USING DRIVING CIRCUIT ................................................................... 31 FIGURE 9: TURN ON THE MODULE USING KEYSTROKE ........................................................................... 32 FIGURE 10: TIMING OF TURNING ON MODULE ........................................................................................... 32 FIGURE 11: TIMING OF TURNING OFF MODULE .......................................................................................... 33 FIGURE 12: REFERENCE CIRCUIT OF RESET_N BY USING DRIVING CIRCUIT ...................................... 34 FIGURE 13: REFERENCE CIRCUIT OF RESET_N BY USING BUTTON ...................................................... 34 FIGURE 14: TIMING OF RESETTING MODULE ............................................................................................. 35 FIGURE 15: REFERENCE CIRCUIT OF (U)SIM CARD INTERFACE WITH AN 8-PIN (U)SIM CARD CONNECTOR .................................................................................................................................................... 36 FIGURE 16: REFERENCE CIRCUIT OF (U)SIM CARD INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR .................................................................................................................................................... 37 FIGURE 17: REFERENCE CIRCUIT OF USB APPLICATION ......................................................................... 38 FIGURE 18: REFERENCE CIRCUIT WITH TRANSLATOR CHIP ................................................................... 40 FIGURE 19: REFERENCE CIRCUIT WITH TRANSISTOR CIRCUIT .............................................................. 41 FIGURE 20: REFERENCE CIRCUIT OF I2S APPLICATION WITH AUDIO CODEC ....................................... 42 FIGURE 21: REFERENCE CIRCUIT OF THE NETWORK STATUS INDICATOR ........................................... 44 FIGURE 22: REFERENCE CIRCUIT OF STATUS ........................................................................................... 44 FIGURE 23: REFERENCE CIRCUIT OF USB_BOOT INTERFACE ................................................................ 46 FIGURE 24: REFERENCE CIRCUIT OF RF ANTENNA INTERFACE ............................................................. 50 FIGURE 25: MICROSTRIP LINE DESIGN ON A 2-LAYER PCB ...................................................................... 51 FIGURE 26: COPLANAR WAVEGUIDE LINE DESIGN ON A 2-LAYER PCB .................................................. 51 FIGURE 27: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 3 AS REFERENCE GROUND) .......................................................................................................................................................... 51 FIGURE 28: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 4 AS REFERENCE GROUND) .......................................................................................................................................................... 52 FIGURE 29: REFERENCE CIRCUIT OF GNSS ANTENNA INTERFACE ........................................................ 53 FIGURE 30: DIMENSIONS OF THE UF.L-R-SMT CONNECTOR (UNIT: MM) ................................................ 55 FIGURE 31: MECHANICALS OF UF.L-LP CONNECTORS ............................................................................. 55 FIGURE 32: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) ........................................................... 56 FIGURE 33: MODULE TOP AND SIDE DIMENSIONS ..................................................................................... 65 FIGURE 34: MODULE BOTTOM DIMENSIONS (BOTTOM VIEW) ................................................................. 66 FIGURE 35: RECOMMENDED FOOTPRINT (TOP VIEW) .............................................................................. 67 FIGURE 36: RECOMMENDED STENCIL DESIGN (TOP VIEW) ..................................................................... 68 FIGURE 37: TOP VIEW OF THE MODULE ...................................................................................................... 69
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 8 / 71 FIGURE 38: BOTTOM VIEW OF THE MODULE .............................................................................................. 69 FIGURE 39: REFLOW SOLDERING THERMAL PROFILE .............................................................................. 71
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 9 / 71 1 Introduction This document defines BG96 module and describes its air interface and hardware interfaces which are connected with customers’ applications. This document can help customers quickly understand the interface specifications, electrical and mechanical details, as well as other related information of BG96. To facilitate its application in different fields, reference design is also provided for customers’ reference. Associated with application note and user guide, customers can use the module to design and set up mobile applications easily.
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 10 / 71 1.1. Safety Information The following safety precautions must be observed during all phases of the operation, such as usage, service or repair of any cellular terminal or mobile incorporating BG96. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for the customers’ failure to comply with these precautions. Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. You must comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is switched off. The operation of wireless appliances in an aircraft is forbidden, so as to prevent interference with communication systems. Consult the airline staff about the use of wireless devices on boarding the aircraft, if your device offers an Airplane Mode which must be enabled prior to boarding an aircraft. Switch off your wireless device when in hospitals, clinics or other health care facilities. These requests are designed to prevent possible interference with sensitive medical equipment. Cellular terminals or mobiles operating over radio frequency signal and cellular network cannot be guaranteed to connect in all conditions, for example no mobile fee or with an invalid (U)SIM card. While you are in this condition and need emergent help, please remember using emergency call. In order to make or receive a call, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Your cellular terminal or mobile contains a transmitter and receiver. When it is ON, it receives and transmits radio frequency energy. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment. In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals. Areas with potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders, etc.
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 11 / 71 2 Product Concept 2.1. General Description BG96 is an embedded IoT (LTE Cat.M1) wireless communication module without receive diversity. It supports LTE-TDD and Half-Duplex LTE-FDD wireless communication, which provides data connectivity on LTE-TDD/FDD networks. It also provides GNSS1) function and voice2) interface to meet customers’ specific application demands. The following table shows the frequency bands of BG96 module. Table 1: Frequency Bands of BG96 Module 1. 1) GNSS function is optional. 2. 2) BG96 does not support VoLTE (Voice over LTE) function temporarily. With a compact profile of 22.5mm × 26.5mm × 2.3mm, BG96 can meet almost all requirements for M2M applications such as automotive, smart metering, tracking system, security, router, wireless POS, mobile computing device, PDA phone, tablet PC, etc. BG96 is an SMD type module which can be embedded into applications through its 102 LGA pads. BG96 supports internet service protocols like TCP, UDP and PPP. Extended AT commands have been developed for customers to use these internet service protocols easily. Module LTE Bands GSM Rx-diversity GNSS 1) BG96 Cat.M1: LTE-FDD: B1/B2/B3/B4/B5/B8/B12/ B13/ B20/B26/B28 LTE-TDD: B39 GSM850/GSM900/ DCS1800/PCS1900 Not Supported GPS, GLONASS, BeiDou/Compass, Galileo, QZSS NOTES
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 12 / 71 2.2. Directives and Standards The BG96 module is designed to comply with the FCC statements. FCC ID: XMR201707BG96 The Host system using BG96 should have label “contains FCC ID: XMR201707BG96 2.2.1. FCC Statement According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met: 1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based time- averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the user’s body and must not transmit simultaneously with any other antenna or transmitter. 3. A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR201707BG96. 4. To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed: ❒LTE B1/B2/B3/B4/B5/B8/B12/B13/B20/B26/B28 <4dBi ❒GSM 850/900/1800/1900 <4dBi 5. This module must not transmit simultaneously with any other antenna or transmitter 6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093. If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs: A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be label led with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 13 / 71 to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the module’s FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straight forward commonly used methods for access to remove the module so that the FCC ID of the module is visible; then an additional permanent label referring to the enclosed module: “Contains Transmitter Module FCC ID:XMR201707BG96” or “Contains FCC ID: XMR201707BG96” must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The user’s manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the user’s authority to operate the equipment. To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring compliance with the module(s) installed and fully operational. For example, if a host was previously authorized as an unintentional radiator under the Declaration of Conformity procedure without a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring that the after the module is installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements. 2.3. Key Features The following table describes the detailed features of BG96. Table 2: Key Features of BG96 Features Details
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 14 / 71 Power Supply Supply voltage: 3.3V~4.3V Typical supply voltage: 3.8V LTE Features Support up to LTE Cat.M1 Support 1.08MHz RF bandwidth Support SISO in DL direction Cat.M1: Max. 375kbps (DL)/375kbps (UL) GSM Features GPRS: Support GPRS multi-slot class 12 (12 by default) Coding schemes: CS-1, CS-2, CS-3 and CS-4 Maximum of four Rx time slots per frame GPRS: Max. 85.6kbps (DL)/85.6kbps (UL) EDGE: Support EDGE multi-slot class 12 (12 by default) Support GMSK and 8-PSK for different MCS (Modulation and Coding Scheme) Downlink coding schemes: CS 1-4 and MCS 1-9 Uplink coding schemes: CS 1-4 and MCS 1-9 EDGE: Max. 236.8kbps (DL)/236.8kbps (UL) Internet Protocol Features* Support TCP/UDP/PPP protocols Support PAP (Password Authentication Protocol) and CHAP (Challenge Handshake Authentication Protocol) protocols which are usually used for PPP connections SMS* Text and PDU mode Point to point MO and MT SMS cell broadcast SMS storage: ME by default (U)SIM Card Interface Support (U)SIM card: 1.8V, 3.0V Audio Feature* Support one digital audio interface: I2S interface USB Interface Compliant with USB 2.0 specification (slave only) and the data transfer rate can reach up to 480Mbps Used for AT command communication, data transmission, GNSS NEMA output, software debugging and firmware upgrade Support USB drivers for Windows XP, Windows Vista, Windows 7, Windows 8/8.1, Windows 10, Windows CE 5.0/6.0/7.0*, Linux 2.6/3.x/4.1, Android 4.x/5.x/6.0 UART Interfaces UART1: Used for data transmission and AT command communication Baud rate reach up to 3000000bps; 115200bps by default Support RTS and CTS hardware flow control UART2: Used for module debugging and log output 115200bps baud rate UART3/SPI*:
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 15 / 71 UART3 is the default configuration when the module is used as a modem. In this case, it is used for outputting GNSS data or NEMA sentences. When the module is used as the core board, the port can be multiplexed into SPI* interface for data transferring. AT Commands 3GPP TS 27.007 and 3GPP TS 27.005 AT commands, as well as Quectel enhanced AT commands Network Indication One NETLIGHT pin for network connectivity status indication Antenna Interfaces Including main antenna (ANT_MAIN) and GNSS antenna (ANT_GNSS) interfaces Physical Characteristics Size: 22.5mm × 26.5mm × 2.3mm Weight: approx. 3.1g Temperature Range Operation temperature range: -35°C ~ +75°C 1) Extended temperature range: -40°C ~ +85°C 2) Firmware Upgrade USB interface and DFOTA* RoHS All hardware components are fully compliant with EU RoHS directive 1. “*” means under development. 2. 1) Within operation temperature range, the module is 3GPP compliant. 3. 2) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to the normal operating temperature levels, the module will meet 3GPP specifications again. 2.4. Functional Diagram The following figure shows a block diagram of BG96 and illustrates the major functional parts.  Power management  Baseband  DDR+NAND flash  Radio frequency  Peripheral interfaces NOTES
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 16 / 71 BasebandPMICTransceiver NANDDDR2SDRAMPARF5212AFilterANT_MAIN ANT_GNSSVBAT_BBVBAT_RFPWRKEYVDD_EXT USB USIM I2S* I2CRESET_N19.2MXOSTATUSGPIOsControlIQ ControlLNATx PRx GNSSUART/SPI*NETLIGHTPARF3628 Figure 1: Functional Diagram “*” means under development. 2.5. Evaluation Board In order to help customers develop applications conveniently with BG96, Quectel supplies the evaluation board (EVB), USB data cable, earphone, antenna and other peripherals to control or test the module. NOTE
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 17 / 71 3 Application Interfaces BG96 is equipped with 62-pin 1.1mm pitch SMT pads and 40-pin ground/reserved pads that can be connected to customers’ cellular application platforms. The following sub-chapters will provide detailed description of interfaces listed below:  Power supply  (U)SIM card interface  USB interface  UART interfaces  I2S* interface  UART3/SPI* interface  Status indication  USB_BOOT interface
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 18 / 71 3.1. Pin Assignment The following figure shows the pin assignment of BG96. PSM_INDI2S_WCLK*I2S_BCLK*I2S_D0*I2S_D1*RESERVEDRESERVEDPWRKEY1)RESERVEDRESET_NW_DISABLE#1234567111213141516175051525354555859606162USB_DMAP_READYSTATUSNETLIGHTDBG_RXDDBG_TXDADC0RESERVEDGPIO/SPI_CLK*UART3_TXD/SPI_MOSI*UART3_RXD/SPI_MISO*VDD_EXTDTRGNDUSIM_CLKUSIM_DATAUSIM_RSTUSIM_VDDRIDCDCTSTXDRXDVBAT_BBVBAT_BBUSIM_GNDGNDRESERVED3130292827262322212019109USB_DPUSB_VBUSADC1GNDRESERVEDRESERVEDRTSI2C_SCLI2C_SDA8494847464544434041423938373635343332245756GNDGNDANT_MAINGNDGNDVBAT_RFVBAT_RFGNDGNDANT_GNSSRESERVEDGNDUSIM_PRESENCE63646566676883848586878898979695949378777675747391 9289 9071 7269 7080 7982 81100 99102 101POWER USB UART USIM OTHERSGND RESERVEDI2S ANT25I2S_MCLK*RESERVEDUSB_BOOT18SPIGPIO* Figure 2: Pin Assignment (Top View)
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 19 / 71 1. Keep all RESERVED pins and unused pins unconnected. 2. GND pads should be connected to ground in the design. 3. 1) PWRKEY output voltage is 0.8V because of the diode drop in the Qualcomm chipset. 4. “*” means under development. 3.2. Pin Description The following tables show the pin definition and description of BG96. Table 3: Definition of I/O Parameters Type Description IO Bidirectional DI Digital input DO Digital output PI Power input PO Power output AI Analog input AO Analog output OD Open drain Table 4: Pin Description Power Supply Pin Name Pin No. I/O Description DC Characteristics Comment VBAT_BB 32, 33 PI Power supply for module baseband part Vmax=4.3V Vmin=3.3V Vnorm=3.8V VBAT_RF 52, 53 PI Power supply for module RF Vmax=4.3V Vmin=3.3V NOTES
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 20 / 71 part Vnorm=3.8V VDD_EXT 29 PO Provide 1.8V for external circuit Vnorm=1.8V IOmax=50mA Power supply for external GPIO’s pull up circuits. GND 3, 31, 48, 50, 54, 55, 58, 59, 61, 62, 67~74, 79~82, 89~91, 100~102 Ground Turn on/off Pin Name Pin No. I/O Description DC Characteristics Comment PWRKEY 15 DI Turn on/off the module VIHmax=2.1V VIHmin=1.3V VILmax=0.5V The output voltage is 0.8V because of the diode drop in the Qualcomm chipset. RESET_N 17 DI Reset signal of the module VIHmax=2.1V VIHmin=1.3V VILmax=0.5V If unused, keep this pin open. Status Indication Pin Name Pin No. I/O Description DC Characteristics Comment STATUS 20 OD Indicate the module’s operation status VOHmin=1.35V VOLmax=0.45V 1.8V power domain. If unused, keep this pin open. NETLIGHT 21 DO Indicate the module’s network activity status VOHmin=1.35V VOLmax=0.45V 1.8V power domain. If unused, keep it open. USB Interface Pin Name Pin No. I/O Description DC Characteristics Comment USB_VBUS 8 PI USB detection Vmax=5.25V Vmin=3.0V Vnorm=5.0V USB_DP 9 IO USB differential data bus (+) Compliant with USB 2.0 standard specification. Require differential impedance of 90Ω.
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 21 / 71 USB_DM 10 IO USB differential data bus (-) Compliant with USB 2.0 standard specification. Require differential impedance of 90Ω. (U)SIM Card Interface Pin Name Pin No. I/O Description DC Characteristics Comment USIM_GND 47 Specified ground for (U)SIM card USIM_VDD 43 PO Power supply for (U)SIM card For 1.8V (U)SIM: Vmax=1.9V Vmin=1.7V For 3.0V (U)SIM: Vmax=3.05V Vmin=2.7V IOmax=50mA Either 1.8V or 3V is supported by the module automatically. USIM_DATA 45 IO Data signal of (U)SIM card For 1.8V (U)SIM: VILmax=0.6V VIHmin=1.2V VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM: VILmax=1.0V VIHmin=1.95V VOLmax=0.45V VOHmin=2.55V USIM_CLK 46 DO Clock signal of (U)SIM card For 1.8V (U)SIM: VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM: VOLmax=0.45V VOHmin=2.55V USIM_RST 44 DO Reset signal of (U)SIM card For 1.8V (U)SIM: VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM: VOLmax=0.45V VOHmin=2.55V
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 22 / 71 USIM_ PRESENCE 42 DI (U)SIM card insertion detection VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. UART1 Interface Pin Name Pin No. I/O Description DC Characteristics Comment RI 39 DO Ring indicator VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. DCD 38 DO Data carrier detection VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. RTS 37 DI Request to send VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. CTS 36 DO Clear to send VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. TXD 35 DO Transmit data VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. RXD 34 DI Receive data VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. DTR 30 DI Data terminal ready. Sleep mode control. VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. Pull-up by default. Low level wakes up the module. If unused, keep it open. UART2 Interface Pin Name Pin No. I/O Description DC Characteristics Comment DBG_TXD 23 DO Transmit data VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. DBG_RXD 22 DI Receive data VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. UART3/SPI* Interface Pin Name Pin No. I/O Description DC Characteristics Comment
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 23 / 71 GPIO/ SPI_CLK* 26 DO GPIO/SPI master clock VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. UART3_TXD/ SPI_MOSI* 27 DO Transmit data/ Master Out Salve In of SPI interface VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. UART3_RXD/ SPI_MISO* 28 DI Receive data/ Master In Slave Out of SPI interface VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. I2S* Interface Pin Name Pin No. I/O Description DC Characteristics Comment I2S_MCLK* 63 DO I2S master clock VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. I2S_BCLK* 4 DO I2S bit clock VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. I2S_WCLK* 5 DO I2S data frame clock VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. I2S_D0* 6 IO I2S data 0 VILmax=0.6V VIHmin=1.2V VOLmax=0.45V VIHmin=1.35V 1.8V power domain. If unused, keep it open. I2S_D1* 7 IO I2S data 1 VILmax=0.6V VIHmin=1.2V VOLmax=0.45V VIHmin=1.35V 1.8V power domain. If unused, keep it open. I2C Interface Pin Name Pin No. I/O Description DC Characteristics Comment I2C_SCL 40 OD I2C serial clock. Used for external codec. External pull-up resistor is required. 1.8V only. If unused, keep it open. I2C_SDA 41 OD I2C serial data. Used for external codec. External pull-up resistor is required. 1.8V only. If unused, keep it open. Antenna Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 24 / 71 ANT_MAIN 60 IO Main antenna interface 50Ω impedance ANT_GNSS 49 AI GNSS antenna interface 50Ω impedance If unused, keep it open. Other Pins Pin Name Pin No. I/O Description DC Characteristics Comment PSM_IND* 1 DO Power saving mode indicator VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. W_DISABLE# 18 DI Airplane mode control VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. Pull-up by default. In low voltage level, the module can enter into airplane mode. If unused, keep it open. AP_READY* 19 DI Application processor sleep state detection VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. USB_BOOT 75 DI Force the module to boot from USB port VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. GPIO* 64 IO General- purpose input/ output interface VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. ADC Interface Pin Name Pin No. I/O Description DC Characteristics Comment ADC1 2 AI General purpose analog to digital converter interface Voltage range: 0.3V to VBAT_BB If unused, keep it open. ADC0 24 AI General purpose analog to digital converter interface Voltage range: 0.3V to VBAT_BB If unused, keep it open.
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 25 / 71 RESERVED Pins Pin Name Pin No. I/O Description DC Characteristics Comment RESERVED 11~14, 16, 25, 51, 56, 57, 65,66, 76~78, 83~88, 92~99 Reserved Keep these pins unconnected. 1. Keep all RESERVED pins and unused pins unconnected. 2. “*” means under development. 3.3. Operating Modes The table below briefly summarizes the various operating modes referred in the following chapters. Table 5: Overview of Operating Modes Mode Details Normal Operation Idle Software is active. The module has registered on network, and it is ready to send and receive data. Talk/Data Network connection is ongoing. In this mode, the power consumption is decided by network setting and data transfer rate. Minimum Functionality Mode AT+CFUN command can set the module to a minimum functionality mode without removing the power supply. In this case, both RF function and (U)SIM card will be invalid. Airplane Mode AT+CFUN command or W_DISABLE# pin can set the module to airplane mode. In this case, RF function will be invalid. Sleep Mode In this mode, the current consumption of the module will be reduced to the minimal level. During this mode, the module can still receive paging message, SMS, voice call and TCP/UDP data from the network normally. PSM* A UE may adopt the PSM (Power Saving Mode) for reducing its power consumption. PSM is similar to power-off, but the UE remains registered on the network and there is no need to re-attach or re-establish PDN connections. When the module is successfully entered into the PSM, PSM_IND* outputs a low level. NOTES
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 26 / 71 Power Down Mode In this mode, the power management unit shuts down the power supply. Software is not active. The serial interface is not accessible. Operating voltage (connected to VBAT_RF and VBAT_BB) remains applied. 1. In PSM or sleep mode, it is recommended to use UART interface for module connection. USB connection is NOT recommended as it will cause increase in power consumption. 2. “*” means under development. 3.4. Power Saving 3.4.1. Sleep Mode BG96 is able to reduce its current consumption to a minimum value during sleep mode. The following describes the power saving procedure of BG96 module. 3.4.1.1. UART Application If the host communicates with module via UART interface, the following preconditions can let the module enter into sleep mode.  Execute AT+QSCLK=1 command to enable sleep mode.  Drive DTR to high level. The following figure shows the connection between the module and the host. RXDTXDRIDTRAP_READY*TXDRXDEINTGPIOGPIOModule HostGND GND Figure 3: Sleep Mode Application via UART NOTES
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 27 / 71  Driving the host DTR to low level will wake up the module.  When BG96 has URC to report, RI signal will wake up the host. Refer to Chapter 3.15 for details about RI behaviors.  AP_READY* will detect the sleep state of the host (can be configured to high level or low level detection). Please refer to AT+QCFG=“apready” command for details. 3.4.1.2. USB Application with USB Remote Wakeup Function If the host supports USB suspend/resume and remote wakeup functions, the following three preconditions must be met to let the module enter into sleep mode.  Execute AT+QSCLK=1 command to enable the sleep mode.  Ensure the DTR is held in high level or keep it open.  The host’s USB bus, which is connected with the module’s USB interface, enters into suspended state. The following figure shows the connection between the module and the host. USB_VBUSUSB_DPUSB_DMAP_READY*VDDUSB_DPUSB_DMGPIOModule HostGND GND Figure 4: Sleep Mode Application with USB Remote Wakeup  Sending data to BG96 through USB will wake up the module.  When BG96 has URC to report, the module will send remote wake-up signals via USB bus so as to wake up the host. 3.4.1.3. USB Application with USB Suspend/Resume and RI Function If the host supports USB suspend/resume, but does not support remote wake-up function, the RI signal is needed to wake up the host. There are three preconditions to let the module enter into sleep mode.  Execute AT+QSCLK=1 command to enable sleep mode.  Ensure the DTR is held in high level or keep it open.  The host’s USB bus, which is connected with the module’s USB interface, enters into suspended state.
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 28 / 71 The following figure shows the connection between the module and the host. USB_VBUSUSB_DPUSB_DMAP_READY*VDDUSB_DPUSB_DMGPIOModule HostGND GNDRI EINT Figure 5: Sleep Mode Application with RI  Sending data to BG96 through USB will wake up the module.  When BG96 has a URC to report, RI signal will wake up the host. 3.4.1.4. USB Application without USB Suspend Function If the host does not support USB suspend function, USB_VBUS should be disconnected via an additional control circuit to let the module enter into sleep mode.  Execute AT+QSCLK=1 command to enable sleep mode.  Ensure the DTR is held in high level or keep it open.  Disconnect USB_VBUS. The following figure shows the connection between the module and the host. USB_VBUSUSB_DPUSB_DMAP_READYVDDUSB_DPUSB_DMGPIOModule HostRI EINTPower SwitchGPIOGND GND Figure 6: Sleep Mode Application without Suspend Function
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 29 / 71 Switching on the power switch to supply power to USB_VBUS will wake up the module. 1. Please pay attention to the level match shown in dotted line between the module and the host. Refer to document [1] for more details about BG96 power management application. 2. “*” means under development. 3.4.2. Airplane Mode When the module enters into airplane mode, the RF function does not work, and all AT commands correlative with RF function will be inaccessible. This mode can be set via the following ways. Hardware: W_DISABLE# is pulled up by default. Driving it to low level will let the module enter into airplane mode. Software: AT+CFUN=<fun> command provides choice of the functionality level, through setting <fun> into 0, 1 or 4.  AT+CFUN=0: Minimum functionality mode. Both (U)SIM and RF functions are disabled.  AT+CFUN=1: Full functionality mode (by default).  AT+CFUN=4: Airplane mode. RF function is disabled. 1. Airplane mode control via W_DISABLE# is disabled in firmware by default. It can be enabled by AT+QCFG=“airplanecontrol” command. The command is still under development. 2. The execution of AT+CFUN command will not affect GNSS function. 3.5. Power Supply 3.5.1. Power Supply Pins BG96 provides four VBAT pins for connection with an external power supply. There are two separate voltage domains for VBAT.  Two VBAT_RF pins for module’s RF part.  Two VBAT_BB pins for module’s baseband part. The following table shows the details of VBAT pins and ground pins. NOTES NOTES
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 30 / 71 Table 6: VBAT and GND Pins Pin Name Pin No. Description Min. Typ. Max. Unit VBAT_RF 52, 53 Power supply for module’s RF part 3.3 3.8 4.3 V VBAT_BB 32, 33 Power supply for module’s baseband part 3.3 3.8 4.3 V GND 3, 31, 48, 50, 54, 55, 58, 59, 61, 62, 67~74, 79~82, 89~91, 100~102 Ground - - - - 3.5.2. Decrease Voltage Drop The power supply range of the module is from 3.3V to 4.3V. Please make sure that the input voltage will never drop below 3.3V. To decrease voltage drop, a bypass capacitor of about 100µF with low ESR should be used, and a multi-layer ceramic chip capacitor (MLCC) array should also be used to provide the low ESR. The main power supply from an external application has to be a single voltage source and can be expanded to two sub paths with star structure. The width of VBAT_BB trace should be no less than 1mm, and the width of VBAT_RF trace should be no less than 2mm. In principle, the longer the VBAT trace is, the wider it will be. Three ceramic capacitors (100nF, 33pF, 10pF) are recommended to be applied to the VBAT pins. These capacitors should be placed close to the VBAT pins. In addition, in order to get a stable power source, it is suggested that you should use a zener diode of which reverse zener voltage is 5.1V and dissipation power is more than 0.5W. The following figure shows the star structure of the power supply. ModuleVBAT_RFVBAT_BBVBATC1100uFC6100nFC733pFC810pF++C2100nFC5100uFC333pFC410pFD15.1V Figure 7: Star Structure of the Power Supply
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 31 / 71 3.5.3. Monitor the Power Supply AT+CBC command can be used to monitor the VBAT_BB voltage value. For more details, please refer to document [2]. 3.6. Turn on and off Scenarios 3.6.1. Turn on Module Using the PWRKEY Pin The following table shows the pin definition of PWRKEY. Table 7: Pin Definition of PWRKEY Pin Name Pin No. Description DC Characteristics Comment PWRKEY 15 Turn on/off the module VIHmax=2.1V VIHmin=1.3V VILmax=0.5V The output voltage is 0.8V because of the diode drop in the Qualcomm chipset. When BG96 is in power down mode, it can be turned on to normal mode by driving the PWRKEY pin to a low level for at least 100ms. It is recommended to use an open drain/collector driver to control the PWRKEY. After STATUS pin (require external pull-up) outputting a low level, PWRKEY pin can be released. A simple reference circuit is illustrated in the following figure. Turn on pulsePWRKEY4.7K47K≥100ms Figure 8: Turn on the Module Using Driving Circuit The other way to control the PWRKEY is using a button directly. When pressing the key, electrostatic strike may generate from finger. Therefore, a TVS component is indispensable to be placed nearby the button for ESD protection. A reference circuit is shown in the following figure.
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 32 / 71 PWRKEYS1Close to S1TVS Figure 9: Turn on the Module Using Keystroke The turn on scenario is illustrated in the following figure. VIL≤0.5VVIH≥1.3VVBATPWRKEY≥100msRESET_NSTATUS(OD)Inactive ActiveUARTNOTEInactive ActiveUSBTBDTBDTBD Figure 10: Timing of Turning on Module Make sure that VBAT is stable before pulling down PWRKEY pin. The time between them is no less than 30ms. NOTE
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 33 / 71 3.6.2. Turn off Module The following procedures can be used to turn off the module:  Normal power down procedure: Turn off the module using the PWRKEY pin.  Normal power down procedure: Turn off the module using AT+QPOWD command. 3.6.2.1. Turn off Module Using the PWRKEY Pin Driving the PWRKEY pin to a low level voltage (the specific time is TBD), the module will execute power-down procedure after the PWRKEY is released. The power-down scenario is illustrated in the following figure. VBATPWRKEYTBDTBDRUNNING Power-down procedure OFFModuleStatusSTATUS Figure 11: Timing of Turning off Module 3.6.2.2. Turn off Module Using AT Command It is also a safe way to use AT+QPOWD command to turn off the module, which is similar to turning off the module via PWRKEY pin. Please refer to document [2] for details about AT+QPOWD command.
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 34 / 71 3.7. Reset the Module The RESET_N pin can be used to reset the module. The module can be reset by driving RESET_N to a low level voltage for time between 150ms and 460ms. Table 8: RESET_N Pin Description Pin Name Pin No. Description DC Characteristics Comment RESET_N 17 Reset signal of the module VIHmax=2.1V VIHmin=1.3V VILmax=0.5V The recommended circuit is similar to the PWRKEY control circuit. An open drain/collector driver or button can be used to control the RESET_N. Reset pulseRESET_N4.7K47K150~460ms Figure 12: Reference Circuit of RESET_N by Using Driving Circuit RESET_NS2Close to S2TVS Figure 13: Reference Circuit of RESET_N by Using Button The reset scenario is illustrated in the following figure.
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 35 / 71 VBAT≥150msResettingModule Status RunningRESET_NRestart≤460msVIL≤0.5V VIH≥1.3V Figure 14: Timing of Resetting Module 1. Use RESET_N only when turning off the module by AT+QPOWD command and PWRKEY pin both failed. 2. Ensure that there is no large capacitance on PWRKEY and RESET_N pins. 3.8. (U)SIM Card Interface The (U)SIM card interface circuitry meets ETSI and IMT-2000 requirements. Both 1.8V and 3.0V (U)SIM cards are supported. Table 9: Pin Definition of (U)SIM Card Interface Pin Name Pin No. I/O Description Comment USIM_VDD 43 PO Power supply for (U)SIM card Either 1.8V or 3.0V is supported by the module automatically. USIM_DATA 45 IO Data signal of (U)SIM card USIM_CLK 46 DO Clock signal of (U)SIM card USIM_RST 44 DO Reset signal of (U)SIM card USIM_ PRESENCE 42 DI (U)SIM card insertion detection USIM_GND 47 Specified ground for (U)SIM card NOTES
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 36 / 71 BG96 supports (U)SIM card hot-plug via the USIM_PRESENCE pin. The function supports low level and high level detections, and is disabled by default. Please refer to document [2] about AT+QSIMDET command for details. The following figure shows a reference design of (U)SIM card interface with an 8-pin (U)SIM card connector. ModuleUSIM_VDDUSIM_GNDUSIM_RSTUSIM_CLKUSIM_DATAUSIM_PRESENCE22R22R22RVDD_EXT51K100nF (U)SIM Card ConnectorGNDGND33pF 33pF 33pFVCCRSTCLK IOVPPGNDGNDUSIM_VDD15K Figure 15: Reference Circuit of (U)SIM Card Interface with an 8-Pin (U)SIM Card Connector If (U)SIM card detection function is not needed, please keep USIM_PRESENCE unconnected. A reference circuit for (U)SIM card interface with a 6-pin (U)SIM card connector is illustrated in the following figure. ModuleUSIM_VDDUSIM_GNDUSIM_RSTUSIM_CLKUSIM_DATA 22R22R22R100nF (U)SIM Card ConnectorGND33pF 33pF 33pFVCCRSTCLK IOVPPGNDGND15KUSIM_VDD
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 37 / 71 Figure 16: Reference Circuit of (U)SIM Card Interface with a 6-Pin (U)SIM Card Connector In order to enhance the reliability and availability of the (U)SIM card in applications, please follow the criteria below in (U)SIM circuit design:  Keep layout of (U)SIM card as close to the module as possible. Keep the trace length as less than 200mm as possible.  Keep (U)SIM card signals away from RF and VBAT traces.  Assure the ground between the module and the (U)SIM card connector short and wide. Keep the trace width of ground and USIM_VDD no less than 0.5mm to maintain the same electric potential.  To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with surrounded ground.  In order to offer good ESD protection, it is recommended to add a TVS diode array with parasitic capacitance not exceeding 50pF. The 22Ω resistors should be added in series between the module and the (U)SIM card so as to suppress EMI spurious transmission and enhance ESD protection. The 33pF capacitors are used for filtering interference of GSM900. Please note that the (U)SIM peripheral circuit should be close to the (U)SIM card connector.  The pull-up resistor on USIM_DATA line can improve anti-jamming capability when long layout trace and sensitive occasion are applied, and should be placed close to the (U)SIM card connector. 3.9. USB Interface BG96 contains one integrated Universal Serial Bus (USB) interface which complies with the USB 2.0 specification and supports high-speed (480Mbps) and full-speed (12Mbps) modes. The USB interface is used for AT command communication, data transmission, software debugging and firmware upgrade. The following table shows the pin definition of USB interface. Table 10: Pin Definition of USB Interface Pin Name Pin No. I/O Description Comment USB_VBUS 8 PI USB connection detection Typically 5.0V USB_DP 9 IO USB differential data bus (+) Require differential impedance of 90Ω USB_DM 10 IO USB differential data bus (-) Require differential impedance of 90Ω GND 3 Ground For more details about USB 2.0 specification, please visit http://www.usb.org/home.
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 38 / 71 The USB interface is recommended to be reserved for firmware upgrade in your design. The following figure shows a reference circuit of USB interface. USB_DPUSB_DMGNDUSB_DPUSB_DMGNDR1R2Close to ModuleR3R4Test PointsESD ArrayNM_0RNM_0R0R0RMinimize these stubsModule MCUUSB_VBUSVDD Figure 17: Reference Circuit of USB Application In order to ensure signal integrity of USB data lines, components R1, R2, R3 and R4 must be placed close to the module, and also these resistors should be placed close to each other. The extra stubs of trace must be as short as possible. The following principles should be complied with when design the USB interface, so as to meet USB 2.0 specification.  It is important to route the USB signal traces as differential pairs with total grounding. The impedance of USB differential trace is 90Ω.  Do not route signal traces under crystals, oscillators, magnetic devices and RF signal traces. It is important to route the USB differential traces in inner-layer with ground shielding on not only upper and lower layers but also right and left sides.  Pay attention to the influence of junction capacitance of ESD protection components on USB data lines. Typically, the capacitance value should be less than 2pF.  Keep the ESD protection components to the USB connector as close as possible. BG96 module can only be used as a slave device. NOTE
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 39 / 71 3.10. UART Interfaces The module provides three UART interfaces: UART1, UART2 and UART3 interfaces. The following are their features.  UART1 interface supports 9600, 19200, 38400, 57600, 115200, 230400, 460800, 921600 and 3000000bps baud rates, and the default is 115200bps. This interface is used for data transmission and AT command communication.  UART2 interface supports 115200bps baud rate. It is used for module debugging and log output.  UART3 interface is used for outputting GNSS data or NEMA sentences. It can be multiplexed into SPI* interface. The following tables show the pin definition of the three UART interfaces. Table 11: Pin Definition of UART1 Interface Pin Name Pin No. I/O Description Comment DTR 30 DI Sleep mode control 1.8V power domain RXD 34 DI Receive data 1.8V power domain TXD 35 DO Transmit data 1.8V power domain CTS 36 DO Clear to send 1.8V power domain RTS 37 DI Request to send 1.8V power domain DCD 38 DO Data carrier detection 1.8V power domain RI 39 DO Ring indicator 1.8V power domain Table 12: Pin Definition of UART2 Interface Pin Name Pin No. I/O Description Comment DBG_TXD 23 DO Transmit data 1.8V power domain DBG_RXD 22 DI Receive data 1.8V power domain
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 40 / 71 Table 13: Pin Definition of UART3 Interface Pin Name Pin No. I/O Description Comment UART3_TXD 27 DO Transmit data 1.8V power domain UART3_RXD 28 DI Receive data 1.8V power domain The logic levels are described in the following table. Table 14: Logic Levels of Digital I/O Parameter Min. Max. Unit VIL -0.3 0.6 V VIH 1.2 2.0 V VOL 0 0.45 V VOH 1.35 1.8 V The module provides 1.8V UART interface. A level translator should be used if your application is equipped with a 3.3V UART interface. A level translator TXS0108EPWR provided by Texas Instrument is recommended. The following figure shows a reference design. VCCA VCCBOEA1A2A3A4A5A6A7A8GNDB1B2B3B4B5B6B7B8VDD_EXTRIDCDRTSRXDDTRCTSTXD51K 51K0.1uF 0.1uFRI_MCUDCD_MCURTS_MCURXD_MCUDTR_MCUCTS_MCUTXD_MCUVDD_MCUTranslator Figure 18: Reference Circuit with Translator Chip Please visit http://www.ti.com for more information.
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 41 / 71 Another example with transistor translation circuit is shown as below. The circuit design of dotted line section can refer to the circuit design of solid line section, in terms of both module input and output circuit designs, but please pay attention to the direction of connection. MCU/ARMTXDRXDVDD_EXT10KVCC_MCU 4.7K10KVDD_EXTTXDRXDRTSCTSDTRRIRTSCTSGNDGPIO DCDModuleGPIOEINTVDD_EXT4.7KGND1nF1nF Figure 19: Reference Circuit with Transistor Circuit Transistor circuit solution is not suitable for applications with high baud rates exceeding 460Kbps. 3.11. I2S* and I2C Interfaces BG96 provides one Inter-IC Sound (I2S) digital interface* and one I2C interface. The following table shows the pin definition of I2S* and I2C interfaces which can be applied on audio codec design. Table 15: Pin Definition of I2S* and I2C Interfaces Pin Name Pin No. I/O Description Comment I2S_MCLK* 63 DO I2S master clock 1.8V power domain. I2S_BCLK* 4 DO I2S bit clock 1.8V power domain I2S_WCLK* 5 DO I2S data frame clock 1.8V power domain NOTE
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 42 / 71 I2S_D0* 6 IO I2S data 0 1.8V power domain I2S_D1* 7 IO I2S data 1 1.8V power domain I2C_SCL 40 OD I2C serial clock Require external pull-up to 1.8V I2C_SDA 41 OD I2C serial data Require external pull-up to 1.8V The following figure shows a reference design of I2S* and I2C interfaces with an external codec IC. I2S_D0I2S_WCLKI2S_BCLKI2S_MCLKI2C_SCLI2C_SDAModule1.8V4.7K4.7KMCLKBCLKWCLKADCSCLSDABIASMICBIASINPINNLOUTPLOUTNCodecI2S_D1 DAC Figure 20: Reference Circuit of I2S Application with Audio Codec “*” means under development. 3.12. SPI* Interface BG96 provides one Serial Peripheral Interface (SPI) digital interface* which is multiplexed from UART3 (default configuration). The following table shows the pin definition of SPI* interface which can be used to transfer data. NOTE
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 43 / 71 Table 16: Pin Definition of SPI* Interface Pin Name Pin No. I/O Description Comment SPI_CLK* 26 DO SPI master clock 1.8V power domain. SPI_MOSI* 27 DO Master Out Slave in of SPI interface 1.8V power domain SPI_MISO* 28 DI Master In Slave Out of SPI interface 1.8V power domain “*” means under development. 3.13. Network Status Indication BG96 provides one network indication pin: NETLIGHT. The pin is used to drive a network status indication LED. The following tables describe the pin definition and logic level changes of NETLIGHT in different network activity status. Table 17: Pin Definition of Network Status Indicator Pin Name Pin No. I/O Description Comment NETLIGHT 21 DO Indicate the module’s network activity status 1.8V power domain Table 18: Working State of the Network Status Indicator Pin Name Logic Level Changes Network Status NETLIGHT Flicker slowly (200ms High/1800ms Low) Network searching Flicker slowly (1800ms High/200ms Low) Idle Flicker quickly (125ms High/125ms Low) Data transfer is ongoing Always high Voice calling A reference circuit is shown in the following figure. NOTE
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 44 / 71 4.7K47KVBAT2.2KModuleNETLIGHT Figure 21: Reference Circuit of the Network Status Indicator 3.14. STATUS The STATUS pin is an open drain output for indicating the module’s operation status. It can be connected to a GPIO of DTE with a pulled up resistor, or as LED indication circuit as below. When the module is turned on normally, the STATUS will present a low state. Otherwise, the STATUS will present high-impedance state. Table 19: Pin Definition of STATUS Pin Name Pin No. I/O Description Comment STATUS 20 OD Indicate the module’s operation status Require external pull-up The following figure shows different circuit designs of STATUS, and you can choose either one according to your application demands. VDD_MCU10KModuleSTATUS MCU_GPIOModuleSTATUSVBAT2.2K Figure 22: Reference Circuit of STATUS
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 45 / 71 3.15. Behaviors of RI AT+QCFG=“risignaltype”,“physical” command can be used to configure RI behavior. No matter on which port URC is presented, URC will trigger the behavior of RI pin. URC can be outputted from UART port, USB AT port and USB modem port, through configuration via AT+QURCCFG command. The default port is USB AT port. The default behaviors of RI are shown as below. Table 20: Default Behaviors of RI State Response Idle RI keeps in high level. URC RI outputs 120ms low pulse when new URC returns. The default RI behaviors can be configured flexibly by AT+QCFG=“urc/ri/ring” command. AT+QCFG command is still under development. For more details, please refer to document [2]. 3.16. USB_BOOT Interface BG96 provides a USB_BOOT pin. During development or factory production, USB_BOOT pin can force the module to boot from USB port for firmware upgrade. Table 21: Pin Definition of USB_BOOT Interface Pin Name Pin No. I/O Description Comment USB_BOOT 75 DI Force the module to boot from USB port 1.8V power domain. Active high. If unused, keep it open. NOTE
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 46 / 71 The following figure shows a reference circuit of USB_BOOT interface. ModuleUSB_BOOTVDD_EXT10KTest pointTVS Close to test point Figure 23: Reference Circuit of USB_BOOT Interface
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 47 / 71 4 GNSS Receiver 4.1. General Description BG96 includes a fully integrated global navigation satellite system solution that supports Gen8C-Lite of Qualcomm (GPS, GLONASS, BeiDou/Compass, Galileo and QZSS). BG96 supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1Hz data update rate via USB interface by default. By default, BG96 GNSS engine is switched off. It has to be switched on via AT command. For more details about GNSS engine technology and configurations, please refer to document [3]. 4.2. GNSS Performance The following table shows the GNSS performance of BG96. Table 22: GNSS Performance Parameter Description Conditions Typ. Unit Sensitivity (GNSS) Cold start Autonomous TBD dBm Reacquisition Autonomous TBD dBm Tracking Autonomous TBD dBm TTFF (GNSS) Cold start @open sky Autonomous TBD s XTRA* enabled TBD s Warm start @open sky Autonomous TBD s XTRA* enabled TBD s Hot start Autonomous TBD s
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 48 / 71 @open sky XTRA* enabled TBD s Accuracy (GNSS) CEP-50 Autonomous @open sky TBD m 1. Tracking sensitivity: the lowest GNSS signal value at the antenna port on which the module can keep on positioning for 3 minutes. 2. Reacquisition sensitivity: the lowest GNSS signal value at the antenna port on which the module can fix position again within 3 minutes after loss of lock. 3. Cold start sensitivity: the lowest GNSS signal value at the antenna port on which the module fixes position within 3 minutes after executing cold start command. 4. “*” means under development. 4.3. Layout Guidelines The following layout guidelines should be taken into account in your design.  Maximize the distance between GNSS antenna and main antenna.  Digital circuits such as (U)SIM card, USB interface, camera module, display connector and SD card should be kept away from the antennas.  Use ground vias around the GNSS trace and sensitive analog signal traces to provide coplanar isolation and protection.  Keep 50Ω characteristic impedance for the ANT_GNSS trace. Please refer to Chapter 5 for GNSS antenna reference design and antenna installation information. NOTES
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 49 / 71 5 Antenna Interfaces BG96 includes a main antenna interface and a GNSS antenna interface. The antenna interfaces have an impedance of 50Ω. 5.1. Main Antenna Interface 5.1.1. Pin Definition The pin definition of main antenna interface is shown below. Table 23: Pin Definition of Main Antenna Interface Pin Name Pin No. I/O Description Comment ANT_MAIN 60 IO Main antenna interface 50Ω impedance 5.1.2. Operating Frequency Table 24: Module Operating Frequencies 3GPP Band Transmit Receive Unit B1 1920~1980 2110~2170 MHz B2 (PCS1900) 1850~1910 1930~1990 MHz B3 (DCS1800) 1710~1785 1805~1880 MHz B4 1710~1755 2110~2155 MHz B5 (GSM850) 824~849 869~894 MHz B8 (GSM900) 880~915 925~960 MHz B12 699~716 728~746 MHz
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 50 / 71 B13 777~787 746~757 MHz B20 832~862 791~821 MHz B26 814~848.9 859~893.9 MHz B28 703~748 758~803 MHz B39 1880~1920 1880~1920 MHz 5.1.3. Reference Design of RF Antenna Interface A reference design of ANT_MAIN antenna pad is shown as below. A π-type matching circuit should be reserved for better RF performance, and the π-type matching components (R1/C1/C2) should be placed as close the antenna as possible. The capacitors are not mounted by default. ANT_MAINR1 0RC1ModuleMainantennaNMC2NM Figure 24: Reference Circuit of RF Antenna Interface 5.1.4. Reference Design of RF Layout For user’s PCB, the characteristic impedance of all RF traces should be controlled as 50Ω. The impedance of the RF traces is usually determined by the trace width (W), the materials’ dielectric constant, the distance between signal layer and reference ground (H), and the clearance between RF trace and ground (S). Microstrip line or coplanar waveguide line is typically used in RF layout for characteristic impedance control. The following are reference designs of microstrip line or coplanar waveguide line with different PCB structures.
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 51 / 71 Figure 25: Microstrip Line Design on a 2-layer PCB Figure 26: Coplanar Waveguide Line Design on a 2-layer PCB Figure 27: Coplanar Waveguide Line Design on a 4-layer PCB (Layer 3 as Reference Ground)
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 52 / 71 Figure 28: Coplanar Waveguide Line Design on a 4-layer PCB (Layer 4 as Reference Ground) In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design:  Use impedance simulation tool to control the characteristic impedance of RF traces as 50Ω.  The GND pins adjacent to RF pins should not be hot welded, and should be fully connected to ground.  The distance between the RF pins and the RF connector should be as short as possible, and all the right angle traces should be changed to curved ones.  There should be clearance area under the signal pin of the antenna connector or solder joint.  The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be no less than two times the width of RF signal traces (2*W). For more details about RF layout, please refer to document [4]. 5.2. GNSS Antenna Interface The following tables show the pin definition and frequency specification of GNSS antenna interface. Table 25: Pin Definition of GNSS Antenna Interface Pin Name Pin No. I/O Description Comment ANT_GNSS 49 AI GNSS antenna interface 50Ω impedance
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 53 / 71 Table 26: GNSS Frequency Type Frequency Unit GPS/Galileo/QZSS 1575.42±1.023 MHz GLONASS 1597.5~1605.8 MHz BeiDou 1561.098±2.046 MHz A reference design of GNSS antenna is shown as below. GNSS AntennaVDDModuleANT_GNSS47nH10R 0.1uF100pFNMNM Figure 29: Reference Circuit of GNSS Antenna Interface 1. An external LDO can be selected to supply power according to the active antenna requirement. 2. If the module is designed with a passive antenna, then the VDD circuit is not needed. NOTES
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 54 / 71 5.3. Antenna Installation 5.3.1. Antenna Requirements The following table shows the requirements on main antenna and GNSS antenna. Table 27: Antenna Requirements Antenna Type Requirements LTE/GSM VSWR: ≤ 2 Gain (dBi): 1 Max Input Power (W): 50 Input Impedance (Ω): 50 Polarization Type: Vertical Cable Insertion Loss: < 1dB (LTE B5/B8/B12/B13/B20/B26/B28 GSM850/GSM900) Cable Insertion Loss: < 1.5dB (LTE B1/B2/B3/B4/B39, DCS1800/PCS1900) GNSS Frequency range: 1561~1615MHz Polarization: RHCP or linear VSWR: <2 (Typ.) Passive antenna gain: >0dBi Active antenna noise figure: <1.5dB Active antenna gain: >-2dBi Active antenna embedded LNA gain: 20dB (Typ.) Active antenna total gain: >18dBi (Typ.) 5.3.2. Recommended RF Connector for Antenna Installation If RF connector is used for antenna connection, it is recommended to use the UF.L-R-SMT connector provided by HIROSE.
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 55 / 71 Figure 30: Dimensions of the UF.L-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the UF.L-R-SMT. Figure 31: Mechanicals of UF.L-LP Connectors
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 56 / 71 The following figure describes the space factor of mated connector. Figure 32: Space Factor of Mated Connector (Unit: mm) For more details, please visit http://www.hirose.com. 5.3.3. RF Reference Schematic Diagram
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 57 / 71 Figure 33: RF Reference Schematic Diagram C1, R1 and C2 form a “PI” type matching circuit which is reserved for antenna optimization. By default, R1 is 0ohm while C1 and C2 are both Not Mounted (NM).
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 58 / 71 5.3.4. Coplanar Waveguide Structure Design The recommended coplanar waveguide structure is shown as Figure 2. Figure 34: Structure of Coplanar WG The factors which influence impedance include dielectric constant (usually 4.2~4.6, here is 4.4), dielectric height (H), RF trace width (W), the space between RF trace, the ground (S) and copper thickness (T). When T=0.035mm, the recommended value of W and S for 50 ohm coplanar WG under different PCB structure is listed in Table 1. Table 28: Recommended Value of W and S for 50 ohm Coplanar WG under Different PCB Structure Dielectric Height (H) RF Trace Width (W) Space between RF Trace and the Ground (S) 0.076mm 0.1188mm 0.15mm 0.1mm 0.1623mm 0.2mm 0.15mm 0.24mm 0.2mm 0.8mm 0.8mm 0.18mm 1.0mm 0.8mm 0.17mm
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 59 / 71 If there are two layers, the TOP layer is the signal layer, and the BOTTOM layer is the reference ground, as shown in Figure 3. If there are 4 layers, the reference ground could be the second layer, the third layer or the fourth layer. If third layer is chosen, the second layer should be kept out and the width of keepout area should be at least five times of the trace width, as shown in Figure 4. If the fourth layer is chosen, both the second and third layer should be kept out and the width of keepout area should be at least five times of the trace width, as shown in Figure 5. Same as 6 or more layers. Figure 35: Two Layers PCB Layout Figure 36: Four Layers PCB Layout (Third Layer as Reference Ground) Figure 37: Four Layers PCB Layout (Fourth Layer as Reference Ground) 1.2mm 0.8mm 0.16mm 1.6mm 0.8mm 0.15mm 2mm 0.8mm 0.14mm
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 60 / 71 5.3.5. Coplanar WG PCB Layout Example and Guidelines Figure 38: An example of PCB layout There are 6 guidelines should be taken into account, as marked in the above figure: 1. Control corresponding W and S of 50 ohm coplanar waveguide. Use the common PCB as FR4 medium (dielectric constant is 4.2) and take copper clad of 35 um thickness as an example. Values of W and S for 50 ohm coplanar WG under different PCB structure is shown as Table 1. Keep in mind to remind PCB manufacturers to keep the accuracy of W and S. 2. Do not hot sealing the PIN in this position and make it contacted with the ground closely enough. 3. Keep out pouring copper in the surface layer and reduce parasitic effect. The RF trace line should be as short as possible. It will be better for RF trace line to avoid vertical angle layout. The RF trace line should be kept 135 degree angle around the corner. 4. Keep a certain distance between signal pad and ground when packaging the device. Refer to Figure 6. If the signal pad is in SMD type, pouring copper on the corresponding signal pad. 5. Ensure the corresponding reference ground of RF trace line is integrated and do not forget to add more ground via to help RF reflow. The ground and RF trace should be kept at least two times of the trace width. Guarantee the contact area which is in the same layer with RF trace is as large as
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 61 / 71 possible and its corresponding reference ground in the opposite layer is as integrated as possible, meanwhile ensure the two layer ground is connected by amount of ground hole. 6. Three components consist of PI type matching circuit shown as Figure 6. Place the pad to antenna as close as possible, as shown in Figure 6. If the distance between SMA and RF PIN is too short to place the three pin of PI type matching circuit, PI type matching circuit can be changed into L matching circuit.
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 62 / 71 6 Electrical, Reliability and Radio Characteristics 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 29: Absolute Maximum Ratings Parameter Min. Max. Unit VBAT_RF/VBAT_BB -0.3 4.7 V USB_VBUS -0.3 5.5 V Peak Current of VBAT_BB 0 TBD A Peak Current of VBAT_RF 0 TBD A Voltage at Digital Pins -0.3 2.3 V 6.2. Power Supply Ratings Table 30: Power Supply Ratings Parameter Description Conditions Min. Typ. Max. Unit VBAT VBAT_BB and VBAT_RF Voltage must stay within the min/max values, including voltage drop, ripple and spikes. 3.3 3.8 4.3 V IVBAT Peak supply current (during transmission slot) TBD TBD A
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 63 / 71 Parameter Description Conditions Min. Typ. Max. Unit USB_VBUS USB detection 3.0 5.0 5.25 V 6.3. Operation Temperature The operation temperature is listed in the following table. Table 31: Operation Temperature Parameter Min. Typ. Max. Unit Operation Temperature Range 1) -35 +25 +75 ºC Extended Temperature Range 2) -40 +85 ºC 1. 1) Within operation temperature range, the module is 3GPP compliant. 2. 2) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to the normal operating temperature levels, the module will meet 3GPP specifications again. 6.4. Current Consumption The information will be added in the future version of this document. 6.5. RF Output Power The following table shows the RF output power of BG96 module. NOTES
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 64 / 71 6.6. RF Receiving Sensitivity The following table shows the conducted RF receiving sensitivity of BG96 module. Table 32: BG96 Conducted RF Receiving Sensitivity Frequency Primary Diversity SISO 3GPP LTE-FDD B1 TBD Not Supported TBD -102.7dBm LTE-FDD B2 TBD Not Supported TBD -100.3dBm LTE-FDD B3 TBD Not Supported TBD -99.3dBm LTE-FDD B4 TBD Not Supported TBD -102.3dBm LTE-FDD B5 TBD Not Supported TBD -100.8dBm LTE-FDD B8 TBD Not Supported TBD -99.8dBm LTE-FDD B12 TBD Not Supported TBD -99.3dBm LTE-FDD B13 TBD Not Supported TBD -99.3dBm LTE-FDD B20 TBD Not Supported TBD -99.8dBm LTE-FDD B26 TBD Not Supported TBD -100.3dBm LTE-FDD B28 TBD Not Supported TBD -100.8dBm LTE-TDD B39 TBD Not Supported TBD -103dBm GSM850/GSM900 TBD Not Supported TBD -102.4dBm DCS1800/PCS1900 TBD Not Supported TBD -102.4dBm 6.7. Electrostatic Discharge The information will be added in the future version of this document.
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 65 / 71 7 Mechanical Dimensions This chapter describes the mechanical dimensions of the module. All dimensions are measured in mm. 7.1. Mechanical Dimensions of the Module 22.50±0.126.50±0.12.3±0.2 Figure 39: Module Top and Side Dimensions
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 66 / 71 22.5026.500.920.921.501.107.45 7.151.95 0.55 1.10 1.665.101.008.500.851.700.851.001.001.701.700.551.501.151.901.100.50 0.7040x1.040x1.062x0.762x1.15 Figure 40: Module Bottom Dimensions (Bottom View)
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 67 / 71 7.2. Recommended Footprint and Stencil Design 1.001.700.700.550.851.001.701.7062x0.740x1.0040x1.0022.5026.501.651.501.501.651.151.157.45 7.150.855.100.201.101.901.101.951.001.10 1.1062x1.158.50 Figure 41: Recommended Footprint (Top View)
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 68 / 71 1.001.700.700.550.851.001.701.7062x0.740x1.0040x1.0022.5026.501.651.501.501.651.151.157.45 7.150.855.100.201.101.901.101.951.001.10 1.1062x1.158.50 Figure 42: Recommended Stencil Design (Top View) 1. For easy maintenance of the module, please keep about 3mm between the module and other components in the host PCB. 2. All Reserved pins MUST be kept open. NOTES
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 69 / 71 7.3. Design Effect Drawings of the Module Figure 43: Top View of the Module Figure 44: Bottom View of the Module These are design effect drawings of BG96 module. For more accurate pictures, please refer to the module that you get from Quectel. NOTE
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 70 / 71 8 Storage, Manufacturing and Packaging 8.1. Storage BG96 is stored in a vacuum-sealed bag. The storage restrictions are shown as below. 1. Shelf life in the vacuum-sealed bag: 12 months at <40ºC/90%RH. 2. After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other high temperature processes must be:  Mounted within 168 hours at the factory environment of ≤30ºC/60%RH.  Stored at <10%RH. 3. Devices require baking before mounting, if any circumstance below occurs.  When the ambient temperature is 23ºC±5ºC and the humidity indication card shows the humidity is >10% before opening the vacuum-sealed bag.  Device mounting cannot be finished within 168 hours at factory conditions of ≤30ºC/60% 4. If baking is required, devices may be baked for 48 hours at 125ºC±5ºC. As the plastic package cannot be subjected to high temperature, it should be removed from devices before high temperature (125ºC ) baking. If shorter baking time is desired, please refer to IPC/JEDECJ-STD-033 for baking procedure. 8.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the thickness of stencil for the module is recommended to be 0.18mm. For more details, please refer to document [5]. NOTE
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 71 / 71 It is suggested that the peak reflow temperature is 235~245ºC (for SnAg3.0Cu0.5 alloy). The absolute max reflow temperature is 260ºC. To avoid damage to the module caused by repeated heating, it is suggested that the module should be mounted after reflow soldering for the other side of PCB has been completed. Recommended reflow soldering thermal profile is shown below. Time50 100 150 200 250 30050100150200250 160ºC 200ºC217070s~120s40s~60sBetween 1~3ºC/sPreheat Heating CoolingºCsLiquids Temperature Temperature Figure 45: Reflow Soldering Thermal Profile During manufacturing and soldering, or any other processes that may contact the module directly, NEVER wipe the module label with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol, trichloroethylene, etc. 8.3. Packaging The information will be added in the future version of this document. NOTE
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 72 / 71 9 Appendix A References Table 33: Related Documents SN Document Name Remark [1] Quectel_BG96_Power_Management_Application_Note BG96 Power Management Application Note [2] Quectel_BG96_AT_Commands_Manual BG96 AT Commands Manual [3] Quectel_BG96_GNSS_AT_Commands_Manual BG96 GNSS AT Commands Manual [4] Quectel_RF_Layout_Application_Note RF Layout Application Note [5] Quectel_Module_Secondary_SMT_User_Guide Module Secondary SMT User Guide Table 34: Terms and Abbreviations Abbreviation Description AMR Adaptive Multi-rate bps Bits Per Second CHAP Challenge Handshake Authentication Protocol CS Coding Scheme CTS Clear To Send DC-HSPA+ Dual-carrier High Speed Packet Access DFOTA Delta Firmware Upgrade Over The Air DL Downlink DTR Data Terminal Ready DTX Discontinuous Transmission EFR Enhanced Full Rate
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 73 / 71 ESD Electrostatic Discharge FDD Frequency Division Duplex FR Full Rate GMSK Gaussian Minimum Shift Keying GSM Global System for Mobile Communications HR Half Rate HSPA High Speed Packet Access HSDPA High Speed Downlink Packet Access HSUPA High Speed Uplink Packet Access I/O Input/Output Inorm Normal Current LED Light Emitting Diode LNA Low Noise Amplifier LTE Long Term Evolution MIMO Multiple Input Multiple Output MO Mobile Originated MS Mobile Station (GSM engine) MT Mobile Terminated PAP Password Authentication Protocol PCB Printed Circuit Board PDU Protocol Data Unit PPP Point-to-Point Protocol QAM Quadrature Amplitude Modulation QPSK Quadrature Phase Shift Keying RF Radio Frequency RHCP Right Hand Circularly Polarized Rx Receive
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 74 / 71 SISO Single Input Single Output SMS Short Message Service TDD Time Division Duplexing TX Transmitting Direction UL Uplink UMTS Universal Mobile Telecommunications System URC Unsolicited Result Code (U)SIM (Universal) Subscriber Identity Module Vmax Maximum Voltage Value Vnorm Normal Voltage Value Vmin Minimum Voltage Value VIHmax Maximum Input High Level Voltage Value VIHmin Minimum Input High Level Voltage Value VILmax Maximum Input Low Level Voltage Value VILmin Minimum Input Low Level Voltage Value VImax Absolute Maximum Input Voltage Value VImin Absolute Minimum Input Voltage Value VOHmax Maximum Output High Level Voltage Value VOHmin Minimum Output High Level Voltage Value VOLmax Maximum Output Low Level Voltage Value VOLmin Minimum Output Low Level Voltage Value VSWR Voltage Standing Wave Ratio WCDMA Wideband Code Division Multiple Access
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 75 / 71 10 Appendix B GPRS Coding Schemes Table 35: Description of Different Coding Schemes Scheme CS-1 CS-2 CS-3 CS-4 Code Rate 1/2 2/3 3/4 1 USF 3 3 3 3 Pre-coded USF 3 6 6 12 Radio Block excl.USF and BCS 181 268 312 428 BCS 40 16 16 16 Tail 4 4 4 - Coded Bits 456 588 676 456 Punctured Bits 0 132 220 - Data Rate Kb/s 9.05 13.4 15.6 21.4
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 76 / 71 11 Appendix C GPRS Multi-slot Classes Twenty-nine classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot classes are product dependent, and determine the maximum achievable data rates in both the uplink and downlink directions. Written as 3+1 or 2+2, the first number indicates the amount of downlink timeslots, while the second number indicates the amount of uplink timeslots. The active slots determine the total number of slots the GPRS device can use simultaneously for both uplink and downlink communications. The description of different multi-slot classes is shown in the following table. Table 36: GPRS Multi-slot Classes Multislot Class Downlink Slots Uplink Slots Active Slots 1 1 1 2 2 2 1 3 3 2 2 3 4 3 1 4 5 2 2 4 6 3 2 4 7 3 3 4 8 4 1 5 9 3 2 5 10 4 2 5 11 4 3 5 12 4 4 5
LTE Module Series BG96 Hardware Design BG96_Hardware_Design Confidential / Released 77 / 71 12 Appendix D EDGE Modulation and Coding Schemes Table 37: EDGE Modulation and Coding Schemes Coding Schemes Modulation Coding Family 1 Timeslot 2 Timeslot 4 Timeslot CS-1: GMSK / 9.05kbps 18.1kbps 36.2kbps CS-2: GMSK / 13.4kbps 26.8kbps 53.6kbps CS-3: GMSK / 15.6kbps 31.2kbps 62.4kbps CS-4: GMSK / 21.4kbps 42.8kbps 85.6kbps MCS-1 GMSK C 8.80kbps 17.60kbps 35.20kbps MCS-2 GMSK B 11.2kbps 22.4kbps 44.8kbps MCS-3 GMSK A 14.8kbps 29.6kbps 59.2kbps MCS-4 GMSK C 17.6kbps 35.2kbps 70.4kbps MCS-5 8-PSK B 22.4kbps 44.8kbps 89.6kbps MCS-6 8-PSK A 29.6kbps 59.2kbps 118.4kbps MCS-7 8-PSK B 44.8kbps 89.6kbps 179.2kbps MCS-8 8-PSK A 54.4kbps 108.8kbps 217.6kbps MCS-9 8-PSK A 59.2kbps 118.4kbps 236.8kbps

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