Quectel Wireless Solutions 201208M80 GSM/GPRS Module User Manual M10 Hardware Design

Quectel Wireless Solutions Company Limited GSM/GPRS Module M10 Hardware Design

User Manual

M80 Hardware Design M80_HD_V1.2 - 1 - M80 Quectel Cellular Engine Hardware Design M80_HD_V1.2
M80 Hardware Design M80_HD_V1.2 - 2 - Document Title M80 Hardware Design Revision 1.2 Date 2012-07-23 Status Released Document Control ID M80_HD_V1.2 General Notes Quectel offers this information as a service to its customers, to support application and engineering efforts that use the products designed by Quectel. The information provided is based upon requirements specifically provided for customers of Quectel. Quectel has not undertaken any independent search for additional information, relevant to any information that may be in the customer’s possession. Furthermore, system validation of this product designed by Quectel within a larger electronic system remains the responsibility of the customer or the customer’s system integrator. All specifications supplied herein are subject to change. Copyright This document contains proprietary technical information of Quectel Co., Ltd. Copying this document, distribution to others, and communication of the contents thereof, are forbidden without permission. Offenders are liable to the payment of damages. All rights are reserved in the event of a patent grant or registration of a utility model or design. All specifications supplied herein are subject to change without notice at any time. Copyright © Shanghai Quectel Wireless Solutions Ltd. 2012.
M80 Hardware Design M80_HD_V1.2 - 3 - Contents Contents ............................................................................................................................................ 3 Table Index ........................................................................................................................................ 6 Figure Index ...................................................................................................................................... 7 0. Revision history ............................................................................................................................ 9 1. Introduction ................................................................................................................................. 10 1.1. Related documents ............................................................................................................ 10 1.2. Terms and abbreviations .................................................................................................... 11 1.3. Directives and standards .................................................................................................... 13 1.3.1. FCC Statement ........................................................................................................ 13 1.3.2. FCC/IC Radiation exposure statement .................................................................... 13 1.3.3. Industry Canada license ........................................................................................... 13 1.4. Safety cautions .................................................................................................................. 14 2. Product concept ........................................................................................................................... 16 2.1. Key features ...................................................................................................................... 16 2.2. Functional diagram ............................................................................................................ 18 2.3. Evaluation board ............................................................................................................... 19 3. Application interface ................................................................................................................... 20 3.1. Pin ..................................................................................................................................... 21 3.1.1. Pin assignment ......................................................................................................... 21 3.1.2. Pin description ......................................................................................................... 23 3.2. Operating modes ............................................................................................................... 30 3.3. Power supply ..................................................................................................................... 31 3.3.1. Feature of GSM power ............................................................................................ 31 3.3.2. Minimize supply voltage drop ................................................................................. 31 3.3.3. Reference power design for module ........................................................................ 32 3.3.4. Monitor power supply ............................................................................................. 33 3.4. Power on and down scenarios ........................................................................................... 33 3.4.1. Power on .................................................................................................................. 33 3.4.2. Power down ............................................................................................................. 35 3.4.3. Restart ...................................................................................................................... 38 3.5. Charging interface ............................................................................................................. 40 3.6. Power saving ..................................................................................................................... 40 3.6.1. Minimum functionality mode .................................................................................. 40 3.6.2. SLEEP mode ........................................................................................................... 41 3.6.3. Wake up module from SLEEP mode ...................................................................... 41 3.7. Summary of state transitions ............................................................................................. 41 3.8. RTC backup ....................................................................................................................... 42 3.9. Serial interfaces ................................................................................................................. 43 3.9.1. UART Port .............................................................................................................. 44 3.9.2. Debug Port ............................................................................................................... 48 3.9.3. Auxiliary UART Port .............................................................................................. 48
M80 Hardware Design M80_HD_V1.2 - 4 - 3.9.4. Level match ............................................................................................................. 49 3.10. Audio interfaces .............................................................................................................. 52 3.10.1. Decrease TDD noise and other noise .................................................................... 53 3.10.2. Microphone interfaces design ................................................................................ 54 3.10.3. Receiver and speaker interface design ................................................................... 54 3.10.4. Earphone interface design ..................................................................................... 56 3.10.5. Loud speaker interface design ............................................................................... 56 3.10.6. Audio characteristics ............................................................................................. 57 3.11. SIM card interface ........................................................................................................... 57 3.11.1. SIM card application ............................................................................................. 57 3.11.2. 6 Pin SIM cassette ................................................................................................. 59 3.11.3. 8 Pin SIM cassette ................................................................................................. 60 3.12. SD card interface ............................................................................................................. 62 3.13. PCM interface ................................................................................................................. 64 3.13.1. Configuration ......................................................................................................... 64 3.13.2. Timing ................................................................................................................... 65 3.13.3. Reference design ................................................................................................... 66 3.13.4. AT command ......................................................................................................... 66 3.14. ADC ................................................................................................................................ 67 3.15. Behaviors of the RI ......................................................................................................... 67 3.16. Network status indication ................................................................................................ 70 3.17. Operating status indication .............................................................................................. 70 4. Antenna interface ........................................................................................................................ 72 4.1. RF reference design ........................................................................................................... 72 4.2. RF output power ................................................................................................................ 73 4.3. RF receiving sensitivity ..................................................................................................... 73 4.4. Operating frequencies ....................................................................................................... 73 4.5. RF cable soldering ............................................................................................................. 73 5. Electrical, reliability and radio characteristics ............................................................................ 75 5.1. Absolute maximum ratings ................................................................................................ 75 5.2. Operating temperature ....................................................................................................... 75 5.3. Power supply ratings ......................................................................................................... 76 5.4. Current consumption ......................................................................................................... 77 5.5. Electro-static discharge ..................................................................................................... 79 6. Mechanical dimensions ............................................................................................................... 80 6.1. Mechanical dimensions of module .................................................................................... 80 6.2. Footprint one of recommendation ..................................................................................... 82 6.3. Footprint two of recommendation ..................................................................................... 83 6.4. Top view of the module .................................................................................................... 84 6.5. Bottom view of the module ............................................................................................... 85 7. Storage and manufacturing ......................................................................................................... 86 7.1. Storage............................................................................................................................... 86 7.2. Soldering ........................................................................................................................... 87 7.3. Packaging .......................................................................................................................... 88
M80 Hardware Design M80_HD_V1.2 - 5 - Appendix A: GPRS coding schemes ............................................................................................... 89 Appendix B: GPRS multi-slot classes............................................................................................. 90
M80 Hardware Design M80_HD_V1.2 - 6 - Table Index TABLE 1: RELATED DOCUMENTS ................................................................................................... 10 TABLE 2: TERMS AND ABBREVIATIONS ....................................................................................... 11 TABLE 3: MODULE KEY FEATURES ................................................................................................ 16 TABLE 4: CODING SCHEMES AND MAXIMUM NET DATA RATES OVER AIR INTERFACE .. 18 TABLE 5: M80 PIN ASSIGNMENT ..................................................................................................... 22 TABLE 6: PIN DESCRIPTION ............................................................................................................. 23 TABLE 7: OVERVIEW OF OPERATING MODES.............................................................................. 30 TABLE 8: PIN DEFINITION OF THE CHARGING ............................................................................ 40 TABLE 9: SUMMARY OF STATE TRANSITION ............................................................................... 41 TABLE 10: LOGIC LEVELS OF THE UART INTERFACE ................................................................ 44 TABLE 11: PIN DEFINITION OF THE UART INTERFACES ............................................................ 44 TABLE 12: PIN DEFINITION OF AUDIO INTERFACE .................................................................... 52 TABLE 13: AOUT3 OUTPUT CHARACTERISTICS .......................................................................... 53 TABLE 14: TYPICAL ELECTRET MICROPHONE CHARACTERISTICS ....................................... 57 TABLE 15: TYPICAL SPEAKER CHARACTERISTICS .................................................................... 57 TABLE 16: PIN DEFINITION OF THE SIM INTERFACE ................................................................. 58 TABLE 17: PIN DESCRIPTION OF AMPHENOL SIM CARD HOLDER ......................................... 60 TABLE 18: PIN DESCRIPTION OF MOLEX SIM CARD HOLDER ................................................. 61 TABLE 19: PIN DEFINITION OF THE SD CARD INTERFACE ....................................................... 62 TABLE 20: PIN NAME OF THE SD CARD AND MICRO SD CARD ............................................... 63 TABLE 21: PIN DEFINITION OF PCM INTERFACE ........................................................................ 64 TABLE 22: CONFIGURATION ............................................................................................................ 64 TABLE 23：AT COMMAND DESCRIPTION ..................................................................................... 66 TABLE 24: PIN DEFINITION OF THE ADC ....................................................................................... 67 TABLE 25: CHARACTERISTICS OF THE ADC ................................................................................ 67 TABLE 26: BEHAVIORS OF THE RI .................................................................................................. 67 TABLE 27: WORKING STATE OF THE NETLIGHT ......................................................................... 70 TABLE 28: PIN DEFINITION OF THE STATUS ................................................................................ 70 TABLE 29: PIN DEFINITION OF THE RF_ANT ................................................................................ 72 TABLE 30: THE MODULE CONDUCTED RF OUTPUT POWER .................................................... 73 TABLE 31: THE MODULE CONDUCTED RF RECEIVING SENSITIVITY .................................... 73 TABLE 32: THE MODULE OPERATING FREQUENCIES ................................................................ 73 TABLE 33: ABSOLUTE MAXIMUM RATINGS................................................................................. 75 TABLE 34: OPERATING TEMPERATURE ......................................................................................... 75 TABLE 35: THE MODULE POWER SUPPLY RATINGS ................................................................... 76 TABLE 36: THE MODULE CURRENT CONSUMPTION .................................................................. 77 TABLE 37: THE ESD ENDURANCE (TEMPERATURE:25℃,HUMIDITY:45 %) ........................... 79 TABLE 38: DESCRIPTION OF DIFFERENT CODING SCHEMES .................................................. 89 TABLE 39: GPRS MULTI-SLOT CLASSES ........................................................................................ 90
M80 Hardware Design M80_HD_V1.2 - 7 - Figure Index FIGURE 1: MODULE FUNCTIONAL DIAGRAM ............................................................................. 19 FIGURE 2: PIN ASSIGNMENT ............................................................................................................ 21 FIGURE 3: RIPPLE IN SUPPLY VOLTAGE DURING TRANSMITTING BURST ........................... 31 FIGURE 4: REFERENCE CIRCUIT OF THE VBAT INPUT .............................................................. 32 FIGURE 5: REFERENCE CIRCUIT OF THE SOURCE POWER SUPPLY INPUT ........................... 32 FIGURE 6: TURN ON THE MODULE USING DRIVING CIRCUIT................................................. 34 FIGURE 7: TURN ON THE MODULE USING KEYSTROKE ........................................................... 34 FIGURE 8: TIMING OF TURNING ON SYSTEM .............................................................................. 35 FIGURE 9: TIMING OF TURNING OFF THE MODULE .................................................................. 36 FIGURE 10: REFERENCE CIRCUIT FOR EMERG_OFF BY USING DRIVING CIRCUIT ............ 38 FIGURE 11: REFERENCE CIRCUIT FOR EMERG_OFF BY USING BUTTON .............................. 38 FIGURE 12: TIMING OF RESTARTING SYSTEM ............................................................................ 39 FIGURE 13: TIMING OF RESTARTING SYSTEM AFTER EMERGENCY SHUTDOWN .............. 39 FIGURE 14: RTC SUPPLY FROM NON-CHARGEABLE BATTERY ............................................... 42 FIGURE 15: RTC SUPPLY FROM RECHARGEABLE BATTERY .................................................... 42 FIGURE 16: RTC SUPPLY FROM CAPACITOR ................................................................................ 42 FIGURE 17: SEIKO XH414H-IV01E CHARGE CHARACTERISTICS ............................................. 43 FIGURE 18: REFERENCE DESIGN FOR FULL-FUNCTION UART ................................................ 46 FIGURE 19: REFERENCE DESIGN FOR UART PORT ..................................................................... 46 FIGURE 20: REFERENCE DESIGN FOR UART PORT WITH HARDWARE FLOW CONTROL .. 47 FIGURE 21: REFERENCE DESIGN SOFTWARE UPGRADE........................................................... 47 FIGURE 22: REFERENCE DESIGN FOR DEBUG PORT .................................................................. 48 FIGURE 23: REFERENCE DESIGN FOR AUXILIARY UART PORT ............................................... 49 FIGURE 24: LEVEL MATCH DESIGN FOR 3.3V SYSTEM ............................................................. 49 FIGURE 25: LEVEL MATCH DESIGN FOR 5V SYSTEM ................................................................ 50 FIGURE 26: LEVEL MATCH DESIGN FOR RS-232 .......................................................................... 51 FIGURE 27: REFERENCE DESIGN FOR AIN1&AIN2...................................................................... 54 FIGURE 28: REFERENCE DESIGN FOR AOUT1 .............................................................................. 54 FIGURE 29: HANDSET INTERFACE DESIGN FOR AOUT2 ........................................................... 55 FIGURE 30: SPEAKER INTERFACE DESIGN WITH AN AMPLIFIER FOR AOUT2 ..................... 55 FIGURE 31: EARPHONE INTERFACE DESIGN ............................................................................... 56 FIGURE 32: LOUD SPEAKER INTERFACE DESIGN ....................................................................... 56 FIGURE 33: REFERENCE CIRCUIT OF THE 8 PINS SIM CARD .................................................... 58 FIGURE 34: REFERENCE CIRCUIT OF THE 6 PINS SIM CARD .................................................... 59 FIGURE 35: AMPHENOL C707 10M006 512 2 SIM CARD HOLDER .............................................. 60 FIGURE 36: MOLEX 91228 SIM CARD HOLDER ............................................................................ 61 FIGURE 37: REFERENCE CIRCUIT OF SD CARD ........................................................................... 62 FIGURE 38: LONG SYNCHRONIZATION DIAGRAM ..................................................................... 65 FIGURE 39: SHORT SYNCHRONIZATION DIAGRAM ................................................................... 65 FIGURE 40: REFERENCE DESIGN FOR PCM .................................................................................. 66 FIGURE 41: RI BEHAVIOR OF VOICE CALLING AS A RECEIVER .............................................. 68
M80 Hardware Design M80_HD_V1.2 - 8 - FIGURE 42: RI BEHAVIOR OF DATA CALLING AS A RECEIVER ................................................ 68 FIGURE 43: RI BEHAVIOR AS A CALLER ........................................................................................ 68 FIGURE 44: RI BEHAVIOR OF URC OR SMS RECEIVED .............................................................. 69 FIGURE 45: REFERENCE DESIGN FOR NETLIGHT ....................................................................... 70 FIGURE 46: REFERENCE DESIGN FOR STATUS ............................................................................ 71 FIGURE 47: REFERENCE DESIGN FOR RF ...................................................................................... 72 FIGURE 48: RF SOLDERING SAMPLE ............................................................................................. 74 FIGURE 49: M80 TOP AND SIDE DIMENSIONS（UNIT: MM） .................................................... 80 FIGURE 50: M80 BOTTOM DIMENSIONS（UNIT: MM） ............................................................. 81 FIGURE 51: FOOTPRINT ONE OF RECOMMENDATION（UNIT: MM） .................................... 82 FIGURE 52: FOOTPRINT TWO OF RECOMMENDATION（UNIT: MM） .................................... 83 FIGURE 53: TOP VIEW OF THE MODULE ....................................................................................... 84 FIGURE 54: BOTTOM VIEW OF THE MODULE .............................................................................. 85 FIGURE 55: PASTE APPLICATION .................................................................................................... 87 FIGURE 56: RAMP-SOAK-SPIKE REFLOW PROFILE .................................................................... 88 FIGURE 57: MODULE TRAY .............................................................................................................. 88 FIGURE 58: RADIO BLOCK STRUCTURE OF CS-1, CS-2 AND CS-3 ........................................... 89 FIGURE 59: RADIO BLOCK STRUCTURE OF CS-4 ........................................................................ 89
M80 Hardware Design M80_HD_V1.2 - 9 - 0. Revision history Revision Date Author Description of change 1.0 2011-12-20 Ray XU Initial. 1.1 2012-02-03 Ray XU 1. Updated PCM interface. 2. Updated SD interface. 3. Updated charging interface. 4. Updated timing of turning on the module. 1.2 2012-07-20 Baly BAO 1. Deleted the USB interface. 2. Deleted the camera interface.
M80 Hardware Design M80_HD_V1.2 - 10 - 1. Introduction This document defines the M80 module and describes the hardware interface of M80 which are connected with the customer application and the air interface. This document can help customers quickly understand module interface specifications, electrical and mechanical details. Associated with application notes and user guide, customers can use M80 module to design and set up mobile applications easily. 1.1. Related documents Table 1: Related documents SN Document name Remark [1] M80_ATC AT commands set [2] ITU-T Draft new recommendation V.25ter Serial asynchronous automatic dialing and control [3] GSM 07.07 Digital cellular telecommunications (Phase 2+); AT command set for GSM Mobile Equipment (ME) [4] GSM 07.10 Support GSM 07.10 multiplexing protocol [5] GSM 07.05 Digital cellular telecommunications (Phase 2+); Use of Data Terminal Equipment – Data Circuit terminating Equipment (DTE – DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS) [6] GSM 11.14 Digital cellular telecommunications (Phase 2+); Specification of the SIM Application Toolkit for the Subscriber Identity module – Mobile Equipment (SIM – ME) interface [7] GSM 11.11 Digital cellular telecommunications (Phase 2+); Specification of the Subscriber Identity module – Mobile Equipment (SIM – ME) interface [8] GSM 03.38 Digital cellular telecommunications (Phase 2+); Alphabets and language-specific information [9] GSM 11.10 Digital cellular telecommunications (Phase 2); Mobile Station (MS) conformance specification; Part 1: Conformance specification [10] GSM_UART_AN UART port application notes [11] GSM_FW_Upgrade_AN01 GSM Firmware upgrade application note [12] M80_EVB_UGD M80 EVB user guide [13] M80_Charging_AN M80 charging application notes
M80 Hardware Design M80_HD_V1.2 - 11 - 1.2. Terms and abbreviations Table 2: Terms and abbreviations Abbreviation Description ADC Analog-to-Digital Converter AMR Adaptive Multi-Rate ARP Antenna Reference Point ASIC Application Specific Integrated Circuit BER Bit Error Rate BOM Bill Of Material BTS Base Transceiver Station CHAP Challenge Handshake Authentication Protocol CS Coding Scheme CSD Circuit Switched Data CTS Clear To Send DAC Digital-to-Analog Converter DRX Discontinuous Reception DSP Digital Signal Processor DCE Data Communications Equipment (typically module) DTE Data Terminal Equipment (typically computer, external controller) DTR Data Terminal Ready DTX Discontinuous Transmission EFR Enhanced Full Rate EGSM Enhanced GSM EMC Electromagnetic Compatibility ESD Electrostatic Discharge ETS European Telecommunication Standard FCC Federal Communications Commission (U.S.) FDMA Frequency Division Multiple Access FR Full Rate GMSK Gaussian Minimum Shift Keying GPRS General Packet Radio Service GSM Global System for Mobile Communications HR Half Rate I/O Input/Output IC Integrated Circuit IMEI International Mobile Equipment Identity Imax Maximum Load Current Inorm Normal Current kbps Kilo Bits Per Second LED Light Emitting Diode
M80 Hardware Design M80_HD_V1.2 - 12 - Li-Ion Lithium-Ion MO Mobile Originated MS Mobile Station (GSM engine) MT Mobile Terminated PAP Password Authentication Protocol PBCCH Packet Switched Broadcast Control Channel PCB Printed Circuit Board PDU Protocol Data Unit PPP Point-to-Point Protocol RF Radio Frequency RMS Root Mean Square (value) RTC Real Time Clock RX Receive Direction SIM Subscriber Identification Module SMS Short Message Service TDMA Time Division Multiple Access TE Terminal Equipment TX Transmitting Direction UART Universal Asynchronous Receiver & Transmitter URC Unsolicited Result Code USSD Unstructured Supplementary Service Data VSWR Voltage Standing Wave Ratio Vmax Maximum Voltage Value Vnorm Normal Voltage Value Vmin Minimum Voltage Value VIHmax Maximum Input High Level Voltage Value VIHmin Minimum Input High Level Voltage Value VILmax Maximum Input Low Level Voltage Value VILmin Minimum Input Low Level Voltage Value VImax Absolute Maximum Input Voltage Value VImin Absolute Minimum Input Voltage Value VOHmax Maximum Output High Level Voltage Value VOHmin Minimum Output High Level Voltage Value VOLmax Maximum Output Low Level Voltage Value VOLmin Minimum Output Low Level Voltage Value Phonebook abbreviations FD SIM Fix Dialing phonebook LD SIM Last Dialing phonebook (list of numbers most recently dialed) MC Mobile Equipment list of unanswered MT Calls (missed calls) ON SIM (or ME) Own Numbers (MSISDNs) list RC Mobile Equipment list of Received Calls SM SIM phonebook
M80 Hardware Design M80_HD_V1.2 - 13 - 1.3. Directives and standards The M80 module is designed to comply with the FCC statements. FCC ID: XMR201208M80. The Host system using M80, should have label indicated FCC ID: XMR201208M80. 1.3.1. FCC Statement 1. This device complies with Part 15 of the FCC rules. Operation is subject to the following conditions: a) This device may not cause harmful interference. b) This device must accept any interference received, including interference that may cause undesired operation. 2. Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. 1.3.2. FCC/IC Radiation exposure statement This equipment complies with FCC/IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body as well as kept minimum 20cm from radio antenna depending on the Mobile status of this module usage. The manual of the host system, which uses M80, must include RF exposure warning statement to advice user should keep minimum 20cm from the radio antenna of M80 module depending on the Mobile status. 1.3.3. Industry Canada license Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful. The host system using M80 should have label indicating “transmitter module IC ID: 10224A-201208M80 . This radio transmitter (IC ID: 10224A-201208M80) has been approved by Industry Canada to operate with the antenna type listed below with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.
M80 Hardware Design M80_HD_V1.2 - 14 - The following list of antenna is indicating the maximum permissible antenna gain. Type Maximum Gain (850Hz/900Hz) Maximum Gain (1800Hz/1900Hz) Impedance External Antenna Monopole 0.5dBi 2dBi 50Ω Vehicular antenna 0.5dBi 2dBi 50Ω Internal Antenna Monopole 0.5dBi 2dBi 50Ω PIFA 0.5dBi 2dBi 50Ω FPC 0.5dBi 2dBi 50Ω PCB 0.5dBi 2dBi 50Ω 1.4. Safety cautions The following safety precautions must be observed during all phases of the operation, such as usage, service or repair of any cellular terminal or mobile incorporating M80 module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. If not so, Quectel does not take on any liability for customer failure to comply with these precautions. When in a hospital or other health care facility, observe the restrictions about the use of mobile. Switch the cellular terminal or mobile off. Medical equipment may be sensitive to not operate normally for RF energy interference. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it switched off. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. Forget to think much of these instructions may lead to the flight safety or offend against local legal action, or both. Do not operate the cellular terminal or mobile in the presence of flammable gas or fume. Switch off the cellular terminal when you are near petrol station, fuel depot, chemical plant or where blasting operations are in progress. Operation of any electrical equipment in potentially explosive atmosphere can constitute a safety hazard.
M80 Hardware Design M80_HD_V1.2 - 15 - Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment. Road safety comes first! Do not use a hand-held cellular terminal or mobile while driving a vehicle, unless it is securely mounted in a holder for hands-free operation. Before making a call with a hand-held terminal or mobile, park the vehicle. GSM cellular terminals or mobiles operate over radio frequency signal and cellular network and cannot be guaranteed to connect in all conditions, for example no mobile fee or an invalid SIM card. While you are in this condition and need emergent help, Please Remember using emergency call. In order to make or receive call, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Some networks do not allow for emergency call if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may have to deactivate those features before you can make an emergency call. Also, some networks require that a valid SIM card be properly inserted in cellular terminal or mobile.
M80 Hardware Design M80_HD_V1.2 - 16 - 2. Product concept M80 is a Quad-band GSM/GPRS engine that works at frequencies of GSM850MHz, GSM900MHz, DCS1800MHz and PCS1900MHz. The M80 features GPRS multi-slot class 12 and supports the GPRS coding schemes CS-1, CS-2, CS-3 and CS-4. For more details about GPRS multi-slot classes and coding schemes, please refer to Appendix A and Appendix B. With a tiny profile of 23mm×25mm ×2.6 mm, the module can meet almost all the requirements for M2M applications, including Tracking and Tracing, Monitor and Security System, Wireless POS, Intelligent Measurement, Industrial PDA, Remote Controlling, etc. M80 is an SMD type module with LGA package, which can be embedded in customer’s applications. It provides abundant hardware interfaces between the module and customer’s host board. Designed with power saving technique, the current consumption of M80 is as low as 1.1 mA in SLEEP mode when DRX is 5. M80 is integrated with Internet service protocols, which are TCP, UDP, FTP and PPP. Extended AT commands have been developed for customer to use these Internet service protocols easily. The module fully complies to the RoHS directive of the European Union. 2.1. Key features Table 3: Module key features Feature Implementation Power supply Single supply voltage 3.3V ~ 4.6V Typical supply voltage 4V Power saving Typical power consumption in SLEEP mode: 1.1 mA@ DRX=5 0.95 mA@ DRX=9 Frequency bands  Quad-band: GSM850, GSM900, DCS1800, PCS1900.  The module can search these frequency bands automatically  The frequency bands can be set by AT command.  Compliant with GSM Phase 2/2+ GSM class Small MS Transmitting power  Class 4 (2W) at GSM850 and GSM900  Class 1 (1W) at DCS1800 and PCS1900 GPRS connectivity  GPRS multi-slot class 12 (default)  GPRS multi-slot class 1~12 (configurable)  GPRS mobile station class B
M80 Hardware Design M80_HD_V1.2 - 17 - Temperature range  Normal operation: -35°C ~ +80°C  Restricted operation: -45°C ~ -35°C and +80°C ~ +85°C 1)  Storage temperature: -45°C ~ +90°C DATA GPRS: CSD:  GPRS data downlink transfer: max. 85.6 kbps  GPRS data uplink transfer: max. 85.6 kbps  Coding scheme: CS-1, CS-2, CS-3 and CS-4  Support the protocols PAP (Password Authentication Protocol) usually used for PPP connections  Internet service protocols TCP/UDP/FTP/HTTP/MMS  Support Packet Switched Broadcast Control Channel (PBCCH)  CSD transmission rates: 2.4, 4.8, 9.6, 14.4 kbps non-transparent  Support Unstructured Supplementary Services Data (USSD) SMS  Text and PDU mode  SMS storage: SIM card FAX Group 3 Class 1 and Class 2 SIM interface Support SIM card: 1.8V, 3V Audio features Speech codec modes:  Half Rate (ETS 06.20)  Full Rate (ETS 06.10)  Enhanced Full Rate (ETS 06.50 / 06.60 / 06.80)  Adaptive Multi-Rate (AMR)  Echo Cancellation  Echo Suppression  Noise Reduction  Embedded one amplifier of class AB with maximum driving power up to 800mW UART interface UART Port:  Seven lines on UART port interface  Use for AT command, GPRS data and CSD data  Multiplexing function  Support autobauding from 4800 bps to 115200 bps Debug Port:  Two lines on debug UART port interface DBG_TXD and DBG_RXD  Debug Port only used for software debugging Auxiliary Port:  Use for AT command Phonebook management Support phonebook types: SM, ME, FD, ON, MT SIM Application Toolkit Support SAT class 3, GSM 11.14 Release 99 Real time clock Implemented Physical characteristics Size: 23±0.15 × 25±0.15 × 2.6±0.2mm Weight: 3.3g
M80 Hardware Design M80_HD_V1.2 - 18 - Firmware upgrade Firmware upgrade via UART Port Antenna interface Connected to antenna pad with 50 Ohm impendence control 1）When the module exceeds the temperature range, the deviations from the GSM specification may occur. For example, the frequency error or the phase error will be increased. Table 4: Coding schemes and maximum net data rates over air interface Coding scheme 1 Timeslot 2 Timeslot 4 Timeslot CS-1: 9.05kbps 18.1kbps 36.2kbps CS-2: 13.4kbps 26.8kbps 53.6kbps CS-3: 15.6kbps 31.2kbps 62.4kbps CS-4: 21.4kbps 42.8kbps 85.6kbps 2.2. Functional diagram The following figure shows a block diagram of the M80 module and illustrates the major functional parts:  Power management  Baseband  Serial Flash  The GSM radio frequency part  The Peripheral interface —Charging interface —PCM interface —SD card interface —SIM interface —Audio interface —UART interface —Power supply —RF interface —ADC —Turn on/off interface
M80 Hardware Design M80_HD_V1.2 - 19 - Serial FlashBaseband EnginePAMPMUPower supplyRTCChargeUARTSIMSDEINTTurn on/offIndicatorADCPCMTransceiverSaw26MHz 32kHzAudiocodecRF Figure 1: Module functional diagram 2.3. Evaluation board In order to help customer to develop applications with M80, Quectel supplies an evaluation board (EVB), RS-232 to USB cable, power adapter, earphone, antenna and other peripherals to control or test the module. For details, please refer to the document [12].
M80 Hardware Design M80_HD_V1.2 - 20 - 3. Application interface The module is equipped with 110 pin SMT pad and it adopts LGA package. Detailed descriptions on Sub-interfaces included in these pads are given in the following chapters:  Power supply  Turn on/off  Charging interface  RTC  UART interfaces  Audio interfaces  SIM interface  PCM interface  ADC
M80 Hardware Design M80_HD_V1.2 - 21 - 3.1. Pin 3.1.1. Pin assignment GNDPower SIM RESERVED LCM Audio PCMADCOtherSD1234567891011121314151617181920 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 3738394041424344454647484950515253545556575859606162636465666768697071727374757677787980 81 82 83 84858687888990919293949596979899 100 101 102103104105106107108109110Top viewRFChargeVBAT UARTADC1ADC0DOWNLOADNETLIGHTSPK2PAGNDMIC2PMIC2NMIC1PMIC1NSPK1NSPK1PLOUDSPKNLOUDSPKPPWRKEYSTATUSEMERG_OFFPCM_INPCM_CLKPCM_OUTPCM_SYNCRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDSD_CMDSD_CLKSD_DATA0GNDRESERVEDRESERVEDTXD_AUXRXD_AUXDBG_TXDDBG_RXDRESERVEDDCDRIDTRCTSTXDRXDRTSSIM1_GNDSIM1_RSTSIM1_DATASIM1_CLKSIM1_VDDSIM_PRESENCERESERVEDVRTCVDD_EXTGNDGNDRF_ANTGNDGNDGNDVBATVBATVBATBATSNSISENSECHGDETCHGLDOGATDRVGNDGND Figure 2: Pin assignment
M80 Hardware Design M80_HD_V1.2 - 22 - Table 5: M80 pin assignment PIN NO. PIN NAME I/O PIN NO. PIN NAME I/O 1 ADC1 I 2 ADC0 I 3 DOWNLOAD I 4 NETLIGHT O 5 SPK2P O 6 AGND 7 MIC2P I 8 MIC2N I 9 MIC1P I 10 MIC1N I 11 SPK1N O 12 SPK1P O 13 LOUDSPKN O 14 LOUDSPKP O 15 PWRKEY I 16 STATUS O 17 EMERG_OFF I 18 PCM_IN I 19 PCM_CLK O 20 PCM_OUT O 21 PCM_SYNC O 22 RESERVED 23 RESERVED 24 RESERVED 25 RESERVED 26 RESERVED 27 RESERVED 28 RESERVED 29 RESERVED 30 RESERVED 31 RESERVED 32 RESERVED 33 RESERVED 34 SD_CMD O 35 SD_CLK O 36 SD_DATA0 I/O 37 GND 38 RESERVED 39 RESERVED 40 TXD_AUX O 41 RXD_AUX I 42 DBG_TXD O 43 DBG_RXD I 44 RESERVED 45 DCD O 46 RI O 47 DTR I 48 CTS O 49 TXD O 50 RXD I 51 RTS I 52 SIM1_GND 53 SIM1_RST O 54 SIM1_DATA I/O 55 SIM1_CLK O 56 SIM1_VDD O 57 SIM_PRESENCE I 58 RESERVED O 59 VRTC I/O 60 VDD_EXT O 61 GND 62 GND 63 RF_ANT I/O 64 GND 65 GND 66 GND 67 VBAT I 68 VBAT I 69 VBAT I 70 BATSNS I 71 ISENSE I 72 CHGDET I
M80 Hardware Design M80_HD_V1.2 - 23 - 73 CHGLDO I 74 GATDRV O 75 RESERVED 76 RESERVED 77 RESERVED 78 RESERVED 79 RESERVED 80 RESERVED 81 RESERVED 82 RESERVED 83 RESERVED 84 RESERVED 85 RESERVED 86 RESERVED 87 RESERVED 88 RESERVED 89 RESERVED 90 RESERVED 91 RESERVED 92 RESERVED 93 GND 94 GND 95 RESERVED 96 RESERVED 97 RESERVED 98 RESERVED 99 RESERVED 100 RESERVED 101 RESERVED 102 RESERVED 103 RESERVED 104 RESERVED 105 RESERVED 106 RESERVED 107 RESERVED 108 RESERVED 109 RESERVED 110 RESERVED Note: Keep all reserved pins open. 3.1.2. Pin description Table 6: Pin description Power supply PIN NAME PIN NO. I/O DESCRIPTION DC CHARACTERISTICS COMMENT VBAT 67, 68, 69 I Main power supply of module: VBAT=3.3V~4.6V Vmax= 4.6V Vmin=3.3V Vnorm=4.0V Make sure that supply sufficient current in a transmitting burst which typically rises to 1.6A. VRTC 59 I/O Power supply for RTC when VBAT is not supplied for the system. Charging for VImax=VBAT VImin=2.6V VInorm=2.8V VOmax=2.85V VOmin=2.6V If unused, keep this pin open.
M80 Hardware Design M80_HD_V1.2 - 24 - backup battery or golden capacitor when the VBAT is supplied. VOnorm=2.8V Iout(max)= 730uA Iin=2.6~5 uA VDD_EXT 60 O Supply 2.8V voltage for external circuit. Vmax=2.9V Vmin=2.7V Vnorm=2.8V Imax=20mA 1. If unused, keep this pin open. 2. Recommended to add a 2.2~4.7uF bypass capacitor, when using this pin for power supply. GND 37, 61, 62, 64, 65, 66, 93, 94 Ground Charge interface PIN NAME PIN NO. I/O DESCRIPTION DC CHARACTERISTICS COMMENT GATDRV 74 O Charge driving CHGLDO 73 I Charger power supply source CHGDET 72 I Charger detection ISENSE 71 I Current sense pin BATSNS 70 I VBAT voltage sense pin Turn on/off PIN NAME PIN NO. I/O DESCRIPTION DC CHARACTERISTICS COMMENT PWRKEY 15 I Power on/off key. PWRKEY should be pulled down for a moment to turn on or off the system. VILmax= 0.1×VBAT VIHmin= 0.6×VBAT VImax=VBAT Pulled up to VBAT internally. Emergency shutdown PIN NAME PIN I/O DESCRIPTION DC COMMENT
M80 Hardware Design M80_HD_V1.2 - 25 - NO. CHARACTERISTICS EMERG_ OFF 17 I Emergency off. Pulled down for at least 20ms, which will turn off the module in case of emergency. Use it only when normal shutdown through PWRKEY or AT command can’t perform well. VILmax=0.4V VIHmin=2.2V Vopenmax=2.8V Open drain/collector driver required in cellular device application. If unused, keep this pin open. Module indicator PIN NAME PIN NO. I/O DESCRIPTION DC CHARACTERISTICS COMMENT STATUS 16 O Indicate module operating status. High level indicates module is power-on and low level indicates power-down. VOHmin= 0.85×VDD_EXT VOLmax= 0.15×VDD_EXT If unused, keep this pin open. Audio interface PIN NAME PIN NO. I/O DESCRIPTION DC CHARACTERISTICS COMMENT MIC1P MIC1N 9，10 I Channel one for positive and negative voice-band input If unused, keep these pins open. MIC2P MIC2N 7，8 I Channel two for positive and negative voice-band input SPK1P SPK1N 12,11 O Channel one for positive and negative voice-band output If unused, keep these pins open. SPK2P AGND 5,6 O Channel two for voice-band output 1. If unused, keep these pins open. 2. Support both voice and ring. LOUDSPKN 13，O Channel three of 1. If unused,
M80 Hardware Design M80_HD_V1.2 - 26 - LOUDSPKP 14 positive and negative voice-band output keep these pins open. 2. Embedded amplifier of class AB internally. 3. Support both voice and ring. Net status indicator PIN NAME PIN NO. I/O DESCRIPTION DC CHARACTERISTICS COMMENT NETLIGHT 4 O Network status indication VOHmin= 0.85×VDD_EXT VOLmax= 0.15×VDD_EXT If unused, keep these pins open. UART Port PIN NAME PIN NO. I/O DESCRIPTION DC CHARACTERISTICS COMMENT DTR 47 I Data terminal ready VILmin=0V VILmax= 0.25×VDD_EXT VIHmin= 0.75×VDD_EXT VIHmax= VDD_EXT+0.3 VOHmin= 0.85×VDD_EXT VOLmax= 0.15×VDD_EXT If only use TXD, RXD and GND to communicate, recommend keeping other pins open except RTS. Pull down RTS. RXD 50 I Receive data TXD 49 O Transmit data RTS 51 I Request to send CTS 48 O Clear to send RI 46 O Ring indicator DCD 45 O Data carrier detection Debug Port PIN NAME PIN NO. I/O DESCRIPTION DC CHARACTERISTICS COMMENT DBG_TXD 42 O UART interface for debugging only. VILmin=0V VILmax= 0.25×VDD_EXT VIHmin= 0.75×VDD_EXT VIHmax= VDD_EXT+0.3 VOHmin= 0.85×VDD_EXT VOLmax= 0.15×VDD_EXT If unused, keep these pins open. DBG_RXD 43 I Auxiliary UART Port
M80 Hardware Design M80_HD_V1.2 - 27 - PIN NAME PIN NO. I/O DESCRIPTION DC CHARACTERISTICS COMMENT TXD_AUX 40 O Transmit data VILmin=0V VILmax= 0.25×VDD_EXT VIHmin= 0.75×VDD_EXT VIHmax= VDD_EXT+0.3 VOHmin= 0.85×VDD_EXT VOLmax= 0.15×VDD_EXT If unused, keep these pins open. RXD_AUX 41 I Receive data SIM1 interface PIN NAME PIN NO. I/O DESCRIPTION DC CHARACTERISTICS COMMENT SIM1_ VDD 56 O Power supply for SIM card The voltage can be selected by software automatically. Either 1.8V or 3V. All signals of SIM interface should be protected against ESD with a TVS diode array. Maximum cable length is 200mm from the module pad to SIM card holder. SIM1_ DATA 54 I/O SIM data 3V： VOLmax=0.4 VOHmin= SIM1_VDD-0.4 1.8V: VOLmax= 0.15×SIM1_VDD VOHmin= SIM1_VDD-0.4 SIM1_CLK 55 O SIM clock 3V： VOLmax=0.4 VOHmin= 0.9×SIM1_VDD 1.8V: VOLmax= 0.12×SIM1_VDD VOHmin= 0.9×SIM1_VDD SIM1_RST 53 O SIM reset 3V： VOLmax=0.36 VOHmin= 0.9×SIM1_VDD 1.8V: VOLmax=
M80 Hardware Design M80_HD_V1.2 - 28 - 0.2×SIM1_VDD VOHmin= 0.9×SIM1_VDD SIM1_GND 52 SIM ground SIM_ PRESENCE 57 I SIM card detection VILmin=0V VILmax= 0.25×VDD_EXT VIHmin= 0.75×VDD_EXT VIHmax= VDD_EXT+0.3 If unused, keep these pins open. ADC PIN NAME PIN NO. I/O DESCRIPTION DC CHARACTERISTICS COMMENT ADC0 2 I General purpose analog to digital converter. Voltage range: 0V to 2.8V If unused, keep these pins open. ADC1 1 I General purpose analog to digital converter. Voltage range: 0V to 2.8V If unused, keep these pins open. PCM PIN NAME PIN NO. I/O DESCRIPTION DC CHARACTERISTICS COMMENT PCM_CLK 19 O PCM clock VILmin=0V VILmax= 0.25×VDD_EXT VIHmin= 0.75×VDD_EXT VIHmax= VDD_EXT+0.3 VOHmin= 0.85×VDD_EXT VOLmax= 0.15×VDD_EXT PCM_IN 18 I PCM data input PCM_OUT 20 O PCM data output PCM_SYNC 21 O PCM frame synchronization SD card PIN NAME PIN NO. I/O DESCRIPTION DC CHARACTERISTICS COMMENT SD_CMD 34 O SD command VILmin=0V VILmax= 0.25×VDD_EXT VIHmin= 0.75×VDD_EXT VIHmax= SD_CLK 35 O SD clock SD_DATA0 36 I/O SD data
M80 Hardware Design M80_HD_V1.2 - 29 - VDD_EXT+0.3 VOHmin= 0.85×VDD_EXT VOLmax= 0.15×VDD_EXT RF interface PIN NAME PIN NO. I/O DESCRIPTION DC CHARACTERISTICS COMMENT RF_ANT 63 I/O RF antenna pad Impedance of 50Ω Other interface PIN NAME PIN NO. I/O DESCRIPTION DC CHARACTERISTICS COMMENT DOWNLOAD 3 I VILmin=0V VILmax= 0.25×VDD_EXT VIHmin= 0.75×VDD_EXT VIHmax= VDD_EXT+0.3 Keep this pin open. RESERVED 22~ 33， 38, 39, 44, 58, 75~ 92 95~ 110 Keep these pins open.
M80 Hardware Design M80_HD_V1.2 - 30 - 3.2. Operating modes The table below briefly summarizes the various operating modes in the following chapters. Table 7: Overview of operating modes Mode Function Normal operation GSM/GPRS SLEEP The module will automatically go into SLEEP mode if DTR is set to high level and there is no interrupt (such as GPIO interrupt or data on UART port). In this case, the current consumption of module will reduce to the minimal level. During SLEEP mode, the module can still receive paging message and SMS from the system normally. GSM IDLE Software is active. The module has registered to the GSM network, and the module is ready to send and receive GSM data. GSM TALK GSM connection is ongoing. In this mode, the power consumption is decided by the configuration of Power Control Level (PCL), dynamic DTX control and the working RF band. GPRS IDLE The module is not registered to GPRS network. The module is not reachable through GPRS channel. GPRS STANDBY The module is registered to GPRS network, but no GPRS PDP context is active. The SGSN knows the Routing Area where the module is located at. GPRS READY The PDP context is active, but no data transfer is ongoing. The module is ready to receive or send GPRS data. The SGSN knows the cell where the module is located at. GPRS DATA There is GPRS data in transfer. In this mode, power consumption is decided by the PCL, working RF band and GPRS multi-slot configuration. POWER DOWN Normal shutdown by sending the “AT+QPOWD=1” command, using the PWRKEY or the EMERG_OFF1) pin. The power management ASIC disconnects the power supply from the base band part of the module, and only the power supply for the RTC is remained. Software is not active. The UART interfaces are not accessible. Operating voltage (connected to VBAT) remains applied. Minimum functionality mode (without removing power supply) “AT+CFUN” command can set the module to a minimum functionality mode without removing the power supply. In this case, the RF part of the module will not work or the SIM card will not be accessible, or both RF part and SIM card will be disabled, but the UART port is still accessible. The power consumption in this case is very low.
M80 Hardware Design M80_HD_V1.2 - 31 - 1) Use the EMERG_OFF pin only while failing to turn off the module by the command “AT+QPOWD=1” and the PWRKEY pin. Please refer to Section 3.4.2.4. 3.3. Power supply 3.3.1. Feature of GSM power The unit of GSM transmit in the wireless path is pulse string which is constructed by GSMK bit string and we call it burst. The period of burst is 4.16ms and the last time of burst is 577us. The burst current will reach 1.6A while idle current is as low as tens of milliampere. This sudden change of current will produce large ripple of VBAT or pull the VBAT down to 3.3V, while the module will shut down when VBAT drops to 3.3V. Due to these features, the power design for the module is crucial. The following figure is the VBAT voltage and current ripple at the maximum power transmitting phase, the test condition is VBAT=4.0V, VBAT maximum output current =2A, C1=100µF tantalum capacitor (ESR=0.7Ω) and C2=1µF. Max:400mV4.615ms577usIBATVBATBurst:1.6A Figure 3: Ripple in supply voltage during transmitting burst 3.3.2. Minimize supply voltage drop The power supply of the module is from a single voltage source of VBAT= 3.3V~4.6V. The GSM transmitting burst can cause obvious voltage drop at the supply voltage thus the power supply must be carefully designed and is capable of providing sufficient current up to 2A. For the VBAT input, a bypass capacitor of about 100 µF with low ESR is recommended. Multi-layer ceramic chip (MLCC) capacitor can provide the best combination of low ESR but small size may not be economical. A lower cost choice could be a 100 µF tantalum capacitor with low ESR. A small (0.1µF to 1µF) ceramic capacitor should be in parallel with the 100µF capacitor, which is
M80 Hardware Design M80_HD_V1.2 - 32 - illustrated in Figure 4. The capacitors should be placed close to the M80 VBAT pins. The PCB traces from the VBAT pads to the power source must be wide enough to ensure that there isn’t too much voltage drop occurring in the transmitting burst mode. The width of trace should be no less than 2mm and the principle of the VBAT trace is the longer, the wider. The VBAT voltage can be measured by oscilloscope. C2C1VBAT+ C1=100uF, C2=0.1uF~1uF Figure 4: Reference circuit of the VBAT input 3.3.3. Reference power design for module The power design for the module is very important and the circuit design of the power supply for the module largely depends on the power source. Figure 5 shows a reference design of +5V input power source. The part number of this LDO IC is MIC29302WU. The designed output for the power supply is 4.16V and the maximum load current is 3A, in order to prevent from outputting abnormal voltage, a zener voltage regulator is employed at the point of the output nearby the pin of VBAT. Some elements have to be taken into account during the component selection, such as reverse zener voltage is recommend 5.1V and the total dissipation is more than 1Watt. C1100uFC2MIC29032 U1IN OUTENGNDADJ2 4135DC_IN VBAT100nFC3100uFC4100nFC5 C633pFR110pFD1120K51KR2 Figure 5: Reference circuit of the source power supply input
M80 Hardware Design M80_HD_V1.2 - 33 - 3.3.4. Monitor power supply To monitor the supply voltage, you can use the “AT+CBC” command which includes three parameters: charging status, remaining battery capacity and voltage value (in mV). It returns the 0-100 percent of battery capacity and actual value measured between VBAT and GND. The voltage is automatically measured in period of 5s. The displayed voltage (in mV) is averaged over the last measuring period before the “AT+CBC” command is executed. For details, please refer to document [1]. 3.4. Power on and down scenarios 3.4.1. Power on The module can be turned on by PWRKEY pin. The module is set to autobauding mode (AT+IPR=0) in default configuration. In the autobauding mode, the URC “RDY” after powering on is not sent to host controller. When the module receives AT command, it will be powered on after a delay of 2 or 3 seconds. Host controller should firstly send an “AT” or “at” string in order that the module can detect baud rate of host controller, and it should send the second or the third “AT” or “at” string until receiving “OK” string from the module. Then an “AT+IPR=x;&W” should be sent to set a fixed baud rate for the module and save the configuration to flash memory of the module. After these configurations, the URC “RDY” would be received from the UART Port of the module every time when the module is powered on. Refer to section “AT+IPR” in document [1]. The hardware flow control is disabled in default configuration. In the simple UART port which means that only TXD, RXD, GND of the module is connected to host. CTS and RTS are pulled down internally by software. In this condition, the module can transmit and receive data freely. On the other side, if RTS, CTS connect to the host together with TXD, RXD, GND, whether or not to transmit and receive data depends on the level of RTS and CTS. Then whenever hardware flow is present or not, the URC “RDY” is sent to host controller in the fixed band rate. 3.4.1.1. Power on module using the PWRKEY pin Customer’s application can turn on the module by driving the pin PWRKEY to a low level voltage and after STATUS pin outputs a high level, PWRKEY pin can be released. Customer may monitor the level of the STATUS pin to judge whether the module is power-on or not. An open collector driver circuit is suggested to control the PWRKEY. A simple reference circuit is illustrated as below.
M80 Hardware Design M80_HD_V1.2 - 34 - Turn on pulsePWRKEY4.7K47K Figure 6: Turn on the module using driving circuit The other way to control the PWRKEY is using a button directly. A TVS component is indispensable to be placed nearby the button for ESD protection. When pressing the key, electrostatic strike may generate from finger. A reference circuit is shown in the following figure. S1PWRKEYTVS1Close to S1 Figure 7: Turn on the module using keystroke The power-on scenarios is illustrated as the following figure.
M80 Hardware Design M80_HD_V1.2 - 35 - EMERG_OFF(INPUT)VDD_EXT(OUTPUT)VIL<0.1*VBATVIH > 0.6*VBATVBATPWRKEY(INPUT)54msSTATUS(OUTPUT)800ms>1sOFF BOOTINGMODULE STATUS RUNNING21 Figure 8: Timing of turning on system ① Make sure that VBAT is stable before pulling down PWRKEY pin. The time between them is recommended 30ms. ② EMERG_OFF should be floated when it is unused Note: Customer can monitor the voltage level of the STATUS pin to judge whether the module is power-on. After the STATUS pin goes to high level, PWRKEY may be released. If the STATUS pin is ignored, pull the PWRKEY pin to low level for more than 1 second to turn on the module. 3.4.2. Power down The following procedures can be used to turn off the module:  Normal power down procedure: Turn off module using the PWRKEY pin  Normal power down procedure: Turn off module using command “AT+QPOWD”  Over-voltage or under-voltage automatic shutdown: Take effect when over-voltage or under-voltage is detected  Emergent power down procedure: Turn off module using the EMERG_OFF pin
M80 Hardware Design M80_HD_V1.2 - 36 - 3.4.2.1. Power down module using the PWRKEY pin Customer’s application can turn off the module by driving the PWRKEY to a low level voltage for certain time. The power-down scenario is illustrated in Figure 9. The power-down procedure causes the module to log off from the network and allows the software to save important data before completely disconnecting the power supply, thus it is a safe way. Before the completion of the power-down procedure, the module sends out the result code shown below: NORMAL POWER DOWN Note: This result code does not appear when autobauding is active and DTE and DCE are not correctly synchronized after start-up. The module is recommended to set a fixed baud rate. After that moment, no further AT commands can be executed. Then the module enters the POWER DOWN mode, only the RTC is still active. The POWER DOWN mode can also be indicated by the STATUS pin, which is a low level voltage in this mode. VBATPWRKEY(INPUT)STATUS(OUTPUT)EMERG_OFF(INPUT)Logout net about 2s to 12s0.6s<Pulldown<1s>160us Figure 9: Timing of turning off the module 3.4.2.2. Power down module using AT command Customer’s application can turn off the module via AT command “AT+QPOWD=1”. This command will let the module to log off from the network and allow the software to save important data before completely disconnecting the power supply, thus it is a safe way. Before the completion of the power-down procedure the module sends out the result code shown
M80 Hardware Design M80_HD_V1.2 - 37 - below: NORMAL POWER DOWN After that moment, no further AT commands can be executed. And then the module enters the POWER DOWN mode, only the RTC is still active. The POWER DOWN mode can also be indicated by STATUS pin, which is a low level voltage in this mode. Please refer to document [1] for details about the AT command “AT+QPOWD”. 3.4.2.3. Over-voltage or under-voltage automatic shutdown The module will constantly monitor the voltage applied on the VBAT, if the voltage is ≤ 3.5V, the following URC will be presented: UNDER_VOLTAGE WARNING If the voltage is ≥ 4.5V, the following URC will be presented: OVER_VOLTAGE WARNING The uncritical voltage range is 3.3V to 4.6V. If the voltage is > 4.6V or <3.3V, the module would automatically shutdown itself. If the voltage is <3.3V, the following URC will be presented: UNDER_VOLTAGE POWER DOWN If the voltage is >4.6V, the following URC will be presented: OVER_VOLTAGE POWER DOWN Note: These result codes don’t appear when autobauding is active and DTE and DCE are not correctly synchronized after start-up. The module is recommended to set to a fixed baud rate. After that moment, no further AT commands can be executed. The module logs off from network and enters POWER DOWN mode, and only RTC is still active. The POWER DOWN mode can also be indicated by the pin STATUS, which is a low level voltage in this mode. 3.4.2.4. Emergency shutdown using EMERG_OFF pin The module can be shut down by driving the pin EMERG_OFF to a low level voltage over 20ms and then releasing it. The EMERG_OFF line can be driven by an open-drain /collector driver or a button. The circuit is illustrated as the following figures.
M80 Hardware Design M80_HD_V1.2 - 38 - Emergency shutdown pulseEMERG_OFF4.7K47K Figure 10: Reference circuit for EMERG_OFF by using driving circuit S1EMERG_OFFTVS1Close to S1 Figure 11: Reference circuit for EMERG_OFF by using button 3.4.3. Restart 3.4.3.1. Restart module using the PWRKEY pin Customer’s application can restart the module by driving the PWRKEY to a low level voltage for a certain time, which is similar to the way of turning on module. Before restarting the module, at least 500ms should be delayed after detecting the low level of STATUS. The restart timing is illustrated as the following figure.
M80 Hardware Design M80_HD_V1.2 - 39 - STATUS（OUTPUT）HPWRKEY（INPUT）Delay > 0.5sTurn offPull down the PWRKEY to turn on the moduleRestart Figure 12: Timing of restarting system The module can also be restarted by the PWRKEY after emergency shutdown. PWRKEY（INPUT）Pulldown > 20ms Delay>2sEMERG_OFF（INPUT）STATUS（OUTPUT）6us Figure 13: Timing of restarting system after emergency shutdown
M80 Hardware Design M80_HD_V1.2 - 40 - 3.5. Charging interface M80 provides charging function for rechargeable Li-Ion or Lithium Polymer battery. It is introduced simply in this document. If you want to get more information about charging, please refer to document [13]. Table 8: Pin definition of the charging Item No. I/O Description. GATDRV 74 O Charge driving CHGLDO 73 I Charge power CHGDET 72 I Charging detect ISENSE 71 I Current sense BATSNS 70 I VBAT voltage sense 3.6. Power saving Upon system requirement, there are several actions to drive the module to enter low current consumption status. For example, “AT+CFUN” can be used to set module into minimum functionality mode and DTR hardware interface signal can be used to lead system to SLEEP mode. 3.6.1. Minimum functionality mode Minimum functionality mode reduces the functionality of the module to a minimum level, thus minimize the current consumption when the slow clocking mode is activated at the same time. This mode is set with the “AT+CFUN” command which provides the choice of the functionality levels <fun>=0，1，4.  0: minimum functionality  1: full functionality (default)  4: disable both transmitting and receiving of RF part If the module is set to minimum functionality by “AT+CFUN=0”, the RF function and SIM card function would be disabled. In this case, the UART port is still accessible, but all AT commands correlative with RF function or SIM card function will not be accessible. If the module has been set by “AT+CFUN=4”, the RF function will be disabled, the UART port is still active. In this case, all AT commands correlative with RF function will be not accessible. After the module is set by “AT+CFUN=0” or “AT+CFUN=4”, it can return to full functionality by
M80 Hardware Design M80_HD_V1.2 - 41 - “AT+CFUN=1”. For detailed information about “AT+CFUN”, please refer to document [1]. 3.6.2. SLEEP mode The SLEEP mode is disabled in default software configuration. Customer’s application can enable this mode by “AT+QSCLK=1”. On the other hand, the default setting is “AT+QSCLK=0” and in this mode, the module can’t enter SLEEP mode. When “AT+QSCLK=1” is sent to the module, customer’s application can control the module to enter or exit from the SLEEP mode through pin DTR. When DTR is set to high level, and there is no on-air or hardware interrupt such as GPIO interrupt or data on UART port, the module will enter SLEEP mode automatically. In this mode, the module can still receive voice, SMS or GPRS paging from network but the UART port is not accessible. 3.6.3. Wake up module from SLEEP mode  When the module is in the SLEEP mode, the following methods can wake up the module.  If the DTR Pin is set low, it would wake up the module from the SLEEP mode. The UART port will be active within 20ms after DTR is changed to low level.  Receive a voice or data call from network wakes up module.  Receiving an SMS from network wakes up module. Note: DTR pin should be held low level during communication between the module and DTE. 3.7. Summary of state transitions Table 9: Summary of state transition Current mode Next mode Power down Normal mode Sleep mode Power down Use PWRKEY Normal mode AT+QPOWD, use PWRKEY pin, or use EMERG_OFF pin Use AT command “AT+QSCLK=1” and pull DTR up Sleep mode Use PWRKEY pin, or use EMERG_OFF pin Pull DTR down or incoming call or SMS or GPRS
M80 Hardware Design M80_HD_V1.2 - 42 - 3.8. RTC backup The RTC (Real Time Clock) can be supplied by an external capacitor or battery (rechargeable or non-chargeable) through the pin VRTC. A 1.5 K resistor has been integrated in the module for current limiting. A coin-cell battery or a super-cap can be used to backup power supply for RTC. The following figures show various sample circuits for RTC backup. RTCCore1.5KMODULEVRTCNon-chargeableBackup Battery Figure 14: RTC supply from non-chargeable battery RTCCore1.5KMODULEVRTCRechargeableBackup Battery Figure 15: RTC supply from rechargeable battery RTCCore1.5KMODULEVRTC Large-capacitance Capacitor Figure 16: RTC supply from capacitor Coin-type rechargeable capacitor such as XH414H-IV01E from Seiko can be used.
M80 Hardware Design M80_HD_V1.2 - 43 - Figure 17: Seiko XH414H-IV01E Charge Characteristics 3.9. Serial interfaces The module provides three serial ports: UART Port, Debug Port and Auxiliary UART Port. The module is designed as a DCE (Data Communication Equipment), following the traditional DCE-DTE (Data Terminal Equipment) connection. Autobauding function supports baud rate from 4800bps to 115200bps. The UART Port:  TXD: Send data to RXD of DTE.  RXD: Receive data from TXD of DTE.  RTS: Requests to send.  CTS: Clear to send.  DTR: DTE is ready and inform DCE (this pin can wake the module up).  RI: Ring indicator (when the call, SMS, data of the module are coming, the module will output signal to inform DTE).  DCD: Data carrier detection (the validity of this pin demonstrates the communication link is set up). Note: The module disables hardware flow control by default. When hardware flow control is required, RTS and CTS should be connected to the host. AT command “AT+IFC=2,2” is used to enable hardware flow control. AT command “AT+IFC=0,0” is used to disable the hardware flow control. For more details, please refer to document [1].
M80 Hardware Design M80_HD_V1.2 - 44 - The Debug Port  DBG_TXD: Send data to the COM port of a debugging computer.  DBG_RXD: Receive data from the COM port of a debugging computer. The Auxiliary UART Port  TXD_AUX: Send data to the RXD of DTE.  RXD_AUX: Receive data from the TXD of DTE. The logic levels are described in the following table. Table 10: Logic levels of the UART interface Parameter Min Max Unit VIL 0 0.25×VDD_EXT V VIH 0.75×VDD_EXT VDD_EXT +0.3 V VOL 0.15×VDD_EXT V VOH 0.85×VDD_EXT V Table 11: Pin definition of the UART interfaces Interface Name Pin Description Debug Port DBG_RXD 43 Receive data of the debug port DBG_TXD 42 Transmit data of the debug port UART Port RI 46 Ring indicator RTS 51 Request to send CTS 48 Clear to send RXD 50 Receive data of the UART port TXD 49 Transmit data of the UART port DTR 47 Data terminal ready DCD 45 Data carrier detection Auxiliary UART Port RXD_AUX 41 Receive data of the Auxiliary UART TXD_AUX 40 Transmit data of the Auxiliary UART 3.9.1. UART Port 3.9.1.1 The features of UART Port.  Seven lines on UART interface  Contain data lines TXD and RXD, hardware flow control lines RTS and CTS, other control lines DTR, DCD and RI.  Used for AT command, GPRS data, CSD FAX, etc. Multiplexing function is supported on the
M80 Hardware Design M80_HD_V1.2 - 45 - UART Port. So far only the basic mode of multiplexing is available.  Support the communication baud rates as the following: 300,600,1200,2400,4800,9600,14400,19200,28800,38400,57600,115200.  The default setting is autobauding mode. Support the following baud rates for Autobauding function: 4800, 9600, 19200, 38400, 57600, 115200.  The module disables hardware flow control by default. AT command “AT+IFC=2,2” is used to enable hardware flow control. After setting a fixed baud rate or Autobauding, please send “AT” string at that rate. The UART port is ready when it responds “OK”. Autobauding allows the module to detect the baud rate by receiving the string “AT” or “at” from the host or PC automatically, which gives module flexibility without considering which baud rate is used by the host controller. Autobauding is enabled by default. To take advantage of the autobauding mode, special attention should be paid according to the following requirements: Synchronization between DTE and DCE: When DCE (the module) powers on with the autobauding enabled, it is recommended to wait 2 to 3 seconds before sending the first AT character. After receiving the “OK” response, DTE and DCE are correctly synchronized. If the host controller needs URC in the mode of autobauding, it must be synchronized firstly. Otherwise the URC will be discarded. Restrictions on autobauding operation:  The UART port has to be operated at 8 data bits, no parity and 1 stop bit (factory setting).  The “At” and “aT” commands can’t be used.  Only the strings “AT” or “at” can be detected (neither “At” nor “aT”).  The Unsolicited Result Codes like "RDY", "+CFUN: 1" and "+CPIN: READY” will not be indicated when the module is turned on with autobauding enabled and not be synchronized.  Any other Unsolicited Result Codes will be sent at the previous baud rate before the module detects the new baud rate by receiving the first “AT” or “at” string. The DTE may receive unknown characters after switching to new baud rate.  It is not recommended to switch to autobauding from a fixed baud rate.  If autobauding is active it is not recommended to switch to multiplex mode. Note: To assure reliable communication and avoid any problems caused by undetermined baud rate between DCE and DTE, it is strongly recommended to configure a fixed baud rate and save it instead of using autobauding after start-up. For more details, please refer to Section “AT+IPR” in document [1].
M80 Hardware Design M80_HD_V1.2 - 46 - 3.9.1.2. The connection of UART The connection between module and host using UART Port is very flexible. Three connection styles are illustrated as below. Reference design for Full-Function UART connection is shown as below when it is applied in modulation-demodulation. TXDRXDRTSCTSDTRDCDRITXDRXDRTSCTSDTRDCDRINGModule (DCE) PC (DTE)UART portUART PortGND GND Figure 18: Reference design for Full-Function UART Three-line connection is shown as below. Host (DTE)ControllerModule(DCE)TXDRXDGNDUART PORTRTS0RTXDRXDGND Figure 19: Reference design for UART Port UART Port with hardware flow control is shown as below. This connection will enhance the
M80 Hardware Design M80_HD_V1.2 - 47 - reliability of the mass data communication. Host (DTE) Controller Module(DCE)RTSCTSRTSCTSGNDRXDTXD TXDRXDGND Figure 20: Reference design for UART Port with hardware flow control 3.9.1.3. Software upgrade The TXD, RXD can be used to upgrade software. The PWRKEY pin must be pulled down before the software upgrade. Please refer to the following figures for software upgrade. IO Connector TXDRXDGNDPWRKEY Module (DCE) Serial portTXDRXDGNDPWRKEY Figure 21: Reference design software upgrade Note: The firmware of module might need to be upgraded due to certain reasons, it is recommended to reserve these pins in the host board for firmware upgrade. For detailed design, please refer to document [11].
M80 Hardware Design M80_HD_V1.2 - 48 - 3.9.2. Debug Port Debug Port  Two lines: DBG_TXD and DBG_RXD  It outputs log information automatically.  Debug Port is only used for software debugging and its baud rate must be configured as 460800bps. Debug ComputerTXDRXDGND Module (DCE) Debug portDBG_TXDDBG_RXD GND Figure 22: Reference design for Debug Port 3.9.3. Auxiliary UART Port Auxiliary UART Port  Two data lines: TXD_AUX and RXD_AUX  Auxiliary UART port is used for AT command only and doesn’t support GPRS data, CSD FAX, Multiplexing function etc.  Auxiliary UART port supports the communication baud rates as the following: 4800, 9600, 14400, 19200,28800,38400,57600,115200.  The default baud rate setting is 115200bps, and doesn’t support autobauding. The baud rate can be modified by AT+QSEDCB command. For more details, please refer to document [1].
M80 Hardware Design M80_HD_V1.2 - 49 - Module (DCE) Host (DTE) ControllerTXDRXDGNDTXD_AUXRXD_AUXGND Figure 23: Reference design for Auxiliary UART port 3.9.4. Level match The reference design of 3.3V level match is shown as below. If the host is a 3V system, please change the 5.6K resistor to 15K. MCU/ARMTXDRXD1KTXDRXDRTSCTSDTRRIRTSCTSGPIOEINTVoltage Level: 3.3VGNDVBATGPIO DCDMODULE1K1K1K1K5K6 5K6 5K61K1K Figure 24: Level match design for 3.3V system
M80 Hardware Design M80_HD_V1.2 - 50 - The reference design for 5V level match is shown as below. The connection of dotted line can be referred to the connection of solid line. Please pay attention to the direction of signal. Input dotted line of module should be referred to input solid line of the module. Output dotted line of module should be referred to output solid line of the module. As to the circuit below, VDD_EXT supplies power for the I/O of module, while VCC_MCU supplies power for the I/O of the MCU/ARM. MCU/ARMTXDRXD1KVDD_EXT4.7kVCC_MCU4.7k4.7k4.7kVDD_EXTTXDRXDRTSCTSDTRRIRTSCTSGNDVBATGPIO STATUSMODULEGPIOEINTVCC_MCUVoltage Level: 5V Figure 25: Level match design for 5V system
M80 Hardware Design M80_HD_V1.2 - 51 - The following circuit shows a reference design for the communication between module and PC. Since the electrical level of module is 2.8V, so a RS-232 level shifter must be used. 98765432115148911125761042622713182021161719222324312528GNDTO PC serial portSP32383VGNDGNDT5OUT/SHUTDOWNV+GNDV-VCCT4OUTT2OUTT3OUTT1OUTR3INR2INR1IN/STATUS3V ONLINER1OUTR2OUTR3OUT/R1OUTGND T5INT4INT3INT2INT1INC2+C2-C1-C1+MODULERXDDTRRTSRICTSTXDDCD Figure 26: Level match design for RS-232
M80 Hardware Design M80_HD_V1.2 - 52 - 3.10. Audio interfaces The module provides two analogy input channels and three analogy output channels. Table 12: Pin definition of Audio interface AIN1 and AIN2 can be used for input of microphone and line. An electret microphone is usually used. AIN1 and AIN2 are both differential input channels. AOUT1 is used for output of the receiver. This channel is typically used for a receiver built into a handset. AOUT1 channel is a differential channel. AOUT2 is typically used with earphone or speaker. It is a single-ended and mono channel. SPK2P and AGND can establish a pseudo differential mode. If customer needs to play Melody or Midi ring tone for incoming call, AOUT2 Channel should always be used. If it is used as a speaker, an amplifier should be employed also. AOUT3 is used for loud speaker output as it embedded an amplifier of class AB whose maximum drive power is 800mW. AOUT3 is a differential channel. Immediately playing Melody or Midi ring tone for incoming call is available in AOUT3. These three audio channels can be swapped by “AT+QAUDCH” command. For more details, please refer to document [1]. Use AT command “AT+QAUDCH” to select audio channel:  0--AIN1/AOUT1, the default value is 0.  1--AIN2/AOUT2  2--AIN2/AOUT3 For each channel, customer can use AT+QMIC to adjust the input gain level of microphone. Interface Name Pin Description AIN1/AOUT1 MIC1P 9 Channel one for Microphone positive input MIC1N 10 Channel one for Microphone negative input SPK1P 12 Channel one for Audio positive output SPK1N 11 Channel one for Audio negative output AIN2/AOUT2 MIC2P 7 Channel two for Microphone positive input MIC2N 8 Channel two for Microphone negative input SPK2P 5 Channel two for Audio positive output AGND 6 Cooperate with SPK2P AIN2/AOUT3 LOUDSPKP 14 Channel three for Audio positive output LOUDSPKN 13 Channel three for Audio negative output
M80 Hardware Design M80_HD_V1.2 - 53 - Customer can also use “AT+CLVL” to adjust the output gain level of receiver and speaker. “AT+QECHO” is used to set the parameters for echo cancellation control. “AT+QSIDET” is used to set the side-tone gain level. For more details, please refer to document [1]. Table 13: AOUT3 output characteristics Item Condition min type max unit RMS power 8ohm load VBAT=4.3v THD+N=1% 800 mW 8ohm load VBAT=3.7v THD+N=1% 700 mW 8ohm load VBAT=3.2v THD+N=1% 500 mW Gain adjustment range 0 18 dB Gain adjustment steps 3 dB 3.10.1. Decrease TDD noise and other noise The 33pF capacitor is applied for filtering out 900MHz RF interference when the module is transmitting at GSM900MHz. Without placing this capacitor, TDD noise could be heard. Moreover, the 10pF capacitor here is for filtering out 1800MHz RF interference. However, the resonant frequency point of a capacitor largely depends on the material and production technique. Therefore, customer would have to discuss with its capacitor vendor to choose the most suitable capacitor for filtering out GSM850MHz, GSM900MHz, DCS1800MHz and PCS1900MHz separately. The severity degree of the RF interference in the voice channel during GSM transmitting period largely depends on the application design. In some cases, GSM900 TDD noise is more severe; while in other cases, DCS1800 TDD noise is more obvious. Therefore, customer can have a choice based on test results. Sometimes, even no RF filtering capacitor is required. The capacitor which is used for filtering out RF noise should be close to RJ11 or other audio interfaces. Audio alignment should be as short as possible. In order to decrease radio or other signal interference, the position of RF antenna should be kept away from audio interface and audio alignment. Power alignment and audio alignment should not be parallel, and power alignment should be far away from audio alignment. The differential audio traces have to be placed according to the differential signal layout rule.
M80 Hardware Design M80_HD_V1.2 - 54 - 3.10.2. Microphone interfaces design AIN1 and AIN2 channels come with internal bias supply for external electret microphone. A reference circuit is shown in the following figure. 10pF 33pF33pF33pFClose to MicrophoneMICxPMICxNGNDGNDDifferential layoutModuleElectret MicrophoneGNDGND10pF10pFGNDGNDESD ANTIESDANTI Figure 27: Reference design for AIN1&AIN2 3.10.3. Receiver and speaker interface design SPK1PSPK1NDifferential layout10pF10pF33pF33pF33pFClose to receiverGNDGND10pFESD ANTIESD ANTIModule Figure 28: Reference design for AOUT1
M80 Hardware Design M80_HD_V1.2 - 55 - SPK2PAGNDDifferential layout10pF 33pFClose to receiver GNDESD ANTIModule22uF Figure 29: Handset interface design for AOUT2 SPK2PAGNDDifferential layout Amplifiercircuit 10pF10pF 33pF33pFClose to speakerGNDGNDESD ANTIESD ANTIModuleC2C1 Figure 30: Speaker interface design with an amplifier for AOUT2 Texas Instrument’s TPA6205A1is recommended for a suitable differential audio amplifier. There are plenty of excellent audio amplifiers in the market. Note: The value of C1 and C2 depends on the input impedance of audio amplifier.
M80 Hardware Design M80_HD_V1.2 - 56 - 3.10.4. Earphone interface design 1243Amphenol9001-8905-050SPK2PMIC2NMIC2P22uF68R33pFGND GNDAGNDClose to SocketDifferential layout33pFAGND33pF 10pFGND GNDGNDGNDAGNDModule4.7uF Figure 31: Earphone interface design 3.10.5. Loud speaker interface design LOUDSPKPLOUDSPKNDifferential layout10pF10pF 33pF33pFClose to speakerGNDGND100pFESD ANTIESD ANTIModule0R0R Figure 32: Loud speaker interface design
M80 Hardware Design M80_HD_V1.2 - 57 - 3.10.6. Audio characteristics Table 14: Typical electret microphone characteristics Parameter Min Typ Max Unit Working Voltage 1.2 1.5 2.0 V Working Current 200 500 uA External Microphone Load Resistance 2.2 k Ohm Table 15: Typical speaker characteristics Parameter Min Typ Max Unit Normal Output (AOUT1) Single Ended Load Resistance 28 32 Ohm Ref level 0 2.4 Vpp Differential Load Resistance 28 32 Ohm Ref level 0 4.8 Vpp Auxiliary Output (AOUT2) Single Ended Load Resistance 16 32 Load Resistance Ref level 0 2.4 Vpp Output (AOUT3) Differential Load Resistance 8 Load Resistance Ref level 0 2*VBAT Vpp 3.11. SIM card interface 3.11.1. SIM card application The SIM interface supports the functionality of the GSM Phase 1 specification and also supports the functionality of the new GSM Phase 2+ specification for FAST 64 kbps SIM card, which is intended for use with a SIM application Tool-kit. The SIM interface is powered from an internal regulator in the module. Both 1.8V and 3.0V SIM Cards are supported.
M80 Hardware Design M80_HD_V1.2 - 58 - Table 16: Pin definition of the SIM interface In Figure 33, the pin SIM_PRESENCE is used to detect whether the tray of the Molex SIM socket, which is used for holding SIM card, is present in the card socket. When the tray is inserted in the socket, SIM_PRESENCE is at low level. Regardless of whether the SIM card is in the tray or not, the change of SIM_PRESENCE level from high to low level inspires the module to reinitialize SIM card. In default configuration, SIM card detection function is disabled. Customer’s application can use “AT+QSIMDET=1,0 ” to switch on and “AT+QSIMDET=0,0 ” to switch off the SIM card detection function. For detail of this AT command, please refer to document [1]. When “AT+QSIMDET=1,0” is set and the tray with SIM card is removed from SIM socket, the following URC will be presented. +CPIN: NOT READY When the tray with SIM card is inserted into SIM socket again and the module finishes re-initialization SIM card, the following URC will be presented. Call Ready ModuleSIM_VDDSIM_RSTSIM_CLKSIM_DATASIM_PRESENCE22R22R22RVCCRSTCLK IOVPPGNDVDD_EXT10K 100nF SIM_CARDGNDGNDESDA6V8V6GNDPRESENCE Figure 33: Reference circuit of the 8 pins SIM card Name Pin Description SIM1_VDD 56 Supply power for SIM Card. Automatic detection of SIM card voltage. 3.0V±10% and 1.8V±10%. Maximum supply current is around 10mA. SIM1_DATA 54 SIM Card data I/O SIM1_CLK 55 SIM Card clock SIM1_RST 53 SIM Card reset SIM_PRESENCE 57 SIM Card detect SIM1_GND 52 SIM Card ground
M80 Hardware Design M80_HD_V1.2 - 59 - Note: Please do not use “AT+QSIMDET=1,1” which causes to initialize SIM card when Figure 33 circuit is adopted. If customer doesn’t need the SIM card detection function, keep SIM_PRESENCE open. The reference circuit using a 6-pin SIM card socket is illustrated as the following figure. ModuleSIM_VDDSIM_RSTSIM_CLKSIM_DATA 22R22R22RVCCRSTCLK IOVPPGND100nF SIM_CARDGNDGNDESDA6V8V6GND Figure 34: Reference circuit of the 6 pins SIM card  In order to enhance the reliability and availability of the SIM card in the customer’s application. Please follow the below criterion in the SIM circuit design  Keep layout of SIM card as close as possible to the module. Assure the possibility of the length of the trace is less than 20cm.  Keep SIM card signal away from RF and VBAT alignment.  Assure the ground between module and SIM cassette short and wide. Keep the width of ground no less than 0.5mm to maintain the same electric potential. The decouple capacitor of SIM_VDD is less than 1uF and must be near to SIM cassette.  To avoid cross talk between SIM1_DATA and SIM1_CLK. Keep them away with each other and shield them with surrounded ground  In order to offer good ESD protection, it is recommended to add TVS such as WILL (http://www.willsemi.com) ESDA6V8AV6. The 22Ω resistors should be added in series between the module and the SIM card so as to suppress the EMI spurious transmission and enhance the ESD protection. Please to be noted that the SIM peripheral circuit should be close to the SIM card socket. 3.11.2. 6 Pin SIM cassette For 6-pin SIM card holder, it is recommended to use Amphenol C707 10M006 512 2. Please visit http://www.amphenol.com for more information.
M80 Hardware Design M80_HD_V1.2 - 60 - Figure 35: Amphenol C707 10M006 512 2 SIM card holder Table 17: Pin description of Amphenol SIM card holder Name Pin Description SIM_VDD C1 SIM Card Power Supply SIM_RST C2 SIM Card Reset SIM_CLK C3 SIM Card Clock GND C5 Ground VPP C6 Not Connect SIM_DATA C7 SIM Card data I/O 3.11.3. 8 Pin SIM cassette For 8-pin SIM card holder, it is recommended to use Molex 91228. Please visit http://www.molex.com for more information.
M80 Hardware Design M80_HD_V1.2 - 61 - Figure 36: Molex 91228 SIM card holder Table 18: Pin description of Molex SIM card holder Name Pin Description SIM_VDD C1 SIM Card Power supply SIM_RST C2 SIM Card Reset SIM_CLK C3 SIM Card Clock SIM_PRESENCE C4 SIM Card Presence Detection GND C5 Ground VPP C6 Not Connect SIM_DATA C7 SIM Card Data I/O SIM_DETECT C8 Pulled down GND with external circuit. When the tray is present, C4 is connected to C8.
M80 Hardware Design M80_HD_V1.2 - 62 - 3.12. SD card interface The module provides SD card interface that support many types of memory, such as Memory Stick, SD/MCC card and T-Flash or Micro SD card. The following are the main features of SD card interface.  Only supports 1bit serial mode.  Does not support the SPI mode SD/MMC memory card.  Does not support multiple SD memory cards.  Does not support hot plug.  Up to 26MHz data rate in serial mode.  Up to 32GB maximum memory card capacity. With interface features and reference circuit of SD card shown in Figure 37, the users can easily design the SD card application circuit to enhance the memory capacity of the module. The module can record and store the audio file to the SD card, and play the audio files in SD card as well. Table 19: Pin definition of the SD card interface ModuleSD_DATA0SD_CLKSD_CMDDATA2DATA1DATA0CD/DATA3CMDVDDCLKVSS47K47K 47K4.7uF 0.1nFVDD_EXT33R33R33RMicro SD Socket12345678 Figure 37: Reference circuit of SD card Name Pin Description SD_DATA 36 Data output and input signal of SD card SD_CLK 35 Clock signal of SD card output SD_CMD 34 Command signal of SD card output
M80 Hardware Design M80_HD_V1.2 - 63 - Table 20: Pin name of the SD card and Micro SD card In SD card interface designing, in order to ensure good communication performance with SD card, the following design principles should be complied with.  Route SD card trace as short as possible.  In order to offer good ESD protection, it is recommended to add TVS on signals with the capacitance is less than 15pF.  Reserve external pull-up resistor for other data lines except the DATA0.  The SD_CLK and SD_DATA line must be shielded by GND in order to avoid interference. Pin NO. Pin name of SD card Pin name of T-Flash(Micro SD) card 1 CD/DATA3 DATA2 2 CMD CD/DATA3 3 VSS1 CMD 4 VDD VDD 5 CLK CLK 6 VSS2 VSS 7 DATA0 DATA0 8 DATA1 DATA1 9 DATA2
M80 Hardware Design M80_HD_V1.2 - 64 - 3.13. PCM interface M80 supports PCM interface. It is used for digital audio transmission between the module and the customer’s device. This interface is composed of PCM_CLK, PCM_SYNC, PCM_IN and PCM_OUT signal lines. Pulse-code modulation (PCM) is a converter that changes the consecutive analog audio signal to discrete digital signal. The whole procedure of Pulse-code modulation contains sampling, quantizing and encoding. Table 21: Pin definition of PCM interface Name Pin NO. I/O Description Note PCM_CLK 19 O PCM clock PCM_IN 18 I PCM data input PCM_OUT 20 O PCM data output PCM_SYNC 21 O PCM frame synchronization 3.13.1. Configuration M80 supports 13bit line code PCM format. The sample rate is 8 KHz, the clock source is 256 KHz, and the module can only act as master mode. The PCM interfaces support long and short synchronization simultaneously. It only supports MSB first. For more detailed information, please see the table below. Table 22: Configuration PCM Line interface format Line Data length Line：13bit Sample rate 8KHz PCM clock/synchronization source PCM master mode: clock and synchronization is generated by module PCM synchronization rate 8KHz PCM clock rate PCM master mode:256 KHz(line) PCM synchronization format Long/short synchronization PCM data ordering MSB first
M80 Hardware Design M80_HD_V1.2 - 65 - 3.13.2. Timing The sample rate of the PCM interface is 8 KHz and the clock source is 256 KHz, so every frame contains 32 bits data, since M80 supports 13bit line code PCM format, the left 19 bits is invalid. M80 support short and long synchronization format. The following diagram shows the timing of short and long synchronization format. The synchronization length in long synchronization format can be programmed by software from one bit to eight bits. 13 12 11 10 9 8 7 6 5 4 3 2 113 12 11 10 9 8 7 6 5 4 3 2 1PCM_CLKPCM_SYNCPCM_OUTPCM_INMSBMSB Figure 38: Long synchronization diagram PCM_CLKPCM_SYNCPCM_OUTPCM_IN13 12 11 10 9 8 7 6 5 4 3 2 113 12 11 10 9 8 7 6 5 4 3 2 1MSBMSB Figure 39: Short synchronization diagram
M80 Hardware Design M80_HD_V1.2 - 66 - 3.13.3. Reference design As M80 only acts as a master, the module provides synchronization and clock source. The reference design is shown as below. PCM_SYNCPCM_CLKPCM_OUTPCM_INPCM_SYNCPCM_CLKPCM_INPCM_OUTModule (Master)Customer device (Slave) Figure 40: Reference design for PCM 3.13.4. AT command “AT+QPCMON” can configure PCM parameter. AT command format is shown as below: AT+QPCMON= mode, Sync_Type, Sync_Length, SignExtension, MSBFirst. Table 23：AT command description Parameter scope Description Mode 0~2 0：Close PCM 1：Open PCM 2：Open PCM when audio talk is set up Sync_Type 0~1 0：Short synchronization 1：Long synchronization Sync_Length 1~8 Programmed from one bit to eight bit SignExtension 0~1 Not supported MSBFirst 0~1 0：MSB first 1：Not supported
M80 Hardware Design M80_HD_V1.2 - 67 - 3.14. ADC The module provides two ADC to measure the value of voltage. The command “AT+QADC” can read the voltage value applied on ADC0 pin, while AT command “AT+QEADC” can read the voltage value applied on ADC1 pin. For details of this AT command, please refer to document [1]. In order to improve the accuracy of ADC, the layout of ADC should be surrounded by ground. Table 24: Pin definition of the ADC Name Pin Description ADC0 2 Analog to digital converter. ADC1 1 Analog to digital converter. Table 25: Characteristics of the ADC Item Min Typ Max Units Voltage Range 0 2.8 V ADC Resolution 10 bits ADC Accuracy 2.7 mV 3.15. Behaviors of the RI Table 26: Behaviors of the RI State RI response Standby HIGH Voice calling Change to LOW, then: 1. Change to HIGH when call is established. 2. Use ATH to hang up the call, RI changes to HIGH. 3. Calling part hangs up, RI changes to HIGH first, and changes to LOW for 120ms indicating “NO CARRIER” as an URC, then changes to HIGH again. 4. Change to HIGH when SMS is received. Data calling Change to LOW, then： 1. Change to HIGH when data connection is established. 2. Use ATH to hang up the data calling, RI changes to HIGH. 3. Calling part hangs up, RI changes to HIGH first, and changes to LOW for 120ms indicating “NO CARRIER” as an URC, then changes to HIGH again. 4. Change to HIGH when SMS is received.
M80 Hardware Design M80_HD_V1.2 - 68 - SMS When a new SMS comes, the RI changes to LOW and holds low level for about 120 ms, then changes to HIGH. URC Certain URCs can trigger 120ms low level on RI. For more details, please refer to the document [1] If the module is used as a caller, the RI would maintain high except the URC or SMS is received. On the other hand, when it is used as a receiver, the timing of the RI is shown below. RIIdle RingOff-hook by “ATA”. On-hook by “ATH”. SMS received. HIGHLOW Figure 41: RI behavior of voice calling as a receiver RIIdle RingData calling establish. On-hook by “ATH”. SMS receivedHIGHLOW Figure 42: RI behavior of data calling as a receiver RIIdle Calling On-hookTalkingHIGHLOWIdle Figure 43: RI behavior as a caller
M80 Hardware Design M80_HD_V1.2 - 69 - RIIdle or talking URC or SMS Received HIGHLOW120ms Figure 44: RI behavior of URC or SMS received
M80 Hardware Design M80_HD_V1.2 - 70 - 3.16. Network status indication The NETLIGHT signal can be used to drive a network status indicator LED. The working state of this pin is listed in the following table. Table 27: Working state of the NETLIGHT State Module function Off The module is not running. 64ms On/ 800ms Off The module is not synchronized with network. 64ms On/ 2000ms Off The module is synchronized with network. 64ms On/ 600ms Off GPRS data transfer is ongoing. A reference circuit is shown as below. Module300R4.7K47KVBATNETLIGHT Figure 45: Reference design for NETLIGHT 3.17. Operating status indication The STATUS pin is set as an output pin and can be used to judge whether module is power-on. In customer’s design, this pin can be connected to a GPIO of DTE or be used to drive an LED in order to judge the module’s operation status. A reference circuit is shown in Figure 46. Table 28: Pin definition of the STATUS Name Pin Description STATUS 16 Indicate the module’s operating status
M80 Hardware Design M80_HD_V1.2 - 71 - Figure 46: Reference design for STATUS Module 300R4.7K47KVBATSTATUS
M80 Hardware Design M80_HD_V1.2 - 72 - 4. Antenna interface The Pin 63 is the RF antenna pad. The RF interface has an impedance of 50Ω. Table 29: Pin definition of the RF_ANT 4.1. RF reference design The reference design for RF is shown as below. RF_ANT0RMODULE NMNM Figure 47: Reference design for RF M80 provides an RF antenna PAD for customer’s antenna connection. The RF trace in host PCB connected to the module RF antenna pad should be micro-strip line or other types of RF trace, whose characteristic impendence should be close to 50Ω. M80 comes with grounding pads which are next to the antenna pad in order to give a better grounding. Besides, a ∏ type match circuit is suggested to be used to adjust the RF performance. To minimize the loss on the RF trace and RF cable, take design into account carefully. It is recommended that the insertion loss should meet the following requirements:  GSM850/EGSM900 is <1dB. Name Pin Description GND 62 Ground GND 61 Ground RF_ANT 63 RF antenna pad GND 66 Ground GND 65 Ground GND 64 Ground
M80 Hardware Design M80_HD_V1.2 - 73 -  DCS1800/PCS1900 is <1.5dB. 4.2. RF output power Table 30: The module conducted RF output power Frequency Max Min GSM850 33dBm ±2dB 5dBm±5dB EGSM900 33dBm ±2dB 5dBm±5dB DCS1800 30dBm ±2dB 0dBm±5dB PCS1900 30dBm ±2dB 0dBm±5dB Note: In GPRS 4 slots TX mode, the max output power is reduced by 2.5dB. This design conforms to the GSM specification as described in section 13.16 of 3GPP TS 51.010-1. 4.3. RF receiving sensitivity Table 31: The module conducted RF receiving sensitivity Frequency Receive sensitivity GSM850 < -108.5dBm EGSM900 < -108.5dBm DCS1800 < -108.5dBm PCS1900 < -108.5dBm 4.4. Operating frequencies Table 32: The module operating frequencies Frequency Receive Transmit ARFCH GSM850 869~894MHz 824~849MHz 128~251 EGSM900 925~960MHz 880~915MHz 0~124， 975~1023 DCS1800 1805~1880MHz 1710~1785MHz 512~885 PCS1900 1930~1990MHz 1850~1910MHz 512~810 4.5. RF cable soldering Soldering the RF cable to RF pad of module correctly will reduce the loss on the path of RF, please refer to the following example of RF soldering.
M80 Hardware Design M80_HD_V1.2 - 74 - Figure 48: RF soldering sample
M80 Hardware Design M80_HD_V1.2 - 75 - 5. Electrical, reliability and radio characteristics 5.1. Absolute maximum ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of module are listed in the following table: Table 33: Absolute maximum ratings Parameter Min Max Unit VBAT -0.3 +4.73 V Peak current of power supply 0 2 A RMS current of power supply (during one TDMA- frame) 0 0.7 A Voltage at digital pins -0.3 3.3 V Voltage at analog pins -0.3 3.0 V Voltage at digital/analog pins in POWER DOWN mode -0.25 0.25 V 5.2. Operating temperature The operating temperature is listed in the following table: Table 34: Operating temperature Parameter Min Typ Max Unit Normal Temperature -35 +25 +80 ℃ Restricted Operation1) -45 ~ -35 +80 ~ +851) ℃ Storage Temperature -45 +90 ℃ 1) When the module exceeds the temperature range, the deviation from the GSM specification may occur. For example, the frequency error or the phase error will be increased.
M80 Hardware Design M80_HD_V1.2 - 76 - 5.3. Power supply ratings Table 35: The module power supply ratings Parameter Description Conditions Min Typ Max Unit VBAT Supply voltage Voltage must stay within the min/max values, including voltage drop, ripple, and spikes. 3.3 4.0 4.6 V Voltage drop during transmitting burst Maximum power control level on GSM850 and GSM900. 400 mV Voltage ripple Maximum power control level on GSM850 and GSM900 @ f<200kHz @ f>200kHz 50 2 mVmV IVBAT Average supply current POWER DOWN mode SLEEP mode @ DRX=5 30 1.1 uA mA Minimum functionality mode AT+CFUN=0 IDLE mode SLEEP mode AT+CFUN=4 IDLE mode SLEEP mode 13 0.83 13 0.83 mA mA mA mA IDLE mode GSM850/EGSM 900 DCS1800/PCS1900 13 13 mA mA TALK mode GSM850/EGSM 9001) DCS1800/PCS19002) 209/208 191/202 mA mA DATA mode, GPRS (3 Rx,2Tx) GSM850/EGSM 9001) DCS1800/PCS19002) 435/400 313/337 mA mA DATA mode, GPRS(2 Rx,3Tx) GSM850/EGSM 9001) DCS1800/PCS19002) 605/558 399/460 mA mA DATA mode, GPRS (4 Rx,1Tx) GSM850/EGSM 9001) DCS1800/PCS19002) 265/240 200/212 mA mA DATA mode, GPRS (1Rx,4Tx)
M80 Hardware Design M80_HD_V1.2 - 77 - GSM850/EGSM 9001) DCS1800/PCS19002) 615/560 420/470 mA mA Peak supply current (during transmission slot) Maximum power control level on GSM850 and GSM900. 1.6 1.8 A 1) Power control level PCL 5 2) Power control level PCL 0 5.4. Current consumption The values of current consumption are shown as below. Table 36: The module current consumption Condition Current Consumption Voice Call GSM850 @power level #5 <300mA,Typical 209mA @power level #12,Typical 96mA @power level #19,Typical 73mA GSM900 @power level #5 <300mA,Typical 208mA @power level #12,Typical 96mA @power level #19,Typical 73mA DCS1800 @power level #0 <250mA,Typical 191mA @power level #7,Typical 93mA @power level #15,Typical 70mA PCS1900 @power level #0 <250mA,Typical 202mA @power level #7,Typical 95mA @power level #15,Typical 71mA GPRS Data DATA mode, GPRS ( 1 Rx,1 Tx ) CLASS 12 GSM850 @power level #5 <350mA,Typical 199mA @power level #12,Typical 87mA @power level #19,Typical 63mA EGSM 900 @power level #5 <350mA,Typical 200mA @power level #12,Typical 96mA @power level #19,Typical 70mA DCS 1800 @power level #0 <300mA,Typical 184mA @power level #7,Typical 82mA @power level #15,Typical 66mA PCS 1900 @power level #0 <300mA,Typical 192mA @power level #7,Typical 82mA
M80 Hardware Design M80_HD_V1.2 - 78 - @power level #15,Typical 66mA DATA mode, GPRS ( 3 Rx, 2 Tx ) CLASS 12 GSM850 @power level #5 <550mA,Typical 435mA @power level #12,Typical 158mA @power level #19,Typical 99mA EGSM 900 @power level #5 <550mA,Typical 400mA @power level #12,Typical 150mA @power level #19,Typical 97mA DCS 1800 @power level #0 <450mA,Typical 313mA @power level #7,Typical 130mA @power level #15,Typical 92mA PCS 1900 @power level #0 <450mA,Typical 337mA @power level #7,Typical 140mA @power level #15,Typical 94mA DATA mode, GPRS ( 2 Rx, 3 Tx ) CLASS 12 GSM850 @power level #5 <640mA,Typical 605mA @power level #12,Typical 195mA @power level #19,Typical 107mA EGSM 900 @power level #5 <600mA,Typical 558mA @power level #12,Typical 185mA @power level #19,Typical 106mA DCS 1800 @power level #0 <490mA,Typical 399mA @power level #7,Typical 150mA @power level #15,Typical 94mA PCS 1900 @power level #0 <480mA,Typical 460mA @power level #7,Typical 166mA @power level #15,Typical 98mA DATA mode, GPRS ( 4 Rx,1 Tx ) CLASS 12 GSM850 @power level #5 <350mA,Typical 265mA @power level #12,Typical 122mA @power level #19,Typical 93mA EGSM 900 @power level #5 <350mA,Typical 240mA @power level #12,Typical 115mA @power level #19,Typical 90mA DCS 1800 @power level #0 <300mA,Typical 200mA @power level #7,Typical 107mA @power level #15,Typical 89mA PCS 1900 @power level #0 <300mA,Typical 212mA @power level #7,Typical 118mA @power level #15,Typical 90mA DATA mode, GPRS ( 1 Rx, 4 Tx ) CLASS 12 GSM850 @power level #5 <660mA,Typical 615mA @power level #12,Typical 232mA
M80 Hardware Design M80_HD_V1.2 - 79 - @power level #19,Typical 118mA EGSM 900 @power level #5 <660mA,Typical 560mA @power level #12,Typical 215mA @power level #19,Typical 114mA DCS 1800 @power level #0 <530mA,Typical 420mA @power level #7,Typical 173mA @power level #15,Typical 97mA PCS 1900 @power level #0 <530mA,Typical 470mA @power level #7,Typical 192mA @power level #15,Typical 101mA Note: GPRS Class 12 is the default setting. The module can be configured from GPRS Class 1 to Class 12 by “AT+QGPCLASS”. Setting to lower GPRS class would make it easier to design the power supply for the module. 5.5. Electro-static discharge Although the GSM engine is generally protected against Electrostatic Discharge (ESD), ESD protection precautions should still be emphasized. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any applications using the module. The measured ESD values of module are shown in the following table. Table 37: The ESD endurance (Temperature:25℃,Humidity:45 %) Tested point Contact discharge Air discharge VBAT,GND ±5KV ±10KV RF_ANT ±5KV ±10KV PWRKEY STATUS ±4KV ±8KV SIM1_VDD, SIM1_DATA SIM1_CLK, SIM1_RST ±4KV ±8KV TXD, RXD RTS, CTS, DTR ±4KV ±8KV Others ±0.5KV ±1KV
M80 Hardware Design M80_HD_V1.2 - 80 - 6. Mechanical dimensions This chapter describes the mechanical dimensions of the module. 6.1. Mechanical dimensions of module Figure 49: M80 top and side dimensions（Unit: mm）
M80 Hardware Design M80_HD_V1.2 - 81 - Figure 50: M80 bottom dimensions（Unit: mm）
M80 Hardware Design M80_HD_V1.2 - 82 - 6.2. Footprint one of recommendation frame linesilkscreen Figure 51: Footprint one of recommendation（Unit: mm）
M80 Hardware Design M80_HD_V1.2 - 83 - 6.3. Footprint two of recommendation silkscreenframe line Figure 52: Footprint two of recommendation（Unit: mm） Note：In order to maintain the module, keep about 3mm away between the module and other components in the host PCB.
M80 Hardware Design M80_HD_V1.2 - 84 - 6.4. Top view of the module Figure 53: Top view of the module
M80 Hardware Design M80_HD_V1.2 - 85 - 6.5. Bottom view of the module Figure 54: Bottom view of the module
M80 Hardware Design M80_HD_V1.2 - 86 - 7. Storage and manufacturing 7.1. Storage M80 is distributed in vacuum-sealed bag. The restriction of storage condition is shown as below. Shelf life in sealed bag: 12 months at <40℃/ 90%RH After this bag is opened, devices that will be subjected to reflow solder or other high temperature process must be:  Mounted within 72 hours at factory conditions of ≤30℃/60% RH  Stored at <10% RH Devices require bake before mounting, if:  Humidity indicator card is >10% when read at 23℃±5 ℃  Mounted exceed 72 hours at factory conditions of ≤30℃/60% RH If baking is required, devices may be baked for 48 hours at 125℃±5 ℃ Note: As plastic container cannot be subjected to high temperature, devices must be removed prior to high temperature (125℃) bake. If shorter bake times are desired, refer to IPC/JEDECJ-STD-033 for bake procedure.
M80 Hardware Design M80_HD_V1.2 - 87 - 7.2. Soldering The squeegee should push the paste on the surface of the stencil that makes the paste fill the stencil openings and penetrate to the PCB. The force on the squeegee should be adjusted so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the thickness of stencil at the hole of the module pads should be 0.13mm for M80. Figure 55: Paste application Suggest peak reflow temperature is from 235 ºC to 245ºC (for SnAg3.0Cu0.5 alloy). Absolute max reflow temperature is 260ºC. To avoid damage to the module when it was repeatedly heated, it is suggested that the module should be mounted after the first panel has been reflowed. The following picture is the actual diagram which we have operated.
M80 Hardware Design M80_HD_V1.2 - 88 - Time(s)50 100 150 200 250 30050100150200250 160℃ 200℃217070s~120s40s~60sBetween 1~3℃/SPreheat Heating Cooling℃sLiquids Temperature Figure 56: Ramp-Soak-Spike reflow profile 7.3. Packaging M80 modules are distributed in trays of 20 pieces each. This is especially suitable for the M80 according to SMT processes requirements. The trays are stored inside a vacuum-sealed bag which is ESD protected. It should not be opened until the devices are ready to be soldered onto the application. Figure 57: Module tray
M80 Hardware Design M80_HD_V1.2 - 89 - Appendix A: GPRS coding schemes Four coding schemes are used in GPRS protocol. The differences between them are shown in Table 38. Table 38: Description of different coding schemes Scheme Code rate USF Pre-coded USF Radio Block excl.USF and BCS BCS Tail Coded bits Punctured bits Data rate Kb/s CS-1 1/2 3 3 181 40 4 456 0 9.05 CS-2 2/3 3 6 268 16 4 588 132 13.4 CS-3 3/4 3 6 312 16 4 676 220 15.6 CS-4 1 3 12 428 16 - 456 - 21.4 Radio block structure of CS-1, CS-2 and CS-3 is shown as Figure 59: Figure 58: Radio block structure of CS-1, CS-2 and CS-3 Radio block structure of CS-4 is shown as Figure 60: Figure 59: Radio block structure of CS-4 Block code No coding 456 bits USF BCS Radio Block Rate 1/2 convolutional coding Puncturing 456 bits USF BCS Radio Block
M80 Hardware Design M80_HD_V1.2 - 90 - Appendix B: GPRS multi-slot classes Twenty-nine classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot classes are product dependant, and determine the maximum achievable data rates in both the uplink and downlink directions. Written as 3+1 or 2+2, the first number indicates the amount of downlink timeslots, while the second number indicates the amount of uplink timeslots. The active slots determine the total number of slots the GPRS device can use simultaneously for both uplink and downlink communications. The description of different multi-slot classes is shown in Table 39. Table 39: GPRS multi-slot classes Multislot class Downlink slots Uplink slots Active slots 1 1 1 2 2 2 1 3 3 2 2 3 4 3 1 4 5 2 2 4 6 3 2 4 7 3 3 4 8 4 1 5 9 3 2 5 10 4 2 5 11 4 3 5 12 4 4 5
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