Quectel Wireless Solutions 201202M10 GSM/GPRS Module User Manual M10 HD V3 0x

Quectel Wireless Solutions Company Limited GSM/GPRS Module M10 HD V3 0x

Users Manual

M10 Quectel Cellular Engine Hardware Design M10_HD_V3.0
M10 Hardware Design M10_HD_V3.0 - 1 - Document Title M10 Hardware Design Revision 3.0 Date 2012-03-02 Status Released Document Control ID M10_HD_V3.0 General Notes Quectel offers this information as a service to its customers, to support application and engineering efforts that use the products designed by Quectel. The information provided is based upon requirements specifically provided for customers of Quectel. Quectel has not undertaken any independent search for additional information, relevant to any information that may be in the customer’s possession. Furthermore, system validation of this product designed by Quectel within a larger electronic system remains the responsibility of the customer or the customer’s system integrator. All specifications supplied herein are subject to change. Copyright This document contains proprietary technical information of Quectel Co., Ltd. Copying of this document, distribution to others, and communication of the contents thereof, are forbidden without permission. Offenders are liable to the payment of damages. All rights are reserved in the event of a patent grant or registration of a utility model or design. All specification supplied herein are subject to change without notice at any time. Copyright © Quectel Wireless Solutions Co., Ltd. 2012
M10 Hardware Design M10_HD_V3.0 - 2 - Contents Contents ............................................................................................................................................ 2 Table Index ........................................................................................................................................ 4 Figure Index ...................................................................................................................................... 5 0. Revision history ............................................................................................................................ 7 1. Introduction ................................................................................................................................... 9 1.1. Related documents .............................................................................................................. 9 1.2. Terms and abbreviations .................................................................................................... 10 1.3. Directives and standards .................................................................................................... 12 1.3.1. FCC Statement ........................................................................................................ 12 1.3.2. FCC Radiation exposure statement ......................................................................... 12 1.3.3. Industry Canada licence .......................................................................................... 12 1.4. Safety cautions .................................................................................................................. 13 2. Product concept ........................................................................................................................... 15 2.1. Key features ...................................................................................................................... 15 2.2. Functional diagram ............................................................................................................ 17 2.3. Evaluation board ............................................................................................................... 18 3. Application interface ................................................................................................................... 19 3.1. Pin of module .................................................................................................................... 19 3.1.1. Pin assignment ......................................................................................................... 19 3.1.2. Pin description ......................................................................................................... 20 3.2. Operating modes ............................................................................................................... 25 3.3. Power supply ..................................................................................................................... 26 3.3.1. Power supply pins.................................................................................................... 27 3.3.2. Minimizing supply voltage drop.............................................................................. 27 3.3.3. Monitor power supply ............................................................................................. 28 3.4. Power up and down scenarios ........................................................................................... 28 3.4.1. Power on .................................................................................................................. 28 3.4.2. Power down ............................................................................................................. 31 3.4.3. Restart module using the PWRKEY pin.................................................................. 35 3.5. Power saving ..................................................................................................................... 36 3.5.1. Minimum functionality mode .................................................................................. 36 3.5.2. SLEEP mode (slow clock mode) ............................................................................. 36 3.5.3. Wake up module from SLEEP mode ...................................................................... 37 3.6. Summary of state transitions (except SLEEP mode) ......................................................... 37 3.7. RTC backup ...................................................................................................................... 37 3.8. Serial interfaces ................................................................................................................. 39 3.8.1. UART Port .............................................................................................................. 40 3.8.2. Debug Port ............................................................................................................... 43 3.8.3. UART Port 3 ........................................................................................................... 44 3.8.4. UART Application .................................................................................................. 45 3.9. Audio interfaces................................................................................................................. 46
M10 Hardware Design M10_HD_V3.0 - 3 - 3.9.1. Decrease TDD noise and other noise ...................................................................... 47 3.9.2. Microphone interfaces configuration ....................................................................... 48 3.9.3. Receiver and speaker interface configuration .......................................................... 49 3.9.4. Earphone interface configuration ............................................................................ 51 3.10. SIM card interface ........................................................................................................... 52 3.10.1. SIM card application ............................................................................................. 52 3.10.2. Design considerations for SIM card holder ........................................................... 54 3.11. Keypad interface .............................................................................................................. 56 3.12. ADC................................................................................................................................. 57 3.13. Behaviors of the RI ......................................................................................................... 58 3.14. Network status indication ................................................................................................ 60 3.15. Operating status indication .............................................................................................. 61 3.16. General purpose input & output (GPIO) ......................................................................... 61 3.17. Open drain output (LIGHT_MOS) .................................................................................. 62 3.18. SD card interface ............................................................................................................. 63 4. Antenna interface ........................................................................................................................ 65 4.1. Antenna installation ........................................................................................................... 65 4.2. RF output power ................................................................................................................ 66 4.3. RF receiving sensitivity ..................................................................................................... 66 4.4. Operating frequencies ....................................................................................................... 66 4.5. Recommendation of RF pad welding ................................................................................ 66 5. Electrical, reliability and radio characteristics ............................................................................ 68 5.1. Absolute maximum ratings ................................................................................................ 68 5.2. Operating temperature ....................................................................................................... 68 5.3. Power supply ratings ......................................................................................................... 69 5.4. Current consumption ......................................................................................................... 70 5.5. Electro-static discharge ..................................................................................................... 72 6. Mechanical dimensions ............................................................................................................... 73 6.1. Mechanical dimensions of module .................................................................................... 73 6.2. Footprint of recommendation ............................................................................................ 75 6.3. Top view of the module .................................................................................................... 77 6.4. Bottom view of the module ............................................................................................... 77 Appendix A: GPRS coding schemes ............................................................................................... 78 Appendix B: GPRS multi-slot classes ............................................................................................. 79
M10 Hardware Design M10_HD_V3.0 - 4 - Table Index TABLE 1: RELATED DOCUMENTS ............................................................................................. 9TABLE 2: TERMS AND ABBREVIATIONS ................................................................................ 10TABLE 3: MODULE KEY FEATURES ........................................................................................ 15TABLE 4: CODING SCHEMES AND MAXIMUM NET DATA RATES OVER AIR INTERFACE .................................................................................................................. 17TABLE 5: PIN DESCRIPTION ...................................................................................................... 20TABLE 6: OVERVIEW OF OPERATING MODES ...................................................................... 25TABLE 7: AT COMMANDS USED IN ALARM MODE ............................................................. 31TABLE 8: SUMMARY OF STATE TRANSITION ....................................................................... 37TABLE 9: LOGIC LEVELS OF THE SERIAL INTERFACE ....................................................... 40TABLE 10: PIN DEFINITION OF THE SERIAL INTERFACES ................................................. 40TABLE 11: PIN DEFINITION OF AUDIO INTERFACE ............................................................. 47TABLE 12: TYPICAL ELECTRET MICROPHONE CHARACTERISTIC ................................. 51TABLE 13: TYPICAL SPEAKER CHARACTERISTIC ............................................................... 51TABLE 14: PIN DEFINITION OF THE SIM INTERFACE .......................................................... 52TABLE 15: PIN DESCRIPTION OF AMPHENOL SIM CARD HOLDER .................................. 55TABLE 16: PIN DESCRIPTION OF MOLEX SIM CARD HOLDER ......................................... 55TABLE 17: PIN DEFINITION OF THE KEYPAD INTERFACE ................................................. 56TABLE 18: PIN DEFINITION OF THE ADC ............................................................................... 57TABLE 19: CHARACTERISTIC OF THE ADC ........................................................................... 58TABLE 20: BEHAVIORS OF THE RI ........................................................................................... 58TABLE 21: WORKING STATE OF THE NETLIGHT .................................................................. 60TABLE 22: PIN DEFINITION OF THE STATUS ......................................................................... 61TABLE 23: PIN DEFINITION OF THE GPIO INTERFACE ....................................................... 62TABLE 24: PIN DEFINITION OF THE LIGHT_MOS ................................................................. 62TABLE 25: PIN DEFINITION OF THE SD CARD INTERFACE ............................................... 63TABLE 26: PIN NAME OF THE SD CARD AND T-FLASH(MICRO SD) CARD ..................... 64TABLE 27: PIN DEFINITION OF THE RF_ANT ........................................................................ 65TABLE 28: THE MODULE CONDUCTED RF OUTPUT POWER ............................................ 66TABLE 29: THE MODULE CONDUCTED RF RECEIVING SENSITIVITY ............................ 66TABLE 30: THE MODULE OPERATING FREQUENCIES ........................................................ 66TABLE 31: ABSOLUTE MAXIMUM RATINGS ......................................................................... 68TABLE 32: OPERATING TEMPERATURE ................................................................................. 68TABLE 33: THE MODULE POWER SUPPLY RATINGS ........................................................... 69TABLE 34: THE MODULE CURRENT CONSUMPTION .......................................................... 70TABLE 35: THE ESD ENDURANCE (TEMPERATURE:25℃,HUMIDITY:45 %) .................... 72TABLE 36: DESCRIPTION OF DIFFERENT CODING SCHEMES ........................................... 78TABLE 37: GPRS MULTI-SLOT CLASSES ................................................................................ 79
M10 Hardware Design M10_HD_V3.0 - 5 - Figure Index FIGURE 1: MODULE FUNCTIONAL DIAGRAM ...................................................................... 18FIGURE 2: TOP VIEW OF MODULE PIN ASSIGNMENT ......................................................... 19FIGURE 3: REFERENCE CIRCUIT OF THE SOURCE POWER SUPPLY INPUT ................... 26FIGURE 4: RIPPLE IN SUPPLY VOLTAGE DURING TRANSMITTING BURST ................... 27FIGURE 5: REFERENCE CIRCUIT OF THE VBAT INPUT ....................................................... 28FIGURE 6: TURN ON THE MODULE USING DRIVING CIRCUIT ......................................... 29FIGURE 7: TURN ON THE MODULE USING KEYSTROKE ................................................... 29FIGURE 8: TIMING OF TURN ON SYSTEM ............................................................................. 30FIGURE 9: TIMING OF TURN OFF THE MODULE .................................................................. 32FIGURE 10: REFERENCE CIRCUIT FOR EMERG_OFF BY USING DRIVING CIRCUIT .... 34FIGURE 11: REFERENCE CIRCUIT FOR EMERG_OFF BY USING BUTTON ...................... 34FIGURE 12: TIMING OF RESTART SYSTEM ............................................................................ 35FIGURE 13: TIMING OF RESTART SYSTEM AFTER EMERGENCY SHUTDOWN ............. 35FIGURE 14: RTC SUPPLY FROM NON-CHARGEABLE BATTERY ........................................ 38FIGURE 15: RTC SUPPLY FROM RECHARGEABLE BATTERY ............................................ 38FIGURE 16: RTC SUPPLY FROM CAPACITOR ......................................................................... 38FIGURE 17: SEIKO XH414H-IV01E CHARGE CHARACTERISTIC ....................................... 39FIGURE 18: CONNECTION OF ALL FUNCTIONAL UART PORT .......................................... 42FIGURE 19: CONNECTION OF THREE LINES UART PORT ................................................... 42FIGURE 20: CONNECTION OF UART PORT WITH HARDWARE FLOW CONTROL .......... 43FIGURE 21: CONNECTION OF SOFTWARE UPGRADE ......................................................... 43FIGURE 22: CONNECTION OF SOFTWARE DEBUG .............................................................. 44FIGURE 23: CONNECTION OF AUXILIARY UART PORT ...................................................... 44FIGURE 24: 3.3V LEVEL MATCH CIRCUIT .............................................................................. 45FIGURE 25: 5V LEVEL MATCH CIRCUIT ................................................................................. 45FIGURE 26: RS232 LEVEL MATCH CIRCUIT ........................................................................... 46FIGURE 27: MICROPHONE INTERFACE CONFIGURATION OF AIN1&AIN2 ..................... 48FIGURE 28: SPEAKER INTERFACE CONFIGURATION OF AOUT1 ...................................... 49FIGURE 29: SPEAKER INTERFACE WITH AMPLIFIER CONFIGURATION OF AOUT1 ..... 49FIGURE 30: SPEAKER INTERFACE CONFIGURATION OF AOUT2 ...................................... 50FIGURE 31: SPEAKER INTERFACE WITH AMPLIFIER CONFIGURATION OF AOUT2 ..... 50FIGURE 32: EARPHONE INTERFACE CONFIGURATION ...................................................... 51FIGURE 33: REFERENCE CIRCUIT OF THE 8 PINS SIM CARD ............................................ 53FIGURE 34: REFERENCE CIRCUIT OF THE 6 PINS SIM CARD ............................................ 53FIGURE 35: AMPHENOL C707 10M006 512 2 SIM CARD HOLDER ...................................... 54FIGURE 36: MOLEX 91228 SIM CARD HOLDER ..................................................................... 55FIGURE 37: REFERENCE CIRCUIT OF THE KEYPAD INTERFACE ..................................... 57FIGURE 38: RI BEHAVIOUR OF VOICE CALLING AS A RECEIVER .................................... 59FIGURE 39: RI BEHAVIOUR OF DATA CALLING AS A RECEIVER ...................................... 59FIGURE 40: RI BEHAVIOUR AS A CALLER ............................................................................. 59FIGURE 41: RI BEHAVIOUR OF URC OR SMS RECEIVED .................................................... 60
M10 Hardware Design M10_HD_V3.0 - 6 - FIGURE 42: REFERENCE CIRCUIT OF THE NETLIGHT ........................................................ 60FIGURE 43: REFERENCE CIRCUIT OF THE STATUS ............................................................. 61FIGURE 44: REFERENCE CIRCUIT OF THE LIGHT_MOS ..................................................... 62FIGURE 45: REFERENCE CIRCUIT OF SD CARD ................................................................... 63FIGURE 46: REFERENCE CIRCUIT OF RF INTERFACE ......................................................... 65FIGURE 47: RECOMMENDATION OF RF PAD WELDING ..................................................... 67FIGURE 48: M10 TOP AND SIDE DIMENSIONS（UNIT: MM） ............................................ 73FIGURE 49: M10 BOTTOM DIMENSIONS（UNIT: MM） ...................................................... 74FIGURE 50: PAD BOTTOM DIMENSIONS（UNIT: MM） ...................................................... 74FIGURE 51: FOOTPRINT OF RECOMMENDATION（UNIT: MM） ...................................... 76FIGURE 52: TOP VIEW OF THE MODULE ................................................................................ 77FIGURE 53: BOTTOM VIEW OF THE MODULE ...................................................................... 77FIGURE 54: RADIO BLOCK STRUCTURE OF CS-1, CS-2 AND CS-3 .................................... 78FIGURE 55: RADIO BLOCK STRUCTURE OF CS-4 ................................................................ 78
M10 Hardware Design M10_HD_V3.0 - 7 - 0. Revision history Revision Date Author Description of change 1.00 2009-06-27 Tracy ZHANG Initial 1.01 2009-09-18 Yong AN 1. Modified VRTC voltage inputting range. 2. Modified Figure 1. 3. Added Table 7 and Figure 4 with remark. 4. Modified ordering information content in Chapter 6. 5. Added VCHG pin description. 6. Modified current consumption data in Table 36.7. Added appendix A and B. 1.02 2009-11-12 Yong AN 1. Baud rate of the main UART port is set to autobauding mode from former fixed baud rate of 115200 in default configuration. 2. Modified contents about autobauding in Chapter 3.8 3. Modified the SIM card detection function through “AT+QSIMDET”. 1.03 2010-06-09 Yong AN 1. Added charging interface description. 2. Added Serial Port 3 interface description. 3. Added STATUS pin and its function description.4. Added GPIO control by AT+QGPIO command. 5. Modified timing of powering on, powering down and restarting the module. 6. Added ESD level of SIM card interface. 7. Modified function description of audio AOUT2 channel. 8. Disabled VDD_EXT pin as the indication of power-on and power-down. 9. Both STATUS and AT+QGPIO functions are supported at R05A05 release version and later, while Serial Port 3 function will be supported at R06AXX and later. 2.0 2010-07-30 DavidWEI 1. Added recommendation of RF pad welding. 3.0 2012-02-28 LayneYE 1. Modified the power supply range 2. Modified buzzer interface as RESERVED 3. Modified the display interface as SD interface 4. Modified the peak current in a transmitting burst 5. Modified the current consumption in GSM talk mode and GPRS communication mode 6. Modified the RF receiving sensitivity
M10 Hardware Design M10_HD_V3.0 - 8 - 7. Deleted the content of charging function.
M10 Hardware Design M10_HD_V3.0 - 9 - 1. Introduction This document defines the M10 module and describes the hardware interface of M10 module which are connected with the customer application and the air interface. This document can help customer quickly understand module interface specifications, electrical and mechanical details. Associated with application notes and user guide, customer can use M10 module to design and set up mobile applications easily. 1.1. Related documents Table 1: Related documents SN Document name Remark [ 1] M10_ATC AT comm a n d s s e t [2] ITU-T Draft new recommendation V.25ter Serial asynchronous automatic dialing and control [3] GSM 07.07 Digital cellular telecommunications (Phase 2+); AT command set for GSM Mobile Equipment (ME) [4] GSM 07.10 Support GSM 07.10 multiplexing protocol [5] GSM 07.05 Digital cellular telecommunications (Phase 2+); Use of Data Terminal Equipment – Data Circuit terminating Equipment (DTE – DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS) [6] GSM 11.14 Digital cellular telecommunications (Phase 2+); Specification of the SIM Application Toolkit for the Subscriber Identity module – Mobile Equipment (SIM – ME) interface [7] GSM 11.11 Digital cellular telecommunications (Phase 2+); Specification of the Subscriber Identity module – Mobile Equipment (SIM – ME) interface [8] GSM 03.38 Digital cellular telecommunications (Phase 2+); Alphabets and language-specific information [9] GSM 11.10 Digital cellular telecommunications (Phase 2); Mobile Station (MS) conformance specification; Part 1: Conformance specification [10] GSM_UART_AN UART port application notes [11] M10_HD_AN01 M10 hardware design application notes [12] GSM_FW_Upgrade_AN01 GSM Firmware upgrade application note [13] M10_EVB_UGD M10 EVB user guide application notes
M10 Hardware Design M10_HD_V3.0 - 10 - 1.2. Terms and abbreviations Table 2: Terms and abbreviations Abbreviation Description ADC Analog-to-Digital Converter AMR Adaptive Multi-Rate ARP Antenna Reference Point ASIC Application Specific Integrated Circuit BER Bit Error Rate BOM Bill Of Material BTS Base Transceiver Station CHAP Challenge Handshake Authentication Protocol CS Coding Scheme CSD Circuit Switched Data CTS Clear To Send DAC Digital-to-Analog Converter DRX Discontinuous Reception DSP Digital Signal Processor DCE Data Communications Equipment (typically module) DTE Data Terminal Equipment (typically computer, external controller) DTR Data Terminal Ready DTX Discontinuous Transmission EFR Enhanced Full Rate EGSM Enhanced GSM EMC Electromagnetic Compatibility ESD Electrostatic Discharge ETS European Telecommunication Standard FCC Federal Communications Commission (U.S.) FDMA Frequency Division Multiple Access FR Full Rate GMSK Gaussian Minimum Shift Keying GPRS General Packet Radio Service GSM Global System for Mobile Communications HR Half Rate I/O Input/Output IC Integrated Circuit IMEI International Mobile Equipment Identity Imax Maximum Load Current Inorm Normal Current kbps Kilo Bits Per Second LED Light Emitting Diode
M10 Hardware Design M10_HD_V3.0 - 11 - Abbreviation Description Li-Ion Lithium-Ion MO Mobile Originated MS Mobile Station (GSM engine) MT Mobile Terminated PAP Password Authentication Protocol PBCCH Packet Switched Broadcast Control Channel PCB Printed Circuit Board PDU Protocol Data Unit PPP Point-to-Point Protocol RF Radio Frequency RMS Root Mean Square (value) RTC Real Time Clock RX Receive Direction SIM Subscriber Identification Module SMS Short Message Service TDMA Time Division Multiple Access TE Terminal Equipment TX Transmitting Direction UART Universal Asynchronous Receiver & Transmitter URC Unsolicited Result Code USSD Unstructured Supplementary Service Data VSWR Voltage Standing Wave Ratio Vmax Maximum Voltage Value Vnorm Normal Voltage Value Vmin Minimum Voltage Value VIHmax Maximum Input High Level Voltage Value VIHmin Minimum Input High Level Voltage Value VILmax Maximum Input Low Level Voltage Value VILmin Minimum Input Low Level Voltage Value VImax Absolute Maximum Input Voltage Value VImin Absolute Minimum Input Voltage Value VOHmax Maximum Output High Level Voltage Value VOHmin Minimum Output High Level Voltage Value VOLmax Maximum Output Low Level Voltage Value VOLmin Minimum Output Low Level Voltage Value Phonebook abbreviations FD SIM Fix Dialing phonebook LD SIM Last Dialing phonebook (list of numbers most recently dialed) MC Mobile Equipment list of unanswered MT Calls (missed calls) ON SIM (or ME) Own Numbers (MSISDNs) list RC Mobile Equipment list of Received Calls
M10 Hardware Design M10_HD_V3.0 - 12 - Abbreviation Description SM SIM phonebook 1.3. Directives and standards The M10 module is designed to comply with the FCC statements. FCC ID is XMR201202M10. The Host system using M10, should have label indicating FCC ID: XMR201202M10. 1.3.1. FCC Statement Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. 1.3.2. FCC Radiation exposure statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body. The manual of the host system, which uses M10, must include RF exposure warning statement to advice user should keep minimum 20cm from the radio antenna of M10 module depending on portable or Mobile status. Note: If a portable device (such as PDA) uses M10 module, the device needs to do permissive change and SAR testing. 1.3.3. Industry Canada license  English version This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: a) This device may not cause harmful interference. b) This device must accept any interference, including interference that may cause undesired operation of the device.  The Host system using M10, should have label indicating “transmitter module IC: 10064-201202M10.  French version Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio
M10 Hardware Design M10_HD_V3.0 - 13 - exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : a) l'appareil ne doit pas produire de brouillage, et b) L’utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. 1.4. Safety cautions The following safety precautions must be observed during all phases of the operation, such as usage, service or repair of any cellular terminal or mobile incorporating M10 module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. If not so, Quectel does not take on any liability for customer failure to comply with these precautions. When in a hospital or other health care facility, observe the restrictions about the use of mobile. Switch the cellular terminal or mobile off. Medical equipment may be sensitive to not operate normally for RF energy interference. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it switched off. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. Forget to think much of these instructions may lead to the flight safety or offend against local legal action, or both. Do not operate the cellular terminal or mobile in the presence of flammable gas or fume. Switch off the cellular terminal when you are near petrol station, fuel depot, chemical plant or where blasting operations are in progress. Operation of any electrical equipment in potentially explosive atmosphere can constitute a safety hazard. Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment. Road safety comes first! Do not use a hand-held cellular terminal or mobile while driving a vehicle, unless it is securely mounted in a holder for hands-free operation. Before making a call with a hand-held terminal or mobile, park the vehicle.
M10 Hardware Design M10_HD_V3.0 - 14 - GSM cellular terminals or mobiles operate over radio frequency signal and cellular network and cannot be guaranteed to connect in all conditions, for example no mobile fee or an invalid SIM card. While you are in this condition and need emergent help, Please Remember using emergency call. In order to make or receive call, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Some networks do not allow for emergency call if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may have to deactivate those features before you can make an emergency call. Also, some networks require that a valid SIM card be properly inserted in cellular terminal or mobile.
M10 Hardware Design M10_HD_V3.0 - 15 - 2. Product concept The M10 is a Quad-band GSM/GPRS engine that works at frequencies GSM850MHz, GSM900MHz, DCS1800MHz and PCS1900MHz. The M10 features GPRS multi-slot class 12 and supports the GPRS coding schemes CS-1, CS-2, CS-3 and CS-4. For more details about GPRS multi-slot classes and coding schemes, please refer to Appendix A and Appendix B. With a tiny profile of 29mm×29mm ×3.6 mm, the module can meet almost all the requirements for M2M applications, including Tracking and Tracing, Intelligent Instrument, Wireless POS, Security, Telematics, Remote Controlling, etc. M10 is an SMD type module, which can be embedded in customer application through its 64-pin pads. It provides all hardware interfaces between the module and customer’s host board. Designed with power saving technique, current consumption of M10 is as low as 1.1 mA in SLEEP mode when DRX is 5. M10 is integrated with Internet service protocols, which are TCP/IP, PPP. Extended AT commands have been developed for customer to use these Internet service protocols easily. The modules are fully RoHS compliant to EU regulation. 2.1. Key features Table 3: Module key features Feature Implementation Power supply Single supply voltage: 3.3V~4.6V Typical supply voltage: 4V Power saving Typical power consumption in SLEEP mode to 1.1 mA@ DRX=5 0.95mA@ DRX=9 Frequency bands  Daud-band: GSM850, GSM900, DCS1800, PCS1900.  The module can search these frequency bands automatically  The frequency bands can be set by AT command.  Compliant to GSM Phase 2/2+ GSM class Small MS Transmitting power  Class 4 (2W) at GSM850 and GSM900  Class 1 (1W) at DCS1800 and PCS1900 GPRS connectivity  GPRS multi-slot class 12 (default)  GPRS multi-slot class 1~12 (configurable)  GPRS mobile station class B Temperature range  Normal operation: -35°C ~ +80°C
M10 Hardware Design M10_HD_V3.0 - 16 -  Restricted operation: -45°C ~ -35°C and +80°C ~ +85°C 1)  Storage temperature: -45°C ~ +90°C DATA GPRS: CSD:  GPRS data downlink transfer: max. 85.6 kbps  GPRS data uplink transfer: max. 85.6 kbps  Coding scheme: CS-1, CS-2, CS-3 and CS-4  Support the protocols PAP (Password Authentication Protocol) usually used for PPP connections  Internet service protocols TCP/UDP/FTP/HTTP/MMS/SMTP  Support Packet Switched Broadcast Control Channel (PBCCH)  CSD transmission rates: 2.4, 4.8, 9.6, 14.4 kbps non-transparent Support Unstructured Supplementary Services Data (USSD) SMS  MT, MO, CB, Text and PDU mode  SMS storage: SIM card FAX Group 3 Class 1 and Class 2 SIM interface Support SIM card: 1.8V, 3V Antenna interface Connected via 50 Ohm antenna pad Audio features Speech codec modes:  Half Rate (ETS 06.20)  Full Rate (ETS 06.10)  Enhanced Full Rate (ETS 06.50 / 06.60 / 06.80)  Adaptive Multi-Rate (AMR)  Echo Cancellation  Echo Suppression  Noise Reduction Serial interface Serial Port:  Seven lines on serial port interface  Use for AT command, GPRS data and CSD data  Multiplexing function  Support autobauding from 4800 bps to 115200 bps Debug Port:  Two lines on second serial port interface DBG_TXD and DBG_RXD  Debug Port used for software debugging and log output UART3:  Use for AT command Phonebook management Support phonebook types: SM, FD, LD, RC, ON, MC SIM Application Toolkit Support SAT class 3, GSM 11.14 Release 99 Real time clock Implemented Alarm function Programmable via AT command Physical characteristics Size: 29±0.15×29±0.15×3.6±0.3mm Weight: 6g Firmware upgrade Firmware upgrade over Serial Port
M10 Hardware Design M10_HD_V3.0 - 17 - 1) When the module works in this temperature range, the deviation from the GSM specification might occur. For example, the frequency error or the phase error could increase. Table 4: Coding schemes and maximum net data rates over air interface Coding scheme 1 Timeslot 2 Timeslot 4 Timeslot CS-1: 9.05kbps 18.1kbps 36.2kbps CS-2: 13.4kbps 26.8kbps 53.6kbps CS-3: 15.6kbps 31.2kbps 62.4kbps CS-4: 21.4kbps 42.8kbps 85.6kbps 2.2. Functional diagram The following figure shows a block diagram of M10 and illustrates the major functional parts.  Power management  Baseband  Serial Flash  The GSM radio frequency part  The Peripheral interface —Power supply —Turn on/off interface —UART interface —Audio interface —SIM interface —Keypad interface —ADC —SD card interface —RF interface
M10 Hardware Design M10_HD_V3.0 - 18 - Figure 1: Module functional diagram2.3. Evaluation board In order to help customer on the application of M12, Quectel supplies an Evaluation Board (EVB) that hosts the module directly with appropriate power supply, SIM card holder, RS-232 serial interface, handset RJ11 port, earphone port, antenna and other peripherals to control or test the module. For details, please refer to the document [13].
M10 Hardware Design M10_HD_V3.0 - 19 - 3. Application interface The module is equipped with a 64-pin 1.3mm pitch SMT pad that connects to the cellular application platform. Sub-interfaces included in these pads are described in detail in following chapters:  Power supply (refer to Chapter 3.3)  Serial interfaces (refer to Chapter 3.8)  Two analog audio interfaces (refer to Chapter 3.9)  SIM interface (refer to Chapter 3.10)  SD card interface(refer to Chapter 3.18) Electrical and mechanical characteristics of the SMT pad are specified in Chapter 5&Chapter6. 3.1. Pin of module 3.1.1. Pin assignment The following figure shows pin name and assignment of M10. Figure 2: Top view of module pin assignment
M10 Hardware Design M10_HD_V3.0 - 20 - 3.1.2. Pin description Table 5: Pin description Power supply PIN NAME PIN NO. I/O DESCRIPTION DC CHARACTERISTICS COMMENT VBAT 50,51 52 I Module main power supply. VBAT=3.3V~4.6V. Vmax= 4.6V Vmin=3.3V Vnorm=4.0V It must be able to provide sufficient current in a transmitting burst which typically rises to 1.6A. VRTC 16 I/O Power supply for RTC when VBAT is not supplied. Charging for backup battery or golden capacitor when the VBAT is supplied. VImax=VBAT VImin=2.6V VInorm=2.75V VOmax=2.85V VOmin=2.6V VOnorm=2.75V Iout(max)= 730uA Iin=2.6~5 uA Recommended to connect to a backup battery or a golden capacitor. VDD_EXT 7 O Supply 2.8V voltage for external circuit. Vmax=2.9V Vmin=2.7V Vnorm=2.8V Imax=20mA 1. If unused, keep this pin open. 2. Recommended to add a 2.2~4.7uF bypass capacitor, when used for power supply. GND 8,42, 44~ 49 Digital ground Turn on /off PIN NAME PIN NO. I/O DESCRIPTION DC CHARACTERISTICS COMMENT PWRKEY 18 I Power on/off key PWRKEY should be pulled down for a moment to turn on or off the system. VILmax=0.1*VBAT VIHmin=0.6*VBAT VImax=VBAT Pull up to VBAT internally. Emergency shutdown PIN NAME PIN NO. I/O DESCRIPTION DC CHARACTERISTICS COMMENT
M10 Hardware Design M10_HD_V3.0 - 21 - EMERG_ OFF 17 I Emergency off. Pulling down for at least 20ms will turn off the module in case of emergency. Use it only when normal shutdown through PWRKEY or AT command cannot perform well. VILmax=0.4V VIHmin=2.2V Vopenmax=2.8V Open drain/collector driver required in cellular device application. If unused, keep this pin open. Module status indication PIN NAME PIN NO. I/O DESCRIPTION DC CHARACTERISTICS COMMENT STATUS 54 O Used to indicate module’s operating status. High level indicates module power-on and low level indicates power-down. VOLmax= 0.15*VDD_EXT VOHmax= 0.85*VDD_EXT If unused, keep this pin open. Audio interfaces PIN NAME PIN NO. I/O DESCRIPTION DC CHARACTERISTICS COMMENT MIC1P MIC1N 23 24 I Positive and negative voice-band input. For Audio DC characteristics refer to Chapter 3.10. If unused, keep these pins open. MIC2P MIC2N 25 26 I Auxiliary positive and negative voice-band input. SPK1P SPK1N 22 21 O Positive and negative voice-band output.SPK2P 20 O Auxiliary positive voice-band output.AGND 19 AGND is separate ground connection for external audio circuits. General purpose input/output PIN NAME PIN NO. I/O DESCRIPTION DC CHARACTERISTICS COMMENT
M10 Hardware Design M10_HD_V3.0 - 22 - KBC0~ KBC4 33~37 I Keypad interface VILmin=-0.3V VILmax= 0.25*VDD_EXT VIHmin= 0.75*VDD_EXT VIHmax= VDD_EXT+0.3 VOLmax= 0.15*VDD_EXT VOHmin= 0.85*VDD_EXT If unused, keep these pins open. KBR0~ KBR4 28~32 O Pull up to VDD_EXT, if unused, keep these pins open. GPIO1_ KBC5 38 I/O Normal input/output port/Keypad interface If unused, keep these pins open. GPIO0 64 I/O Normal input/output port NETLIGHT 6 O Network status indication LIGHT_ MOS 27 O Open drain output port Imax=60mA If unused, keep this pin open. Main Serial port PIN NAME PIN NO. I/O DESCRIPTION DC CHARACTERISTICS COMMENT DTR 59 I Data terminal ready VILmin=-0.3V VILmax= 0.25*VDD_EXT VIHmin= 0.75*VDD_EXT VIHmax= VDD_EXT+0.3 VOLmax= 0.15*VDD_EXT VOHmin= 0.85*VDD_EXT If only use TXD, RXD and GND to communicate, recommend connecting RTS to GND via 0R resistor and keeping other pins open. RXD 61 I Receive data TXD 60 O Transmit data RTS 58 I Request to send CTS 57 O Clear to send RI 55 O Ring indicator DCD 56 O Data carrier detection Debug port DBG_TXD 10 O Serial interface for debugging only Same as above If unused, keep these pins open. DBG_RXD 9 I UART3 TXD3 62 O Transmit data Same as above If unused, keep these pins open. RXD3 63 I Receive data SD card interface PIN NAME PIN NO. I/O DESCRIPTION DC CHARACTERISTICS COMMENT SD_DATA 1 I/O SD serial data VILmin=-0.3V If unused, keep
M10 Hardware Design M10_HD_V3.0 - 23 - SD_CLK 2 O SD serial clock VILmax= 0.25*VDD_EXT VIHmin= 0.75*VDD_EXT VIHmax= VDD_EXT+0.3 VOLmax= 0.15*VDD_EXT VOHmin= 0.85*VDD_EXT these pins open. If used, SD_DATA is connected to SD card DATA0 pin. SD_CMD 3 O SD command SIM interface PIN NAME PIN NO. I/O DESCRIPTION DC CHARACTERISTICS COMMENT SIM_VDD 12 O Voltage supply for SIM card The voltage can be selected by software automatically. Either 1.8V or 3V. All signals of SIM interface should be protected against ESD with a TVS diode array. Maximum cable length is 200mm from the module pad to SIM card holder. SIM_DATA 13 I/O SIM data When SIM_VDD=3V VILmax=0.4V VIHmin= SIM_VDD-0.4 VOLmax=0.4V VOHmin= SIM_VDD-0.4 When SIM_VDD=1.8VVILmax= 0.15*SIM_VDD VIHmin= SIM_VDD-0.4 VOLmax= 0.15*SIM_VDD VOHmin= SIM_VDD-0.4 SIM_CLK 14 O SIM clock When SIM_VDD=3V VILmax=0.4V VIHmin= 0.9*SIM_VDD VOLmax=0.4V VOHmin= 0.9*SIM_VDD When SIM_VDD=1.8VVILmax= 0.12*SIM_VDD VIHmin=
M10 Hardware Design M10_HD_V3.0 - 24 - 0.9*SIM_VDD VOLmax= 0.12*SIM_VDD VOHmin= 0.9*SIM_VDD SIM_RST 15 O SIM reset When SIM_VDD=3V VILmax=0.36V VIHmin= 0.9*SIM_VDD VOLmax=0.4V VOHmin= 0.9*SIM_VDD When SIM_VDD=1.8VVILmax= 0.12*SIM_VDD VIHmin= 0.9*SIM_VDD VOLmax= 0.12*SIM_VDD VOHmin= 0.9*SIM_VDD SIM_ PRESENCE 11 I SIM card detection VILmax=0.67V VIHmin=1.7V If unused, keep this pin open. AUX ADC PIN NAME PIN NO. I/O DESCRIPTION DC CHARACTERISTICS COMMENT ADC0 41 I General purpose analog to digital converter Voltage range: 0V ~ 2.8V If unused, keep this pin open. ADC1 40 I RF interface PIN NAME PIN NO. I/O DESCRIPTION DC CHARACTERISTICS COMMENT RF_ANT 43 I/O RF antenna pad Impedance of 50Ω Refer to Chapter 4. Other interfaces PIN NAME PIN NO. I/O DESCRIPTION DC CHARACTERISTICS COMMENT RESERVED 4,5, 39,53 Keep these pins open
M10 Hardware Design M10_HD_V3.0 - 25 - 3.2. Operating modes The table below briefly summarizes the various operating modes referred to in the following chapters. Table 6: Overview of operating modes Mode Function Normal operation GSM/GPRS SLEEP The module will automatically go into SLEEP mode if DTR is set to high level and there is no interrupt (such as GPIO interrupt or data on serial port). In this case, the current consumption of module will reduce to the minimal level. During SLEEP mode, the module can still receive paging message and SMS from the system normally. GSM IDLE Software is active. The module has registered to the GSM network, and the module is ready to send and receive data. GSM TALK GSM connection is ongoing. In this mode, the power consumption is decided by the configuration of Power Control Level (PCL), dynamic DTX control and the working RF band. GPRS IDLE The module is not registered to GPRS network. The module is not reachable through GPRS channel. GPRS STANDBY The module is registered to GPRS network, but no GPRS PDP context is active. The SGSN knows the Routing Area where the module is located at. GPRS READY The PDP context is active, but no data transfer is going on. The module is ready to receive or send GPRS data. The SGSN knows the cell where the module is located at. GPRS DATA There is GPRS data in transfer. In this mode, power consumption is decided by the PCL, working RF band and GPRS multi-slot configuration. POWER DOWN1) Normal shutdown by sending the “AT+QPOWD=1” command, using the PWRKEY or using the EMERG_OFF pin. The power management ASIC disconnects the power supply from the base band part of the module, and only the power supply for the RTC is remained. Software is not active. The serial interfaces are not accessible. Operating voltage (connected to VBAT) remains applied. Minimum functionality mode (without removing power supply) “AT+CFUN” command can be set the module to a minimum functionality mode without removing the power supply. In this case, the RF part of the module will not work or the SIM card will not be accessible, or both RF part and SIM card will be closed, but the serial port is still accessible. The power consumption in this case is very low.
M10 Hardware Design M10_HD_V3.0 - 26 - Alarm mode RTC alert function launches this restricted operation while the module is in POWER DOWN mode. The module will not be registered to GSM network and only parts of AT commands can be available. 1) Use the EMERG_OFF pin only while failing to turn off the module by the command “AT+QPOWD=1” and the ON/OFF pin. Please refer to Chapter 3.4.2.4. 3.3. Power supply The power supply range of M12 is from 3.3V to 4.6V which is supplied with a single voltage source of VBAT. The GSM transmitting burst can cause obvious voltage drop at the supply voltage thus the power supply must be carefully designed and is capable of providing sufficient current up to 1.6A. A reference design of DC 5V/2A input power source is shown in Figure 3. The designed output for the power supply is 4.16V, thus a linear regulator can be used. If there’s a big voltage difference between the input source and the desired output (VBAT), a switching converter power supply would be preferable for its better efficiency especially with the 1.6A peak current in burst mode of the module. Figure 3: Reference circuit of the source power supply input The RF Power Amplifier current (1.6A peak in GSM/GPRS mode) flows with a ratio of 1/8 of time, around 577us every 4.615ms, in talking mode. The following figure is the VBAT voltage and current ripple at the maximum power transmitting phase, the test condition is VBAT=4.16V, VBAT maximum output current is 1.6A, C3=100µF tantalum capacitor (ESR=0.7Ω).
M10 Hardware Design M10_HD_V3.0 - 27 - Max:400mV4.615ms577usIBATVBATBurst:1.6A Figure 4: Ripple in supply voltage during transmitting burst3.3.1. Power supply pins The VBAT pins are dedicated to connect the module supply voltage. VRTC pin can be used to connect a rechargeable coin battery or a golden capacitor which can help to maintain the system clock when VBAT supply is not applied. 3.3.2. Minimizing supply voltage drop Please pay special attention to the power supply design for your applications. Make sure that the input voltage will never drop below 3.3V even in a transmitting burst during which the current consumption may rise up to 1.6A. If the power voltage drops below 3.3V, the module could turn off automatically. The PCB traces from the VBAT pads to the power source must be wide enough to ensure that there is not too much voltage drop occur in the transmitting burst mode. The width of trace should be no less than 2mm and the principle of the VBAT trace is the longer route, the wider trace. The VBAT voltage can be measured by oscilloscope. For the VBAT input, a bypass capacitor of about 100 µF with low ESR is recommended. Multi-layer ceramic chip (MLCC) capacitor can provide the best combination of low ESR and small size but may not be economical. A lower cost choice could be a 100 µF tantalum capacitor with low ESR. Other small ceramic capacitors should be in parallel with the 100µF capacitor, which is illustrated in Figure 5. The capacitors should be placed close to the M12 VBAT pins.
M10 Hardware Design M10_HD_V3.0 - 28 - C1>=100uF; C2=0.1uF~1uF; C3=10pF; C4=33pF Figure 5: Reference circuit of the VBAT input3.3.3. Monitor power supply To monitor the supply voltage, you can use the “AT+CBC” command which includes three parameters: charging status, remaining battery capacity and voltage value (in mV). It returns the 0-100 percent of battery capacity and actual value measured between VBAT and GND. The voltage is continuously measured at an interval depending on the operating mode. The displayed voltage (in mV) is averaged over the last measuring period before the “AT+CBC” command is executed. For details, please refer to document [1]. 3.4. Power up and down scenarios 3.4.1. Power on The module can be turned on through the two ways, which are described in following chapters:  Via PWRKEY pin: start normal operating mode (please refer to chapter 3.4.1.1);  Via RTC interrupt: start ALARM mode (please refer to chapter 3.4.1.2). Note: The module is set to autobauding mode (AT+IPR=0) in default configuration. In the autobauding mode, the URC “RDY” is not sent to host controller after powering on. AT command can be sent to the module 2-3 seconds after the module is powered on. Host controller should firstly send an “AT” or “at” string in order that the module can detect baud rate of host controller, and it should send the second or the third “AT” or “at” string until receiving “OK” string from module. Then an “AT+IPR=x;&W” should be sent to set a fixed baud rate for
M10 Hardware Design M10_HD_V3.0 - 29 - module and save the configuration to flash memory of module. After these configurations, the URC “RDY” would be received from the Serial Port of module every time when the module is powered on. Refer to Chapter “AT+IPR” in document [1]. 3.4.1.1. Power on module using the PWRKEY pin Customer’s application can turn on the module by driving the pin PWRKEY to a low level voltage and after STATUS pin outputs a high level, PWRKEY pin can be released. Customer may monitor the level of the STATUS pin to judge whether the module is power-on or not. An open collector driver circuit is suggested to control the PWRKEY. A simple reference circuit is illustrated in Figure 6. Figure 6: Turn on the module using driving circuit The other way to control the PWRKEY is using a button directly. A TVS component is indispensable to be placed nearby the button for ESD protection. When pressing the key, electrostatic strike may generate from finger. A reference circuit is showed in Figure 7. Figure 7: Turn on the module using keystroke
M10 Hardware Design M10_HD_V3.0 - 30 - The power on scenarios is illustrated as following figure. VDD_EXT(OUTPUT)VIL<0.1*VBATVIH > 0.6*VBATVBATPWRKEY(INPUT)EMERG_OFF(INPUT)54msSTATUS(OUTPUT)800ms>1sOFF BOOTINGMODULE STATUS RUNNING21 Figure 8: Timing of turning on system ① Make sure that VBAT voltage is stable before pulling down PWRKEY pin. The interval time between them is recommended 30ms. ② Keep the EMERG_OFF pin open if not used. Note: Customer can monitor the voltage level of the STATUS pin to judge whether the module is power-on. After the STATUS pin goes to high level, PWRKEY may be released. If the STATUS pin is ignored, pull the PWRKEY pin to low level for more than 2 seconds to turn on the module. 3.4.1.2. Power on module using the RTC (Alarm mode) Alarm mode is a power-on approach by using the RTC. The alert function of RTC can wake-up the module while it is in power-off state. In alarm mode, the module will not register to GSM network and the GSM protocol stack software is closed. Thus the part of AT commands related with SIM card and the protocol stack will not be accessible, and the others can be used. Use the “AT+QALARM” command to set the alarm time. The RTC remains the alarm time if the module is powered off by “AT+QPOWD=1” or by PWRKEY pin. Once the alarm time is expired,
M10 Hardware Design M10_HD_V3.0 - 31 - the module will go into the alarm mode. In this case, the module will send out an Unsolicited Result Code (URC) when the baud rate of the Serial Port is set to a fixed one. RDY ALARM MODE +CFUN:0 Note: This result code does not appear when autobauding is active because a valid baud rate is not available immediately after powering up the module. Therefore, the module is recommended to set to a fixed baud rate. During alarm mode, use “AT+CFUN” command to query the status of software protocol stack; it will return “0” which indicates that the protocol stack is closed. After 90 seconds, the module will power down automatically. However, if the GSM protocol stack is started by “AT+CFUN=1” command during the alarm mode, the process of automatic power-off will not be executed. In alarm mode, driving the PWRKEY to a low level voltage for a period will cause the module to power down. The frequently-used AT commands during alarm mode are briefly summarized In Table 7. For details of these instructions, please refer to document [1]. Table 7: AT commands used in alarm mode AT command Function AT+QALARM Set alarm time AT+CCLK Set data and time of RTC AT+QPOWD Power down the module AT+CFUN Start or close the protocol stack 3.4.2. Power down The following procedures can be used to turn off the module:  Normal power down procedure: Turn off module using the PWRKEY pin  Normal power down procedure: Turn off module using command “AT+QPOWD”  Over-voltage or under-voltage automatic shutdown: Take effect when over-voltage or under-voltage is detected  Emergent power down procedure: Turn off module using the EMERG_OFF pin
M10 Hardware Design M10_HD_V3.0 - 32 - 3.4.2.1. Power down module using the PWRKEY pin Customer’s application can turn off the module by driving the PWRKEY to a low level voltage for certain time. The power-down scenario is illustrated as in Figure 9. The power-down procedure causes the module to log off from the network and allows the software to save important data before completely disconnecting the power supply, thus it is a safe way. Before the completion of the power-down procedure, the module sends out the result code as shown below: NORMAL POWER DOWN Note: This result code does not appear when autobauding is active and DTE and DCE are not correctly synchronized after start-up. The module is recommended to set a fixed baud rate. After this moment, no other AT commands can be executed. And then the module enters the POWER DOWN mode, only the RTC is still active. The POWER DOWN mode can also be indicated by the STATUS pin, which is a low level voltage in this mode. VBATPWRKEY(INPUT)STATUS(OUTPUT)EMERG_OFF(INPUT)Logout net about 2s to 12s0.6s<Pulldown<1s >160us Figure 9: Timing of turning off the module 3.4.2.2. Power down module using AT command Customer’s application can use an AT command “AT+QPOWD=1” to turn off the module. This command will let the module to log off from the network and allow the software to save important
M10 Hardware Design M10_HD_V3.0 - 33 - data before completely disconnecting the power supply, thus it is a safe way. Before the completion of the power-down procedure, the module sends out the result code as shown below: NORMAL POWER DOWN After this moment, no other AT commands can be executed. And then the module enters the POWER DOWN mode, only the RTC is still active. The POWER DOWN mode can also be indicated by STATUS pin, which is a low level voltage in this mode. For details about the AT command of “AT+QPOWD”, please refer to document [1]. 3.4.2.3. Over-voltage or under-voltage automatic shutdown The module will constantly monitor the voltage applied on the VBAT, if the voltage is ≤ 3.5V, the following URC will be presented: UNDER_VOLTAGE WARNING If the voltage is ≥ 4.5V, the following URC will be presented: OVER_VOLTAGE WARNING The normal input voltage range is 3.3V to 4.6V. If the voltage is > 4.6V or <3.3V, the module would automatically shutdown itself. If the voltage is <3.3V, the following URC will be presented: UNDER_VOLTAGE POWER DOWN If the voltage is >4.6V, the following URC will be presented: OVER_VOLTAGE POWER DOWN Note: These result codes don’t appear when autobauding is active and DTE and DCE are not correctly synchronized after start-up. The module is recommended to set to a fixed baud rate. After this moment, no other AT command can be executed, the module logs off from network and enters POWER DOWN mode, and only RTC is still active. The POWER DOWN mode can also be indicated by the pin STATUS, which is a low level voltage in this mode.
M10 Hardware Design M10_HD_V3.0 - 34 - 3.4.2.4. Emergency shutdown The module can be shut down by driving the pin EMERG_OFF to a low level voltage for over 20ms and then releasing it. The EMERG_OFF line can be driven by an Open Drain/Collector driver or a button. The circuit is illustrated as the following figures. Figure 10: Reference circuit for EMERG_OFF by using driving circuit Figure 11: Reference circuit for EMERG_OFF by using button Be cautious to use the pin EMERG_OFF. It should only be used under emergent situation. For instance, if the module is unresponsive or abnormal, the pin EMERG_OFF could be used to shutdown the system. Although turning off the module by EMERG_OFF is fully tested and nothing wrong is detected, this operation is still a big risk as it could cause destroying of the code or data area of the NOR flash memory in the module. Therefore, it is recommended that PWRKEY or AT command should always be the preferential way to turn off the system.
M10 Hardware Design M10_HD_V3.0 - 35 - 3.4.3. Restart module using the PWRKEY pin Customer’s application can restart the module by driving the PWRKEY to a low level voltage for certain time, which is similar to the way to turn on the module. Before restarting the module, at least 500ms should be delayed after detecting the low level of STATUS. The restart scenario is illustrated as the following figure. Figure 12: Timing of restarting system The module can also be restarted by the PWRKEY after emergency shutdown. PWRKEY（INPUT）Pulldown >20ms Delay>2sEMERG_OFF（INPUT） Figure 13: Timing of restarting system after emergency shutdown
M10 Hardware Design M10_HD_V3.0 - 36 - 3.5. Power saving Upon system requirement, there are several actions to drive the module to enter low current consumption status. For example, “AT+CFUN” can be used to set the module into minimum functionality mode and DTR hardware interface signal can be used to lead system to SLEEP mode. 3.5.1. Minimum functionality mode Minimum functionality mode reduces the functionality of the module to minimum level, thus minimizes the current consumption when the slow clocking mode is activated at the same time. This mode is set with the “AT+CFUN” command which provides the choice of the functionality levels <fun>=0,1,4.  0: minimum functionality  1: full functionality (default)  4: disable both transmitting and receiving of RF part If the module is set to minimum functionality by “AT+CFUN=0”, the RF function and SIM card function would be closed. In this case, the serial port is still accessible, but all AT commands correlative with RF function or SIM card function will not be accessible. If the module has been set by “AT+CFUN=4”, the RF function will be closed but the serial port is still active. In this case, all AT commands correlative with RF function will not be accessible. After the module is set by “AT+CFUN=0” or “AT+CFUN=4”, it can return to full functionality by “AT+CFUN=1”. For detailed information about “AT+CFUN”, please refer to document [1]. 3.5.2. SLEEP mode (slow clock mode) The SLEEP mode is disabled in default software configuration. Customer’s application can enable this mode by “AT+QSCLK=1”. On the other hand, the default setting is “AT+QSCLK=0” and in this mode, the module cannot enter SLEEP mode. When “AT+QSCLK=1” is set to the module, customer’s application can control the module to enter or exit from the SLEEP mode through pin DTR. When DTR is set to high level, and there is no on-air or hardware interrupt such as GPIO interrupt or data on serial port, the module will enter SLEEP mode automatically. In this mode, the module can still receive voice, SMS or GPRS paging from network but the serial port is not accessible.
M10 Hardware Design M10_HD_V3.0 - 37 - 3.5.3. Wake up module from SLEEP mode When the module is in the SLEEP mode, the following methods can wake up the module. If the DTR Pin is pulled down to a low level, it would wake up the module from the SLEEP mode. The serial port will be active about 20ms after DTR is changed to low level. Receive a voice or data call from network to wake up module. Receive an SMS from network to wake up module. RTC alarm expired to wake up module. Note: DTR pin should be held low level during communicating between the module and DTE. 3.6. Summary of state transitions (except SLEEP mode) Table 8: Summary of state transition 3.7. RTC backup The RTC (Real Time Clock) can be supplied by an external capacitor or battery (rechargeable or non-chargeable) through the pin VRTC. A 1.5K resistor has been integrated in the module for current limiting. A coin-cell battery or a super-cap can be used to backup power supply for RTC. The following figures show various sample circuits for RTC backup. Current mode Next mode POWER DOWN Normal mode Alarm mode POWER DOWN Use PWRKEY Turn on the module by RTC alarm Normal mode Use “AT+QPOWD” command, PWRKEY pin, or EMERG_OFF pin Set alarm by “AT+QALARM”, and then turn off the module. When the timer expires, the module turns on automatically and enters Alarm mode. Alarm mode Use PWRKEY pin or wait module turning off automatically Use “AT+CFUN” command
M10 Hardware Design M10_HD_V3.0 - 38 - Figure 14: RTC supply from non-chargeable battery Figure 15: RTC supply from rechargeable battery VRTCLarge Capacitance CapacitorMODULERTC Core1.5K Figure 16: RTC supply from capacitor Coin-type rechargeable capacitor such as XH414H-IV01E from Seiko can be used.
M10 Hardware Design M10_HD_V3.0 - 39 - Figure 17: Seiko XH414H-IV01E Charge Characteristic 3.8. Serial interfaces The module provides two unbalanced asynchronous serial ports including Serial Port, Debug Port. The module is designed as a DCE (Data Communication Equipment), following the traditional DCE-DTE (Data Terminal Equipment) connection. Autobauding function supports baud rate from 4800bps to 115200bps. The UART Port:  TXD: Send data to RXD of DTE  RXD: Receive data from TXD of DTE  RTS: Requests to send  CTS: Clear to send  DTR: DTE is ready and inform DCE (this pin can wake the module up)  RI: Ring indicator (when the call, SMS, data of the module are coming, the module will output signal to inform DTE)  DCD: Data carrier detection (the validity of this pin demonstrates the communication link is set up) Note: The module disables hardware flow control by default. When hardware flow control is required, RTS and CTS should be connected to the host. AT command “AT+IFC=2,2” is used to enable hardware flow control. AT command “AT+IFC=0,0” is used to disable the hardware flow control. For more details, please refer to document [1].
M10 Hardware Design M10_HD_V3.0 - 40 - The Debug Port:  DBG_TXD: Send data to the COM port of a debugging computer  DBG_RXD: Receive data from the COM port of a debugging computer UART3:  TXD_AUX: Send data to the RXD of DTE  RXD_AUX: Receive data from the TXD of DTE The logic levels are described in the following table. Table 9: Logic levels of the serial interface Table 10: Pin definition of the serial interfaces Interface Name Pin Function Debug Port DBG_RXD 9 Receive data of the debug port DBG_TXD 10 Transmit data of the debug port Serial Port RI 55 Ring indicator RTS 58 Request to send CTS 57 Clear to send RXD 61 Receive data of the serial port TXD 60 Transmit data of the serial port DTR 59 Data terminal ready DCD 56 Data carrier detection UART3 TXD3 62 Transmit data of UART3 RXD3 63 Receive data of UART3 3.8.1. UART Port 3.8.1.1. The features of UART Port. Seven lines on UART interface:  Contain data lines TXD and RXD, hardware flow control lines RTS and CTS, other control lines DTR, DCD and RI. Parameter Min Max Unit VIL 0 0.25*VDD_EXT V VIH 0.75*VDD_EXT VDD_EXT +0.3 V VOL 0 0.15*VDD_EXT V VOH 0.85*VDD_EXT VDD_EXT V
M10 Hardware Design M10_HD_V3.0 - 41 -  The module disables hardware flow control in default, AT command “AT+IFC=2,2” is used to enable hardware flow control.  Used for AT command, GPRS data, CSD FAX, etc. Multiplexing function is supported on the UART Port. So far only the basic mode of multiplexing is available.  Support the communication baud rates as the following:  300,600,1200,2400,4800,9600,14400,19200,28800,38400,57600,115200.  The default setting is autobauding mode. Support the following baud rates for Autobauding function: 4800, 9600, 19200, 38400, 57600, 115200. After setting a fixed baud rate or Autobauding, please send “AT” or “at” string at that rate. The UART port is ready when it responds with “OK”. Autobauding allows the module to detect the baud rate by receiving the string “AT” or “at” from the host or PC automatically, which gives module flexibility without considering which baud rate is used by the host controller. Autobauding is enabled by default. To take advantage of the autobauding mode, special attention should be paid according to the following requirements: Synchronization between DTE and DCE: When DCE (the module) powers on with the autobauding enabled, it is recommended to wait 2 to 3 seconds before sending the first “AT” string. After receiving the “OK” response, DTE and DCE are correctly synchronized. If the host controller needs URC in the mode of autobauding, it must be synchronized first. Otherwise the URC will be discarded. Restrictions on autobauding operation  The UART port has to be operated at 8 data bits, no parity and 1 stop bit (factory setting).  The A/ and a/ commands can’t be used.  Only the strings “AT” or “at” can be detected (neither “At” nor “aT”).  The Unsolicited Result Codes like “RDY”, “+CFUN: 1” and “+CPIN: READY” will not be indicated when the module is turned on with autobauding enabled and not be synchronized.  Any other Unsolicited Result Codes will be sent at the previous baud rate before the module detects the new baud rate by receiving the first “AT” or “at” string. The DTE may receive unknown characters after switching to new baud rate.  It is not recommended to switch to autobauding from a fixed baud rate.  If autobauding is active it is not recommended to switch to multiplex mode Note: To assure reliable communication and avoid any problems caused by undetermined baud rate between DCE and DTE, it is strongly recommended to configure a fixed baud rate and save it instead of using autobauding after start-up. For more details, please refer to Section “AT+IPR” in document [1].
M10 Hardware Design M10_HD_V3.0 - 42 - 3.8.1.2. The connection of UART The connection between module and host via UART port is very flexible. Three connection styles are illustrated as below. UART Port connection is shown as below when it is applied in modulation-demodulation. Figure 18: Connection of all functional UART port Three lines connection is shown as below. Figure 19: Connection of three lines UART port UART Port with hardware flow control is shown as below. This connection will enhance the
M10 Hardware Design M10_HD_V3.0 - 43 - reliability of the mass data communication. Figure 20: Connection of UART port with hardware flow control 3.8.1.3. Software upgrade The TXD and RXD can be used to upgrade software. The PWRKEY pin must be pulled down before the software upgrade. Please refer to the following figure for software upgrade. IO Connector TXDRXDGNDPWRKEY Module (DCE) UART portTXDRXDGNDPWRKEY Figure 21: Connection of software upgrade3.8.2. Debug Port Debug Port:  Two lines: DBG_TXD and DBG_RXD  It outputs log information automatically.  Debug Port is only used for software debugging and its baud rate must be configured as
M10 Hardware Design M10_HD_V3.0 - 44 - 460800bps. Figure 22: Connection of software debug3.8.3. UART Port 3 UART3:  Two data lines: TXD3and RXD3  UART3 port is used for AT command only and does not support GPRS data, CSD FAX, Multiplexing function etc.  Support the communication baud rates as the following: 4800, 9600, 14400, 19200,28800,38400,57600,115200.  The default baud rate setting is 115200bps, and does not support autobauding. The baud rate can be modified by AT+QSEDCB command. For more details, please refer to document [1]. Figure 23: Connection of Auxiliary UART port
M10 Hardware Design M10_HD_V3.0 - 45 - 3.8.4. UART Application The reference design of 3.3V level match is shown as below. When the peripheral MCU/ARM system is 3V, the divider resistor should be changed from 5.6K to 10K. Figure 24: 3.3V level match circuit The reference design of 5V level match is shown as below. The construction of dotted line can refer to the construction of solid line. Please pay attention to direction of connection. Input dotted line of module should refer to input solid line of the module. Output dotted line of module should refer to output solid line of the module. MCU/ARM/TXD/RXD1KVDD_EXT4.7kVCC_MCU4.7k4.7k4.7kVDD_EXTTXDRXDRTSCTSDTRRI/RTS/CTSGNDVBATGPIO STATUSMODULEGPIOEINTVCC_MCUVoltage level: 5V Figure 25: 5V level match circuit
M10 Hardware Design M10_HD_V3.0 - 46 - The following picture is an example of connection between module and PC. A RS_232 level shifter IC or circuit must be inserted between module and PC, since these three UART ports do not support the RS_232 level, while support the CMOS level only. 98765432115148911125761042622713182021161719222324312528GNDTO PC serial portSP32383VGNDGNDT5OUT/SHUTDOWNV+GNDV-VCCT4OUTT2OUTT3OUTT1OUTR3INR2INR1IN/STATUS3V ONLINER1OUTR2OUTR3OUT/R1OUTGND T5INT4INT3INT2INT1INC2+C2-C1-C1+MODULERXDDTRRTSRICTSTXDDCD Figure 26: RS232 level match circuit3.9. Audio interfaces The module provides two analogy input channels and two analogy output channels.
M10 Hardware Design M10_HD_V3.0 - 47 - Table 11: Pin definition of Audio interface  AIN1 and AIN2, which may be used for both microphone and line inputs. An electret microphone is usually used. AIN1 and AIN2 are both differential input channels.  AOUT1 and AOUT2, which may be used for both receiver and speaker outputs. AOUT1 channel is typically used for a receiver built into a handset, while AOUT2 channel is typically used with headset or hands-free speaker. AOUT1 channel is a differential channel and AOUT2 is a single-ended channel. SPK2P and AGND can establish a pseudo differential mode. If customer needs to play Melody or Midi ringtone for incoming call, AOUT2 Channel should always be used.  These two audio channels can be swapped by “AT+QAUDCH” command. For more details, please refer to document [1]. Use AT command “AT+QAUDCH” to select audio channel: 0--AIN1/AOUT1 (normal audio channel), the default value is 0. 1--AIN2/AOUT2 (aux audio channel). For each channel, customer can use AT+QMIC to adjust the input gain level of microphone. Customer can also use “AT+CLVL” to adjust the output gain level of receiver and speaker. “AT+QECHO” is to set the parameters for echo cancellation control. “AT+QSIDET” is to set the side-tone gain level. For more details, please refer to document [1]. 3.9.1. Decrease TDD noise and other noise The 33pF capacitor is applied for filtering out 850MHz/900MHz RF interference when the module is transmitting at GSM900MHz. Without placing this capacitor, TDD noise could be heard. Moreover, the 10pF capacitor here is for filtering out 1800MHz/1900MHz RF interference. However, the resonant frequency point of a capacitor largely depends on the material and production technique. Therefore, customer would have to discuss with its capacitor vendor to choose the most suitable capacitor for filtering out GSM850MHz, GSM900MHz, DCS1800MHz and PCS1900MHz separately. Interface Name Pin Function (AIN1/AOUT1) MIC1P 23 Microphone1 input + MIC1N 24 Microphone1 input - SPK1P 22 Audio1 output+ SPK1N 21 Audio1 output- (AIN2/AOUT2) MIC2P 25 Microphone2 input + MIC2N 26 Microphone2 input - SPK2P 20 Audio2 output+ AGND 19 Suggested to be used in audio circuit. Do not connect to digital GND in host PCB as it could produce TDD noise.
M10 Hardware Design M10_HD_V3.0 - 48 - The severity degree of the RF interference in the voice channel during GSM transmitting period largely depends on the application design. In some cases, GSM850/GSM900 TDD noise is more severe; while in other cases, DCS1800/PCS1900 TDD noise is more obvious. Therefore, customer can have a choice based on test results. Sometimes, even no RF filtering capacitor is required. The capacitor which is used for filtering out RF noise should be close to RJ11 or other audio interfaces. Audio alignment should be as short as possible. In order to decrease radio or other signal interference, the position of RF antenna should be kept away from audio interface and audio alignment. Power alignment and audio alignment should not be parallel, and power alignment should be far away from audio alignment. The differential audio traces have to be placed according to the differential signal layout rules. 3.9.2. Microphone interfaces configuration AIN1/IN2 channels come with internal bias supply for external electret microphone. A reference circuit is shown in Figure27. 10pF 33pF33pF33pFClose to MicrophoneMICxPMICxNGNDGNDDifferential layoutModule Electret MicrophoneGNDGND10pF10pFGNDGNDESD ESDAGND Figure 27: Microphone interface configuration of AIN1&AIN2
M10 Hardware Design M10_HD_V3.0 - 49 - 3.9.3. Receiver and speaker interface configuration SPK1PSPK1NDifferential layout10pF10pF33pF33pF33pFClose to speakerGNDGND10pFESD ESD Module Figure 28: Speaker interface configuration of AOUT1 SPK1PSPK1NDifferential layout Amplifiercircuit 10pF10pF33pF33pF33pFClose to speakerGNDGND10pFESD ESD Module Figure 29: Speaker interface with amplifier configuration of AOUT1 Texas Instruments TPA6205A1is recommended for a suitable differential audio amplifier. There are plenty of excellent audio amplifiers in the market.
M10 Hardware Design M10_HD_V3.0 - 50 - SPK2PAGNDDifferential layout 10pF 33pFClose to speakerGNDESD Module 22uF Figure 30: Speaker interface configuration of AOUT2 Module SPK2PAGNDDifferential layout Amplifiercircuit 10pF10pF 33pF33pFClose to speakerGNDGNDESD ESD C2C1 Figure 31: Speaker interface with amplifier configuration of AOUT2 Note: The value of C1 and C2 depends on the input impedance of audio amplifier.
M10 Hardware Design M10_HD_V3.0 - 51 - 3.9.4. Earphone interface configuration Amphenol9001-8905-0501243SPK2PMIC2NMIC2P22uF68R33pFGND GNDAGNDClose to SocketDifferential layout33pFAGND33pF 10pFGND GNDGNDGNDAGNDModule4.7uF Figure 32: Earphone interface configuration Table 12: Typical electret microphone characteristic Parameter Min Type Max Unit Working Voltage 1.2 1.5 2.0 V Working Current 200 500 uA External Microphone Load Resistance 2.2 k Ohm Table 13: Typical speaker characteristic Parameter Min Typ Max Unit Normal Output(SPK1) Single Ended Load resistance 28 32 Ohm Ref level 0 2.4 Vpp Differential Load resistance 28 32 Ohm Ref level 0 4.8 Vpp Auxiliary Output(SPK2) Single Ended Load resistance 16 32 Ohm Ref level 0 2.4 Vpp Maxim driving current limit of SPK1 and SPK2 50 mA
M10 Hardware Design M10_HD_V3.0 - 52 - 3.10. SIM card interface 3.10.1. SIM card application The SIM interface supports the functionality of the GSM Phase 1 specification and also supports the functionality of the new GSM Phase 2+ specification for FAST 64 kbps SIM card, which is intended for use with a SIM application Tool-kit. The SIM interface is powered from an internal regulator in the module. Both 1.8V and 3.0V SIM Cards are supported. Table 14: Pin definition of the SIM interface Figure 33 is the reference circuit for SIM interface, and here an 8-pin SIM card holder is used. The pin SIM_PRESENCE is used to detect whether the tray of the Molex SIM socket, which is used for holding SIM card, is present in the card socket. When the tray is inserted in the socket, SIM_PRESENCE is at low level. Regardless of the SIM card is in the tray or not, the change of SIM_PRESENCE level from high to low level prompts the module to reinitialize SIM card. In default configuration, SIM card detection function is disabled. Customer’s application can use “AT+QSIMDET=1,0 ” to be switched on and “AT+QSIMDET=0,0 ” to switch off the SIM card detection function. For detail of this AT command, please refer to document [1]. When “AT+QSIMDET=1,0” is set and the tray with SIM card is removed from SIM socket, the following URC will be presented. +CPIN: NOT READY When the tray with SIM card is inserted into SIM socket again and the module finishes re-initializing SIM card, the following URC will be presented. Call Ready Name Pin Function SIM_VDD 12 Supply power for SIM Card. Automatic detection of SIM card voltage. 3.0V±10% and 1.8V±10%. Maximum supply current is around 10mA. SIM_DATA 13 SIM Card data I/O SIM_CLK 14 SIM Card Clock SIM_RST 15 SIM Card Reset SIM_PRESENCE 11 SIM Card Presence
M10 Hardware Design M10_HD_V3.0 - 53 - ModuleSIM_VDDSIM_RSTSIM_CLKSIM_DATASIM_PRESENCE22R22R22RVCCRSTCLK IOVPPGNDVDD_EXT10K 100nF SIM_CARDGNDGNDESDA6V8V6GNDPRESENCE Figure 33: Reference circuit of the 8 pins SIM card Note: Please do not use “AT+QSIMDET=1,1” which causes to initialize SIM card when Figure 33 circuit is adopted. If customer does not need the SIM card detection function, keep SIM_PRESENCE open. The reference circuit using a 6-pin SIM card socket is illustrated as the following figure. Figure 34: Reference circuit of the 6 pins SIM card
M10 Hardware Design M10_HD_V3.0 - 54 - In SIM interface designing, in order to ensure good communication performance with SIM card, the following design principles should be complied with.  Place the SIM card holder close to module as close as possible. Ensure the trace length of SIM signals do not exceed 20mm.  Keep the SIM signals far away from VBAT power and RF trace.  The width of SIM_VDD trace is not less than 0.5mm. Place a bypass capacitor close to SIM card power pin. The value of capacitor is less than 1uF.  To avoid possible cross-talk from the SIM_CLK signal to the SIM_DATA signal be careful that both lines are not placed closely next to each other. A useful approach is to use GND to shield the SIM_DATA line from the SIM_CLK line.  In order to ensure good ESD protection, it is recommended to add TVS such as WILL (http://www.willsemi.com) ESDA6V8AV6. The capacitance of ESD component is less than 50pF. The 22Ω resistors should be added in series between the module and the SIM card so as to suppress the EMI spurious transmission and enhance the ESD protection. Note that the SIM peripheral circuit should be close to the SIM card socket. 3.10.2. Design considerations for SIM card holder For 6-pin SIM card holder, it is recommended to use Amphenol C707 10M006 512 2. Please visit http://www.amphenol.com for more information. Figure 35: Amphenol C707 10M006 512 2 SIM card holder
M10 Hardware Design M10_HD_V3.0 - 55 - Table 15: Pin description of Amphenol SIM card holder Name Pin Function SIM_VDD C1 SIM Card Power supply SIM_RST C2 SIM Card Reset SIM_CLK C3 SIM Card Clock GND C5 Ground VPP C6 Not Connect SIM_DATA C7 SIM Card data I/O For 8-pin SIM card holder, it is recommended to use Molex 91228. Please visit http://www.molex.com for more information. Figure 36: Molex 91228 SIM card holder Table 16: Pin description of Molex SIM card holder Name Pin Function SIM_VDD C1 SIM Card Power supply SIM_RST C2 SIM Card Reset SIM_CLK C3 SIM Card Clock SIM_PRESENCE C4 SIM Card Presence Detection GND C5 Ground
M10 Hardware Design M10_HD_V3.0 - 56 - 3.11. Keypad interface The keypad interface consists of 5 keypad column inputs and 5 keypad row outputs. The basic configuration is 5 keypad columns and 5 keypad rows, giving 25 keys. Table 17: Pin definition of the keypad interface The keypad interface allows a direct external matrix connection. A typical recommended circuit about the keypad is shown in the following figure. VPP C6 Not Connect SIM_DATA C7 SIM Card Data I/O SIM_DETECT C8 Pulled down GND with external circuit. When the tray is present, C4 is connected to C8. Name Pin Function KBC0 33 Keypad matrix column KBC1 34 KBC2 35 KBC3 36 KBC4 37 KBR0 28 Keypad matrix row KBR1 29 KBR2 30 KBR3 31 KBR4 32
M10 Hardware Design M10_HD_V3.0 - 57 - KBR4KBR3KBR2KBR1KBR0KBC0KBC1KBC2KBC3KBC4ModuleGPIO1_KBC5 Figure 37: Reference circuit of the keypad interface If a 5*5 matrix does not provide enough keys, GPIO1 could be multiplexed as KBC5 to configure a 5*6 keypad matrix. Then, the keypad interface consists of 5 keypad row outputs and 6 keypad column inputs. The basic configuration is 5 keypad rows and 6 keypad columns, giving 30 keys. Note: This function is not supported in the default firmware. 3.12. ADC The module provides two auxiliary ADC interfaces to measure the values of two analog inputs. AT command “AT+QADC?” is used to read the voltage value present on ADC0 pin. AT command “AT+QEADC?” is used to read the voltage value present on ADC1 pin. For details of this AT command, please refer to document [1]. Table 18: Pin definition of the ADC Name Pin Function ADC0 41 Analog to digital converter. ADC1 40 Analog to digital converter
M10 Hardware Design M10_HD_V3.0 - 58 - Table 19: Characteristic of the ADC Item Min Typ Max Units Voltage range 0 2.8 V ADC Resolution 10 bits ADC accuracy 2.7 mV 3.13. Behaviors of the RI Table 20: Behaviors of the RI State RI response Standby HIGH Voice calling Changed to LOW, then: 1. Changed to HIGH when call is established. 2. Use ATH to hang up the call, RI changes to HIGH. 3. Calling part hangs up, RI changes to HIGH first, and changes to LOW for 120ms indicating “NO CARRIER” as an URC, then changes to HIGH again. 4. Change to HIGH when SMS is received. Data calling Changed to LOW, then： 1. Changed to HIGH when data connection is established. 2. Use ATH to hang up the data calling, RI changes to HIGH. 3. Calling part hangs up, RI changes to HIGH first, and changes to LOW for 120ms indicating “NO CARRIER” as an URC, then changes to HIGH again. 4. Changed to HIGH when SMS is received. SMS When a new SMS comes, the RI changes to LOW and holds low level for about 120 ms, then changes to HIGH. URC Certain URCs can trigger 120ms low level on RI. For more details, please refer to the document [10] If the module is used as a caller, the RI would maintain high except the URC or SMS is received. On the other hand, when it is used as a receiver, the timing of the RI is shown below.
M10 Hardware Design M10_HD_V3.0 - 59 - Figure 38: RI behaviour of voice calling as a receiver Figure 39: RI behaviour of data calling as a receiver Figure 40: RI behaviour as a caller
M10 Hardware Design M10_HD_V3.0 - 60 - Figure 41: RI behaviour of URC or SMS received 3.14. Network status indication The NETLIGHT signal can be used to drive a network status indicator LED. The working state of this pin is listed in Table 21. Table 21: Working state of the NETLIGHT State Module function Off The module is not running. 64ms On/ 800ms Off The module is not synchronized with network. 64ms On/ 2000ms Off The module is synchronized with network. 64ms On/ 600ms Off GPRS data transfer is ongoing. A reference circuit is shown in following figure. Figure 42: Reference circuit of the NETLIGHT
M10 Hardware Design M10_HD_V3.0 - 61 - 3.15. Operating status indication The STATUS pin is set as an output pin and can be used to judge whether module is power-on, please refer to Chapter 3.4. In customer design, this pin can be connected to a GPIO of DTE or be used to drive an LED in order to judge the module’s operation status. A reference circuit is shown in figure 43. Table 22: Pin definition of the STATUS Figure 43: Reference circuit of the STATUS 3.16. General purpose input & output (GPIO) The module provides a limited number of General Purpose Input/Output signal pins. The driving capability of these pins is 4mA. Every GPIO can be configured as input or output, and set to high or low when working as an output pin by “AT+CEQGPIO” command. Before using these GPIO pins, customer should configure them with “AT+CEQGPIO=1,x,x,x,x” first. For details, please refer to document [1]. Name Pin Function STATUS 54 Indicate module’s operating status
M10 Hardware Design M10_HD_V3.0 - 62 - Table 23: Pin definition of the GPIO interface 3.17. Open drain output (LIGHT_MOS) The module provides an open drain output pin to control keyboard backlight. The output LIGHT_MOS can sink 60mA. This open-drain output switch is high impedance when disabled. Table 24: Pin definition of the LIGHT_MOS Note: This function is not supported in the default firmware. There must be special firmware if customer needs this function. Please contact Quectel for more details. Module300RVBATLIGHT_MOS Figure 44: Reference circuit of the LIGHT_MOS Name Pin PU/PD Function GPIO0 64 Pulled up internally to 75K resistor General Purpose Input/Output Port GPIO1_KBC5 38 Pulled up internallyto 75K resistor General Purpose Input/Output Port Keypad interface KBC5 Name Pin Function LIGHT_MOS 27 Open drain output port
M10 Hardware Design M10_HD_V3.0 - 63 - 3.18. SD card interface The module provides SD card interface that supports many types of memory, such as Memory Stick, SD/MCC card and T-Flash or Micro SD card. The following are the main features of SD card interface.  Only supports 1bit serial mode  Dose not support the SPI mode SD/MMC memory card  Dose not support multiple SD memory cards  Dose not support hot plug  The data rate up to 26MHz in serial mode  Up to 32GB maximum memory card capacity With the SD card interface features and reference circuit shown in figure 45, the users can easily design the SD card application circuit to enhance the memory capacity of the module. The users can store some high-capacity files to external memory card. Such as in the automotive application system, the module can record and store the audio file to the SD card, and also can play the audio files in SD card. Table 25: Pin definition of the SD card interface Figure 45: Reference circuit of SD card Name Pin Function SD_DATA 1 Data output and input signal of SD card SD_CLK 2 Clock signal of SD card output SD_CMD 3 Command signal of SD card output
M10 Hardware Design M10_HD_V3.0 - 64 - Table 26: Pin name of the SD card and T-Flash(Micro SD) card In SD card interface designing, in order to ensure good communication performance with SD card, it should be complied with following design principles.  Route SD card signals as short as possible. Ensure the length of trace do not exceed 20mm.  In order to offer good ESD protection, it is recommended to add TVS on signals with the capacitance is less than 15pF.  Reserve external pull-up resistor for other data lines except the DATA0.  The SD_CLK and SD_DATA line must be shielded by GND in order to avoid interference.  The SD_CLK and SD_DATA and SD_CMD trace should be routed together and keep each trace as close as possible. Pin NO. Pin name of SD card Pin name of T-Flash(Micro SD) card 1 CD/DATA3 DATA2 2 CMD CD/DATA3 3 VSS1 CMD 4 VCC VCC 5 CLK CLK 6 VSS2 VSS 7 DATA0 DATA0 8 DATA1 DATA1 9 DATA2
M10 Hardware Design M10_HD_V3.0 - 65 - 4. Antenna interface The Pin 43 is the RF antenna pad. The RF interface has an impedance of 50Ω. A reference circuit is shown in following figure. By default, the resistor R1 is 0 ohm and capacitor C1 and C2 are not mounted. MODULERF_ANTR1 0RC1NMC2NM Figure 46: Reference circuit of RF interface 4.1. Antenna installation M10 provides an RF antenna PAD for customer’s antenna connection. The RF trace in host PCB connecting to the module RF antenna pad should be micro-strip line or other types of RF trace, whose characteristic resistance should be close to 50Ω. M10 comes with two grounding pads which are next to the antenna pad in order to give a better grounding. Table 27: Pin definition of the RF_ANT To minimize the loss on the RF trace and RF cable, they should be designed carefully. It is recommended that the insertion loss should try to meet the following requirements:  GSM850/EGSM900<1dB  DCS1800/PCS1900<1.5dB Name Pin Function RF_ANT 43 RF antenna pad GND 42 Ground GND 44 Ground
M10 Hardware Design M10_HD_V3.0 - 66 - 4.2. RF output power Table 28: The module conducted RF output power Frequency Max Min GSM850 33dBm ±2dB 5dBm±5dB EGSM900 33dBm ±2dB 5dBm±5dB DCS1800 30dBm ±2dB 0dBm±5dB PCS1900 30dBm ±2dB 0dBm±5dB Note: In GPRS 4 slots TX mode, the max output power is reduced by 2.5dB. This design conforms to the GSM specification as described in chapter 13.16 of 3GPP TS 51.010-1. 4.3. RF receiving sensitivity Table 29: The module conducted RF receiving sensitivity Frequency Receive sensitivity GSM850 < -108.5dBm EGSM900 < -108.5dBm DCS1800 < -108dBm PCS1900 < -108dBm 4.4. Operating frequencies Table 30: The module operating frequencies Frequency Receive Transmit ARFCH GSM850 869~894MHz 824~849MHz 128~251 EGSM900 925~960MHz 880~915MHz 0~124, 975~1023 DCS1800 1805~1880MHz 1710~1785MHz 512~885 PCS1900 1930~1990MHz 1850~1910MHz 512~810 4.5. Recommendation of RF pad welding If external antenna is connected with RF cable welded on the RF pads, please refer to figure 47. Any incorrect welding type may cause poor performance both in transmitting power and receiving sensitivity.
M10 Hardware Design M10_HD_V3.0 - 67 - Figure 47: Recommendation of RF pad welding
M10 Hardware Design M10_HD_V3.0 - 68 - 5. Electrical, reliability and radio characteristics 5.1. Absolute maximum ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of module are listed in the following table: Table 31: Absolute maximum ratings Parameter Min Max Unit VBAT -0.3 4.7 V Peak current of power supply 0 2 A RMS current of power supply (during one TDMA- frame) 0 0.7 A Voltage at digital pins -0.3 3.3 V Voltage at analog pins -0.3 3.0 V Voltage at digital/analog pins in POWER DOWN mode -0.25 0.25 V 5.2. Operating temperature The operating temperature is listed in the following table: Table 32: Operating temperature Parameter Min Typ Max Unit Normal temperature -35 25 +80 ℃ Restricted operation* -45 to -35 +80 to +85 ℃ Storage temperature -45 +90 ℃ * When the module works in this temperature range, the deviation from the GSM specification may occur. For example, the frequency error or the phase error could increase.
M10 Hardware Design M10_HD_V3.0 - 69 - 5.3. Power supply ratings Table 33: The module power supply ratings Parameter Description Conditions Min Type Max UnitVBAT Supply voltage Voltage must stay within the min/max values, including voltage drop, ripple, and spikes.3.3 4.0 4.6 V Voltage drop during transmitting burst Maximum power control level on GSM850 and GSM900. 400 mV Voltage ripple Maximum power control level on GSM850 and GSM900 @ f<200kHz @ f>200kHz 50 2 mVmV IVBAT Average supply current POWER DOWN mode SLEEP mode @ DRX=5 29 1.1 uA mA Minimum functionality mode AT+CFUN=0 IDLE mode SLEEP mode AT+CFUN=4 IDLE mode SLEEP mode 13 0.84 13 0.83 mA mA mA mA IDLE mode GSM850/EGSM900 DCS1800/PCS1900 13 13 mA mA TALK mode GSM850/EGSM9001) DCS1800/PCS19002) 209/208 191/202 mA mA DATA mode, GPRS (3 Rx,2Tx)GSM850/EGSM9001) DCS1800/PCS19002) 341/347 318/335 mA mA DATA mode, GPRS(2 Rx,3Tx) GSM850/EGSM9001) DCS1800/PCS19002) 394/408 377/396 mA mA DATA mode, GPRS (4 Rx,1Tx)GSM850/EGSM9001) DCS1800/PCS19002) 225/226 210/219 mA mA DATA mode, GPRS(1Rx,4Tx) GSM850/EGSM9001) 449/464 mA
M10 Hardware Design M10_HD_V3.0 - 70 - Parameter Description Conditions Min Type Max UnitDCS1800/PCS19002) 423/445 mA Peak supply current (during transmission slot) Maximum power control level on GSM900. 1.6 1.8 A 1) Power control level PCL 5 2) Power control level PCL 0 5.4. Current consumption The values of current consumption are shown in Table 34. Table 34: The module current consumption Condition Current Consumption Voice Call GSM850 @power level #5 <300mA,Typical 209mA @power level #12,Typical 96mA @power level #19,Typical 73mA GSM900 @power level #5 <300mA,Typical 208mA @power level #12,Typical 96mA @power level #19,Typical 73mA DCS1800 @power level #0 <250mA,Typical 191mA @power level #7,Typical 93mA @power level #15,Typical 70mA PCS1900 @power level #0 <250mA,Typical 202mA @power level #7,Typical 95mA @power level #15,Typical 71mA GPRS Data DATA mode, GPRS ( 1 Rx,1 Tx ) CLASS 12 GSM850 @power level #5 <350mA,Typical 199mA @power level #12,Typical 87mA @power level #19,Typical 63mA EGSM 900 @power level #5 <350mA,Typical 200mA @power level #12,Typical 96mA @power level #19,Typical 70mA DCS 1800 @power level #0 <300mA,Typical 184mA @power level #7,Typical 82mA @power level #15,Typical 66mA PCS 1900 @power level #0 <300mA,Typical 192mA @power level #7,Typical 82mA
M10 Hardware Design M10_HD_V3.0 - 71 - @power level #15,Typical 66mA DATA mode, GPRS ( 3 Rx, 2 Tx ) CLASS 12 GSM850 @power level #5 <550mA,Typical 341mA @power level #12,Typical 135mA @power level #19,Typical 85mA EGSM 900 @power level #5 <550mA,Typical 347mA @power level #12,Typical 156mA @power level #19,Typical 103mA DCS 1800 @power level #0 <450mA,Typical 318mA @power level #7,Typical 118mA @power level #15,Typical 84mA PCS 1900 @power level #0 <450mA,Typical 335mA @power level #7,Typical 128mA @power level #15,Typical 95mA DATA mode, GPRS ( 2 Rx, 3 Tx ) CLASS 12 GSM850 @power level #5 <600mA,Typical 394mA @power level #12,Typical 176mA @power level #19,Typical 102mA EGSM 900 @power level #5 <600mA,Typical 408mA @power level #12,Typical 189mA @power level #19,Typical 110mA DCS 1800 @power level #0 <490mA,Typical 377mA @power level #7,Typical 147mA @power level #15,Typical 97mA PCS 1900 @power level #0 <480mA,Typical 396mA @power level #7,Typical 146mA @power level #15,Typical 98mA DATA mode, GPRS ( 4 Rx,1 Tx ) CLASS 12 GSM850 @power level #5 <350mA,Typical 225mA @power level #12,Typical 87mA @power level #19,Typical 62mA EGSM 900 @power level #5 <350mA,Typical 226mA @power level #12,Typical 97mA @power level #19,Typical 69mA DCS 1800 @power level #0 <300mA,Typical 210mA @power level #7,Typical 82mA @power level #15,Typical 66mA PCS 1900 @power level #0 <300mA,Typical 219mA @power level #7,Typical 82mA @power level #15,Typical 66mA DATA mode, GPRS ( 1 Rx, 4 Tx ) CLASS 12 GSM850 @power level #5 <660mA,Typical 449mA @power level #12,Typical 207mA
M10 Hardware Design M10_HD_V3.0 - 72 - @power level #19,Typical 109mA EGSM 900 @power level #5 <660mA,Typical 464mA @power level #12,Typical 221mA @power level #19,Typical 117mA DCS 1800 @power level #0 <530mA,Typical 423mA @power level #7,Typical 166mA @power level #15,Typical 99mA PCS 1900 @power level #0 <530mA,Typical 445mA @power level #7,Typical 165mA @power level #15,Typical 100mA Note: GPRS Class 12 is the default setting. The module can be configured from GPRS Class 1 to Class 12 by “AT+QGPCLASS”. Setting to lower GPRS class would make it easier to design the power supply for the module. 5.5. Electro-static discharge Although the GSM engine is generally protected against Electrostatic Discharge (ESD), precautions about ESD protection should still be emphasized. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any applications using the module. The measured ESD values of module are shown as the following table: Table 35: The ESD endurance (Temperature:25℃,Humidity:45 %) Tested point Contact discharge Air discharge VBAT,GND ±5KV ±12KV PWRKEY ±4KV +8KV/-6 KV SIM Card Interface ±4KV +8KV/-6 KV Antenna port ±5KV ±10KV SPK1P/1N, SPK2P/2N, MIC1P/1N, MIC2P/2N ±4KV +8KV/-6 KV
M10 M10_6. MThis6.1. Hardware De_HD_V3.0 Mechanis chapter desc. Mechanicesign cal dimecribes the meal dimensio Figure 4 ensionschanical dimons of mod48: M10 top a mensions of thdule and side dim e module. mensions（Un nit: mm） - 73 -
M10 Hardware Design M10_HD_V3.0 - 74 - test point Figure 49: M10 bottom dimensions（Unit: mm） Figure 50: PAD bottom dimensions（Unit: mm）
M10 Hardware Design M10_HD_V3.0 - 75 - 6.2. Footprint of recommendation single pad
M10 Hardware Design M10_HD_V3.0 - 76 - keepout areamodule dimensionsafe area line Figure 51: Footprint of recommendation（Unit: mm） Note1：Keep out the area below the test point in the host PCB. Place solder mask. Note2：In order to maintain the module, keep about 3mm between the module and other components in host PCB. Note3：Keep out area in above figure in which is forbid to pour GND copper. Since the RF test point in this area, avoid generating parasitic capacitance between RF test point and GND.
M10 M10_6.3.6.4. Hardware De_HD_V3.0 . Top view . Bottom viesign of the modew of the mF dule Figure 52: module Figure 53: B Top view of Bottom view o fthe moduleof the modul le - 77 -
M10 Hardware Design M10_HD_V3.0 - 78 - Appendix A: GPRS coding schemes Four coding schemes are used in GPRS protocol. The differences between them are shown in Table 36. Table 36: Description of different coding schemes Scheme Code rate USF Pre-coded USF Radio Block excl.USF and BCS BCS Tail Coded bits Punctured bits Data rate Kb/s CS-1 1/2 3 3 181 40 4 456 0 9.05 CS-2 2/3 3 6 268 16 4 588 132 13.4 CS-3 3/4 3 6 312 16 4 676 220 15.6 CS-4 1 3 12 428 16 - 456 - 21.4 Radio block structure of CS-1, CS-2 and CS-3 is shown as Figure 54: Figure 54: Radio block structure of CS-1, CS-2 and CS-3 Radio block structure of CS-4 is shown as Figure 55: Figure 55: Radio block structure of CS-4 Rate 1/2 convolutional codingPuncturing456 bitsUSF BCS Radio BlockBlock Code No coding456 bitsUSF BCSRadio Block
M10 Hardware Design M10_HD_V3.0 - 79 - Appendix B: GPRS multi-slot classes Twenty-nine classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot classes are product dependant, and determine the maximum achievable data rates in both the uplink and downlink directions. Written as 3+1 or 2+2, the first number indicates the amount of downlink timeslots, while the second number indicates the amount of uplink timeslots. The active slots determine the total number of slots the GPRS device can use simultaneously for both uplink and downlink communications. The description of different multi-slot classes of the M10 module support is shown in Table 37. Table 37: GPRS multi-slot classes Multislot class Downlink slots Uplink slots Active slots 1 1 1 2 2 2 1 3 3 2 2 3 4 3 1 4 5 2 2 4 6 3 2 4 7 3 3 4 8 4 1 5 9 3 2 5 10 4 2 5 11 4 3 5 12 4 4 5
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