Qisda H20 HSUPA PCI Express mini card module User Manual H20 Manual 2

Qisda Corporation HSUPA PCI Express mini card module H20 Manual 2

UserMan 20090313

Datasheet H20 HSUPA PCI Express mini card module Datasheet Rev. 0.1 2008/04/30 Copyright Qisda Corporation This document contains proprietary technical information which is the property of Qisda Corporation and is issued in strict confidential and shall not be disclosed to others parties in whole or in parts without written permission of Qisda Corporation The documents contain information on a product, which is under development and is issued for customer evaluation purposes only. Qisda may make changes to product specifications at any time, without notice. Qisda Corporation Mobile Communications BG 18 JiHu Road, Nei-Hu, Taipei 114, Taiwan, R.O.C. Tel: +886-2-2799-8800 Fax: +886-2-2656-6390 http://www.Qisda.com H20 Datasheet
HISTORY Version Date Notes VER: 0.1 2008-APR-30 FIRST RELEASE
1. INTRODUCTION .................................................................................................... 4 1.1 Description.............................................................................................................4 1.2 Application Device .................................................................................................4 2. FEATURES ............................................................................................................... 5 2.1 General Characteristics ..........................................................................................5 2.2 RF Functionalities ..................................................................................................6 Maximum TX Power............................................................................................6 Parametric Performance ......................................................................................6 Sensitivity.............................................................................................................7 Radio Frequency ..................................................................................................7 3. HARDWARE DESCRIPTION................................................................................... 10 3.1 System Interface....................................................................................................10 3.2 Functional Diagram .............................................................................................11 3.3 Pin Description ....................................................................................................12 3.4 Terminal Definition..............................................................................................14 3.5 Electrical Characteristics ......................................................................................16 DC characteristics ..............................................................................................16 Digital interface..................................................................................................17 USB Transceiver DC characteristics ...................................................................17 USIM Interface...................................................................................................18 3.6 Environmental......................................................................................................19 3.7 Physical Package ...................................................................................................20 4. SOFTWARE CHARACTERISTICS............................................................................ 23 4.1 Introduction .........................................................................................................23 4.2 Software Architecture ...........................................................................................23
1. INTRODUCTION 1.1 Description Overview This document describes all the functions, features, and interfaces of the HSUPA PCI Express Mini Card Module – H20 from Qisda. Qisda H20 HSUPA module supports Tri-band WCDMA/HSDPA/HSUPA and Quad-band GSM/GPRS/EDGE network connection capability. Qisda H20 HSUPA card can provides high speed data connection, the data speed of downlink and uplink path is up to 7.2Mbps and 5.76Mbps respectively. Furthermore, users can ease to use this module by using the “HMTool” application software that we provide for Windows XP and Vista system. With the Qisda H20 HSUPA module, devices are enhanced in both functionality and usability based on state of the art wireless technology. 1.2 Application Device Scope Qisda H20 module is a high speed modem card with PCI Express minicard form factor and is focusing on the Notebook, UMPC, MID and other portable device marketing. ¾ Notebook ¾ Ultra Mobile PC ¾ Mobile Internet Device ¾ Wireless Router ¾ USB Modem ¾ Car Embedded System
2. FEATURES 2.1 General Characteristics z Bands: Tri Band WCDMA and Quad Band GSM Band TX RX GSM850 824~849 MHz 869~894MHz EGSM900 880~915 MHz 925~960MHz DCS1800 1710~1785MHz 1805~1880MHz PCS1900 1850~1910MHz 1930~1990MHz WCDMA850 824~849 MHz 869~894MHz WCDMA1900 1850~1910MHz 1930~1990MHz WCDMA2100 1920~1980MHz 2110~2170MHz z Support SIM Interface: 1.8V/3V z Form factor i. Dimension: 50.95 x 30 x 5.0 mm ii. Weight: 12g z Power Operation Voltage: 3.3V +/- 9% z Power Consumption: Speech Mode: Band Typ Max Unit GSM850 / PCL=5 385 410 mA EGSM900 / PCL=5 385 410 mA DCS / PCL=0 330 350 mA PCS / PCL=0 330 350 mA WCDMA (all band) 750 820 mA Standby Mode: Typ (Average) Max (Average) Unit GSM / Page frame=2 3.5 4.5 mA GSM / Page frame=9 1.5 3 mA DCS / Page frame=2 3.5 4.5 mA DCS / Page frame=9 1.9 3.5 mA PCS / Page frame=2 3.5 4.5 mA PCS / Page frame=9 1.6 3 mA WCDMA / DRX=6 (0.64 S) 4.2 5.5 mA WCDMA / DRX=9 (5.12 S) 1.7 3 mA
z Hardware Interface: 52 Pins PCI Express Mini Card connector interface 2 RF Antenna Coaxial Connectors z Software Interface: USB driver HMTool software tool. 2.2 RF Functionalities Maximum TX Power The performance of the transmitter meets test requirement ETSI TS 151 010-1 chapter 13.3 for GSM, chapter 13.17.3 for EDGE and TS 34.121 chapter 5.2&5.4.3 for WCDMA, chapter 5.2A for HSDPA, chapter 5.2B for HSUPA. Band Max Min GSM850 33 dBm ±2dBm 5 dBm ±5dBm EGSM 33 dBm ±2dBm 5 dBm ±5dBm DCS 30 dBm ±2dBm 0 dBm ±5dBm PCS 30 dBm ±2dBm 0 dBm ±5dBm GSM850(EDGE) 27 dBm ±3dBm 5 dBm ±5dBm EGSM(EDGE) 27 dBm ±3dBm 5 dBm ±5dBm DCS(EDGE) 26 dBm ±3dBm 2 dBm ±5dBm PCS(EDGE) 26 dBm ±3dBm 2 dBm ±5dBm UMTS-2100 24 dBm +1/-3dBm Less than -50dBm UMTS-1900 24 dBm +1/-3dBm Less than -50dBm UMTS-850 24 dBm +1/-3dBm Less than -50dBm 1/15≦βo/βd≦12/15 (HS-DPCCH) 24 dBm +1/-3dBm 13/15≦βo/βd≦15/8 (HS-DPCCH) 23 dBm +2/-3dBm 15/7≦βo/βd≦15/0 (HS-DPCCH) 22 dBm +3/-3dBm Sub-test 1 (E-DCH) 24 dBm +1.7/-5.2dBm Sub-test 2 (E-DCH) 22 dBm +3.7/-5.2dBm Sub-test 3 (E-DCH) 23 dBm +2.7/-5.2dBm Sub-test 4 (E-DCH) 22 dBm +3.7/-5.2dBm Sub-test 5 (E-DCH) 24 dBm +1.7/-5.2dBm Parametric Performance Tests carried out at -20ºC, 25ºC and 60ºC for each voltage 3V, 3.3V and 3.6V. The Measured Peak Phase, RMS Phase, frequency error, power level, and static sensitivity meets ETSI TS 151 010-1 chapter 13.1 for GSM and TS 34.121 chapter 5.13.1 for WCDMA, chapter 5.13.1A for HSDPA Band (GSM) Peak Phase Error RMS Phase Error GSM850 <20° <5° EGSM <20° <5° DCS <20° <5° PCS <20° <5°
Band (GSM) Peak Phase Error RMS Phase Error Band (WCDMA) Error Vector Magnitude UMTS-2100(HS-DPCCH) <17.5% UMTS-1900(HS-DPCCH) <17.5% UMTS-850(HS-DPCCH) <17.5% Sensitivity The performance of the receiver meets test requirement ETSI TS 151 010-1 chapter 14.2.1 for GSM, chapter 14.18.1 for EDGE and TS 34.121 chapter 6.2 for WCDMA. Band Typical Min GSM850 -107 dBm -104 dBm EGSM -107 dBm -104 dBm DCS -107 dBm -103 dBm PCS -107 dBm -103 dBm EDGE(GMSK modulation) -107 dBm -104 dBm EDGE(8-PSK modulation) -104 dBm -102 dBm UMTS-2100(Primary) -109 dBm -106.7 dBm UMTS-2100(Secondary) -109 dBm N/A UMTS-1900(Primary) -107 dBm -104.7 dBm UMTS-1900(Secondary) -109 dBm N/A UMTS-850(Primary) -109 dBm -106.7 dBm UMTS-850(Secondary) -109 dBm N/A Radio Frequency GSM850 (850 MHz) Frequency Range TX 824-849 MHz; RX 869-894 MHz Channel Spacing 200 KHz Number of Channels 124 Carriers x 8 (TDMA) Modulation GMSK / 8-PSK Duplex Spacing 45 MHz Frequency Stability +/- 0.1 ppm (Uplink TX) Power Output 33 dBm Class 8 (2 W peak) – 5 dBm Output Impedance 50 Ohm Spurious Emission -36 dBm up to 1 GHz (< -30 dBm > 1 GHz) EGSM (900 MHz) Frequency Range TX 880-915 MHz; RX 925-960 MHz Channel Spacing 200 KHz Number of Channels 124 Carriers x 8 (TDMA) Modulation GMSK / 8-PSK Duplex Spacing 45 MHz Frequency Stability +/- 0.1 ppm (Uplink TX) Power Output 33 dBm Class 8 (2 W peak) – 5 dBm Output Impedance 50 Ohm Spurious Emission -36 dBm up to 1 GHz (< -30 dBm > 1 GHz)
DCS (1800 MHz) Frequency Range TX 1710-1785 MHz; RX 1805-1880 MHz Channel Spacing 200 KHz Number of Channels 374 Carriers x 8 (TDMA) Modulation GMSK / 8-PSK Duplex Spacing 95 MHz Frequency Stability +/- 0.1 ppm (Uplink TX) Power Output 30 dBm – 0 dBm Output Impedance 50 Ohm Spurious Emission -36 dBm up to 1 GHz (< -30 dBm > 1 GHz) Compatible with phase 2 feature PCS (1900 MHz) Frequency Range TX: 1850~1910MHz; RX: 1930~1990MHz Channel Spacing 200KHz Number of Channels 299 Carriers x 8 (TDMA) Modulation GMSK / 8-PSK Duplex Spacing 80 MHz Frequency Stability +/- 0.1 ppm (Uplink TX) Power Output 30 dBm – 0 dBm Output Impedance 50 Ohm Spurious Emission -36 dBm up to 1 GHz (< -30 dBm > 1 GHz) Compatible with phase 2 feature WCDMA_IMT (2100 MHz) Frequency Range TX: 1920~1980MHz; RX: 2110~2170MHz Channel Raster 200KHz Number of Channels 299 Carriers x 8 (TDMA) Modulation QPSK Duplex Spacing 190 MHz Frequency Stability +/- 0.1 ppm (Uplink TX) Power Output 24 dBm +1/-3dBm - less than -50dBm Output Impedance 50 Ohm Spurious Emission -67dBm(925-935MHz);-79dBm(935-960MHz);-71dBm(1805-1880MHz) ;-60dBm(1845-1880MHz);-41dBm(1885-1920MHz) WCDMA_PCS (1900 MHz) Frequency Range TX: 1850~1910MHz; RX: 1930~1990MHz Channel Raster 200KHz Number of Channels 299 Carriers x 8 (TDMA) Modulation QPSK Duplex Spacing 80 MHz Frequency Stability +/- 0.1 ppm (Uplink TX) Power Output 24 dBm +1/-3dBm - less than -50dBm Output Impedance 50 Ohm Spurious Emission WCDMA_850 (850 MHz) Frequency Range TX 824-849 MHz; RX 869-894 MHz Channel Raster 200KHz Number of Channels 299 Carriers x 8 (TDMA) Modulation QPSK Duplex Spacing 45 MHz
Frequency Stability +/- 0.1 ppm (Uplink TX) Power Output 24 dBm +1/-3dBm - less than -50dBm Output Impedance 50 Ohm Spurious Emission -60dBm(869-894MHz;1930-1990MHz;2110-2155MHz)
3. HARDWARE DESCRIPTION 3.1 System Interface The I/O connectors of H20 module are PCI EXPRESS MINI CARD and two RF antenna connectors. Table 3-1 summarizes the 25 signals and 18 power lines that are supported by the PCI Express Mini Card System Interface. Table 3-2 shows the antenna interface. Table 3-1 System Interface Signal Group Pin no. Description Power 5 3.3V power source GND 13 Return current path USB 2 USB serial data interface compliant to the USB 2.0 specification PERST# 1 Function reset to the card W_DISABLE# 1 Shutdown the HSDPA module UIM 4 SIM function LED 3 Status indicators Table 3-2 Antenna interface Signal Group Connector no. Description ANT 2 Antenna interface
3.2 Functional Diagram
3.3 Pin Description Pin Signal name Direction Description 1 NC No connect 2 +3.3Vaux Power 3.3V power source 3 NC No connect 4 GND Power Return current path 5 NC No connect 6 NC No connect 7 NC No connect 8 UIM_PWR Output Power source for the USIM 9 GND Power Return current path 10 UIM_DATA Input / Output USIM data signal 11 NC No connect 12 UIM_CLK Output USIM clock signal 13 NC No connect 14 UIM_RESET Output USIM reset signal 15 GND Power Return current path 16 NC No connect 17 NC No connect 18 GND Power Return current path 19 NC No connect 20 W_DISABLE# Input Active low signal. This signal is used by the system to shutdown the HSDPA module. 21 GND Power Return current path 22 PERST# Input Active low signal. Function reset to the card. 23 NC No connect 24 +3.3Vaux Power 3.3V power source 25 NC No connect 26 GND Power Return current path 27 GND Power Return current path 28 NC No connect 29 GND Power Return current path 30 NC No connect 31 NC No connect
32 NC No connect 33 NC No connect 34 GND Power Return current path 35 GND Power Return current path 36 USB_D- Input / Output USB serial data interface (negative) 37 GND Power Return current path 38 USB_D+ Input / Output USB serial data interface (postive) 39 +3.3Vaux Power 3.3V power source 40 GND Power Return current path 41 +3.3Vaux Power 3.3V power source 42 LED_WWAN# Output Active low signal. WAN status LED driver. 43 GND Power Return current path 44 LED_WLAN# Output Active low signal. LAN status LED driver. 45 NC No connect 46 LED_WPAN# Output Active low signal. PAN status LED driver. 47 NC No connect 48 NC No connect 49 NC No connect 50 GND Power Return current path 51 NC No connect 52 +3.3Vaux Power 3.3V power source
3.4 Terminal Definition Recommend antenna connect Hirose Coaxial Connectors
System connector 52 pins PCI Express Mini Card
3.5 Electrical Characteristics DC characteristics Pin Function/ Name Direction Parameter Min Typ Max Unit 1 NC 2 +3.3Vaux Power Power Supply Voltage 3.0 3.3 3.6 V 3 NC 4 GND Power Ground 5 NC 6 NC 7 NC Supply Voltage 1.5 2.85 3.05 V 8 UIM_PWR Output Current 150 mA 9 GND Power Ground 10 UIM_DATA Input / Output 11 NC 12 UIM_CLK Output 13 NC 14 UIM_RESET Output 15 GND Power Ground 16 NC 17 NC 18 GND Power Ground 19 NC Logic High Input Voltage 1.69 2.6 3.3 V 20 W_DISABLE# Input Logic Low Input Voltage -0.3 0 0.91 V 21 GND Power Ground Logic High Input Voltage 1.69 2.6 3.3 V 22 PERST# Input Logic Low Input Voltage -0.3 0 0.91 V 23 NC 24 +3.3Vaux Power Power Supply Voltage 3.0 3.3 3.6 V 25 NC 26 GND Power Ground 27 GND Power Ground 28 NC 29 GND Power Ground 30 NC 31 NC
32 NC 33 NC 34 GND Power Ground 35 GND Power Ground 36 USB_D- Input / Output Termination Voltage 3.0 3.3 3.6 V 37 GND Power Ground 38 USB_D+ Input / Output Termination Voltage 3.0 3.3 3.6 V 39 +3.3Vaux Power Power Supply Voltage 3.0 3.3 3.6 V 40 GND Power Ground 41 +3.3Vaux Power Power Supply Voltage 3.0 3.3 3.6 V 42 LED_WWAN# Output Driver current 0 150 mA 43 GND Power Ground 44 LED_WLAN# Output Driver current 0 150 mA 45 NC 46 LED_WPAN# Output Driver current 0 300 mA 47 NC 48 NC 49 NC 50 GND Power Ground 51 NC 52 +3.3Vaux Power Power Supply Voltage 3.0 3.3 3.6 V Digital interface Parameter Min Typ Max Unit Logic High Input Voltage 1.69 2.6 2.9 V Logic Low Input Voltage -0.3 0 0.91 V Logic High Output Voltage 2.15 2.6 2.6 V Logic Low Output Voltage -0.3 0 0.45 V USB Transceiver DC characteristics The USB interface is powered from 3.3V power source. Parameter Comments Min Ty p Max Unit Input sensitivity (differential) |D+－D-|, VIN=0.8 to 2.5V 0.2 V Output voltage Logic LOW Logic HIGH RL=1.5KΩ to 3.6V RL=1.5KΩ to GND, IO=1mA 2.8 0.3 3.6 V V Series output resistance D+, D- 28 33 44 Ω
Internal pull-up resistor 3.3V to D+, 3.3V to D- 1.425 1.5 1.575 KΩ Internal pull-down resistor D+ to GND, D- to GND 14.3 15 24.8 KΩ USIM Interface The USIM signals are defined on system connector to provide the interface between the removable User Identity Module. USIM interface usually run off either 1.8V or 3.0V. Pin Name Direction Description 8 UIM_PWR Output Power source for the USIM 10 UIM_DATA Input / Output USIM data signal 12 UIM_CLK Output USIM clock signal 14 UIM_RESET Output USIM reset signal Parameter Comments Min Typ Max Unit Logic High Input Voltage 1.8525 2.85 3.15 V Logic Low Input Voltage -0.3 0 0.9975 V Logic High Output Voltage 2.4 2.85 2.85 V Logic Low Output Voltage -0.3 0 0.45 V Schmitt Hysteresis 150 mV Logic input leakage current -200 200 nA Internal pull-up resistor Programmable range 1 30 KΩ
3.6 Environmental Operational temperature: -20 ~ +60 ℃ Functional temperature: -20 ~ +70 ℃ Storage temperature: -40 ~ +85 ℃ Note: ¾ The maximum case temperature (Tc) of shielding case cover should be under 90 ℃ (@RF TX power = 24dBm) for ensure all of the characteristics of H20 module can be fulfilled the ETSI specification. ¾
3.7 Physical Package Top View
Bottom View
Side View
4. SOFTWARE CHARACTERISTICS 4.1 Introduction We provide the PC Tool – HMTool for H20 HSUPA card. The main functions in this tool are Contacts (only SIM card), SMS, Settings, and Network Management. 4.2 Software Architecture
-28- FEDERAL COMMUNICATIONS COMMISSION INTERFERENCE STATEMENT This mobile device meets guidelines for exposure to radio waves. Your mobile device is a radio transmitter and receiver. It is designed not to exceed the limits for exposure to radio waves recommended by international guidelines. This equipment has been tested and found to comp ly with the limits for a Class B digit al device, pursuant to P art 15 of the FCC Ru les. Thes e limit s are designed to provide reasonable protection against harmful interfer ence in a residential inst allation. This equipment generates, uses and c an radiate radio frequency energy and, if not inst alled and used in accordance with the instructions, may cause harmful interference to radio communications. However , there is no guarant ee that interference will not occur in a particular inst allation. If this equipment does cause harmful i nterference to radio or television reception, which c an be determined by turning the equipment of f and on, th e user is encouraged to try to correct the interference by one or more of the following measures: – Reorient or relocate the receiving antenna. – Increase the separation between the equipment and receiver. – Connect the equipment into an outlet on a circ uit dif ferent from that to w hich the receiver is connected. – Consult the dealer or an experienced radio/TV technician for help. CAUTION: Any changes or modifications not expre ssly approved by the p arty responsible for compliance could void the user's authority to operate the equipment. FCC RF Radiation Exposure Statement This equipment complies with F CC RF radiation exposure limits set forth for an uncontrolled environment. This equipment must be inst alled and operated with a minimum dist ance of 20cm between the radiator and your body.

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