Particle PHOTON PHOTON User Manual photon datasheet v011 FCC md

Spark Labs, Inc., PHOTON photon datasheet v011 FCC md

Users Manual

Photon DatasheetModel number: PHOTONHvoid setup() { Spark.publish("my-event","The internet just got smarter!");}1 of 35
Photon Datasheet v011ContentsPhoton DatasheetContents1. Functional description1.1 Overview1.2 Features2. Interfaces2.1 Power2.2 RF2.3 FCC Approved Antennas2.4 Peripherals and GPIO2.5 JTAG2.6 External Coexistence Interface3. Pin and button def inition3.1 Pin markings3.2 Pin description3.3 Pin out diagrams4. Technical specif ication4.1 Absolute maximum ratings4.2 Recommended operating conditions4.3 Wi-Fi Specif ications4.4 I/O Characteristics5. Mechanical specif ications5.1 Dimensions and Weight5.2 Mating connectors5.3 Recommended pcb land pattern (Photon with headers)5.4 Recommended pcb land pattern (Photon without headers)6. Layout6.1 Photon v1.0.0 Top Layer (GTL)6.2 Photon v1.0.0 GND Layer (G2L)6.3 Photon v1.0.0 3V3 Layer (G15L)6.4 Photon v1.0.0 Bottom Layer (GBL)7. Recommended solder reflow profile8. Bill of MaterialsBuild your own design based on the Photon!9. Ordering information2 of 35
10. Qualification and approvals11. Product handling11.1 Packaging11.2 Moisture sensitivity levels11.3 ESD Precautions12. Def ault settings13. Glossary14. FCC IC CE Warnings and End Product Labeling Requirements15. Revision history16. Contact3 of 35
Photon Datasheet v0111. Functional description1.1 OverviewParticle’s Internet of Things hardware development kit, the Photon, provides everything you need to build aconnected product. Particle combines a powerful ARM Cortex M3 micro-controller with a Broadcom Wi-Fi chip in a tinythumbnail-sized module called the PØ (P-zero).To get you started quickly, Particle adds a rock solid 3.3VDC SMPS power supply, RF and user interface components tothe PØ on a small single-sided PCB called the Photon. The design is open source, so when you’re ready to integratethe Photon into your product, you can.The Photon comes in two physical forms: with headers and without. Prototyping is easy with headers as the Photonplugs directly into standard breadboards and perfboards, and may also be mounted with 0.1” pitch female headers ona PCB. To minimize space required, the Photon f orm factor without headers has castellated edges. These make itpossible to surface mount the Photon directly onto your PCB.1.2 FeaturesParticle PØ Wi-Fi module Broadcom BCM43362 Wi-Fi chip802.11b/g/n Wi-FiSTM32F205 120Mhz ARM Cortex M31MB flash, 128KB RAMOn-board RGB status LED (ext. drive provided)18 Mixed-signal GPIO and advanced peripheralsOpen source desig nReal-time operating system (FreeRTOS)Sof t AP setupFCC, CE and IC certified4 of 35
Photon Datasheet v0112. Interfaces2.1 PowerPower to the Photon is supplied via the on-board USB Micro B connector or directly via the VIN pin. If power is supplieddirectly to the VIN pin, the voltage should be reg ulated between 3.6VDC and 5.5VDC. When the Photon is powered viathe USB port, VIN will output a voltage of approximately 4 .8VDC due to a reverse polarity protection series schottkydiode between V+ of USB and VIN. When used as an output, the max load on VIN is 1A.Typical current consumption is 80mA with a 5V input. Deep sleep quiescent current is 160uA. When powering thePhoton f rom the USB connector, make sure to use a quality cable to minimize IR drops (current x resistance = voltage)in the wiring. If a high resistance cable (i.e., low current) is used, peak currents drawn from the Photon whentransmitting and receiving will result in voltage sag at the input which may cause a system brown out or intermittentoperation. Likewise, the power source should be suff icient enough to source 1A of current to be on the safe side.2.2 RFThe RF section of the Photon is a finely tuned impedance controlled network of components that optimize theefficiency and sensitivity of the Wi-Fi communications.An RF feed line runs from the PØ module into a SPDT RF-switch. Log ic level control lines on the PØ module select whichof the two ports of the RF-switch is connected to the RF feed line. A 100pF decoupling capacitor is located on eachcontrol line. One port is connected to a PCB ceramic chip antenna, and the other is connected to a u.FL connector forexternal antenna adaptation. The def ault port will be set to the chip antenna.Additionally, a user API is available to switch between internal, external and even an automatic mode whichcontinuously switches between each antenna and selects the best signal. All three RF ports on the RF-switch have a10pF RF quality DC-blocking capacitor in series with them. These effectively pass 2.4GHz frequencies freely whileblocking unwanted DC voltages from damaging the RF-switch. All RF traces are considered as tiny transmission linesthat have a controlled 50 ohm impedance.The chip antenna is impedance matched to the 50 ohm RF feed line via a Pi network comprised of three RF inductors (1series, 2 shunt). These values are quite specific to the Photon due to the PCB construction and layout of the RFsection. Even if the Photon’s layout design is copied exactly, to achieve the best performance it would be worth re-examining the Pi network values on actual samples of the PCB in question.5 of 35
Photon Datasheet v0112.3 FCC Approved AntennasAntenna T ype Manuf acturer MFG. Part # GainDipole antenna LumenRadio 104 -1001 2.15dBiChip antenna Advanced Ceramic X AT7020-E3R0HBA 1.3dBi2.4 Peripherals and GPIOThe Photon has ton of capability in a small footprint, with analog, digital and communication interf aces.Peripheral Type Qty Input(I) / Output(O) FT / 3V3Digital 18 I/O FT/3V3Analog (ADC) 8 I 3V3Analog (DAC) 2 O 3V3SPI 2 I/O 3V3I2S 1 I/O 3V3I2C 1 I/O FTCAN 1 I/O FTUSB 1 I/O 3V3PWM 9 O 3V3Notes: FT = 5.0V tolerant pins. All pins except A3 and DAC are 5V tolerant (when not in analog mode). If used as a 5V inputthe pull-up/pull-down resistor must be disabled. 3V3 = 3.3V max pins. PWM is available on D0, D1, D2, D3, A4, A5, WKP, RX, TX with a caveat: PWM timer peripheral is duplicated on two pins(A5/D2) and (A4/D3) for 7 total independent PWM outputs. For example: PWM may be used on A5 while D2 is used as aGPIO, or D2 as a PWM while A5 is used as an analog input. However A5 and D2 cannot be used as independentlycontrolled PWM outputs at the same time.[1] [2]3[1][2][3]6 of 35
Photon Datasheet v0112.5 JTAGPin D3 through D7 are JTAG interface pins. These can be used to reprogram your Photon bootloader or user firmwareimage with standard JTAG tools such as the ST-Link v2, J-Link, R-Link, OLIMEX ARM-USB-TINI-H, and also the FTDI-basedParticle JTAG Prog rammer.Photon Pin Description ST M32 Pin PØ Pin # PØ Pin Name Default InternalD7 JTAG_TMS PA13 44 MICRO_JTAG_TMS ~40k pull-upD6 JTAG_TCK PA14 40 MICRO_JTAG_TCK ~40k pull-downD5 JTAG_TDI PA15 43 MICRO_JTAG_TDI ~40k pull-upD4 JTAG_TDO PB3 41 MICRO_JTAG_TDO FloatingD3 JTAG_TRST PB4 42 MICRO_JTAG_TRSTN ~4 0k pull-up3V3 PowerGND GroundRST ResetNotes: Default state after reset f or a short period of time before these pins are restored to GPIO (if JTAG debugging is notrequired, i.e. USE_SWD_JTAG=y is not specified on the command line.A standard 20-pin 0.1” shrouded male JTAG interf ace connector should be wired as f ollows:[1][1]7 of 35
Photon Datasheet v0112.6 External Coexistence InterfaceThe Photon supports coexistence with Bluetooth and other external radios via the three gold pads on the top side ofthe PCB near pin A3. These pads are 0.035” square, spaced 0.049” apart. This spacing supports the possibility oftacking on a small 1.25mm - 1.27mm pitch 3-pin male header to make it somewhat easier to interface with.When two radios occupying the same f requency band are used in the same system, such as Wi-Fi and Bluetooth, acoexistence interface can be used to coordinate transmit activity, to ensure optimal performance by arbitratingconflicts between the two radios.Pad # PØ Pin Name PØ Pin # I/O Description1 BTCX_RF_ACTIVE 9 I Sig nals Bluetooth is active2 BTCX_STATUS 10 I Sig nals Bluetooth priority status and TX/RX direction3 BTCX_TXCONF 11 O Output giving Bluetooth permission to TX​ When these pads are programmed to be used as a Bluetooth coexistence interface, they’re set as high impedance onpower up and reset. Alternatively, they can be individually prog rammed to be used as GPIOs through sof tware control.They can also be programmed to have an internal pull-up or pull-down resistor.8 of 35
Photon Datasheet v0113. Pin and button definition3.1 Pin markings9 of 35
Photon Datasheet v0113.2 Pin descriptionPin DescriptionVIN This pin can be used as an input or output. As an input, supply 3.6 to 5.5VDC to power the Photon. When thePhoton is powered via the USB port, this pin will output a voltage of approximately 4.8VDC due to areverse polarity protection series schottky diode between VUSB and VIN. When used as an output, the maxload on VIN is 1A.RST Active-low reset input. On-board circuitry contains a 1k ohm pull-up resistor between RST and 3V3, and0.1uF capacitor between RST and GND.VBAT Supply to the internal RTC, backup registers and SRAM when 3V3 not present (1.65 to 3.6VDC).3V3 This pin is the output of the on-board regulator and is internally connected to the VDD of the WiFi module.When powering the Photon via VIN or the USB port, this pin will output a voltage of 3.3VDC. This pin canalso be used to power the Photon directly (max input 3.3VDC). When used as an output, the max load on3V3 is 100mA. NOTE: When powering the Photon via this pin, ensure power is disconnected from VIN andUSB.WKP Active-hig h wakeup pin, wakes the module from sleep/standby modes. When not used as a WAKEUP, thispin can also be used as a digital GPIO, ADC input or PWM.D0~D7 Dig ital only GPIO pins.A0~A9 12-bit Analog-to-Digital (A/D) inputs (0-4095), and also dig ital GPIOs. A6 and A7 are code conveniencemappings, which means pins are not actually labeled as such but you may use code like analogRead(A7) .A6 maps to the DAC pin and A7 maps to the WKP pin.DAC 12-bit Digital-to-Analog (D/A) output (0-4095), and also a digital GPIO. DAC is used as DAC1 in software,and A5 is a second DAC output used as DAC2 in software.RX Primarily used as UART RX, but can also be used as a digital GPIO or PWM.TX Primarily used as UART TX, but can also be used as a digital GPIO or PWM.10 of 35
Photon Datasheet v0113.3 Pin out diagrams11 of 35
Photon Datasheet v0114. Technical specification4.1 Absolute maximum ratings Parameter Symbol Min Typ Max UnitSupply Input Voltage V +6.5 VSupply Output Current I 1 ASupply Output Current I 100 mAStorage Temperature T -4 0 +85 °CEnable Voltage V V +0.6 VESD Susceptibility HBM (Human Body Mode) V 2 kVIN-MAXIN-MAX-L3V3-MAX-Ls tgEN INES D12 of 35
Photon Datasheet v0114.2 Recommended operating conditions Parameter Symbol Min Typ Max UnitSupply Input Voltage V +3.6 +5.5 VSupply Input Voltage V +3.0 +3.3 +3.6 VSupply Output Voltage V +4 .8 VSupply Output Voltage V +3.3 VSupply Input Voltage V +1.65 +3.6 VSupply Input Current (VBAT) I 19 uAOperating Current (Wi-Fi on) I 80 100 mAOperating Current (Wi-Fi on) I 235 430 mAOperating Current (Wi-Fi on, w/powersave) I 18 100 mAOperating Current (Wi-Fi off ) I 30 40 mASleep Current (5V @ VIN) I 1 2 mADeep Sleep Current (5V @ VIN) I 80 100 uAOperating Temperature T -20 +60 °CHumidity Range Non condensing, relative humidity 95 %Notes: These numbers represent the extreme range of short peak current bursts when transmitting and receiving in802.11b/g/n modes at dif ferent power levels. Averag e TX current consumption in will be 80-100mA. These are very short average current bursts when transmitting and receiving. On average if minimizing f requencyof TX/RX events, current consumption in powersave mode will be 18mAIN3V3IN3V3VBATVBATIN avgIN pk [1] [1]IN avg [2]IN avgQsQdsop[1][2]13 of 35
Photon Datasheet v0114.3 Wi-Fi Specifications Feature DescriptionWLAN Standards IEEE 802 11b/g/nAntenna Port Single AntennaFrequency Band 2.4 12GHz – 2.462GHz (United States of America and Canada)2.4 12GHz – 2.472GHz (EU)Sub Channels 1 – 11 (United States of America and Canada)1 – 13 (EU)Modulation DSSS, CCK, OFDM, BPSK, QPSK,16QAM, 64QAMPØ module Wi-Fi output power Typ. T ol. UnitRF Average Output Power, 802.11b CCK Mode 1M Avail. upon request +/- 1.5 dBm11M - +/- 1.5 dBmRF Average Output Power, 802.11g OFDM Mode 6M - +/- 1.5 dBm54M - +/- 1.5 dBmRF Average Output Power, 802.11n OFDM Mode MCS0 - +/- 1.5 dBmMCS7 - +/- 1.5 dBm14 of 35
Photon Datasheet v0114.4 I/O CharacteristicsThese specifications are based on the STM32F205RG datasheet, with reference to Photon pin nomenclature.Parameter Symbol Conditions Min Typ Max UnitStandard I/O input low level voltage V -0.3 0.28*(V -2)+0.8VI/O FT input low level voltage V -0.3 0.32*(V -2)+0.75VStandard I/O input hig h level voltage V 0.4 1*(V -2)+1.3V +0.3 VI/O FT input hig h level voltage V V > 2V 0.42*(V -2)+15.5 VV V ≤ 2V 0.4 2*(V -2)+15.2 VStandard I/O Schmitt trigg er voltagehysteresisV 200 mVI/O FT Schmitt trigger voltagehysteresisV 5% V mVInput leakag e current I GND ≤ V ≤ VGPIOs±1 µAInput leakag e current I R V = 5V, I/OFT3 µAWeak pull-up equivalent resistor R V = GND 30 4 0 50 k ΩWeak pull-down equivalent resistor R V = V 30 4 0 50 k ΩI/O pin capacitance C 5 pFNotes: FT = Five-volt tolerant. In order to sustain a voltage hig her than V +0.3 the internal pull-up/pull-down resistorsmust be disabled. Hysteresis voltage between Schmitt trig g er switching levels. Based on characterization, not tested in production. With a minimum of 100mV. Leakage could be higher than max. if neg ative current is injected on adjacent pins.IL 3V3[1] IL 3V3IH 3V3 3V3[1] IH 3V3 3V3IH 3V3 3V3[2]hys[2]hys 3V3[3][4] lkg io 3V3[4] lkg PU io[5] PU io[5] PD io 3V3IO[1] 3V3[2][3][4]15 of 35
Photon Datasheet v011 Pull-up and pull-down resistors are desig ned with a true resistance in series with switchable PMOS/NMOS. ThisPMOS/NMOS contribution to the series resistance is minimum (~10% order).5. Mechanical specifications5.1 Dimensions and WeightHeaders Dimensions in inches (mm) WeightWith 1.44 x 0.8 x 0.27 (36.58 x 20.32 x 6.86) 5 gramsWithout 1.44 x 0.8 x 0.17 (36.58 x 20.32 x 4.32) 3.7 grams5.2 Mating connectorsThe Photon (with headers) can be mounted with (qty 2) 12-pin single row 0.1” female headers. Typically these are0.335” (8.5mm) tall, but you may pick a taller one if desired. When you search for parts like these it can be difficult tonavigate the thousands of parts available.On Digikey.com, this section Rectangular Connectors - Headers, Receptacles, Female Sockets contains 36,000 of them. Narrow the search with: 12 positions, 1 row, 0.1” (2.54mm) pitch, Through Hole mountingtypes (unless you want SMT), and sort by Price Ascending. You may f ind something like this:Description MFG MFG Part Number12-pin 0.1” Female Header (Tin) Sullins Connector Solutions PPTC121LFBN-RC12-pin 0.1” Female Header (Gold) Sullins Connector Solutions PPPC121LFBN-RCYou may also search f or other types, such as reverse mounted (bottom side SMT) female headers, low profile types,machine pin, etc..[5]16 of 35
Photon Datasheet v0115.3 Recommended pcb land pattern (Photon with headers)The Photon (with headers) can be mounted with 0.1” 12-pin female header receptacles using the following PCB landpattern:This land pattern can be found in the Spark.lbr Eagle library, as a Device named PHOTON . Note: Clone or Downloadthe complete repository as a ZIP file to avoid corrupted data in Eagle files.17 of 35
Photon Datasheet v0115.4 Recommended pcb land pattern (Photon without headers)The Photon (without headers) can be surface mounted directly in an end application PCB using the following PCB landpattern:Solder mask around exposed copper pads should be 0.1mm (4 mils) larger in all directions. E.g., a 0.08” x 0.10” padwould have a 0.088” x 0.108” solder mask.This land pattern can be found in the Spark.lbr Eagle library, as a Device named PHOTON_SMD . Note: Clone orDownload the complete repository as a ZIP f ile to avoid corrupted data in Eagle f iles.18 of 35
Photon Datasheet v0116. Layout6.1 Photon v1.0.0 Top Layer (GTL)19 of 35
Photon Datasheet v0116.2 Photon v1.0.0 GND Layer (G2L)20 of 35
Photon Datasheet v0116.3 Photon v1.0.0 3V3 Layer (G15L)21 of 35
Photon Datasheet v0116.4 Photon v1.0.0 Bottom Layer (GBL)22 of 35
Photon Datasheet v0117. Recommended solder reflow profilePhase T emperatures and RatesA-B. Ambient~150°C, Heating rate: < 3°C/sB-C. 150~200°C, soak time: 60~120 sC-D. 200~245°C, Heating rate: < 3°C/sD. Peak temp.: 235~24 5°C, Time above 220°C: 4 0~90 sD-E. 245~220°C, Cooling rate: < 1°C/s23 of 35
Photon Datasheet v0118. Bill of MaterialsBuild your own design based on the Photon!Qty DeviceMinimumSpecification Package/Case Part Designator MFG. MFG. PN1 ANTENNA 2.4 GHzCeramic5.0mm ×2.0mm x2.6mmANT1 AdvancedCeramic XAT7020-E3R0HBA2 CERAMICCAPACITOR22uF Ceramic6.3V 10% X5R0603 C4,C5 Samsung CL10A226MQ8NRNC6 CERAMICCAPACITOR0.1uF Ceramic6.3V 10% X5R0402 C6,C7,C8,C11,C12,C16 RongFu 04 02B104K01A2 CERAMICCAPACITOR100pFCeramic 6.3V10% X5R0402 C2,C3 Fenghua 04 02CG101J500NT4 CERAMICCAPACITOR10uF Ceramic6.3V 10% X5R0603 C9,C11,C13,C15 Sumsung CL10A106MQ8NNNC3 CERAMICCAPACITOR(RF)10pF Ceramic6.3V 10% X5R0402 C1,C14,C17 Murata GJM1555C1HR80BB01D1 CONNECTOR USB Micro-Bw/tabs & slotsUSB-MICROB X1 Kaweei CMCUSB-5BFM2G-01-D1 CONNECTOR uFLConnectorSMD X2 Kaweei P1163-0140R2 HEADER Single String1.2” MatingLength0.1” 12-pin JP1,JP2 Kaweei CP254 11-12G-S116-A1 DIODE DiodeSchottky 30V3ADO-220AA D1 Vishay SS3P3-M3/84 A24 of 35
1 DIODE (LED) Blue SMD 0603 LED1 Everlight 19-217/BHC-ZL1M2RY/3T1 DIODE (LED) LED RGBCommonAnodeDif f used SMD4-PLCC(2.0mm x2.0mm)LED2 Cree CLVBA-FKA-CAEDH8BBB7A3631 INDUCTOR 2.2uH 1.5A 3mm x 3mm L4 TaiyoYudenNR3015T2R2M1 INDUCTOR(RF)3.9nH RFinductor0402 L3 Johanson L-07C3N9SV6T1 INDUCTOR(RF)4.7nH RFinductor0402 L1 Johanson L-07C4N7SV6T1 INDUCTOR(RF)6.8nH RFinductor0402 L2 Johanson L-07C6N8JV6T1 WI-FI + MCU Broadcom Wi-FI + STM32MCUCustom USISMDU1 USI WM-N-BM-09-S1 RF SWITCH RF SwitchSPDTUQFN-6(1x1mm)U3 Skyworks SKY13350-385LF1 POWERREGULATOR3.3V 1.5MHz600mA HighEf f iciencyPWM Step-Down DC/DCConverterSOT23-5 U2 Richtek RT8008-33GB1 RESISTOR 100k 5% 0402 R4 Fenghua RC-02W104FT2 RESISTOR 22R 5% 0402 R5,R6 Fenghua RC-02W220JT1 RESISTOR 10k 5% 04 02 R8 Fenghua RC-02W103JT4 RESISTOR 1k 5% 0402 R1,R2,R3,R7 Fenghua RC-02W102JT2 SWITCH Button 160gf 3.6mm x3.1mmSETUP,RESET Haoyu TS-1185A-CQty DeviceMinimumSpecification Package/Case Part Designator MFG. MFG. PN25 of 35
Photon Datasheet v0119. Ordering informationPhotons are available from store.particle.io in single quantities with and without headers, and also included indiff erent maker kits.10. Qualification and approvalsModel number: PHOTONHRoHSCEFCC ID: 2AEMI-PHOTONIC: 20127-PHOTON26 of 35
Photon Datasheet v01111. Product handling11.1 PackagingThe Photon comes in two primary styles of packag ing: Matchbox and Kit Box. The Matchbox contains the bareessentials to get you started, while the kit box contains a breadboard, Micro B USB cable, sticker, prototyping card anda couple sensors to build your first internet connected project!Photons without headers are also available in JEDEC style trays for automated pick and place machines. Requestmore details f rom us on this in the Contact section below.27 of 35
Photon Datasheet v01111.2 Moisture sensitivity levels The Moisture Sensitivity Level (MSL) relates to the packaging and handling precautions required. The PØ module onthe Photons dominate the MSL requirements and are rated level 3. In general, this precaution applies f or Photonswithout headers. If ref lowing a Photon directly onto an application PCB, increased moisture levels prior to ref low candamage sensitive electronics on the Photon. A bake process to reduce moisture may be required. For more information regarding moisture sensitivity levels, labeling, storage and drying see the MSL standard seeIPC/JEDEC J-STD-020 (can be downloaded from www.jedec.org).11.3 ESD Precautions The photon contains highly sensitive electronic circuitry and is an Electrostatic Sensitive Device (ESD). Handling aphoton without proper ESD protection may destroy or damage it permanently. Proper ESD handling and packag ingprocedures must be applied throughout the processing, handling and operation of any application that incorporatesphotons. ESD precautions should be implemented on the application board where the photon is mounted. Failure toobserve these precautions can result in severe damage to the photon! 28 of 35
Photon Datasheet v01112. Default settingsThe Photon comes preprogrammed with a bootloader and a user application called Tinker. This application workswith an iOS and Android app also named Tinker that allows you to very easily toggle digital pins, take analog anddigital readings and drive variable PWM outputs.The bootloader allows you to easily update the user application via several dif f erent methods, USB, OTA, Serial Y-Modem, and also internally via the Factory Reset procedure. All of these methods have multiple tools associated withthem as well.You may use the online Web IDE Particle Build to code, compile and flash a user application OTA (Over The Air). ParticleDev is a local tool that uses the Cloud to compile and flash OTA as well. There is also a packag e Spark DFU-UTIL forParticle Dev that allows for Cloud compiling and local f lashing via DFU over USB. This requires dfu-util to beinstalled on your system. ‘dfu-util’ can also be used with Particle CLI for Cloud compiling and local flashing via thecommand line. Finally the lowest level of development is available via the GNU GCC toolchain for ARM, which offerslocal compile and flash via dfu-util. This gives the user complete control of all source code and flashing methods. Thisis an extensive list, however not exhaustive.29 of 35
Photon Datasheet v01113. GlossarySMPSSwitched-Mode Power SupplyRFRadio FrequencyCastellatedThe edge of the PCB has plated holes that are cut in half which resemble the top of a castle. These make iteasy to solder the Photon down to another PCB with a SMT ref low process.SMTSurface Mount Technolog y (of ten associated with SMD which is a surface mount device).APAccess PointLEDLight-Emitting DiodeRGB LEDRed green and blue LEDs combined and diff used in one packag e.USBUniversal Serial BusQuiescent currentCurrent consumed in the deepest sleep stateFTFive-tolerant; Refers to a pin being tolerant to 5V.3V3+3.3V; The regulated +3.3V supply rail. Also used to note a pin is only 3.3V tolerant.RTCReal Time ClockOT AOver The Air; describing how f irmware is transferred to the device.30 of 35
Photon Datasheet v01114. FCC IC CE Warnings and End ProductLabeling RequirementsFederal Communication Commission Interf erence Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 ofthe FCC Rules. These limits are designed to provide reasonable protection against harmf ul interference in a residentialinstallation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used inaccordance with the instructions, may cause harmf ul interference to radio communications. However, there is noguarantee that interference will not occur in a particular installation. If this equipment does cause harmfulinterf erence to radio or television reception, which can be determined by turning the equipment off and on, the user isencourag ed to try to correct the interference by one of the following measures:Reorient or relocate the receiving antenna.Increase the separation between the equipment and receiver.Connect the equipment into an outlet on a circuit dif ferent from that to which the receiver is connected.Consult the dealer or an experienced radio/TV technician for help.FCC Caution: Any changes or modif ications not expressly approved by the party responsible for compliance could void the user’sauthority to operate this equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:1. This device may not cause harmful interference, and2. This device must accept any interference received, including interference that may cause undesired operation.FCC Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set f orth for an uncontrolled environment. Thistransmitter module must not be co-located or operating in conjunction with any other antenna or transmitter. ThisEnd equipment should be installed and operated with a minimum distance of 20 centimeters between the radiator andyour body.IMPORTANT NOT E: In the event that these conditions can not be met (for example certain laptop conf igurations or co-location withanother transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on thefinal product. In these circumstances, the OEM integrator will be responsible f or re-evaluating the end product(including the transmitter) and obtaining a separate FCC authorization.(continued on next page)31 of 35
Photon Datasheet v011End Product Labeling The final end product must be labeled in a visible area with the following:Contains FCC ID: 2AEMI-PHOTONManual Inf ormation to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or removethis RF module in the user’s manual of the end product which integrates this module.Canada Statement This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following twoconditions:1. This device may not cause interference; and2. This device must accept any interference, including interference that may cause undesired operation of thedevice.Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence.L’ exploitation est autorisée aux deux conditions suivantes:1. l’appareil ne doit pas produire de brouillage;2. l’utilisateur de l’appareil doit accepter tout brouillag e radioélectrique subi, même si le brouillage est susceptibled’en compromettre le fonctionnement.Caution Exposure: This device meets the exemption from the routine evaluation limits in section 2.5 of RSS102 and users can obtainCanadian information on RF exposure and compliance. Le dispositif répond à l’exemption des limites d’évaluation de routine dans la section 2.5 de RSS102 et les utilisateurspeuvent obtenir des renseignements canadiens sur l’exposition aux RF et le respect.The final end product must be labelled in a visible area with the f ollowing: The Industry Canada certif ication label of a module shall be clearly visible at all times when installed in the host device,otherwise the host device must be labelled to display the Industry Canada certif ication number of the module,preceded by the words “Contains transmitter module”, or the word “Contains”, or similar wording expressing thesame meaning, as follows:Contains transmitter module IC: 20127-PHOTON(continued on next page)32 of 35
Photon Datasheet v011This End equipment should be installed and operated with a minimum distance of 20 centimeters between theradiator and your body. Cet équipement devrait être installé et actionné avec une distance minimum de 20 centimètres entre le radiateur etvotre corps.The end user manual shall include all required regulatory inf ormation/warning as shown in this manual.15. Revision historyRevision Date Author Comments- 30-Mar-2015BW Initial releasev003 7-Apr-2015BW Updated templatev004 8-Apr-2015BW Updated Overview, Block diagram, Power, RF, and Pin markings sectionsv005 9-Apr-2015BW Updated BOMv006 21-Apr-2015BW Added JTAG, BT CO-EX, I/O Characteristics, Schematic, Layout, Ref low Prof ile,Glossary, Updated Operating Conditionsv007 28-Apr-2015BW Added Layout, Updated analog pins, Land patterns, Packaging, Mating Connectorsv008 11-May-2015BW Updated BT CO-EX, PWM info, Qualif icationsv009 31-May-2015BW Updated Pinouts, DAC info, Height dimensions, Solder mask info, Recommendedoperating conditions33 of 35
v010 1-June-2015BW Updated VBAT infov011 22-June-2015BW Added FCC IC CE Warnings and End Product Labeling Requirements, Updated poweroutput, removed block diagram and schematics, added approved antennasRevision Date Author Comments34 of 35
Photon Datasheet v01116. ContactWeb https://www.particle.ioCommunity Forums https://community.particle.ioEmail hello@particle.io35 of 35

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