Motorola Mobility T56KT1 Cellular/PCS GSM/GPRS Transceiver Module User Manual G30 Cell Engine Module Description

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T56KT1 User Manual

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Technical InformationMotorola G30 Developer’s GuideModule Hardware DescriptionDECEMBER 15, 20096802986C55-A

SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICENoticeWhile reasonable efforts have been made to assure the accuracy of this document, Motorola, Inc. assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein. The information in this document has been carefully checked and is believed to be entirely reliable. However, no responsibility is assumed for inaccuracies or omissions. Motorola, Inc. reserves the right to make changes to any products described herein and reserves the right to revise this document and to make changes from time to time in content hereof with no obligation to notify any person of revisions or changes. Motorola, Inc. does not assume any liability arising out of the application or use of any product, software, or circuit described herein; neither does it convey license under its patent rights or the rights of others.It is possible that this publication may contain references to, or information about Motorola products (machines and programs), programming, or services that are not announced in your country. Such references or information must not be construed to mean that Motorola intends to announce such Motorola products, programming, or services in your country.CopyrightsThis instruction manual, and the Motorola products described in this instruction manual may be, include or describe copyrighted Motorola material, such as computer programs stored in semiconductor memories or other media. Laws in the United States and other countries preserve for Motorola and its licensors certain exclusive rights for copyrighted material, including the exclusive right to copy, reproduce in any form, distribute and make derivative works of the copyrighted material. Accordingly, any copyrighted material of Motorola and its licensors contained herein or in the Motorola products described in this instruction manual may not be copied, reproduced, distributed, merged or modified in any manner without the express written permission of Motorola. Furthermore, the purchase of Motorola products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Motorola, as arises by operation of law in the sale of a product.Computer Software CopyrightsThe Motorola and 3rd Party supplied Software (SW) products described in this instruction manual may include copyrighted Motorola and other 3rd Party supplied computer programs stored in semiconductor memories or other media. Laws in the United States and other countries preserve for Motorola and other 3rd Party supplied SW certain exclusive rights for copyrighted computer programs, including the exclusive right to copy or reproduce in any form the copyrighted computer program. Accordingly, any copyrighted Motorola or other 3rd Party supplied SW computer programs contained in the Motorola products described in this instruction manual may not be copied (reverse engineered) or reproduced in any manner without the express written permission of Motorola or the 3rd Party SW supplier. Furthermore, the purchase of Motorola products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Motorola or other 3rd Party supplied SW, except for the normal non-exclusive, royalty free license to use that arises by operation of law in the sale of a product. VENDOR COPYRIGHTApache Software Foundation Copyright 2004-2005 All Rights Reserved

December 15, 2009 G30 - Module Hardware Description iManual Scope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ixTarget Audience . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ixManual Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ixApplicable Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ixRegulatory Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xRegulatory Statement (Safety). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xFCC Notice to Users . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xPrecautions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .xiAntenna and Transmission Safety Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .xiStandards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xiiContact Us . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xiiiText Conventions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xiiiField Service . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xvGeneral Safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xvCaring for the Environment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .xviLimitation of Liability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xviiWarranty Notification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xviiHow to Get Warranty Service? . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xviiiClaiming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xviiiConditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .xixWhat is Not Covered by the Warranty . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .xixInstalled Data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xxOut of Warranty Repairs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xxRevision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .xxiChapter 1: Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1Product Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2Regulatory and Approvals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6European Union Directives Conformance Statement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6CFR 47 Part 15.19 specifies label requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6CFR 47 Part 15.21 Information to user . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7CFR 47 Part 15.105 Information to the user . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7Chapter 2: Hardware Interface Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9Architecture Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9Baseband . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10RF Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11Power Supply. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12Power Supply Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12Power Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14Power On/Off Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15Turning the G30 On . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15Power Supply Turn-on . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15Turning the G30 On Using PWR_ON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16Table of Contents

Table of Contentsii G30 - Module Hardware Description December 15, 2009Turning the G30 Off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16Turning the G30 Off Using PWR_ON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17Power Loss shut down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17Turning the G30 Off Using AT+MRST . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17Low Power Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18Activating Low Power Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18Serial Interface During Low Power Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18Terminating Low Power Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19Temporary Termination of Low Power Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20Permanent termination of Low Power Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21Real Time Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22Serial Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23UART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23Serial Peripheral Interface (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24I2C Bus Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25SIM Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25External SIM Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26External SIM Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27External SIM Design Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27Embedded SIM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28eSIM Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28Audio Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29Handset Microphone Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29Headset Microphone Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30Differential Speaker (Handset) Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31Mono Speaker (Headset) Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33Headset Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34Digital Audio Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35Voiceband Audio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36Basic Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36Advanced Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37Audio Programming Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37Audio Algorithms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38Gain Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39Audio Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39Analog Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40A/D Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41Power Supply A/D . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41General Purpose A/D . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42Controls and Indicators Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44VREF Reference Regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44VRTC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45Wakeup Out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45Antenna Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46GPRS Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47General Purpose I/O . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47Antenna Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48Chapter 3: Electrical and Environmental Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51Operating Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52Supply/power Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

Table of ContentsDecember 15, 2009 G30 - Module Hardware Description iiiDigital Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52Audio Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56ADC Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59Environmental Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61Application Interface Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61Chapter 4: Mechanical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69Board Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69LGA Tape & Reel Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71Interface Connector Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72Mating Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73U.FL Connector Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74Mating Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75G30 Mounting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76Layout Recommendation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77Soldering Footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77RF Recommendation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78Soldering Re-flow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78Chapter 5: Service and Testing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79Service . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79Who to Contact? . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80Required Query Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80Testing a Standalone Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82Test Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82Test Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83Acronyms and AbbreviationsIndex

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December 15, 2009 G30 - Module Hardware Description v2-1 G30 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92-2 Transmission Power Drops. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132-3 Power Supply Turn-on . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162-4 PWR_ON Power On Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162-5 PWR_ON Power Off Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172-6 ATS24 Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182-7 CTS Signal During Sleep Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 192-8 WKUPI Signal Operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 202-9 Serial Interface Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 212-10 UART Interface Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 232-11 G30 External SIM Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 272-12 G30 eSIM Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 282-13 Audio Interface Topology. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 292-14 Handset Microphone Circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 302-15 Headset Microphone Circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 312-16 Differential Speaker Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 322-17 Single-ended Speaker Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 322-18 Mono Speaker (Headset) Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 332-19 Voiceband Mode PCM Bus Coding Format. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 362-20 Audio Programming Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 382-21 WKUPO Operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 463-1 G30 - 70 Pin Connector Quick Integration Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 623-2 G30 - 81 Pin LGA Interface Quick Integration Connections . . . . . . . . . . . . . . . . . . . . . . . . . . 634-1 G30 Mechanical Characteristics - 81 Pin LGA Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 694-2 G30 Mechanical Characteristics - B2B Connector (70 Pin). . . . . . . . . . . . . . . . . . . . . . . . . . . 704-3 LGA Tape & Reel Specification. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 714-4 G30 Interface Connector. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 724-5 Mating Connector Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 734-6 U.FL Connector Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 744-7 U.FL Mating Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 754-8 G30 Mounting Area . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 764-9 G30 Soldering Footprint (Top View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 775-1 Test Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83List of Figures

December 15, 2009 G30 - Module Hardware Description vii1-1 Product Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22-1 G30 Operating Modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112-2 Power Supply Signals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122-3 Recommended Power Supply Filtering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132-4 G30 Current Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142-5 SPI Interface Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 242-6 I2C Interface Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 252-7 SIM Interface Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 262-8 Handset Microphone Port Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 302-9 Headset Microphone Port Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 312-10 Speaker Port Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 332-11 Mono Speaker Port Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 342-12 Digital Audio modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 352-13 Basic Mode Audio Paths . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 362-14 Advanced Mode Commands. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 372-15 Speech Processing Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 382-16 Gain Control Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 392-17 Supply A/D Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 422-18 GPAD Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 422-19 Controls and Indicators. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 432-20 VREF Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 452-21 Antenna Interface Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 483-1 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 513-2 Input Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 523-3 Output Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 523-4 Input Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 523-5 Output Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 543-6 Pad Pull-up and Pull-down Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 563-7 Audio Transmit Path Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 563-8 Microphone Supply Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 573-9 G30 Low Power Single-ended Audio Receive Path Characteristics . . . . . . . . . . . . . . . . . . . . 583-10 G30 High Power Differential Audio Receive Path Characteristics . . . . . . . . . . . . . . . . . . . . . 593-11 Input Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 593-12 Environmental Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 613-13 Interface Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 634-1 G30 interface connector option . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 724-2 Interface Connector Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 724-3 U.FL Connector Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74List of Tables

December 15, 2009 G30 - Module Hardware Description ixPrefaceManual ScopeThis manual provides the electrical, mechanical and environmental requirements for properly integrating the G30 module in a host application.This manual gives a complete set of hardware features and functions that may be provided by G30. The availability of any feature or function, which is described in this manual, depends on the hardware revision and software version of a specific G30 model.The parameters and values provided in this manual are defined under typical conditions. These values may vary when subject to different conditions, such as SW version, network status, application settings and environmental conditions.Target AudienceThis manual is intended for all members of the integration team who are responsible for integrating the G30 module into the host OEM device, including representatives from hardware, software and RF engineering disciplines. Manual OrganizationThis manual contains the following chapters: •Chapter 1—introduces the G30 unit and provides important safety instructions.•Chapter 2—provides a detailed hardware description of the blocks and components comprising the G30.•Chapter 3—describes the pin assignments for G30 connectors.•Chapter 4—describes G30 mechanical specifications and requirements.•Chapter 5—provides contact information for Motorola Service Support and Customer Assistance.Applicable Documents•G30 Developer's Kit - 6802986C48•G30 AT Commands - 6802986C33

Regulatory Requirementsx G30 - Module Hardware Description December 15, 2009Regulatory RequirementsThe Federal Communications Commission (FCC) requires application for certification of digital devices in accordance with CFR Title 47, Part 2 and Part 15. This includes MPE calculation. As the G30 modem is not a standalone transceiver but is an integrated module, the G30 cannot be tested by itself for EME certification. It is, however, the integrator’s responsibility to have the completed device tested for EME certification.Caution: Unauthorized repairs or modifications could result in permanent damage to the equipment and void your warranty and your authority to operate this device under Part 15 of the FCC Rules.Regulatory Statement (Safety)The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating the G30 module. Manufacturers of the cellular terminal are advised to convey the following safety information to users and operating personnel, and to incorporate these guidelines into all manuals supplied with the product. Failure to comply with these precautions violates safety standards of design, manufacture and intended use of the product. Motorola assumes no liability for customer failure to comply with these precautions.•G30 module should not be assembled when voltage is supplied (applicable for 70 pin connector model only)•G30 module must be operated at the voltages described in the technical documentation•G30 module must not be mechanically nor electrically changed. Use of connectors should follow the guidance of the technical documentation•G30 module is designed to meet the EMC requirements of EN 301 489-07•When integrating the G30 module into a system, Motorola recommends testing the system to EN 301 489-07•You must not remove any label from the G30 module•Systems using the G30 module are subject to mandatory EMC/RF/Safety (including EME) testing under R&TTE directive 1999/5/EC (to://www.newapproach.org/Directives/). Other directives, such, 2002/95/EC (RoHS), WEEE Directive 2002/96/EC should also apply to a system using the G30 module.FCC Notice to UsersMotorola has not approved any changes or modifications to this device by the user. Any changes or modifications could void the user's authority to operate the equipment. See 47 CFR Sec. 15.21. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. See 47 CFR Sec. 15.19(3).If your mobile device or accessory has a USB connector, or is otherwise considered a computer peripheral device whereby it can be connected to a computer for purposes of transferring data, then it is considered a Class B device and the following statement applies:

Preface December 15, 2009 G30 - Module Hardware Description xiThis equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:•Reorient or relocate the receiving antenna.•Increase the separation between the equipment and the receiver.•Connect the equipment to an outlet on a circuit different from that to which the receiver is connected.This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:(1) This device may not cause harmful interference.(2) This device must accept any interference received, including interference that may cause undesired operation.PrecautionsInterface connector and some of the module circuits are not shielded. Be sure to take appropriate precautionary measures in order to avoid ESD while handling the module. ESD can damage the G30 modules. Integrators need to design ESD protection on all external interfaces.Antenna and Transmission Safety PrecautionsUser OperationDo not operate your unit when a person is within 8 inches (20 centimeters) of the antenna. A person or object within 8 inches (20 centimeters) of the antenna could impair call quality and may cause the phone to operate at a higher power level than necessary.Important: The unit must be installed in a manner that provides a minimum separation distance of 20 cm or more between the antenna and persons and must not be co-located or operate in conjunction with any other antenna or transmitter to satisfy FCC RF exposure requirements for mobile transmitting devices.Important: To comply with the FCC RF exposure limits and satisfy the categorical exclusion requirements for mobile transmitters, the requirements described in the following section, “Antenna Installation” , must be met.

Standardsxii G30 - Module Hardware Description December 15, 2009Antenna Installation•The antenna installation must provide a minimum separation distance of 20 cm from users and nearby persons and must not be co-located or operating in conjunction with any other antenna or transmitter.•Antenna installation should be done by a professional installer and should meet all FCC requirement as given in FCC part 15.•Combined cable loss and antenna gain• R&TTE requirements• 900 MHz GSM band: The combined cable loss and antenna gain must not exceed 4.08 dBi• 1800 MHz DCS band: The combined cable loss and antenna gain must not exceed 9.47 dBi• FCC requirements• 800 MHz cellular band: The combined cable loss and antenna gain must not exceed 2.85 dBi• 1900 MHz PCS band: The combined cable loss and antenna gain must not exceed 2.5 dBiOEM installers must be provided with antenna installation instruction and transmitter operating conditions for satisfying RF exposure compliance.Section 15.203 - Antenna RequirementsAn intentional radiator shall be designed to ensure that no antenna other than that furnished by the responsible party shall be used with the device. The use of a permanently attached antenna or of an antenna that uses a unique coupling to the intentional radiator shall be considered sufficient to comply with the provisions of this Section. The manufacturer may design the unit so that a broken antenna can be replaced by the user, but the use of a standard antenna jack or electrical connector is prohibited. This requirement does not apply to carrier current devices or to de-vices operated under the provisions of Sections 15.211, 15.213, 15.217, 15.219, or 15.221. Further, this requirement does not apply to intentional radiators that must be professionally installed, such as perimeter protection systems and some field disturbance sensors, or to other intentional radiators which, in accordance with Section 15.31(d), must be measured at the installation site. However, the installer shall be responsible for ensuring that the proper antenna is employed so that the limits in this Part are not exceeded.StandardsElectromagnetic Compatibility: Principles and Applications by David A Weston, published by Marcel Dekker, Inc., 270 Madison Avenue, New York, NY 10016 USA. GSM 07.07 - prETS 300 916, Digital cellular telecommunication system (Phase 2+); AT command set for GSM Mobile Equipment (ME), Version 5.2.0 or higher, Reference RE/SMG-040707QR1.GSM 07.05, Digital cellular telecommunication system (Phase 2+); Use of Data Terminal Equipment - Data Circuit terminating; Equipment (DTE-DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS), Version 5.3.0, August, 1997, ReferenceTS/SMG-040705QR2.

Preface December 15, 2009 G30 - Module Hardware Description xiiiGSM 03.40, Digital cellular telecommunication system (Phase 2+); Technical realization of the Short Message Service (SMS) Point-to-Point (PP), Version 5.3.0, July 1996, Reference TS/SMG-040340QR2.GSM 04.11 Digital cellular telecommunication system (Phase 2+); Point-to-Point (PP) Short Message Service (SMS) support on mobile radio interface, Version 5.1.0, March 1996, Reference TS/SMG-030411QR.GSM 03.38, Digital cellular telecommunication system (Phase 2+); Alphabets and language-specific information, Version 5.3.0, July 1996, Reference TS/SMG-040338QR2.GSM 11.10-1, Digital cellular telecommunication system (Phase 2); Mobile Station (MS) Conformance specification; Part 1: Conformance specification. Draft pr ETS 300 607-1, March 1998, Reference RE/SMG-071110PR6-1.GSM Specifications are orderable from Global Engineering Documents, 15 Inverness Way East, Englewood, Colorado 80112-5704 USA 303-792-2181 800-624-3974.ETSI Standard PCS - 11.10-1.GSM 02.30 Supplementary services.GSM 03.90 USSD stage 2.GSM 11.14 SIM toolkit.ITU-T V.25terGSM Data Adapter for Motorola Handsets, AT command reference, Rev 2, June 9 1997. ETSI standard SMG31.GSM 05.02.ETSI 07.60.ETSI 0.7.07 Ver. 7.5.0.Contact UsWe at Motorola want to make this guide as helpful as possible. Keep us informed of your comments and suggestions for improvements. For general contact, technical support, report documentation errors and to order manuals, use this email address: M2M.CustomerCare@motorola.comMotorola appreciates feedback from the users of our information.Text ConventionsThe following special paragraphs are used in this guide to point out information that must be read. This information may be set-off from the surrounding text, but is always preceded by a bold title in capital letters: NoteNote: Presents additional, helpful, noncritical information that you can use.

Text Conventionsxiv G30 - Module Hardware Description December 15, 2009WarningWarning: Presents information to warn you of a potentially hazardous situation in which there is a possibility of personal injury.Important Important: Presents information to help you avoid an undesirable situation or provides additional information to help you understand a topic or concept.Caution Caution: Presents information to identify a situation in which damage to software, stored data, or equipment could occur, thus avoiding the damage.

Preface December 15, 2009 G30 - Module Hardware Description xvField ServiceFor Field Service requests, use this email address:n2csfs01@motorola.comGeneral SafetyRemember!. . . safety depends on you!The following general safety precautions must be observed during all phases of operation, service, and repair of the equipment described in this manual. Failure to comply with these precautions or with specific warnings elsewhere in this manual violates safety standards of design, manufacture, and intended use of the equipment. Motorola, Inc. assumes no liability for the customer’s failure to comply with these requirements. The safety precautions listed below represent warnings of certain dangers of which we are aware. You, as the user of this product, should follow these warnings and all other safety precautions necessary for the safe operation of the equipment in your operating environment.Ground the instrumentTo minimize shock hazard, the equipment chassis and enclosure must be connected to an electrical ground. If the equipment is supplied with a three-conductor AC power cable, the power cable must be either plugged into an approved three-contact electrical outlet or used with a three-contact to two-contact adapter. The three-contact to two-contact adapter must have the grounding wire (green) firmly connected to an electrical ground (safety ground) at the power outlet. The power jack and mating plug of the power cable must meet International Electrotechnical Commission (IEC) safety standards.Note: Refer to “Grounding Guideline for Cellular Radio Installations”–Motorola part no. 68P081150E62.Do not operate in an explosive atmosphereDo not operate the equipment in the presence of flammable gases or fumes. Operation of any electrical equipment in such an environment constitutes a definite safety hazard.Do not service or adjust aloneDo not attempt internal service or adjustment unless another person, capable of rendering first aid is present.Keep away from live circuitsOperating personnel must:•not remove equipment covers. Only Factory Authorized Service Personnel or other qualified maintenance personnel may remove equipment covers for internal subassembly, or component replacement, or any internal adjustment

Caring for the Environmentxvi G30 - Module Hardware Description December 15, 2009•not replace components with power cable connected. Under certain conditions, dangerous voltages may exist even with the power cable removed•always disconnect power and discharge circuits before touching themDo not substitute parts or modify equipmentBecause of the danger of introducing additional hazards, do not install substitute parts or perform any unauthorized modification of equipment. Contact Motorola Warranty and Repair for service and repair to ensure that safety features are maintained.Dangerous procedure warningsWarnings, such as the example below, precede potentially dangerous procedures throughout this manual. Instructions contained in the warnings must be followed. You should also employ all other safety precautions that you deem necessary for the operation of the equipment in your operating environment.Warning example:Warning: Dangerous voltages, capable of causing death, are present in this equipment. Use extreme caution when handling, testing, and adjusting.Caring for the EnvironmentThe following information is provided to enable regulatory compliance with the European Union (EU) Directive 2002/96/EC Waste Electrical and Electronic Equipment (WEEE) when using Motorola equipment in EU countries.Disposal of Motorola equipment in EU countriesPlease do not dispose of Motorola equipment in landfill sites.In the EU, Motorola in conjunction with a recycling partner will ensure that equipment is collected and recycled according to the requirements of EU environmental law.Please contact the Customer Network Resolution Center (CNRC) for assistance. The 24 hour telephone numbers are listed at http://mynetworksupport.motorola.comSelect Customer Network Resolution Center contact information.Alternatively if you do not have access to CNRC or the internet, contact the Local Motorola Office.

$Preface December 15, 2009 G30 - Module Hardware Description xviiDisposal of Motorola equipment in non-EU countriesIn non-EU countries, dispose of Motorola equipment in accordance with national and regional regulations.TurkeyLimitation of LiabilityThe Products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body; in other applications intended to support or sustain life; for the planning, construction, maintenance, operation or use of any nuclear facility; for the flight, navigation, communication of aircraft or ground support equipment; or in any other application in which the failure of the Product could create a situation where personal injury or death may occur. If CUSTOMER should use any Product or provide any Product to a third party for any such use, CUSTOMER hereby agrees that MOTOROLA is not liable, in whole or in part, for any claims or damages arising from such use, and further agrees to indemnify and hold MOTOROLA harmless from any claim, loss, cost or damage arising from such use. EXCEPT AS SPECIFICALLY STATED ABOVE, THE PRODUCTS ARE PROVIDED "AS IS" AND MOTOROLA MAKES NO OTHER WARRANTIES EXPRESS, IMPLIED, STATUTORY, OR OTHERWISE REGARDING THE PRODUCTS. MOTOROLA SPECIFICALLY DISCLAIMS ANY IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE, OR ARISING FROM A COURSE OF DEALING OR USAGE OF TRADE.Under no circumstances shall MOTOROLA be liable to CUSTOMER or any other party for any costs, lost revenue or profits or for any other special, incidental or consequential damages, even if MOTOROLA has been informed of such potential loss or damage. And in no event shall MOTOROLA's liability to CUSTOMER for damages of any nature exceed the total purchase price CUSTOMER paid for the Product at issue in the dispute, except direct damages resulting from patent and/or copyright infringement, which shall be governed by the "INDEMNITY" Section of this Agreement. The preceding states MOTOROLA's entire liability for MOTOROLA's breach or failure to perform under any provision of this Agreement.Warranty NotificationMotorola guarantees to you, the original purchaser, the OEM module and accessories which you have purchased from an authorized Motorola dealer (the “Products”), to be in conformance with the applicable Motorola specifications current at the time of manufacture for a term of fifteen (15) months from Product manufacture date (Warranty Term).$UWLFOH  RI WKH(XURSHDQ 8QLRQ (8 'LUHFWLYH (& :DVWH (OHFWULFDO DQG (OHFWURQLF(TXLSPHQW :(((7KH *RYHUQPHQW RI 7XUNH\ UHTXHVWV D VWDWHPHQW RI FRQIRUPLW\ ZLWK WKH ((( UHJXODWLRQEH SURYLGHG ZLWK WKLV HTXLSPHQW 7KLV VWDWHPHQW RI ((( FRQIRUPLW\ LQ 7XUNLVK LV (((<|QHWPHOL÷LQH 8\JXQGXU$

How to Get Warranty Service?xviii G30 - Module Hardware Description December 15, 2009You must inform Motorola of the lack of conformity to the applicable specifications of any of the Products within a period of two (2) months from the date on which you detect a defect in material, workmanship or lack of conformity and in any event within a term not to exceed the Warranty Term, and must immediately submit the Product for service to Motorola's Authorized Repair or Service Center. Motorola shall not be bound by Product related statements not directly made by Motorola nor any warranty obligations applicable to the seller.A list of the Motorola Call Center numbers is enclosed with this Product.During the Warranty term, Motorola will, at its discretion and without extra charge, as your exclusive remedy, repair or replace your Product which does not comply with this warranty; or failing this, to reimburse the price of the Product but reduced to take into account the use you have had of the Product since it was delivered. This warranty will expire at the end of the Warranty Term.This is the complete and exclusive warranty for a Motorola OEM module and accessories and in lieu of all other warranties, terms and conditions, whether express or implied.Where you purchase the product other than as a consumer, Motorola disclaims all other warranties, terms and conditions express or implied, such as fitness for purpose and satisfactory quality.In no event shall Motorola be liable for damages nor loss of data in excess of the purchase price nor for any incidental special or consequential damages* arising out of the use or inability to use the Product, to the full extent such may be disclaimed by law.This Warranty does not affect any statutory rights that you may have if you are a consumer, such as a warranty of satisfactory quality and fit for the purpose for which products of the same type are normally used under normal use and service, nor any rights against the seller of the Products arising from your purchase and sales contract.(*)including without limitation loss of use, loss of time, loss of data, inconvenience, commercial loss, lost profits or savings.How to Get Warranty Service?In most cases the authorized Motorola dealer which sold and/or installed your Motorola OEM module and original accessories will honor a warranty claim and/or provide warranty service. Alternatively, for further information on how to get warranty service please contact Customer care group (refer to “Service and Testing” ).ClaimingIn order to claim the warranty service you must return the OEM module and/or accessories in question to Motorola's Authorized Repair or Service Center in the original configuration and packaging as supplied by Motorola. Please avoid leaving any supplementary items like SIM cards. The Product should also be accompanied by a label with your name, address, and telephone number; name of operator and a description of the problem.In order to be eligible to receive warranty service, you must present your receipt of purchase or a comparable substitute proof of purchase bearing the date of purchase. The module should also clearly display the original compatible electronic serial number (IMEI) and mechanic serial number [MSN]. Such information is contained with the Product.You must ensure that all and any repairs or servicing is handled at all times by a Motorola Authorized Service Center in accordance with the Motorola Service requirements.

Preface December 15, 2009 G30 - Module Hardware Description xixIn some cases, you may be requested to provide additional information concerning the maintenance of the Products by Motorola Authorized Service Centers only, therefore it is important to keep a record of any previous repairs, and make them available if questions arise concerning maintenance.ConditionsThis warranty will not apply if the type or serial numbers on the Product has been altered, deleted, duplicated, removed, or made illegible. Motorola reserves the right to refuse free-of-charge warranty service if the requested documentation can not be presented or if the information is incomplete, illegible or incompatible with the factory records.Repair, at Motorola's option, may include reflashing of software, the replacement of parts or boards with functionally equivalent, reconditioned or new parts or boards. Replaced parts, accessories, batteries, or boards are warranted for the balance of the original warranty time period. The Warranty Term will not be extended. All original accessories, batteries, parts, and OEM module equipment that have been replaced shall become the property of Motorola. Motorola does not warrant the installation, maintenance or service of the products, accessories, batteries or parts.Motorola will not be responsible in any way for problems or damage caused by any ancillary equipment not furnished by Motorola which is attached to or used in connection with the Products, or for operation of Motorola equipment with any ancillary equipment and all such equipment is expressly excluded from this warranty.When the Product is used in conjunction with ancillary or peripheral equipment not supplied by Motorola, Motorola does not warrant the operation of the Product/peripheral combination and Motorola will not honor any warranty claim where the Product is used in such a combination and it is determined by Motorola that there is no fault with the Product. Motorola specifically disclaims any responsibility for any damage, whether or not to Motorola equipment, caused in any way by the use of the OEM module, accessories, software applications and peripherals (specific examples include, but are not limited to: batteries, chargers, adapters, and power supplies) when such accessories, software applications and peripherals are not manufactured and supplied by Motorola.What is Not Covered by the WarrantyThis warranty is not valid if the defects are due to damage, misuse, tampering, neglect or lack of care and in case of alterations or repair carried out by unauthorized persons.The following are examples of defects or damage not covered by this product warranty1. Defects or damage resulting from use of the Product in other than its normal and customary manner.2. Defects or damage from misuse, access to incompatible sources, accident or neglect.3. Defects or damage from improper testing, operation, maintenance, installation, adjustment, unauthorized software applications or any alteration or modification of any kind.4. Breakage or damage to antennas unless caused directly by defects in material or workmanship.5. Products disassembled or repaired other than by Motorola in such a manner as to adversely affect performance or prevent adequate inspection and testing to verify any warranty claim.

Installed Dataxx G30 - Module Hardware Description December 15, 20096. Defects or damage due to range, coverage, availability, grade of service, or operation of the cellular system by the cellular operator.7. Defects or damage due to moist, liquid or spills of food.8. Control unit coil cords in the Product that are stretched or have the modular tab broken.9. All plastic surfaces and all other externally exposed parts that are scratched or damaged due to customer normal use.Depending on operating conditions and your usage habits, wear and tear might take place of components including mechanical problems related to Product housing, paint, assembly, sub-assemblies, displays and keyboards and any accessories which are not part of the Product's in-box configuration. The rectification of faults generated through wear and tear and the use of consumable items like batteries beyond their Optimum Performance Time as indicated in the product manual is considered to be your responsibility and therefore Motorola will not provide the free Warranty repair service for these itemsInstalled DataPlease make and retain a note of all data you have inserted into your Product for example names, addresses, phone numbers, user and access codes, notes etc. before submitting your Product for a Warranty service as such data may be deleted or erased as part of the repair or service process.Please note if you have downloaded material onto your product, these may be deleted or erased as part of the repair process or testing process. Motorola shall not be responsible for such matters. The repair or testing process should not affect any such material that was installed by Motorola on your Product as a standard feature.Out of Warranty RepairsIf you request Motorola to repair your Product any time after the Warranty term or where this warranty does not apply due to the nature of the defect or fault, then Motorola may in its discretion carry out such repairs subject to you paying Motorola its fees for such a repair or it may refer you to an authorized third party to carry out such repairs.

Preface December 15, 2009 G30 - Module Hardware Description xxiRevision HistoryManual Number6802986C55-AManual TitleG30 - Module Hardware Description Version InformationThe following table lists the manual version, date of version, and remarks about the version.Revision HistoryVersion Date Issue RemarksADecember 15, 2009 Initial Release

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December 15, 2009 G30 - Module Hardware Description 1Chapter 1: IntroductionThe G30 is the newest member of Motorola's embedded cellular modules family.Designed with quad band GSM capabilities, which supports four GSM bands - 850/900/1800/1900 MHz, and with GPRS multislot class 10, G30 can operate on any GSM/GPRS/EGPRS network to provide voice and data communications.The G30 is similar to a condensed cellular phone core, which can be integrated into any system or product that needs to transfer voice or data information over a cellular network. Thus, it significantly enhances the system's capabilities, transforming it from a standalone, isolated product to a powerful high-performance system with global communications capabilities.The G30 is designed as a complete GSM communications solution with all the controls, interfaces and features to support a broad range of applications:•A powerful audio interface•A large set of indicators and control signals•Several advanced power-saving modes•A variety of serial communications solutions.All these features and interfaces are easily controlled and configured using a versatile AT command interface that provides full control over the G30 operation.The G30 comes with several hardware configurations (models) that gives the development engineer the option to select the best cost effective solution for their application.The hardware configuration is the combination of the following factors:•User interface: 81 pin LGA interface for solder mounting, or 70 pin connector interface with screw mounting•Memory: 64Mb/16Mb or 128Mb/32Mb Flash/PSRAM internal memory•RF Interface: U.FL connector or SMT pad (part of the LGA module)•SIM interface: External SIM card interface, or internal Embedded SIM (eSIM)The G30 series was designed for Zero time, Zero effort integration, getting you to market faster than ever. The G30 features both an 81 pin LGA interface form factor and an optional 70-pin B2B connector for various design possibilities. The optional connectorized platform maintains the same mounting design as the award winning G24 module, so you can leverage the G30’s rich feature set but remain with your connectorized design. The G30 Series also shares a unified software interface with the G24 family, including compatible AT commands and TCP/IP stacks.

Product Specifications2 G30 - Module Hardware Description December 15, 2009Product SpecificationsImportant: For safety regulations and requirements, see “Regulatory Requirements” on page x, “Regulatory Statement (Safety)” on page x and “Antenna and Transmission Safety Precautions” on page xi in “Preface” .Note: Motorola reserves the right to change the specifications without prior notice.Table 1-1: Product SpecificationsProduct FeaturesOperating systems: GSM 850/GSM 900DCS 1800/PCS 1900Physical CharacteristicsSize (with 3 mm connector): 24.4x40x.3.5mmMounting: SMT (LGA module) or two Ø2.4 mm holes (70 pin con-nector interface model)Weight: <6 grams

December 15, 2009 G30 - Module Hardware Description 3EnvironmentalOperational temperature: -30°C to +85°CStorage temperature: -40°C to +85°CPerformanceOperating voltage: 3.4 - 4.2 VCurrent consumption: In AT mode: < 1.6 mA @ DRX9 (Sleep mode)Maximum Tx output power: GSM 850/GSM 900: Power class 4 (33 ± 2dBm)DCS 1800/PCS 1900: Power class 1 (30 ± 2 dBm)GSM 850/GSM 900: GPRS 2 slot up (33 ± 2 dBm)DCS 1800/PCS 1900: GPRS 2 slot up (30 ± 2 dBm)InterfacesConnectors: SMT pads or via a single 70-pin, board to boardRF U.FL or via SMT padsSIM Card: External SIM connectivity1.8 V / 3.0 V SIM Card supportEmbedded SIMConnectivity: UART:BR from 2400 bps to 230400 bpsAuto BR up to 230400 bpsI2C (Master):DAI or SPI (Master, AT command selection)RTC supply: RTC supply output/Backup voltage supply inputReset: External Reset inputData FeaturesGPRS: Multislot Class 10DL up to 85.6 Kbit/sUL up to 42.8 Kbit/sMobile station class BCS1 to CS 4 supportedInternal TCP/IPEmbedded FTPCSD: CS data calls (Transparent / Non-Transparent) up to 9.6 kbpsModem type V.32, V.110SMS: MO/MT Text and PDU modesCell broadcast (SMS CB)Reception of SMS during circuit-switched callsReception of SMS via GSM or GPRSFAX Bearer service faxGroup 3. Class 2.0Table 1-1: Product Specifications (Cont.)

Product Specifications4 G30 - Module Hardware Description December 15, 2009Voice FeaturesTelephonyDigital/Analog audioHeadset ModeHandset ModeHands Free ModeRinger Mode Supporting Midi filesVocoders EFR/HR/FR/AMRDTMF supportAudio control: Echo canceller, noise reduction, side tone and gain control, Tx / Rx digital filter controlTable 1-1: Product Specifications (Cont.)

December 15, 2009 G30 - Module Hardware Description 5GSM Supplementary ServiceCall Hold/Resume (CH)Call Waiting (CW)Multi-Party (MTPY)Call Forwarding (CF)Call DivertExplicit Call Transfer (ECT)Call Barring (CB)Call Completion to Busy Subscriber (CCBS)Advice of Charge (AoC)Calling Line Identification Presentation (CLIP)Calling Line Identification Restriction (CLIR)Connected Line Identification Presentation (COLP)Unstructured Supplementary Services Data (USSD)Network Identify and Time Zone (NITZ)Character SetGSM GSM default alphabet (GSM03.38)HEX Character strings consist only of hexadecimal numbers from 00 to FF; e.g. "032FE6" equals three 8-bit characters with decimal values 3, 47 and 230; no conversions to the original ME character set shall be doneIRA International Reference Alphabet (ITU-T T.50)8859-1 ISO 8859 Latin 1 character setUCS2 16-bit universal multiple-octet coded character set (USO/IEC10646); UCS2 character strings are converted to hexadecimal numbers from 0000 to FFFF. Only the strings found in quotation marks are UCS2 coded, the rest of commands or responses, remains in IRA alphabetAT Command SetGSM 07.05GSM 07.07Motorola proprietary AT commandsTable 1-1: Product Specifications (Cont.)

Regulatory and Approvals6 G30 - Module Hardware Description December 15, 2009Regulatory and Approvals•R&TTE•GCF•FCC/CE •PTCRB •IC•RoHS•Anatel BrazilEuropean Union Directives Conformance StatementThe above gives an example of a typical Product Approval Number.You can view your product's Declaration of Conformity (DoC) to Directive 1999/5/EC (the R&TTE Directive) at www.motorola.com/rtte - to find your DoC, enter the product Approval Number from your product's label in the "Search" bar on the Web site.Important: The following paragraphs must be addressed by the integrator to ensure their host is in compliance to the G30 FCC grant and/or the FCC grant of the host device.CFR 47 Part 15.19 specifies label requirementsThe following text may be on the product, user's manual, or container.This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.Hereby, Motorola declares that this product is in compliance with•The essential requirements and other relevant provisions of Directive 1999/5/EC•All other relevant EU Directives0682IMEI: 350034/40/394721/9Type: G30ProductApprovalNumber

December 15, 2009 G30 - Module Hardware Description 7CFR 47 Part 15.21 Information to userThe user's manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form.CFR 47 Part 15.105 Information to the user(b) For a Class B digital device or peripheral, the instructions furnished the user shall include the following or similar statement, placed in a prominent location in the text of the manual:Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:- Reorient or relocate the receiving antenna.- Increase the separation between the equipment and receiver.- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.- Consult the dealer or an experienced radio/TV technician for help.

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December 15, 2009 G30 - Module Hardware Description 9Chapter 2: Hardware Interface DescriptionThe following paragraphs describe in details the hardware requirements for properly interfacing and operating the G30 module.Architecture OverviewFigure 2-1 below illustrates the primary functional components of the G30.Figure 2-1: G30 Block DiagramVoicebandHandsetMicrophoneHeadsetMicrophonePower-onExternalResetHandset/LoudSpeakerPowerSupplyPowerSupplyCoin Cell(Backup)HeadsetSpeakerAudio AmplifierMCUDSPRAM/ROMMCP MemoryNOR/PSRAM81-pin LGA/70-pin Connector InterfaceSPI/I2S/DAIInterface GPIO I2C ADC CaptureCompareExternalInteruptPMUPowerManagementUnitGSM/GPRSSingle ChipRFTransceiverLNA26MHzXTAL32kHzXTALSIMCardSerialInterfaceSIMCard UART RTCSSC/I2S GPIO I2C ADC CaptureCompare ExtIntExternalBusUnitRFTimingPAControlADC NTCVRF0 VRF1 VRF2PWR_ONRESET_INBaseband SupplyRF SupplyPeripherals SupplyVCCVRTCSPKR_NSPKR_PMIC_HDST, AGND2HDST_SPKRMIC, AGND1RXD_DAITXD_DAICLK_DAIWA0_DAIGPIOx SCLSDA ADC1ADC2VMEMControl and ClockDataAddressVC1, VC2VRAMPTXON_PA, VMODE_ENANT50 OhmAntennaInterfaceTX 850/900TX 1800/1900RX 850RX 900RX 1800RX 1900SAW Filters/DuplexerRX 1800/1900RX 850/900RF MatchingRF MatchingPAAntennaSwitch4-Bands GSM FEMVSIMSIM_IOSIM_CLKSIM_RSTRXDRTSDCDDSRTXDCTSDTRRIeSIMEmbeddedSIMeSIM_RESET

Architecture Overview10 G30 - Module Hardware Description December 15, 2009The G30 consists of the following blocks:BasebandThe baseband IC is combined with the RF transceiver and the power management unit (PMU).This chipset provides all baseband and low power RF band functionality for GPRS/GSM, and includes:•Micro-controller Unit (MCU) for system and user code execution.•Digital Signal Processor (DSP) for voice and data processing.•Serial communications interfaces.•UART•SPI /I2S (via M2M Zone Platform)•SIM card •I2C (via M2M Zone Platform)•Power Management IC (PMIC).•Internal regulators•External VRTC regulator•Voltage reference (applies for 70 pin connector interface model only)•Analog audio interface management.•Handset•Headset•Hands Free•General purpose and dedicated A/D signals.•A/D•Voltage sensor•Temperature sensor•Real Time Clock (RTC) subsystem.•RF transceiver.The G30 base band system provides all necessary interfaces for hardware or software designing and debugging, which are available by means of the 81 board to board pads or the 70 pin connector interface.RF BlockThe G30 RF section is designed with minimum discrete parts, making it more reliable.The RF block consists of:•RF Transceiver/Receiver block in the same single chip IC as the MCU•2 Rx Filters•RF power amplifier and Front End Module in single chip IC

Chapter 2: Hardware Interface Description December 15, 2009 G30 - Module Hardware Description 11Operating ModesG30 incorporates several operating modes. Each operating mode is different in the active features and interfaces.Table 2-1 summarizes the general characteristics of the G30 operating modes and provides general guidelines for operation.Table 2-1: G30 Operating Modes Mode Description FeaturesNot Powered VCC supply is disconnected.VRTC is disconnected.The G30 is Off.Any signals connected to the interface con-nector must be set low or tri-state.RTC Mode Valid VRTC supply.VCC supply is disconnected.The G30 Interfaces are Off. Only the internal RTC timer is operating. Any signals con-nected to the interface connector must be set low or tri-stated.Off Mode Valid VCC supply.RESET_IN signal is enabled (low).The G30 Interfaces are Off. Only the internal RTC timer is operating. Any signalsconnected to the interface connector must be set low or tri-stated.In this mode, the G30 waits for PWR_ON signal to turn ON.Idle Mode RESET_IN signal is disabled (high).CTS and DSR signals are enabled (low).The G30 is fully active, registered to the GSM network and ready to communicate.This is the default power-up mode.Sleep Mode RESET_IN signal is high.CTS signal is disabled.The G30 is in low power mode.The application interfaces are disabled, but, G30 continues to monitor the GSM network.CSD call or GPRS data RESET_IN signal is high.TXEN signal is high.A GSM voice or data call is in progress.When the call terminates, G30 returns to the last operating state (Idle or Sleep).

Power Supply12 G30 - Module Hardware Description December 15, 2009Power SupplyThe G30 power supply must be a single external DC voltage source of 3.3V to 4.2V. The power supply must be able to sustain the voltage level during a GSM transmit burst current surge, which may reach 2.0A.The G30 interface contacts for the main power supply, are described in Table 2-2. All these contacts must be used for proper operation.Power Supply DesignSpecial care must be taken when designing the power supply of the G30. The single external DC power source indirectly supplies all the digital and analog interfaces, but also directly supplies the RF power amplifier (PA). Therefore, any degradation in the power supply performance, due to losses, noises or transients, will directly affect the G30 performance.The burst-mode operation of the GSM transmission and reception, draws instantaneous current surges from the power supply, which causes temporary voltage drops of the power supply level. The transmission bursts consume the most instantaneous current, and therefore cause the largest voltage drop. If the voltage drops are not minimized, the frequent voltage fluctuations may degrade the G30 performance.Table 2-2: Power Supply SignalsPin #(LGA interface)Pin #(70 pin connector interface)Signal Name Description65, 67-77 1-4 GND Main ground connection for G30 module.78, 79 5-8 VCC DC supply input for G30 module.VIN = 3.3 V to 4.2 VIRMS = 350 mA during multislot transmissionIMAX = 2 A during transmit bursts

Chapter 2: Hardware Interface Description December 15, 2009 G30 - Module Hardware Description 13Figure 2-2 illustrates the power supply behavior during GSM transmission.Figure 2-2: Transmission Power DropsNote: 1 TX slot is shown.It is recommended that the voltage drops during a transmit burst will not exceed 300mV, measured on the G30 interface connector. In any case, the G30 supply input must not drop below the minimum operating level during a transmit burst. Dropping below the minimum operating level may result in a low voltage detection, which will initiate an automatic power-off.To minimize the losses and transients on the power supply lines, it is recommended to follow these guidelines:•Use a 1000 uF, or greater, low ESR capacitor on the G30 supply inputs. The capacitor should be located as near to the G30 interface connector as possible.•Use low impedance power source, cabling and board routing.•Use cabling and routing as short as possible.•Filter the G30 supply lines using filtering capacitors, as described in Table 2-3.Table 2-3: Recommended Power Supply FilteringCapacitor Usage Description1000 uF GSM Transmit current sergeMinimizes power supply losses during transmit bursts.Use maximum possible value.10 nF, 100 nF Digital switching noise Filters digital logic noises from clocks and data sources.8.2 pF, 10 pF 1800/1900 MHz GSM bandsFilters transmission EMI.33 pF, 39 pF 850/900 MHz GSM bandsFilters transmission EMI.

Power Supply14 G30 - Module Hardware Description December 15, 2009Power ConsumptionTable 2-4 specifies typical G30 current consumption ratings in various operating modes. The current ratings refer to the overall G30 current consumption over the VCC supply.Table 2-4: G30 Current Ratings Parameter Description Conditions Min Typ Max UnitIOFF RTC mode 90 µAIIDLE Idle mode 28 mAISLEEP Low power mode DRx 9 2 mA

Chapter 2: Hardware Interface Description December 15, 2009 G30 - Module Hardware Description 15Power On/Off OperationThe G30 power on and off process includes two primary phases, which are indicated at the interface connector by the hardware input signal RESET_IN, and the output signal CTS.The RESET_IN is usually an input signal to the G30, and its main function is to initiate HW reset to the G30. However, this signal can also serve as "live indication" signal, and indicate whether G30 is powered on or off.Note: When RESET_IN is used as "Live Indication", verify that the signal is connected to an input device (via a input buffer), with NO pull-up or pull-down resistors.When this signal is enabled (low), G30 is powered-off. When it is disabled (high), G30 is powered-on.The CTS signal indicates the serial communications interface (UART) status. When this signal is high, the G30 serial interface is disabled. When it is low, the serial interface is enabled, and G30 is ready to communicate.When G30 is powered on, and after the CTS is enabled (Low), The G30 initiates an unsolicited "Wait...At command Ready" massage via the UART serial interface, followed by "+PBREADY" massage (once all G30 internal tests are done).For more information, refer to "G30 AT Commands Reference Manual, P/N 6802986C33".Important: Applying voltage to ADC lines before power up is forbidden and may cause G30 power up issues.Important: Do not operate the G30 out of its electrical or environmental limits. Refer to the specifications chapter for details of these limits.Turning the G30 OnWhen the G30 power supply is stable above the minimum operating level and G30 is powered off, only the internal RTC timer is active.When G30 is turned on, by any of the methods described below, it will first perform an automatic internal system-test, during which basic functions are verified. The system-test duration is typically 1600 milliseconds. When the system-test has completed G30 resumes normal operation.During the internal system-test process G30 may toggle several interface signals, which are visible to the application. These signals do not represent any valid state or data, and should be ignored by the customer application until the system-test has completed.Power Supply Turn-onWhen connecting the power supply for the first time, or when reconnecting it after a power supply loss, G30 will power-on. The G30 is turned-on automatically when external power is applied above the minimum operating level.

Power On/Off Operation16 G30 - Module Hardware Description December 15, 2009Figure 2-3 illustrates the G30 power on upon application of a power supply.Figure 2-3: Power Supply Turn-onTurning the G30 On Using PWR_ONThe PWR_ON input signal is set high by an internal pull-up resistor whenever a power supply is applied to G30. Therefore, it is recommended to operate this signal using an open collector/drain circuit connection.Asserting the PWR_ON signal low for a minimum of 600 milliseconds (0.6 seconds) and a maximum of 1.5 seconds will cause the G30 to turn-on.Asserting the PWR_ON signal low for more than 1.5 seconds may cause the G30 to interpret the signal as a power-off command, and turn off immediately after turning on.Figure 2-4 illustrates the power-on process using the PWR_ON signal.Figure 2-4: PWR_ON Power On TimingTurning the G30 OffThere are several ways to turn the G30 off:•Asserting the PWR_ON signal low for a minimum of 3 seconds.•Low power automatic shut down.•AT command.

Chapter 2: Hardware Interface Description December 15, 2009 G30 - Module Hardware Description 17Turning the G30 Off Using PWR_ONThe PWR_ON signal is set high using an internal pull up resistor when power is applied to G30. Asserting the PWR_ON signal low for a minimum of 3 seconds will turn G30 off. This will initiate a normal power-off process, which includes disabling of all applications interfaces (UART, SIM card, audio, etc.) and closing the network connection.Figure 2-5 illustrates the power-off timings when using the PWR_ON signal.Figure 2-5: PWR_ON Power Off TimingPower Loss shut downA low power shut down occurs when G30 senses the external power supply is below the minimal operating limit. The module will respond by powering down automatically without notice.This form of power-down is not recommended for regular use since the unexpected power loss may result in loss of data.Turning the G30 Off Using AT+MRSTThe AT+MRST command initiates a G30 system reset operation, which powers off the G30. This command emulates the PWR_ON signal operation for power off.

Low Power Mode18 G30 - Module Hardware Description December 15, 2009Low Power ModeThe G30 incorporates an optional low power mode, called Sleep Mode, in which it operates in minimum functionality, and therefore draws significantly less current. During low power mode the G30 network connection is not lost. G30 continues to monitor the GSM network constantly for any incoming calls or data.During low power mode, all of the G30 interface signals are inactive and are kept in their previous state, prior to activating low power mode. To save power, all the G30 internal clocks and circuits are shut down, and therefore serial communications is limited.Activating Low Power ModeBy default, the G30 powers on in Idle mode. In this mode the G30 interfaces and features are functional and the module is fully active.Low power mode is activated by the ATS24 command. The value set by this command determines the inactive state duration required by G30, in seconds, after which G30 will enter sleep mode.For example:ATS24 = 1 activates low power mode after 1 second of inactivity.ATS24 = 5 activates low power mode after 5 seconds of inactivity.ATS24 = 0 disables low power mode (default).Figure 2-6 illustrates the ATS24 command operation.Figure 2-6: ATS24 OperationImportant: G30 will not enter low power mode in any case when there is data present on the serial interface or incoming from the GSM network or an internal system task is running. Only when processing of any external or internal system task has completed, and G30 is inactive for the duration of ATS24, it will enter low power mode.Serial Interface During Low Power ModeDuring low power mode the G30 serial interfaces are disabled. This is indicated by the CTS signal high state.

Chapter 2: Hardware Interface Description December 15, 2009 G30 - Module Hardware Description 19The G30 wakes up periodically from low power mode to page the GSM network for any incoming calls or data. After this short paging is completed, G30 returns to low power mode. During this short awake period, the serial interfaces are enabled and communications with the module is possible.The CTS signal is alternately enabled and disabled synchronously with the network paging cycle. CTS is enabled whenever G30 awakes to page the network. This indicates the G30 serial interfaces are active (see Figure 2-7).Figure 2-7: CTS Signal During Sleep ModeThe periodical enabling and disabling of the CTS signal during low power mode can be controlled by the AT+MSCTS command.Setting AT+MSCTS=1 permanently disables the serial interface during low power mode, even during a network page by G30. The CTS signal is disabled, and therefore the serial interfaces are blocked.Terminating Low Power ModeTerminating the low power mode, or wake-up, is defined as the transition of the G30 operating state from Sleep mode to Idle mode. There are several ways to wake-up G30 from low power mode as described below.Important: During power saving mode the G30 internal clocks and circuits are disabled, in order to minimize power consumption. When terminating the power saving mode, and switching to Idle mode, G30 requires a minimal delay time to reactivate and stabilize its internal circuits before it can respond to application data.This delay is typically of TBD milliseconds, and is also indicated by the CTS signal inactive (high) state. The delay guarantees that data on the serial interface is not lost or misinterpreted.

Low Power Mode20 G30 - Module Hardware Description December 15, 2009Temporary Termination of Low Power ModeTemporary termination of low power mode occurs when G30 switches from Sleep mode to Idle mode for a defined period, and then returns automatically to Sleep mode.Low power mode may be terminated temporarily by several sources, some of which are user initiated and others are initiated by the system.Using the WKUPI signalThe WKUPI signal is an active low input, that is set high by default. By asserting this signal low the application can wake-up G30 from low power mode and switch to Idle mode.G30 will remain in Idle mode, awake and fully active, as long as WKUPI signal remains low. When this signal is disabled and set high again, G30 will return to Sleep mode automatically, according to the ATS24 settings (see Figure 2-8).Figure 2-8: WKUPI Signal OperationThe WKUPI signal is the recommended method to temporarily wake-up G30 from low power mode. It provides the application full control of the G30 operating mode and guarantees that data on the serial interface will not be lost or misinterpreted.The WKUPI signal must be used to wake up G30 from low power mode if the serial interface has been disabled by the AT+MSCTS command.Incoming Network DataDuring low power mode, G30 continues monitoring the GSM network for any incoming data, message or voice calls.When G30 receives an indication from the network that an incoming voice call, message or data is available, it automatically wakes up from low power mode to alert the application. When G30 has completed to process all the tasks related to the incoming data, it will automatically return to low power mode according to the ATS24 settings.Depending on the type of network indication and the application settings, G30 may operate in several methods, which are configurable by AT commands, to alert the application of the incoming data:•Enable the WKUPO signal to wake-up the application from low power.•Send data to the application over the serial interface.•Enable the serial interface's Ring Indicator (RI) signal.

Chapter 2: Hardware Interface Description December 15, 2009 G30 - Module Hardware Description 21Data on the Serial interfaceWhile G30 is temporarily awake in Idle mode, data may be transmitted on the serial interface. In case data is being transmitted in any direction, G30 will not return to low power mode. This is regardless of the original wake-up reason or source. G30 will remain awake while data is transferred.Only when the serial interface transfer is completed and the data has been processed, G30 will return to low power mode automatically, according to the ATS24 settings (see Figure 2-9).Figure 2-9: Serial Interface DataPermanent termination of Low Power ModeThe G30 low power mode is enabled and disabled by the ATS24 command.To permanently terminate the G30 low power mode, the ATS24 = 0 command must be used. Setting ATS24 = 0 disables the currently active low power mode and switches G30 to Idle mode.G30 will not return to low power mode until an ATS24 > 0 commands is set again.This command can be sent only when the serial interface is active.In case the serial interface is disabled, it must first be activated before sending this command. To reactivate the serial interface, a temporary termination of the low power mode is required, as described in “Temporary Termination of Low Power Mode” on page 20.Following the temporary low power mode termination, the serial interface will activate and the ATS24 = 0 command can be received by G30.

Real Time Clock22 G30 - Module Hardware Description December 15, 2009Real Time ClockG30 incorporates a Real Time Clock (RTC) mechanism that performs many internal functions, one of which is keeping time. The RTC subsystem is embedded in the PMU and operates in all of the G30 operating modes (Off, RTC, Idle, Sleep), as long as power is supplied above the minimum operating level.The G30 time and date can be set using the following methods:•Automatically retrieved from the GSM network.In case G30 is operated in a GSM network that supports automatic time zone updating, it will update the RTC with the local time and date upon connection to the network. The RTC will continue to keep the time from that point.•Using the AT+CCLK command.Setting the time and date manually by this AT commands overrides the automatic network update.Once the time and date are manually updated, the RTC timer will keep the time and date synchronized regardless of the G30 operating state.When the power supply is disconnected from G30 and no voltage is supplied to the VRTC pin, the RTC timer will reset and the current time and date will be lost. On the next G30 power-up the time and date will need to be set again automatically or manually.Note: A 47uF capacitor should be connected between ground and VRTC signal (pin 62 of the 81-pin LGA interface/pin 60 of the 70-pin connector).

Chapter 2: Hardware Interface Description December 15, 2009 G30 - Module Hardware Description 23Serial InterfacesG30 includes three completely independent serial communications interfaces, which may be used by the application for several purposes.UARTThe G30 UART is a standard 8-signal bus. The primary UART is used for all the communications with G30 - AT commands interface, GPRS data and CSD data, programming and software upgrades.The UART signals are active low CMOS level signals. For standard RS232 communications with a PC, an external transceiver is required.G30 is defined as a DCE device, and the user application is defined as the DTE device. These definitions apply for the UART signals naming conventions, and the direction of data flow, as described in Figure 2-10.Figure 2-10: UART Interface SignalsThe G30 UART supports baud rates 300, 600, 1200, 2400, 4800, 9600, 19200, 38400, 57600, 115200, and 230400 bps.Auto baud rate detection is supported for baud rates up to 230400 bps.All flow control handshakes are supported: hardware, software, or none.Parity bit and Stop bit definitions are also supported.The UART default port configuration is 8 data bits, 1 stop bit and no parity, with hardware flow control and auto baud rate detect enabled.Important: The G30 UART will not send data over the serial interface in case the DTR and/or RTS input signals are disabled (set high). Therefore, regardless of the handshake method, it is still required to enable these signals for proper operation, by asserting them low.

Serial Interfaces24 G30 - Module Hardware Description December 15, 2009Serial Peripheral Interface (SPI)The G30 provides a synchronous SPI-compatible serial interface, implemented with the synchronous serial controller hardware block of the G30. The SPI is a master-slave protocol: the module runs as a SPI master device.The SPI interface includes basically the following signals to transmit and receive data and to synchronize them:•MOSI (master output, slave input) signal which is an output for the module while it runs as SPI master;•MISO (master input, slave output) signal which is an input for the module while it runs as SPI master;•Clock signal which is an output for the module while it runs as SPI master;•Optional chip select signal which is an output for the module while it runs as SPI master.Note: The SPI interface is internally connected to the I2S digital audio interface, and is controlled by means of software settings. Hence SPI interface is available only if the I2S digital audio interface is disabled.The SPI interface can be used as a data event logger by connecting SPI signals to an external SPI-UART dedicated interface, and enabling the data logging interface by SW.Note: In case that the M2M zone platform is being used, the SPI interface can be configured as GPIOs, disabling the I2S digital audio and SPI interface.The board to board pins related to SPI interface description are given in Table 2-5:Table 2-5: SPI Interface Connections Pin #(LGA interface)Pin #(70 pin connector interface)G30Signal Name G30I/O Function Remarks762SPI_IRQ I SPI Interrupt Input Generic digital interfaces voltage domain.Output driver class C.PU/PD class B.Value at reset: T/PD.I/O Capture/CompareI/O GPIO60 68 SPI_MOSI OSPI sync data (MOSI)Short to pin 5Generic digital interfaces voltage domain.Output driver class D.PU/PD class B.Value at reset: T.63 70 SPI_CS OSPI chip selectShort to pin 58Generic digital interfaces voltage domain.Output driver class D.PU/PD class B.Value at reset: T.45 66 SPI_CLK OSPI ClockShort to Pin 57Generic digital interfaces voltage domain.Output driver class D.PU/PD class B.Value at reset: T.

Chapter 2: Hardware Interface Description December 15, 2009 G30 - Module Hardware Description 25I2C Bus InterfaceThe module provides an I2C bus interface which includes a serial data line and a clock line on the board to board pins. The G30 I2C acts as master only. The I2C bus interface is available to the user only with M2M Zone Platform.The I2C signals are pulled-up, using internal 4.7 kOhm resistors.Note: Do not connect any pull-up resistors when using signals as I2C interface.Note: The I2C Bus interface can only be activated by M2M Zone Platform. Otherwise, the I2C signals are configured as GPIOs.The board to board pins related to I2C bus interface description is given in Table 2-6:SIM InterfaceThe G30 incorporates a SIM interface, which conforms to the GSM 11.11 and GSM 11.12 standards, that are based on the ISO/IEC 7816 standard. These standards define the electrical, signaling and protocol specifications of a GSM SIM card.61 64 SPI_MISO ISPI sync data (MISO)Short to pin 55Generic digital interfaces voltage domain.Output driver class D.PU/PD class B.Value at reset: T.Table 2-5: SPI Interface Connections (Cont.)Pin #(LGA interface)Pin #(70 pin connector interface)G30Signal Name G30I/O Function RemarksTable 2-6: I2C Interface Connections Pin #(LGA interface)Pin #(70 pin connector interface)G30Signal Name G30I/O Function Remarks33 34 GPIO4/SCL O I2C bus clock line I2C interface voltage domain.PU drain.Value at reset: T/OD.I/O GPIO34 32 GPIO3/SDA I/O I2C bus data line I2C interface voltage domain.PU drain.Value at reset: T/OD.I/O GPIO

SIM Interface26 G30 - Module Hardware Description December 15, 2009Both 1.8 V and 3 V SIM types are supported; activation and deactivation with automatic voltage switch from 1.8 V to 3 V is implemented.G30 is designed to support two SIM card options with the same SIM signals: External SIM card, or an on board Embedded SIM (eSIM), depending on the G30 model.Table 2-7 details the SIM interface signals.External SIM CardG30 does not incorporate an on-board SIM card tray for SIM placement. The external SIM must be located on the user application board, external to the G30. The G30 SIM interface includes all the necessary signals, which are routed to the interface connector, for a direct and complete connection to an external SIM.G30 supports dynamic detection of the SIM card, through a dedicated SIM detection signal. G30 will detect a SIM card insertion or removal upon power up or during operation by the transitions on the SIM_PD_N signal.Table 2-7: SIM Interface SignalsPin #(LGA interface)Pin #(70 pin connector interface)Signal Name Description20 48 VSIM 2.85V/1.8V Supply to the SIM21 44 SIM_RST Active low External SIM reset signal22 52 SIM_IO Serial input and output data23 46 SIM_CLK Serial 3.25 MHz clock59 50 SIM_PD_n Active low SIM card presence detection456eSIM_RESET Active low Embedded SIM reset signal

Chapter 2: Hardware Interface Description December 15, 2009 G30 - Module Hardware Description 27External SIM ConnectionFigure 2-11 illustrates a typical external SIM interface connection to G30. This connection type is implemented on the G30 Developer Board, using an FCI SIM tray, PN 7111S1615A05.Figure 2-11: G30 External SIM InterfaceExternal SIM Design GuidelinesThe SIM interface and signals design is extremely important for proper operation of G30 and the SIM card. There are several design guidelines that must be followed to achieve a robust and stable design that meets the required standards and regulations.•Using the SIM detection signal, SIM_PD_N, is mandatory in case the SIM card is accessible to the user and may be removed during G30 operation. To avoid any damage to the SIM or G30, the SIM interface signals must be deactivated before the SIM card contacts are mechanically removed from the SIM tray contacts. Therefore, the SIM_PD_N detection signal must be disabled before the SIM is removed from its tray.•The SIM should be located, and its signals should be routed, away from any possible EMI sources, such as the RF antenna and digital switching signals.•The SIM interface signals length should not exceed 100 mm between the G30 interface connector and the SIM tray. This is to meet with EMC regulations and improve signal integrity.•To avoid crosstalk between the SIM clock and data signals (SIM_CLK and SIM_DIO), it is recommended to rout them separately on the application board, and preferably isolated by a surrounding ground plane.•The SIM card signals should be protected from ESD using very low capacitance protective elements (zener diodes, etc.).•The G30 interface does not support SIM programming through the VPP signal. This signal should not be connected to G30.

SIM Interface28 G30 - Module Hardware Description December 15, 2009Embedded SIMThe G30 incorporates an Embedded SIM (depending on G30 model).Embedded SIM (e.g. eSIM or chip SIM), is a secured micro controller IC, with the same pinout interface, and the same operation as an external SIM card.The eSIM main advantage is it robustness, making it an ideal solution for the M2M, and automotive application.Since an eSIM is actually an IC soldered on the G30, it can withstand wider temperature range than a regular external SIM card that is usually made of plastic, and gets twisted and bowed at high temperature, causing disconnection inside the SIM tray.For the same reason, the eSIM is more durable to vibration then a regular external SIM card. Hard vibration on an application with a SIM card socket may result in with an intermitted connection between the SIM card socket and the SIM card.Note: When Embedded SIM is used, it is recommended to connect the SIM_PD_n signal to ground. However, in case the SIM detection is disabled by SW (+MSMPD command), this signal can be left disconnected.eSIM ConnectionFigure 2-12 illustrates a typical eSIM interface connection to G30.Figure 2-12: G30 eSIM InterfaceNote: When Embedded SIM is used, SIM_RST signal must be connected to eSIM_RESET signal via an optional 0 ohm resistor.

Chapter 2: Hardware Interface Description December 15, 2009 G30 - Module Hardware Description 29Audio InterfaceThe G30 audio interface supports several audio devices and operating modes.The audio interface's operating modes, active devices, amplification levels and speech processing algorithms are fully controlled by the host application, through advanced programming options and a versatile AT commands set.The G30 supports the following audio devices:•Two single-ended and biased mono analog microphone inputs for use in a variety of modes.•A single differential mono analog speaker output for use in a variety of modes.•A digital serial interface using I2S coding.•A single-ended mono analog speaker output for use in a variety of modes.Figure 2-13 shows the audio interface topology.Figure 2-13: Audio Interface TopologyHandset Microphone PortThe handset microphone port is the G30 power-up default active audio input for voice calls. It is located on pin 51 at the G30 81 pin LGA interface, named MIC.It is designed as a single-ended input and should be referenced to the G30 analog ground.The microphone input includes all the necessary circuitry to support a direct connection to an external microphone device. It incorporates an internal bias voltage of 2.0V through a 3kΩ resistor, and has an impedance of 1kΩ.

Audio Interface30 G30 - Module Hardware Description December 15, 2009Figure 2-14 shows the microphone circuit and Table 2-8 gives the microphone specifications.Figure 2-14: Handset Microphone CircuitImportant: The microphone circuit design depends on the type of microphone device. A series capacitor is required in case a passive microphone is used, or the application provides a separate bias voltage to an active microphone circuit.The internal G30 biasing circuit may also be used with an active microphone, which corresponds to the microphone port specifications.Headset Microphone PortThe headset microphone port is designed for use with, but not limited to, a headset audio device. It is located at pin 53 on the G30 81 pin LGA interface, named MIC_HDST.It is designed as a single-ended input and should be referenced to the G30 analog ground.The microphone input includes all the necessary circuitry to support a direct connection to a headset microphone device. It incorporates an internal bias voltage of 2.0V through a 3.0kΩ resistor, and has an impedance of 1kΩ.Table 2-8: Handset Microphone Port SpecificationsParameter Conditions Min Typ Max UnitInput Voltage No loadAT+MMICG=02.0 VPPGain Programmable in 3 dB steps045dBAC Input Impedance1kΩBias voltage RBIAS = 3.0 kΩIBIAS = 1 mA1.8 2.0 2.2 VBias Current 1 mA

Chapter 2: Hardware Interface Description December 15, 2009 G30 - Module Hardware Description 31Figure 2-15 shows the microphone circuit and Table 2-9 gives the microphone specifications.Figure 2-15: Headset Microphone CircuitImportant: The headset microphone circuit design depends on the type of microphone device.A series capacitor is required in case a passive microphone is used, or the application provides a separate bias voltage to an active microphone circuit.The internal G30 biasing circuit may also be used with an active microphone, which corresponds to the headset microphone port specifications.Differential Speaker (Handset) PortThe analog differential speaker port is the G30 power-up default active output for voice calls and DTMF tones. It is located at pins 48 and 49 on the G30 81 pin LGA interface, named SPKR_N and SPKR_P respectively.It is designed as a differential output with 8Ω impedance, but may also be used as a single-ended output referenced to the G30 analog ground.The differential speaker output is used for the handset audio path.Table 2-9: Headset Microphone Port SpecificationsParameter Conditions Min Typ Max UnitInput Voltage No loadAT+MMICG=02.0 VPPGain Programmable in 1 dB steps045dBAC Input Impedance1kΩBias voltage RBIAS = 3.0 kΩIBIAS = 1 mA1.8 2.0 2.2 VBias Current 1 mA

Audio Interface32 G30 - Module Hardware Description December 15, 2009Figure 2-16 shows a differential speaker circuit, Figure 2-17 shows a single-ended speaker circuit and Table 2-10 gives the speaker specifications.Figure 2-16: Differential Speaker CircuitImportant: For safety regulations it is important to place series resistors on the speaker output lines, as illustrated in Figure 2-16. The resistors value should be R = 0Ω at the design stage, but may be changed to a different value during audio safety testing, in case speaker level limitation is required.Figure 2-17: Single-ended Speaker Circuit

Chapter 2: Hardware Interface Description December 15, 2009 G30 - Module Hardware Description 33Important: When implementing a single ended speaker design, it is required to place a series capacitor and resistor on the speaker output line, as illustrated in Figure 2-17.The capacitor should be of low tolerance with values of C = 10-22 uF.The resistor value depends on the speaker application:- For a handset device, the resistor value should be R = 0Ω at the design stage, but may be changed to a different value during audio safety testing, in case speaker level limitation is required.- For a headset device, safety regulations require the resistors value to be R > 2RLΩ, where RL is the speaker impedance (e.g. 32Ω).For example, when using a 32Ω speaker the series resistance would be R > 64Ω.Mono Speaker (Headset) PortThe mono speaker port can be used for voice calls and DTMF tones. It is located at pin 47 on the G30 81 pin LGA interface, named HDST_SPK.It is designed as a single-ended output with 32Ω impedance, referenced to the G30 analog ground.Figure 2-18 shows the headset speaker circuit and Table 2-11 gives the headset speaker specifications.Figure 2-18: Mono Speaker (Headset) CircuitTable 2-10: Speaker Port SpecificationsParameter Conditions Min Typ Max UnitOutput VoltageNo loadSingle ended2.7 VPPGain Programmable in 3 dB steps-15 +9 dBAC Output Impedance8ΩDC Voltage VCC/2 VTHD 8 Ω load300 Hz - 4 kHz1%Isolation Speech, f> 4 kHz 60 dB

Audio Interface34 G30 - Module Hardware Description December 15, 2009Important: When implementing a single ended loudspeaker design, it is required to place a series capacitor and resistor on the alert output line, as illustrated in Figure 2-18.The capacitor should be of low tolerance with values of C = 10-22 uF.The resistor value should be R = 0Ω at the design stage, but may be changed to a different value during audio safety testing, in case that alert level limitation is required.Headset DetectionThe G30 operates by default in the basic audio mode with the differential speaker (handset) audio path, for DTMF tones, speech, rings, and alert tones active.The headset (mono speaker) path is an alternate audio path in basic mode. It is designed for, but not limited to, a personal hands-free audio device, a headset, using the headset microphone input device and the headset speaker output device. When this path is selected, the differential speaker is disabled, and all the audio sounds are passed through to the headset path.The HDST_INT signal is used to switch between handset and headset audio paths in basic audio mode. This signal is set high by default at power up. Asserting the HDST_INT signal low enables the headset audio path and disables the handset path. Setting this signal high will disable the headset path and enable the handset path.The G30 supports dynamic switching between the handset and headset audio paths, during operation and call handling.Important: The HDST_INT signal does not operate in advanced audio mode. This signal's functionality is overridden by the AT+MAPATH command settings.Table 2-11: Mono Speaker Port SpecificationsParameter Conditions Min Typ Max UnitOutput Volt-ageNo loadSingle endedTBD VPPGain Programmable in 3 dB steps-18 0 dBAC Output Impedance32 ΩDC Voltage TBD VTHD 32 Ω load300 Hz - 4 kHz1%Isolation 60 dB

Chapter 2: Hardware Interface Description December 15, 2009 G30 - Module Hardware Description 35Digital Audio InterfaceThe G30 digital audio interface is a serial Pulse Code Modulation (PCM) bus, which uses linear 2's compliment coding. G30 is the PCM bus master, supplying the clock and sync signals to the application.The G30 digital interface is a 4 signal PCM bus, which includes a bit clock output signal for the bus timing, a frame sync output signal for audio sampling timing, and serial data input and output signals.Important: The PCM bus signals are shared internally by the analog audio interface and the digital audio interface. Therefore, when using the analog audio interface the PCM bus signals must be tri-stated or disconnected at the interface connector.The digital audio interface supports 2 types of audio data formats, which define the PCM bus configuration and data rates:•Normal I2S mode.•PCM mode.The PCM bus configuration is defined by the audio data format that is sounded through the digital audio path, as described in Table 2-12.Note: Switching between Audio Modes is done using AT+MAI2SY command. For detailed information, refer to G30 AT Commands Reference Manual (P/N 6802986C33).Voiceband AudioThis digital voice audio format is used for speech during voice calls and for mono rings and alerts.The I2S bus signal's configuration for voiceband audio is:•I2S_CLK - 512 kHz serial clock•I2S_FS - 8 kHz bit-wide frame-sync•I2S_DOUT - 16-bit linear audio data outputI2S capture - TBD•I2S_DIN - 16-bit linear audio data inputThe PCM bus signal's configuration for voiceband audio is:•PCM_CLK - 144 kHz serial clockTable 2-12: Digital Audio modesAudio Mode Frame Sync Sampling Bit ClockPCM 8 kHz 144 kHzI2S8 kHz 512 kHz

Audio Interface36 G30 - Module Hardware Description December 15, 2009•PCM_FS - 8 kHz bit-wide frame-sync•PCM_DOUT - 16-bit linear audio data output•PCM_DIN - 16-bit linear audio data inputThe 16-bit serial data is transferred in both directions after each sync signal's falling edge. The sync signal pulse duration is two clock periods, after which the serial data is transferred in both directions for 16 consecutive clock periods.Following the 16-bit data transfer, the serial input and output data signals inactivate until the next sync pulse, which occurs every 125 µS (8 kHz). It is recommended the serial data signals will be High-Z during the inactive period.Figure 2-19 illustrates the PCM bus format of the voiceband audio configuration.Figure 2-19: Voiceband Mode PCM Bus Coding FormatOperating ModesThe G30 audio interface includes 2 modes of operation. Each operating mode defines the audio input and output devices to be used for each audio sound type and their programmable settings.Basic ModeBasic audio mode is the G30 default power-up audio configuration. Several audio paths are available in this mode, and their settings can be programmed through the AT command set.Table 2-13 describes the available audio paths in Basic mode.Table 2-13: Basic Mode Audio PathsAudio Path Input Signal Output Signal DescriptionHandset MIC SPKR_N, SPKR_P Default audio path for speech and DTMF tones and ring.Headset HDST_INT HDST_SPK Alternate path for headset device.Enable by setting HDST_INT inter-face signal low.Digital PCM_DIN PCM_DOUT Enable digital path by AT+MADIGITAL=1

Chapter 2: Hardware Interface Description December 15, 2009 G30 - Module Hardware Description 37Advanced ModeAdvanced audio mode utilizes G30's unique set of AT commands for advanced audio programming. The expanded AT command set enables to define a specific audio path and setting, which are not part of the default configuration, for each type of audio sound (speech, DTMF tones, rings and alerts).Unlike basic audio mode, which provides predefined audio paths, the advanced audio mode provides full control over the G30 audio interface and its parameters, and differentiates between each type of audio sound.Table 2-14 describes the advanced mode audio programming features. These features are only a part of the complete advanced audio AT command set.Audio Programming InterfaceThe G30 incorporates a unique audio programming interface, through AT commands, which controls the following audio features:•Audio Path - Defines the input and output devices for speech, DTMF tones, rings and alerts.•Audio Gain - Defines the amplification (gain) level for input and output audio devices.•Audio Algorithm - Defines the speech processing features for voice calls.Table 2-14: Advanced Mode CommandsCommand DescriptionAT+MAPATH Sets the input device for voice, and the output devices for voice, DTMF tones, rings and alerts.AT+MAFEAT Enables and disables the speech processing algorithms - Echo suppression, noise sup-pression and sidetone.AT+MAVOL Sets the gain (amplification) level of the selected analog output device.AT+MMICG Sets the gain (amplification) level of the selected analog input device.AT+MMICV Sets the MIC bias voltage.AT+MADIGITAL Switches between analog and digital audio paths.

Audio Interface38 G30 - Module Hardware Description December 15, 2009Figure 2-20 describes the audio programming interface options, which are defined by AT commands.Figure 2-20: Audio Programming InterfaceAudio AlgorithmsThe G30 audio interface features advanced speech processing algorithms for echo suppression, noise suppression and side-tone feedbackEnabling or disabling the algorithms can be configured separately for each audio path and operating mode through the AT command interface.The G30 also supports full rate (FR), half rate (HR), enhanced full rate (EFR) and adaptive multi-rate (AMR) speech coding algorithms, which are used by the GSM network. These algorithms are configured and operated by the GSM network provider.Table 2-15 gives the speech processing features.Table 2-15: Speech Processing FeaturesFeature AT Command Default Setting DescriptionBasic AdvancedEcho SuppressionATS96 AT+MAFEAT DisabledControls the echo and noise suppres-sion.Noise SuppressionSidetone ATS94 AT+MAFEAT Enabled Controls the sidetone.

Chapter 2: Hardware Interface Description December 15, 2009 G30 - Module Hardware Description 39Gain ControlThe amplification (gain) level for each input and output device can be configured through AT commands. Both basic and advanced audio modes provide AT commands to set the desired gain levels for each audio path and audio sound type.Table 2-16 gives the gain control features.Audio DesignThe audio quality delivered by G30 is highly affected by the application audio design, particularly when using the analog audio interface. Therefore, special care must be taken when designing the G30 audio interface. Improper design and implementation of the audio interface will result in poor audio quality.Poor audio quality is a result of electrical interferences, or noises, from circuits surrounding the audio interface. There are several possible sources for the audio noise:•Transients and losses on the power supply•EMI from antenna radiations•Digital logic switching noiseMost of the audio noise originates from the GSM transmit burst current surges (217 Hz TDMA buzz), which appear on the main power supply lines and antenna, but also indirectly penetrate the internal application's supplies and signals. The noises are transferred into the G30's audio circuits through the microphone input signals and then are amplified by the G30's internal audio amplifiers.To minimize the audio noise and improve the audio performance the microphone and speaker signals must be designed with sufficient protection from surrounding noises.The following guidelines should be followed to achieve best audio performance:•Reference the microphone input circuits to the G30 AGND interface signal.•If using single-ended audio outputs, they should be referenced to the G30 AGND interface signal.•Keep the audio circuits away from the antenna.•Use RF filtering capacitors on the audio signals, as described in Table 2-3.•The audio signals should not be routed adjacent to digital signals.Table 2-16: Gain Control FeaturesDevice Gain Command Default Gain DescriptionBasic AdvancedMicrophoneAT+MMICG AT+MMICG8 Sets input speech gain level.Headset Micro-phone8 Sets input speech gain level.Mono Speaker AT+CLVLAT+MAVOL4 Sets voice and DTMF gain.Differential Speaker AT+CRSL 4 Sets rings and alerts gain.

Audio Interface40 G30 - Module Hardware Description December 15, 2009•Isolate the audio signals by a surrounding ground plane or shields.•Filter internal supplies and signals that may indirectly affect the audio circuits, from noises and voltage drops.Analog GroundThe G30 interface incorporates a dedicated analog ground contacts, AGND pads 52, 54 (of the 81 pin LGA interface), which are internally connected to the G30's ground. The AGND signal is intended to provide a separate ground connection for the application's external audio devices and circuits.This signal provides an isolated ground connection directly from G30, which is separated from the noisy digital ground of the application. It is recommended to connect this signal to analog audio devices and circuits used by the application. Using a separate analog ground minimizes audio noises and improves the audio circuit's immunity from external interferences.

Chapter 2: Hardware Interface Description December 15, 2009 G30 - Module Hardware Description 41A/D InterfaceThe G30 includes 3 Analog to Digital Converter (ADC) signals with 12-bit resolution, for environmental and electrical measurements. The ADC signals measure an analog DC voltage level on their inputs which is converted to a 12-bit digital value for further processing by G30 or the user application.The A/D signals operation and reporting mechanism is defined by the AT+MMAD command. Each A/D can be defined to provide several reports:•A single measurement.A single A/D measurement will take place and will be reported upon activation of the AT command.•An automatic periodical measurement.The A/D measures its input signal at a rate that is defined by the user application. Every measurement will generate an unsolicited message over the serial interface.•An automatic periodical measurement with predefined limits.The A/D measures its input signal at a rate that is defined by the user. The user also defines upper and/or lower limits for the A/D measurements. Each measurement is compared to these limits, and an unsolicited message is generated only if these limits are exceeded.Important: In case the defined periodical measurement rate is equal to, or shorter than, the defined sleep mode delay settings (ATS24), G30 will not enter low power mode.Important: Applying voltage to ADC lines before power up is forbidden and may cause G30 power up issues.Power Supply A/DThe main power supply (VCC) is constantly monitored internally by the G30 through a dedicated A/D signal, which is not accessible on the interface connector.The measured VCC level can be read and monitored by the user application through the AT+MMAD command, which returns the measured VCC level in Volts times 100.For example, a measured supply level of 3.65 Volts will be presented as 365 by the MMAD command.

A/D Interface42 G30 - Module Hardware Description December 15, 2009Important: During GSM transmissions the power supply may suffer voltage drops. This can cause frequent and wide changes in the power supply A/D measurements. This should be taken into account when designing and operating the G30 power supply A/D interface.Table 2-17 gives the supply A/D specifications.General Purpose A/DThe G30 provides 2 general purpose A/D (GPAD) signals for customer application use. Each A/D signal can monitor a separate external voltage and report its measured level independently to the application, through the AT command interface.The GPAD signals measure a DC voltage level of 0 - 1.92 V, which is converted internally to a 12-bit digital value. The user application can monitor the A/D voltage level through the AT+MMAD command, which returns the measured DC level in Volts times 100.For example, a measured analog DC level of 1.75 Volts will be presented as 175 by the MMAD command.Table 2-18 gives the GPAD specifications.Table 2-17: Supply A/D SpecificationsParameter Conditions Min Typ Max UnitMeasurement Range3.0 4.5 VResolution 10 mVTable 2-18: GPAD SpecificationsPin #(LGA interface)Pin #(70 pin connector interface)G30Signal Name G30I/O Function Remarks36 37 ADC1 I Analog-to-DigitalConverter InputResolution: 12 bitsVoltage span: 0V-1.92V35 43 ADC2 I Analog-to-DigitalConverter InputFResolution: 12 bitsVoltage span: 0V-1.92V.

Chapter 2: Hardware Interface Description December 15, 2009 G30 - Module Hardware Description 43Controls and Indicators InterfaceThe G30 incorporates several interface signals for controlling and monitoring the module's operation. The following paragraphs describes these signals and their operation.Table 2-19 gives a description of the controls and indicators signals.Table 2-19: Controls and IndicatorsPin #(LGA interface)Pin #(70 pin connector interface)G30Signal Name G30I/O Function Remarks27 25 RESET_IN OC External reset input External reset signal voltage domain.27 VREF O Reference voltage supply Max current source 30mA.62 60 VRTC I/O Real Time Clock Supply Output/InputVRTC = 2.0 V (typical) 2mAConnect a 47uF capacitor to ground.14 26 WKUPO I/O GPIO Generic digital interfacesvoltage domain.Output driver class F.PU/PD class B.O Wake-Up Out25 16 WKUPI I/O Capture/Compare Generic digital interfacesvoltage domain.Output driver class C.PU/PD class B.IWake-Up In13 41 ANT_DET I/O GPIO Generic digital interfacesvoltage domain.Output driver class F.PU/PD class B.O Antenna Detect16 49 GPRS I/O GPIO Generic digital interfacesvoltage domain.Output driver class F.PU/PD class B.OGPRS80 28 GPIO1 I/O GPIO Generic digital interfacesvoltage domain.Output driver class F.PU/PD class B.Value at reset: T.81 30 GPIO2 I/O GPIO Generic digital interfacesvoltage domain.Output driver class F.PU/PD class B.34 32 GPIO3/SDA I/O I2C bus data line I2C interfacevoltage domain.PU drain.I/O GPIO

Controls and Indicators Interface44 G30 - Module Hardware Description December 15, 2009ResetTo reset the module, RESET_IN must be used (see Table 2-19). This pin performs an external reset, also called hardware reset. Driving the RESET_IN pin low causes an asynchronous reset of the entire device except for the Real Time Clock block (RTC). The device then enters its power-on reset sequence.Note: As an external reset input, it is recommended that RESET_IN signal will be connected via a push button, or an open-drain transistor, or an open-collector transistor. In this way, when RESET_IN signal is not used, It will be at High-Z state. In any case, it is forbidden to connect this signal directly to any input voltage level.VREF Reference RegulatorThe G30 incorporates a regulated voltage output, VREF. The regulator provides a 2.85V output for use by the customer application. This regulator can source up to 30 mA of current to power any external digital circuits.33 34 GPIO4/SCL O I2C bus clock line I2C interfacevoltage domain.PU drain.Value at reset: T/OD.I/O GPIO136GPIO5 I/O GPIO Generic digital interfacesvoltage domain.Output driver class F.PU/PD class B.238GPIO6 I/O GPIO Generic digital interfacesvoltage domain.Output driver class F.PU/PD class B.540GPIO7 I/O GPIO Generic digital interfacesvoltage domain.Output driver class F.PU/PD class B.642GPIO8 I/O GPIO Generic digital interfacesvoltage domain.Output driver class F.PU/PD class B.Table 2-19: Controls and Indicators (Cont.)Pin #(LGA interface)Pin #(70 pin connector interface)G30Signal Name G30I/O Function Remarks

Chapter 2: Hardware Interface Description December 15, 2009 G30 - Module Hardware Description 45Important: The VREF regulator is powered from the G30's main power supply, and therefore any current sourced through this regulator originates from the G30 VCC supply. The overall VCC current consumed by G30 is directly affected by the VREF operation. The G30 current consumption rises with respect to the current sourced through VREF.Table 2-20 gives the VREF specifications.VRTCThe G30 incorporates a real time block and is operated by the VRTC power located on pin 62 of the 81-pin LGA interface, or pin 60 of the 70-pin connector interface. For detailed explanation, refer to “Real Time Clock” on page 22.Note: A 47uF capacitor should be connected between ground and VRTC signal (pin 62 of the 81-pin LGA interface/pin 60 of the 70-pin connector).Wakeup OutSome applications incorporate their own power saving mode, in which they operate with minimal functionality, including disabling of interfaces and serial communications.The wakeup-out (WKUPO) signal is an active low output, which is designed to support a low power mode feature in the host application. This signal is used by G30 to indicate that it requires to communicate with the host application through the serial interface, due to an incoming call or data, or an unsolicited event. Applications that incorporate a low power mode should use this signal as an indication to switch from low power mode to normal operation, and activate the serial interface.The wakeup-out mechanism, using the WKUPO signal, is controlled by 2 AT commands (see Figure 2-21):•ATS102 - Defines the delay time in milliseconds that G30 will wait, after asserting the WKUPO signal low, before sending data on the serial interface. This delay is required to allow the application enough time to reactivate from low power mode and switch to normal mode.If ATS102=0, which is the default value, the WKUPO signal and mechanism is disabled.Table 2-20: VREF SpecificationsParameter Conditions Min Typ Max UnitVOUT IOUT = 30 mA -3% 2.8 +3% VIOUT 30 mALoad regula-tion7mVLine regula-tion10 mVPSRR 50 Hz - 20 kHz 35 dB

Controls and Indicators Interface46 G30 - Module Hardware Description December 15, 2009In case the serial interface incorporates hardware flow control signals, the data will be sent according to their state, after the ATS102 delay time has expired.•ATS100 - Defines the application minimal wakeup duration, in seconds, for a single wakeup event. This time definition is required to avoid frequent unnecessary wakeup events and consequent ATS102 delays.The application may return to low power mode after the serial interface has been inactive for the duration set by ATS100. This duration is measured from the last data sent or received on the serial interface.Figure 2-21: WKUPO OperationThe following guidelines apply to the wakeup-out mechanism:•G30 will set the WKUPO signal low to indicate that in has data to send through the serial interface.•G30 will start sending the data to the application after the delay defined by ATS102.•The WKUPO signal will remain low while data is being sent to the host application.•The host application should keep its serial interface active, and not switch to low power mode, while the WKUPO signal is low.•G30 will set the WKUPO signal high when it has completed sending the data.•The application serial interface must stay active, and not switch to low power mode, for the duration set by ATS100, after WKUPO is set high.•G30 will not set the WKUPO signal low if it needs to send additional data during the ATS100 delay time.•The application may switch to low power mode after the WKUPO signal is set high and the serial interface has been inactive for the duration set by ATS100.Antenna DetectionThe G30 incorporates an internal antenna detection circuit, which senses the physical connection and removal of an antenna or antenna circuit on the G30 antenna connector. The antenna detection state is reported to the application through the ANT_DET output signal, and may also be queried by the ATS97 command.The detection circuit senses DC resistance to ground on the G30 antenna connector.

Chapter 2: Hardware Interface Description December 15, 2009 G30 - Module Hardware Description 47A DC resistance below 100kohm (+10%) is defined as a valid antenna connection, and the ANT_DET output signal is set high.Note: Antenna detect indicator is valid after 2 second from power-up only.GPRS DetectionThe GPRS output signal indicates the network GPRS connection status. When G30 is connected to a GPRS network, this signal is enabled. When G30 is not connected to the GPRS network this signal is disabled.General Purpose I/OThe G30 incorporates 8 general purpose IO signals for the user application. Each GPIO signal may be configured and controlled by AT command. These signals may be used to control or set external application circuits, or to receive indications from the external application.

Antenna Interface48 G30 - Module Hardware Description December 15, 2009Antenna InterfaceImportant: G30 has two basic hardware models that are differ from one another in the antenna interface.The first uses antenna interface with a U.FL connector, and the second uses RF B2B pads in accordance with the table below.When a U.FL connector module is used, the RF B2B pads are not connected, but the design guidelines must be followed.The board to board SMD pad 53 (ANT signal) has an impedance of 50Ω and it provides the RF antenna interface (see table below). The two pads close to the ANT pin (pads 52 and 54) are ground pads and must be used to provide the connection of the RF antenna to the grounding plane.Caution: B2B pins 65, 66 are for factory use only. Do not connect. Any use may result in permanent damage to the module. Special layout design rules must be followed, refer to “Layout Recommendation” on page 69.If the module is soldered on a customized board, special care must be taken on the layout design for the RF antenna pad which needs to be designed for 50Ω impedance and suitable copper keep out must be implemented below the RF test point.The antenna or antenna application must be installed properly to achieve best performance.Table 2-21 gives the antenna interface specifications.Pin #(LGA interface)Pin #(70 pin connector interface)G30Signal Name G30I/O Function Remarks53 NA ANT I/O RF antenna 50Ω nominal impedance.(Applicable for G30 with-out U.FL connector model)65,67 NA GND N/A RF isolated Ground Route Ground according to “RF Recommenda-tion” on page 78.NA ANT I/O RF Antenna (U.FL connec-tor)50Ω nominal impedance.(Applicable for G30 with U.FL connector model)Table 2-21: Antenna Interface SpecificationsParameter Conditions SpecificationsGSM 850TX 824 - 849 MHzRX 869 - 894 MHz

Chapter 2: Hardware Interface Description December 15, 2009 G30 - Module Hardware Description 49It is the Integrator's responsibility to design the antenna or antenna assembly used with the G30. This will highly affect the RF performance of the G30 (dropped calls, battery consumption etc.). The following guidelines should be followed:•Make sure that the antenna or antenna assembly matches the Antenna Interface Specifications.•Use low loss RF cable and connectors keeping cable runs to a minimum.GSM 900TX 880 - 915 MHzRX 925 - 960 MHzDCS 1800TX 1710 - 1785 MHzRX 1805 - 1880 MHzPCS 1900TX 1850 - 1910 MHzRX 1930 - 1990 MHzGain For antenna gain refer to “Antenna Installation” Impedance 50ΩVSWR Less than: 2.5:1Table 2-21: Antenna Interface Specifications (Cont.)Parameter Conditions Specifications

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December 15, 2009 G30 - Module Hardware Description 51Chapter 3: Electrical and Environmental SpecificationsAbsolute Maximum RatingsTable 3-1 gives the maximum electrical characteristics of the G30 interface signals.Caution: Exceeding the values may result in permanent damage to the module.Table 3-1: Maximum RatingsDescription Name Limit ValuesMin MaxModule Supply(AC Max = 0.35 Vpp) VCC -0.15 V 4.5 VGeneric digital interfaces -0.30 V 3.60 VI2C interface -0.30 V 3.60 VSIM interface -0.30 V 3.60 VRESET_IN signal 0.15 V 2.5 VAudio pinsADC pins -0.15 V 3.0 V

Operating Parameters52 G30 - Module Hardware Description December 15, 2009Operating ParametersSupply/power PinsDigital PinsTable 3-2: Input CharacteristicsSupply Description Name Limit ValuesMin Typ MaxModule Supply VCC 3.3 V 3.8 V 4.2 VRTC Supply VRTC 1.86 V 2.0 V 2.14 VTable 3-3: Output CharacteristicsSupply Description Name Limit ValuesMin Typ MaxSIM Supply VSIM1.75 V 1.80 V 1.85V2.76 V 2.85 V 2.94 VRTC Supply VRTC 1.86 V 2.00 V 2.14 VReference voltage supply VREF 2.76 V 2.85 V 2.94 VTable 3-4: Input CharacteristicsVoltage Domain Parameter Limit Values Unit RemarksMin Typ MaxGeneric digital interfacesL-level input -0.20 0.55 V Voltage Domain = VIO = 2.85 VH-level input 2.05 3.30 V Voltage Domain = VIO = 2.85 V

Chapter 3: Electrical and Environmental Specifications December 15, 2009 G30 - Module Hardware Description 53I2C interfaceL-level input -0.30 0.82 V In accordance with I2C bus specification.H-level input 2.05 3.30 V In accordance with I2C bus specification.Hysteresis 0.15 V In accordance with I2C bus specification.SIM interfaceL-level input0.37 V VSIM = 1.80 V0.60 V VSIM = 2.85 VH-level input1.22 V VSIM = 1.80 V1.95 V VSIM = 2.85 VRESET_IN signalL-level input 0.37 VH-level input 1.6 VTable 3-4: Input Characteristics (Cont.)Voltage Domain Parameter Limit Values Unit RemarksMin Typ Max

Operating Parameters54 G30 - Module Hardware Description December 15, 2009Table 3-5: Output CharacteristicsVoltage Domain Parameter Limit Values Unit RemarksMin Typ MaxGeneric digital interfacesL-level output for output driver class B slow0.00 0.80 V IOL = +15.0 mAL-level output for output driver class B0.00 0.35 V IOL = +5.0 mAL-level output for output driver class C0.00 0.35 V IOL = +4.0 mAL-level output for output driver class D0.00 0.35 V IOL = +2.0 mAL-level output for output driver class E and F0.00 0.35 V IOL = +1.5 mAH-level output for output driver class B slow2.05 2.85 V IOH = -15.0 mAH-level output for output driver class B2.05 2.85 V IOH = -5.0 mAH-level output for output driver class C2.05 2.85 V IOH = -4.0 mAH-level output for output driver class D2.05 2.85 V IOH = -2.0 mAH-level output for output driver class E and F2.05 2.85 V IOH = -1.5 mAI2C interface L-level output 0.00 0.40 V IOL = +3.0 mA

Chapter 3: Electrical and Environmental Specifications December 15, 2009 G30 - Module Hardware Description 55SIM interface L-level output0.00 0.20 V VSIM = 1.80 VIOL = +1.0 mA0.00 0.35 V VSIM = 1.80 VIOL = +1.5 mA0.00 0.20 V VSIM = 2.85 VIOL = +1.0 mA0.00 0.35 V VSIM = 2.85 VIOL = +1.5 mAH-level output1.60 1.80 V VSIM = 1.80 VIOH = -1.0 mA1.45 1.80 V VSIM = 1.80 VIOH = -1.5 mA2.65 2.85 V VSIM = 2.85 VIOH = -1.0 mA2.50 2.85 V VSIM = 2.85 VIOH = -1.5 mATable 3-5: Output Characteristics (Cont.)Voltage Domain Parameter Limit Values Unit RemarksMin Typ Max

Operating Parameters56 G30 - Module Hardware Description December 15, 2009Audio PinsTable 3-6: Pad Pull-up and Pull-down CharacteristicsVoltage Domain Parameter Limit Values Unit RemarksMin Typ MaxGeneric digital interfacesorSIM interfacePull-up input current for pull class A-450 uAPull-up input current for pull class B-100 uAPull-up input current for pull class C-30 uAPull-down input current for pull class A450 uAPull-down input current for pull class B100 uAPull-down input current for pull class C30 uATable 3-7: Audio Transmit Path CharacteristicsParameter Limit Values Unit RemarksMin Typ MaxDifferential input voltage 1.03 VppDifferential input impedance 50 kΩInput capacitance 5 10 pFSignal to distortion 65 dB

Chapter 3: Electrical and Environmental Specifications December 15, 2009 G30 - Module Hardware Description 57Signal-to-noise ratio75 dBGain stage = +12dBBandwidth = 300-3900Hz (GSM mode)72 dBGain stage = +12dBBandwidth = 300-7000Hz (WAMR mode)Power supply rejection66 85 dBGain stage = +24dBUVDD(t) = 2.5V+0.15V•sin(2π•1kHz•t)62 dBGain stage = +18dB UVDD(t) = 2.5V+0.15V•sin(2π•1kHz•t)45 dBGain stage = +0dB UVDD(t) = 2.5V+0.15V•sin(2π•1kHz•t)Cross talk (between Rx and Tx channel) -65 dBUTX(t) = 1.075V+URX(t) = 0.775V•sin(2π•1kHz•t)Cut-off frequency of anti-alias filter 16 kHzAbsolute gain drift ±2 %Variation due to change in supply, temperature and life time.Table 3-8: Microphone Supply CharacteristicsParameter Limit Values Unit RemarksMin Typ MaxOutput voltage of pin VMIC 2.20 V Settable to: 1.8 V, 2.0 V, 2.2 V typ.Microphone supply current 2.0 mAPower supply rejection of micro-phone supply 75 dBGain stage = +0dB in crosstalk free conditions at board levelUVDD(t) = 2.6V+0.10V•sin(2π•1kHz•t)Table 3-7: Audio Transmit Path Characteristics (Cont.)Parameter Limit Values Unit RemarksMin Typ Max

Operating Parameters58 G30 - Module Hardware Description December 15, 2009Table 3-9: G30 Low Power Single-ended Audio Receive Path CharacteristicsParameter Limit Values Unit RemarksMin Typ MaxMaximum single-ended output voltage 1.65 1.85 2.05 Vpp Full scale single-ended open circuit voltage.Internal output resistance 1.7 4 ΩOutput load resistance 16 ΩSingle-ended output load capaci-tance 10 nFSignal to noise 70 80 dBLoad = 16Ω, Gain stage = +0dB,Input signal = 0dBFS, Code 0, A-weightedSignal to distortion60 70 dBLoad = 16Ω, Gain stage = +0dB,Input signal = 0dBFS60 70 dBLoad = 16Ω, Gain stage = +0dB,Input signal = -1dBFS60 dBLoad = 16Ω, Gain stage = +0dB,Input signal = -6dBFSPower supply rejection 60 66 dBGain stage = +0dB,UVDD(t) = 2.5V+0.15V•sin(2π•1kHz•t)Passband ripple 0.5 dB f < 0.45 fsStopband attenuation 50 dB f > 0.55 fsAbsolute gain drift ±2 %Variation due to change in supply,temperature and life time.

Chapter 3: Electrical and Environmental Specifications December 15, 2009 G30 - Module Hardware Description 59ADC PinsTable 3-10: G30 High Power Differential Audio Receive Path CharacteristicsParameter Limit Values Unit RemarksMin Typ MaxMaximum differential output voltage 10.4 Vpp OverdriveGain stage = +9dBOutput load resistance 8 ΩSingle-ended output load capaci-tance 10 nFInductive load 400 uH Between output pins and GND with series resistanceSignal to noise 70 80 dBLoad = 16Ω, Gain stage = +0dB,Input signal = 0dBFS, Code 0, A-weightedSignal to distortion 50 dB Load = 8Ω, 350mWPower supply rejection 60 dB 1kHzTable 3-11: Input CharacteristicsParameter Limit Values Unit RemarksMin Typ MaxResolution 12 BitsDifferential linearity error ±0.5 LSBIntegral linearity error ±4 LSBOffset error ±10 LSB ADC input = 0VAbsolute gain drift ±2 %Variation due to change in supply, temperature and life time.Input voltage span 0 1.92 VThroughput rate 4 Hz With current ADC SW driver.

Operating Parameters60 G30 - Module Hardware Description December 15, 2009Input resistance 1 MΩWith respect to AGND.If mode OFF is selected.Input resistance in measurement mode 288 480 672 kΩWith respect to AGND.Variation due to process tol-erances and change in sup-ply, temperature, and life time.Internal voltage 0.46 0.48 0.50 VWith respect to AGND.Variation due to process tol-erances and change in sup-ply, temperature, and life time.Input leakage current 0.1 uATable 3-11: Input Characteristics (Cont.)Parameter Limit Values Unit RemarksMin Typ Max

Chapter 3: Electrical and Environmental Specifications December 15, 2009 G30 - Module Hardware Description 61Environmental SpecificationsTable 3-12 gives the environmental operating conditions of the G30 module.Caution: Exceeding the values may result in permanent damage to the module.Application Interface SpecificationsTable 3-13 summarizes the DC electrical specifications of the application interface connector signals.Important: Interface signals that are not used by the customer application must be left unconnected. G30 incorporates the necessary internal circuitry to keep unconnected signal in their default state. Do not connect any components to, or apply any voltage on, signals that are not used by the application.Important: Signals that are defined as "Do Not Use", or DNU, must remain externally unconnected in any case. These signals are reserved for future use.Figure 3-1 and Figure 3-2 give a brief description of the 70 pins connector and the 81 pin LGA interface irrespectively for quick integration.Table 3-12: Environmental RatingsParameter Conditions Min Max UnitAmbient Operating Temperature -30 85 °CStorage Temperature -40 85 °CESDAt antenna connector Contact AirAt interface pads/con-nector± 8± 15± 1KV

Application Interface Specifications62 G30 - Module Hardware Description December 15, 2009Figure 3-1: G30 - 70 Pin Connector Quick Integration ConnectionsHostVCCGND 1 2 GND GND 3 4 GND VCC 5 6 VCC VCC 7 8 VCC RTS 9 10 RXD 11 12 DSR 13 14 CTS 15 16 WKUPI DCD 17 18 RXD_DAI DTR 19 20 TXD_DAI TXD 21 22 CLK_DAI RI 23 24 WA0_DAI RESET_IN 25 26 WKUPO 2.85Vdc/Imax30mA VREF 27 28 GPIO1 29 30 GPIO2 31 32 GPIO3/SDA 33 34 GPIO4/SCL 35 36 GPIO5 ADC1 37 38 GPIO6 39 40 GPIO7 ANT_DET 41 42 GPIO8 ADC2 43 44 SIM_RST 45 46 SIM_CLK 47 48 VSIM GPRS 49 50 SIM_PD_n 51 52 SIM_IO PWR_ON 53 54 HDST_SPK HDST_INT 55 56 NC (eSIM_RESET) MIC_HDST 57 58 AGND 59 60 NC MIC 61 62 63 64 65 66 SPKR_N 67 68 SPKR_P 69 70 70 PinMOLEXconnectorG30 VCC3.3V – 4.2VRegulatorDigitalAudioExternal SIMconnectionUARTTransceiverTyp 2.85VdcMax 3.3Vdc InputAUDIOIntefaceON/OFFcontrol 2x100nF NCNCNCSPI_IRQSPI_CLKSPI_MOSISPI_MISOSPI_CSSPI LoggerNCNCNCNCNCSPKR_NSPKR_PNCNCVRTCOutput : 2V 4mAInput : connect CoinCell 47uF

Chapter 3: Electrical and Environmental Specifications December 15, 2009 G30 - Module Hardware Description 63Figure 3-2: G30 - 81 Pin LGA Interface Quick Integration ConnectionsNote: Refer to “Interface Connector Specifications” on page 72.GPIO5GPIO6GPIO7 ANT_DETGPIO8 NC (eSIM_RESET)NCSPI_IRQNCNCNCNCGPIO9WKUPONCGPRSNCPWR_ONON/OFFcontrolNC SIM_PD_nSIM_RSTSIM_CLKSIM_IO VSIM 2x100nF External SIMconnectionNCWKUPINCRESET_INNCNCNCNCNCGPIO3/SDAGPIO4/SCL ADC2ADC1RTSRXDDSRCTSDCDDTRTXDRIUARTTransceiverTyp 2.85VdcMax 3.3Vdc InputSPI_CLKHDST_SPKNCHDST_INTMIC_HDSTAGNDMICSPKR_NSPKR_PAGNDAUDIOIntefaceRXD_DAITXD_DAICLK_DAIWA0_DAIDigitalAudioSPI_MOSISPI_MISOSPI_CSVRTCOutput : 2V 4mAInput : connect CoinCellNCGNDGNDANTGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDVCCVCCG30 VCC3.3V – 4.2VGPIO1 GPIO2 47uFTable 3-13: Interface SpecificationsPin No. @70 Pin Conn. Name I/O Function Value @ Reset Characteristics(See “Operating Parameters”)136GPIO5 I/O GPIOIH100K PUGeneric digital interfacesvoltage domain.Output driver class F.PU/PD class B.238GPIO6 I/O GPIOIH100K PUGeneric digital interfacesvoltage domain.Output driver class F.PU/PD class B3 Not Connected456eSIM_RESET I Embedded SIM reset T If eSIM is being used short this pin to pin 21540GPIO7 I/O GPIOIH100K PUGeneric digital interfacesvoltage domain.Output driver class F.PU/PD class B.

Application Interface Specifications64 G30 - Module Hardware Description December 15, 2009642GPIO8 I/O GPIOIH100K PUGeneric digital interfacesvoltage domain.Output driver class F.PU/PD class B.762SPI_IRQI SPI Interrupt InputGeneric digital interfacesvoltage domain.Output driver class C.PU/PD class B.I/O Capture/CompareI/O GPIOIH100K PU8-11 Not Connected12 GPIO9 I/O GPIOIH100K PUGeneric digital interfacesvoltage domain.Output driver class F.PU/PD class B.13 41 ANT_DETI/O GPIO Generic digital interfacesvoltage domain.Output driver class F.PU/PD class B.O Antenna DetectL - No AntennaH - Valid Antenna14 26 WKUPOI/O GPIO Generic digital interfacesvoltage domain.Output driver class F.PU/PD class B.O Wake-Up Out H15 Not Connected16 49 GPRSI/O GPIOGeneric digital interfacesvoltage domain.Output driver class F.PU/PD class B.OGPRSL - Valid GPRS connec-tionH - No GPRS connec-tion17 Not Connected18 53 PWR_ON I Power-on/off input T/PD RTC interface.19 Not Connected20 48 VSIM O SIM supply outputVSIM = 1.80 V typicalif SIM card = 1.8V typeorVSIM = 2.85 V typicalif SIM card = 3.0V type21 44 SIM_RST O External SIM reset LSIM interfacevoltage domain.Output driver class E.PU/PD class B.Table 3-13: Interface Specifications (Cont.)Pin No. @70 Pin Conn. Name I/O Function Value @ Reset Characteristics(See “Operating Parameters”)

Chapter 3: Electrical and Environmental Specifications December 15, 2009 G30 - Module Hardware Description 6522 52 SIM_IO I/O SIM data H4.7K PUSIM interfacevoltage domain.Output driver class E.PU/PD class B.23 46 SIM_CLK O SIM clock LSIM interfacevoltage domain.Output driver class E.PU/PD class B.24 Not Connected25 16 WKUPII/O Capture/Compare Generic digital interfacesvoltage domain.Output driver class C.PU/PD class B.IWake-Up InIH100K PU26 Not Connected27 25 RESET_IN OC External reset inputIH19K PUExternal reset signalvoltage domain.28-32 Not Connected33 34 GPIO4/SCLOI2C bus clock line I2C interfacevoltage domain.PU drain.Value at reset: T/OD.I/O GPIOIH100K PU34 32 GPIO3/SDAI/O I2C bus data line I2C interfacevoltage domain.PU drain.I/O GPIOIH100K PU35 43 ADC2 I Analog-to-DigitalConverter Input LResolution: 12 bitsVoltage span: 0V-1.92V36 37 ADC1 I Analog-to-DigitalConverter Input LResolution: 12 bitsVoltage span: 0V-1.92V37 23 RIO Ring Indicator H Generic digital interfacesvoltage domain.Output driver class D.PU/PD class B.I/O GPIO38 17 DCD O Data Carrier Detect H Generic digital interfacesvoltage domain.Output driver class B.PU/PD class BTable 3-13: Interface Specifications (Cont.)Pin No. @70 Pin Conn. Name I/O Function Value @ Reset Characteristics(See “Operating Parameters”)

Application Interface Specifications66 G30 - Module Hardware Description December 15, 200939 13 DSR O Data Set Ready LGeneric digital interfacesvoltage domain.Output driver class B slow.PU/PD class A.40 19 DTR I Data terminal readyIH100K PUGeneric digital interfacesvoltage domain.Output driver class C.PU/PD class B.41 9 RTS I Ready to send 4.7K PUGeneric digital interfacesvoltage domain.Output driver class F.PU/PD class C.42 15 CTS O Clear To SendGeneric digital interfacesvoltage domain.Output driver class E.PU/PD class C.43 21 TXD I Transmitted DataGPIO 200K PUGeneric digital interfacesvoltage domain.Output driver class E.PU/PD class C.44 11 RXD O Received DataGPIO TGeneric digital interfacesvoltage domain.Output driver class E.PU/PD class C.45 66 SPI_CLK O SPI ClockShort to Pin 57 TGeneric digital interfacesvoltage domain.Output driver class D.PU/PD class B.46 Not Connected47 54 HDST_SPK OLow power sin-gle-endedanalog audio outputUsed in handset orin headset mode48 63,67 SPKR_N OHigh power differen-tialanalog audio outputUsed in ring tones orin hands free mode49 65,69 SPKR_P OHigh power differen-tialanalog audio outputUsed in ring tones orin hands free mode50 55 HDST_INTIHeadset detection input Generic digital interfacesvoltage domain.Output driver class E.PU/PD class B.IExternal interrupt inputI/O GPIOTable 3-13: Interface Specifications (Cont.)Pin No. @70 Pin Conn. Name I/O Function Value @ Reset Characteristics(See “Operating Parameters”)

Chapter 3: Electrical and Environmental Specifications December 15, 2009 G30 - Module Hardware Description 6751 61 MIC I Headset microphoneanalog biasSingle ended supply outputand signal input for Handsetmicrophone.Used in handset orin hands free mode52 59 AGND1 I Handset microphoneanalog referenceLocal groundof the Handset microphone53 57 MIC_HDST I Headset microphoneanalog biasSingle ended supply outputand signal input for microphone. Used in headset mode54 59 AGND2 I Headset microphoneanalog referenceLocal groundof the Headset microphone55 18 RXD_DAI I I2S receive dataShort to pin 61 47K PUGeneric digital interfacesvoltage domain.Output driver class D.PU/PD class B.56 24 WA0_DAI O I2S word alignmentShort to pin 60 TGeneric digital interfacesvoltage domain.Output driver class D.PU/PD class B.57 22 CLK_DAI O I2S clockShort to pin 45 TGeneric digital interfacesvoltage domain.Output driver class D.PU/PD class B.58 20 TXD_DAI O I2S transmit dataShort to pin 63 TGeneric digital interfacesvoltage domain.Output driver class D.PU/PD class B.59 50 SIM_PD_n I SIM present detect OD/LSIM interfacevoltage domain.Output driver class E.PU/PD class B.60 68 SPI_MOSI OSPI sync data (MOSI)Shorted to pin 56TGeneric digital interfacesvoltage domain.Output driver class D.PU/PD class B61 64 SPI_MISO ISPI sync data (MISO)Shorted to pin 5547K PUGeneric digital interfacesvoltage domain.Output driver class D.PU/PD class B.62 60 VRTC I/0 Real Time Clock Supply Output/InputVRTC = 2.0 V (typical) 2mAConnect a 47uF capacitor to ground.63 70 SPI_CS O SPI chip selectShort to pin 58 TGeneric digital interfacesvoltage domain.Output driver class D.PU/PD class B.64 Not ConnectedTable 3-13: Interface Specifications (Cont.)Pin No. @70 Pin Conn. Name I/O Function Value @ Reset Characteristics(See “Operating Parameters”)

Application Interface Specifications68 G30 - Module Hardware Description December 15, 2009Note: PU - Pull up, PD - Pull down, I - Input, H - High logic state, L - Low logic state65 1,2,3,4 GND NA Ground GND pins are internallyshorted between them.66 N.C ANT I/O RF antenna 50 Ohm nominal impedance67 1,2,3,4 GND NA Ground GND pins are internallyshorted between them.68 1,2,3,4 GND NA Ground GND pins are internallyshorted between them.69 1,2,3,4 GND NA Ground GND pins are internallyshorted between them.70 1,2,3,4 GND NA Ground GND pins are internallyshorted between them.71 1,2,3,4 GND NA Ground GND pins are internallyshorted between them.72 1,2,3,4 GND NA Ground GND pins are internallyshorted between them.73 1,2,3,4 GND NA Ground GND pins are internallyshorted between them.74 1,2,3,4 GND NA Ground GND pins are internallyshorted between them.75 1,2,3,4 GND NA Ground GND pins are internallyshorted between them.76 1,2,3,4 GND NA Ground GND pins are internallyshorted between them.77 1,2,3,4 GND NA Ground GND pins are internallyshorted between them.78 5,6,7,8 VCC I Voltage Supply Input VCC pins are internallyshorted between them.79 5,6,7,8 VCC I Voltage Supply Input VCC pins are internallyshorted between them.80 28 GPIO1 I/O GPIOIH100K PUGeneric digital interfacesvoltage domain.Output driver class F.PU/PD class B.81 30 GPIO2 I/O GPIOIH100K PUGeneric digital interfacesvoltage domain.Output driver class F.PU/PD class B.27 VREF O Reference voltage supply 2.85V Max current source 30mA82-89 Not ConnectedRF TP Not Connected – Refer to “RF Recommendation” on page 78.Table 3-13: Interface Specifications (Cont.)Pin No. @70 Pin Conn. Name I/O Function Value @ Reset Characteristics(See “Operating Parameters”)

December 15, 2009 G30 - Module Hardware Description 69Chapter 4: Mechanical SpecificationsBoard DimensionsFigure 4-1 and Figure 4-2 describe the G30 mechanical characteristics.Figure 4-1: G30 Mechanical Characteristics - 81 Pin LGA Interface

Board Dimensions70 G30 - Module Hardware Description December 15, 2009Figure 4-2: G30 Mechanical Characteristics - B2B Connector (70 Pin)

Chapter 4: Mechanical Specifications December 15, 2009 G30 - Module Hardware Description 71LGA Tape & Reel SpecificationFigure 4-3 shows LGA Tape & Reel specification.Figure 4-3: LGA Tape & Reel Specification62.256.856.0

Interface Connector Specifications72 G30 - Module Hardware Description December 15, 2009Interface Connector SpecificationsThe G30 uses a single 70-pin, 0.5 mm pitch, board to board connector for the application interface, as described in Table 4-1.Figure 4-4 shows the G30 interface connector.Figure 4-4: G30 Interface ConnectorTable 4-2 describes the G30 interface connector characteristics.Table 4-1: G30 interface connector option G30 Connector Mating Connector Stacking HeightMolex 53748-0708 Molex 52991-0708 3.0 mmTable 4-2: Interface Connector SpecificationsParameter 53748 (3.0 mm)Contacts 70Rows 2Pitch 0.5 mmMaximum Current 500 mAMaximum Voltage 50 VContact Resistance 50 mΩ maximumInsulation Resistance 100 MΩ minimumDurability 50 mated cycles maximumStacking Height 3.0 mmMates with Molex 52991-0708

Chapter 4: Mechanical Specifications December 15, 2009 G30 - Module Hardware Description 73Mating ConnectorThe mating connector incorporate the same electrical and mechanical characteristics as the corresponding G30 interface connectors, which are described in Table 4-2.Figure 4-5 provides a reference drawing of the mating connectors mechanical dimensions.Figure 4-5: Mating Connector DimensionsFor more information on the G30 mating connector, please refer to the Molex web site at http://www.molex.com/molex/index.jsp.

U.FL Connector Specifications74 G30 - Module Hardware Description December 15, 2009U.FL Connector SpecificationsThe G30 uses a standard U.FL receptacle connector for the radio interface.Figure 4-6 shows the U.FL connector dimensions.Figure 4-6: U.FL Connector DimensionsTable 4-3 describes the U.FL connector characteristics.Table 4-3: U.FL Connector SpecificationsParameter SpecificationsCharacteristic Impedance 50 OhmsFrequency Range DC to 6 GHzVSWR (mated pair) 1.30 max DC to 3 GHz1.40 max 3 to 6 GHz (cable dependent)Insertion Loss (connectors only) 0.24 dB max DC to 6 GHz

Chapter 4: Mechanical Specifications December 15, 2009 G30 - Module Hardware Description 75Mating ConnectorThe RF mating connector should be a standard U.FL plug connector or cable assembly, which corresponds to the G30 U.FL connector specifications.Only Hirose U.FL mating cable may be mated with G30. A family of Hirose mating cables are available.Such a cable assembly example is the Hirose U.FL-LP-040 is U.FL-R-SMT, which is illustrated in Figure 4-7.Figure 4-7: U.FL Mating ConnectorRated voltage 60 VAC (rms) - standard receipt (Styles A, B)Dielectric Withstanding Voltage200 VAC, 50 Hz for 1 min (at sea level)Insulation Resistance 500 Megaohms minContact Resistance (connectors only) 20 milliohms max (Center)10 milliohms max (Outer, Plug)10 milliohms max (Outer, Receptacle)Durability 30 cycles - standard receipt (Styles A, B)Disengagement Force 2N min perpendicular4N min orthogonalCenter Contact Retention force 0.15N minTape/Reel Packaging (receptacle)12mm carrier per EIA-481Operating Temperature 40°C to + 90°CTable 4-3: U.FL Connector Specifications (Cont.)Parameter Specifications

G30 Mounting76 G30 - Module Hardware Description December 15, 2009For more details regarding Hirose mating cable assemblies, refer to http://www.hirose.co.jp/cataloge_hp/e32119372.pdf.G30 MountingNote: This section applies to G30 70 pin connector Model only.The G30 incorporates 2 mechanical holes for installing the module onto the application board. The holes are 2.4 millimeters in diameter, which accommodates several types of mechanical elements.Several mechanical approaches may be applied to mount and fasten G30 to the application board. Using M2 screws with suitable washers to mount the module onto spacers, a bracket or chassis is a recommended design.Special attention must be paid to the area surrounding the G30 mounting holes. A grounding pad of 4.4 millimeters in diameter surrounds these holes. The diameter and area of this pad must not be exceeded by any mechanical or electrical element. Several electrical components, which are not shielded, are located near the holes. These components must not be in contact with the mounting elements or with other parts of the application board, and care must be taken to avoid any damage.Figure 4-8 depict the G30 mounting area.Figure 4-8: G30 Mounting AreaThe holes are used for mechanical mounting of G30 to the application board but also for grounding support. Using conductive elements to install G30, significantly improves the overall grounding of the module and therefore improves the G30 performance and stability.It is required to use screws or other mechanical elements to fasten G30 to the application board, but it is highly recommended to use conductive elements to improve the module's performance.The preferred mounting screw head types are:• "Allen" head with a champer - the best choice.• "Star" head - good.• "Philips" head - may cause damage to nearby components.

Chapter 4: Mechanical Specifications December 15, 2009 G30 - Module Hardware Description 77Layout RecommendationNote: This section applies to G30 LGA Model only.Soldering FootprintFigure 4-9 gives a layout recommendation for the G30.Figure 4-9: G30 Soldering Footprint (Top View)Note: • Routing signals other then GND (Ground) within inner soldering footprint area of G30(under G30) not recommended.• Vias inside pads are not recommended.• Verify GND pads are well tied to ground plane layer by vias.

Soldering Re-flow78 G30 - Module Hardware Description December 15, 2009RF RecommendationNote: The restrictions below are valid for both U.FL connector and RF PAD.•Avoid ANY routing below RF Test-Point Round circle, and RF pad, Pin-66.•Keep the RF TP area and its clearance area cleared from Routing and GND (internal layers also), at least 0.45mm below the G30.•RF PAD must be connected with a 50 ohm controlled impedance Line.•Keep the RF PAD area cleared from GND (internal layers also), at least 0.45mm below the G30.•Cover all Pads area with inner GND Layer below the 0.45mm routing clearance.Soldering Re-flowG30 LGA recommended soldering re-flow condition are max TBD C for 5 second duration.Note: Any G30 LGA removal must be performed according to IPC-7711 standard "Rework of Electronic Assemblies" chap 3.9.1 or 3.9.2 regarding “BGA/CSP Removal”. The IPC-7711 can be found at www.ipc.org.

December 15, 2009 G30 - Module Hardware Description 79Chapter 5: Service and TestingOrdering InformationG30 different hardware models are given in the following table for ordering purposes:Note: * Dummy module is used by customer’s factory for automatic pick and place adjustments/training. The dummy module includes the PCB and shields only, in the 81-pin LGA interface form factor.ServiceThis section provides contact information for any possible queries that may arise, for example:•Have questions?•Having trouble getting the Developer Board set up?•Technical questions?•Configuration questions/problems?•Technical operating problems?Tier Model No. U.FL eSIM 70 PinbasicF9000AAA - - -F9100AAA + - - F9200AAA + - +advancedF9300AAA* - + -F9400AAA* + + -F9500AAA* + + +premiumF9000ABA - - -F9100ABA + - -F9200ABA + - +F9300ABA - + -F9400ABA + + -F9500ABA + + +dummy* F9000ZZZ - - -

Service80 G30 - Module Hardware Description December 15, 2009•Need documentation?Who to Contact?The Customer Care Group is ready to assist you on integration issues.Direct CustomerUse this following email address to contact customer assistance: M2M.CustomerCare@motorola.comNote: The support services provided by Motorola are subject to the agreement between the customer and Motorola and may be at an additional charge to the customer. Motorola will inform the customer in advance of any such charge.Indirect CustomerPlease contact your Motorola licensed distributor.Required Query InformationEvery new call/problem report, directly from a Direct Customer or from a distributor, should be directed to the help desk email address noted above in “Who to Contact?” . It is recommended to report each individual issue in a separate email. The following information is required when reporting a problem:•Customer name and address•Customer contact information for this request, including:–Name–Telephone–Fax number–Mobile number–Email address•Product name (G30)•Software version of the unit (ATI8 command) or model number•PCB version (located on the PCB near the RF connector)•Severity of the problem •Problem description, including:–Operator name–Type of SIM card (for example, Test, Pre-paid, or 3v)–Setup Configuration (such as Developer Board, handset, host, connections, and so on)–Detailed scenario from startup–Log of all the commands and the responses, beginning from startup•Answers to the following questions:–Was the same scenario tested on the Developer Board and the PC to reproduce the problem?–How many units do you have, and how many of them have this problem?–How often does the problem recur?In addition to the information requested above, send the following AT commands and the HyperTerminal log with the responses:•AT+CMEE=2 // to get textual error message•AT+CPIN? // to get SIM card status•AT+CREG? // to see if the TXVR is registered to the network•AT+CSQ // to get the signal strength (RX level)•AT+CGSN // to read the IMEI number of the unit

$Chapter 5: Service and Testing December 15, 2009 G30 - Module Hardware Description 81•ATI3 // to get the software version of the TXVR•AT\S // to get the setting of basic AT commands•AT+CMER=0,0,1,1 // to get messages and indicators from the handset display to the DTE$

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