Microchip Technology MRF89XAM9A 915MHz Ultra Low-Power Communications Device Transmitter User Manual 915 MHz Ultra Low Power Sub GHz Transceiver Module

Microchip Technology Inc 915MHz Ultra Low-Power Communications Device Transmitter 915 MHz Ultra Low Power Sub GHz Transceiver Module

User Manual

© 2011 Microchip Technology Inc. Preliminary DS00000AMRF89XAM9AData Sheet915 MHz Ultra Low-Power Sub-GHzTransceiver Module
DS00000A-page ii Preliminary © 2011 Microchip Technology Inc.Information contained in this publication regarding deviceapplications and the like is provided only for your convenienceand may be superseded by updates. It is your responsibility toensure that your application meets with your specifications.MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS ORIMPLIED, WRITTEN OR ORAL, STATUTORY OROTHERWISE, RELATED TO THE INFORMATION,INCLUDING BUT NOT LIMITED TO ITS CONDITION,QUALITY, PERFORMANCE, MERCHANTABILITY ORFITNESS FOR PURPOSE. Microchip disclaims all liabilityarising from this information and its use. Use of Microchipdevices in life support and/or safety applications is entirely atthe buyer’s risk, and the buyer agrees to defend, indemnify andhold harmless Microchip from any and all damages, claims,suits, or expenses resulting from such use. No licenses areconveyed, implicitly or otherwise, under any Microchipintellectual property rights.TrademarksThe Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A.Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.All other trademarks mentioned herein are property of their respective companies.© 2011, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper.ISBN: Note the following details of the code protection feature on Microchip devices:• Microchip products meet the specification contained in their particular Microchip Data Sheet.• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.• Microchip is willing to work with the customer who is concerned about the integrity of their code.• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of ourproducts. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such actsallow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
© 2011 Microchip Technology Inc. Preliminary DS00000A-page 1MRF89XAM9AFeatures• Module designed from the MRF89XA IntegratedUltra Low-Power, Sub-GHz Transceiver IC.• Supports MiWi™ Development EnvironmentProprietary Wireless Networking Protocols• 4-Wire Serial Peripheral Interface (SPI) withInterrupts• Small Size: 0.7" x 1.1" (17.8 mm x 27.9 mm),Surface Mountable — Pin compatible withMRF89XAM9A• Integrated Crystal, Internal Voltage Regulator,Matching Circuitry and Printed Circuit Board(PCB) Antenna• Easy Integration into Final Product — MinimizeProduct Development, Quicker Time to Market• Compatible with Microchip’s MicrocontrollerFamilies (PIC16, PIC18, PIC24, dsPIC33 andPIC32)• Radio Regulation Certified for United States(FCC), Canada (IC) and Australia/New Zealand(C-TICK)Operational• Operating Voltage: 2.1–3.6V (3.3V typical)• Temperature Range: -40°C to +85°C Industrial• Low-Current Consumption:- Rx mode: 3 mA (typical)- Tx mode: 25 mA at +10 dBm (typical)- Sleep: 0.1 µA (typical)RF/Analog Features• ISM Band 902–928 MHz Operation• Modulation: FSK and OOK• Data Rate (to conform to FCC and IC regulations): - FSK: 50–200 kbps- OOK: 16 kbps• Reception sensitivity- FSK: -107 dBm (typical) at 50 kbps- OOK: -113 dBm (typical) at 2 kbps• +10 dBm Typical Output Power with 21 dB TxPower Control RangeMedia Access Controller (MAC)/Baseband Features• Packet handling feature with data whitening andautomatic CRC generation• Incoming sync word (pattern) recognition• Built-in bit synchronizer for incoming data, and clocksynchronization and recovery• 64-byte transmit/receive FIFO with preload in Stand-bymode• Supports Manchester encoding/decoding techniquesPin diagram2345617VINGND8910RESETCSCONSDOSDISCKCSDATAIRQ1GNDIRQ01211 GND915 MHz Ultra Low-Power Sub-GHz Transceiver Module
MRF89XAM9ADS00000A-page 2 Preliminary © 2011 Microchip Technology Inc.Table of Contents1.0 Device Overview .......................................................................................................................................................................... 32.0 Circuit Description ........................................................................................................................................................................ 93.0 Regulatory Approval................................................................................................................................................................... 174.0 Electrical Characteristics ............................................................................................................................................................ 21Appendix A: Revision History............................................................................................................................................................... 27The Microchip Web Site ....................................................................................................................................................................... 29Customer Change Notification Service ................................................................................................................................................ 29Customer Support ................................................................................................................................................................................ 29Reader Response ................................................................................................................................................................................ 30Product Identification System............................................................................................................................................................... 31TO OUR VALUED CUSTOMERSIt is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchipproducts. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined andenhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department viaE-mail at docerrors@microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. Wewelcome your feedback.Most Current Data SheetTo obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:http://www.microchip.comYou can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000).ErrataAn errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for currentdevices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revisionof silicon and revision of document to which it applies.To determine if an errata sheet exists for a particular device, please check with one of the following:• Microchip’s Worldwide Web site; http://www.microchip.com• Your local Microchip sales office (see last page)When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you areusing.Customer Notification SystemRegister on our web site at www.microchip.com to receive the most current information on all of our products.
© 2011 Microchip Technology Inc. Preliminary DS00000A-page 3MRF89XAM9A1.0 DEVICE OVERVIEWThe MRF89XAM9A is an Ultra Low-Power Sub-GHzsurface mount transceiver module with integratedcrystal, internal voltage regulator, matching circuitryand PCB antenna. The MRF89XAM9A moduleoperates in the United States/Canada 902–928 MHzISM frequency band. The integrated module designfrees the integrator from extensive RF and antennadesign, and regulatory compliance testing, allowingquicker time to market.The MRF89XAM9A module is compatible withMicrochip’s MiWi™ Development Environment softwarestacks. The software stacks are available as a freedownload, including source code, from the Microchip’sweb site http://www.microchip.com/wireless.The MRF89XAM9A module has received regulatoryapprovals for modular devices in the United States(FCC) and Canada (IC). Modular approval removes theneed for expensive RF and antenna design, and allowsthe end user to place the MRF89XAM9A module insidea finished product and not require regulatory testing foran intentional radiator (RF transmitter). To maintainconformance, refer to module settings in Section 3.1.1,MRF89XAM9A SETTINGS for the United States andSection 3.2.1, MRF89XAM9A SETTINGS for Canada.1.1 Interface descriptionThe simplified block diagram of the MRF89XAM9Amodule is shown in Figure 1-1. The module is based onthe Microchip Technology MRF89XA Ultra Low-PowerSub-GHz Transceiver Integrated Circuit (IC). Themodule interfaces to many popular Microchip PIC®microcontrollers through a 3-wire serial SPI interface,two chip selects (Configuration and Data), twointerrupts — Interrupt Request 0 (IRQ0) and InterruptRequest 1 (IRQ1), Reset, Power and Ground as shownin Figure 1-2. Tab le 1- 1 provides the pin descriptions.Data communication and module configuration aredocumented in the “MRF89XA Ultra Low-Power,Integrated Sub-GHz Transceiver” (DS70622) DataSheet. For more information on specific serial interfaceprotocol and general register definitions, refer to the“MRF89XA Data Sheet” and see Section 1.3,Operation for specific register settings unique to theMRF89XAM9A module operation to maintainregulatory compliance.FIGURE 1-1: MRF89XAM9A BLOCK DIAGRAMMRF89XAControlInterfacePowerManagementBasebandRFMRF89XAM9A ModuleSPI Digital I/OIRQ0Power12.8 MHz CrystalMatchingCircuitryandSAW FilterPCBAntennaLoopFilterVCOTankIRQ1CSDATACSCONRESET
MRF89XAM9ADS00000A-page 4 Preliminary © 2011 Microchip Technology Inc.TABLE 1-1: PIN DESCRIPTIONFIGURE 1-2: MICROCONTROLLER TO MRF89XAM9A INTERFACEPin Symbol Type Description1GNDPower Ground2 RESET DI Reset Pin3CSCON DI Serial Interface Configure Chip Select 4 IRQ0 DO Interrupt Request Output5 SDI DI Serial Interface Data Input6 SCK DI Serial Interface Clock7 SDO DO Serial Interface Data Output 8CSDATA DI Serial Interface Data Chip Select9 IRQ1 DO Interrupt Request Output10 Vin Power Power Supply11 GND Power Ground12 GND Power GroundPIC® MicrocontrollerI/OI/OSDOSDISCKINTxINTxI/OMRF89XAM9ACSCONCSDATASDISDOSCKIRQ0IRQ1RESETVINGND
© 2011 Microchip Technology Inc. Preliminary DS00000A-page 5MRF89XAM9A1.2 Mounting DetailsThe MRF89XAM9A is a surface mountable module.Module dimensions are shown in Figure 1-3. Themodule PCB is 0.032" thick with castellated mountingholes on the edge. Figure 1-4 is the recommended hostPCB footprint for the MRF89XAM9A.The MRF89XAM9A has an integrated PCB antenna.For the best performance, follow the mounting detailsshown in Figure 1-5. It is recommended that themodule be mounted on the edge of the host PCB andan area around the antenna, approximately 3.4" (8.6cm), be kept clear of metal objects for bestperformance. A host PCB ground plane around theMRF89XAM9A acts as a counterpoise to the PCBantenna. It is recommended to extend the ground planeat least 0.4" (1 cm) around the module.FIGURE 1-3: MODULE DETAILSFIGURE 1-4: RECOMMENDED PCB FOOTPRINT
MRF89XAM9ADS00000A-page 6 Preliminary © 2011 Microchip Technology Inc.FIGURE 1-5: MOUNTING DETAILS3.4”3.4”0.4”0.4”Edge of PCB0.470”Keep area around antenna(approximately 3.4 (6.8 cm)inches) clear of metallic structuresfor best performanceHost PCB Top Copper GroundPlane (Antenna Counterpoise):Extend the host PCB top copperground plane under and to the leftand right side of the module at least0.4 inches (1 cm) for best antennaperformance.
© 2011 Microchip Technology Inc. Preliminary DS00000A-page 7MRF89XAM9A1.3 OperationThe MRF89XAM9A module is based on the MicrochipTechnology MRF89XA Ultra Low-Power, IntegratedISM Band Sub-GHz Transceiver IC. Datacommunication and module configuration aredocumented in the “MRF89XA Ultra Low-Power,Integrated ISM Band Sub-GHz Transceiver DataSheet” (DS70622).This section emphasizes operational settings that areunique to the MRF89XAM9A module design that mustbe followed for proper operation.1.3.1 RESETPin 2 of the module, RESET, allows for an externalreset of the MRF89XA IC. RESET is connected to theTEST8 pin of the MRF89XA IC. During normaloperations of the MRF89XAM9A, the RESET pinshould be held in a high impedance state. For moreinformation on Assertion of the RESET pin, refer to the“Section 3.1.2 Manual Reset” of “MRF89XA DataSheet” (DS70622).1.3.2 CRYSTAL FREQUENCYWhen calculating frequency deviation, bit rate, receiverbandwidth, and PLL R, P and S values, use crystalfrequency fxtal = 12.8 MHz. 1.3.3 CLOCK OUTPUT (CLKOUT)The CLKOUT pin 19 of the MRF89XA IC is not used onthe module. Ensure that the CLKOUT signal is disabledto minimize the current consumption.1.3.4 FREQUENCY BAND SELECTThe Frequency Band Select (FBS<1:0>) bits in theGCONREG<4:3> should be set for target channelrange 902–915 MHz FBS<1:0> = '00' or 915–928 MHzFBS<1:0> = '01'.1.3.5 VCO TANK TRIM VALUEThe VCO Trim (VCOT<1:0>) bits in theGCONREG<2:1> should be set for VCOT<1:0> = '11'for the inductor values of the module.
MRF89XAM9ADS00000A-page 8 Preliminary © 2011 Microchip Technology Inc.NOTES:
© 2011 Microchip Technology Inc. Preliminary DS00000A-page 9MRF89XAM9A2.0 CIRCUIT DESCRIPTIONThe MRF89XAM9A module interfaces to Microchip’sPIC16, PIC 18, PIC24, dsPIC33 and PIC32microcontrollers with a minimum of externalcomponents through digital only connections. Anexample application schematic is shown in Figure 2-2.2.1 Module SchematicThe MRF89XAM9A module is based on the MicrochipTechnology MRF89XA Ultra Low-Power, IntegratedISM Band sub-GHz Transceiver IC. The serial I/O(CSCON, CSDATA, SCK, SDO and SDI), RESET,IRQ0 and IRQ1 pins are brought out to the modulepins. Crystal X1 is a 12.8 MHz crystal with afrequency tolerance of ±10 ppm at 25°C. The RFIOoutput is matched to the SAW filter FL1 and furthermatched to the PCB trace antenna.Figure 2-2 illustrates the MRF89XAM9A schematics.Table 2-1 details the Bill of Materials (BOM).FIGURE 2-1: MRF89XAM9A APPLICATION SCHEMATICNote 1+C21 0 μFC10.1 μFTo Host MicrocontrollerTo Host MicrocontrollerU1MRF89XAM9A-I/RM+ 3.3VGNDRESETCSCONIRQ0SDISCKGNDGNDVINIRQ1CSDATASDO123456121110987Note: For battery powered applications, place a 10 μF capacitor in parallel with the 0.1 μF bypasscapacitor to provide a low impedance during startup sequences.
MRF89XAM9ADS00000A-page 10 Preliminary © 2011 Microchip Technology Inc.FIGURE 2-2: MRF89XAM9A SCHEMATICNote: Designators not used: C6, L5
© 2011 Microchip Technology Inc. Preliminary DS00000A-page 11MRF89XAM9ATABLE 2-1: MRF89XAM9A BILL OF MATERIALSDesignator Value Description Manufacturer Part NumberC1 0.047 µF Capacitor, Ceramic, 10V, ±10%, X7R, SMT 0402Murata GRM155R71A473KA01DC2 0.22 µF Capacitor, Ceramic, 16V, ±10%, X7R, SMT 0402Murata GRM155R71C224KA12DC3 1 µF Capacitor, Ceramic, 6.3V, ±10%, X5R, SMT 0603Murata GRM188R60J105KA01DC4 30 pF Capacitor, Ceramic, 50V, ±5%, UHI-Q NP0, SMT 0402Johanson Technology 250R07S300JV4TC5 1.8 pF Capacitor, Ceramic, 50V, ±0.1 pF, UHI-Q NP0, SMT 0402Johanson Technology 500R07S1R8BV4C6 — Designator not used — —C7 33 pF Capacitor, Ceramic, 50V, ±5%, C0G, SMT 0402Murata GRM1555C1H330JZ01DC8 0.1 µF Capacitor, Ceramic, 16V, ±10%, X7R, SMT 0402Murata GRM155R71C104KA88DC9 680 pF Capacitor, Ceramic, 50V, ±5%, C0G, SMT 0402Murata GRM1555C1H681JA01DC10 0.01 µF Capacitor, Ceramic, 16V, ±10%, X7R, SMT 0402Murata GRM155R71C103KA01DC11 1.0 pF Capacitor, Ceramic, 50V, ±0.1 pF, UHI-Q NP0, SMT 0402Johanson Technology 500R07S1R0BV4C12 0.9 pF Capacitor, Ceramic, 50V, ±0.1 pF, UHI-Q NP0, SMT 0402Johanson Technology 500R07S0R9BV4FL1 TA0281A Filter, SAW, 902–928 MHz Tai-saw Technology TA0281AL1 10 nH Inductor, Ceramic, ±5%, SMT 0402 Johanson Technology L-07C10NJV6TL2 100 nH Inductor, Ceramic, ±5%, SMT 0402 Johanson Technology L-07CR10JV6TL3 5.6 nH Inductor, Wirewound, ±5%, SMT 0402 Johanson Technology L-07W5N6JV4TL4 5.6 nH Inductor, Wirewound, ±5%, SMT 0402 Johanson Technology L-07W5N6JV4TL5 — Designator not used — —L6 10 nH Inductor, Ceramic, ±5%, SMT 0402 Johanson Technology L-07C10NJV6TR1 1ΩResistor, 1%, ±100 ppm/0C, SMT 0402 Vishay/Dale CRCW04021R00FKEDR2 100KΩResistor, 5%, ±100 ppm/0C, SMT 0402 Yageo RC0402JR-07100KLR3 6.8KΩResistor, 1%, ±100 ppm/0C, SMT 0402 Yageo RC0402FR-076K8LU1 MRF89XA Transceiver, Ultra Low-Power, Integrated Sub-GHzMicrochip Technology MRF89XA-I/MQX1 12.8 MHz Crystal, ±10 ppm, 15 pF, ESR 100 ohms, SMT 5 x 3.2mmAbracon ABM3B-155-12.800MHz-T
© 2011 Microchip Technology Inc. Preliminary DS00000A-page 12MRF89XAM9A2.2 Printed Circuit BoardThe MRF89XAM9A module PCB is constructed withhigh temperature FR4 material, four layers and 0.032inches thick. The layers are shown in Figure 2-3through Figure 2-8. The stack up of the PCB is shownin Figure 2-9FIGURE 2-3: TOP SILK SCREENFIGURE 2-4: TOP COPPERFIGURE 2-5: LAYER 2 — GROUND PLANEFIGURE 2-6: LAYER 3 — POWER PLANE
© 2011 Microchip Technology Inc. Preliminary DS00000A-page 13MRF89XAM9AFIGURE 2-7: BOTTOM COPPER FIGURE 2-8: BOTTOM SILK SCREENFIGURE 2-9: PCB LAYER STACK UPTop CopperGround PlanePower PlaneBottom Copper1/2 oz. Copper1/2 oz. Copper1/2 oz. Copper1/2 oz. Copper8 mil FR412 mil FR48 mil FR40.032”±0.005”
© 2011 Microchip Technology Inc. Preliminary DS00000A-page 14MRF89XAM9A2.3 PCB AntennaThe PCB antenna is fabricated on the top copper trace.Figure 2-11 shows the trace dimensions. The layersbelow the antenna have no copper traces. The groundand power planes under the components serve as acounterpoise to the PCB antenna. Additional groundplane on the host PCB will substantially enhance theperformance of the module. For best performance,place the module on the host PCB by following therecommendations in Section 1.2, Mounting Details.The PCB antenna was designed and simulated usingAnsoft Designer® and HFSS™ 3D full-wave solversoftware by ANSYS, Inc. (www.ansoft.com). Thedesign goal was to create a compact, low-cost antennawith the best radiation pattern. Figure 2-11 shows thesimulation drawing and Figure 2-12 and Figure 2-13show the 2D and 3D radiation patterns, respectively. Asshown by the radiation patterns, the performance of theantenna is dependant upon the orientation of themodule. Figure 2-14 shows the impedance simulationand Figure 2-15 shows the actual impedancemeasurement. The discrete matching circuitry matchesthe impedance of the antenna with the SAW filter andMRF89XA transceiver IC.FIGURE 2-10: PCB ANTENNA DIMENSIONSFIGURE 2-11: PCB ANTENNA SIMULATION DRAWING16.8mm 1.0mm8.4mm1.1mm0.5mm2.5mm
© 2011 Microchip Technology Inc. Preliminary DS00000A-page 15MRF89XAM9AFIGURE 2-12: SIMULATED 2D RADIATION PATTERNFIGURE 2-13: SIMULATED 3D RADIATION PATTERN
© 2011 Microchip Technology Inc. Preliminary DS00000A-page 16MRF89XAM9AFIGURE 2-14: SIMULATED PCB ANTENNA IMPEDANCEFIGURE 2-15: SIMULATED PCB ANTENNA VSWR
© 2011 Microchip Technology Inc. Preliminary DS00000A-page 17MRF89XAM9A3.0 REGULATORY APPROVALThe MRF89XAM9A module has received regulatoryapprovals for modular devices in the United States andCanada. Modular approval allows the end user to placethe MRF89XAM9A module inside a finished productand not require regulatory testing for an intentionalradiator (RF transmitter), provided no changes ormodifications are made to the module circuitry.Changes or modifications could void the user’sauthority to operate the equipment. The end user mustcomply with all of the instructions provided by theGrantee, which indicate installation and/or operatingconditions necessary for compliance.The integrator is still responsible for testing the endproduct for any additional compliance requirementsrequired with this module installed (digital deviceemission, PC peripheral requirements, etc.) in thespecific country that the end device will be marketed.For more information on details on regulatorycompliance, refer to the specific country radioregulations in the following sections. 3.1 United StatesThe MRF89XAM9A has received FederalCommunications Commission (FCC) CFR47Telecommunications, Part 15 Subpart C “IntentionalRadiators” 15.247 and 15.249 and modular approval inaccordance with FCC Public Notice DA 00-1407Released: June 26, 2000, Part 15 Unlicensed ModularTransmitter Approval. The MRF89XAM9A module canbe integrated into a finished product without obtainingsubsequent and separate FCC certification.The MRF89XAM9A module has been labeled with itsown FCC ID number, and if the FCC ID is not visiblewhen the module is installed inside another device,then the outside of the finished product into which themodule is installed must also display a label referringto the enclosed module. This exterior label can usewording as following:The user’s manual should include the followingstatement:3.1.1 MRF89XAM9A SETTINGSTo meet the FCC requirements, the following settingsmust be observed by the integrator:3.1.1.1 FSK ModulationThe following settings configure the MRF89XAM9A forwideband digital modulation techniques that conform tothe requirements of Part 15.247. These settings allowfor higher radio frequency (RF) output power andgreater link budget:• Bit Rate Setting: 50 - 200 kbps- Transmit Power Maximum Setting:13 dBm• Bit Rate Setting: 2 - 40 kbps- Transmit Power Maximum Setting:7 dBm• Frequency Deviation Setting: 200 kHz• Data Whitening: On• Transmit Bandwidth Setting: 400 kHz• Lower Frequency Setting: 902.800 MHz• Upper Frequency Setting: 926.500 MHzContains Transmitter Module FCC ID: OA3MRF89XAM9A-or- Contains FCC ID: OA3MRF89XAM9AThis device complies with Part 15 of the FCC Rules.Operation is subject to the following two conditions:(1) this device may not cause harmful interference,and (2) this device must accept any interferencereceived, including interference that may causeundesired operation.Requirements for product labeling are given in Part15.19 Labelling Requirements.This equipment has been tested and found to complywith the limits for a Class B digital device, pursuant topart 15 of the FCC Rules. These limits are designed toprovide reasonable protection against harmfulinterference in a residential installation. Thisequipment generates, uses and can radiate radiofrequency energy, and if not installed and used inaccordance with the instructions, may cause harmfulinterference to radio communications. However, thereis no guarantee that interference will not occur in aparticular installation. If this equipment does causeharmful interference to radio or television reception,which can be determined by turning the equipmentOFF and ON, the user is encouraged to try to correctthe interference by one or more of the followingmeasures:• Reorient or relocate the receiving antenna.• Increase the separation between the equipmentand receiver.• Connect the equipment into an outlet on acircuit different from that to which the receiver isconnected.• Consult the dealer or an experienced radio/TVtechnician for help.
MRF89XAM9ADS00000A-page 18 Preliminary © 2011 Microchip Technology Inc.3.1.1.2 OOK ModulationThe following settings configure the MRF89XAM9A fornarrowband operation that conform to the requirementsof Part 15.249. Part 15.249 requires a much lowerpower setting than is allowed in Part 15.247. These set-tings are good for applications that require lower trans-mit power current consumption and shorter transmitdistances:• Transmit Power Maximum Setting:1 dBm• Bit Rate Maximum Setting: 16 kbps• Frequency Deviation Setting: 200 kHz• Transmit Bandwidth Setting: 400 kHz• Lower Frequency Setting: 902.330 MHz• Upper Frequency Setting: 927.500 MHz3.1.2 RF EXPOSUREAll transmitters regulated by FCC must comply with RFexposure requirements. OET Bulletin 65 “EvaluatingCompliance with FCC Guidelines for Human Exposureto Radio Frequency Electromagnetic Fields” providesassistance in determining whether proposed or existingtransmitting facilities, operations or devices complywith limits for human exposure to RF fields adopted bythe Federal Communications Commission (FCC). Thebulletin offers guidelines and suggestions forevaluating compliance.If appropriate, compliance with exposure guidelines formobile and unlicensed devices can be accomplishedby the use of warning labels and by providing userswith information concerning minimum separationdistances from transmitting structures and properinstallation of antennas.The following statement must be included as aCAUTION statement in manuals and OEM products toalert users of FCC RF Exposure compliance:If the MRF89XAM9A module is used in a portableapplication (antenna is less than 20 cm from personsduring operation), the integrator is responsible forperforming Specific Absorption Rate (SAR) testing inaccordance with FCC rules 2.1091.3.1.3 HELPFUL WEB SITESFederal Communications Commission (FCC) http://www.fcc.govTo satisfy FCC RF Exposure requirements for mobileand base station transmission devices, a separationdistance of 20 cm or more should be maintainedbetween the antenna of this device and personsduring operation. To ensure compliance, operation atcloser than this distance is not recommended.The antenna(s) used for this transmitter must not beco-located or operating in conjunction with any otherantenna or transmitter.
© 2011 Microchip Technology Inc. Preliminary DS00000A-page 19MRF89XAM9A3.2 CanadaThe MRF89XAM9A module has been certified for use inCanada under Industry Canada (IC) Radio StandardsSpecification (RSS) RSS-210 and RSS-Gen. Modularapproval permits the installation of a module in a hostdevice without the need to recertify the device. Labeling Requirements for the Host Device (fromSection 3.2.1, RSS-Gen, Issue 3, December 2010):The host device shall be properly labeled to identify themodule within the host device.The Industry Canada certification label of a moduleshall be clearly visible at all times when installed in thehost device, otherwise the host device must be labeledto display the Industry Canada certification number ofthe module, preceded by the words “Containstransmitter module”, or the word “Contains”, or similarwording expressing the same meaning, as follows:User Manual Notice for License-Exempt RadioApparatus (from Section 7.1.3 RSS-Gen, Issue 3,December 2010):User manuals for license-exempt radio apparatus shallcontain the following or equivalent notice in aconspicuous location in the user manual oralternatively on the device or both.3.2.1 MRF89XAM9A SETTINGSTo meet Industry Canada (IC) requirements, thefollowing settings must be observed by the integrator:3.2.1.1 FSK ModulationThe following settings configure the MRF89XAM9A forwideband digital modulation techniques that conform tothe requirements of RSS-210 Issue 8 Annex 8. Thesesettings allow for higher radio frequency (RF) outputpower and greater link budget.• Bit Rate Setting: 50 - 200 kbps- Transmit Power Maximum Setting:13 dBm• Bit Rate Setting: 2 - 40 kbps- Transmit Power Maximum Setting:7 dBm• Frequency Deviation Setting: 200 kHz• Data Whitening: On• Transmit Bandwidth Setting: 400 kHz• Lower Frequency Setting: 902.800 MHz• Upper Frequency Setting: 926.500 MHz3.2.1.2 OOK ModulationThe following settings configure the MRF89XAM9A fornarrowband operation that conform to the requirementsof RSS-Gen Issue 3. RSS-Gen Issue 3 requires amuch lower power setting than is allowed in Part RSS-210 Issue 8 Annex 8. These settings are good forapplications that require lower transmit power currentconsumption and shorter transmit distances.• Transmit Power Maximum Setting:1 dBm• Bit Rate Maximum Setting: 16 kbps• Frequency Deviation Setting: 200 kHz• Transmit Bandwidth Setting: 400 kHz• Lower Frequency Setting: 902.330 MHz• Upper Frequency Setting: 927.500 MHz3.2.2 HELPFUL WEB SITESIndustry Canada: http://www.ic.gc.ca/Contains transmitter module IC: 7693A-89XAM9AThis device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to thefollowing two conditions: (1) this device may notcause interference, and (2) this device must acceptany interference, including interference that maycause undesired operation of the device.Le présent appareil est conforme aux CNRd'Industrie Canada applicables aux appareils radioexempts de licence. L'exploitation est autorisée auxdeux conditions suivantes: (1) l'appareil ne doit pasproduire de brouillage, et (2) l'utilisateur de l'appareildoit accepter tout brouillage radioélectrique subi,même si le brouillage est susceptible d'encompromettre le fonctionnement.
MRF89XAM9ADS00000A-page 20 Preliminary © 2011 Microchip Technology Inc.NOTES:
© 2011 Microchip Technology Inc. Preliminary DS00000A-page 21MRF89XAM9A4.0 ELECTRICAL CHARACTERISTICSAbsolute Maximum RatingsAmbient temperature under bias.............................................................................................................. -40°C to +85°CStorage temperature .............................................................................................................................. -55°C to +125°CVoltage on VIN with respect to VSS ................................................................................................................ -0.3V to 6VVoltage on any combined digital and analog pin with respect to VSS (except VIN) ...........................-0.3V to (VIN + 0.3V)Input current into pin (except VIN and VSS)........................................................................................... -25 mA to 25 mAElectrostatic discharge with human body model .................................................................................................... 1000V NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
MRF89XAM9ADS00000A-page 22 Preliminary © 2011 Microchip Technology Inc.TABLE 4-1: RECOMMENDED OPERATING CONDITIONSTABLE 4-2: CURRENT CONSUMPTIONTABLE 4-3: DIGITAL I/O PIN INPUT SPECIFICATIONS(1)Parameter Min Typ Max Unit ConditionAmbient Operating Temperature -40 — +85 °C —Supply Voltage for RF, Analog and Digital Circuits 2.1 — 3.6 V —Supply Voltage for Digital I/O 2.1 — 3.6 V —Input High Voltage (VIH) 0.5 * VIN —VIN + 0.3 V —Input Low Voltage (VIL) -0.3V — 0.2 * VIN V—AC Peak Voltage on Open Collector Outputs (IO)(1) VIN – 1.5 — VIN + 1.5 V —Note 1: At minimum, VIN – 1.5V should not be lower than 1.8V.Symbol Chip Mode Min Typ Max Unit ConditionIDDSL Sleep — 0.1 2 µA Sleep clock disabled, all blocks disabledIDDST Idle — 65 80 µA Oscillator and baseband enabledIDDFS Frequency Synthesizer — 1.3 1.7 mA Frequency synthesizer runningIDDTX Tx ——25163021mAmAOutput power = +10 dBmOutput power = +1 dBm(1)IDDRX Rx — 3.0 3.5 mA —Note 1: Guaranteed by design and characterization.Symbol Characteristic Min Typ Max Unit ConditionVIL Input Low Voltage — — 0.2 * VIN V—VIH Input High Voltage 0.8 * VIN ——V —IIL Input Low Leakage Current(2) -0.5 — 0.5 µA VIL = 0VIIH Input High Leakage Current -0.5 — 0.5 µA VIH = VIN, VIN = 3.7VOL Digital Low Output Voltage — — 0.1 * VIN —IOL = 1 mAVOH Digital Low Output 0.9 * VIN ——V IOH = -1 mANote 1: Measurement Conditions: TA = 25°C, VIN = 3.3V, Crystal Frequency = 12.8 MHz, unless otherwise specified.2: Negative current is defined as the current sourced by the pin.
© 2011 Microchip Technology Inc. Preliminary DS00000A-page 23MRF89XAM9ATABLE 4-4: PLL PARAMETERS AC CHARACTERISTICS(1)Symbol Parameter Min Typ Max Unit ConditionFRO Frequency Ranges 902 — 928 MHz —BRFSK Bit Rate (FSK) 1.56 — 40 kbps NRZBROOK Bit Rate (OOK) 1.56 — 16 kbps NRZFDFSK Frequency Deviation (FSK) 33 50 200 kHz —FXTAL Crystal Oscillator Frequency 9 12.8 — MHz —FSSTP Frequency Synthesizer Step — 2 — kHz Variable, depending on the frequencyTSOSC Oscillator Wake-up Time — 1.5 5 ms From Sleep mode(1)TSFS Frequency Synthesizer Wake-up Time; at most, 10 kHz away from the target— 500 800 µs From Stand-by modeTSHOP Frequency Synthesizer Hop Time; at most, 10 kHz away from the target— 180 — µs 200 kHz step — 200 — µs 1 MHz step— 250 — µs 5 MHz step— 260 — µs 7 MHz step— 290 — µs 12 MHz step— 320 — µs 20 MHz step— 340 — µs 27 MHz stepNote 1: Guaranteed by design and characterization.
MRF89XAM9ADS00000A-page 24 Preliminary © 2011 Microchip Technology Inc.TABLE 4-5: RECEIVER AC CHARACTERISTICS(1)Symbol Parameter Min Typ Max Unit ConditionRSF Sensitivity (FSK) — -107 — dBm 915 MHz, BR = 25 kbps, fdev = 50 kHz, fc = 100 kHz— -103 — dBm 915 MHz, BR = 66.7 kbps, fdev = 100 kHz, fc = 200 kHzRSO Sensitivity (OOK) — -113 — dBm 915 MHz, 2 kbps NRZfc – fo = 50 kHz, fo = 50 kHz— -106 — dBm 915 MHz, 16.7 kbps NRZfc – fo = 100 kHz, fo = 100 kHzCCR Co-Channel Rejection — -12 — dBc Modulation as wanted signalACR Adjacent Channel Rejection — 27 — dB Offset = 300 kHz, unwanted tone is not modulated— 52 — dB Offset = 600 kHz, unwanted tone is not modulated— 57 — dB Offset = 1.2 MHz, unwanted tone is not modulatedBI Blocking Immunity — -48 — dBm Offset = 1 MHz, unmodulated— -37 — dBm Offset = 2 MHz, unmodulated, no SAW— -33 — dBm Offset = 10 MHz, unmodulated, no SAWRXBWF Receiver Bandwidth in FSK Mode(2) 50 — 250 kHz Single side BW, Polyphase OffRXBWU Receiver Bandwidth in OOK Mode(2) 50 — 400 kHz Single side BW, Polyphase OnITP3 Input Third Order Intercept Point— -28 — dBm Interferers at 1 MHz and 1.950 MHz offsetTSRWF Receiver Wake-up Time — 280 500 µs From FS to Rx readyTSRWS Receiver Wake-up Time — 600 900 µs From Stand-by to Rx readyTSRHOP Receiver Hop Time from Rx Ready to Rx Ready with a Frequency Hop— 400 — µs 200 kHz step— 400 — µs 1 MHz step— 460 — µs 5 MHz step— 480 — µs 7 MHz step— 520 — µs 12 MHz step— 550 — µs 20 MHz step— 600 — µs 27 MHz stepRSSIST RSSI Sampling Time — — 1/fdev s From Rx readyRSSTDR RSSI Dynamic Range — 70 — dB Ranging from sensitivityNote 1: Guaranteed by design and characterization.2: This reflects the whole receiver bandwidth, as described by conditions for active and passive filters.
© 2011 Microchip Technology Inc. Preliminary DS00000A-page 25MRF89XAM9ATABLE 4-6: TRANSMITTER AC CHARACTERISTICS(1) 4.1 Timing Specification and DiagramTABLE 4-7: SPI TIMING SPECIFICATION(1,2)Symbol Description Min Typ Max Unit ConditionRFOP RF Output Power, Programmable with 8 Steps of typ. 3 dB— +12.5 — dBm Maximum power setting— -8.5 — dBm Minimum power settingPN Phase Noise — -112 — dBc/Hz Measured with a 600 kHz offset at the transmitter outputTXSP Transmitted Spurious — — -47 dBc At any offset between 200 kHz and 600 kHz, unmodulated carrier, fdev = 50 kHzTx2 Second Harmonic——-40dBmNo modulation, see Note(2)Tx3 Third HarmonicTx4 Fourth HarmonicTxn Harmonics above Tx4FSKDEV FSK Deviation ±33 ±55 ±200 kHz ProgrammableTSTWF Transmitter Wake-up Time — 120 500 µs From FS to Tx readyTSTWS Transmitter Wake-up Time — 600 900 µs From Stand-by to Tx readyNote 1: Guaranteed by design and characterization.2: Transmitter in-circuit performance with SAW filter and crystal.Parameter Min Typ Max Unit ConditionSPI Configure Clock Frequency — — 6 MHz —SPI Data Clock Frequency — — 1 MHz —Data Hold and Setup Time 2 — — µs —SDI Setup Time for SPI Configure 250 — — ns —SDI Setup Time for SPI Data 312 — — ns —CSCON Low to SCK Rising Edge;SCK Falling Edge to CSCON High500 — — ns —CSDATA Low to SCK Rising Edge;SCK Falling Edge to CSDATA High625 — — ns —CSCON Rising to Falling Edge 500 — — ns —CSDATA Rising to Falling Edge 625 — — ns —Note 1: Typical Values: TA = 25°C, VIN = 3.3V, Crystal Frequency = 12.8 MHz, unless otherwise specified.2: Negative current is defined as the current sourced by the pin.
MRF89XAM9ADS00000A-page 26 Preliminary © 2011 Microchip Technology Inc.NOTES:
© 2011 Microchip Technology Inc. Preliminary DS00000A-page 27MRF89XAM9AAPPENDIX A: REVISION HISTORYRevision A (May 2011)This is the Initial release of the document.
MRF89XAM9ADS00000A-page 28 Preliminary © 2011 Microchip Technology Inc.NOTES:
© 2011 Microchip Technology Inc. Preliminary DS00000A-page 29MRF89XAM9ATHE MICROCHIP WEB SITEMicrochip provides online support via our WWW site atwww.microchip.com. This web site is used as a meansto make files and information easily available tocustomers. Accessible by using your favorite Internetbrowser, the web site contains the followinginformation:•Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software•General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing•Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representativesCUSTOMER CHANGE NOTIFICATION SERVICEMicrochip’s customer notification service helps keepcustomers current on Microchip products. Subscriberswill receive e-mail notification whenever there arechanges, updates, revisions or errata related to aspecified product family or development tool of interest.To register, access the Microchip web site atwww.microchip.com. Under “Support”, click on“Customer Change Notification” and follow theregistration instructions.CUSTOMER SUPPORTUsers of Microchip products can receive assistancethrough several channels:• Distributor or Representative• Local Sales Office• Field Application Engineer (FAE)• Technical Support• Development Systems Information LineCustomers should contact their distributor,representative or field application engineer (FAE) forsupport. Local sales offices are also available to helpcustomers. A listing of sales offices and locations isincluded in the back of this document.Technical support is available through the web siteat: http://microchip.com/support
MRF89XAM9ADS00000A-page 30 Preliminary © 2011 Microchip Technology Inc.READER RESPONSEIt is our intention to provide you with the best documentation possible to ensure successful use of your Microchipproduct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which ourdocumentation can better serve you, please FAX your comments to the Technical Publications Manager at(480) 792-4150.Please list the following information, and use this outline to provide us with your comments about this document.TO: Technical Publications ManagerRE: Reader ResponseTotal Pages Sent ________From: NameCompanyAddressCity / State / ZIP / CountryTelephone: (_______) _________ - _________Application (optional):Would you like a reply? Y NDevice: Literature Number: Questions:FAX: (______) _________ - _________DS00000AMRF89XAM9A1. What are the best features of this document?2. How does this document meet your hardware and software development needs?3. Do you find the organization of this document easy to follow? If not, why?4. What additions to the document do you think would enhance the structure and subject?5. What deletions from the document could be made without affecting the overall usefulness?6. Is there any incorrect or misleading information (what and where)?7. How would you improve this document?
© 2011 Microchip Technology Inc. Preliminary DS00000A-page 31MRF89XAM9APRODUCT IDENTIFICATION SYSTEMTo order or obtain information, for example, on pricing or delivery, refer to the factory or the listed sales office. Device MRF89XAM9A-I/RM: Ultra Low-Power, Integrated ISM Band Sub-GHz Transceiver moduleTemperature RangeI = -40ºC to +85ºC (Industrial)Example:a) MRF89XAM9A-I/RM: Industrial temperaturetray.b) MRF89XAM9AT-I/RM: Industrial temperaturetape and reel, PART NODeviceMModuleXModuleTypeTape and Reel-XTemperature RangeT
DS00000A-page 32 © 2011 Microchip Technology Inc.AMERICASCorporate Office2355 West Chandler Blvd.Chandler, AZ 85224-6199Tel: 480-792-7200 Fax: 480-792-7277Technical Support: http://www.microchip.com/supportWeb Address: www.microchip.comAtlantaDuluth, GA Tel: 678-957-9614 Fax: 678-957-1455BostonWestborough, MA Tel: 774-760-0087 Fax: 774-760-0088ChicagoItasca, IL Tel: 630-285-0071 Fax: 630-285-0075ClevelandIndependence, OH Tel: 216-447-0464 Fax: 216-447-0643DallasAddison, TX Tel: 972-818-7423 Fax: 972-818-2924DetroitFarmington Hills, MI Tel: 248-538-2250Fax: 248-538-2260IndianapolisNoblesville, IN Tel: 317-773-8323Fax: 317-773-5453Los AngelesMission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608Santa ClaraSanta Clara, CA Tel: 408-961-6444Fax: 408-961-6445TorontoMississauga, Ontario, CanadaTel: 905-673-0699 Fax: 905-673-6509ASIA/PACIFICAsia Pacific OfficeSuites 3707-14, 37th FloorTower 6, The GatewayHarbour City, KowloonHong KongTel: 852-2401-1200Fax: 852-2401-3431Australia - SydneyTel: 61-2-9868-6733Fax: 61-2-9868-6755China - BeijingTel: 86-10-8528-2100 Fax: 86-10-8528-2104China - ChengduTel: 86-28-8665-5511Fax: 86-28-8665-7889China - ChongqingTel: 86-23-8980-9588Fax: 86-23-8980-9500China - Hong Kong SARTel: 852-2401-1200 Fax: 852-2401-3431China - NanjingTel: 86-25-8473-2460Fax: 86-25-8473-2470China - QingdaoTel: 86-532-8502-7355Fax: 86-532-8502-7205China - ShanghaiTel: 86-21-5407-5533 Fax: 86-21-5407-5066China - ShenyangTel: 86-24-2334-2829Fax: 86-24-2334-2393China - ShenzhenTel: 86-755-8203-2660 Fax: 86-755-8203-1760China - WuhanTel: 86-27-5980-5300Fax: 86-27-5980-5118China - XianTel: 86-29-8833-7252Fax: 86-29-8833-7256China - XiamenTel: 86-592-2388138 Fax: 86-592-2388130China - ZhuhaiTel: 86-756-3210040 Fax: 86-756-3210049ASIA/PACIFICIndia - BangaloreTel: 91-80-3090-4444 Fax: 91-80-3090-4123India - New DelhiTel: 91-11-4160-8631Fax: 91-11-4160-8632India - PuneTel: 91-20-2566-1512Fax: 91-20-2566-1513Japan - YokohamaTel: 81-45-471- 6166 Fax: 81-45-471-6122Korea - DaeguTel: 82-53-744-4301Fax: 82-53-744-4302Korea - SeoulTel: 82-2-554-7200Fax: 82-2-558-5932 or 82-2-558-5934Malaysia - Kuala LumpurTel: 60-3-6201-9857Fax: 60-3-6201-9859Malaysia - PenangTel: 60-4-227-8870Fax: 60-4-227-4068Philippines - ManilaTel: 63-2-634-9065Fax: 63-2-634-9069SingaporeTel: 65-6334-8870Fax: 65-6334-8850Taiwan - Hsin ChuTel: 886-3-6578-300Fax: 886-3-6578-370Taiwan - KaohsiungTel: 886-7-213-7830Fax: 886-7-330-9305Taiwan - TaipeiTel: 886-2-2500-6610 Fax: 886-2-2508-0102Thailand - BangkokTel: 66-2-694-1351Fax: 66-2-694-1350EUROPEAustria - WelsTel: 43-7242-2244-39Fax: 43-7242-2244-393Denmark - CopenhagenTel: 45-4450-2828 Fax: 45-4485-2829France - ParisTel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79Germany - MunichTel: 49-89-627-144-0 Fax: 49-89-627-144-44Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781Netherlands - DrunenTel: 31-416-690399 Fax: 31-416-690340Spain - MadridTel: 34-91-708-08-90Fax: 34-91-708-08-91UK - WokinghamTel: 44-118-921-5869Fax: 44-118-921-5820Worldwide Sales and Service02/18/11

Navigation menu