MMB Research BSB03PA1X EFR32 802.15.4 Module User Manual

MMB Research Inc. EFR32 802.15.4 Module Users Manual

Users Manual

Page 1Rev 0.7 © MMB Networks 2018 BSB03PA1x Module Data SheetPre-loaded with RapidConnect firmware Ensures compatibility with latest Zigbee and Thread specificationsMMB Networks EFR32 Zigbee / Thread ModuleBSB03PA10 / PA11 / PA12 Document Rev 0.7The MMB Networks BSB03PA1x family is the latest generation Zigbee and Thread capable module. Based on the EFR32 multi-protocol IC from Silicon Labs, the BSB03PA1x are drop-in Zigbee 3.0 solutions. Preloaded with MMB Networks’ RapidSE Zigbee Smart Energy application or RapidHA Home Automation application, it offers hardware vendors an easy way to integrate a fully-implemented, automated Zigbee Smart Energy or Zigbee Home Automation platform into their existing devices.MMB Networks offers a variety of hardware and software development tools to facilitate integration. For more information, please visit http://www.mmbnetworks.comFeatures Benefits+19.5, +16.5, and +8 dBm transmit power options Power and price optimized to meet end product transmit power requirementsBuilt on Silicon Labs EFR32 Wireless Gecko Family Industry leading 802.15.4 MCU ensures best-in-class performanceCertified application layer, onboard stack, antenna and regulatory approvalsProvides rapid time-to-market and short implementation timeUp to 118 dB link budget Delivers unmatched range for difficult installationsSMD Chip Antenna or U.FL RF connector options Allows for external antennas where required15.88mm x 12.6mm x 2.0mm module size Tiny module size will fit in the most miniature applications15 GPIO (General Purpose Input/Output) connections Flexibility to drive simple to complex devicesPreliminary Information
Page 2Rev 0.7 © MMB Networks 2018 BSB03PA1x Module Data SheetContents1 | General Information ...................................................................................................................................32 | Memory ........................................................................................................................................................33 | Module Pinout .............................................................................................................................................33.1 | Debug and Programming Interface ..........................................................................................................................................44 | Electrical Specications .............................................................................................................................44.1 | Absolute Maximum Ratings ...........................................................................................................................................................44.2 | Recommended Operating Conditions ....................................................................................................................................44.3 | DC Electrical Characteristics ...........................................................................................................................................................55 | RF Specications .........................................................................................................................................55.1 | Receive Specifications ........................................................................................................................................................................55.2 | Transmit Specifications ......................................................................................................................................................................55.2.1 | Typical Transmit Performance Curves (Tx Current vs. Tx Power) ..........................................................................65.2.2 | Typical Transmit Performance Curves (Output Power vs. Tx Power) ..................................................................76 | Functional Specications ..........................................................................................................................76.1 | Serial Ports .................................................................................................................................................................................................77 | Mechanical Specications .........................................................................................................................87.1 | Physical Dimensions ............................................................................................................................................................................87.2 | Recommended Land Pattern (Surface Mount) ..................................................................................................................97.3 | RF Connector Dimensions ............................................................................................................................................................ 107.4 | Label Drawings ....................................................................................................................................................................................108 | Soldering Temperature Time Prole for reow soldering (Lead-free solder)............................... 119 | Regulatory Approvals ............................................................................................................................. 119.1 | Federal Communications Commission (FCC - US) .........................................................................................119.2 | Industry Canada (IC) ........................................................................................................................................................................ 129.3 | EU .................................................................................................................................................................................................................139.4 | RoHS Compliance ..............................................................................................................................................................1310 | Revision History ..................................................................................................................................... 1311 | Ordering Information ........................................................................................................................... 14Preliminary Information
Page 3Rev 0.7 © MMB Networks 2018 BSB03PA1x Module Data Sheet1 | General InformationNote that some of the specifications refer to either the “EFR32” chip or the “Module”. Specifications cited as EFR32 are taken from the EFR32 datasheet (this should also be noted where referred to). Module means measurements taken with our production module.2 | Memory3 | Module PinoutRAM (kB) On-Chip Flash (kB)32 256Module Pad Function EFR32 Pin Name (number) ADC Capable1 2.4GHz antenna line out 2G4RF_IOP (12)2 Module Ground3 EFR32 GPIO, Port D #13 PD13 (14) Yes4 EFR32 GPIO, Port D #14 PD14 (15) Yes5 EFR32 GPIO, Port D #15 PD15 (16) Yes6 EFR32 GPIO, Port A #1 PA1 (18) Yes7 EFR32 GPIO, Port A #0 PA0 (17) Yes8 Digital I/O Power Supply IOVDD (30)9 EFR32 GPIO, Port B #11 PB11 (19) Yes10 EFR32 GPIO, Port B #12 PB12 (20) Yes11 Module Ground12 Module Ground13 Module Ground14 EFR32 GPIO, Port B #13 PB13 (21) Yes15 EFR32 GPIO, Port B #14 PB14 (23) Yes16 EFR32 GPIO, Port B #15 PB15 (24) Yes17 Module Ground18 Module Main Power19 Module Ground20 EFR32 GPIO, Port C #10 PC10 (31) Yes21 EFR32 GPIO, Port C #11 PC11 (32) Yes22 Module Ground23 Reset input, active low RESETn (8)24 EFR32 GPIO, Port F #0 PF0 (1) Yes25 EFR32 GPIO, Port F #1 PF1 (2) Yes26 EFR32 GPIO, Port F #2 PF2 (3) Yes27 Module GroundPreliminary Information
Page 4Rev 0.7 © MMB Networks 2018 BSB03PA1x Module Data Sheet3.1 | Debug and Programming InterfaceIn order to access the EFR32 for programming and debug purposes, it is recommended that the designer incorporate Silcon Labs 10-pin Mini Simplicity connector. The following table shows a pin mapping between Silicon Labs 10-pin Mini Simplicity connector and the module, and the graphic to the right displays the layout of the Mini Simplicity connector.4 | Electrical Specications4.1 | Absolute Maximum RatingsParameter Minimum Maximum UnitsSupply Voltage (VCC) 0 3.6 VVoltage on any GPIO -0.3 VCC + 0.3 VVoltage on any GPIO pin when used as an input to the general purpose ADC with the low voltage range selected -0.3 2 VAmbient Operating Temperature (standard version) -40 85 °CStorage Temperature -50 150 °C4.2 | Recommended Operating ConditionsSilicon Labs Simplicity Studio Port Pin Module Pad1 18 (Module Main Power)2 17 (Module Ground)3 23 (Reset input, active low)4 6 (EFR32 GPIO, Port A #1)5 7 (EFR32 GPIO, Port A #0)6 26 (EFR32 GPIO, Port F #2)7 25 (EFR32 GPIO, Port F #1)8 24 (EFR32 GPIO, Port F #0)9 14 (EFR32 GPIO, Port B #13)10 10 (EFR32 GPIO, Port B #12)Parameter Minimum Typical Maximum UnitsSupply Voltage (VCC) 2.0 3.3 3.6 VTemperature Range -40 85 °C1 23 45 67 89 10VAEMRSTVCOM_TXSWDIOPTI_FRAMEGNDVCOM_RXSWOSWCLKPTI_DATAPreliminary Information
Page 5Rev 0.7 © MMB Networks 2018 BSB03PA1x Module Data Sheet4.3 | DC Electrical Characteristics5 | RF Specications5.1 | Receive Specifications Note: The Typical number indicates one standard deviation above the mean, measured at room temperature (25°C). The Min and Max numbers were measured over process corners at room temperature.5.2 | Transmit SpecificationsFrequency range 2400 2483.5 MHzSensitivity1% PER, 20 byte packet defined by IEEE 802.15.4-2003 -98 dBmOutput Power at highest power settingBSB03PA10 module 19.5 dBmBSB03PA11 module 16.5 dBmBSB03PA12 module 8.5 dBmParameter Test Condition Minimum Typical Maximum UnitsOperating CurrentAt 25 °C, VCC = 3.3v, normal mode, 19.5 dBm 140 mAAt 25 °C, VCC = 3.3v, normal mode, 16.5 dBm 95 mAAt 25 °C, VCC = 3.3v, normal mode, 8 dBm 30 mARX CurrentAt 25 °C, VCC = 3.3v, normal mode, 2.4 GHz 8.7 mADeep Sleep CurrentAt 25 °C, VCC = 3.3v, shutdown mode. Full RAM retention and RTCC running from LFXO 2 μAPreliminary Information
Page 6Rev 0.7 © MMB Networks 2018 BSB03PA1x Module Data Sheet5.2.1 | Typical Transmit Performance Curves (Tx Current vs. Tx Power)Note: The graph above is for the PA10 variant. For PA11 and PA12 modules, the maximum output power is limited by the chosen SKU (16.5dBm or 8dBm respectively)Preliminary Information
Page 7Rev 0.7 © MMB Networks 2018 BSB03PA1x Module Data Sheet5.2.2 | Typical Transmit Performance Curves (Output Power vs. Tx Power)Note: The graph above is for the PA10 variant. For PA11 and PA12 modules, the maximum output power is limited by the chosen SKU (16.5dBm or 8dBm respectively)6 | Functional Specications6.1 | Serial PortsRefer to the EFR32 data sheet for functionality and associated GPIO pinouts. Note: The module pinout table in section 3 of this document provides a cross reference between the MMB module pins and the EFR32 GPIO.Note 2: The RapidConnect firmware supports UART communication with a baud rate of 115.2kbps. However, MMB can modify this configuration as necessary through a Non-Recurring Engineering engagement.Preliminary Information
Page 8Rev 0.7 © MMB Networks 2018 BSB03PA1x Module Data Sheet7 | Mechanical Specications7.1 | Physical DimensionsAntennaABDCLW Symbol Description DistanceL Length of the module 15.88 mmW Width of the module 12.60 mmH Height of the module 2.88 mmA Length of keep-out zone 5.50 mmB Width of keep-out zone 8.50 mmC Keep-out zone from corner of PCB 5.0 mmD Keep-out zone from corner of PCB 5.0 mmNote: The above table and recommendation apply to BSB03PA1x-CHP products only.The BSB03PA1x family of devices use a System on Module (SOM) package process technology.Preliminary Information
Page 9Rev 0.7 © MMB Networks 2018 BSB03PA1x Module Data Sheet7.2 | Recommended Land Pattern (Surface Mount)The diagram below shows the recommended dimensions and arrangement of the pads for the module. The daughtercard upon which the module will be mounted should not include any traces or vias directly under the module, because they may come in contact with the module’s traces and cause unexpected behavior. If it is absolutely necessary to include traces and/or vias under the module due to space constraints, then a customer can elect to do so at their own risk. MMB can provide a Hardware Designer Package to show the module’s footprint and drill locations, which must not line up with the daughtercard’s drill locations.F6F1F2F4F5F7Top and Bottom Pad Dimensions0.64 mm 1.14 mm1 1327 222114Right Side Pad Dimensions1.14 mm 0.64 mmF5F3Symbol Description DistanceF1 Distance pad centre to pad centre 2.68 mmF2 Distance pad centre to pad centre 1.40 mmF3 Distance pad centre to pad centre 3.52 mmF4 Distance pad centre to pad centre 1.48 mmF5 Pitch 1.02 mmF6 Module silkscreen outline 12.60 mmF7 Module silkscreen outline 15.88 mmPreliminary Information
Page 10Rev 0.7 © MMB Networks 2018 BSB03PA1x Module Data Sheet7.3 | RF Connector DimensionsThe diagram below shows the dimensions for the RF connector. This connector appears on the -RFC variants only.7.4 | Label DrawingsPreliminary Information
Page 11Rev 0.7 © MMB Networks 2018 BSB03PA1x Module Data Sheet8 | Soldering Temperature Time Prole for reow soldering (Lead-free solder)150˚C - 190˚C220˚C30 +20/-10s90 ±30s230˚C - 240˚C maxTemp[ ˚C ]Time [ s ]Maximum reflow cycles: 2Opposite-side reflow is prohibited due to the module weight. You must not place the module on the bottom / underside of your PCB and re-flow.9 | Regulatory Approvals9.1 | Federal Communications Commission (FCC - US)Note: this section applies to BSB03PA1x-CHP and BSB03PA1x-RFC devices only.9.1.1 | Approved AntennaeFor the BSB03PA1x-CHP modules using the onboard chip antenna, the approved power level settings are -2 dBm for channels 11-25 and -20 dBm for channel 26. The onboard chip antenna is Inpaq ACA-2012-A1-CC-S.For the BSB03PA1x-RFC modules using the approved external antenna, the approved power level settings are -11 dBm for channels 11-25 and -26 dBm for channel 26. The BSB03PA1x-RFC devices have been approved with the following external FCC approved antennas: Mag Layers EDA-1713-2G4C1-A2, and Bondale G-RA0K13200284-SZ478.9.1.2 | FCC NoticeThe BSB03PA1x-CHP and BSB03PA1x-RFC devices comply with Part 15 of the FCC rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation. To comply with FCC RF Exposure requirements, users of this device must ensure that the module be installed and/or configured to operate with a separation distance of 20cm or more from all persons. Usage of Channel 26 at full power will result in non-compliance to FCC standards. MMB recommends avoiding use of channel 26 and if necessary only use with a reduced power setting. For further details please contact MMB.Preliminary Information
Page 12Rev 0.7 © MMB Networks 2018 BSB03PA1x Module Data SheetThis equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:• Reorient or relocate the receiving antenna.• Increase the separation between the equipment and receiver.• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.• Consult the dealer or an experienced radio/TV technician for help.9.1.3 | Modular Approval The BSB03PA1x-CHP and BSB03PA1x-RFC devices meet the requirements for modular transmitter approval as detailed in the FCC public notice DA 00-1407. It should be noted that: “While the applicant for a device into which an authorized module is installed is not required to obtain a new authorization for the module, this does not preclude the possibility that some other form of authorization or testing may be required for the device (e.g., a WLAN into which an authorized module is installed must still be authorized as a PC peripheral, subject to the appropriate equipment authorization).” -- FCC Public Notice DA 00-1407 Caution: Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.NOTE:This module is intended for an OEM integrator. The OEM integrator is responsible for the compliance to all the rules that apply to the product into which this certified RF module is integrated. Additional testing and certification may be necessary when multiple modules are used.A 20cm minimum distance has to be able to be maintained between the antenna and the users for the host this module is integrated into. Under such configuration, the FCC radiation exposure limits set forth for a population/uncontrolled environment can be satisfied. Further RF exposure shall be re-evaluated to the scenario of portable, and collocated use. USER MANUAL OF THE END PRODUCT:In the user manual of the end product, the end user has to be informed to keep at least 20cm separation with the antenna while this end product is installed and operated. The end user has to be informed that the FCC radio-frequency exposure guidelines for an uncontrolled environment can be satisfied.The end user has to also be informed that any changes or modifications not expressly approved by the manufacturer could void the user’s authority to operate this equipment.Preliminary Information
Page 13Rev 0.7 © MMB Networks 2018 BSB03PA1x Module Data Sheet9.1.4 | Labeling Requirements The user of this device is responsible for meeting the FCC labeling requirements. A clearly visible label on the exterior enclosure of an incorporating device must list the MMB Research Inc. FCC ID “XFF-BSB03PA1X” and the FCC Notice above (section 9.1.1). The exterior label should use the wording “Contains” or “Contains Transmitter Module”. For example:Contains FCC ID: XFF-BSB03PA1XorContains Transmitter Module FCC ID: XFF-BSB03PA1XAny similar wording that expresses the same meaning may be used. If the labelling area is smaller than the palm of the hand, then additional FCC part 15.19 statement is required to be available in the users manual: This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation.LABEL OF THE END PRODUCT:The final end product must be labeled in a visible area with the following “Contains TX FCC ID: XFF-BSB03PA1X”. If the labelling area is larger than the palm of the hand, then the following FCC part 15.19 statement has to also be available on the label: This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation.9.2 | Industry Canada (IC) Note: this section applies to BSB03PA1x-CHP and BSB03PA1x-RFC devices only.9.2.1 | Approved AntennaeFor the BSB03PA1x-CHP modules using the onboard chip antenna, the approved power level settings are -2 dBm for channels 11-25 and -20 dBm for channel 26.For the BSB03PA1x-RFC modules using the approved external antenna, the approved power level settings are -11 dBm for channels 11-25 and -26 dBm for channel 26.9.2.2 | IC NoticeThis device complies with Industry Canada licence-exempt RSS standard(s).Operation is subject to the following two conditions: (1) this device may not cause interference, and(2) this device must accept any interference, including interference that may cause undesired operation of the device.Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence.L’exploitation est autorisée aux deux conditions suivantes : (1) l’appareil ne doit pas produire de brouillage, et (2) l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement.Preliminary Information
Page 14Rev 0.7 © MMB Networks 2018 BSB03PA1x Module Data Sheet9.2.3 | Labeling RequirementsThe host device shall be properly labelled to identify the modules within the host device. The Industry Canada certification label of a module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labelled to display the Industry Canada certification number of the module, preceded by the words “Contains transmitter module”, or the word “Contains”, or similar wording expressing the same meaning, as follows:Contains transmitter module IC: 8365A-BSB03PA1XContient le émetteur radio IC: 8365A-BSB03PA1X 9.3 | EUNote: this section applies to BSB03PA1x-CHP and BSB03PA1x-RFC devices only.BSB03PA1x-CHP and BSB03PA1x-RFC devices are compliant with the following EU standards: ETSI EN 300 328 (v1.9.1), ETSI EN 301 489 1 (v1.9.2) and ETSI EN 301 489 17 (v2.2.1), provided that the transmit power level is set to -2 dBm (if on-board antenna is used) or -11 dBm (if whip antenna is used).These devices are also compliant with 2014/53/EU.9.4 | RoHS ComplianceThe BSB03PA1X devices do not contain any substances in excess of the maximum concentration allowed by Directive 2002/95/EC. The module is RoHS compliant.10 | Revision HistoryRevision Date Comments0.7 2018/02/13Added Debug and Programming Section, Updated FCC/IC section0.6 2017/11/21Updated dimensions, package type, and ordering information0.5 2017/10/04 Regulatory Information added0.4 2017/09/15 New SKU names, minor updates0.3 2017/08/24 Added PA11 and PA12 variants0.2 2017/07/10 Minor updates0.1 2017/05/29 Initial draftPreliminary Information
Page 15Rev 0.7 © MMB Networks 2018 BSB03PA10x Module Data SheetCopyright © 2018 MMB Research Inc. All rights reserved.The information in this document is subject to change without notice. This document is believed to be accurate and reliable, but the statements contained herein are presented without expressed or implied warranty.MMB Networks is a division of MMB Research Inc RapidSE, RapidHA, and RapidConnect are trademarks of MMB Research Inc. All other trademarks are the property of their respective holders.February 2018500 -243 College StreetToronto, Ontario, CanadaM5T 1R5416.636.3145info@mmbnetworks.comwww.mmbnetworks.com11 | Ordering InformationHW SKUMax Output Power (dBm)RF Output Option StatusBSB03PA10-CHP 19.5 Chip Antenna Engineering SamplesBSB03PA10-RFC 19.5 RF Connector Engineering SamplesBSB03PA10-PIN 19.5 Module Pad 1 Engineering SamplesBSB03PA11-CHP 16.5 Chip Antenna Engineering SamplesBSB03PA11-RFC 16.5 RF Connector Engineering SamplesBSB03PA11-PIN 16.5 Module Pad 1 Engineering SamplesBSB03PA12-CHP 8 Chip Antenna Engineering SamplesBSB03PA12-RFC 8 RF Connector Engineering SamplesBSB03PA12-PIN 8 Module Pad 1 Engineering SamplesNote: The above table provides the HW SKU which forms the first part of the complete part number. The complete part number takes the format: BSB03PA1x-yyy-r-zzz.Where r is the regulatory region (E=Europe, N=North America), and zzz represents a three digit programming code.Contact your local MMB sales representative to determine the correct programming code for your application.Preliminary Information

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