Linudix WMGMR01 802.11 WIRELESS LAN SIP MODULE User Manual WM G MR 01 v27 01192006

Linudix Co. Ltd. 802.11 WIRELESS LAN SIP MODULE WM G MR 01 v27 01192006

USERS MANUAL

All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. 1 Data Sheet of 802.11g WM-G-MR -01 B2B Wireless LAN Module Data Sheet Jan 19th. 2006 Rev 2.7 802.11g Wireless LAN SiP Module (WM-G-MR -01) www.usi.com.tw
802.11g Wireless LAN SiP Module V2.7 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. 3 Change Sheet Rev. Date Description of change Approval & Date Page Par Change(s) 1.0 09/14/04 All All Draft version for Review 1.1 11/12/04 Update the pin assignment Update the mechanical drawing 2.0 12/25/04 Update the picture & outpower of 802.11g 2.1 04/11/05 6,15,21 1. Updated Executive summary for available date from “the middle of 1Q 2005” to “the end of 2Q 2005”. 2.Update the mechanical drawing (more specific one) ; update pin description for xxx_B is from “ Active low” to Active high” 2.2 04/28/05 21,22 1. Update Pin”A10” pin definition from “left open no use” to “ using as address line for CIS and memory access “and Type change from “No connection “ to “ Input PD 5VT” 2.3 04/28/05 14 1. Update Power consumption and sensitivity 2.4 11/8/05 21,22,23, 24 Add SDIO Pin Definition 2.5 11/28 8, 15, 18, 23 1. Operation Voltage 2. Temperature 3. Radio Specification 4. Radio Pre-test 5. Drawing of Pin definition 2.6 01/06/06 9,15 4.3.2 4.5 1.IOH ; IOL value is corrected to typical not Min 2.Remove VOH on Min. 3.Tx output power add 12,24,36Mbps on the power range 14 +/-1dBm ; 12+/-1 dBm is for 48;54Mbps 2.7 01/19/06 15 4.5 Update 802.11b output power tolerance from +1.5/-1.0 dBm to +2.0/-1.0 dBm
802.11g Wireless LAN SiP Module V2.7 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. 4 TABLE OF CONTENTS 1. SUMMARY........................................................................................................................................6 2. DELIVERABLES .............................................................................................................................6 3. REFERENCE DOCUMENTS.........................................................................................................7 4. TECHNICAL SPECIFICATION .....................................................................................................7 4.1. ABSOLUTE MAXIMUM RATING...............................................................................................7 4.2. RECOMMENDABLE OPERATION CONDITION......................................................................8 4.2.1. TEMPERATURE, HUMIDITY.............................................................................................8 4.2.2 SUPPLY VOLTAGE...........................................................................................................8 4.3. COMPACTFLASH SPECIFICATION.........................................................................................9 4.3.1. DC ELECTRICALS.............................................................................................................9 4.3.2. AC ELECTRICALS.............................................................................................................9 4.3.3. COMPACTFLASH PROTOCAL TIMING.........................................................................10 4.4. WIRELESS SPECIFICATIONS................................................................................................15 4.5. RADIO SPECIFICATIONS 802.11G........................................................................................15 4.6. RECEIVER SPECIFICATIONS................................................................................................15 4.7. DIMENSIONS, WEIGHT AND MOUNTING.............................................................................16 4.7.1. DIMENSIONS...................................................................................................................16 4.7.2. WEIGHT............................................................................................................................16 4.7.3. MOUNTING......................................................................................................................16 4.8. SHOCK AND VIBRATION........................................................................................................16 5. COMPATIBILITY AND INTEROPERABILITY .........................................................................17 5.1. WI-FI LOGO..............................................................................................................................17 5.2. WHQL COMPLIANCE..............................................................................................................17 6. CONFIGURABILITY .....................................................................................................................17 7. SECURITY ......................................................................................................................................17 8. OPERATING SYSTEM COMPATIBILITY.................................................................................17 9. LEGAL, REGULATORY & OTHER TECHNICAL CONSTRAINTS .....................................17 9.1. EMC..........................................................................................................................................18 9.2. COMPONENT SPECIFICATION.............................................................................................18 9.3. RADIO PRETEST.....................................................................................................................19 9.4. PRODUCT MARKING..............................................................................................................20 9.5. ENVIRONMENTALLY SAFE MATERIAL RESTRICTIONS....................................................21
802.11g Wireless LAN SiP Module V2.7 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. 6 1. SUMMARY The WM-G-MR-01 module - is one of the product families in USI’s product offering, targeting for system integration requiring a smaller form factor. It also provides the standard migration to high data rate to USI’s current SIP customers. The WM-G-MR-01 module providing B to B type connector is provided as option for customers, who want to have Board to board type assembly. This document outlines the product requirements for a “system in Package” 802.11g/(b) module – here after referred as WM-G-MR-01 Module. - The WM-G-MR-01 module is restricted to mobile and fixed operation at 20cm from the body.. 2. DELIVERABLES The following products and software will be part of the product. WM-G-MR-01 Module with packaging Evaluation kits Software utility which supporting customer for integration, performance test, and homologation. Capable of testing, loading (firmware) and configuring (MAC, CIS) for the WM-G-MR-01 module. Unit Test / Qualification report Product Specifications. Agency certification pre-test report base on adapter boards
802.11g Wireless LAN SiP Module V2.7 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. 7 3. REFERENCE DOCUMENTS C.I.S.P.R. Pub. 22 "Limits and methods of measurement of radio interference characteristics of information technology equipment." International Special Committee on Radio Interference (C.I.S.P.R.), Third Edition, 1997. CB Bulletin No. 96A "Adherence to IEC Standards: “Requirements for IEC 950, 2nd Edition and Amendments 1 (1991), 2(1993), 3 (1995) and 4(1996). Product Categories: Meas, Med, Off, Tron." IEC System for Conformity Testing to Standards for Safety of Electrical Equipment (IECEE), April 2000. CFR 47, Part 15-B "Unintentional Radiators". Title 47 of the Code of Federal Regulations, Part 15, FCC Rules, Radio Frequency Devices, Subpart B. CFR 47, Part 15-C "Intentional Radiators". Title 47 of the Code of Federal Regulations, Part 15, FCC Rules, Subpart C. URL: http://www.access.gpo.gov/nara/cfr/waisidx_98/47cfr15_98.html CSA C22.2 No. 950-95 "Safety of Information Technology Equipment including Electrical Business Equipment, Third Edition." Canadian Standards Association, 1995, including revised pages through July 1997. EN 60 950 "Safety of Information Technology Equipment Including Electrical Business Equipment." European Committee for Electrotechnical Standardization (CENELEC), 1996, (IEC 950, Second Edition, including Amendment 1, 2, 3 and 4). IEC 950 "Safety of Information Technology Equipment Including Electrical Business Equipment." European Committee for Electrotechnical Standardization, Intentional Electrotechnical Commission. 1991, Second Edition, including Amendments 1, 2, 3, and 4. IEEE 802.11 “Wireless LAN Medium Access Control (MAC) And Physical Layer (PHY) Specifications.” Institute of Electrical and Electronics Engineers. 1999. 4. TECHNICAL SPECIFICATION The WM-G-MR-01 is a B2B type assembly part, technical supporting. 4.1. ABSOLUTE MAXIMUM RATING Supply Power Max +3.6 Volt Non Operating Temperature - 40° to 85° Celsius Voltage ripple +/- 2% 10KHz~100KHz Max. Values not exceeding Operating voltage
802.11g Wireless LAN SiP Module V2.7 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. 8 4.2. RECOMMENDABLE OPERATION CONDITION 4.2.1. TEMPERATURE, HUMIDITY WM-G-MR-01 module supports the operational requirements as listed in the table below. Operating Temperature -5° to 60° Celsius Humidity range Max 95% Non condensing, relative humidity 4.2.2 SUPPLY VOLTAGE Power supply for the WM-G-MR-01 module will be provided by the host via the power pins Voltage : VDD Operating Voltage 3.0~3.5 Volt 4.2.3 SUPPLY CURRENT 802.11b/g Current (3.3V, 25 degree C) Condition Minimum Typical Maximum Transmit (54Mbps, 12 dBm) - 480 mA 520 mA Transmit (6Mbps, 14 dBm) - 500 mA 540 mA Transmit (11Mbps, 14 dBm) - 485 mA 530 mA Receive (54Mbps, -70 dBm) - 275 mA 300 mA Receive (11Mbps, -70 dBm) - 255 mA 280 mA Sleep connected average* - 8 mA 15 mA Deep Sleep** - 1.2 mA 2.0 mA Maximum Current (Full temperature and voltage range) Condition Maximum Transmit (54Mbps, 12 dBm) 570 mA Transmit (6Mbps, 14 dBm) 590 mA Transmit (11Mbps, 14 dBm) 580 mA Receive (54Mbps, -70 dBm) 320 mA Receive (11Mbps, -70 dBm) 300 mA * The sleep-connected current is measured under Marvell Linux V4 driver, with 100ms beacon interval and skipping 2 beacons. ** The Deep Sleep current is measured under Marvell Linux V4 driver.
802.11g Wireless LAN SiP Module V2.7 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. 9 4.3. COMPACTFLASH SPECIFICATION 4.3.1. DC ELECTRICALS The DC specification is under 3.3 voltage. Over full range of values specified in the “Recommended Operation Condition” unless specified. Power supply : VDD=3.3V Symbol Parameter Condition Min Typ Max Units VIH Input high voltage 0.5 VDD - VDD+0.5 V VIL Input low voltage -0.5 - 0.35VDD V VOH Output high voltage 2.4 - - V VOL Output low voltage - - 0.4 V 4.3.2. AC ELECTRICALS The DC specification is under 3.3 voltage. Over full range of values specified in the “Recommended Operation Condition” unless specified. Power supply : VDD = 3.3V Symbol Parameter Condition Min Typ Max Units IOH Input high voltage =0.7 VDD 11.3 32 mA IOL Input low voltage =0.18VDD 10.5 38 mA VOH Output high voltage 0.2VDD- 0.6VDD 0.518 4.0 V/ns VOL Output low voltage 0.6VDD-0.2VDD - 0.592 4.0 V/ns
802.11g Wireless LAN SiP Module V2.7 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. 10 4.3.3. COMPACTFLASH PROTOCAL TIMING 4.3.3.1. RESET SPECIFICATION
802.11g Wireless LAN SiP Module V2.7 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. 11 4.3.3.2. ATTRIBUTE MEMORY READ/WRITE TIMING SPECIFICATION
802.11g Wireless LAN SiP Module V2.7 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. 12
802.11g Wireless LAN SiP Module V2.7 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. 13 4.3.3.3. I/O READ/WRITE TIMING SPECIFICATION
802.11g Wireless LAN SiP Module V2.7 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. 14
802.11g Wireless LAN SiP Module V2.7 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. 15 4.4. WIRELESS SPECIFICATIONS The WM-G-MR-01 module complies with the following features and standards; Features Description WLAN Standards IEEE 802 Part 11g/b Antenna No Antenna diversity supported Data Rates 1,2,5.5, 11, 6,9, 12,18, 24,36,48,54 Mbps Medium Access Protocol CSMA/CA (Collision Avoidance) with ACK Network Access Ad-hoc, Infrastructure 4.5. RADIO SPECIFICATIONS 802.11G Over full range of values specified in the “Recommended Operation Condition” unless specified otherwise. Features Description Frequency Band 2.4000 – 2.4835 GHz (2.4 GHz ISM Band) Number of selectable Sub channels 11 channels Modulation OFDM, DSSS (Direct Sequence Spread Spectrum), DBPSK, DQPSK, CCK , 16QAM, 64QAM Supported rates 1, 2, 5.5, 11, 6, 9, 12, 18, 24, 36, 48, 54 Mbps Maximum receive level - 10dBm (with PER < 8%) Output Power 14 dBm +2.0/-1.0 dBm for 1, 2, 5.5, 11Mbps 14 dBm +/- 1.0 dBm for 6, 9, 12, 18, 24, 36Mbps 12 dBm +/- 1.0 dBm for 48, 54Mbps 4.6. RECEIVER SPECIFICATIONS Receiver Characteristics ( 3.3V, 25 degree C ) Typical Max. Unit PER <8%, Rx Sensitivity @ 11 Mbps -87 -85 dBm PER <8%, Rx Sensitivity @ 5.5 Mbps -89 -87 dBm PER <8%, Rx Sensitivity @ 2 Mbps -90 -88 dBm PER <8%, Rx Sensitivity @ 1 Mbps -92 -90 dBm PER <10%, Rx Sensitivity @ 54 Mbps -72 -70 dBm
802.11g Wireless LAN SiP Module V2.7 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. 16 4.7. DIMENSIONS, WEIGHT AND MOUNTING The following paragraphs provide the information for the size, weight and mounting of the WM-G-MR-01 module. 4.7.1. DIMENSIONS The size and thickness of the WM-G-MR-01 module is listed below: 4.7.2. WEIGHT Weight less than 3 gram including the shielding. 4.7.3. MOUNTING The WM-G-MR-01 module is B2B mounted type component. The B2B connector and additional screw hole provide mounting mechanism to secure the WM-G-MR-01 module against vibration and shock on the host system. 4.8. SHOCK AND VIBRATION All shock and vibration test is performed by using an interface adapter card. Additional shock and vibration tests can be performed – on request – by using the real host being PDA, Textbook or any other application. Vibration Operating Frequency sweep from 3-150-3 Hz with a constant 0.25 G input Non-Operational Frequency sweep from 3-150-3 Hz with a constant 0.5 G input Shock
802.11g Wireless LAN SiP Module V2.7 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. 17 Operational 25 G peak within 3.75 msec in normal base position Non-Operational 65 G peak in 3.75 msec in normal base position. 30 G within 8 msec square or trapezoidal shock in + and - direction along the 3 axis. (Total 6 shocks) Note: Above tests are executed without packaging material. 5. COMPATIBILITY AND INTEROPERABILITY 5.1. WI-FI LOGO There is no module level WiFi applied for WM-G-MR-01 module. Wi-Fi certification is dependent on the OS capability and application of the host system. The certification will be base on customer’s request. 5.2. WHQL COMPLIANCE Not required for WM-G-MR-01 module 6. CONFIGURABILITY No user configuration needed. The CIS and MAC Address will be loaded during production of the WM-G-MR-01 module. 7. SECURITY The WM-G-MR-01 module supports WEP64/128, WPA , AES-CCM which including TKIP (full version TKIP SSN /WPA) . Refer to Marvell Libertas solution. 8. OPERATING SYSTEM COMPATIBILITY Drivers are supported for the following OS: Windows CE 3.0 /.NET , WinCE 4.2, Win CE 5.0 Linux. Pocket PC 2003, 2004, 2005 9. LEGAL, REGULATORY & OTHER TECHNICAL CONSTRAINTS The WM-G-MR-01 module is pre-tested to ensure that all requirements met as set forth in the following sections. Final certification (module certification) requires the antenna of targeted system with a lead-time of 6 weeks. The product deliverable shall be a pre-tested WM-G-MR-01 module. No module level certification on WM-G-MR-01 module.
802.11g Wireless LAN SiP Module V2.7 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. 18 9.1. EMC The module will be pre-tested to ensure that we can certify the product in the following countries when final certification will be performed on products and or platforms. US. FCC CFR47 Part 15-B, Class B Canada. CSA C22.2, Class B Europe. 89/336/EEC, EMC Directive, including CE Mark ETS300 826, EMC standard for 2.4GHz wideband transmission systems EN55022, Class B (Emissions) EN50082-1 (Immunity) EN61000-3-2 (Harmonic AC current emissions) Japan. VCCI Standard, Class 2 (Emissions) Korea (MIC) 9.2. COMPONENT SPECIFICATION All components used in this device meet the following component approval requirements. PRINTED WIRING BOARDS: The printed wiring boards shall be Underwriters Laboratories Inc. "Recognized Component" (ZPMV2) under the category for Printed Wiring Boards, and shall be flammability rated 94V-1 or less flammable. The board material shall be rated 130°C minimum. CONNECTORS: Any connectors, if used, shall be Underwriters Laboratories, Inc. "Recognized" (ECBT2/RTRT2) in accordance with the requirements in the UL Standard for Safety, UL 498. Any polymeric connector housing shall be molded of plastics rated UL 94V-2 or less flammable when tested to UL 94. WIRING: Any wiring material, if used, shall be UL Recognized Component Appliance Wiring Material (AVLV2). Wire shall be minimum rated 30V, 105°C. PLASTIC PARTS - Any plastic parts used shall be molded of plastics that are UL "Recognized" (QFMZ2) and rated UL 94V-2 or less flammable when tested to UL 94. “PB FREE” - The entire component Suppliers has to support Green requirement base on USI’s policy. All of the components which including process and materials has to be Lead Free and RoHS Compliance.
802.11g Wireless LAN SiP Module V2.7 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. 19 9.3. RADIO PRETEST The WM-G-MR-01 module is tested with adapter card to comply with following standard. The testing is to assure the performance of regulatory requirement on module. Final certification will be conducted on system level: US/CAN: FCC CFR47 Part 15.247 Japan: TELEC Europe: CE EN 300 328
802.11g Wireless LAN SiP Module V2.7 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. 20 9.4. PRODUCT MARKING The Module is marked which containing the following information: Description: WM-G-XX-XX Serial number: yyllwkxxxx Revision: format to follow USI revision level in PDM System For the serial number the following format will be followed: yy = last two digits of current year ll = Assembly Location: UT = USI Taiwan UM = USI Mexico UC = USI China wk = current week (week period = starting on Monday) xxxx = consecutive number, starting at 0000 at beginning of each week.
802.11g Wireless LAN SiP Module V2.7 All rights are reserved by USI. No part of this technical document can be reproduced in any form without permission of USI. 21 9.5. ENVIRONMENTALLY SAFE MATERIAL RESTRICTIONS The use of polychlorinated biphenyls (PCB’s) is prohibited (specifically) as dielectric in capacitors or transformers. Electrolytic capacitors shall not be composed of any quaternary salt ammonium and/or gamma-butyrolactone (i.e. no el caps allowed). No CFC's (chlorofluorocarbons) shall be used anywhere in the manufacture of this product. The use of tantalum capacitors should be minimized in any product of the product family [including the power-supply]. Where the use of tantalum caps cannot be avoided, provisions must be made in the manufacturing process to prevent reverse polarization. The WM-G-MR-01 module hardware design should take the safety of operation into consideration and prevent the potential risk on Labor safety for manufacturing process. 9.6. FCC Warning Statements THIS DEVICE COMPLIES WITH PART 15 OF THE FCC RULES. OPERATION IS SUBJECT TO THE FOLLOWING TWO CONDITIONS: (1) THIS DEVICE MAY NOT CAUSE HARMFUL INTERFERENCE, AND (2) THIS DEVICE MUST ACCEPT ANY INTERFERENCE RECEIVED, INCLUDING INTERFERENCE THAT MAY CAUSE UNDESIRED OPERATION. NOTE: THE MANUFACTURER IS NOT RESPONSIBLE FOR ANY RADIO OR TV INTERFERENCE CAUSED BY UNAUTHORIZED MODIFICATIONS TO THIS EQUIPMENT. SUCH MODIFICATIONS COULD VOID THE USER¡¯S AUTHORITY TO OPERATE THE EQUIPMENT.

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