Li Seng Technology LSN51822 Bluetooth LE module User Manual 1

Li Seng Technology Limited Bluetooth LE module 1

Users Manual

Li Seng Wireless MCU Solution Bluetooth Low Energy (BLE) Module LSN51822 User Manual / User Guide Jun, 2014 1
Overview LSN51822 Bluetooth Low Energy (BLE) Module has developed by LI SENG Technology Ltd. It’s built in Nordic nRF51822 chip to achieve Bluetooth Core Specification for Low Energy - Single Mode Design. Up to date , it can support Nordic SoftDevices S110 or S120 for Slave and Master Mode respectively. Li Seng provided LSN51822 without module programming and it’s target for customer own development. If customer require module programming , Firmware Development, Test Jig Development…etc. please contact for details. LSN51822 provide Ultra Low Power Consumption base on its’ Cortex M0 CPU . It can also work with another proprietary 2.4GHz concurrently.  Cortex M0 chip set, provide Ultra Low Power Platform  Support One Chip Solution by using 51822 as Main Controller or work with another MCU since extra hardware requirements…like Scale or Blood Pressure Application…etc.  Nordic PPI ( Programmable Peripheral Interconnect) System to save more power  Support UART, SPI, TWI, GPIO...etc.  Pins Swap Ability , provide simple layout of Main PCB.  Built in 8x 10-bit ADC  Support Single Mode “Master”or “Slave”Mode*  Support OTA Firmware Upgrade by DFU Bluetooth Low Energy Module : LSN51822 Specification Features Li Seng Technology Ltd. reserved the right to update and correct the data , information in latest status. LSN51822 2
nRF51822 Chip Overview 3
Module Overview 4
Installation Guide (1/2) 5 1) Check LSN51822 Module connection pin is clean for soldering. Finished Assembly 1 2 3 1 2) Ready the Master PCB which will connect with LSN51822 Module. Check connection pads is clean for soldering. 3) Place the Module on the Master PCB. Then solder it in sequence : 3 2 1 3 2 Master PCB (examples)
Installation Guide (2/2) 6 Finished Assembly 4) After soldering, Check all pads are well connected. 4 5 5) Connect DC Power 1.8-3.6V on VDD(Vcc / BAT+) and GND on Master PCB. The Module will work as firmware preloaded. VDD GND
Pin Name & Dimension Antenna 22.0 x 15.2 x (1.8) mm 7
BLE Module Placement Tips 1) To enable DTM mode for R/F Test like BLE fix frequency Test, FCC test…etc., RXD and TXD pad require to connect to RF Equipment though RS232. RXD and TXD pad located on the back side of the module. Reserve hole at Main PCB for soldering RXD & TXD pads for RF Equipment . 2) Module Soldering on Main PCB, ensure antenna overlap area do NOT cover Main PCB Wiring or Ground area, it’s suggested to reserve Min. 5mm apart from Module Antenna. 3) Connect All Module Ground Pads to main PCB Ground to obtain better performance. 4) BLE Module (Antenna) placement inside the product, it need to avoid to get close to Metal Part, LCD, Battery…etc. since it’s affect the RF performance. Min. 5mm Min. 5mm Main PCB Wiring / GND Main PCB Wiring / GND 8 End
FCC Statement: The final end product must be labeled in a visible area with the following "Contains TX FCC ID:RR3-LSN51822". If the size of the end product is smaller than 8x10cm, then additionalFCC part 15.19 stayement is required to be availale in the users manual: This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: —Reorient or relocate the receiving antenna. —Increase the separation between the equipment and receiver. —Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. —Consult the dealer or an experienced radio/TV technician for help. Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. FCC Radiation Exposure Statement:This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.Due to missing shielding the module is strictly limited to integration by the Grantee himself or his dedicated OEM integrator under control of the Grantee.However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.This device is intended only for OEM integrators under the following conditions:1)This module is granted as a Limited Modular Approval.2)This device has been designed to operate with a PCB antenna having a maximum gain of 0dBi.Only this type of antenna may be used.

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