Laird Connectivity SIFLEX2HP SiFLEX-02HP User Manual Revison v0 7

LS Research, LLC SiFLEX-02HP Users Manual Revison v0 7

Users Manual Revison v0.7

SiFLEX02-HP TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. 330-0047-R0.7 Copyright © 2010-2011 LS Research, LLC Page 1 of 35 Integrated Transceiver Modules for ZigBee / 802.15.4 (900 MHz) Development Kit Available FEATURES • 650mW output power • Long range • Up to 1Mbps RF data rate • Miniature footprint: 0.9” x 1.63” • Multiple antenna options • Dual antennas • Agency Approvals: FCC and IC • Powerful Atmel 256k ATXMEGA256A3 with 802.15.4 MAC or ZigBee Stack • LSR serial interface based on 802.15.4 MAC • Low power operation • RoHS compliant • Streamlined development with LSR design services. • License options available to purchase design or integrate design. APPLICATIONS • Security • Lighting Control • HVAC Control • Sensor Networks • Medical • Industrial Automation DESCRIPTION The SiFLEX02-HP module is a high performance 900MHz IEEE 802.15.4 radio (AT86RF212 & RF amplifier circuit) and microcontroller (ATXMEGA256A3) in a cost effective, pre-certified footprint. The module comes preloaded with the LSR host serial interface running on top of the Atmel 802.15.4 MAC. Full debug and programming capabilities are included to develop custom applications. Easily load the ZigBee stack or 802.15.4 MAC onto the module and create your own network. Need to get to market quickly? Not an expert in 802.15.4 or ZigBee? Need a custom antenna? Would you like to own the design? Would you like a custom design? Not quite sure what you need? Do you need help with your host board? LS Research Design Services will be happy to develop custom hardware or software, integrate the design, or license the design so you can manufacture yourself. Contact us at sales@lsr.com or call us at 262-375-4400. ORDERING INFORMATION Order Number Description 450-0047 SiFLEX02-HP Module with u.fl connectors for external antennas 450-0049 SiFLEX02-HP Module with castellated RF traces for off board antenna. Note: See Antenna Options section for more details. SiFLEX02-HP Dev Kit Table 1 Orderable SiFLEX02-HP Model Numbers
SiFLEX02-HP TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. 330-0047-R0.7 Copyright © 2010-2011 LS Research, LLC Page 2 of 35 MODULE ACCESSORIES Order Number Description 001-0002 900 MHz Dipole Antenna with Reverse Polarity SMA Connector 080-0001 u.fl to Reverse Polarity SMA Bulkhead Cable 105mm
SiFLEX02-HP TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. 330-0047-R0.7 Copyright © 2010-2011 LS Research, LLC Page 3 of 35 BLOCK DIAGRAM ATXMEGA256A3(Microcontroller) AT86RF212(802.15.4 Radio)RF Front EndPower Amplifier / LNASPIAntennaSerial I/OAnalogGPIOPGM/DBG TMR/PWMAntenna Figure 1 SiFLEX02-HP Module Block Diagram – High-Level DEVELOPMENT KIT The SiFLEX02-HP Development Kit can be used out of the box to evaluate RF range performance with the simple press of a button. Users interested in further investigating the performance and capabilities of the SiFLEX02-HP Module can use the ModFLEXTM Test Tool. This PC-based software can demonstrate just how easy it is to send & receive data, collect performance data, change channels, power levels, or addresses using the LSR Serial Host Protocol with another microcontroller. More advanced users can use the development board to create and debug their own software for the SiFLEX02-HP module using the 802.15.4 MAC or ZigBee stack from Atmel. Part Number Description SiFLEX02-HP Dev Kit Figure 2 SiFLEX02-HP Development Board Kit Contents • ModFLEXTM Development Board with SiFLEX02-HP Module with external antennas (x2) • USB Cable (x2) • AA Batteries (x4) • Software & Technical Information CD
SiFLEX02-HP TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. 330-0047-R0.7 Copyright © 2010-2011 LS Research, LLC Page 4 of 35 TABLE OF CONTENTS FEATURES .......................................................................................................................... 1 APPLICATIONS ................................................................................................................... 1 DESCRIPTION ..................................................................................................................... 1 ORDERING INFORMATION ................................................................................................ 1 MODULE ACCESSORIES ................................................................................................... 2 BLOCK DIAGRAM ............................................................................................................... 3 DEVELOPMENT KIT............................................................................................................ 3 Kit Contents ................................................................................................................................................. 3 MODULE PINOUT AND PIN DESCRIPTIONS .................................................................... 6 MODULE OVERVIEW ........................................................................................................ 10 Microcontroller .......................................................................................................................................... 10 Radio .......................................................................................................................................................... 12 RF Front End (Power Amplifier and LNA) ............................................................................................... 13 Antenna Options ....................................................................................................................................... 14 OPERATING MODES TRUTH TABLE .............................................................................. 15 MODES OF OPERATION .................................................................................................. 16 Host Microcontroller ................................................................................................................................. 16 Software Stacks ........................................................................................................................................ 16 DEVELOPMENT TOOLS ................................................................................................... 18 AVR Studio................................................................................................................................................. 18 Eclipse ........................................................................................................................................................ 18 WinAVR ...................................................................................................................................................... 18 AVR JTAGICE mkII .................................................................................................................................... 18 AVRISP mkII ............................................................................................................................................... 18 IAR Embedded Workbench for Atmel AVR ............................................................................................ 18 ELECTRICAL SPECIFICATIONS ...................................................................................... 19 Absolute Maximum Ratings ..................................................................................................................... 19 Recommended Operating Conditions .................................................................................................... 19 General Characteristics ............................................................................................................................ 20
SiFLEX02-HP TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. 330-0047-R0.7 Copyright © 2010-2011 LS Research, LLC Page 5 of 35 RF Characteristics .................................................................................................................................... 21 SOLDERING RECOMMENDATIONS ................................................................................ 24 Recommended Reflow Profile for Lead Free Solder ............................................................................. 24 CLEANING ......................................................................................................................... 25 OPTICAL INSPECTION ..................................................................................................... 25 REWORK ........................................................................................................................... 25 SHIPPING, HANDLING, AND STORAGE ......................................................................... 25 Shipping ..................................................................................................................................................... 25 Handling ..................................................................................................................................................... 25 Moisture Sensitivity Level (MSL) ............................................................................................................. 25 Storage ....................................................................................................................................................... 25 Repeating Reflow Soldering .................................................................................................................... 25 AGENCY STATEMENTS ................................................................................................... 26 MECHANICAL DATA......................................................................................................... 32 PCB Footprint .................................................................................................. Error! Bookmark not defined. General Module Dimensions .................................................................................................................... 32 COMPATIBILITY ................................................................................................................ 33 MODULE REVISION HISTORY ......................................................................................... 34 Rev 1.1 ........................................................................................................................................................ 34 CONTACTING LS RESEARCH ......................................................................................... 35
SiFLEX02-HP TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. 330-0047-R0.7 Copyright © 2010-2011 LS Research, LLC Page 6 of 35 MODULE PINOUT AND PIN DESCRIPTIONS MCU# GND 1 SiFLEX02-HP (Atmel ATXMEGA256A3) 69 GND MCU# - GND 2 68 GND - - GND 3 67 GND - - NC 4 66 NC - - NC 5 65 NC - - VPA 6 64 NC - - VPA 7 63 NC - - NC 8 62 NC - 10 JTAG TMS 9 61 PC5 21 11 JTAG TDI 10 60 PC6 22 12 JTAG TCK 11 59 PC7 23 13 JTAG TDO 12 58 PC4 20 56 JTAG/PDI/JRST 13 57 PE0 36 57 nRESET 14 56 PE1 37 62 PA0 15 55 NC - - NC 16 54 NC - 64 PA2 17 53 NC - 63 PA1 18 52 NC - 5 PA7 19 51 NC - 2 PA4 20 50 NC - 3 PA5 21 49 NC - 4 PA6 22 48 NC - 7 PB1 23 47 NC - 8 PB2 24 46 NC - 9 PB3 25 45 NC - - VCC - 3V3DC 26 44 GND - 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 PF3 PF2 PF1 PF0 PE5 PE4 PE3 PE2 PC3/UART TX PC2/UART RX PC1 PC0 PF5 PF6 PF7 PA3 NC MCU# 49 48 47 46 41 40 39 38 19 18 17 16 51 54 55 1 - MCU# Figure 3 Module Pinout
SiFLEX02-HP TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. 330-0047-R0.7 Copyright © 2010-2011 LS Research, LLC Page 7 of 35 Module Pin Name MCU Pin Type Description 1 GND N/A GND Ground 2 GND N/A GND Ground 3 GND N/A GND Ground 4 NC N/A NC No Connect 5 NC N/A NC No Connect 6 VPA N/A PWR RF Power Amplifier Supply Voltage For 650mW output power provide 4.0VDC For .5W output power provide 3.3VDC 7 VPA N/A PWR RF Power Amplifier Supply Voltage For 650mW output power provide 4.0VDC For .5W output power provide 3.3VDC 8 NC N/A NC No Connect 9 JTAG TMS 10 I/O General-purpose digital I/O (PB4), Analog input, JTAG TMS 10 JTAG TDI 11 I/O General-purpose digital I/O (PB5), Analog input, JTAG TDI 11 JTAG TCK 12 I/O General-purpose digital I/O (PB6), Analog input, JTAG TCK 12 JTAG TDO 13 I/O General-purpose digital I/O (PB7), Analog input, JTAG TDO 13 JTAG/PDI/JRST 56 I/O PDI/PDI_DATA 14 nRESET 57 Input RESET/PDI_CLOCK 15 PA0 62 I/O General-purpose digital I/O, Analog input, Analog REF A 16 NC N/A NC No Connect 17 PA2 64 I/O General-purpose digital I/O, Analog input, Analog comparator 2 18 PA1 63 I/O General-purpose digital I/O, Analog input, Analog comparator 1 19 PA7 5 I/O General-purpose digital I/O, Analog input, Analog comparator output 20 PA4 2 I/O General-purpose digital I/O, Analog input 21 PA5 3 I/O General-purpose digital I/O, Analog input 22 PA6 4 I/O General-purpose digital I/O, Analog input 23 PB1 7 I/O General-purpose digital I/O, Analog input 24 PB2 8 I/O General-purpose digital I/O, Analog input 25 PB3 9 I/O General-purpose digital I/O, Analog input 26 VCC - 3V3DC VCC VCC Supply Voltage 27 PF3 49 I/O General-purpose digital I/O, Output Compare, UART Tx 28 PF2 48 I/O General-purpose digital I/O, Output Compare, UART Rx
SiFLEX02-HP TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. 330-0047-R0.7 Copyright © 2010-2011 LS Research, LLC Page 8 of 35 Module Pin Name MCU Pin Type Description 29 PF1 47 I/O General-purpose digital I/O, Output Compare, UART XCK0 30 PF0 46 I/O General-purpose digital I/O, Output Compare 31 PE5 41 I/O General-purpose digital I/O, Output Compare, UART XCK1, SPI MOSI 32 PE4 40 I/O General-purpose digital I/O, Output Compare, SPI SS 33 PE3 39 I/O General-purpose digital I/O, Output Compare, UART Tx 34 PE2 38 I/O General-purpose digital I/O, Output Compare, UART Rx 35 PC3, UART TX 19 I/O General-purpose digital I/O, Output Compare, UART Tx 36 PC2, UART RX 18 I/O General-purpose digital I/O, Output Compare, UART Rx 37 PC1 17 I/O General-purpose digital I/O, Output Compare, IIC SCL 38 PC0 16 I/O General-purpose digital I/O, Output Compare, IIC SDA 39 PF5 51 I/O General-purpose digital I/O 40 PF6 54 I/O General-purpose digital I/O 41 PF7 55 I/O General-purpose digital I/O 42 PA3 1 I/O General-purpose digital I/O, Analog input 43 NC N/A NC No Connect 44 GND N/A GND Ground 45 NC N/A NC No Connect 46 NC N/A NC No Connect 47 NC N/A NC No Connect 48 NC N/A NC No Connect 49 NC N/A NC No Connect 50 NC N/A NC No Connect 51 NC N/A NC No Connect 52 NC N/A NC No Connect 53 NC N/A NC No Connect 54 NC N/A NC No Connect 55 NC N/A NC No Connect 56 PE1 37 I/O General-purpose digital I/O, Output Compare, IIC SCL 57 PE0 36 I/O General-purpose digital I/O, Output Compare, IIC SDA 58 PC4 20 I/O General-purpose digital I/O, Output Compare, SPI SS 59 PC7 23 I/O General-purpose digital I/O, Output Compare, UART Tx, SPI SCK
SiFLEX02-HP TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. 330-0047-R0.7 Copyright © 2010-2011 LS Research, LLC Page 9 of 35 Module Pin Name MCU Pin Type Description 60 PC6 22 I/O General-purpose digital I/O, Output Compare, UART Rx, SPI MISO 61 PC5 21 I/O General-purpose digital I/O, Output Compare, UART XCK1, SPI MOSI 62 NC N/A NC No Connect 63 NC N/A NC No Connect 64 NC N/A NC No Connect 65 NC N/A NC No Connect 66 NC N/A NC No Connect 67 GND N/A GND Ground 68 GND N/A GND Ground 69 GND N/A GND Ground Table 2 SiFLEX02-HP Module Pin Descriptions
SiFLEX02-HP TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. 330-0047-R0.7 Copyright © 2010-2011 LS Research, LLC Page 10 of 35 MODULE OVERVIEW Figure 4 shows the internal interconnects of the ICs on the SiFLEX02-HP module. Consult the respective IC datasheets for details, or contact LSR sales to purchase the SiFLEX02-HP module schematics as part of LSR’s ModFLEX™ design program. For a high-level block diagram of the SiFLEX02-HP module, see Figure 1. AtmelATXMEGA256A3/RSTRX_START/SELMOSIMISOSCLKSLP_TRIRQDIG3 (TX EN)DIG4 (RX EN)RFPower Amplifier / LNA /TX/RX SwitchesPA/LNAPower Supply2627282930313233AtmelAT86RF21281024112322201912DIG1 (ANT_SW)950ANT_SELVPA_AD6Antenna 1Antenna 2Supply Voltage59VGE Figure 4 SiFLEX02-HP Module Block Diagram – Internal Interconnects Microcontroller The XMEGA A3 is a family of low power, high performance and peripheral rich CMOS 8/16-bit microcontrollers based on the AVR® enhanced RISC architecture. By executing powerful instructions in a single clock cycle, the XMEGA A3 achieves throughputs approaching 1 Million Instructions Per Second (MIPS), thus allowing the system designer to optimize power consumption versus processing speed. Figure 5 shows a block diagram of the ATXMEGA256A3.
SiFLEX02-HP TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. 330-0047-R0.7 Copyright © 2010-2011 LS Research, LLC Page 11 of 35 Figure 5 ATXMEGA256A3 Block Diagram The AVR CPU combines a rich instruction set with 32 general purpose working registers. All the 32 registers are directly connected to the Arithmetic Logic Unit (ALU), allowing two independent registers to be accessed in one single instruction, executed in one clock cycle. The resulting architecture is more code efficient while achieving throughputs many times faster than conventional single-accumulator or CISC based microcontrollers.
SiFLEX02-HP TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. 330-0047-R0.7 Copyright © 2010-2011 LS Research, LLC Page 12 of 35 The XMEGA A3 devices have five software selectable power saving modes. The Idle mode stops the CPU while allowing the SRAM, DMA Controller, Event System, Interrupt Controller and all peripherals to continue functioning. The Power-down mode saves the SRAM and register contents but stops the oscillators, disabling all other functions until the next TWI or pin-change interrupt, or Reset. In Power-save mode, the asynchronous Real Time Counter continues to run, allowing the application to maintain a timer base while the rest of the device is sleeping. In Standby mode, the Crystal/Resonator Oscillator is kept running while the rest of the device is sleeping. This allows very fast start-up from external crystal combined with low power consumption. In Extended Standby mode, both the main Oscillator and the Asynchronous Timer continue to run. To further reduce power consumption, the peripheral clock for each individual peripheral can optionally be stopped in Active mode and Idle sleep mode. Radio The AT86RF212 is a low-power, low-voltage 900 MHz transceiver specially designed for low-cost IEEE 802.15.4, ZigBee™, and high data rate ISM applications. For the sub-1 GHz bands, it supports a low data rate of 40kbps of the IEEE 802.15.4-2003 standard and provides an optional data rate 250kbps using O-QPSK, according to IEEE 802.15.4-2006. Furthermore hardware accelerators improve overall system power efficiency and timing. The receiver path is based on a low-IF architecture. After channel filtering and down conversion the low-IF signal is sampled and applied to the digital signal processing part. Communication between transmitter and receiver is based on direct sequence spread spectrum with different modulation schemes and spreading codes. The AT86RF212 supports the IEEE 802.15.4-2006 standard mandatory BPSK modulation and optional O-QPSK modulation in the 900 MHz band. For applications not necessarily targeting IEEE compliant networks the radio transceiver supports proprietary High Data Rate Modes based on O-QPSK. The AT86RF212 features hardware supported 128 bit security operation. The standalone AES encryption/decryption engine can be accessed in parallel to all PHY operational modes. Configuration of the AT86RF212, reading, and writing of data memory as well as the AES hardware engine are controlled by the SPI interface and additional control signals.
SiFLEX02-HP TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. 330-0047-R0.7 Copyright © 2010-2011 LS Research, LLC Page 13 of 35 Figure 6 AT86RF212 Block Diagram RF Front End (Power Amplifier and LNA) The SiFLEX02-HP module contains a high performance RF Front End, containing both a RF Power Amplifier as well as a LNA. It is capable of 650mW output power, providing miles of range in outdoor applications. The signals DIG3 and DIG4 from the RF212 radio are used for transmit enable (TXEN) and receive enable (RXEN) respectively. When transmitting the DIG3 signal will be high and DIG4 will be low, which is controlled by the RF212. When receiving DIG3 will be low and DIG4 is high. In order to configure this functionality, the PA_EXT_EN bit in register TRX_CTRL_1 (0x04) of the RF212 needs to be set as a one. In addition the bits PA_LT[1] and PA_LT[0] in register RF_CTRL_0 (0x16) should both be set to one to maximize the PA lead time to 8usec. When putting the module to sleep the PA_EXT_EN bit should be set as zero. Upon wakeup the PA_EXT_EN should be set back to one.
SiFLEX02-HP TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. 330-0047-R0.7 Copyright © 2010-2011 LS Research, LLC Page 14 of 35 Antenna Options The SiFLEX02-HP module includes multiple antenna options. The module’s regulatory certification has been completed with the following antenna: • LS Research 001-0002 900 MHz Dipole Antenna with Reverse Polarity SMA Connector and LS Research 080-0001 u.fl to Reverse Polarity SMA Bulkhead Cable (105mm in length) The SiFLEX02-HP RF castellations for off board antennas are not covered in the modular certification. If a host board is designed that will utilize off board antennas via the RF castellated antenna connections, an additional certification will be required. LS Research is equipped with a certification lab and can assist in getting this done at a very reasonable cost in a short period of time. An adequate ground plane is necessary to provide good efficiency. The ground plane of the host board on which the module is mounted increases the effective antenna ground plane size and improves the antenna performance. The environment the module is placed in will dictate the range performance The non-ideal characteristics of the environment will result in the transmitted signal being reflected, diffracted, and scattered. All of these factors randomly combine to create extremely complex scenarios that will affect the link range in various ways. It is also best to keep some clearance between the antennas and nearby objects. This includes how the module is mounted in the product enclosure. Unless the items on the following list of recommendations are met, the radiation pattern can be heavily distorted. Whichever antenna is used, it is best to keep a few things in mind when determining its location. • Never place ground plane or copper trace routing underneath the antenna. • LSR recommends keeping metal objects as far away from the antenna as possible. At a very minimum keep the antenna at least 5 cm from any metallic objects, components, or wiring. The farther the antenna is placed from these interferers, the less the radiation pattern and gain will be perturbed. • Do not embed the antenna in a metallic or metalized plastic enclosure. • If located within a plastic enclosure, keep the enclosure at least 1 cm from the antenna.
SiFLEX02-HP TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. 330-0047-R0.7 Copyright © 2010-2011 LS Research, LLC Page 15 of 35 OPERATING MODES TRUTH TABLE Mode VGE LNA_EN ANT_SW ANT_SEL Sleep 0 0 0 0 Transmit – Ant J1 1 0 1 0 Receive with LNA Disabled – Ant J1 1 0 0 1 (J1 RX) Receive with LNA Disabled – Ant J2 1 0 0 0 (J2 RX) Receive with LNA Enabled – Ant J1 1 1 0 1 (J1 RX) Receive with LNA Enabled – Ant J2 1 1 0 0 (J2 RX) Table 3 Operating Modes Truth Table
SiFLEX02-HP TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. 330-0047-R0.7 Copyright © 2010-2011 LS Research, LLC Page 16 of 35 MODES OF OPERATION • With a host microcontroller • With the Atmel 802.15.4 MAC • With the Atmel ZigBee stack Host Microcontroller Si-FLEX Module on Evaluation BoardUARTPCLSR Test Tool SoftwareSi-FLEX Module on Your BoardYour Microcontroller (Host) of Choice UART-OR- Figure 7 Host Microcontroller Modes of Operation Out of the box the SiFLEX02-HP module contains an 802.15.4 based application that uses a host serial processor. This allows features of the module to be explored with the LSR PC based test tool, or controlled with a host microcontroller. The advantage of this method is simplicity; all major features of using the radio are simplified into a simple serial message, taking the burden of becoming a radio expert off the developer. Use the Communications Log in the ModFLEX™ Test Tool software and serial host protocol documents to see the messages in action. It will help you become familiar with the serial commands and how to implement them on your own microcontroller. Figure 8 ModFLEX™ Test Tool Communications Log Some examples of serial commands that can be used with the SiFLEX02-HP Module: • Set/Query RF channel • Set/Query RF power • Set/Query device address • Transmit RF data or notification RF data received • Go to Sleep Software Stacks There are two software stacks provided by Atmel to streamline development: MAC (802.15.4)Atmel ZigBee StackOverall Complexity and Development Effort Figure 9 SiFLEX02-HP Compatible Stacks 802.15.4 MAC • Use for applications requiring point-to-point or star network topology. • Advantages: Quick learning curve, minimize software development, easy to deploy in the field • Disadvantages: No mesh networking
SiFLEX02-HP TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. 330-0047-R0.7 Copyright © 2010-2011 LS Research, LLC Page 17 of 35 802.15.4 MAC(To Tx/Rx RF data)Application Software(to control switches, LED’s, serial ports and so on)Software Interface Figure 10 SiFLEX02-HP with 802.15.4 MAC Atmel ZigBee Stack • Use when mesh networking is required. • Advantages: Covers a large area with a ZigBee network. • Disadvantages: Large learning curve, more software development, complexity Application Software(to control switches, LED’s, serial ports and so on)Software Interface ZigBee Stack(To Tx/Rx RF data) Figure 11 SiFLEX02-HP with Atmel ZigBee Stack
SiFLEX02-HP TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. 330-0047-R0.7 Copyright © 2010-2011 LS Research, LLC Page 18 of 35 DEVELOPMENT TOOLS AVR Studio AVR Studio® is an Integrated Development Environment (IDE) for writing and debugging AVR® applications in Windows® 9x/NT/2000/XP/Vista(32- and 64-bit) environments. AVR Studio 4 includes an assembler, simulator, and in-circuit debugger. AVR Studio is the Integrated Development Environment (IDE) developed by Atmel for writing and debugging Atmel AVR applications. Eclipse Eclipse is an IDE for C/C++ developers. The Eclipse IDE requires a Java Runtime Environment (JRE) be installed on your machine to run. While it can run using a Java 1.4 JRE, a Java5 JRE (minimum) is recommended. See the SiFLEX02-HP User’s Guide for detailed instructions for installing Eclipse and integrating it with AVR Studio and WinAVR. WinAVR WinAVR is a suite of executable, open source software development tools for the Atmel AVR series of RISC microprocessors hosted on the Windows platform. It includes the GNU GCC compiler for C/C++. WinAVR contains all the tools for developing on AVR family microcontrollers from Atmel. This includes avr-gcc (compiler), avrdude (programmer), avr-gdb (debugger), and more. AVR JTAGICE mkII Custom firmware development can be done on the SiFLEX02-HP module using development tools available through Atmel. Shown in Figure 12, a JTAGICE mkII interface is required. It plugs into the ModFLEX™ Development Board, and can easily be adapted to other hardware. See the Atmel website for more information and ordering options. Figure 12 AVR JTAGICE mkII AVRISP mkII Another option for in-circuit programming is the AVRISP mkII from Atmel, Figure 13. The AVRISP mkII combined with AVR Studio® can program new AVR 8-bit RISC microcontrollers with ISP Interface. Figure 13 AVRISP mkII IAR Embedded Workbench for Atmel AVR Another option is IAR Embedded Workbench for Atmel AVR. IAR Embedded Workbench for AVR is an integrated development environment for building and debugging embedded applications. Visit the IAR Systems website for additional information.
SiFLEX02-HP TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. 330-0047-R0.7 Copyright © 2010-2011 LS Research, LLC Page 19 of 35 ELECTRICAL SPECIFICATIONS The majority of these characteristics are based on the use of the Atmel IEEE 802.15.4 MAC loaded with the generic application firmware written by LSR. Custom firmware may require these values to be re-characterized by the customer. Absolute Maximum Ratings Rating Min Max Unit Power supply voltage (VCC) 0 3.6 V Power Amplifier supply voltage (VPA) 0 4.5 V Voltage on any pin with respect to ground -0.3 Vcc + 0.3 V RF input power +10 dBm Operating temperature range -40 +85 ºC Storage temperature -50 +150 ºC Table 4 Absolute Maximum Ratings1Recommended Operating Conditions Characteristic Min Typ Max Unit Power supply voltage (VCC) 2.5 3.3 3.50 Vdc Power Amplifier supply voltage (VPA) 3.0 4.0 4.25 Vdc Ambient temperature range -40 25 85 ºC Table 5 Recommended Operating Conditions Module will NOT transmit, if VPA > 4.25V. 1 Under no circumstances should exceeding the maximum ratings specified in the Absolute Maximum Ratings section be allowed. Stressing the module beyond these limits may result permanent damage to the module that is not covered by the warranty.
SiFLEX02-HP TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. 330-0047-R0.7 Copyright © 2010-2011 LS Research, LLC Page 20 of 35 General Characteristics Parameter Min Typ Max Unit RF frequency range (Note 1, 2) 906 924 MHz RF data rate 40 1000 kbps Host data rate 1.2 19.2 921.6 kbps Flash memory 256 kBytes RAM 16 kBytes EEPROM 4 kBytes Table 6 General Characteristics Note 1: The frequency range needs to be restricted to 915 to 924 MHz (channels 6-10) to meet Australian/New Zealand standards. Note 2:Due to the band pass filter, receiver sensitivity is reduced by approximately 1dB on channels 1, 2, 8, 9, and 10 (906MHz, 908MHz, 920MHz, 922MHz, and 924MHz). This improves receiver performance in the presence of interferers on channels 3, 4, 5, 6, and 7 (910MHz, 912MHz, 914MHz, 916MHz, and 918MHz). Power Consumption (TA = 25°C, VCC = 3.3V, VPA = 4.0V, fc = 906-924MHz, Rload = 50Ω) Parameter Test Conditions Min Typ Max Unit Transmit mode - VPA Maximum power step 450 600 mA Transmit mode - VCC 50 mA Receive mode - VPA 1 uA Receive mode - VCC 27 39 48 mA Sleep mode - VPA 1 µA Sleep mode - VCC 2 5 uA Table 7 Power Consumption DC Characteristics – General Purpose I/O Parameter Test Conditions Min Typ Max Unit Logic input low -0.3 0.2 * Vcc V Logic input high 0.8 * Vcc Vcc + 0.3 V Logic output low IOUT = 15mA Vcc = 3.3V 0.4 V Logic output high IOUT = -8mA Vcc = 3.3V 2.9 V Table 8 DC Characteristics – General Purpose I/O
SiFLEX02-HP TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. 330-0047-R0.7 Copyright © 2010-2011 LS Research, LLC Page 21 of 35 RF Characteristics Transmitter Characteristics (TA = 25°C, VCC = 3.3V, VPA = 4.0V, fc = 906-924 MHz) Parameter Test Conditions Min Typ Max Unit Nominal max output power (40kbps) (Notes: 1, 2) 26 27 29 dBm Nominal max output power (250kbps and higher) (Notes: 1, 2) 27 28 29 dBm Programmable output power range 22 Steps 15 28 dBm Harmonics (2fo) -50 dBm Harmonics (3fo) -55 dBm Error vector magnitude 10 35 % rms Table 9 Transmitter RF Characteristics Note 1: In accordance with FCC Part 15.247(e) and RSS 210 A8.2(b), the peak power spectral density should not exceed +8 dBm in any 3 KHz band. Note 2: In accordance with Australian/New Zealand 4268 : 2008, the peak power spectral density should not exceed +14dBm in any 3 KHz band in the 915 to 928 MHz frequency band.
SiFLEX02-HP TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. 330-0047-R0.7 Copyright © 2010-2011 LS Research, LLC Page 22 of 35 Host Protocol RF Power Level AT86RF212 PHY_TX_PWR Register Value BPSK into 50 ohms at u.fl RF Output Power (dBm) Typical Current Consumption (mA) 21 0x0C 28 466 20 0x0B 28 455 19 0x0A 28 443 18 0x09 28 426 17 0x08 27 393 16 0x07 26 365 15 0x06 26 346 14 0x05 26 338 13 0x04 25 319 12 0x03 25 304 11 0x02 24 281 10 0x23 24 277 9 0x22 22 254 8 0x42 22 236 7 0x41 21 219 6 0x61 21 207 5 0x60 20 198 4 0x83 19 188 3 0x82 18 181 2 0x81 17 176 1 0xA1 16 172 0 0xC0 15 170 Table 10 RF Power Settings Receiver Characteristics (TA = 25°C, VCC = 3.3V, VPA = 4.0V, fc = 906-924 MHz) Parameter Test Conditions Min Typ Max Unit Receiver Sensitivity @ 1% PER BPSK 40kbit/s < -104 dBm Saturation Level @ 1% PER BPSK 40kbit/s -2 dBm Table 11 Receiver RF Characteristics
SiFLEX02-HP TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. 330-0047-R0.7 Copyright © 2010-2011 LS Research, LLC Page 23 of 35 For additional details regarding the electrical specifications, refer to the ATXMEGA256A3 and AT86RF212 datasheets on the Atmel website.
SiFLEX02-HP TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. 330-0047-R0.7 Copyright © 2010-2011 LS Research, LLC Page 24 of 35 SOLDERING RECOMMENDATIONS Recommended Reflow Profile for Lead Free Solder Note: The quality of solder joints on the castellations (‘half vias’) where they contact the host board should meet the appropriate IPC Specification. See IPC-A-610-D Acceptability of Electronic Assemblies, section 8.2.4 Castellated Terminations.”
SiFLEX02-HP TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. 330-0047-R0.7 Copyright © 2010-2011 LS Research, LLC Page 25 of 35 CLEANING In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed with any cleaning process. • Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between neighboring pads. Water could also damage any stickers or labels. • Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the RF shield, which is not accessible for post-washing inspection. The solvent could also damage any stickers or labels. • Ultrasonic cleaning could damage the module permanently. OPTICAL INSPECTION After soldering the Module to the host board, consider optical inspection to check the following: • Proper alignment and centering of the module over the pads. • Proper solder joints on all pads. • Excessive solder or contacts to neighboring pads, or vias. REWORK The SiFLEX02-HP module can be unsoldered from the host board. Use of a hot air rework tool and hot plate for pre-heating from underneath is recommended. Avoid overheating. Never attempt a rework on the module itself, e.g. replacing individual components. Such actions will terminate warranty coverage. SHIPPING, HANDLING, AND STORAGE Shipping Bulk orders of the SiFLEX02-HP modules are delivered in trays of 50. Handling The SiFLEX02-HP modules contain a highly sensitive electronic circuitry. Handling without proper ESD protection may destroy or damage the module permanently. ESD protection may destroy or damage the module permanently. Moisture Sensitivity Level (MSL) MSL 4, per J-STD-020 Devices not stored in a sealed bag with desiccant pack should be baked. After opening devices that will be subjected to reflow must be mounted within 72 hours of factory conditions (<30°C and 60% RH) or stored at <10% RH. Bake devices for 8 hours at 125°C. Storage Storage/shelf life in sealed bags is 12 months at <40°C and <90% relative humidity. Repeating Reflow Soldering Only a single reflow soldering process is encouraged for host boards.
SiFLEX02-HP TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. 330-0047-R0.7 Copyright © 2010-2011 LS Research, LLC Page 26 of 35 AGENCY STATEMENTS Federal Communication Commission Interference Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures: • Reorient or relocate the receiving antenna. • Increase the separation between the equipment and receiver. • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. • Consult the dealer or an experienced radio/TV technician for help. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. FCC CAUTION: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment.
SiFLEX02-HP TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. 330-0047-R0.7 Copyright © 2010-2011 LS Research, LLC Page 27 of 35 Industry Canada Statements Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that permitted for successful communication. This device has been designed to operate with the antennas listed below, and having a maximum gain of 2.0 dB. Antennas not included in this list or having a gain greater than 2.0 dB are strictly prohibited for use with this device. The required antenna impedance is 50 ohms. LS Research 001-0002 900 MHz Dipole Antenna with Reverse Polarity SMA Connector and LS Research 080-0001 u.fl to Reverse Polarity SMA Bulkhead Cable (105mm in length) Son fonctionnement est soumis aux deux conditions suivantes: (1) cet appareil ne peut pas provoquer d'interférences et (2) cet appareil doit accepter toute interférence, y compris les interférences qui peuvent causer un mauvais fonctionnement du dispositif. Pour réduire le risque d'interférence aux autres utilisateurs, le type d'antenne et son gain doivent être choisies de façon que la puissance isotrope rayonnée équivalente (e.i.r.p) ne dépasse pas celle admise pour une communication réussie. Cet appareil a été conçu pour fonctionner avec les antennes énumérées ci-dessous, et ayant un gain maximum de 2,0 dB. Antennes pas inclus dans cette liste ou ayant un gain supérieur à 2,0 dB sont strictement interdites pour une utilisation avec cet appareil. L'impédance d'antenne requise est de 50 ohms. LS Research 001-0002 900 MHz Antenne dipôle avec inversion de polarité Connecteur SMA et LS Research 080-0001 U.FL àinversion de polarité SMA traversée de câble (105 mm de longueur)
SiFLEX02-HP TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. 330-0047-R0.7 Copyright © 2010-2011 LS Research, LLC Page 28 of 35 OEM Responsibilities to comply with FCC and Industry Canada Regulations The SiFLEX02-HP Module has been certified for integration into products only by OEM integrators under the following conditions: This device is granted for use in Mobile only configurations in which the antennas used for this transmitter must be installed to provide a separation distance of at least 20cm from all person and not be co-located with any other transmitters except in accordance with FCC and Industry Canada multi-transmitter product procedures. As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). IMPORTANT NOTE: In the event that these conditions cannot be met (for certain configurations or co-location with another transmitter), then the FCC and Industry Canada authorizations are no longer considered valid and the FCC ID and IC Certification Number cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC and Industry Canada authorization.
SiFLEX02-HP TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. 330-0047-R0.7 Copyright © 2010-2011 LS Research, LLC Page 29 of 35 Le module SiFLEX02-HP a été certifiée pour l'intégration dans les produits que par les intégrateurs OEM dans les conditions suivantes: Ce dispositif est accordé pour une utilisation dans des configurations mobiles seule dans laquelle les antennes utilisées pour cet émetteur doit être installé pour fournir une distance de séparation d'au moins 20cm de toute personne et ne pas être co-localisés avec les autres émetteurs, sauf en conformité avec FCC et Industrie Canada, multi-émetteur procedures produit. Tant que les deux conditions précitées sont réunies, les tests de transmetteurs supplémentaires ne seront pas tenus. Toutefois, l'intégrateur OEM est toujours responsable de tester leur produit final pour toutes les exigences de conformité supplémentaires requis avec ce module installé (par exemple, les émissions appareil numérique, les exigences de périphériques PC, etc.) NOTE IMPORTANTE: Dans le cas où ces conditions ne peuvent être satisfaites (pour certaines configurations ou de co-implantation avec un autre émetteur), puis la FCC et Industrie autorisations Canada ne sont plus considérés comme valides et l'ID de la FCC et IC numéro de certification ne peut pas être utilisé sur la produit final. Dans ces circonstances, l'intégrateur OEM sera chargé de réévaluer le produit final (y compris l'émetteur) et l'obtention d'un distincte de la FCC et Industrie Canada l'autorisation.
SiFLEX02-HP TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. 330-0047-R0.7 Copyright © 2010-2011 LS Research, LLC Page 30 of 35 End Product Labelling The SiFLEX02-HP Module is labeled with its own FCC ID and IC Certification Number. If the FCC ID and IC Certification Number are not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: TFB-SIFLEX2HP” “Contains Transmitter Module IC: 5969A-SIFLEX2HP” or “Contains FCC ID: TFB-SIFLEX2HP” “Contains IC: 5969A-SIFLEX2HP” The OEM of the SiFLEX02-HP Module must only use the approved antenna(s) listed above, which have been certified with this module. The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product. The user manual for the end product must include the following information in a prominent location: This device is granted for use in Mobile only configurations in which the antennas used for this transmitter must be installed to provide a separation distance of at least 20cm from all person and not be co-located with any other transmitters except in accordance with FCC and Industry Canada multi-transmitter product procedures.
SiFLEX02-HP TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. 330-0047-R0.7 Copyright © 2010-2011 LS Research, LLC Page 31 of 35 Le SiFLEX02-HP Module est étiqueté avec sa propre ID de la FCC et IC numéro de certification. Si l'ID de la FCC et IC numéro de certification ne sont pas visibles lorsque le module est installé à l'intérieur d'un autre appareil, puis l'extérieur de l'appareil dans lequel le module est installé doit également afficher une étiquette mentionnant le module ci-joint. Dans ce cas, le produit final doivent être étiquetés dans un endroit visible de ce qui suit: Module émetteur Contient FCC ID: TFB-SIFLEX2HP Module émetteur Contient IC: 5969A-SIFLEX2HP ou Contient FCC ID: TFB-SIFLEX2HP Contient IC: 5969A-SIFLEX2HP Le constructeur d'équipements de l'SiFLEX02-HP module ne doit utiliser l'antenne approuvée (s) ci-dessus, qui ont été certifiés avec ce module. L'intégrateur OEM doit être conscient de ne pas fournir des informations à l'utilisateur final quant à la façon d'installer ou de supprimer ce module RF ou RF changer les paramètres liés au mode d'emploi du produit final. Le manuel d'utilisation pour le produit final doit comporter les informations suivantes dans un endroit bien en vue: Ce dispositif est accordé pour une utilisation dans des configurations mobiles seule dans laquelle les antennes utilisées pour cet émetteur doit être installé pour fournir une distance de séparation d'au moins 20cm de toute personne et ne pas être co-localisés avec les autres émetteurs, sauf en conformité avec FCC et Industrie Canada, multi-émetteur procedures produit.
SiFLEX02-HP TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. 330-0047-R0.7 Copyright © 2010-2011 LS Research, LLC Page 32 of 35 MECHANICAL DATA General Module Dimensions Figure 14 Basic dimensions
SiFLEX02-HP TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. 330-0047-R0.7 Copyright © 2010-2011 LS Research, LLC Page 33 of 35 COMPATIBILITY To maintain compatibility with other ModFLEX™ family transceiver modules it is important to use the module pins in your application as they are designated in Figure 16. Since the available GPIO and peripherals vary per micro, not all pins may be populated. For example on SiFLEX02-HP module pins 45-55 are not available (due to the number of GPIO available on the ATxMega256A3). All attempts are made to lay out modules starting with the lowest number in the peripheral (ADC, TMR/PWM, GPIO) series. For example if there are only two ADC’s available they will be brought out to ADC1 and ADC2 (module pins 20 and 21). GND 1 ModFLEX™ Generic Module Footprint 69 GND GND 2 68 GND GND 3 67 GND NC 4 66 NC NC 5 65 NC NC 6 64 NC NC 7 63 NC NC 8 62 NC JTAG - TMS 9 61 SPI - MOSI JTAG - TDI 10 60 SPI - MISO JTAG - TCK 11 59 SPI - SCK JTAG - TDO 12 58 SPI - SS JTAG/PDI/JRST 13 57 IIC - SDA nReset 14 56 IIC - SCL Analog REF 15 55 GPIO 16 Analog REF 16 54 GPIO 15 CMP+ 17 53 GPIO 14 CMP- 18 52 GPIO 13 CMPOUT 19 51 GPIO 12 ADC1 20 50 GPIO 11 ADC2 21 49 GPIO 10 ADC3 22 48 GPIO 9 ADC4 23 47 GPIO 8 ADC5 24 46 GPIO 7 ADC6 25 45 GPIO 6 VCC - 3V3DC 26 44 GND 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 TMR/PWM 1 TMR/PWM 2 TMR/PWM 3 TMR/PWM 4 TMR/PWM 5 TMR/PWM 6 TMR/PWM 7 TMR/PWM 8 UART - TX UART - RX UART - CTS UART - RTS GPIO 1 GPIO 2 GPIO 3 GPIO 4 GPIO 5 Figure 15 ModFLEX™ Generic Module Footprint
SiFLEX02-HP TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. 330-0047-R0.7 Copyright © 2010-2011 LS Research, LLC Page 34 of 35 MODULE REVISION HISTORY Rev 1.1 • Initial production release.
SiFLEX02-HP TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Confirm the data is current by downloading the latest revision from www.lsr.com. 330-0047-R0.7 Copyright © 2010-2011 LS Research, LLC Page 35 of 35 CONTACTING LS RESEARCH Headquarters LS Research, LLC W66 N220 Commerce Court Cedarburg, WI 53012-2636 USA Tel: 1(262) 375-4400 Fax: 1(262) 375-4248 Website www.lsr.com Technical Support forum.lsr.com Sales Contact sales@lsr.com The information in this document is provided in connection with LS Research (hereafter referred to as “LSR”) products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of LSR products. EXCEPT AS SET FORTH IN LSR’S TERMS AND CONDITIONS OF SALE LOCATED ON LSR’S WEB SITE, LSR ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL LSR BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF LSR HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. LSR makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and product descriptions at any time without notice. LSR does not make any commitment to update the information contained herein. Unless specifically provided otherwise, LSR products are not suitable for, and shall not be used in, automotive applications. LSR’s products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life.

Navigation menu