Laird Connectivity 60SIPT 802.11 ac/a/b/g/n + Bluetooth 4.2 module / 802.11 ac/a/b/g/n M.2 2230 + Bluetooth 4.2 module User Manual CS DS SU60 SIPT PRELIMINARY

Laird Technologies 802.11 ac/a/b/g/n + Bluetooth 4.2 module / 802.11 ac/a/b/g/n M.2 2230 + Bluetooth 4.2 module CS DS SU60 SIPT PRELIMINARY

Contents

Users Manual_60-SIPT_SQG-60SIPT

A     Datasheet 60-SIPT series Version 0.2
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  2 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  REVISION HISTORY Version Date  Notes  Approver 0.1  24 Mar 2017  Initial preliminary version  Jay White 0.2  11 May 2017 Updated some certifications; fixed typos in Channel table; corrected RX sensitivity numbers on 11 AC (MCS9;HT80); Descript PDn and PMU_EN function Andrew Chen
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  3 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  CONTENTS 1 Scope ................................................................................................................................................... 4 2 Introduction ......................................................................................................................................... 4 2.1 General Description...................................................................................................................... 4 3 60-SIPT Series Features Summary ....................................................................................................... 5 4 Specifications ....................................................................................................................................... 6 5 WLAN Functional Description ............................................................................................................ 11 5.1 Overview .................................................................................................................................... 11 6 Bluetooth Functional Description ...................................................................................................... 14 7 Block Diagram .................................................................................................................................... 15 8 Electrical Characteristics .................................................................................................................... 15 8.1 Absolute Maximum Ratings ....................................................................................................... 15 8.2 Recommended Operating Conditions ........................................................................................ 16 8.3 DC Electrical Characteristics ....................................................................................................... 16 8.4 WLAN Radio Receiver Characteristics ........................................................................................ 17 8.5 WLAN Transmitter Characteristics ............................................................................................. 18 9 Bluetooth Radio Characteristics ........................................................................................................ 19 10 Host Interface Specifications ......................................................................................................... 22 10.1 SDIO Specifications ..................................................................................................................... 22 10.2 PCI Express Specifications .......................................................................................................... 26 10.3 USB Specifications ...................................................................................................................... 30 10.4 PCM Interface Specifications ..................................................................................................... 33 11 Pin Definitions ................................................................................................................................ 34 12 Host Configuration Options ........................................................................................................... 37 13 Mechanical Specifications .............................................................................................................. 37 14 RF Layout Design Guidelines .......................................................................................................... 39 15 Recommended Storage, Handling, Baking, and Reflow Profile ..................................................... 39 15.1 Required Storage Conditions ..................................................................................................... 39 15.2 Baking Conditions ....................................................................................................................... 40 15.3 Surface Mount Conditions ......................................................................................................... 41 16 Regulatory ...................................................................................................................................... 43 16.1 Certified Antennas ..................................................................................................................... 43 17 FCC and IC Regulatory .................................................................................................................... 43 17.1 FCC .............................................................................................................................................. 44 17.2 Industry Canada ......................................................................................................................... 45 18 European Union Regulatory ........................................................................................................... 48 19 Ordering Information ..................................................................................................................... 49 19.1 General Comments .................................................................................................................... 49 19.1.1 Labeling Requirements ....................................................................................................... 50
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  4 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  1 SCOPE This document describes key hardware aspects of the Laird 60-SIPT series system-in-package (SiP) modules providing either SDIO, USB2.0, or PCIe bus interface for WLAN connection and UART/PCM, SDIO/PCM, USB2.0/PCM for Bluetooth® connection. This document is intended to assist device manufacturers and related parties with the integration of this radio into their host devices. Data in this document is drawn from several sources and includes information found in the Marvell 88W8997/88PG823 data sheets issued in April 2016, along with other documents provided from Marvell. Note that the information in this document is subject to change. Please contact Laird to obtain the most recent version of this document. 2 INTRODUCTION 2.1 General Description The 60-SIPT series SiP modules are an integrated, small form factor 2x2 MIMO 802.11 a/b/g/n/ac WLAN plus Bluetooth 4.2 dual mode device that is optimized for low-power mobile devices. The integration of all WLAN and Bluetooth functionality in a single package supports low cost and simple implementation along with flexibility for platform-specific customization.  This device is pre-calibrated and integrates the complete transmit/receive RF paths including band pass filter, diplexer, switches, reference crystal oscillator, and power manage units (PMU).  The 60-SIPT series device supports IEEE 802.11 ac (wave 2) 2X2 receive multi-user MIMO (MU-MIMO) spatial stream multiplexing with data rates up to MCS9 (866.7 Mbps). It also supports Bluetooth 2.1 + EDR and Bluetooth 4.2 (Bluetooth Low Energy or BLE).  Internal Wi-Fi and BT coexistence scheme provides optimized throughput when Wi-Fi and BT working simultaneously. The device’s low power consumption radio architecture and power manage unit (PMU) proprietary power save technologies allow for extended battery life.  In addition, its dual 802.11 and Bluetooth radio includes full digital MAC and baseband engines that handle all 802.11 CCK/OFDM® 2.4/5GHz, and Bluetooth basic rate and EDR baseband and protocol processing. Dual embedded low-power CPU cores minimize host loading and maximize flexibility to support customer-specific use cases.  The 60-SIPT series SiP modules include two product SKUs which is have different supported software features. Please check Laird Sales/FAE for further information. Order information is listed in Table 1. Table 1: Product ordering information Order Model  Description SU60-SIPT  802.11ac + BT4.2 60 Series hardware combined with Summit Series Enterprise software ST60-SIPT  802.11ac + BT4.2 60 Series hardware combined with Sterling Series Professional software
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  5 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  3 60-SIPT SERIES FEATURES SUMMARY The Laird 60-SIPT series device features are described in Table 2. Table 2: 60-SIPT series features Feature  Description Radio Front End Integrates the complete transmit/receive RF paths including band pass filter, diplexer, switches, reference crystal oscillator, and power manage unit (PMU). Supports 20/40/80MHz channel bandwidth. WLAN/Bluetooth share one antenna. The Bluetooth® word mark and logos are registered trademarks owned by Bluetooth SIG, Inc. Any use of such marks by Laird is under license. Other trademarks and trade names are those of their respective owners. Coexistence   Coexistence arbitration for WLAN, Bluetooth, and LTE operation Power Management Dynamic Voltage Scaling (DVS) and Adaptive Voltage Scaling (AVS) features support the latest Marvell SoC and Processor power control scheme. Pre-Calibration  RF system tested and calibrated in production Sleep Clock  An external sleep clock of 32.768 KHz is required during power save mode Host Interface   SDIO 3.0 (4-bit and 1-bit), SDR 12/25/50 mode (up to 100 MHz), USB2.0 or PCIe for WLAN   SDIO 3.0, USB 2.0, HS-UART for Bluetooth HCI (compatible with any upper layer Bluetooth stack)  PCM digital audio interface for Bluetooth audio application Strap Value CONFIG_HOST [2-0] WLAN  Bluetooth/BLE ROM Notes 000 SDIO UART - 001 SDIO SDIO - 010  PCIe  USB 2.0  Initial USB 2.0 PHY and COM PHY PCIe portion 011  PCIe  UART  Initial only COM PHY PCIe portion 100 USB 2.0 UART Initial COM PHY USB 2.0 101 USB 2.0 USB 2.0 Initial only USB 2.0 PHY  Reference Frequency  Incorporates a 40 MHz reference frequency source in package  An external sleep clock is recommended for minimal current consumption. If no sleep clock input is provided, an internal sleep clock (derived from reference clock) is used. An approximate 50 uA current increase on the 3.3V rail. Advanced WLAN  A-MPDU RX (de-aggregation) and TX (aggregation) supports 802.11ac single-MPDU A-MPDU.  Multi-BSS/Station  Transmit rate adaption, transmit power control  Modulation and coding scheme (MCS):   802.11ac—MCS0-9 Nsts=1 and 2.            802.11n—MCS0-15  Dynamic frequency selection (radar detection) DFS  20/40/80 MHz channel bandwidths support  On-chip gain selectable LNA with optimized noise figure and power consumption  Internal PA with optimized gain distribution for linearity and noise performance  Support wide variety of WLAN encryption: TKIP/WEP/AES
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  6 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  Feature  Description Advanced Bluetooth  Bluetooth 4.2 (BDR/EDR/LE), Bluetooth class 1   Support data rate: 1 Mbps(GFSK), 2 Mbps ( /4-DQPSK), 3 Mbps (8-DPSK)  Digital audio interface with PCM/TDM interface for voice application  Adaptive Frequency Hopping (AFH) using Package Error Rate (PER)  Standard SDIO or UART HCI transport layer  WLAN/Bluetooth coexistence protocol support  Shared LNA with WLAN/Bluetooth  Encryption (AES) support 4 SPECIFICATIONS Table 3: Specifications Feature  Description Physical Interface 84-pin LGA package (including 16 thermal ground pad under the package) Wi-Fi Interface 1-bit or 4-bit Secure Digital I/O; PCIe v3.0 Gen1/Gen2 (2.5/5 Gbps); USB 2.0 Bluetooth/BLE Interface Host Controller Interface (HCI) using high speed UART, SDIO, USB 2.0 Strap Value CONFIG_HOST [2-0] WLAN  Bluetooth/ BLE ROM Notes 000 SDIO UART - 001  SDIO  SDIO  - 010  PCIe  USB 2.0  Initial USB 2.0 PHY and COM PHY PCIe portion 011 PCIe UART Initial only COM PHY PCIe portion 100  USB 2.0 UART  Initial COM PHY USB 2.0 101  USB 2.0 USB 2.0  Initial only USB 2.0 PHY  Main Chip  Marvell 88W8997 (WLAN/BT); Marvell 88PG823 (PMU) Input Voltage Requirements DC 3.3 V ±10% I/O Signalling Voltage DC 3.3 V ± 10% or DC 1.8 V ± 10% Operating Temperature -30° to 85°C (-22° to 185°F)   Operating Humidity 10 to 90% (non-condensing)  Storage Temperature -40° to 85°C (-40° to 185°F) Storage Humidity 10 to 90% (non-condensing)  Maximum Electrostatic Discharge Conductive 4KV; Air coupled 8KV follow EN61000-4-2 Size 13 mm (length) x 14 mm (width) x 1.87 mm (thickness) Weight TBD g Wi-Fi Media Direct Sequence-Spread Spectrum (DSSS)  Complementary Code Keying (CCK) Orthogonal Frequency Divisional Multiplexing (OFDM) Bluetooth Media Frequency Hopping Spread Spectrum (FHSS) Wi-Fi Media Access Protocol Carrier sense multiple access with collision avoidance (CSMA/CA) A-MPDU Rx (De-aggregation) and Tx (aggregation) (802.11ac single-MPDU A-MPDU) Network Architecture Types Infrastructure and ad-hoc
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  7 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  Feature  Description Wi-Fi Standards IEEE 802.11a, 802.11b, 802.11d, 802.11e, 802.11g, 802.11h, 802.11i, 802.11n, 802.11r, 802.11ac, 802.11w, 802.11K, 802.11v Bluetooth Standards Bluetooth version 2.1 with Enhanced Data Rate Bluetooth 4.2 (Bluetooth Low Energy or BLE) Wi-Fi Data Rates Supported Support 802.11 ac/a/b/g/n 2X2 MIMO. 802.11b (DSSS, CCK) 1, 2, 5.5, 11 Mbps 802.11a/g (OFDM) 6, 9, 12, 18, 24, 36, 48, 54 Mbps 802.11n (OFDM, HT20/HT40, MCS 0-15) 802.11ac (OFDM, HT20, MCS0-8; OFDM HT40/HT80, MCS 0-9) Modulation Table BPSK, QPSK, CCK, 16-QAM, 64-QAM, and 256-QAM. 802.11ac  HT MCS Index VHT MCS Index Spatial Streams Modulation Coding 20 MHz  40 MHz  80 MHz 802.11n  No SGI SGI  No SGI SGI  No SGI SGI   0  0  1  BPSK  1/2  6.5  7.2  13.5  15  29.3  32.5   1  1  1  QPSK  1/2  13  14.4  27  30  58.5  65   2  2  1  QPSK  3/4  19.5  21.7  40.5  45  87.8  97.5   3  3  1  16-QAM  1/2  26  28.9  54  60  117  130   4  4  1  16-QAM  3/4  39  43.3  81  90  175.5  195   5  5  1  64-QAM  2/3  52  57.8  108  120  234  260   6  6  1  64-QAM  3/4  58.5  65  121.5  135  263.3  292.5   7  7  1  64-QAM  5/6  65  72.2  135  150  292.5  325     8  1  256-QAM  3/4  78  86.7  162  180  351  390     9  1  256-QAM  5/6  N/A  N/A  180  200  390  433.3   8  0  2  BPSK  1/2  13  14.4  27  30  58.5  65   9  1  2  QPSK  1/2  26  28.9  54  60  117  130   10  2  2  QPSK  3/4  39  43.3  81  90  175.5  195   11  3  2  16-QAM  1/2  52  57.8  108  120  234  260   12  4  2  16-QAM  3/4  78  86.7  162  180  351  390   13  5  2  64-QAM  2/3  104  115.6 216  240  468  520   14  6  2  64-QAM  3/4  117  130.3 243  270  526.5  585   15  7  2  64-QAM  5/6  130  144.4 270  300  585  650     8  2  256-QAM  3/4  156  173.3 324  360  702  180     9  2  256-QAM  5/6  N/A  N/A  360  400  780  866.7  802.11ac/n Spatial Streams 2 (2x2 MIMO) Bluetooth Data Rates Supported  1, 2, 3 Mbps Bluetooth Modulation  GFSK@ 1 Mbps Pi/4-DQPSK@ 2 Mbps 8-DPSK@ 3 Mbps Regulatory Domain Support  FCC (Americas, Parts of Asia, and Middle East) ETSI (Europe, Middle East, Africa, and Parts of Asia) IC (Industry Canada) MIC (Japan) (formerly TELEC) – Option KC (Korea) (formerly KCC) – Option
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  8 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  Feature  Description 2.4 GHz Frequency Bands  ETSI: 2.4 GHz to 2.483 GHz FCC: 2.4 GHz to 2.473 GHz MIC: 2.4 GHz to 2.495 GHz KC: 2.4 GHz to 2.483 GHz 2.4 GHz Operating Channels  (Wi-Fi) ETSI: 13 (3 non-overlapping)  FCC:  11 (3 non-overlapping)  MIC:  14 (4 non-overlapping) KC:  13 (3 non-overlapping) 5 GHz Frequency Bands ETSI 5.15 GHz to 5.35 GHz (Ch 36/40/44/48/52/56/60/64) 5.47 GHz to 5.725 GHz (Ch 100/104/108/112/116/120/124/128/132/136/140/144) FCC 5.15 GHz to 5.35 GHz (Ch 36/40/44/48/52/56/60/64) 5.47 GHz to 5.725 GHz (Ch 100/104/108/112/116/120/124/128/132/136/140/144 5.725 GHz to 5.85 GHz (Ch 149/153/157/161/165) MIC (Japan) 5.15 GHz to 5.35 GHz (Ch 36/40/44/48/52/56/60/64) 5.47 GHz to 5.725 GHz (Ch 100/104/108/112/116/120/124/128/132/136/140/144) KC 5.15 GHz to 5.35 GHz (Ch 36/40/44/48/52/56/60/64) 5.47 GHz to 5.725 GHz (Ch 100/104/108/112/116/120/124) 5.725 GHz to 5.825 GHz (Ch 149/153/157/161) 5 GHz Operating Channels (Wi-Fi)  ETSI: 19 non-overlapping; FCC: 24 non-overlapping  MIC: (Japan): 19 non-overlapping; KC: 19 non-overlapping  Transmit Power  Note: Transmit power on each channel varies per individual country regulations. All values are nominal with +/-2 dBm tolerance at room temperature. Tolerance could be up to +/-2.5 dBm across operating temperature.  Note:   HT20 – 20 MHz-wide channels HT40 – 40 MHz-wide channels HT80 – 80 MHz-wide channels  802.11a  6 Mbps 18 dBm (63 mW) 54 Mbps 16 dBm (40 mW) 802.11b 1 Mbps 18 dBm (63 mW) 11 Mbps 18 dBm (63 mW) 802.11g 6 Mbps 18 dBm (63 mW) 54 Mbps 16 dBm (40 mW) 802.11n (2.4/5 GHz) 6.5 Mbps (MCS0-5/MCS8-13; HT20) 65 Mbps (MCS6-7/MCS14-15; HT20) 13.5 Mbps (MCS0-5/MCS8-13; HT40) 135 Mbps (MCS6-7/MCS14-15; HT40) 18 dBm (63 mW) 16 dBm (40 mW) 16 dBm (40 mW) 14 dBm (25 mW) 802.11ac (5 GHz) 6.5/13 Mbps (MCS0-6; Ntst=1,2; HT20) 78/156 Mbps (MCS7-8; Ntst=1,2; HT20) 13.5/27 Mbps (MCS0-5; Ntst=1,2; HT40) 180/360 Mbps (MCS6-8; Ntst=1,2; HT40) 200/400 Mbps (MCS9; Ntst=1,2; HT40) 29.3/58.5 Mbps (MCS0-5; Ntst=1,2; HT80) 263.3/526.5 Mbps (MCS6-8; Ntst=1,2; HT80) 390/780 Mbps (MCS9; Ntst=1,2; HT80) 18 dBm (63 mW) 16 dBm (40 mW) 16 dBm (40 mW) 14 dBm (25 mW) 12 dBm (15.8mW) 14 dBm (25 mW) 12 dBm (15.8 mW) 10 dBm (10 mW) Bluetooth 1 Mbps (1DH5) 10 dBm (12.5 mW)
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  9 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  Feature  Description 2 Mbps 7 dBm (6.3 mW) 3 Mbps BLE (1 Mbps) 7 dBm (6.3 mW) 7 dBm (6.3 mW)  Typical Receiver Sensitivity (PER <= 10%) Note: All values nominal, +/-3 dBm. Sensitivity on CH13 (WLAN)/CH78 (BT) will decade up to 4-6dB. 802.11a: 6 Mbps -89 dBm 54 Mbps -74 dBm  802.11b: 1 Mbps -95 dBm 11 Mbps -90 dBm (PER<8%) 802.11g: 6 Mbps  -91 dBm 54 Mbps -75 dBm  802.11n (2.4 GHz) 6.5 Mbps (MCS0; HT20) -91 dBm 65 Mbps (MCS7; HT20) 13.5 Mbps (MCS0; HT40) 135 Mbps (MCS7; HT40) -73 dBm -85 dBm -70 dBm 802.11n (5 GHz) 6.5 Mbps (MCS0; HT20) -89 dBm 65 Mbps (MCS7; HT20) 13.5Mbps (MCS0; HT40) 135Mbps (MCS7; HT40) -70 dBm -86 dBm -69 dBm 802.11ac (5 GHz) 6.5 Mbps (MCS0; HT20) -89 dBm 78 Mbps (MCS8; HT20) 13.5 Mbps (MCS0; HT40) 180 Mbps (MCS9; HT40) 29.3 Mbps (MCS0; HT80) 390/780 Mbps (MCS9; HT80) -67 dBm -86 dBm -63 dBm -81 dBm -55 dBm Bluetooth: 1 Mbps (1DH5) 2Mbps (2DH5) -95 dBm  -94 dBm 3 Mbps (3DH5) -88 dBm BLE -95 dBm  Operating Systems Supported Linux 3.x to 4.9.x kernel. Android 5.0-5.1.1 (Lollipop) Nov. 2014 supported. Android 6.0-6.01 (Marshmallow) Oct 2015 supported Android 7.0-7.1.1 (Nougat) Aug. 2016 supported
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  10 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  Feature  Description Security  Standards Wireless Equivalent Privacy (WEP) Wi-Fi Protected Access (WPA) IEEE 802.11i (WPA2) Encryption Wireless Equivalent Privacy (WEP, RC4 Algorithm) Temporal Key Integrity Protocol (TKIP, RC4 Algorithm) Advanced Encryption Standard (AES, Rijndael Algorithm) Encryption Key Provisioning Static (40-bit and 128-bit lengths) Pre-Shared (PSK) Dynamic 802.1X Extensible Authentication Protocol Types EAP-FAST EAP-TLS EAP-TTLS PEAP-GTC PEAP-MSCHAPv2 PEAP-TLS LEAP  Compliance Note: These regulatory certifications are pending. ETSI Regulatory Domain  EN 300 328 EN 301 489-1 EN 301 489-17 EN 301 893 EN 60950-1 2011/65/EU (RoHS) FCC Regulatory Domain FCC 15.247 DTS – 802.11b/g (Wi-Fi) – 2.4 GHz FCC 15.407 UNII – 802.11a (Wi-Fi) – 5 GHz FCC 15.247 DSS – BT 2.1 Industry Canada RSS-247 – 802.11a/b/g/n (Wi-Fi) – 2.4 GHz, 5.8 GHz, 5.2 GHz, and 5.4 GHz RSS-247 – BT 2.1 Certifications Note: These regulatory certifications are pending. Wi-Fi Alliance  802.11a, 802.11b, 802.11g, 802.11n, 802.11ac WPA Enterprise  WPA2 Enterprise  Bluetooth® SIG Qualification Warranty  Three Year Warranty All specifications are subject to change without notice
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  11 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  5 WLAN FUNCTIONAL DESCRIPTION 5.1 Overview The 60-SIPT series SiP module is designed based on the Marvell 88W8997 802.11ac/a/b/g/n chipset. It is optimized for high speed, reliable, and low-power embedded applications. It’s integrated with dual-band WLAN (2.4/5GHz) and Bluetooth 4.2. Its functionality includes:  Improved throughput on the link due to frame aggregation, RIFS (reduced inter-frame spacing), and half guard intervals.  Support for STBC (Space Time Block Codes) and LDPC (Low Density Parity Check) codes.  Improved 11n performance due to features such as 11n frame aggregation (A-MPDU and A-MSDU) and low-overhead host-assisted buffering (RX A-MSDU and RX A-MPDU). These techniques can improve performance and efficiency of applications involving large bulk data transfers such as file transfers or high-resolution video streaming.  IEEE 802.11 ac (Wave 2), 2X2 receive Multi-User MIMIO (MU-MIMO) spatial stream multiplexing with data rate up to MCS9 (866.7Mbps). Additional functionality is listed in the following table (Table 4). Table 4: WLAN functions Feature  Description WLAN MAC  Frame Exchange at the MAC level to deliver data  Received frame filtering and validation (Cyclic Redundancy Check (CRC))  Generation of MAC header and trailer information (MAC protocol Data Units (MPDUs))  Fragmentation of data frames (MAC Service Data Units (MSDUs)  Access Mechanism support for fair access to shared wireless medium through (DCF and EDCA)  A-MPDU Aggregation/Deaggregation (support 802.11ac single –MPDU A-MPDU)  20/40/80 MHz channel Coexistence  RIFS Burst Receive  Management Information Base  Radio Resource Measurement  Quality of Service  Block Acknowledgement  802.11ac Downlink MU-MIMO (receive)  Dynamic Frequency Selection  Beamforming  TIM Frame TX and RX  Multi-BSS/Station  Transmit Rate Adaptation.  Transmit Power Control
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  12 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  Feature  Description WLAN Base Band   802.11ac 2x2 MU-MIMO (with on-chip Marvell RF radio)  Backward compatibility with legacy 802.11 n/a/b/g technology  WLAN/Bluetooth LNA sharing  PHY rate up to 866.7 Mbps  20 MHz bandwidth/channel, 40 MHz bandwidth/channel, upper/lower 20 MHz packets in 40 MHz channel, 20 MHz duplicate legacy packets in 40 MHz channel operation.  80 MHz bandwidth/channel, 4 positions of 20 MHz packets in 80 MHz channel, upper/lower 40 MHz packets in 80 MHz channel, 20 MHz quadruplicate legacy packets in 80 MHz channel mode operation.  Modulation and Coding Scheme (MCS): 802.11ac (MCS0-9. Nsts=1/2); 802.11n (MCS0-15)  Dynamic Frequency Selection (DFS) (Radar detection) – Enhanced radar detection for long and short pulse radar – Enhanced AGC scheme for DFS channel – Japan DFS requirements for W53 and W56  802.11 K Radio Resource Measurement.  802.11ac /802.11n optional MIMO features: 20/40/80 MHz Coexistence with middle-packaged detection (GI detection) for enhanced CCA – One spatial stream STBC reception and transmission – LDPC transmission and reception for 802.11ac and 802.11n – 256 QAM (MCS8-9) modulations supported – Short guard interval – RIFS on receive path for 802.11n packets – 802.11n Greenfield TX/RX  Power Save feature WLAN Security   WLAN Encryption features supported include: – Temporal Key Integrity Protocol (TKIP)/Wired Equivalent Privacy (WEP) – Advanced Encryption Standard (AES)/Counter-Mode/CBC-MAC Protocol (CCMP) – Advanced Encryption Standard (AES)/Cipher-Based Message Authentication Code (CMAC) – Advanced Encryption Standard (AES)/Galois/Counter Mode Protocol (GCMP) – WLAN Authentication and Private Infrastructure (WPAI)
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  13 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  Feature  Description WLAN Channel Channel frequency supported. 20 MHz  40 MHz  80 MHz Channel Freq. (MHz) Channel Freq. (MHz) Channel Freq. (MHz) Channel Freq. (MHz) 1  2412  36  5180  1-5  2422 42  5210 2  2417  40  5200  2-6  2427 58  5290 3 2422 44 5220 3-7 2432 74 5370 4 2427 48 5240 4-8 2437 90 5410 5  2432  52  5260  5-9  2422 106  5530 6  2437  56  5280  6-10  2447 122  5610 7 2422 60 5300 7-11 2452 138 5690 8 2447 64 5320 36-40 5190 155 5775 9 2452 100 5500 44-48 5230   10  2457  104  5520  52-56  5270    11  2462  108  5540  60-64  5310    12 2467 112 5560 68-72 5350   13 2472 116 5580 76-80 5390       120  5600  84-88  5430        124  5620  92-96  5470      128 5640 100-104 5510     132 5660 108-112 5550       136  5680  116-120 5590        140  5700  124-128 5630        144  5720  132-136 5670      149 5745 140-144 5710     153 5765 149-153 5755       157  5785  157-161 5795        161  5805           165 5825
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  14 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  6 BLUETOOTH FUNCTIONAL DESCRIPTION The 60-SIPT series includes a fully-integrated Bluetooth baseband/radio. Several features and functions are listed in Table 5. Table 5: Bluetooth functions Feature  Description Bluetooth Interface  Voice interface: – Hardware support for continual PCM data transmission/reception without processor overhead. – Standard PCM clock rates from 64 kHz to 2.048 MHz with multi-slot handshake and synchronization. – A-law, U-law, and linear voice PCM encoding/decoding.  SDIO interface  High-Speed UART interface  USB 2.0 Bluetooth Core functionality  Bluetooth 4.2  Bluetooth Class 2/Bluetooth class 1  WLAN and Bluetooth share same LNA and antenna  Digital audio interfaces with PCM/TDM interface for voice application  Baseband and radio BDR and EDR package type: 1 Mbps, 2 Mbps, 3 Mbps  Fully functional Bluetooth baseband: AFH, forward error correction, header error control, access code correction, CRC, encryption bit stream generation, and whitening.  Adaptive Frequency Hopping (AFH) using Packet Error Rate (PER)  Interlaced scan for faster connection setup  Simultaneous active ACL connection setup  Automatic ACL package type selection  Full master and slave piconet support  Scatter net support  SCO/eSCO links with hardware accelerated audio signal processing and hardware supported PPEC algorithm for speech quality improvement  All standard SCO/eSCO voice coding  All standard pairing, authentication, link key, and encryption operations  Encryption (AES) support Bluetooth Low Energy   (BLE) Core functionality  Advertiser, Scanner, Initiator, Master, and Slave roles support (connects to 16 links)  WLAN/Bluetooth Coexistence (BCA) protocol support.  Shared RF with BDR/EDR  Encryption (AES) support.  Intelligent Adaptive Frequency Hopping (AFH)  LE privacy 1.2  LE Secure Connection.  LE Data Length Extension  LE Advertising Length Extension.  2Mbps LE  Direction Finding –connectionless Angle of Departure (AoD)  Direction Finding –connectionless Angle of Arrival (AoA)
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  15 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  7 BLOCK DIAGRAM  Figure 1: Block diagram 8 ELECTRICAL CHARACTERISTICS 8.1 Absolute Maximum Ratings  Table 6 summarizes the absolute maximum ratings and Table 7 lists the recommended operating conditions for the 60-SIPT Series. Absolute maximum ratings are those values beyond which damage to the device can occur. Functional operation under these conditions, or at any other condition beyond those indicated in the operational sections of this document, is not recommended. Note: Maximum rating for signals follows the supply domain of the signals.  Table 6: Absolute maximum ratings Symbol (Domain)  Parameter   Max Rating  Unit VIO_SD  WLAN host SDIO interface I/O supply (for 1.8V system)                                                                     (for 3.3V system) 2.2 4.0 V
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  16 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  Symbol (Domain)  Parameter   Max Rating  Unit VIO  I/O configuration power supply (for 1.8V system)                                                          (for 3.3V system) 2.2 4.0 V 3V3  External 3.3V power supply   4.0  V Storage  Storage Temperature   -40 to +85 °C ANT0; ANT1  Maximum RF input (reference to 50-Ω input)   +10  dBm ESD  Electrostatic discharge tolerance   2000  V 8.2 Recommended Operating Conditions Table 7: Recommended Operating Conditions Symbol (Domain)  Parameter   Min  Typ  Max  Unit VIO_SD  WLAN host interface I/O supply   1.62/2.97  1.8/3.3  1.98/3.63 V VIO  WLAN and BT GPIO I/O power supply   1.62/2.97  1.8/3.3  1.98/3.63 V 3V3  External 3.3V power supply   2.97  3.30  3.63  V T-ambient  Ambient temperature   -30  25  85  °C 8.3 DC Electrical Characteristics Table 8 and Table 9 list the general DC electrical characteristics over recommended operating conditions (unless otherwise specified). Table 8: General DC electrical characteristics (For 1.8V operation VIO_SD; VIO) Symbol  Parameter  Conditions  Min  Typ  Max  Unit VIH  High Level Input Voltage  --  1.26    2.2  V VIL  Low Level Input Voltage  --  -0.4    0.54  V VHYS  Input Hysteresis  --  100      mV VOH  Output high Voltage  --  1.4      V VOL  Output low Voltage  --      0.4  V Table 9: General DC electrical characteristics (For 3.3V operation VIO_SD; VIO) Symbol Parameter  Conditions  Min  Typ Max  Unit VIH  High Level Input Voltage  --  2.4    3.6  V VIL  Low Level Input Voltage  --  -0.4    0.9  V VHYS  Input Hysteresis  --  100      mV VOH  Output high Voltage  --  2.9      V VOL  Output low Voltage  --      0.4  V Table 10: DC electrical characteristics for 1.8V or 3.3V operation on special pads (PCIE_WAKEn, PCIE_CLKREQn) Symbol  Parameter  Conditions  Min  Typ  Max  Unit VIH  High Level Input Voltage  --  1.4    3.6  V VIL  Low Level Input Voltage  --  -0.4    0.8  V
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  17 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  Symbol  Parameter  Conditions  Min  Typ  Max  Unit VHYS  Input Hysteresis  --  150      mV VOL  Output low Voltage  --      0.4  V 8.4 WLAN Radio Receiver Characteristics Table 11 and Table 12 summarize the WLAN 60-SIPT series receiver characteristics. Table 11: WLAN receiver characteristics for 2.4 GHz signal chain operation Symbol  Parameter  Conditions  Min  Typ  Max  Unit Frx  Receive input frequency range   2.412   2.484  GHz Srf       Sensitivity CCK, 1 Mbps See Note1   -95   dBm CCK, 11 Mbps    -90   OFDM, 6 Mbps    -91   OFDM, 54 Mbps    -75   HT20, MCS0    -91   HT20, MCS7    -73   Radj   Adjacent channel rejection  OFDM, 6 Mbps See Note1   TBD   dB OFDM, 54 Mbps    TBD   HT20, MCS0    TBD   HT20, MCS7    TBD   Table 12: WLAN Receiver Characteristics for 5 GHz Dual Chain Operation Symbol  Parameter  Conditions  Min Typ  Max  Unit Frx  Receive input frequency range   5.15   5.825  GHz Srf       Sensitivity OFDM, 6 Mbps See Note1   -89   dBm OFDM, 54 Mbps    -74   HT20, MCS0    -89   HT20, MCS7    -70   HT40, MCS0    -86   HT40, MCS7    -69   Radj  Adjacent channel rejection OFDM, 6 Mbps See Note1   TBD   dB OFDM, 54 Mbps    TBD   HT20, MCS0    TBD   HT20, MCS7    TBD    Note1: Performance data are measured under single chain operation.
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  18 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  8.5 WLAN Transmitter Characteristics Table 13: WLAN transmitter characteristics for 2.4 GHz per chain operation Symbol  Parameter  Conditions  Min  Typ  Max  Unit Ftx  Transmit output frequency range   2.412    2.484  GHz Pout  Output power  See Note7        11b mask compliant  1-11Mbps    18   dBm 11g mask compliant  6-36Mbps    18   11g EVM compliant  48-54Mbps    16   11n HT20 mask compliant  MCS0-5/MCS8-13    18   11n HT20 EVM compliant  MCS6-7/MCS14-15   16   11n HT40 mask compliant  MCS0-5/MCS8-13    16   11n HT40 EVM compliant  MCS6-7/MCS14-15   14   ATx  Transmit power accuracy at 25    -  -2.0  -  +2.0  dB  Freq.  Mode/Rate (Mbps) Output Power Per Chain (dBm) Typical Current Consumption Single Chain (mA)8 Max. Current Consumption Single Chain (mA)8 2412MHz  1 Mbps   18dBm  340  620  54 Mbps   16dBm  280  500 HT20 MCS7  16dBm  280  510 2422MHz   1 Mbps   18dBm  340  620  54 Mbps   16dBm  280  500 HT20 MCS7  16dBm  280  510 2472MHz   1 Mbps   18dBm  340  620  54 Mbps   16dBm  280  500 HT20 MCS7  16dBm  280  510 Table 14: WLAN transmitter characteristics for 5 GHz per chain operation Symbol  Parameter  Conditions  Min  Typ  Max  Unit Ftx  Transmit output frequency range    5.15    5.925 GHz Pout  Output power  See Note3        11a mask compliant  6-36Mbps    18   dBm 11a EVM compliant  48-54Mbps    16   11n HT20 mask compliant  MCS0-5/MCS8-13    18   11n HT20 EVM compliant  MCS6-7/MCS14-15   16   11n HT40 mask compliant  MCS0-5/MCS8-13    16   11n HT40 EVM compliant  MCS6-7/MCS14-15   14   11ac HT20 mask compliant  MCS0-6 (Ntst=1,2)    18   11ac HT20 EVM compliant  MCS7-8(Ntst=1,2)    16   11ac HT40 mask compliant  MCS0-5 (Ntst=1,2)    16   11ac HT40 EVM compliant  MCS6-8(Ntst=1,2)    14   11ac HT40 EVM compliant  MCS9(Ntst=1,2)    12
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  19 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  Symbol  Parameter  Conditions  Min  Typ  Max  Unit 11ac HT80 mask compliant  MCS0-5 (Ntst=1,2)    14   11ac HT80 EVM compliant  MCS6-8(Ntst=1,2)    12   11ac HT80 EVM compliant  MCS9(Ntst=1,2)    10   ATx  Transmit power accuracy at 25    -  -2.0  -  +2.0  dB Table 15: WLAN current consumption on 5 GHz Freq.  Mode/Rate [Mbps] Output Power Per Chain [dBm] Typical Current Consumption Single Chain (mA) Typical Current Consumption Dual Chain (mA)   5180 MHz   5190 MHz 6 Mbps  18 dBm  400  710 54 Mbps  16 dBm  330  610 HT20 MCS0  18 dBm  400  720 HT20 MCS7  16 dBm  360  620 HT40 MCS7  14 dBm  320  550   5500 MHz   5510 MHz 6 Mbps  18 dBm  380  680 54 Mbps  16 dBm  330  600 HT20 MCS0  18 dBm  370  690 HT20 MCS7  16 dBm  320  600 HT40 MCS7  14 dBm  300  530   5825 MHz   5795 MHz 6 Mbps  18 dBm  380  690 54 Mbps  16 dBm  310  600 HT20 MCS0  18 dBm  360  710 HT20 MCS7  16 dBm  340  550 HT40 MCS7  14 dBm  300  530 Note:     Final TX power values on each channel are limited by the regulatory certification test limit. 9 BLUETOOTH RADIO CHARACTERISTICS Table 16 through Table 17 describe the basic rate transmitter performance, enhanced data transmitter performance, basic rate receiver performance, enhanced rate receiver performance, and current consumption conditions at 25°C. Table 16: Basic rate transmitter performance temperature at 25°C (3.3V) Test Parameter  Min  Typ  Max  BT Spec.  Unit Maximum RF Output Power  8  10  11  0 ~ +20  dBm Frequency Range  2.4  —  2.4835 2.4 ≤ f ≤ 2.4835  GHz 20 dB Bandwidth  —  919.5  —  ≤ 1000  KHz Δf1avg Maximum Modulation  140  165  175  140 < Δf1avg < 175  KHz Δf2max Minimum Modulation  —  135  —  ≥ 115  KHz Δf2avg/Δf1avg  —  0.9  —  ≥ 0.80  —
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  20 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  Initial Carrier Frequency  —  +/-5  —  ≤±75  KHz Drift Rate (DH1 package)  —  4  —  ≤ 20  KHz/50 µs Drift (DH3 packet)  —  8  —  ≤25  KHz Drift (DH5 packet)  —  7  —  ≤ 40  KHz Adjacent Channel Power F≥ ± 3MHz  —  -50  —  < -40  dBm F = ± 2MHz  —  -46  —  ≤ -20  dBm F = ± 1MHz  —  -15  —  N/A  dBm Table 17: Enhanced data rate transmitter performance 25°C (3.3V) Test Parameter  Min  Typ  Max  BT Spec.  Unit Relative Transmit Power  5  7  9    dBm Max Carrier Frequency Stability |wo| 2-DH5  —  1  —  ≤ ±10  KHz 3-DH5  —  1  — Max Carrier Frequency Stability |wi| 2-DH5  —  4  —  ≤ ±75  KHz 3-DH5  —  4  — Max Carrier Frequency Stability |w0+wi| 2-DH5  —  5  —  ≤ ±75  KHz 3-DH5  —  5  — RMS DEVM  2-DH5  —  4  —  ≤ 20  % 3-DH5  —  4  —  ≤13  % Peak DEVM  2-DH5  —  9  —  ≤ 35  % 3-DH5  —  9  —  ≤ 25  % 99% DEVM  2-DH5  —  12  —  ≤ 30  % 3-DH5  —  12  —  ≤ 20  % EDR Differential Phase Encoding  —  99  —  ≥ 99  % Adjacent Channel Power  F≥ ± 3MHz  —  TBD  —  < -40  dBm F = ± 2MHz  —  TBD  —  ≤ -20  dBm Table 18: Basic rate receiver performance at 3.3V Test Parameter  Min  Typ  Max  BT Spec.  Unit Sensitivity (1DH5)  BER ≤ 0.1%  —  -95  -92  ≤ -70  dBm Maximum Input  BER ≤ 0.1%  -20  -10  —  ≥ -20  dBm Carrier-to-Interferer Ratio (C/I) Co-Channel  —  10  11  11   C/I (± 1 MHz)  —  -4  0  0  dB C/I (± 2 MHz)  —  -45  —  -30  dB C/I (± 3 MHz)  —  -49  —  -40  dB Maximum Level of Intermodulation Interferers -39  -30  -  ≥ -39  dBm
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  21 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  Table 19: Enhanced data rate receiver performance 3.3V Test Parameter  Min  Typ  Max  Bluetooth Specification  Unit Sensitivity (BER ≤0.01%) π/4 DQPSK  —  -94  -91  ≤ -70  dBm 8 DPSK  —  -88  -85  ≤ -70  dBm Maximum Input (BER ≤0.1%)  π/4 DQPSK  -20  —  —  ≥ -20  dBm 8 DPSK  -20  —  —  ≥ -20  dBm Co-Channel C/I (BER ≤0.1%)  π/4 DQPSK  —  10  13  ≤ ±13  dB 8 DPSK  —  16  20  ≤ ±20  dB Adjacent Channel C/I (1MHz)  π/4 DQPSK  —  -9  0  ≤ 0  dB 8 DPSK  —  -6  5  ≤5  dB Second Adjacent Channel C/I (2MHz) π/4 DQPSK  —  -47  -30  ≤ -30  dB 8 DPSK  —  -42  -25  ≤ -25  dB Third Adjacent Channel C/I (3MHz) π/4 DQPSK  —  -51  -40  ≤ -40  dB 8 DPSK  —  -48  -33  ≤ -33  dB Out-of-band blocking 30-2000MHz —  -12.5  —  —  dBm 2-2.399GHz —  -12.4  —  —  dBm 2.484-3GHz —  -18  —  —  dBm 3-12.75GHz —  -2.6  —  —  dBm
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  22 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  10 HOST INTERFACE SPECIFICATIONS 10.1 SDIO Specifications The 60-SIPT series SDIO host interface pins are powered from the VIO_SD voltage supply. The SDIO electrical specifications are identical for the 1-bit SDIO and 4-bit SDIO modes. 10.1.1 Default Speed, High-speed Modes  Figure 2: SDIO protocol timing diagram--- default mode (3.3V)  Figure 3: SDIO protocol timing diagram--- High-Speed mode (3.3V) Note:   Over full range of values specified in the Recommended Operating Conditions unless otherwise specified. Table 20: SDIO timing requirements Symbol  Parameter  Condition  Min.  Typ.  Max.  Unit fPP  Clock Frequency   Default Speed High-Speed 0 0 - - 25 50  MHz
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  23 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  Symbol  Parameter  Condition  Min.  Typ.  Max.  Unit TWL  Clock low time  Default Speed High-Speed 10 7 - - - -  ns TWH  Clock high time  Default Speed High-Speed 10 7 - - - -  ns TISU  Input Setup time  Default Speed High-Speed 5 6 - - - -  ns TIH  Input Hold time  Default Speed High-Speed 5 2 - - - -  ns TODLY Output delay time CL 40pF (1 card) Default Speed High-Speed - - - - 14 14  ns TOH  Output hold time  High-Speed 0  -  -  ns 10.1.2 SDR12, SDR25, SDR50 Mode (up to 100MHz) (1.8V)  Figure 4: SDIO protocol timing Diagram--- SDR12, SDR25, SDR50 modes (up to 100 MHz) (1.8V) Note:   Over full range of values specified in the Recommended Operating Conditions unless otherwise specified. Table 21: SDIO timing requirements--- SDR12, SDR25, SDR50 modes (up to 100 MHz) (1.8V) Symbol  Parameter  Condition  Min.  Typ.  Max.  Unit fPP  Clock Frequency   SDR12/25/50 25  -  100  MHz TISU  Input setup time  SDR12/25/50 3  --  -  ns TIH  Input Hold time  SDR12/25/50 0.8  -  -  ns TCLK  Clock Time  SDR12/25/50  10  -  40  ns TCR, TCF Raise time, Fall time TCR, TCF <2ns (max) at 100MHz CCARD=10pF SDR12/25/50  -  -  0.2*TCLK ns
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  24 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  Symbol  Parameter  Condition  Min.  Typ.  Max.  Unit TODLY Output delay time CL30pF   SDR12/25/50 -  -  7.5  ns TOH Output hold time CL=15pF  SDR12/25/50 1.5  -  -  ns 10.1.3 SDR104 Mode (208MHz) (1.8V)  Figure 5: SDIO protocol timing Diagram--- SDR104 modes (up to 208 MHz) (1.8V) Note:  Over full range of values specified in the Recommended Operating Conditions unless otherwise specified. Table 22: SDIO timing requirements--- SDR104 modes (up to 208MHz) (1.8V) Symbol  Parameter  Condition  Min.  Typ.  Max.  Unit fPP  Clock Frequency   SDR104 0  -  208  MHz TISU  Input setup time  SDR104 1.4  --  -  ns TIH  Input Hold time  SDR104 0.8  -  -  ns TCLK  Clock Time  SDR104  4.8  -  -  ns TCR, TCF Raise time, Fall time TCR, TCF <0.96ns (max) at 208MHz CCARD=10pF SDR104 -  -  0.2*TCLK ns TOP  Card Output phase  SDR104 0  -  10  ns TODW Output timing pf variable data window  SDR12/25/50 2.88  -  -  ns
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  25 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  10.1.4 DDR50 Mode (50MHz) (1.8V)  Figure 6: SDIO CMD timing diagram--- DDR50 modes (50 MHz) (1.8V)  Figure 7: SDIO DAT[3:0] timing Diagram--- DDR50 modes (50 MHz) (1.8V) Note:   In DDR50 mode, DAT[3:0] lines are samples on both edges pf the clock (not applicable for CMD line)  Table 23: SDIO timing requirements – DDR50 modes (50 MHz) Symbol  Parameter  Condition  Min.  Typ.  Max.  Unit Clock TCLK Clock time 50MHz (max) between rising edge  DDR50 20  --  --  ns TCR, TCF Rise time, fall time TCR, TCF <4.00ns (max) at 50MHz. CCARD=10pF DDR50 --  --  0.2*TCLK  ns Clock Duty  --  DDR50 45  --  55  % CMD Input (referenced to clock rising edge) TIS Input setup time CCARD DDR50  6  --  --  ns
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  26 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  Symbol  Parameter  Condition  Min.  Typ.  Max.  Unit TIH Input hold time CCARD DDR50  0.8  --  --  ns CMD Output (referenced to clock rising and failing edge) TODLY Output delay time during data transfer mode CL30pF (1 card) DDR50 --  --  13.7  ns TOHLD Output hold time CL≥15pF (1 card)  DDR50 1.5  --  --  ns DAT[3:0] Input (referenced to clock rising and failing edges) TIS2X Input setup time CCARD DDR50  3  --  --  ns TIH2X Input hold time CCARD DDR50  0.8  --  --  ns DAT[3:0] Output (referenced to clock rising and failing edges) TODLY2X (max) Output delay time during data transfer mode  CL25pF (1 card) DDR50  --  --  7.0  ns TODLY2X (min) Output hold time CL≥15pF (1 card))  DDR50  1.5  --  --  ns 10.2 PCI Express Specifications The PCI Express host interface pins are powered from the 1.8V generated by the PMU inside the 60-SIPT series. 10.2.1 Differential TX Output Electricals Note:   Over full range of values specified in the Recommended Operating Conditions unless otherwise specified. Table 24: PCI Express TX Output Specifications – 2.5GT/s Symbol  Parameter  Min.  Typ. Max.  Unit UI Unit interval (UI) The specified UI is equivalent to a tolerance of +/-300ppm for each Refclk source. Period does not account for SSC induced variations. 399.88  -  400.12 Ps  VTX-DIFF-PP Differential peak-to-peak TX voltage swing  VTX-DIFF-PP=2* VTXD+  – VTXD-│  0.8  -  1.2  V VTX-DIFF-PP-LOW Low power differential peak-to-peak TX voltage swing  VTX-DIFF-PP=2* VTXD+  – VTXD-│ 0.4  -  1.2  V VTX-DE-RATIO-3.5dB  Tx de-emphasis level ratio (3.5dB)  3.0  -  4.0  V TTX-EYE  Tx eye including all jitter sources  0.75  -  -  UI
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  27 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  Symbol  Parameter  Min.  Typ. Max.  Unit TTX-EYE-MEDIAN-to-MAX-JITTER Maximum time between jitter median and maximum deviation from median  -  -  0.125 UI TTX-RISE-FALL Tx rise/fall time Measured differentially from 20% to 80%  0.125  -  -  UI RLTX-DIFF  Tx package plus Si differential return loss  10  -  -  dB RLTX-CM  Tx package plus Si common mode return loss  6  -  -  dB VTX-CM-AC-P  Tx AC common mode voltage  -  20  -  mV ITX-SHORT  Tx short circuit current limit  -  -  90  mA VTX-DC-CM  Tx DC common mode voltage  -  -  3.6  V VTX-CM-DC-ACTIVE-IDLE-DELTA Absolute delta of DC common mode voltage during L0 and electrical idle.  0  -  100  mV VTX-IDLE-DIFF-AC-p  Electrical idle differential peak output voltage  0  -  20  mV TTX-IDLE-MIN  Minimum time spent in electrical idle  20  -  -  ns TTX-IDLE-SET-TO-IDLE Maximum time to transition to a valid electrical idle after sending an electrical idle ordered set  -  -  8  ns TTX-IDLE-TO-DIFF-DATA Maximum time to transition to valid diff signalling after leaving electrical idle  -  -  8  ns TCROSLINK  Crosslink random timeout  -  -  1.0  ms CTX  AC coupling capacitor  75  -  200  nF Note:   Over full range of values specified in the Recommended Operating Conditions unless otherwise specified. Table 25: PCI Express TX Output Specifications - 5GT/s Symbol  Parameter  Min.  Typ. Max.  Unit UI Unit interval (UI) The specified UI is equivalent to a tolerance of +/-300ppm for each Refclk source. Period does not account for SSC induced variations. 199.94  -  200.06 Ps  VTX-DIFF-PP Differential peak-to-peak TX voltage swing  VTX-DIFF-PP=2* VTXD+  – VTXD-│  0.8  -  1.2  V VTX-DIFF-PP-LOW Low power differential peak-to-peak TX voltage swing  VTX-DIFF-PP=2* VTXD+  – VTXD-│ 0.4  -  1.2  V VTX-DE-RATIO-3.5dB  Tx de-emphasis level ratio (3.5dB)  3.0  -  4.0  V VTX-DE-RATIO-6dB  Tx de-emphasis level ratio (6dB)  5.5  -  6.5  V TMIN-PULSE Instantaneous lone pulse width  Measured relative to rising/failing pulse  0.9  -  -  UI TTX-EYE  Tx eye including all jitter sources  0.75  -  -  UI TTX-HF-DJ-DD Tx deterministic jitter > 1.5MHz Deterministic jitter only  -  -  0.15  UI
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  28 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  Symbol  Parameter  Min.  Typ. Max.  Unit TTX-LF-RMS Tx RMS jitter<1.5MHz Total energy measured over a 10KHz-1.5MHz range -  3.0  -  Ps RMS TTX-RISE-FALL Tx rise/fall time Measured differentially from 20% to 80%  0.15  -  -  UI RLTX-DIFF Tx package plus Si differential return loss  (0.05-1.25GHz) (1.25-2.5GHz) 10 8  -  -  dB RLTX-CM Tx package plus Si common mode return loss  6  -  -  dB VTX-CM-AC-PP  Tx AC common mode voltage  -  -  100  mV ITX-SHORT  Tx short circuit current limit  -  -  90  mA VTX-DC-CM  Tx DC common mode voltage  -  -  3.6  V VTX-CM-DC-ACTIVE-IDLE-DELTA Absolute delta of DC common mode voltage during L0 and electrical idle.  0  -  100  mV VTX-IDLE-DIFF-AC-p Electrical idle differential peak output voltage VTX-IDLE-DIFF-DC= VTX-IDLE-D+  VTX-IDLE-D-20mV 0  -  20  mV VTX-IDLE-DIFF-DC DC Electrical idle differential output voltage VTX-IDLE-DIFF-DC= VTX-IDLE-D+  VTX-IDLE-D-5mV  0  -  5  mV VTX-RCVDETECT  Voltage change allowed during receiver detection 0  -  600  mV TTX-IDLE-MIN  Minimum time spent in electrical idle  20  -  -  ns TTX-IDLE-SET-TO-IDLE Maximum time to transition to a valid electrical idle after sending an electrical idle ordered set  -  -  8  ns TTX-IDLE-TO-DIFF-DATA Maximum time to transition to valid diff signalling after leaving electrical idle  -  -  8  ns TCROSLINK  Crosslink random timeout  -  -  1.0  ms CTX  AC coupling capacitor  75  -  200  nF 10.2.2 Differential RX input Electricals Note:   Over full range of values specified in the Recommended Operating Conditions unless otherwise specified. Table 26: PCI Express RX Output Specifications – 2.5GT/s Symbol  Parameter  Min.  Typ. Max.  Unit UI Unit interval (UI) The specified UI is equivalent to a tolerance of +/-300ppm for each Refclk source. Period does not account for SSC induced variations. 399.88  -  400.12 Ps  VRX-DIFF-PP-CC Differential RX peak-to-peak voltage for common Refclk RX architecture  0.175  -  1.2  V VRX-DIFF-PP-DC Differential RX peak-to-peak voltage for data clocked Refclk RX architecture  0.175  -  1.2  V
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  29 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  Symbol  Parameter  Min.  Typ. Max.  Unit TRX-EYE Rx eye time opening Minimum eye time at Rx pins to yield a 10-12 BER  0.4  -  -  UI TRX-EYE-MEDIAN-to-MAX-JITTER Maximum time delta between median and deviation from median  -  -  0.3  UI VRX-CM-ACp  AC peak common mode input voltage  -  -  150  mV RLRX-DIFF  Differential return loss  15  -  -  dB RLRX-CM  Common mode return loss  0  -  3.6  dB ZRX-DIFF-DC  DC differential input impedance  80  100  120  Ω ZRX-DC  DC input impedance  40  50  60  Ω ZRX-HIGH-IMP-DC  Powered down DC input impedance  200  -  -  KΩ VRX-IDLE-DET-DIFF-p-p  Electrical idle detect threshold  65  -  175  mV TRX-IDLE-DIFF-ENTERTIME Unexpected electrical idle enter detect threshold integration time  -  -  10  ms LRX-SKEW  Total Skew  -  -  20  ns Note:   Over full range of values specified in the Recommended Operating Conditions unless otherwise specified. Table 27: PCI Express RX Output Specifications – 5GT/s Symbol  Parameter  Min.  Typ. Max.  Unit UI Unit interval (UI) The specified UI is equivalent to a tolerance of +/-300ppm for each Refclk source. Period does not account for SSC induced variations. 199.94  -  200.06 ps  VRX-DIFF-PP-CC Differential RX peak-to-peak voltage for common Refclk RX architecture  0.12  -  1.2  V VRX-DIFF-PP-DC Differential RX peak-to-peak voltage for data clocked Refclk RX architecture  0.1  -  1.2  V TRX-TJ-CC Maximum Rx inherent total timing error for common Refclk RX architecture  -  -  0.4  UI TRX-TJ-DC Maximum Rx inherent total timing error for data clocked RX architecture  -  -  0.34  UI TRX-DJ-DD-CC Maximum Rx inherent deterministic timing error for common Refclk RX architecture  -  -  0.3  UI TRX-DJ-DD-DC Maximum Rx inherent deterministic timing error for data clocked RX architecture  -  -  0.24  UI TRX-MIN-PULSE  Minimum width pulse at Rx  0.6  -  -  UI VRX-CM-ACp  AC peak common mode input voltage  -  -  150  mV RLRX-DIFF  Differential return loss  15  -  -  dB RLRX-CM  Common mode return loss  1-  -  3.6  dB ZRX-DIFF-DC  DC differential input impedance  80  100  120  Ω ZRX-DC  DC input impedance  40  50  60  Ω
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  30 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  Symbol  Parameter  Min.  Typ. Max.  Unit ZRX-HIGH-IMP-DC  Powered down DC input impedance  200  -  -  KΩ VRX-IDLE-DET-DIFF-p-p  Electrical idle detect threshold  65  -  175  mV TRX-IDLE-DIFF-ENTERTIME Unexpected electrical idle enter detect threshold integration time  -  -  10  ms LRX-SKEW  Total Skew  -  -  20  ns 10.3 USB Specifications 10.3.1 USB LS Driver and Receiver Parameters Notes:   Over full range of values specified in the Recommended Operating Conditions unless otherwise specified.   The load is 100Ω differential for these parameters, unless other specified. Table 28: USB LS Driver and Receiver Specifications Symbol  Parameter  Min.  Typ. Max.  Unit BR  Baud rate  -  1.5  -  Mbps BRPPM  Baud rate tolerance  -15000 -  15000 ppm Driver Specifications VOH Output signal ended high Defined with 1.425KΩ pull-up resistor to 3.6V  2.8  -  3.6  V VOL Output signal ended low Defined with 1.425KΩ pull-up resistor to ground  0.0  -  0.3  V VCRS  Output signal crossover voltage  1.3    2.0  V TLR Data fall time Defined from 10% to 90% for raise time and 90% to 10% for fall time 75.0  -  300.0 ns TLF Data rise time Defined from 10% to 90% for raise time and 90% to 10% for fall time 75.0  -  300.0 ns TLRFM  Rise and fall time matching  80.0  -  125.0 % TUDJ1 Source jitter total: to next transition *Including frequency tolerance. Timing difference between the differential data signals. *Defined at crossover point of differential signals  -95  -  95  ns TUDJ2 Source jitter total: for paired transitions *Including frequency tolerance. Timing difference between the differential data signals. *Defined at crossover point of differential signals  -150  -  150  ns Receiver Specifications
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  31 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  10.3.2 USB FS Driver and Receiver Parameters Notes:  Over full range of values specified in the Recommended Operating Conditions unless otherwise specified.  The load is 100Ω differential for these parameters, unless other specified. Table 29: USB FS Driver and Receiver Specifications Symbol  Parameter  Min.  Typ. Max.  Unit BR  Baud rate  -  12.0 -  Mbps BRPPM  Baud rate tolerance  -2500  -  2500  ppm Driver Specifications VOH Output signal ended high Defined with 1.425KΩ pull-up resistor to 3.6V  2.8  -  3.6  V VOL Output signal ended low Defined with 1.425KΩ pull-up resistor to ground  0.0  -  0.3  V VCRS  Output signal crossover voltage  1.3    2.0  V TFR Output raise time Defined from 10% to 90% for raise time and 90% to 10% for fall time -4.0  -  20.0  ns TFL Output fall time Defined from 10% to 90% for raise time and 90% to 10% for fall time -4.0  -  20.0  ns TDJ1 Source jitter total: to next transition *Including frequency tolerance. Timing difference between the differential data signals. *Defined at crossover point of differential signals  -3.5  -  3.5  ns TDJ2 Source jitter total: for paired transitions *Including frequency tolerance. Timing difference between the differential data signals. *Defined at crossover point of differential signals  -4.0  -  4.0  ns TFDEOP Source jitter for differential transition to SE0 transition. Defined at crossover point of differential signals  -2.0  -  5.0  ns Receiver Specifications VIH  Input signal ended high  2.0  -  -  V VIL  Input signal ended low  -  -  0.8  V VDI  Differential input sensitivity  0.2  -  -  V TJR1  Receiver jitter: to next transition  -18.5  -  18.5  ns VIH  Input signal ended high  2.0  -  -  V VIL  Input signal ended low  -  -  0.8  V VDI  Differential input sensitivity  0.2  -  -  V
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  32 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  Symbol  Parameter  Min.  Typ. Max.  Unit Defined at crossover point of differential data signals TJR2 Receiver jitter: for paired transitions Defined at crossover point of differential data signals -9.0  -  9.0  ns 10.3.3 USB HS Driver and Receiver Parameters Notes:    Over full range of values specified in the Recommended Operating Conditions unless otherwise specified.  The load is 100Ω differential for these parameters, unless other specified. Table 30: USB HS Driver and Receiver Specifications Symbol  Parameter  Min.  Typ. Max.  Unit BR  Baud rate  -  480  -  Mbps BRPPM  Baud rate tolerance  -500  -  500  ppm Driver Specifications VHSOH  Data signal high  360  -  440  mV VHSOL  Data signal low  -10  -  10  mV THSR Data rise time Defined from 10% to 90% for raise time and 90% to 10% for fall time 500  -  -  ns THSF Data fall time Defined from 10% to 90% for raise time and 90% to 10% for fall time -500  -  -  ns Receiver Specifications VHSCM  Input signal ended low  -50  -  500  mV
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  33 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  10.4 PCM Interface Specifications  Figure 8: PCM Timing Specification – Master Mode Table 31: PCM Timing Specification – Master Mode Symbol  Parameter  Min.  Typ.  Max.  Unit FBCLK  -  -  2/2.048  -  MHz Duty CycleBCLK  -  0.4  0.5  0.6  - TBCLK rise/fall  -  -  3  -  ns TDO  -  -  -  15  ns TDISU  -  20  -  -  ns TDIHO  -  15  -  -  ns TBF  -  -  -  15  ns  Figure 9: PCM Timing Specification – Slave Mode Table 32: PCM Timing Specification – Slave Mode Symbol  Parameter  Min.  Typ.  Max.  Unit FBCLK  -  -  2/2.048  -  MHz Duty CycleBCLK  -  0.4  0.5  0.6  - TBCLK rise/fall  -  -  3  -  ns
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  34 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  Symbol  Parameter  Min.  Typ.  Max.  Unit TDO  -  -  -  30  ns TDISU  -  15  -  -  ns TDIHO  -  10  -  -  ns TBFSU  -  15  -  -  ns TBFHO  -  10  -  -  ns 11 PIN DEFINITIONS Note:   AVDD18 is generated by PMU internally. No need to power from outside the SIP. Table 33: Pin definitions of 60-SIPT series Pin #  Name  Type  Voltage  Ref.  Description  If Not Used 1  PDn  I  - Full Power-Down (input) (Active low) 0=full power-down mode; 1=normal mode PDn can accept an input range from 1.8V to 3.6V PDn must be high for normal operation. Please connect to pin-32 (1.8V_OUT) through 49.9KΩ. -- 2  GND  -  -  Ground  GND 3  GND  -  -  Ground GND 4  ANT0 (Wi-Fi/BT)  A,I/O  -  RF Transmit/Receive  Wi-Fi and BT share the same path. 50Ω Load 5  GND  -  -  Ground  GND 6  GND  -  -  Ground  GND 7  GND  -  -  Ground  GND 8  GND  -  -  Ground  GND 9  GND  -  -  Ground  GND 10 GND  -  -  Ground  GND 11 GND  -  -  Ground  GND 12 ANT1 (Wi-Fi only)  A,I/O  -  RF Transmit/Receive  Wi-Fi  only 50Ω Load 13 GND  -  -  Ground  GND 14 GND  -  -  Ground  GND 15 CONFIG_HOST2  I, PU  AVDD18 Host interface configuration setting. Detail configuration table are shown in Table 32 To set a configuration bit to “0”, attach a 100kΩ resistor from the pin to ground. No external circuitry is required to set a configuration bit to “1”. - 16 CONFIG_HOST1  I, PU  AVDD18 Host interface configuration setting. Detail configuration table are shown in Table 32 To set a configuration bit to “0”, attach a 100kΩ resistor from the pin to ground. -
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  35 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  Pin #  Name  Type  Voltage  Ref.  Description  If Not Used No external circuitry is required to set a configuration bit to “1”. 17 CONFIG_HOST0  I, PU  AVDD18 Host interface configuration setting. Detail configuration table are shown in Table 32 To set a configuration bit to “0”, attach a 100kΩ resistor from the pin to ground. No external circuitry is required to set a configuration bit to “1”. - 18 GND  -  -  Ground  GND 19 PCM_CLK  I/O  VIO PCM Clock Signal (Optimal) Optimal clock used for some codecs. Output if Master mode; Input if Slave mode. N/C 20 PCM_DOUT  O  VIO  PCM Data   N/C 21 PCM_SYNC  I/O  VIO  PCM Sync Pulse Signal Output if Master mode; Input if Slave mode.  N/C 22 PCM_DIN  I  VIO  PCM Data  N/C 23 GPIO0  I/O  VIO  General purpose I/O pin.  N/C 24 GND  -  -  Ground  GND 25 PCIE_WAKEn  I/O  VIO  PCIe wake signal (input/output) (active low)  N/C 26 PCIE_CLKREQn  I/O  VIO  PCIe clock request (input/output) (active low)  GND 27 PCIE_PERSTn  I, PD  VIO  PCIe host indication to reset the device (input) (active low)  N/C 28 PCIE_W_DISABLEn  I, PU  VIO  PCIe host indication to disable the WLAN function of the device (input) (active low)  N/C 29 LTE_SOUT/ JTAG_TDO O, PD O, PD  VIO  Serial data to external LTE device/ JTAG Test Data Out (TDO)  N/C 30 LTE_SIN/ JTAG_TDI I, PD I, PD  VIO  Serial data from external LTE device/ JTAG Test Data Input (TDI)  N/C 31 VIO  Power  -  1.8V/2.5V/3.3V Digital I/O Power Supply  - 32 1.8V_OUT  Power  - 1.8V output from 60-SIPT series. Used to pull-up the PDn pin for POR. Note:  Do NOT used as power source for other circuits. N/C 33 GND  -  -  Ground  GND 34 32KHz  I, PU  VIO Sleep Clock Input An external sleep clock of 32.768KHz with minimum +/-250ppm is required for power saving mode - 35 GND  -  -  Ground  GND 36 PCIE_RCLK_N  I  AVDD18 PCIe Differential Clock Input-Negative  N/C 37 PCIE_RCLK_P  I  AVDD18 PCIe Differential Clock Input-Positive  N/C 38 GND  -  -  Ground  GND
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  36 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  Pin #  Name  Type  Voltage  Ref.  Description  If Not Used 39 PCIE_TX_P  O  AVDD18 PCIe Transmit Data-Positive  N/C 40 PCIE_TX_N  O  AVDD18 PCIe Transmit Data-Negative  N/C 41 GND  -  -  Ground  GND 42 PCIE_RX_N  I  AVDD18 PCIe Receive Data-Negative  N/C 43 PCIE_RX_P  I  AVDD18 PCIe Receive Data-Positive  N/C 44 GND  -  -  Ground  GND 45 USB_DN  I/O  3V3  USB Differential Data-Negative  N/C 46 USB_DP  I/O  3V3  USB Differential Data-Positive  N/C 47 GND  -  -  Ground  GND 48 3V3  Power  - 3.3V module power supply Note: A 10u MLCC is needed for this pin. Place the capacitor close to this pin as possible. Ref. parts: GRM188R60J106ME47D (MURATA)                     or CC0805KKX7R6BB106 (YAGO) - 49 3V3  Power  - 3.3V module power supply Note:  A 10u MLCC is needed for this pin. Place the capacitor close to this pin as possible. Ref. parts: GRM188R60J106ME47D (MURATA)                     or CC0805KKX7R6BB106 (YAGO) - 50 GND  -  -  Ground  GND 51 PMU_EN  I   Enable input for all Regulators inside the 60-SIPT series when it is “H” state. The 60-SIPT will be off when it is “L” state. Note: DO NOT float this pin. Pull-up to 3.3V with 100K for normal operation. 100K, PU 52 VIO_SD  Power  -  1.8V/3.3V Digital I/O SDIO Power Supply  - 53 SDIO_DATA0  I/O, PU VIO_SD  SDIO 4-bit Mode DATA line Bit[0]  N/C 54 SDIO_DATA1  I/O, PU VIO_SD  SDIO 4-bit Mode DATA line Bit[1]  N/C 55 SDIO_DATA2  I/O, PU VIO_SD  SDIO 4-bit Mode DATA line Bit[2]  N/C 56 SDIO_DATA3  I/O, PU VIO_SD  SDIO 4-bit Mode DATA line Bit[3]  N/C 57 SDIO_CMD  I/O, PU VIO_SD  SDIO 4-bit Mode Command/Response   N/C 58 SDIO_CLK  I, PU VIO_SD  SDIO 4-bit Mode Clock Input  N/C 59 GND  -  -  Ground  GND 60 UART_TXD  O, WPU  VIO  UART Serial Data Output   N/C 61 UART_RXD  I, WPU VIO  UART Serial Data Input   N/C 62 UART_CTSn  I, PU  VIO  UART Clear to Send (Active low)   N/C 63 UART_RTSn  O, WPU  VIO  UART Request to Send (Active low)   N/C 64 GND  -  -  Ground  GND 65 JTAG_TCK  I, PU  VIO  JTAG Test Clock (input)  N/C 66 JTAG_TMS  I, PU  VIO  JTAG Test Controller Select (input)  N/C
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  37 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  Pin #  Name  Type  Voltage  Ref.  Description  If Not Used 67 LED_OUT_BT  O, PU  VIO  LED indicator for BT with 10mA drive capability.  N/C 68 LED_OUT_WLAN  O, PU  VIO  LED indicator for WLAN with 10mA drive capability N/C 69-84 GND  -  - Thermal Ground Pad  (Important for RF performance and thermal dissipation; please flow the reference design)  GND 12 HOST CONFIGURATION OPTIONS  60-SIPT series support various host configurations for WLAN and BT. Its detail configurations are shown in following table (Error! Reference source not found.).  Table 34: Wi-Fi host interface configuration table CONFIG_HOST [2-0] WLAN  BT/BLE  Note 000  SDIO  UART  - 001  SDIO  SDIO  - 010  PCIe  USB 2.0 Initial USB 2.0 PHY and COM PHY PCIe portion 011  PCIe  UART  Initial only COM PHY PCIe portion 100  USB 2.0  UART  Initial USB 2.0 PHY 101  USB 2.0  USB 2.0 Initial only USB 2.0 PHY 13 MECHANICAL SPECIFICATIONS Module dimensions of 60-SIPT series is 13 x 14 x 1.87 mm. Detail drawings are shown in Figure 10.  Figure 10: Mechanical drawing - 60-SIPT
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  38 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610   Figure 11: Module dimension of 60-SIPT series Note:  The Wi-Fi MAC address is located on the product label. The BT MAC address always immediately follows the Wi-Fi MAC address. Therefore, the BT MAC address is the Wi-Fi MAC address plus one.  Figure 12: Recommended ground via  TOP VIEW
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  39 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  Recommend minimal via size and placement for grounding and thermal dissipation. Please double the ground via number when using laser via on HID process. More ground via and the use of 1-oz copper is recommended in our design to get better thermal dissipation. Note:    When soldering, the stencil thickness should be ≥ 0.1 mm. 14 RF LAYOUT DESIGN GUIDELINES The following is a list of RF layout design guidelines and recommendation when installing a Laird radio into your device.   Do not run antenna cables directly above or directly below the radio.  Do not place any parts or run any high speed digital lines below the radio.  If there are other radios or transmitters located on the device (such as a Bluetooth radio), place the devices as far apart from each other as possible. Also, make sure there is at least 25 dB isolation between these two antennas.  Ensure that there is the maximum allowable spacing separating the antenna connectors on the Laird radio from the antenna. In addition, do not place antennas directly above or directly below the radio.  Laird recommends the use of a double-shielded cable for the connection between the radio and the antenna elements.  Be sure to put a 10uF capacitor on EACH 3.3V power pin. Also, place that capacitor to the pin as close as possible to make sure the internal PMU working correctly.  Use proper electro-static-discharge (ESD) procedures when installing the Laird radio module.   To get maximum throughput when operate at MIMO 2x2, two antennas with at least 25 dB isolation is recommended.  To avoid negatively impacting Tx power and receiver sensitivity, do not cover the antennas with metallic objects or components. 15 RECOMMENDED STORAGE, HANDLING, BAKING, AND REFLOW PROFILE  15.1 Required Storage Conditions 15.1.1 Prior to Opening the Dry Packing The following are required storage conditions prior to opening the dry packing:  Normal temperature: 5~40℃  Normal humidity: 80% (Relative humidity) or less  Storage period: One year or less Note: Humidity means Relative Humidity. 15.1.2 After Opening the Dry Packing The following are required storage conditions after opening the dry packing (to prevent moisture absorption):  Storage conditions for one-time soldering: – Temperature: 5~25℃ – Humidity: 60% or less
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  40 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  – Period: 48 hours or less after opening  Storage conditions for two-time soldering Storage conditions following opening and prior to performing the 1st reflow: – Temperature: 5~25℃ – Humidity: 60% or less – Period: 48 hours or less after opening Storage conditions following completion of the 1st reflow and prior to performing the 2nd reflow – Temperature: 5~25℃ – Humidity: 60% or less – Period: 48 hours or less after completion of the 1st reflow 15.1.3 Temporary Storage Requirements after Opening The following are temporary storage requirements after opening:  Only re-store the devices once prior to soldering.  Use a dry box or place desiccant (with a blue humidity indicator) with the devices and perform dry packing again using heat-sealing. The following indicate the required storage period, temperature, and humidity for this temporary storage: 1. Storage temperature and humidity  *** - External atmosphere temperature and humidity of the dry packing 2. Storage period – X1+X2 – Refer to After Opening the Dry Packing storage requirements. – Y – Two weeks or less. 15.2 Baking Conditions Baking conditions and processes for the SSD50NBT follow the J-STD-033 standard which includes the following:  The calculated shelf life in a sealed bag is 12 months at <40℃ and <90% relative humidity.  Once the packaging is opened, the SiP must be mounted (per MSL3/Moisture Sensitivity Level 3) within 168 hours at <30℃ and <60% relative humidity.  If the SiP is not mounted within 168 hours or if, when the packaging is opened, the humidity indicator card displays >10% humidity, then the product must be baked for 48 hours at 125℃ (±5℃). Temperature: 5-40°C Humidity: 80% or less Temperature: 5-25°C Humidity: 60% or less Temperature: 5-40°C Humidity: 80% or less Temperature: 5-25°C Humidity: 60% or less ***  ***
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  41 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  15.3 Surface Mount Conditions The following soldering conditions are recommended to ensure device quality. 15.3.1 Soldering Note:   When soldering, the stencil thickness should be ≥ 0.1 mm. Convection reflow or IR/Convection reflow (one-time soldering or two-time soldering in air or nitrogen environment)  Measuring point – IC package surface  Temperature profile:   Figure 13 Temperature profile
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  42 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  15.3.2 Cautions When Removing the SIP from the Platform for RMA   Bake the platform before removing the SIP from the platform. Reference baking conditions.  Remove the SIP by using a hot air gun. This process should be carried out by a skilled technician. Suggestion conditions:   One-side component platform:  – Set the hot plate at 280°C.  – Put the platform on the hot plate for 8~10 seconds.  – Remove the SIP from platform.   Two-side components platform: – Use two hot air guns – On the bottom side, use a pre-heated nozzle (temperature setting of 200~250°C) at a suitable distance from the platform PCB.  – On the top side, apply a remove nozzle (temperature setting of 330°C). Heat the SIP until it can be removed from platform PCB.       Remove the residue solder under the bottom side of SIP.                  (Not accepted for RMA)                    (Accepted for RMA analysis) SIP with residue solder on the bottom        SIP without residue solder on the bottom    Remove and clean the residue flux is needed. Platform SIP Remove Nozzle Pre-heat
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  43 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  15.3.3 Precautions for Use  Opening/handing/removing must be done on an anti-ESD treated workbench. All workers must also have undergone anti-ESD treatment.  The devices should be mounted within one year of the date of delivery. 16 REGULATORY  16.1 Certified Antennas Model  Type  Connector 2400~2483.5MHz 5150~5250MHz   5250~5350MHz 5470~5725MHz   5725~5850MHz Laird/NanoBlade-IP04 PCB Dipole IPEX U.FL 2 dBi (2.4-2.5 GHz), 3.9 dBi (5.15-5.35 GHz), 4 dBi (5.6 GHz) Laird/MAF95310 Mini NanoBlade Flex PCB Dipole IPEX U.FL 2.79 dBi @ 2.4 GHz, 3.38 dBi @ 5 GHz Ethertronics/WLAN_1000146  Magnetic Dipole IPEX U.FL 2.5dBi (2.390-2.490),3.5 dBi (4.900-5.100),3.5 dBi (5.150-5.350),3.5 dBi (5.70-5.900) LSR/FlexPIFA 001-0016 PIFA IPEX U.FL 2.5dBi@2.4GHz, 3dBi@5GHz LSR/001-0009 Dipole IPEX U.FL 2dBi@2.4GHz, 2dBi@5GHz 17 FCC AND IC REGULATORY  Model US/FCC CANADA/IC 60-SIPT series SQG-SU60SIPT 3147A-SU60SIPT The SSD50NBT has been designed to pass certification with the antenna listed below. The required antenna impedance is 50 ohms.  Model Type ConnectorPeak gain (dBi) 2400~2483.5MHz 5150~5250MHz 5250~5350MHz 5470~5725MHz 5725~5850MHz Laird/NanoBlade-IP04 PCB DipoleIPEX U.FL 2.0 dBi  3.9 dBi 3.9 dBi  4.0dBi Laird/MAF95310 Mini NanoBlade Flex PCB DipoleIPEX U.FL 2.79 dB  3.38dBi Ethertronics/WLAN_1000146  Magnetic Dipole IPEX U.FL 2.5 dBi  3.5 dBi LSR/FlexPIFA 001-0016 PIFA IPEX U.FL 2.5dBi  3.0dBi LSR/001-0009 Dipole IPEX U.FL 2.0dBi  2.0 dBi
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  44 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  17.1 FCC 17.1.1 Federal Communication Commission Interference Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in an installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:  Reorient or relocate the receiving antenna.  Increase the separation between the equipment and receiver.  Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.  Consult the dealer or an experienced radio/TV technician for help. FCC Caution:    Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Important Note Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Country Code selection feature to be disabled for products marketed to the US/Canada. This device is intended only for OEM integrators under the following conditions: 1. The antenna must be installed such that 20 cm is maintained between the antenna and users, and  2. The transmitter module may not be co-located with any other transmitter or antenna,  3. For all products market in US, OEM must limit the operation channels in CH1 to CH11 for 2.4G band by supplied firmware programming tool. OEM shall not supply any tool or info to the end-user regarding to Regulatory Domain change. If the three conditions above are met, further transmitter testing is not required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Important Note  If these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator is responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  45 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  17.1.2 End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The end product must be labeled in a visible area with the following: Contains FCC ID: SQG-SSD50NBT. 17.1.3 Manual Information to the End User The OEM integrator must be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. 17.2 Industry Canada 17.2.1 Industry Canada Statement This device complies with Industry Canada’s license-exempt RSSs. Operation is subject to the following two conditions:  This device may not cause interference; and   This device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes:  l’appareil ne doit pas produire de brouillage;  l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement. This radio transmitter (IC: 3147A-SSD50NBT) has been approved by Industry Canada to operate with the antenna types listed below with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Le présent émetteur radio (IC: 3147A-MSD50NBT) a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés ci-dessous et ayant un gain admissible maximal. Les types d'antenne non inclus dans cette liste, et dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur. 17.2.2 Antenna Information Model Type  Connector Peak gain (dBi) 2400~2483.5MHz 5150~5250MHz 5250~5350MHz 5470~5725MHz 5725~5850MHz Laird/NanoBlade-IP04 PCB Dipole IPEX U.FL  2.0 dBi  3.9 dBi  3.9 dBi  4.0 dBi Laird/MAF95310 Mini NanoBlade Flex PCB Dipole IPEX U.FL  2.79 dB  3.38 dBi
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  46 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  Model Type  Connector Peak gain (dBi) Ethertronics/WLAN_1000146  Magnetic Dipole IPEX U.FL  2.5 dBi  3.5 dBi LSR/FlexPIFA 001-0016PIFA IPEX U.FL  2.5 dBi  3.0 dBi LSR/001-0009 Dipole IPEX U.FL  2.0 dBi  2.0 dBi Caution:   (i) The device for operation in the band 5150–5250 MHz is only for indoor use to reduce the potential for harmful interference to co-channel mobile satellite systems;  (ii) For devices with detachable antenna(s), the maximum antenna gain permitted for devices in the bands 5250-5350 MHz and 5470-5725 MHz shall be such that the equipment still complies with EIRP limit;  (iii) For devices with detachable antenna(s), the maximum antenna gain permitted for devices in the band 5725-5850 MHz shall be such that the equipment still complies with the EIRP limits specified for point-to-point and non-point-to-point operation as appropriate; and  Operations in the 5.25-5.35GHz band are restricted to indoor usage only.  Avertissement: (i) les dispositifs fonctionnant dans la bande de 5150 à 5250MHz sont réservés uniquement pour une utilisation à l'intérieur afin de réduire les risques de brouillage préjudiciable aux systèmes de satellites mobiles utilisant les mêmes canaux; (ii) pour les dispositifs munis d'antennes amovibles, le gain maximal d'antenne permis pour les dispositifs utilisant les bandes de 5250 à 5350MHz et de 5470 à 5725 MHz doit être conforme à la limite de la p.i.r.e; (iii) pour les dispositifs munis d'antennes amovibles, le gain maximal d'antenne permis (pour les dispositifs utilisant la bande de 5725 à 5850 MHz) doit être conforme à la limite de la p.i.r.e. spécifiée pour l'exploitation point à point et l'exploitation non point à point, selon le cas; Les opérations dans la bande de 5.25-5.35GHz sont limités à un usage intérieur seulement. 17.2.3 Radiation Exposure Statement This equipment complies with Canada radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body. 17.2.4 Déclaration d'exposition aux radiations Cet équipement est conforme Canada limites d'exposition aux radiations dans un environnement non contrôlé. Cet équipement doit être installé et utilisé à distance minimum de 20cm entre le radiateur et votre corps.
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  47 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  This device is intended only for OEM integrators under the following condition:   The transmitter module may not be co-located with any other transmitter or antenna. If the condition above is met, further transmitter test is not required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Cet appareil est conçu uniquement pour les intégrateurs OEM dans les conditions suivantes:  Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne. Tant que les 1 condition ci-dessus sont remplies, des essais supplémentaires sur l'émetteur ne seront pas nécessaires. Toutefois, l'intégrateur OEM est toujours responsable des essais sur son produit final pour toutes exigences de conformité supplémentaires requis pour ce module installé. Important Note: If these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the Canada authorization is no longer considered valid and the IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate Canada authorization. Note Importante: Dans le cas où ces conditions ne peuvent être satisfaites (par exemple pour certaines configurations d'ordinateur portable ou de certaines co-localisation avec un autre émetteur), l'autorisation du Canada n'est plus considéré comme valide et l'ID IC ne peut pas être utilisé sur le produit final. Dans ces circonstances, l'intégrateur OEM sera chargé de réévaluer le produit final (y compris l'émetteur) et l'obtention d'une autorisation distincte au Canada. 17.2.5 End Product Labeling The end product must be labeled in a visible area with the following: Contains IC: 3147A-SSD50NBT.  17.2.6 Plaque signalétique du produit final Le produit final doit être étiqueté dans un endroit visible avec l'inscription suivante: Contient des IC: 3147A-SSD50NBT. 17.2.7 Manual Information to the End User The OEM integrator must be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. 17.2.8 Manuel d'information à l'utilisateur final L'intégrateur OEM doit être conscient de ne pas fournir des informations à l'utilisateur final quant à la façon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intègre ce module. Le manuel de l'utilisateur final doit inclure toutes les informations réglementaires requises et avertissements comme indiqué dans ce manuel.
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  48 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  18 EUROPEAN UNION REGULATORY The SSD50NBT has been tested for compliance with relevant standards for the EU market. SSD50NBT module was tested with antennas listed below. Model  Type  Connector 2400~2483.5MHz 5150~5250MHz   5250~5350MHz 5470~5725MHz   5725~5850MHz Laird/NanoBlade-IP04 PCB Dipole IPEX U.FL 2 dBi (2.4-2.5 GHz), 3.9 dBi (5.15-5.35 GHz), 4 dBi (5.6 GHz) Laird/MAF95310 Mini NanoBlade Flex PCB Dipole IPEX U.FL 2.79 dBi @ 2.4 GHz, 3.38 dBi @ 5 GHz Ethertronics/WLAN_1000146  Magnetic Dipole IPEX U.FL 2.5dBi (2.390-2.490),3.5 dBi (4.900-5.100),3.5 dBi (5.150-5.350),3.5 dBi (5.70-5.900) LSR/FlexPIFA 001-0016 PIFA IPEX U.FL 2.5dBi@2.4GHz, 3dBi@5GHz LSR/001-0009 Dipole IPEX U.FL 2dBi@2.4GHz, 2dBi@5GHz The OEM should consult with a qualified test house before entering their device into an EU member country to make sure all regulatory requirements have been met for their complete device. Reference the Declaration of Conformities listed below for a full list of the standards that the modules were tested to. Test reports are available upon request. 18.1 EU Declarations of Conformity This device complies with the essential requirements of the Radio Equipment directive: 2014/53/EU. The following test methods have been applied to prove presumption of conformity with the essential requirements of the Radio Equipment directive 2014/53/EU: Manufacturer: Laird  Products: 60-SIPT series  EU Directives: 2014/53/EU – Radio Equipment Directive (RED) Reference standards used for presumption of conformity:  Article Number Requirement  Reference standard(s) 3.1a Low voltage equipment safety EN 60950-1:2006+A11+A1:2010+A12:2011+A2 2013 RF Exposure  EN 62311:2008 EN 50385:2002 3.1b  Protection requirements with respect to electromagnetic compatibility EN 301 489-1 v2.2.0 (Draft) EN 301 489-17 v3.2.0 (Draft) 3.2  Means of the efficient use of the radio frequency spectrum EN 300 328 v2.1.1 (2015-02) EN 301 893 v2.1.0 (Final Draft) Declaration: We, Laird, declare under our sole responsibility that the essential radio test suites have been carried out and that the above product to which this declaration relates is in conformity with all the applicable essential requirements of Article 3 of the EU Directive 1999/5/EC, when used for its intended purpose. Place of Issue:  Laird  W66N220 Commerce Court, Cedarburg, WI 53012   USA
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  49 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  tel: +1-262-375-4400 fax: +1-262-364-2649 Date of Issue:  May 2017 Name of Authorized Person:  Thomas T Smith, Director of EMC Compliance Signature of Authorized Person:   Maximum Output Power for Each Frequency  TBD  20.5 dBm, 5.15-5.25 GHz 20.5 dBm, 5.25-5.35 GHz 20.5 dBm, 5.47-5.725 GHz  Software Version for Testing SW version: P95  The minimum distance between the user and/or any bystander and the radiating structure of the transmitter  is 20 cm.  5150 ~ 5350 MHz is limited to indoor used in the following countries:   BE  DK IE FR CY LU  NL PT SK UK NO BG DE EL HR LV HU AT RO FI LI  TR CZ  EE ES IT  LT MT PL SI SE IS CH   19 ORDERING INFORMATION Part Number Description 60-SIPT series 2X2 802.11 a/b/g/n/ac with BT4.2 dual mode module.   19.1 General Comments This is a preliminary datasheet. Please check with Laird for the latest information before commencing a design. If in doubt, ask. Česky [Czech] [Jméno výrobce] tímto prohlašuje, že tento [typ zařízení] je ve shodě se základními požadavky a dalšími příslušnými ustanoveními směrnice 1999/5/ES. Dansk [Danish] Undertegnede [fabrikantens navn] erklærer herved, at følgende udstyr [udstyrets typebetegnelse] overholder de væsentlige krav og øvrige relevante krav i direktiv 1999/5/EF. Deutsch [German] Hiermit erklärt [Name des Herstellers], dass sich das Gerät [Gerätetyp] in Übereinstimmung mit den grundlegenden Anforderungen und den übrigen einschlägigen Bestimmungen der Richtlinie 1999/5/EG befindet. Eesti [Estonian] Käesolevaga kinnitab [tootja nimi = name of manufacturer] seadme [seadme tüüp = type of equipment] vastavust direktiivi 1999/5/EÜ põhinõuetele ja nimetatud direktiivist tulenevatele teistele asjakohastele sätetele. English  Hereby, [name of manufacturer], declares that this [type of equipment] is in compliance with the essential requirements and other relevant provisions of Directive 1999/5/EC. Español [Spanish] Por medio de la presente [nombre del fabricante] declara que el [clase de equipo] cumple con los requisitos esenciales y cualesquiera otras disposiciones aplicables o exigibles de la Directiva 1999/5/CE.
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  50 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  Ελληνική [Greek] ΜΕ ΤΗΝ ΠΑΡΟΥΣΑ [name of manufacturer] ∆ΗΛΩΝΕΙ ΟΤΙ [type of equipment] ΣΥΜΜΟΡΦΩΝΕΤΑΙ ΠΡΟΣ ΤΙΣ ΟΥΣΙΩ∆ΕΙΣ ΑΠΑΙΤΗΣΕΙΣ ΚΑΙ ΤΙΣ ΛΟΙΠΕΣ ΣΧΕΤΙΚΕΣ ∆ΙΑΤΑΞΕΙΣ ΤΗΣ Ο∆ΗΓΙΑΣ 1999/5/ΕΚ. Français [French] Par la présente [nom du fabricant] déclare que l'appareil [type d'appareil] est conforme aux exigences essentielles et aux autres dispositions pertinentes de la directive 1999/5/CE. Italiano [Italian] Con la presente [nome del costruttore] dichiara che questo [tipo di apparecchio] è conforme ai requisiti essenziali ed alle altre disposizioni pertinenti stabilite dalla direttiva 1999/5/CE. Latviski [Latvian] Aršo[name of manufacturer /izgatavotājanosaukums] deklarē, ka[type of equipment / iekārtas tips]atbilstDirektīvas 1999/5/EK būtiskajāmprasībām un citiemar to saistītajiemnoteikumiem. Lietuvių [Lithuanian]  Šiuo [manufacturer name] deklaruoja, kad šis [equipment type] atitinka esminius reikalavimus ir kitas 1999/5/EB Direktyvos nuostatas. Nederlands [Dutch] Hierbij verklaart [naam van de fabrikant] dat het toestel [type van toestel] in overeenstemming is met de essentiële eisen en de andere relevante bepalingen van richtlijn 1999/5/EG. Malti [Maltese] Hawnhekk, [isem tal-manifattur], jiddikjara li dan [il-mudel tal-prodott] jikkonforma mal-ħtiġijiet essenzjali u ma provvedimenti oħrajn relevanti li hemm fid-Dirrettiva 1999/5/EC. Magyar [Hungarian] Alulírott, [gyártó neve] nyilatkozom, hogy a [... típus]megfelel a vonatkozó alapvetõ követelményeknek és az 1999/5/EC irányelv egyéb elõírásainak. Polski [Polish] Niniejszym [nazwa producenta] oświadcza, że [nazwa wyrobu] jest zgodny z zasadniczymi wymogami oraz pozostałymi stosownymi postanowieniami Dyrektywy 1999/5/EC. Português [Portuguese] [Nome do fabricante] declara que este [tipo de equipamento] está conforme com os requisitos essenciais e outras disposições da Directiva 1999/5/CE. Slovensko [Slovenian] [Ime proizvajalca] izjavlja, da je ta [tip opreme] v skladu z bistvenimi zahtevami in ostalimi relevantnimi določili direktive 1999/5/ES. Slovensky [Slovak] [Menovýrobcu]týmtovyhlasuje, že[typzariadenia]spĺňazákladnépožiadavky a všetkypríslušnéustanoveniaSmernice 1999/5/ES. Suomi [Finnish] [Valmistaja = manufacturer] vakuuttaa täten että [type of equipment = laitteen tyyppimerkintä] tyyppinen laite on direktiivin 1999/5/EY oleellisten vaatimusten ja sitä koskevien direktiivin muiden ehtojen mukainen. Svenska [Swedish] Härmed intygar [företag] att denna [utrustningstyp] står I överensstämmelse med de väsentliga egenskapskrav och övriga relevanta bestämmelser som framgår av direktiv 1999/5/EG. 19.1.1 Labeling Requirements The end product must be labeled in a visible area with the following notice:  © Copyright 2017 Laird. All Rights Reserved. Any information furnished by Laird and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird materials or products rests with the end user since Laird and its agents cannot be aware of all potential uses. Laird makes no warranties as to non-infringement nor as to the fitness, merchantability, or sustainability of any Laird materials or products for any specific or general uses. Laird, Laird Technologies, Inc., or any of its affiliates or agents shall not be liable for incidental or consequential damages of any kind. All Laird products are sold pursuant to the Laird Terms and Conditions of Sale in effect from time to time, a copy of
SU60-SIPT Datasheet Embedded Wireless Solutions Support Center:  http://ews-support.lairdtech.com www.lairdtech.com/wireless  51 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610  which will be furnished upon request. When used as a tradename herein, Laird means Laird PLC or one or more subsidiaries of Laird PLC. Laird™, Laird Technologies™, corresponding logos, and other marks are trademarks or registered trademarks of Laird. Other marks may be the property of third parties. Nothing herein provides a license under any Laird or any third party intellectual property right.

Navigation menu