Jorjin Technologies WG7833B0 Wireless Module User Manual WG7833BEM2A DTS D02 20150731

Jorjin Technologies Inc. Wireless Module WG7833BEM2A DTS D02 20150731

Contents

User Manual II

Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL   a module solution provider      WG7833BEM2A M.2 Type2226 Module TI  WL1833  IEEE  802.11a/b/g/n  solution BT/BLE Solution      Datasheet Draft 0.2   Jul/28/2015    Prepared By  Reviewed By  Approved By
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 1Index 1. OVERVIEW ................................................................................................................................... 3 1.1. GENERAL FEATURES ........................................................................................................ 3 2. FUNCTIONAL FEATURES ............................................................................................................ 4 2.1. MODULE BLOCK DIAGRAM............................................................................................. 4 2.2. BLOCK FUNCTIONAL FEATURE .......................................................................................... 5 2.2.1. WLAN Features ............................................................................................... 5 2.2.2. Bluetooth Features ......................................................................................... 5 2.2.3. BLE Features .................................................................................................... 6 2.2.4. ANT Features ................................................................................................... 6 3. MODULE OUTLINE ....................................................................................................................... 7 3.1. SIGNAL LAYOUT (TOP VIEW) ........................................................................................... 7 3.2. PIN DESCRIPTION ........................................................................................................... 8 4. MODULE SPECIFICATION ....................................................................................................... 11 4.1. GENERAL MODULE REQUIREMENTS AND OPERATION ....................................................... 11 4.1.1. Absolute Maximum Ratings (1) ..................................................................... 11 4.1.2. Recommended Operating Conditions ..................................................... 12 4.1.3. External Slow Clock Input (SLOW_CLK) ...................................................... 13 4.2. WLAN RF PERFORMANCE ........................................................................................... 14 4.2.1. WLAN 2.4-GHz Receiver Characteristics .................................................... 14 4.2.2. WLAN 2.4-GHz Transmitter Power ............................................................... 15 4.2.4. WLAN 5-GHz Transmitter Power .................................................................. 17 4.3. BLUETOOTH RF PERFORMANCE ...................................................................................... 18 4.3.1. BT Receiver Characteristics, In-Band Signals ............................................. 18 4.3.2. BT Receiver Characteristics – General Blocking ....................................... 19 4.3.3. BT Receiver Characteristics –BR, EDR Blocking Per Band ......................... 19 4.3.5. BT Transmitter, EDR ....................................................................................... 20 4.3.6. BT Modulation, BR ........................................................................................ 20 4.3.7. BT Modulation, EDR ...................................................................................... 21 4.3.8. BT BR, EDR Transceiver - Emissions ............................................................... 21 4.3.9. BT BR Transceiver - Spurs .............................................................................. 22 4.3.10. BT EDR Transceiver - Spurs ........................................................................... 22 4.4.  BT LE RF PERFORMANCE .................................................................................................. 23 4.4.1. BT LE Receiver Characteristics, In-Band Signals ........................................ 23
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 24.4.2. BT LE Receiver Characteristics – General Blocking ................................... 23 4.4.3. BT LE Transmitter Characteristics ................................................................. 24 4.4.4. BT LE Modulation Characteristics ............................................................... 24 4.4.5. BT LE Transceiver – Emissions ....................................................................... 25 4.4.6. BT LE Transceiver - Spurs ............................................................................... 25 4.5. ANT PERFORMANCE .................................................................................................... 25 4.5.1. ANT Receiver Characteristics, In-Band Signals.......................................... 25 4.5.2. ANT Transmitter Characteristics .................................................................. 25 4.6.  POWER CONSUMPTION .............................................................................................. 26 5. HOST INTERFACE TIMING CHARACTERISTICS .................................................................... 29 5.1.  WLAN SDIO TRANSPORT LAYER ......................................................................................... 29 5.2.  SDIO TIMING SPECIFICATIONS ............................................................................................ 30 5.3.  HCI UART SHARED TRANSPORT LAYERS FOR ALL FUNCTIONAL BLOCKS (EXCEPT WLAN) .................... 32 5.4.  UART TIMING SPECIFICATIONS ............................................................................................ 33 5.5.  BLUETOOTH CODEC-PCM(AUDIO) TIMING SPECIFICATIONS ......................................................... 34 6. CLOCK AND POWER MANAGEMENT .................................................................................. 36 6.1.  RESET-POWER-UP SYSTEM ................................................................................................. 36 6.2.  WLAN POWER-UP SEQUENCE ........................................................................................... 36 6.3.  BLUETOOTH/BLE/ANT POWER-UP SEQUENCE ........................................................................ 37 7. REFERENCE SCHEMATIC ......................................................................................................... 38 7.1. MODULE REFERENCE DESIGN ........................................................................................ 38 8. DESIGN RECOMMENDATIONS .............................................................................................. 39 8.1. DESIGN NOTE ON DEBUG PORT ..................................................................................... 39 8.2. MODULE LAYOUT RECOMMENDATIONS .......................................................................... 39 9. PACKAGE INFORMATION ...................................................................................................... 41 9.1. NGFF TYPE 2226 SPECIFICATION FROM PCI-E M.2_REV1.0 ........................................... 41 9.2. WG7833BEM2A MODULE DRAWING ......................................................................... 43 9.3. RF CONNECTOR .......................................................................................................... 43 10. SMT AND BAKING RECOMMENDATION ......................................................................... 44 10.1. BAKING RECOMMENDATION ......................................................................................... 44 10.2. SMT RECOMMENDATION .............................................................................................. 44 11. HISTORY CHANGE ............................................................................................................... 45
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 31. OVERVIEW WG7833BEM2A, a WiFi, BT, BLE combo module, is the most demanded design for mobile devices, Audio, Computer, and embedded system applications with Wilink8 solution from TI. 1.1.   General Features  WLAN, Bluetooth, BLE, ANT with Integrated RF Front-End Module (FEM), Power Amplifier (PA),     and Power Management on a Single Module  M.2 Type2226 LGA package  Dimension 26mm(L) x 22.0mm(W) x 2.6mm(H)  Provides efficient direct connection to battery by employing several integrated switched mode power supplies (DC2DC).  Seamless Integration with TI Sitara™ and Other Application Processors  WLAN and BT/BLE/ANT cores are software and hardware compatible with prior WL127x and WL128x offerings, for smooth migration to device.  Shared HCI transport for BT/BLE/ANT over UART and SDIO for WLAN.    Temperature detection and compensation mechanism ensures minimal variation in RF performance over the entire temperature range.    BT 4.0, BLE, ANT and all audio processing features work in parallel and include full coexistence with WLAN  Operating temperature: –40°C to 85°C
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 42. FUNCTIONAL FEATURES 2.1.   Module Block Diagram                   Figure 2-1 WG7833BEM2A Block Diagram          WLAN BT WiLink8 SW WG7833-B0 SW WLAN 2.4G WL 5G TX WL 5G RX BPF BT Power Management SLOW CLK VBAT_IN 1V8 LDO BPF WG7833BEM2A M.2 Type2226 RF Connector ANT2 RF Connector ANT1 SDIO (WLAN) PCM (BT) GPIO / DBG UART (BT) 26MHz TCXO
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 52.2.   Block Functional Feature 2.2.1. WLAN Features  Integrated 2.4 & 5G GHz Power Amplifier (PA) for WLAN solution    WLAN Baseband Processor and RF transceiver Supporting IEEE Std 802.11a/b/g/n  WLAN 2.4/5 GHz SISO (20/40 MHz channels)  Baseband Processor    IEEE Std 802.11a/b/g/n data rates and IEEE Std 802.11n data rates with 20 or 40 MHz SISO.    Fully calibrated system. Production calibration not required.    Medium Access Controller (MAC)    Embedded ARM™ Central Processing Unit (CPU)    Hardware-Based Encryption/Decryption using 64-, 128-, and 256-Bit WEP, TKIP or AES Keys,    Supports requirements for Wi-Fi Protected Access (WPA and WPA2.0) and IEEE Std 802.11i [includes hardware-accelerated Advanced Encryption Standard (AES)]    Designed to work with IEEE Std 802.1x    IEEE Std 802.11d, e, h, i, k, r PICS compliant.  New advanced co-existence scheme with BT/BLE/ANT.  2.4/5 GHz Radio  Internal LNA and PA  Supports: IEEE Std 802.11a, 802.11b, 802.11g and 802.11n  Supports 4 bit SDIO host interface, including high speed (HS) and V3 modes. 2.2.2. Bluetooth Features  Supports Bluetooth 4.0 as well as CSA2    Includes concurrent operation and built -in coexisting and prioritization handling of Bluetooth, BLE, ANT, audio processing and WLAN    Dedicated Audio processor supporting on chip SBC encoding + A2DP:    Assisted A2DP (A3DP) support - SBC encoding implemented internally    Assisted WB-Speech (AWBS) support - modified SBC codec implemented internally
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 62.2.3. BLE Features  Fully compliant with BT4.0 BLE dual mode standard    Support for all roles and role-combinations, mandatory as well as optional    Supports up to 10 BLE connections  Independent buffering for LE allows having large number of multiple connections without affecting BR/EDR performance 2.2.4. ANT Features Fully compliant with all ANT Protocols:  ANT solution optimized for the fitness and health use-cases  Simple to complex network topologies    Supports high-resolution proximity pairing  The ANT protocol has been designed to very power-efficient, yet is flexible enough to support various network topologies (point-to-point, star, 1-to-N, N-to-1) and data transfer modes (broadcast, broadcast with acknowledge, mass data transfer). Each logical ANT channel can be independently configured for 1-way or 2-way operation
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 73. MODULE OUTLINE 3.1.   Signal Layout (Top View)  Figure 3-1 Device pins
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 83.2.   Pin Description Table 3-1. Pin Description Pin No. Signal Name  Type Shut Down state After Power Up(1) Voltage Level Description 1  3.3V  POW      VBAT  Power supply input, 2.9 to 4.6 V. 2  3.3V  POW      VBAT  Power supply input, 2.9 to 4.6 V. 3  GND  GND        Ground. 4  RESERVED  -        No connection. 5  ALERT#  -        No connection. 6  I2C_CLK  -        No connection. 7  I2C_DATA  -        No connection. 8  COEX1  -        No connection. 9  COEX2  -        No connection. 10  COEX3  -        No connection. 11  RESERVED  I/O  PD  PD  1.8V  WL_RS232_RX. Reserved for debug only. 12  RESERVED  I/O  PD  PD  1.8V  WL_RS232_TX. Reserved for debug only. 13  RESERVED  -        No connection. 14  GND  GND        Ground. 15  RESERVED  -        No connection. 16  RESERVED  -        No connection. 17  GND  GND        Ground. 18  RESERVED  -        No connection. 19  RESERVED  -        No connection. 20  GND  GND        Ground. 21  RESERVED  -        No connection. 22  RESERVED  -        No connection. 23  GND  GND        Ground. 24  SLOWCLK_32kHz  ANA      3.3V  Input Sleep clock: 32.768 KHz 25  W_DISABLE1#  -        No connection. 26  PEWAKE#  -        No connection. 27  CLKREQ#  -        No connection. 28  PERST#  -        No connection. 29  GND  GND        Ground. 30  REFCLKn0  -        No connection.
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 931  REFCLKp0  -        No connection. 32  GND  GND        Ground. 33  PETn0  -        No connection. 34  PETp0  -        No connection. 35  GND  GND        Ground. 36  PERn0  -        No connection. 37  PERp0  -        No connection. 38  GND  GND        Ground. 39  VENDOR DEFINED  -        No connection. 40  VENDOR DEFINED  -        No connection. 41  VENDOR DEFINED  -        No connection. 42  SDIO RESET#  IN  PD  PD  1.8V  WL_EN, Mode setting: High = enable 43  SDIO WAKE#  OUT  PD  0  1.8V SDIO available, interrupt out. Active high. (For WL_RS232_TX/RX pull up at power up) 44  SDIO DATA3  IO  HiZ  PU  1.8V WLAN SDIO Data bit 3. Changes state to PU at WL_EN or BT_EN assertion for card detects. Later disabled by software during initialization. (2) 45  SDIO DATA2  IO  HiZ  HiZ  1.8V  WLAN SDIO Data bit 2 (2) 46  SDIO DATA1  IO  HiZ  HiZ  1.8V  WLAN SDIO Data bit 1 (2) 47  SDIO DATA0  IO  HiZ  HiZ  1.8V  WLAN SDIO Data bit 02) 48  SDIO CMD  I/O  HiZ  HiZ  1.8V  WLAN SDIO Command (2)   49  SDIO CLK  IN  HiZ  HiZ  1.8V  WLAN SDIO Clock. Must be driven by the host. 50  UART WAKE#  OUT  PD  PD  3.3V Bluetooth Host Wake. Open Drain, Active Low. Require pull up on the host side. (recommended 15K to 100K ) 51  UART CTS  IN  PU  PU  1.8V  UART CTS from Host. 52  UART TX  OUT  PU  PU  1.8V  UART TX to Host.   53  UART RX  IN  PU  PU  1.8V  UART RX from Host. 54  UART RTS  OUT  PU  PU  1.8V  UART RTS to Host.   55  PCMFR1  OUT  PD  PD  1.8V  Bluetooth PCM/I2S Bus. Frame sync. 56  PCMIN  IN  PD  PD  1.8V  Bluetooth PCM/I2S Bus. Data in. 57  PCMOUT  OUT  PD  PD  1.8V  Bluetooth PCM/I2S Bus. Data out. 58  PCMCLK  OUT  PD  PD  1.8V  Bluetooth PCM/I2S Bus. Clock. 59  GND  GND        Ground. 60  W_DISABLE2#  IN  PD  PD  3.3V  BT_EN, Mode setting: High = enable 61  LED2#  -        No connection.
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 10 62  LED1#  -        No connection. 63  RESERVED  -        No connection. 64  GND  GND        Ground. 65  USB_D-  -        No connection. 66  USB_D+  -        No connection. 67  GND  GND        Ground. 68  3.3V  POW      VBAT  Power supply input, 2.9 to 4.6 V. 69  3.3V  POW      VBAT  Power supply input, 2.9 to 4.6 V. 70  GND  GND        Ground. 71  GND  GND        Ground. 72  GND  GND        Ground. 73  GND  GND        Ground. 74  GND  GND        Ground. 75  GND  GND        Ground. 76  GND  GND        Ground. 77  GND  GND        Ground. 78  GND  GND        Ground. 79  GND  GND        Ground. 80  GND  GND        Ground. 81  GND  GND        Ground. 82  GND  GND        Ground. 83  GND  GND        Ground. 84  GND  GND        Ground. 85  GND  GND        Ground. 86  GND  GND        Ground. 87  GND  GND        Ground. 88  GND  GND        Ground. 89  GND  GND        Ground. 90  UIM_POWER_SRC/GPIO1 -        No connection. 91  UIM_POWER_SNK  -        No connection. 92  UIM_SWP  -        No connection. G1~G35 GND  GND        Ground. (1) PU=pull up; PD=pull down. (2) Host must provide PU for all non-CLK SDIO signals
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 11 4. MODULE SPECIFICATION 4.1. General Module Requirements and Operation 4.1.1. Absolute Maximum Ratings (1) 1)    Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.   2)    Operating free-air temperature range. The device can be reliably operated for 7 years at ambient of 85°C, assuming 25% active mode and 75% sleep mode (15,400 cumulative active power-on hours). 3)    Electrostatic discharge (ESD) to measure device sensitivity/immunity to damage caused by electrostatic discharges into device. 4)    Level listed is the passing level per ANSI/ESDA/JEDEC JS-001. JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process, and manufacturing with less than 500V HBM is possible if necessary precautions are taken. Pins listed as 1000V may actually have higher performance. 5)    Level listed is the passing level per EIA-JEDEC JESD22-C101E. JEDEC document JEP157 states that 250 V CDM allows safe    manufacturing with a standard ESD control process, and manufacturing with less than 250V CDM is possible if necessary precautions are taken. Pins listed as 250 V may actually have higher performance.    Parameter  Value Units VBAT    -0.5 to 4.6    V   Input voltage to Analog pins    -0.5 to 2.1  V   Input voltage to 1.8V digital pins  -0.5 to 2.3  V Input voltage to 3.3V digital pins  -0.5 to 4.6  V Operating ambient temperature range    -40 to +85 (2)  °C   Storage temperature range    -55 to +125    °C   ESD Stress Voltage (3)  Human Body Model (4)  >1000  V Charged Device Model (5)  >250  V
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 12 4.1.2. Recommended Operating Conditions Parameter Condition Sym Min Max UUUUnits VBAT    (1)  DC supply range for all modes     2.9  4.6 V IO high-level input voltage    1.8V IO  VIH    1.17  1.8 IO low-level input voltage  1.8V IO  VIL  0  0.63 IO high-level input voltage    3.3V IO  VIH  2  3.3 IO low-level input voltage  3.3V IO  VIL  0  0.8 Enable inputs high-level input voltage   1.8V IO  VIH_EN  1.365  1.8 Enable inputs low-level input voltage 1.8V IO  VIL_EN 0  0.4 IO high-level output voltage  3.3V IO  VOH    3.3 IO low-level output voltage  3.3V IO  VOL  0  0.2 High-level output voltage(1.8V IO) @ 4 mA    VOH    1.35  1.8 @ 1 mA    1.688  1.8 @ 0.3 mA    1.767    1.8 Low-level output voltage(1.8V IO)  @ 4 mA    VOL    0    0.45   @ 1 mA    0    0.112   @ 0.09 mA    0    0.01   Input transitions time Tr/Tf from 10% to 90% (Digital IO)   (2)    Tr/Tf    1  10  ns Output rise time from 10% to 90% (Digital pins)   (2)  CL < 25 pF    Tr      5.3    ns   Output fall time from 10% to 90% (Digital pins)   (2)  CL < 25 pF    Tf      4.9   Ambient operating temperature      -40  85  ºC Maximum power dissipation  WLAN operation     2.8  W BT operation      0.2 (1) 4.8V is applicable only for 2.3 years (30% of the time). Otherwise, the maximum VBAT should not exceed 4.3V. (2) Applies to all Digital lines except SDIO, UART, I2C, PCM and slow clock lines
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 13 4.1.3. External Slow Clock Input (SLOW_CLK) The supported digital slow clock is 32.768 kHz digital (square wave). Parameter  Condition  Sym  Min.  Typ.  Max.  Units Input slow clock Frequency        32.768    KHz Input slow clock accuracy (Initial + temp + aging) WLAN, BT        +/-250 ppm ANT        +/- 50 Input Transition time Tr/Tf   - 10% to 90%   Tr/Tf      100  ns Frequency input duty Cycle      15  50  85  % Input Voltage Limits  Square Wave, DC-coupled Vih  2    VBAT Vpeak Vil  0    0.8
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 14 4.2. WLAN RF Performance 4.2.1.  WLAN 2.4-GHz Receiver Characteristics Parameter  Condition  Min  Typ  Max  Units Operation frequency range      2412    2484  MHz Sensitivity   20MHz Bandwidth  At < 10% PER limit 1 Mbps DSSS    –  -95.8  -92.9  dBm 2 Mbps DSSS    –  -92.7  -90 5.5 Mbps CCK  –  -90.1  -87.4 11 Mbps CCK  –  -87.4  -85.2 6 Mbps OFDM    –  -91.5  -88.7 9 Mbps OFDM    –  -89.9  -87.2 12 Mbps OFDM  –  -89  -86.3 18 Mbps OFDM    –  -86.7  -84 24 Mbps OFDM    –  -83.6  -80.9 36 Mbps OFDM    –  -80.2  -77.5 48 Mbps OFDM    –  -76  -73.3 54 Mbps OFDM  –  -74.4  -71.9 MCS0 MM 4K  –  -89.9  -86.9 MCS1 MM 4K  –  -87.1  -84.4 MCS2 MM 4K  –  -85.4  -82.7 MCS3 MM 4K  –  -82.3  -79.6 MCS4 MM 4K  –  -78.9  -76.2 MCS5 MM 4K  –  -74.7  -72 MCS6 MM 4K  –  -73  -70.3 MCS7 MM 4K  –  -71.9  -69.2 MCS0 MM 4K 40MHz  –  -86.9  -82.2 MCS7 MM 4K 40MHz  –  -68.5  -65 Max Input Level At < 10% PER limit OFDM(11g/n)  -19  -9  dBm CCK  -4  -0  Adjacent channel rejection Sensitivity level +3dB for OFDM, Sensitivity level +6dB for 11b 2Mbps DSSS  42.7     dBm 11Mbps CCK  37.9    54Mbps OFDM  2.0    LO Leakage      -80    dBm PER Floor    1.0  2.0  %
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 15 4.2.2.  WLAN 2.4-GHz Transmitter Power Parameter Condition Min  Typ  Max  Output Power - Maximum RMS output power   measured at 1dB from IEEE   spectral mask or EVM 1 Mbps DSSS  14.5  16.5  –  dBm 2 Mbps DSSS  14.5  16.5  – 5.5 Mbps CCK  14.5  16.5  – 11 Mbps CCK  14.5  16.5  – 6 Mbps OFDM  14.5  16.5  – 9 Mbps OFDM  14.5  16.5  – 12 Mbps OFDM  14.5  16.5  – 18 Mbps OFDM  14.5  16.5  – 24 Mbps OFDM  13.5  15.7  – 36 Mbps OFDM  12.6  14.8  – 48 Mbps OFDM  11.9  14.1  – 54 Mbps OFDM  11.3  13.3  – MCS0 MM  13.4  15.6  – MCS1 MM  13.4  15.6  – MCS2 MM  13.4  15.6  – MCS3 MM  13.4  15.6  – MCS4 MM  12.8  14.8  – MCS5 MM  11.9  14.1  – MCS6 MM   11.3  13.3  – MCS7 MM  10.1  12.1  – MCS0 MM 40MHz  11.8  14.3  – MCS7 MM 40MHz  9.7  11.7  – Output power accuracy    -1.5    +1.5  dB Output power resolution      0.125    dB Operation frequency range      2412    2484  MHz Return loss        -10    dB Reference input impedance        50    Ω
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 16 4.2.3. WLAN 5-GHz Receiver Characteristics Parameter  Condition  Min  Typ  Max  Units Operation frequency range      4910    5825  MHz Sensitivity   - 20MHz bandwidth.   - At < 10% PER limit   6 Mbps OFDM    –  -92.2  -88.3 dBm          9 Mbps OFDM    –  -90.4  -86.4 12 Mbps OFDM  –  -89.6  -85.6 18 Mbps OFDM    –  -87.1  -83.1 24 Mbps OFDM    –  -84  -80 36 Mbps OFDM    –  -80.6  -76.6 48 Mbps OFDM    –  -76.3  -72.3 54 Mbps OFDM  –  -74.7  -71.2 MCS0 MM 4K  –  -90.5  -86.1 MCS1 MM 4K  –  -87.7  -83.7 MCS2 MM 4K  –  -85.9  -81.9 MCS3 MM 4K  –  -82.8  -78.8 MCS4 MM 4K  –  -79.4  -75.4 MCS5 MM 4K  –  -75.1  -71.1 MCS6 MM 4K  –  -73.5  -69.5 MCS7 MM 4K  –  -72.2  -68.6 MCS0 MM 4K 40MHz  –  -87.7  -82.5 MCS7 MM 4K 40MHz  –  -69  -65.1 Max Input Level, At < 10% PER limit  OFDM(11a/n)  -27    dBm Adjacent channel rejection Sensitivity level +3dB for OFDM 54Mbps OFDM  2    dBm LO Leakage      -53    dBm PER Floor    1.0  2.0  %
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 17 4.2.4. WLAN 5-GHz Transmitter Power Parameter Condition Min  Typ  Max  Output Power - Maximum RMS output power   measured at 1dB from IEEE   spectral mask or EVM 6 Mbps OFDM  15.4  17.5  –  dBm 9 Mbps OFDM  15.4  17.5  – 12 Mbps OFDM  15.4  17.5  – 18 Mbps OFDM  15.4  17.5  – 24 Mbps OFDM  14.8  16.4  – 36 Mbps OFDM  14.1  15.7  – 48 Mbps OFDM  13.3  14.9  – 54 Mbps OFDM  12.3  14.1  – MCS0 MM  15.1  17.1  – MCS1 MM  15.1  17.1  – MCS2 MM  15.1  17.1  – MCS3 MM  15.1  17.1  – MCS4 MM  13.9  15.7  – MCS5 MM  13.3  14.9  – MCS6 MM   12.3  14.1  – MCS7 MM  11.4  13.1  – MCS0 MM 40MHz  13.7  16.6  – MCS7 MM 40MHz  10.4  12.3  – Output power accuracy    -1.5    +1.5  dB Output power resolution      0.125    dB Operation frequency range      4910    5825  MHz Return loss        -10    dB Reference input impedance        50    Ω
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 18 4.3.   Bluetooth RF Performance   4.3.1.  BT Receiver Characteristics, In-Band Signals Parameter  Condition  Min Typ  Max BT Spec Units BT BR, EDR operation frequency range    2402   2480   MHz   BT BR, EDR channel spacing       1      MHz   BT BR, EDR input impedance        50      Ω BT BR, EDR sensitivity (1) Dirty TX on  BR, BER = 0.1%    -91.7   -70  dBm   EDR2, BER = 0.01%    -91.2   -70 EDR3, BER = 0.01%    -84.2   -70 BT EDR BER floor at sensitivity + 10 dB, dirty TX off (for 1,600,000 bits) EDR2  1e-6     1e-5   EDR3  1e-6     1e-5 BT BR, EDR maximum useable input power   BR, BER = 0.1%    -5.0     -20  dBm   EDR2, BER = 0.1%    -10.0     -20 EDR3, BER = 0.1%    -10.0     -20 BT BR intermodulation  Level of interferers For n = 3, 4, and 5  -36.0 -30.0   -39  dBm   BT BR, EDR C/I performance   Numbers show wanted-signal to interfering-signal ratio. Smaller numbers indicate better C/I performances (Image frequency = -1MHz) BR, Co-channel      8.0  11  dB   EDR, Co-channel    EDR2      9.5  13 EDR3      16.5  21 BR, adjacent ±1 MHz    -10.0  0 EDR, adjacent ±1 MHz, (image)   EDR2      -10.0  0 EDR3      -5.0  5 BR, adjacent +2 MHz      -38.0  -30 EDR, adjacent +2 MHz,  EDR2      -38.0  -30 EDR3      -38.0  -25 BR, adjacent -2 MHz    -28.0  -20 EDR, adjacent   -2 MHz   EDR2      -28.0  -20 EDR3      -22.0  -13
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 19 BR, adjacent    ≥Ι±3Ι MHz    -45.0  -40 EDR, adjacent ≥Ι±3Ι MHz EDR2      -45.0  -40 EDR3      -44.0  -33 BT BR, EDR RF return loss          -10.0     dB   (1) Sensitivity degradation up to -3dB may occur due to fast clock harmonics with dirty TX on. 4.3.2.  BT Receiver Characteristics – General Blocking Parameter  Condition Min Typ  BT spec Units Blocking performance over full range, according to BT specification (1)  30-2000 MHz    -6    -10  dBm 2000-2399 MHz    -6    -27 2484-3000 MHz    -6    -27 3-12.75 GHz    -6    -10   1) Exceptions taken out of the total 24 allowed in the BT spec. 4.3.3.  BT Receiver Characteristics –BR, EDR Blocking Per Band Parameter  Band  Min  Typ  Units Blocking performance for various cellular bands  Hopping on. Wanted signal: -3dB from sensitivity, with modulated continuous blocking signal. BER = 0.1% for BT BR, 0.01% for BT EDR. PER = 1%   776-794 MHz    (CDMA)      -12 dBm 824-849 MHz    (GMSK) (1)   -3 824-849 MHz    (EDGE) (1)   -11 824-849 MHz    (CDMA, QPSK) (1)   -12 880-915 MHz    (GMSK)      -14 880-915 MHz    (EDGE)      -15 1710-1785 MHz    (GMSK)      -4 1710-1785 MHz    (EDGE)      -18 1850-1910 MHz    (GMSK)      -18 1850-1910 MHz    (EDGE)      -20 1850-1910 MHz    (CDMA, QPSK)      -20 1850-1910 MHz    (WCDMA, QPSK)    -16 1920-1980 MHz    (WCDMA, QPSK)      -17 1) Except for frequencies where [3 * F_BLOCKER] falls within the BT band (2400-2483.5 MHz)
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 20 4.3.4. BT Transmitter, BR Parameter  Min Typ Max BT Spec Units BR RF output power (1)  VBAT >= 3V  12.2     dBm   VBAT < 3V    6.7     BR Gain Control Range      30      dB   BR Power Control Step    2  5  8  2 to 8 BR Adjacent Channel Power |M-N| = 2 (2)    -43.0  ≤ -20  dBm   BR Adjacent Channel Power |M-N| > 2 (2)    -48.0  ≤ -40     1)    Values reflect maximum power. Reduced power is available using a vendor-specific (VS) command.     2)    Assumes 3dB insertion loss on external filter and traces 4.3.5.  BT Transmitter, EDR Parameter  Min Typ Max BT Spec Units EDR output power (1)  VBAT >= 3V    6.7      dBm   VBAT < 3V    4.7     EDR relative power  -2    1  -4 to +1  dB   EDR Gain Control Range    30      dB EDR Power Control Step  2  5 8 2 to 8  dB EDR Adjacent Channel Power |M-N| = 1 (2)    -36  ≤ -26  dBc EDR Adjacent Channel Power |M-N| = 2 (2)    -30  ≤ -20  dBm   EDR Adjacent Channel Power |M-N| > 2 (2)    -42  ≤ -40   1)    Values reflect maximum power. Reduced power is available using a vendor-specific (VS) command. 2)    Assumes 3dB insertion loss on external filter and traces. 4.3.6.  BT Modulation, BR Parameter  Condition(1) Performances  BT spec Units Min Typ Max BR -20dB Bandwidth       925 995 ≤1000 kHz  BR modulation characteristics ∆f1avg Mod data = 4-ones, 4-zeros: 111100001111...  160  140 to 175 kHz  ∆f2max ≥ limit for at least 99.9% of all Δf2max Mod data = 1010101...    130  > 115 kHz  ∆f2avg / ∆f1avg  88   > 80  %   BR carrier frequency  One slot packet   -25   +25 < ±25 kHz
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 21 drift  Three and five slot packet  -35   35 < ±40 kHz  BR drift rate    lfk+5 – fkl , k = 0 …. max     15 < 20  kHz/ 50μs BR initial carrier frequency tolerance (2) f0 – fTX  -25   25  < ±75 kHz  1) Performance figures at maximum power 2) This number is added on top of the reference clock frequency accuracy 4.3.7.  BT Modulation, EDR Parameter (1) Condition Min Typ. Max BT spec Units EDR Carrier frequency stability      -5   5 ≤10    kHz   EDR Initial Carrier Frequency Tolerance (2)    -25   25 ±75    kHz   EDR RMS DEVM  EDR2      4  20    %   EDR3      4  13    %   EDR 99% DEVM  EDR2        30 30    %   EDR3        20 20    %   EDR Peak DEVM  EDR2      9  35    %   EDR3      9  25    %   1) Performance figures at maximum power 2) This number is added on top of the reference clock frequency accuracy 4.3.8.  BT BR, EDR Transceiver - Emissions Parameter (1)  Condition (2)  Performances  Units Min  Typ  Max BT out-of-band emission 746-768 MHz    (CDMA)      BR, EDR     -151   dBm/Hz   869-894 MHz    (WCDMA, GSM)         -149   dBm/Hz   925-960 MHz    (E-GSM)         -148   dBm/Hz   1570-1580 MHz    (GPS)     -145   dBm/Hz   1598-1607 MHz    (GLONASS)    (3)     -145   dBm/Hz   1805-1880 MHz    (DCS, WCDMA)       -141   dBm/Hz   1930-1990 MHz    (PCS)         -139   dBm/Hz   2110-2170 MHz    (WCDMA)      BR     -134   dBm/Hz   EDR     -129   dBm/Hz   BT harmonics    2nd harmonic     1.5    dBm
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 22   3rd harmonic     -4    dBm       4th harmonic     -10    dBm     1)    Meets FCC and ETSI requirements with suitable external filter 2)    Performance figures at maximum power 3)    Except for frequencies that corresponds to 2*RF_FREQ/3 4.3.9.  BT BR Transceiver - Spurs Parameter (1)  Condition (2)  Performances  Units Min  Typ  Max BT out-of-band spurs  76-108 MHz    (FM)    BR     -77  dBm 746-768 MHz    (WCDMA)         -79  dBm 869-894 MHz    (WCDMA, GSM)         -77  dBm 925-960 MHz    (E-GSM)         -77  dBm 1570-1580 MHz    (GPS)     -72  dBm 1598-1607 MHz    (GLONASS)    (3)     -74  dBm 1805-1880 MHz    (DCS, WCDMA)         -72  dBm 1930-1990 MHz    (PCS)         -70  dBm 2110-2170 MHz    (WCDMA)        -59  dBm 1)    Meets FCC and ETSI requirements with suitable external filter 2)    Performance figures at maximum power 3)    Except for frequencies that corresponds to 2*RF_FREQ/3 4.3.10.  BT EDR Transceiver - Spurs Parameter  Condition (1)  Performances  Units Min  Typ  Max BT out-of-band spurs  76-108 MHz (FM)    EDR     -82  dBm 746-768 MHz (WCDMA)         -87  dBm 869-894 MHz (WCDMA, GSM)       -85  dBm 925-960 MHz (E-GSM)         -84  dBm 1570-1580 MHz (GPS)     -79  dBm 1598-1607 MHz (GLONASS) (2)    -78  dBm 1805-1880 MHz (DCS, WCDMA)       -76  dBm 1930-1990 MHz (PCS)         -74  dBm 2110-2170 MHz (WCDMA)        -63  dBm 1) Performance figures at maximum power 2) Except for frequencies that corresponds to 2*RF_FREQ/3
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 23 4.4.  BT LE RF Performance 4.4.1.  BT LE Receiver Characteristics, In-Band Signals Parameter  Condition (2) Min Typ Max BLE spec Units BT LE Operation frequency range      2402   2480   MHz BT LE Channel spacing        2      MHz BT LE Input impedance        50      Ω BT LE Sensitivity (1), Dirty Tx on      -92.8   ≤ -70  dBm BT LE Maximum useable input power    -5      ≥ -10  dBm BT LE Intermodulation characteristics  Level of interferers. For n = 3, 4, 5   -36 -30   ≥ -50  dBm BT LE C/I performance Note: Numbers show wanted signal-to-interfering signal ratio. Smaller numbers indicate better C/I performance. Image = -1MHz LE, co-channel      8 12 ≤ 21  dB LE, adjacent ±1MHz      -5 0 ≤ 15 LE, adjacent +2MHz      -45 -38 ≤ -17 LE, adjacent –2MHz      -22 -15 ≤ -15 LE, adjacent ≥ |±3|MHz   -47 -40 ≤ -27   1) Sensitivity degradation up to -3dB may occur due to fast clock harmonics. 2) BER of 0.1% corresponds to PER of 30.8% for a minimum of 1500 transmitted packets, according to BT LE test spec  4.4.2.  BT LE Receiver Characteristics – General Blocking Parameter  Condition Min Typ  Max  BLE spec Unit BT LE Blocking performance over full range, according to LE specification (1) 30–2000MHz    -15     ≥ –30    dBm   2000–2399MHz    -15     ≥ –35   2484–3000MHz    -15     ≥ –35   3–12.75GHz    -15     ≥ –30   1) Exceptions taken out of the total 10 allowed for fbf_1, according to the BT LE Spec
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 24 4.4.3.  BT LE Transmitter Characteristics Parameter  Min Typ Max BT LE Spec Unit BT LE RF output power (1) Vbat >= 3V  12.2   ≤10    dBm   Vbat < 3V  6.7   ≤10    dBm   BT LE Adjacent Channel Power |M-N| = 2 (2)  -51.0  ≤ –20    dBm   BT LE Adjacent Channel Power |M-N| > 2 (2)  -54.0  ≤ –30   1)    To reduce the maximum BLE power, use a VS command. The optional extra margin is offered to compensate for design losses, such as trace and filter losses, and to achieve the maximum allowed output power at system level. 2)    Assumes 3dB insertion loss on external filter and traces 4.4.4.  BT LE Modulation Characteristics Parameter  Condition (1) Performances  BT Spec Units Min Typ Max BT LE modulation characteristics ∆f1avg Mod data = 4-ones, 4-zeros: 111100001111...   250  225 to 275 kHz  ∆f2max ≥ limit for at least 99.9% of all Δf2max Mod data = 1010101...  215   ≥185 kHz  ∆f2avg / ∆f1avg  90   ≥80  %   BT LE carrier frequency drift   lf0 – fnl , n = 2,3 …. K   -25      25  ≤±50 kHz  BT LE drift rate    lf1 – f0l and lfn – fn-5l ,n = 6,7…. K         15  ≤20 kHz/ 50μs LE initial carrier frequency tolerance (2) fn – fTX   -25      25  ≤±100 kHz  1) Performance figures at maximum power 2) This number is added on top of the reference clock frequency accuracy
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 25 4.4.5.  BT LE Transceiver – Emissions See Section 4.3.8, BT BR, EDR Transceiver – Emissions.  4.4.6. BT LE Transceiver - Spurs See Section 4.3.9, BT BR Transceiver – Spurs.    4.5.   ANT Performance 4.5.1. ANT Receiver Characteristics, In-Band Signals Parameter  Condition  Min  Typ  Max Units ANT Operation frequency range       2402     2480 MHz ANT Channel spacing          1     MHz ANT Sensitivity  12.72% PER (1)     -84.7     dBm 1) Translation from BER=0.1%, assuming packet is 136 bits ( not including preamble )  4.5.2. ANT Transmitter Characteristics Same as Bluetooth BR Transmitter Characteristics
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 26 4.6.   POWER CONSUMPTION 4.6.1.  Shutdown and Sleep Currents Parameter Power Supply Current Typ Unit Shutdown mode (All functions shut down) VBAT  11  uA WLAN sleep mode VBAT    155 BT sleep mode VBAT    111  4.6.2.  WLAN Power Currents Parameter Conditions  Typ (avg) - 25C Units LPM  2.4GHz RX LPM  48  mA Receiver 2.4GHz RX search SISO20  53  mA 2.4GHz RX search SISO40  58  mA 5GHz RX search SISO20  59  mA 5GHz RX search SISO40  63  mA 2.4GHz RX 20M SISO 11CCK  55  mA 2.4GHz RX 20M SISO 6OFDM  60  mA 2.4GHz RX 20M SISO MCS7  64  mA 2.4GHz RX 40MHz MCS7  76  mA 5GHz RX 20MHz 6OFDM  67  mA 5GHz RX 20MHz MCS7  72  mA 5GHz RX 40MHz MCS7  84  mA Transmitter 2.4GHz TX 20M SISO 6OFDM 16.4dBm  290  mA 2.4GHz TX 20M SISO 11CCK 16.5dBm  278  mA 2.4GHz TX 20M SISO 54OFDM 13.1dBm  252  mA 2.4GHz TX 20M SISO MCS7 12.2dBm  243  mA 2.4GHz TX 40M SISO MCS7 11.8dBm  248  mA 5GHz TX 20M SISO 6OFDM 16.8dBm  371  mA 5GHz TX 20M SISO 54OFDM 13.4dBm  334  mA 5GHz TX 20M SISO MCS7 12.7dBm  329  mA 5GHz TX 40M SISO MCS7 11.9dBm  337  mA
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 27 4.6.3.  Bluetooth Currents Current measurements are done at the following output power: BR at 12.5dBm, EDR at 7dBm. Use Case (1) Typ Units BR Voice HV3 + sniff    11.6  mA EDR Voice 2-EV3 no retrans. + sniff    5.9  mA Sniff 1 attempt 1.28s  178  uA EDR A2DP EDR2 (master). SBC high quality – 345Kbs    10.4  mA EDR A2DP EDR2 (master). MP3 high quality – 192Kbs  7.5  mA Full throughput ACL RX: RX-2DH5 (2) (3)    18  mA Full throughput BR ACL TX: TX-DH5 (3)    50  mA Full throughput EDR ACL TX: TX-2DH5 (3)    33  mA Page or inquiry 1.28s/11.25ms    253  uA P&I Scan (P=1.28/I=2.56)    332  uA 1) BT role in all scenarios is Slave, except for A2DP 2) ACL RX has same current in all modulations 3) Full throughput assumed data transfer in one direction  4.6.4.  Bluetooth LE Currents All current measurements are done at output power of 8dBm Use Case Typ Units Advertising, non-connectable (1)  131  uA Advertising, discoverable (1) 143  uA Scanning (2) 266  uA Connected, master role, 1.28sec conn. Interval (3) 124  uA Connected, slave role, 1.28sec conn. Interval (3) 132  uA 1) Advertising in all 3 channels, 1.28sec advertising interval, 15 Bytes advertise data. 2) Listening to a single frequency per window, 1.28sec scan interval, 11.25msec scan window. 3) Zero Slave connection latency Empty Tx/Rx LL packets.
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 28 4.6.5.  ANT Currents Use Case Conditions  Typ Units ANT Rx message mode  250ms interval  360  uA ANT Rx message mode  500ms interval  220  uA ANT Rx message mode  1000ms interval  150  uA
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 29 5. HOST INTERFACE TIMING CHARACTERISTICS The following table summarizes the Host Controller interface options. All interfaces operate independently.  WLAN  Shared HCI for all functional blocks except WLAN BT Voice/Audio WLAN HS SDIO  Over UART  BT PCM  The device incorporates UART module dedicated to the BT shared-transport Host Controller Interface (HCI) transport layer. The HCI interface is used to transport commands, events and ACL between the Bluetooth device and its host using HCI data packets. This acts as a shared transport for all functional blocks except WLAN.  5.1.   WLAN SDIO Transport Layer The SDIO is the host interface for WLAN. The interface between the host and the WG7835-T0 uses an SDIO interface and supports a maximum clock rate of 50MHz.    The Device SDIO also supports the following features of the SDIO V3 specification:  4 bit data bus  Synchronous and Asynchronous In-Band-Interrupt  Default and High-Speed (50MHz) timing  Sleep/wake commands
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 30 5.2.   SDIO Timing Specifications 5.2.1.  SDIO Switching Characteristics – Default Rate  Figure 5-1 SDIO default input timing   Figure 5-2 SDIO default output timing  Table 5-1 SDIO Default Timing Characteristics(1) PARAMETER(2)  MIN  MAX  UNIT Fclock  Clock frequency, CLK  0  26  MHz DC  Low/high duty cycle  40  60  % tTLH  Rise time, CLK    10  ns tTHL  Fall time, CLK    10  ns
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 31 tISU  Setup Ɵme, input valid before CLK↑  3    ns tIH  Hold Ɵme, input valid aŌer CLK↑  2    ns tODLY  Delay Ɵme, CLK↓ to output valid  2.5  14.8  ns CI  Capacitive load on outputs    15  pF (1) To change the data out clock edge from the falling edge (default) to the rising edge, set the configuration bit. (2) Parameter values reflect maximum clock frequency.  5.2.2.  SDIO Switching Characteristics – High Rate  Figure 5-3. SDIO HS input timing   Figure 5-4 SDIO HS output timing
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 32 Table 5-2 SDIO HS Timing Characteristics PARAMETER  MIN  MAX  UNIT Fclock  Clock frequency, CLK  0  50  MHz DC  Low/high duty cycle  40  60  % tTLH  Rise time, CLK    3  ns tTHL  Fall time, CLK    3  ns tISU  Setup Ɵme, input valid before CLK↑  3    ns tIH  Hold Ɵme, input valid aŌer CLK↑  2    ns tODLY  Delay Ɵme, CLK↓ to output valid  2.5  14  ns CI  Capacitive load on outputs    10  pF  5.3.   HCI UART Shared Transport Layers for All Functional Blocks (Except WLAN) The HCI UART supports most baud rates (including all PC rates) for all fast clock frequencies - up to a maximum of 4 Mbps. After power up the baud rate is set for 115.2 kbps, regardless of fast clock frequency. The baud rate can then be changed by using a VS command. The Device responds with a Command Complete Event (still at 115.2 kbps), after which the baud rate change occurs.  HCI hardware includes the following features:    Receiver detection of break, idle, framing, FIFO overflow and parity error conditions.    Receiver Transmitter underflow detection.    CTS/RTS hardware flow control.    4 wires (H4) The below table lists the UART default settings    Table 5-3 UART Default Setting Parameter  Value Bit Rate  115.2 kbps Data Length  8 bits Stop Bit  1 Parity  None
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 33 5.3.1.  UART 4-Wires Interface – H4 The interface includes four signals: TXD, RXD, CTS and RTS. Flow control between the host and the Device is byte-wise by hardware. ( See Figure 5-5 )   Figure 5-5 HCI UART Connection When the UART RX buffer of the device passes the flow-control threshold, the buffer sets the UART_RTS signal high to stop transmission from the host. When the UART_CTS signal is set high, the device stops transmitting on the interface. If HCI_CTS is set high in the middle of transmitting a byte, the device finishes transmitting the byte and stops the transmission.  5.4.   UART Timing Specifications  Figure 5-6 UART Timing Diagram  Table 5-4 UART Timing Characteristics Characteristic  Condition  Symbol  Min  Typ  Max  Unit Baud rate      37.5    4364  Kbps Baud rate accuracy per byte RX/TX    -2.5    +1.5  % Baud rate accuracy per bit  RX/TX    -12.5    +12.5  % CTS low to TX_DATA on    t3  0  2    us
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 34 CTS low to TX_DATA off  Hardware flow control  t4      1  Byte CTS High Pulse Width    t6  1      bit RTS low to RX_DATA on    t1  0  2    us RTS high to RX_DATA off  Interrupt set to 1/4 FIFO t2      16  Bytes  STR-Start bit;    D0..Dn - Data bits (LSB first);   PAR - Parity bit (if used);    STP - Stop bit Figure 5-7 UART Data Frame  5.5.   Bluetooth Codec-PCM(Audio) Timing Specifications Figure 5-8 shows the Bluetooth codec-PCM (audio) timing diagram. Table 5-5 lists the Bluetooth codec-PCM master timing characteristics. Table 5-6 lists the Bluetooth codec-PCM slave timing characteristics.  Figure 5-8. PCM Interface Timing  Table 5-5 Bluetooth Codec-PCM Master Timing Characteristics Parameter  Symbol  Min  Max  Unit Cycle time  Tclk  166.67 (6.144MHz) 15625 (64 kHz) ns High or low pulse width  Tw  35% of Tclk min   AUD_IN setup time  tis  10.6   AUD_IN hold time  tih  0   AUD_OUT propagation time  top  0  15 AUD_FSYNC_OUT propagation time  top  0  15 Capacitive loading on outputs  Cl    40  pF
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 35 Table 5-6 Bluetooth Codec-PCM Slave Timing Characteristics Parameter  Symbol  Min  Max  Unit Cycle time  Tclk  81 (12.288MHz)    ns High or low pulse width  Tw  35% of Tclk min   AUD_IN setup time  tis  5   AUD_IN hold time  tih  0   AUD_OUT propagation time  top  5   AUD_FSYNC_OUT propagation time  top  0  19 Capacitive loading on outputs  Cl    40  pF
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 36 6. CLOCK AND POWER MANAGEMENT The slow clock is a free-running, 32.768 kHz clock supplied from an external clock source. The clock is connected to the RTC_CLK pin and is a digital square-wave signal in the range of 0 to 3.3V nominal  6.1.   Reset-Power-Up System After VBAT is fed to the device and while BT_EN and WL_EN are deasserted (low), the device is in SHUTDOWN state, during which functional blocks, internal DC-DCs, and LDOs are disabled. The power supplied to the functional blocks is cut off. When one of the signals (BT_EN or WL_EN) are asserted (high), a power-on reset (POR) is performed. Stable slow clock and VBAT are prerequisites for a successful POR.  6.2.   WLAN Power-Up Sequence Figure 6-1 shows the WLAN power-up sequence.   Figure 6-1 WLAN Power-Up Sequence
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 37 6.3. Bluetooth/BLE/ANT Power-Up Sequence Figure 6-2 shows the Bluetooth/BLE/ANT power-up sequence.  Figure 6-2 Bluetooth/BLE/ANT power-up sequence
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 38 7. REFERENCE SCHEMATIC 7.1. Module Reference Design  Figure 7-1 Module Reference Schematic
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 39 8. DESIGN RECOMMENDATIONS 8.1. Design Note on Debug Port    Pin# 11, 12 serve as WLAN and BT debug port, respectively. So test points for these two signals should be reserved for debugging purpose.    Pin# 43 (SDIO WAKE#) needs to be pulled high via 10Kohm and use Pin# 11, 12 as hardware interface to communicate with system platform and TI RTTT test utility for WLAN RF performance test, debug and manufacturing application.  8.2. Module Layout Recommendations Follow these module layout recommendations:  Digital Signals Layout  SDIO signals traces (CMD, D0, D1, D2 and D3) should be routed in parallel to each other and as short as possible. (Less than 12cm) Besides, every trace length must be the same as the others.  Enough space above 1.5 time trace width or ground shielding between trace and trace will be benefit to make sure signal quality, especially for SDIO_CLK trace.    Remember to keep them away from the other digital or analog signal traces. Adding ground shielding around these bus is recommended.  Route trace of SDIO_CLK at Top layer without vias.  SDIO Clock, Audio Clock (PCM_AUD_CLK), these digital clock signals are a source of noise. Keep the traces of these signals as short as possible. Whenever possible, maintain a clearance around them.  BT_AUD signals should be rounted in the same group and it’s better to rout them at the same layer or confirm them referring to the same reference plane.   Power Trace  Power trace for VBAT should be 20mil wide, at least.  Isolate different power traces with Ground plane   Ground  Having a complete Ground and more GND vias under module in layer1 for system stable and thermal dissipation.  Have a complete Ground pour in layer 2 for thermal dissipation.
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 40  Increase the GND pour in the 1st layer, move all the traces from the 1st layer to the inner layers if possible.  Move GND vias close to the pad.   Clocks  It is preferable to keep all clocks between the ground/power layers.
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 41 9. PACKAGE INFORMATION 9.1. NGFF Type 2226 Specification from PCI-e M.2_Rev1.0 ※ Only Ant1 and Ant2 on this module.   Figure 9-1 M.2 Type 2226-S3 Mechanical Outline Drawing
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 42   Figure 9-2 Recommended Land Pattern for Module Type 2226
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 43 9.2. WG7833BEM2A Module Drawing    Figure 9-3 Module drawing  9.3. RF Connector  ※ P/N : 20449-001E (MHF4 series) from I-PEX Figure 9-4 RF Connect drawing
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 44 10. SMT AND BAKING RECOMMENDATION 10.1. Baking Recommendation    Baking condition: -  Follow MSL Level 4 to do baking process. -  After bag is opened, devices that will be subjected to reflow solder or other high temperature process must be a) Mounted within 72 hours of factory conditions <30°C/60% RH, or   b) Stored at <10% RH. -    Devices require bake, before mounting, if Humidity Indicator Card reads >10%   If baking is required, Devices may be baked for 8 hrs. at 125 °C.  10.2. SMT Recommendation  Recommended Reflow profile:  No.  Item  Temperature  Heating Time 1  Pre-heat  D1 = 140 °C  T1: 80 ~ 120 sec 2  Soldering  D2 = 220 °C  T2: 60 +/- 10 sec 3  Peak-Temp.  D3 = 250 °C max  H
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 45 Note:   (1) Reflow soldering is recommended two times maximum. (2) Add Nitrogen while Reflow process:  SMT solder ability will be better.     Stencil thickness::::  0.1~ 0.13 mm (Recommended)    Soldering paste (without Pb)::::  Recommended SENJU N705-GRN3360-K2-V can get better soldering effects.   11. HISTORY CHANGE Revision  Date  Description D 0.1  2015 / 02 / 26  New Released D 0.2  2015 / 07 / 28  Add FCC/NCC WARING STATEMENT
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 46 FCC WARING STATEMENT  This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:   -Reorient or relocate the receiving antenna.   -Increase the separation between the equipment and receiver.   -Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.   -Consult the dealer or an experienced radio/TV technician for help.    You are cautioned that changes or modifications not expressly approved by the party responsible for compliance could void your authority to operate the equipment.    This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation.  FCC RF Radiation Exposure Statement:   1. This Transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.   2. This equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20 centimeters between the radiator and your body.    According to FCC 15.407(e), the device is intended to operate in the frequency band of 5.15GHz to 5.25GHz under all conditions of normal operation. Normal operation of this device is restricted to indoor used only to reduce any potential for harmful interference to co-channel MSS operations.    Information to OEM integrator The OEM integrator has to be aware not to provide information to the end user regarding how to
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 47 install or remove this RF module in the user manual of the end product. The user manual which is provided by OEM integrators for end users must include the following information in a prominent location.   1. To comply with FCC RF exposure compliance requirements, the antenna used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co- located or operating in conjunction with any other antenna or transmitter, except in accordance with FCC multi-transmitter product transmitter product procedures. 2. Only those antennas with same type and lesser gain filed under this FCC ID number can be used with this device. 3. The regulatory label on the final system must include the statement: “Contains FCC ID: WS2-WG7833B0 “. 4. The final system integrator must ensure there is no instruction provided in the user manual or customer documentation indicating how to install or remove the transmitter module except such device has implemented two-ways authentication between module and the host system. 5. If the end product integrating this module is going to be operated in 5.15 ~5.25GHz frequency range, the warning statement in the user manual of the end product should include the restriction of operating this device in indoor could void the user’s authority to operate the equipment.
                                                  Doc No: WG7833BEM2A-DTS-D02                                                                                                 Copyright © JORJIN TECHNOLOGIES INC. 2015 http://WWW.JORJIN.COM.TW CONFIDENTIAL  Page 48 NCC WARING STATEMENT  Article 12 Without permission, any company, firm or user shall not alter the frequency, increase the power, or change the characteristics and functions of the original design of the certified lower power frequency electric machinery.  Article 14 The application of low power frequency electric machineries shall not affect the navigation safety nor interfere a legal communication, if an interference is found, the service will be suspended until improvement is made and the interference no longer exists.

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