Inventek Systems RL78 2.4 GHz BTLE wireless module User Manual

Inventek Systems 2.4 GHz BTLE wireless module

User Manual

Bluetooth Low Energy SIP Module OEM/Integrators Installation ManualInventek Systems ISMRL78G1D Embedded Bluetooth Low Energy SIP Module OEM/Integrators Installation Manual OEM/Integrators Installation Manual
Inventek Systems ISM78G1D-L31_DS_20167 _2.1 2 Table of Contents 1 General Description ............................................................................................................ 3 2 Part Number Detail Description.......................................................................................... 4 2.1 Ordering Information ...................................................................................................... 4 3 General Features ................................................................................................................. 4 3.1 Limitations ...................................................................................................................... 5 3.2 Regulatory Compliance .................................................................................................. 5 4 Complementary Documents................................................................................................ 7 4.1 Inventek Systems ............................................................................................................ 7 5 Specifications ...................................................................................................................... 8 5.1 Block Diagram ................................................................................................................ 8 6 Environmental Specifications ............................................................................................. 8 7 Hardware Electrical Specifications ..................................................................................... 8 7.1 Absolute Maximum Ratings ........................................................................................... 8 7.2 Recommended Operating Ratings .................................................................................. 8 7.3 ADC Specifications ........................................................................................................ 8 Notes 1. Current flowing to VDD. .............................................................................................. 9 8 Power Consumption ............................................................................................................ 9 8.1.1 Estimated Power Consumption ................................................................................... 9 9 Module Pin Out ................................................................................................................. 10 9.1 Detailed Pin Description: .................................................................................................... 11 10 AC Characteristics ............................................................................................................ 12 11 Bluetooth Low energy Specifications ............................................................................... 12 11.1 Transmitter RF Specifications ...................................................................................... 12 Receiver RF Specifications ....................................................................................................... 13 12 Footprint ............................................................................................................................ 14 13 Product Compliance Considerations ................................................................................. 15 14 Reflow Profile ................................................................................................................... 15 15 Packaging Information ...................................................................................................... 16 15.1 MSL Level / Storage Condition .................................................................................... 16 16 Revision Control ............................................................................................................... 16 17 Contact Information .......................................................................................................... 16
Inventek Systems ISM78G1D-L31_DS_20167 _2.1 3 1 General Description The Inventek ISMRL78G1D module is an embedded wireless Bluetooth low energy (BLE) connectivity device, based on the RenesasRL78/G1Dmicrocomputer incorporating the RL78 CPU core and low power consumption RF transceiversupporting the Bluetooth ver.4.1 (Low Energy Single mode) specifications. The Inventek ISMRL78G1D offers a RL78 CPU core is a3-stage pipelineCISC architecture with an integrated BLE radio, on-board chip antenna, and256KB ROM. The module provides a number of features and standard peripheral interfaces (see “Summaryof Key Features” below), enabling connection to an embedded design. The low cost, small foot print,11mmx13mm 31-Pin LGA package and ease of design-in make it ideal for a range of embedded applications. Note: This module is limited to OEM installation ONLY. Summary of Key Features:  Bluetooth low energy (BLE)-compliant  CISC architecture with 3-stage pipeline o Minimum instruction execution time: Can be changed from high speed (0.03125 us: @ 32 MHz operation with high speed On-chip oscillator) to ultra-low speed (30.5 us: @ 32.768 kHz operation with subsystem clock) o Address space: 1 MB o General-purpose registers: (8-bit register × 8) × 4 banks  On-chip RF transceiver o Bluetooth v4.1 Specification (Low Energy Single mode) o 2.4 GHz ISM band, GFSK modulation, TDMA/TDD frequency hopping (including AES encryption circuit) o Adaptivity, exclusively for use in operation as a slave device  Code flash memory o Code flash memory: 256KB o Block size: 1KB o Prohibition of block erase and rewriting (security function) o On-chip debug function o Self-programming (with boot swap function/flash shield window function)  Data flash memory o Data flash memory: 8KB o Back ground operation (BGO): Instructions can be executed from the program memory while rewriting the data flash memory. o Number of rewrites: 1,000,000 times (TYP.) o Voltage of rewrites: VDD = 1.8 to 3.6 V
Inventek Systems ISM78G1D-L31_DS_20167 _2.1 4 Typical Applications: The module has been designed to provide low power, low cost, and robust communications for applications operating in the globally available 2.4GHz unlicensed industrial, scientific, and medical (ISM) band. The following application profiles are supported in ROM: o Battery Status o Blood Pressure Monitor o Find Me o Heart Rate Monitor o Proximity o Thermometer o Weight Scale o Time Additional profiles that can be supported from RAM include: o Blood Glucose Monitor o Temperature Alarm o Location 2 Part Number Detail Description 2.1 Ordering Information Part Number Description Ordering ISM78G1D-L31 Bluetooth LE Module Tube ISM78G1D-L31-TR Bluetooth LE Module Tape & Reel 3 General Features o Based on the Renesas RL78/G1D Bluetooth Low Energy 4.1 Baseband/Radio device. o Integrates Bluetooth embedded stack, and fully qualified application profiles in ROM o Power-saving mode allows the design of low-power applications. o Lead Free Design which is compliant with ROHS requirements. o FCC/CE Compliance Certified ( In process )
Inventek Systems 3.1 Limitations Inventek Systems products are not authorized for use in safety(such as life support) where a failure of the Inventek Systems product would reasonably be expected to cause severe personal injury or death. The OEM integrator is respoinstructions to remove or install module. The module is limited to installation in mobile or fixed application ONLY. A separate approval is required for all other operating configuration including portaconfiguration with respect to FCC Part 2.1093 and different antenna configurations. The OEM/Integrator can expect to receive guidance from the grantee to ensure compliance with Part 15 Subpart B requirements provide the module is being used within the grant restrictions and instruction detailed within this manual. In the event that these conditions cannot be met (for example certain host configurations or collocation configurations may results in deviations from Grantee’s recommend practice) then the FCC authorization may no longer be consider valid and the FCC ID cannot be used on the final host product. In these circumstances, the OEM Integrator will be responsible for reevaluating the end product (including the transmitter) and obtaining a new sepintended only for OEM Integrators under and under the following conditions: As long as the conditions in this manual are met include RF Exposure requirements and Antenna requirements, further transmitter testing wilOEM Integrator is responsible for testing their end product for any additional compliance requirements such as compliance with Part 15 Subpart B. 3.2 Regulatory Compliance FCC ID: O7P-RL78 IC: 10147A-RL78 There are specific regulatory requirements imposed by regulatory authorities around the world on radio devices.engage with an accredited test lab to determine the overall system level regulatory requirements. Customers may be able to leverage Please discuss the process with your test lab, such as FCC ID transfers. can provide authorizations as neededISM78G1D-L31_DS_20167 _2.15 Inventek Systems products are not authorized for use in safety-critical applications (such as life support) where a failure of the Inventek Systems product would reasonably be expected to cause severe personal injury or death. The OEM integrator is responsible for ensuring that the end-user has no manual instructions to remove or install module. The module is limited to installation in mobile or fixed application ONLY. A separate approval is required for all other operating configuration including portaconfiguration with respect to FCC Part 2.1093 and different antenna configurations. The OEM/Integrator can expect to receive guidance from the grantee to ensure compliance with Part 15 Subpart B requirements provide the module is being used e grant restrictions and instruction detailed within this manual. In the event that these conditions cannot be met (for example certain host configurations or collocation configurations may results in deviations from Grantee’s recommend FCC authorization may no longer be consider valid and the FCC ID cannot be used on the final host product. In these circumstances, the OEM Integrator will be responsible for reevaluating the end product (including the transmitter) and obtaining a new separate FCC authorization. This device is intended only for OEM Integrators under and under the following conditions: As long as the conditions in this manual are met include RF Exposure requirements and Antenna requirements, further transmitter testing will not be required. However the OEM Integrator is responsible for testing their end product for any additional compliance requirements such as compliance with Part 15 Subpart B.Regulatory Compliance specific regulatory requirements imposed by regulatory authorities around the world on radio devices. Customers using Renesas SIP modules are advised to engage with an accredited test lab to determine the overall system level regulatory mers may be able to leverage Renesas' regulatory test reports. Please discuss the process with your test lab, such as FCC ID transfers. can provide authorizations as needed. L31_DS_20167 _2.1 critical applications (such as life support) where a failure of the Inventek Systems product would user has no manual The module is limited to installation in mobile or fixed application ONLY. A separate approval is required for all other operating configuration including portable configuration with respect to FCC Part 2.1093 and different antenna configurations. The OEM/Integrator can expect to receive guidance from the grantee to ensure compliance with Part 15 Subpart B requirements provide the module is being used e grant restrictions and instruction detailed within this manual. In the event that these conditions cannot be met (for example certain host configurations or collocation configurations may results in deviations from Grantee’s recommend FCC authorization may no longer be consider valid and the FCC ID cannot be used on the final host product. In these circumstances, the OEM Integrator will be responsible for reevaluating the end product (including the arate FCC authorization. This device is intended only for OEM Integrators under and under the following conditions: As long as the conditions in this manual are met include RF Exposure requirements and l not be required. However the OEM Integrator is responsible for testing their end product for any additional compliance requirements such as compliance with Part 15 Subpart B. specific regulatory requirements imposed by regulatory authorities around SIP modules are advised to engage with an accredited test lab to determine the overall system level regulatory ' regulatory test reports. Please discuss the process with your test lab, such as FCC ID transfers. Renesas
Inventek Systems ISM78G1D-L31_DS_20167 _2.1 6 When this transmitter is installed in a host device, you must place a permanent label, visible on the outside of the device which includes the following information: Contains: FCC ID: O7P-RL78 Contains: IC: 10147A-RL78 This device complies with part 15 of the fcc rules. operation is subject to the following two conditions.(1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Warning: Changes or modifications not expressly approved by the party responsible could void the user’s authority to operate the product. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: —Reorient or relocate the receiving antenna. —Increase the separation between the equipment and receiver. —Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. —Consult the dealer or an experienced radio/ TV technician for help. This equipment uses the following Antennas and may not be used with other antenna types or with antennas of higher gain: Mfg.: Inventek Systems Type: Etched Antenna Gain:0 dBi This equipment complies with FCC Radiation Exposure limits and should be installed and operated with a minimum distance of 20cm between the radiator and any part of the human body. ISED (Canada) Required Notices to the User
Inventek Systems ISM78G1D-L31_DS_20167 _2.1 7 This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. This radio transmitter, IC: 10147A-RL78, has been approved by Industry Canada to operate with the antenna types listed below with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Type:2.4 GHz chip antenna Gain:-1.5 dBi Le présent émetteur radio, IC: 10147A-RL78 a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés ci-dessous et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur. Type:2.4 GHz chip antenna Gain:-1.5 dBi This equipment complies with the ICES RF radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20cm between the radiator and any part of the human body. Cet équipement est conforme aux limites d'exposition aux radiations ICES définies pour un environnement non contrôlé . Cet équipement doit être installé et utilisé à une distance minimale de 20 cm entre le radiateur et une partie de votre corps. 4 Complementary Documents 4.1 Inventek Systems  RL78/G1D Renesas Data Sheet o P/N (R5F11AGJDNB#40)  ISM78G1D-L31 Product Brief
Inventek Systems ISM78G1D-L31_DS_20167 _2.1 8  ISM78G1D-EVB Quick Start Guide  Renesas Tools and Design Environment  FCC Test Report 5 Specifications 5.1 Block Diagram Available upon request 6 Environmental Specifications Item Description Operating Temperature Range -40 deg. C to +80 deg. C Storage Temperature Range -65 deg. C to +150 deg. C Humidity 95% max non-condensing 7 Hardware Electrical Specifications 7.1 Absolute Maximum Ratings Symbol Description Min Max Unit Supply Power Input Supply Voltage 1.8 3.6 V Voltage Ripple 0 +/-2% VDD, VDD_RF 1.8 3.6 V 7.2 Recommended Operating Ratings Symbol Min Typ Max Unit VDD - 3.3 - V VDD_RF - 3.3 - V 7.3 ADC Specifications Parameter Symbol Conditions Min Typ Max Unit A/D converter operating current IADC1, 2 When conversion at maximum speed AVREFP = VDD = 3.0 V 0.5 0.7 mA
Inventek Systems ISM78G1D-L31_DS_20167 _2.1 9 Notes 1. Current flowing to VDD. Notes 2.Current flowing only to the A/D converter. The current value of MCU is the sum of IDD1 or IDD2 and IADC when theA/D converter operates in an operation mode or the HALT mode. 8 Power Consumption The Power Management Unit (PMU) provides power management features that can be invoked by software through power management registers or packet-handling in the baseband core. There are several Ultra-low power consumption technology operations: MCU part o Standby function HALT mode o STOP mode o SNOOZE mode RF part o Standby function POWER_DOWN mode o RESET_RF mode o STANDBY_RF mode o IDLE_RF mode, o DEEP_SLEEP mode, SLEEP_RF mode RF transmission o (RF normal mode): 4.3 mA (TYP.) (3.0 V/MCU part: STOP mode) o (RF Low power mode): 2.6 mA (TYP.) (3.0 V/MCU part: STOP mode) RF reception o (RF normal mode): 3.5 mA (TYP.) (3.0 V/MCU part: STOP mode) o (RF Low power mode): 3.3 mA (TYP.) (3.0 V/MCU part: STOP mode) RF sleep o (POWER_DOWN mode) operation: 0.10 uA (TYP.) (3.0 V/MCU part: STOP mode) 8.1.1 Estimated Power Consumption Operational Mode Description Typ. Max. Unit Receive Receiver and baseband are both operating, 100% — ON 3.5 mA Transmit Transmitter and baseband are both operating 4.3 mA Sleep Internal LPO is in use 0.10 - uA
Inventek Systems ISM78G1D-L31_DS_20167 _2.1 10 9 Module Pin Out CONFIDENTIAL. CONTACT MANUFACTURER FOR DETAILS.
Inventek Systems ISM78G1D-L31_DS_20167 _2.1 11 9.1 Detailed Pin Description: Pin # Pin Name Type Description 1 VDD RF I VDD 2 GND I Ground 3 P30,XTAL1_RF I/O Crystal oscillator (RF clock) 4 P16/TI01/TO01/INTP5 I/O 5 P15/SCK20/SCL20/(TI02)/(TO02) I/O 6 P14/SI20/SDA20/(SCLA0)/(TI03)/(TO03) I/O 7 P13/SO20/(SDAA0)/(TI04)/(TO04 I/O 0 P12/SO00/TxD0/TOOLTxD/(TI05)/(TO05) I/O TX 9 P11/SI00/RxD0/TOOLRxD/SDA00/(TI06)/(TO06) I/O RX 10 P10/SCK00/SCL00/(TI07)/(TO07) I/O 11 P147/ANI18 I/O 12 P23/ANI3 I/O 13 P22/ANI2 I/O 14 P21/ANI1/AVREFM I/O 15 P20/ANI0/AVREFP I/O 16 P03/ANI16/RxD1 I/O 17 P02/ANI17/TxD1 I/O 18 P01/TO00 I/O 19 P00/TI00 I/O 20 VDD I VDD 21 nReset I 22 Tool0 I/O Data I/O Flash Programmer 23 GND I Ground 24 P120/ANI19 I/O 25 P121/X1 I 26 P137/INTP0 I 27 P60/SCLA0 I/O 28 P61/SDDA0 I/O 29 GPIO1/TXSELL_RF I/O 30 GPIO0/TXSELH_RF I/O 31 GND I Ground
Inventek Systems ISM78G1D-L31_DS_20167 _2.1 12 10 AC Characteristics Items SymbConditions MIN. TYP. MAX.Unit RESETlow-levelwidth tRSL RESET 10 us 11 Bluetooth Low energy Specifications On-Chip RF Transceiver Bluetooth v4.1 Spec. (Low Energy, Single mode) 2.4 GHz ISM Band, GFSK modulation, TDMA/TDDFrequency Hopping (included AES encryption circuit) Adaptivity, exclusively for use in operation as aslave device Single ended RF interface 11.1 Transmitter RF Specifications The module requires a keep out area for the antenna section outside the metal can. Do not put any metal directly below or above the antenna section and as this will reduce antenna performance. VDD=VDD_RF=3.3V, 25o C Frequency 2440MHz RF transmitter active: 4.3 mA (TYP.) Parameter Symbol Conditions Min Typ Max Unit Frequency CF 2402 2480 MHZ Data Rate 1 Mbps Max transmitted output power RF Power @ RF output pin -3 0 2.5 dBm Transmit Output Settings 0 0 Spurious radiation RF TXSP 30-88MHz -76 dBm 88-216MHz -76 dBm 216-960 MHz -76 dBm 960-1000 MHz -74 dBm 1-12.7 GHz -74 dBm Harmonics RF TXHC1 2nd Harmonic -52 dBm RF TXCH2 3rd Harmonic -51 dBm
Inventek Systems ISM78G1D-L31_DS_20167 _2.1 13 Receiver RF Specifications
Inventek Systems ISM78G1D-L31_DS_20167 _2.1 14 12 Footprint Figure 1: Top View
Inventek Systems ISM78G1D-L31_DS_20167 _2.1 15 13 Product Compliance Considerations RoHS: Restriction of Hazardous Substances (RoHS) directive has come into force since 1st July 2006 all electronic products sold in the EU must be free of hazardous materials, such as lead. Inventek is fully committed to being one of the first to introduce lead-free GPS products while maintaining backwards compatibility and focusing on a continuously high level of product and manufacturing quality. EMI/EMC: The Inventek module design embeds EMI/EMC suppression features and accommodations to allow for higher operational reliability in noisier (RF) environments and easier integration compliance in host (OEM) applications. FCC/CE: The module is compliant with FCC/CE 14 Reflow Profile 2000c 2170c 2450c 1500c Pre-heating Soldering 90~120 sec 60~90 sec Temperature Time
Inventek Systems ISM78G1D-L31_DS_20167 _2.1 16 15 Packaging Information 15.1 MSL Level / Storage Condition [ 16 Revision Control Document : ISM78G1D External Release Date Author Revision Comment 7/27/2016 AS 1.0 Preliminary 9/27/2016 KT 2.0 General updates 10/17/2017 KT 2.1 Certification update 17 Contact Information Inventek Systems 2 Republic Road Billerica Ma, 01862 Tel: 978-667-1962 Sales@inventeksys.com www.inventeksys.com Level 3 260℃ 168 hours MMMDDYYYY
Inventek Systems ISM78G1D-L31_DS_20167 _2.1 17 Inventek Systems reserves the right to make changes without further notice to any products or data herein to improve reliability, function, or design. The information contained within is believed to be accurate and reliable. However Inventek Systems does not assume any liability arising out of the application or use of this information, nor the application or use of any product or circuit described herein, neither does it convey any license under its patent rights nor the rights of others.

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