Huawei Technologies MU709GS-8 HSPA+ Module User Manual English

Huawei Technologies Co.,Ltd HSPA+ Module English

Contents

Quick setup guide

Copyright © Huawei Technologies Co., Ltd. 2012. All rights reserved. No part of this document may be reproduced or transmitted in any form or by any means without prior written consent of Huawei Technologies Co., Ltd. The product described in this manual may include copyrighted software of Huawei Technologies Co., Ltd and possible licensors. Customers shall not in any manner reproduce, distribute, modify, decompile, disassemble, decrypt, extract, reverse engineer, lease, assign, or sublicense the said software, unless such restrictions are prohibited by applicable laws or such actions are approved by respective copyright holders under licenses. Trademarks and Permissions , , and are trademarks or registered trademarks of Huawei Technologies Co., Ltd. Other trademarks, product, service and company names mentioned are the property of their respective owners. Notice Some features of the product and its accessories described herein rely on the software installed, capacities and settings of local network, and may not be activated or may be limited by local network operators or network service providers, thus the descriptions herein may not exactly match the product or its accessories you purchase. Huawei Technologies Co., Ltd reserves the right to change or modify any information or specifications contained in this manual without prior notice or obligation. NO WARRANTY
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i Contents Getting to Know the MU709 ........................................................................................................................... 1 PCB Design ............................................................................................................................................................ 2 Assembly................................................................................................................................................................ 3
1 Thank you for purchasing HUAWEI MU709Gs-8 HSPA+ LGA Module (hereinafter referred to as the MU709) Note:  This manual briefly describes the preparation, the process for PCB Design, Assembly and safety precautions.  You are recommended to read the manual before using the MU709. Getting to Know the MU709  The package of the LGA module is 145 pin LGA with a dimension of 30 mm × 30 mm × 2.27 mm. It is applied to the user interface board, and can be used as a wireless terminal in a network environment.
2 PCB Design PCB Pad Design To achieve assembly yields and solder joints of high reliability, it is recommended that the PCB pad size be designed as follows: the sizes of the solder pads on customers' PCBs are the same as those of the module's solder pads for the high production efficiency and high reliability of solder joints. For details, see the following figure:
3 Requirements on PCB Layout  To reduce deformation, a thickness of at least 1.0 mm is recommended.  Other devices must be located more than 3 mm (5 mm recommended) away from the LGA module. The minimum distance between the LGA module and the PCB edge is 0.5 mm.  When the PCB layout is double sided, it is recommended that the LGA module be placed on the second side for assembly; so as to avoid module dropped from PCB or component (located in module) re-melding defects caused by uneven weight. Design of Solder Mask  The PCB pad design can be solder mask defined (SMD), or non-solder mask defined (NSMD).NSMD is recommended. In addition, the solder mask of the NSMD pad design is larger than the pad so the reliability of the solder joint can be improved.  The solder mask must be 100 µm to150 µm larger than the pad, that is, the single side of the solder mask must be 50 µm to 75 µm larger than the pad. The specific size depends on the processing capability of the PCB manufacturer. Assembly Stencil Design It is recommended that the stencil for the LGA module be 0.15 mm in thickness. For the stencil design, see the following figure：
4 0.6
5 Reflow Profile For the soldering temperature of the LGA module, see the following figure. Reflow profile Reflow parameters Temperature Zone Time Key Parameter Preheat zone (40°C–150°C) 60s–120s Heating rate: 0.5°C/s–2°C/s
6 Soak zone (150°C–200°C) (t1–t2): 60s–120s Heating rate: < 1.0°C/s Reflow zone (> 217°C) (t3–t4): 30s–90s Peak reflow temperature: 230°C–250°C Cooling zone Cooling rate: 1°C/s ≤ Slope ≤ 4°C/s

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