Huawei Technologies MU509-65 HSDPA Module User Manual English

Huawei Technologies Co.,Ltd HSDPA Module English

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UserManual.pdf

Copyright © Huawei Technologies Co., Ltd. 2015. All rights reserved. All rights reserved. No part of this manual may be reproduced or transmitted in any form or by any means without prior written consent of Huawei Technologies Co., Ltd. and its affiliates ("Huawei"). The product described in this manual may include copy righted software of Huawei and possible licensors. Customers shall not in any manner reproduce, distribute, modify, decompile, disassemble, decrypt, extract, rev erse engineer, lease, assign, or sublicense the said sof tware, unless such restrictions are prohibited by applicable laws or such actions are approved by respectiv e copy right holders. Trademarks and Permissions , , and are trademarks or registered trademarks of Huawei Technologies Co., Ltd. Other trademarks, product, serv ice and company names mentioned may be the property of their respectiv e owners. Notice Some f eatures of the product and its accessories described herein rely on the software installed, capacities and settings of local network, and theref ore may not be activ ated or may be limited by local network operators or network serv ice prov iders. Thus, the descriptions herein may not exactly match the product or its accessories which y ou purchase. Huawei reserv es the right to change or modify any inf ormation or specif ications contained in this manual without prior notice and without any liability.
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i Contents Getting to Know the MU509-65 ................................................................................ 1 Dimension ..........................................................................................................................................................1 Position of RF Connectors..........................................................................................................................3 Pin Def initions ..................................................................................................................................................4
1 Thank you for purchasing HUAWEI MU509-65 WCDMA Module (hereinafter referred to as the MU509-65) Note:  This manual brief ly describes the dimension, the position of RF connectors and Pin def initions.  You are recommended to read the manual bef ore using the MU509-65. Getting to Know the MU509-65 Dimension  The package of the WCDMA module is 145 pin with a dimension of 30 mm × 30 mm × 2.57mm. It is applied to the user interf ace board, and can be used as a wireless terminal in a network env ironment.
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3 Position of RF Connectors The WCDMA module prov ided one antenna connector (MAIN_AN T) f or connecting the external antenna.
4 Pin Definitions  The sequence of MU509-65 interf ace is shown below.
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6  The Pin def initions of the MU509-65 interf ace is shown below.
7 Pin No. Pin Name Pad Type Description Paramete r Min. (V) Typ. (V) Max. (V) 1 NC - Not connected - - - - 2 NC - Not connected - - - - 3 NC - Not connected - - - - 4 NC - Not connected - - - - 5 PCM_SYNC O PCM interface sync VOH 2.15 - 2.6 VOL 0 - 0.45 6 PCM_DIN I PCM I/F data in VIH 1.69 - 2.9 VIL –0.3 - 0.91 7 PCM_DOU T O PCM I/F data out VOH 2.15 - 2.6 VOL 0 - 0.45 8 PCM_CLK O PCM interfa ce clock VOH 2.15 - 2.6 VOL 0 - 0.45 9 NC - Not connected - - - - 10 NC - Not connected - - - - 11 WAKEUP_IN I Host to set the module into sleep or wake up the module from sleep. VIH 1.69 - 2.9 VIL –0.3 - 0.91 12 VBAT PI Power supply input - 3.3 3.8 4.2 13 VBAT PI Power supply input - 3.3 3.8 4.2 14 PS_HOLD I Used for JTAG interface assigning a test point for it. VIH 1.17 - 2.1 VIL –0.3 - 0.63 15 Reserved - Reserved, please keep this pin open. - - - - 16 NC - Not connected - - - - 17 NC - Not connected - - - - 18 NC - Not connected - - - -
8 Pin No. Pin Name Pad Type Description Paramete r Min. (V) Typ. (V) Max. (V) 19 NC - Not connected - - - - 20 NC - Not connected - - - - 21 NC - Not connected - - - - 22 NC - Not connected - - - - 23 NC - Not connected - - - - 24 NC - Not connected - - - - 25 NC - Not connected - - - - 26 NC - Not connected - - - - 27 NC - Not connected - - - - 28 Reserved - Reserved, please keep this pin open. - - - - 29 Reserved - Reserved, please keep this pin open. - - - - 30 JTAG_TMS I JTAG test mode select VIH 1.17 - 2.1 VIL –0.3 - 0.63 31 VCC_EXT2 PO 2.6 V power output - 2.5 2.6 2.7 32 VCC_EXT1 PO 1.8 V power output - 1.65 1.8 1.95 33 NC - Not connected - - - - 34 USIM_VCC PO Power supply for USIM ca rd - 1.65 1.8 1.95 - 2.7 2.85 3.0 35 VCOIN PI Coin cell input - 1.5 3.0 3.25 36 JTAG_TRS T_N I JTAG reset VIH 1.17 - 2.1 VIL –0.3 - 0.63 37 NC - Not connected - - - - 38 MIC2_P I Positive pole of the input of audio interface 2. - - - - 39 MIC2_N I Negative pole of the input of audio interface 2. - - - - 40 MIC1_P I Positive pole of the input of audio interface 1. - - - -
9 Pin No. Pin Name Pad Type Description Paramete r Min. (V) Typ. (V) Max. (V) 41 MIC1_N I Negative pole of the input of audio interface 1. - - - - 42 JTAG_TCK I JTAG clock input VIH 1.17 - 2.1 VIL –0.3 - 0.63 43 Reserved - Reserved, please keep this pin open. - - - - 44 GPIO I/O General Purpose I/O pin. The function of these pins has not been defined. VOH 2.15 - 2.6 VOL 0 - 0.45 VIH 1.69 2.9 VIL –0.3 0.91 45 GPIO I/O General Purpose I/O pin. The function of these pins has not been defined. VOH 2.15 - 2.6 VOL 0 - 0.45 VIH 1.69 2.9 VIL –0.3 0.91 46 GPIO I/O General Purpose I/O pin. The function of these pins has not been defined. VOH 2.15 - 2.6 VOL 0 - 0.45 VIH 1.69 2.9 VIL –0.3 0.91 47 NC - Not connected - - - - 48 GND - Ground - - - - 49 GND - Ground - - - - 50 GND - Ground - - - - 51 GPIO I/O General Purpose I/O pin. The function of these pins has not been defined. VOH 2.15 - 2.6 VOL 0 - 0.45 VIH 1.69 2.9 VIL –0.3 0.91 52 GND - Ground - - - - 53 GND - Ground - - - - 54 GND - Ground - - - - 55 GPIO I/O General Purpose I/O pin. The function of these pins has not been defined. VOH 2.15 - 2.6 VOL 0 - 0.45 VIH 1.69 - 2.9 VIL –0.3 - 0.91
10 Pin No. Pin Name Pad Type Description Paramete r Min. (V) Typ. (V) Max. (V) 56 GND - Ground - - - - 57 GND - Ground - - - - 58 GND - Ground - - - - 59 GND - Ground - - - - 60 NC - Not connected - - - - 61 NC - Not connected - - - - 62 NC - Not connected - - - - 63 NC - Not connected - - - - 64 NC - Not connected - - - - 65 NC - Not connected - - - - 66 NC - Not connected - - - - 67 NC - Not connected - - - - 68 NC - Not connected - - - - 69 NC - Not connected - - - - 70 NC - Not connected - - - - 71 WAKEUP_OUT O Module to wake up the host VOH 2.15 - 2.6 VOL 0 - 0.45 72 JTAG_TD O O JTAG test data output VOH 1.35 - 1.8 VOL 0 - 0.45 73 UART_DSR O UART Dat a Set Ready VOH 2.15 - 2.6 VOL 0 - 0.45 74 UART_RTS O UART Ready for re ceive VOH 2.15 - 2.6 VOL 0 - 0.45 75 UART_DCD O UART Dat a Carrier Detect VOH 2.15 - 2.6 VOL 0 - 0.45 76 UART_TX O UART transmit output VOH 2.15 - 2.6 VOL 0 - 0.45 77 UART_RING O UART Ring Indicator VOH 2.15 - 2.6 VOL 0 - 0.45 78 UART_RX I UART receive data input VIH 1.69 2.9 VIL –0.3 0.91 79 UART_DTR I Data Terminal Ready VIH 1.69 2.9 VIL –0.3 0.91
11 Pin No. Pin Name Pad Type Description Paramete r Min. (V) Typ. (V) Max. (V) 80 UART_CTS I UART Clear to Send VIH 1.69 2.9 VIL –0.3 - 0.91 81 POWER_ON_OFF I System power-on or power-off VIH 1.17 - 2.1 VIL –0.3 - 0.63 82 NC - Not connected - - - - 83 NC - Not connected - - - - 84 NC - Not connected - - - - 85 USB_DM I/O Full-speed USB D- - - - - 86 USB_DP I/O Full-speed USB D+ - - - - 87 JTAG_TD I I JTAG test data input VIH 1.17 - 2.1 VIL –0.3 - 0.63 88 USIM_RES ET O USIM reset VOH 1.65/ 2.7 1.8/ 2.85 1.95/ 3.0 VOL 0 - 0.36/ 0.57 89 USIM_D ATA I/O USIM data VOH 1.65/ 2.7 1.8/ 2.85 1.95/ 3.0 VOL 0 - 0.36/ 0.57 VIH 1.65/ 2.7 1.8/ 2.85 1.95/ 3.0 VIL 0 - 0.36/ 0.57 90 USIM_CLK O USIM clock VOH 1.65/ 2.7 1.8/ 2.85 1.95/ 3.0 VOL 0 - 0.36/ 0.57 91 LED_STATUS I Status indicator Current sink Drive strength: 10 mA - - - - 92 NC - Not connected - - - - 93 JTAG_RTCK I JTAG return clock VIH 1.17 - 2.1 VIL –0.3 - 0.63 94 NC - Not connected - - - - 95 NC - Not connected - - - -
12 Pin No. Pin Name Pad Type Description Paramete r Min. (V) Typ. (V) Max. (V) 96 EAR_OUT_N O Negative pole of the output of Earphone interface. - - - - 97 EAR_OUT_P O Positive pole of the output of Earphone interface. - - - - 98 SPKR_OUT_P O Positive pole of the output of speaker interfa ce. - - - - 99 SPKR_OUT_N O Negative pole of the output of speaker interface. - - - - 100 RESIN_N I Reset module. VIH 1.17 - 2.1 VIL –0.3 - 0.63 101 LED_MOD E I Mode indicator Current sink Drive strength: 10 mA - - - - 102 NC - Not connected - - - - 103 NC - Not connected - - - - 104 NC - Not connected - - - - 105 GPIO I/O General Purpose I/O pin. The function of these pins has not been defined. VOH 2.15 - 2.6 VOL 0 - 0.45 VIH 1.69 2.9 VIL –0.3 0.91 106 GND - Ground - - - - 107 MAIN_ANT - RF main antenna pad - - - - 108 GND - Ground - - - - 109 GPIO I/O General Purpose I/O pin. The function of these pins has not been defined. VOH 2.15 - 2.6 VOL 0 - 0.45 VIH 1.69 2.9 VIL –0.3 0.91 110 GND - Ground - - - - 111 NC - Not connected - - - - 112 GND - Ground - - - - 113 GPIO I/O General Purpose I/O pin. The function of these pins has not been defined. VOH 2.15 - 2.6 VOL 0 - 0.45 VIH 1.69 2.9 VIL –0.3 0.91 114 GND - Ground - - - -
13 Pin No. Pin Name Pad Type Description Paramete r Min. (V) Typ. (V) Max. (V) 115 NC - Not connected - - - - 116 GND - Ground - - - - 117 NC - Not connected - - - - 118 NC - Not connected - - - - 119 NC - Not connected - - - - 120 NC - Not connected - - - - 121 GND - Thermal Ground Pad - - - - 122 GND - Thermal Ground Pad - - - - 123 GND - Thermal Ground Pad - - - - 124 GND - Thermal Ground Pad - - - - 125 GND - Thermal Ground Pad - - - - 126 GND - Thermal Ground Pad - - - - 127 GND - Thermal Ground Pad - - - - 128 GND - Thermal Ground Pad - - - - 129 GND - Thermal Ground Pad - - - - 130 GND - Thermal Ground Pad - - - - 131 GND - Thermal Ground Pad - - - - 132 GND - Thermal Ground Pad - - - - 133 GND - Thermal Ground Pad - - - - 134 GND - Thermal Ground Pad - - - - 135 GND - Thermal Ground Pad - - - - 136 GND - Thermal Ground Pad - - - - 137 GND - Thermal Ground Pad - - - - 138 GND - Thermal Ground Pad - - - - 139 GND - Thermal Ground Pad - - - - 140 GND - Thermal Ground Pad - - - - 141 GND - Thermal Ground Pad - - - - 142 GND - Thermal Ground Pad - - - - 143 GND - Thermal Ground Pad - - - - 144 GND - Thermal Ground Pad - - - - 145 GND - Thermal Ground Pad - - - -

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