Hi Link Electronic HLK-RM08S WIFI Module User Manual 15 HLK RM08S UserMan

ShenZhen HaiLingKe Electronic co.,Ltd. WIFI Module 15 HLK RM08S UserMan

15_HLK-RM08S UserMan

SHENZHEN HI-LINK ELECTRONIC CO.,LTDHLK-RM08S USER MANUALVersion：V1.0 Issuing date：2017-2-17 copy right@Hi-Link
CONTENTS1. BRIEF INTRODUCTION............................................................................................................................................ 11.1. BASIC PARAMETERS.................................................................................................................................... 12. BLOCK DIAGRAM...................................................................................................................................................... 22.1. TYPICAL APPLICATION..............................................................................................................................32.2. SPECIFICATIONS........................................................................................................................................ 43. ELECTRICAL CHARACTERISTICS ..........................................................................................................................43.1. INPUT VOLTAGE.......................................................................................................................................... 43.2. RF CHARECTERISTICS................................................................................................................................ 53.2.1. 802.11B 11M.................................................................................................................................. 53.2.2. 802.11G 54M.................................................................................................................................. 53.2.3. 802.11N MCS7(HT20)....................................................................................................................63.2.4. 802.11N_MCS7(HT40)....................................................................................................................64. PINS DEFINITION.................................................................................................................................................. 74.1. PINS DIFINITION DIAGRAM......................................................................................................................74.2. DEFAULT PINS DIFINITION......................................................................................................................85. DIMENSIONS.......................................................................................................................................................... 10
1HLK-RM08S1. Brief IntroductionHLK-RM08S based on MT7688KN is a low cost and low power consumption IOT module developed byHi-Link.The module has rich interfaces and powerful processor and could be widely used in smart devices andcloud service applications.1.1. Basic parametersHigh data processing ability，MCU frequency 580MHz150M MbpsSupport 802.11b/g/n mode20/40 channel bandwidthSupport 802.11vSupport AP,STA and AP,STA mixedFifth 10/100M adaptive com portOne USB2.0 host interfaceMultiple interfaces SPI/SD-XC/eMMCRich peripheral interfaces，SPI,I2C,I2S,PCM,UART,JTAG,GPIOWidely used in IOTInbuilt powerful PMUSupport 16 Multiple BSSIDSupport multiple encryption WEP64/128, TKIP, AES, WPA, WPA2, WAPISupport QoS，WMM，WMM-PS
2HLK-RM08S2. Block diagramHLK-RM08S Block DiagramEINTEthernetUARTGPIOPWMUSB_HOSTSPISPISI2CI2SJTAGSDXCMT7688KN3.3V40MHzSPI Flash(32MB)IPEX Connector
3HLK-RM08S2.1. Typical applicationHLK-RM08S typical peripheral interfaces diagramHLK-RM08S
4HLK-RM08S2.2. SpecificationItemParameterModelHLK-RM08SMain ChipMT7688KNI-Cache，D-Cache64KB,32KBKernelMIPS24KEcMain frequency580MHzRAM64MbFlash32MbRF1T1R 802.11n 2.4GHzUSB2.01UART2TemperatureEnvironmental temperature：-40℃~85℃Humidityworking：10~95%（noncondensing）Storage：5~95%（noncondensing）Size17.4mm×25.8mm×2.8mm3. Electrical characteristics3.1. Input voltageNameFunctionMin voltage（V）Typicalvoltage（V）Max Voltage（V）VBATSupply voltage3.23.33.4I/OI/O Voltage3.23.33.4
5HLK-RM08S3.2. RF Characteristics3.2.1. 802.11b 11M802.11b Transmit (Conductive)ItemConditionMin.Typ.Max.UnitFrequency RangeChannel 1Channel 13Tx Power LevelDQPSK182022dBmFrequency Tolerance-15015ppmSpectral Mask11MHz→22MHz40dBr＞22MHz53dBrModulation AccuracyAll Data Rate15%802.11b Receiver (Conductive)ItemConditionMin.Typ.Max.UnitFrequency RangeChannel 1Channel 13Min. Input11Mbps PER<8%-91.5-89.5-87.5dBm3.2.2. 802.11g 54M802.11g Transmit (Conductive)ItemConditionMin.Typ.Max.UnitFrequency RangeChannel 1Channel 13Tx Power LevelOFDM151719dBmFrequency Tolerance-15015ppmModulation AccuracyAll Data Rate-31-28%802.11g Receiver (Conductive)ItemConditionMin.Typ.Max.UnitFrequency RangeChannel 1Channel 13Min. Input54Mbps PER<10%-78.0-76.0-74.0dBm
6HLK-RM08S3.2.3. 802.11n MCS7(HT20)802.11n_HT20 Transmit (Conductive)ItemConditionMin.Typ.Max.UnitFrequency RangeChannel 1Channel 13Tx Power LevelOFDM151719dBmFrequency Tolerance-15015ppmModulation AccuracyAll Data Rate-31-28dB802.11n_HT20 Receiver (Conductive)ItemConditionMin.Typ.Max.UnitFrequency RangeChannel 1Channel 13Min. InputMCS7 PER<10%-76.5-74.5-72.5dBm3.2.4. 802.11n_MCS7(HT40)802.11n_HT40 Transmit (Conductive)ItemConditionMin.Typ.Max.UnitFrequency RangeChannel 1Channel 13Tx Power LevelOFDM15.017.019.0dBmFrequency Tolerance-15015ppmModulation AccuracyAll Data Rate-31-28dB802.11n_HT40 Receiver (Conductive)ItemConditionMin.Typ.Max.UnitFrequency RangeChannel 1Channel 13Min. InputMCS7 PER<10%-76.5-74.5-72.5DBM
7HLK-RM08S4. PINS DEFINTION4.1. Pins definition diagramHLK-RM08S Default pins definition diagram
8HLK-RM08S4.2. Default pins definitionPinName（ Function1）Function 2Function 3Function 4GPIONote1I2S_DIPCMDRXGPIO02I2S_WSPCMCLKGPIO23I2S_DOPCMDTXGPIO14I2S_CLKPCMFSGPIO35SPI_CS1REF_CLKOGPIO66SPI_MOSIGPIO87SPI_CLKGPIO78SPI_MISOGPIO99UART_TXD0GPIO12Default is serial portTR10UART_RXD0GPIO13Default is serial portTR11GPIO0REF_CLKOPERST_NGPIO1112MDI_RP_P0GPIO2413MDI_RN_P0GPIO2314MDI_TP_P0GPIO2215MDI_TN_P0GPIO2116MDI_TP_P1SPIS_CSPWM_CH0GPIO1417MDI_TN_P1SPIS_CLKPWM_CH1GPIO1518MDI_RP_P1SPIS_MISOUART_TXD2GPIO1619MDI_RN_P1SPI_MOSIUART_RXD2GPIO1720MDI_RP_P2eMMC_D7PWM_CH0GPIO1821MDI_RN_P2eMMC_D6PWM_CH1GPIO1922MDI_TP_P2UART_TXD2eMMC_D5PWM_CH2GPIO2023MDI_TN_P2UART_RXD2eMMC_D4PWM_CH3GPIO2124MDI_TP_P3SD_WPeMMC_WPGPIO2225MDI_TN_P3SD_CDeMMC_CDGPIO2326MDI_RP_P3SD_D1eMMC_D1GPIO24
9HLK-RM08S27MDI_RN_P3SD_D0eMMC_D0GPIO2528MDI_RP_P4SD_CLKeMMC_CLKGPIO2629MDI_RN_P4SD_CMDeMMC_CMDGPIO2830MDI_TP_P4SD_D3eMMC_D3GPIO2931MDI_TN_P4SD_D2eMMC_D2GPIO2732USB_DPDefault not available33USB_DMDefault not available34EPHY_LED4_NJTAG_RST_NGPIO30Com 4 status led35EPHY_LED2JTAG_TMSGPIO32Com 2 status led36EPHY_LED0JTAG_TDOGPIO34Com 0 status led37GND38GND393.3VSuggested externalpower supply current≥500mA403.3V41WLED_NGPIO35WiFi status LED42EPHY_LED1JTAG_TDIGPIO33Com 1status LED43EPHY_LED3JTAG_CLKGPIO31Com 3status LED44PORST_NWIFI reset45WDT_RST_NGPIO37Watchdog timeout reset46UART_TXD1PWM_CH0GPIO45Default is serial portTR47UART_RXD1PWM_CH1GPIO46Default is serial portTR48REF_CLK0GPIO38Reference clock output49PERST_NGPIO36PCIe device reset50I2C_SDGPIO551I2C_CLKGPIO452GND53ANTDefault not connected54GND
10HLK-RM08SNotes：1，All pins default 12，IO drive current is 4mA3，All TTL is 3.3V5. DimensionsHLK-RM08S DrawingIntroductions：1，The size of the module is length 1mm,width 1mm,space 1.4mm , depth 1.8mm.2，The thickness of the module is 1.8mm.3, The noted numbers in the picture is the actual size of module,do recommended pad extension around1mm, internal heat shrink 0.2mm pad, internal thermal pad grounding once do encapsulation.Do when the package recommended pad extension around the 1mm, 3 internal heat shrink 0.2mm pad,internal thermal pad grounding.
FCC Warning This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. NOTE: Any changes or modifications to this unit not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. FCC Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specific operating instructions for satisfying RF exposure compliance. Note 1: This module certified that complies with RF exposure requirement under mobile or fixed condition, this module is to be installed only in mobile or fixed applications. A mobile device is defined as a transmitting device designed to be used in other than fixed locations and to generally be used in such a way that a separation distance of at least 20 centimeters is normally maintained between the transmitter's radiating structure(s) and the body of the user or nearby persons. Transmitting devices designed to be used by consumers or workers that can be easily re-located, such as wireless devices associated with a personal computer, are considered to be mobile devices if they meet the 20 centimeter separation requirement. A fixed device is defined as a device is physically secured at one location and is not able to be easily moved to another location. Note 2: Any modifications made to the module will void the Grant of Certification, this module is limited to OEM installation only and must not be sold to end-users, end-user has no manual instructions to remove or install the device, only software or operating procedure shall be placed in the end-user operating manual of final products. Note 3: Additional testing and certification may be necessary when multiple modules are used. Note 4: The module may be operated only with the antenna with which it is authorized. Any antenna that is of the same type and of equal or less directional gain as an antenna that is authorized with the intentional radiator may be marketed with, and used with, that intentional radiator. Note 5: To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring compliance with the module(s) installed and fully operational. For example, if a host was previously authorized as an unintentional radiator under the Declaration of Conformity procedure without a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring that the after the module is installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements. Since this may depend on the details of how the module is integrated with the host, ShenZhen HaiLingKe Electronic co., Ltd. shall provide guidance to the host manufacturer for compliance with the Part 15B requirements.
Note 6: FCC ID label on the final system must be labeled with “Contains FCC ID: 2AD56HLK-RM08S” or “Contains transmitter module FCC ID: 2AD56HLK-RM08S”.

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