Hi Link Electronic HLK-M50 WIFI Module User Manual 15 HLK M50 UserMan r2

ShenZhen HaiLingKe Electronic co.,Ltd. WIFI Module 15 HLK M50 UserMan r2

15_HLK-M50 UserMan r2

niki@hlktech.com Specification HLK-M50 Shenzhen HaiLingKe Electronic co., Ltd HLK-M50 SPEC. Version：V1.0 Date changed：2017-12-27 All right reserved@ Shenzhen Hi-Lin Electronic company .
niki@hlktech.com Specification HLK-M50 Catalogue 1. PRODUCT INTRODUCTION .............................................................................................................................. 1 1.1. HLK-M50 MODULE TYPE.............................................................................................................................. 1 1.2. WLAN FEATURES............................................................................................................................................ 2 1.3. MCU FEATURES .............................................................................................................................................. 2 2. FUNCTIONAL DIAGRAM ......................................................................................................................................... 3 3.SPECIFICATIONS ........................................................................................................................................................ 3 3.1 SYSTEM MEMORY .................................................................................................................................................. 3 3.2 INTERFACE ............................................................................................................................................................... 4 3.3 INTERFACE EXTENSION APPLICATION EXAMPLE...................................................................................... 5 3.4 POWER ....................................................................................................................................................................... 5 4. MODULE PIN DEFINITION ..................................................................................................................................... 6 4.1 PIN DIAGRAM DEFINITION ................................................................................................................................. 6 4.2 DEFAULT PIN DEFINITION ................................................................................................................................... 7 4.3 GPIO ALTERNATE FUNCTION AND FUNCTION PIN POSITION ................................................................. 8 5. MODULE SIZE CHART ............................................................................................................................................. 8 6. TYPICAL APPLICATION CIRCUIT ........................................................................................................................ 9 7. RECOMMENDED REFLOW TEMPERATURE ..................................................................................................... 9 FCC WARNING ............................................................................................................................................................. 11
niki@hlktech.com Specification HLK-M50 Page 1 of 12 1. Product introduction The HLK-M50 WiFi module is a low-power chip that integrates MCU, PMU, clock, and IEEE802.11b / g / n MAC / PHY / radio. Module supports 2.4GHz IEEE802.11b / g / n, USB Host and Device 2.0 HS, Micro SD card (SDMMC interface), UART, I2C, I2S, PMW, SPI and other interfaces, analog keys (GPADC0). Software using mbedOS5.1 operating system, has two versions : WiFi serial transmission function version and secondary development. Second development version provides rich development interface, users can develop their own applications based on mbedOS through C or C ++. Development kit to provide a large number of guidance documents and test routines to facilitate rapid development of users. 1.1. HLK-M50 Module Type Pin section and SMD section front
niki@hlktech.com Specification HLK-M50 Page 2 of 12 1.2. WLAN Features  Single-chip integrated MAC/PHY/Radio  Supports 2.4GHz IEEE 802.11b/g/n  Integrated PA, LNA  20/40MHz bandwidth, maximum 150Mbps  Support WPA, WPA2, WEP, TKIP,CCMP  Support STA, softAP, P2P, STA+softAp,STA+P2P  Support A-MPDU, A-MSDU, HT-BA  Lightweight TCP / IP protocol stack 1.3. MCU Features  Integrated ARM-CM4 MCU, the maximum clock frequency of 160MHz  Integrated MPU and mbed uvisor  Support external psram interface  Built-in 8Mbit SPI flash  Function pin position programmable  Available external rising / falling edge interrupt or wake-up GPIO  Integrated UART×2/I2S×2/I2C×1/PWM×8/SPI×4/SDMMC×1/USB2.0×1  Integrated 2 channel ADC  Integrated watchdog and low-power timer  Operating system using mbedOS5.1
niki@hlktech.com Specification HLK-M50 Page 3 of 12 2. Functional diagram HLK-M50 Module functional diagram 3.Specifications 3.1 System memory Project Parameters Memory System Built-in RAM 96K Bytes User SRAM 32K Bytes icache Built-in Flash Built-in 8Mbit flash
niki@hlktech.com Specification HLK-M50 Page 4 of 12 3.2 Interface 项目 参数 GPIO supports up to 17 GPIO ports, of which 16 can trigger interrupts Serial performance supports up to 2 serial ports, baud rate can be configured to 1200bps - 4Mbps I2S Interface Features Supports 2 I2S Interfaces; I2S Host BCLK Supports 96/192/384/512 / 44.1 / 88.2KHz; Supports 16/32 bit per channel, Data Format Configurable as 16/20 / 24bit or Software Configurable Maximum 24bit per channel) I2C Interface Performance Supports one I2C standard interface. Support master or slave operation. There are 3 standard speed modes: 1. Standard mode (<100Kb/s) 2. Fast mode (<400Kb/s) 3. High-speed mode (<3.4Mb/s) PWM Interface Performance Supports up to eight PWM interfaces; PWM cycle and duty cycle programmable, duty cycle can be configured between 0-100; cycle programmable, the software can choose a different clock to produce longcyclesSPI Interface As the SPI host, up to 4 SPI slave; SPI clock programmable and maximum 20Mhz; data length can be configured by software, the maximum 64bit; SDMMC Interface Support 1 SDMMC interface USB Interface Support 1 USB interface
niki@hlktech.com Specification HLK-M50 Page 5 of 12 3.3 Interface Extension Application Example Note： 1，The figure can be extended function, the common firmware do not support some features, please consult our FAE if you need. 2，The module factory default is USB HOST。 3.4 Power Symbol Function Min.Voltage（V） Typical Voltage（V） Maximum Voltage（V） Current（mA） VBAT Supply voltage range 3.3 3.3 3.5 ≥500mA I/O I/O Input Voltage range 2.7 3.3 3.6 ≤10mA Symbol Function Min. Voltage (V) Typical Voltage (V) Maximum Voltage (V) Current (mA)
niki@hlktech.com Specification HLK-M50 Page 6 of 12 VBAT supply voltage range 3.3 3.3 3.5 ≥500mA I / O I / O Input Voltage Range 2.7 3.3 3.6 ≤10mA 4. Module pin definition 4.1 Pin Diagram Definition HLK-RM08S default Pin diagram definition Note： 1，The figure is the default definition, the multiplexing function is not listed. 2，Please do not arbitrarily pull of each free function pin, so as cause the module does not start properly.
niki@hlktech.com Specification HLK-M50 Page 7 of 12 4.2 Default Pin definition Number Name Type Description 1 RST I RESET signal of the chip 2 ADC I/O General purpose ADC 3 GPIO1 I/O General purpose input/output 4 GPIO2 I/O General purpose input/output 5 GPIO3 I/O General purpose input/output 6 GPIO13 I/O General purpose input/output 7 GPIO12 I/O General purpose input/output 8 3.3V PWR I/O power supply 9 GPIO23 I/O General purpose input/output 10 GPIO22 I/O General purpose input/output 11 GPIO21 I/O General purpose input/output(no interrupt) 12 GPIO0 I/O General purpose input/output 13 GPIO4 I/O General purpose input/output 14 GPIO5 I/O General purpose input/output 15 GND GND buck ground 16 GPIO8 I/O General purpose input/output 17 GPIO7 I/O General purpose input/output 18 GPIO9 I/O General purpose input/output 19 USB-DN I/O USB negative signal 20 USB-DP I/O USB positive signal 21 RX I/O UART_RX 22 TX I/O UART_TX Pin type definition：  I/O → Digital input/output；  I → Digital input  O → Digital output  A,I → Analog input  A,O → Analog output  A,I/O → Analog input/output  PWR → Power  GND → Ground
niki@hlktech.com Specification HLK-M50 Page 8 of 12 4.3 GPIO alternate function and function pin position 5. Module size chart Unit：millimetre（mm） HLK-M50 Dimension
niki@hlktech.com Specification HLK-M50 Page 9 of 12 6. Typical application circuit Note： This is a schematic diagram of the M50 development test suite. Schematic and PCB source files, please ask sales. Module over the furnace, please follow this temperature curve in strict implementation. Reflow temperature deviation is too large will cause damage to the module! 7. Recommended reflow temperature Module over the furnace, please follow this temperature curve in strict implementation.Reflow temperature deviation too large will cause damage to the module!
niki@hlktech.com Specification HLK-M50 Page 10 of 12 Temperature setting (centigrade) Temper. area 1 2 3 4 5 6 7 8 Up 125 135 155 185 195 225 240 230 Down 125 135 155 185 195 225 240 230 Conveyor speed: 70.0 cm/min.
niki@hlktech.com Specification HLK-M50 Page 11 of 12 FCC Warning This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. NOTE 1: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: - Reorient or relocate the receiving antenna. - Increase the separation between the equipment and receiver. -Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. -Consult the dealer or an experienced radio/TV technician for help. NOTE 2: Any changes or modifications to this unit not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. Please notice that if the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label
niki@hlktech.com Specification HLK-M50 Page 12 of 12 can use wording such as the following: “Contains FCC ID: 2AD56HLK-M50” any similar wording that expresses the same meaning may be used. This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. The module is limited to OEM installation ONLY. The OEM integrator is responsible for ensuring that the end-user has no manual instruction to remove or install module. There is requirement that the grantee provide guidance to the host manufacturer for compliance with Part 15B requirements. This module certified that complies with RF exposure requirement under mobile or fixedcondition, this module is to be installed only in mobile or fixed applications.A mobile device is defined as a transmitting device designed to be used in other than fixedlocations and to generally be used in such a way that a separation distance of at least 20 centimetersis normally maintained between the transmitter's radiating structure(s) and the body of the user ornearby persons. Transmitting devices designed to be used by consumers or workers that can be easilyre-located, such as wireless devices associated with a personal computer, are considered to bemobile devices if they meet the 20 centimeter separation requirement.

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