Flir BelgiumBA AX905 WiFi and Bluetooth module User Manual

Raymarine UK Ltd. WiFi and Bluetooth module

Contents

User manual

AMPAK  CONFIDENTIAL 保存期限:最新版本                                                   C-RD-047A              正基科技股份有限公司    SPECIFICATION    SPEC. NO.:  REV:    1.4    DATE:  01.08. 2016    PRODUCT  NAME: AP6212   Customer APPROVED Company    Representative Signature    REVIEW PREPARED  PM QA APPROVED DCC ISSUE       SPEC-W-014BethAnnaCarolRichard2016.01.20AMPAKD.C.C PUBLISH
AMPAK  CONFIDENTIAL 保存期限:最新版本                                               C-RD-047A     AMPAK   AP6212  WiFi+Bluetooth 4.0+FM RX   SIP Module Spec Sheet
AMPAK  CONFIDENTIAL 保存期限:最新版本                                                  C-RD-047A                                                           1Revision History                           Date  Revision Content  Revised By  Version2014/04/08   - Preliminary  Brian  1.0 2014/09/02   - Pin Definition Modified  Brian  1.1 2014/11/26  - Bluetooth Spec Modified  Brian  1.2 2014/12/26 - Add Process  Brian  1.3 2016/01/08    - Add Reflow Suggestion and MLS  Beth  1.4
AMPAK  CONFIDENTIAL 保存期限:最新版本                                                 C-RD-047A  2Contents Contents ................................................................................................................... 2 1. Introduction......................................................................................................... 3 2. Features............................................................................................................... 4 3. Deliverables ........................................................................................................ 5 3.1 Deliverables.................................................................................................... 5 3.2 Regulatory certifications ................................................................................. 5 4. General Specification......................................................................................... 6 4.1 General Specification...................................................................................... 6 4.2 Voltages.......................................................................................................... 6 4.2.1 Absolute Maximum Ratings.................................................................... 6 4.2.2 Recommended Operating Rating ........................................................... 6 5. WiFi RF Specification......................................................................................... 7 5.1 2.4GHz RF Specification................................................................................. 7 6. Bluetooth Specification...................................................................................... 9 6.1 Bluetooth Specification ................................................................................... 9 7. FM Specification............................................................................................... 10 7.1 FM Specification (TBD)................................................................................. 10 8. Pin Assignments............................................................................................... 11 8.1 Pin Outline .................................................................................................... 11 8.2 Pin Definition ................................................................................................ 11 9. Dimensions ....................................................................................................... 13 9.1 Physical Dimensions..................................................................................... 13 9.2 Layout Recommendation.............................................................................. 14 10. External clock reference .................................................................................. 15 10.1 SDIO Pin Description.................................................................................. 15 11. Host Interface Timing Diagramo...................................................................... 16 11.1 Power-up Sequence Timing Diagram ......................................................... 16 11.2 SDIO Default Mode Timing Diagram........................................................... 18 11.3 SDIO High Speed Mode Timing Diagram.................................................... 19 12. Recommended Reflow Profile......................................................................... 20 Solder Paste definition.......................................................................................... 2113. Package Information........................................................................................ 23 13.1Label  .......................................................................................................... 23 Label C Inner box label . .................................................................................... 23Label D Carton box label . ................................................................................. 2313.2 Dimension ................................................................................................. 24 13.3 MSL Level / Storage Condition ................................................................... 26
AMPAK  CONFIDENTIAL 保存期限:最新版本                                                 C-RD-047A  31. Introduction AMPAK Technology would like to announce a low-cost and low-power consumption module which has all of the WiFi, Bluetooth and FM functionalities. The highly integrated module makes the possibilities of web browsing, VoIP, Bluetooth headsets, FM radio functional applications and other applications. With seamless roaming capabilities and advanced security, also could interact with different vendors’ 802.11b/g/n Access Points in the wireless LAN.  The wireless module complies with IEEE 802.11 b/g/n standard and it can achieve up to a speed of 72.2Mbps with single stream in 802.11n draft, 54Mbps as specified in IEEE 802.11g, or 11Mbps for IEEE 802.11b to connect to the wireless LAN. The integrated module provides SDIO interface for WiFi, UART / I2S / PCM interface for Bluetooth and UART / I2S / PCM interface for FM.  This compact module is a total solution for a combination of WiFi + BT + FM technologies. The module is specifically developed for Smart phones and Portable devices.
AMPAK  CONFIDENTIAL 保存期限:最新版本                                                 C-RD-047A  42. Features   802.11b/g/n single-band radio    Bluetooth V4.0(HS) with integrated Class 1.5 PA and Low Energy (BLE) support   Concurrent Bluetooth, FM (RX) RDS/RBDS, and WLAN operation   Simultaneous BT/WLAN receive with single antenna   WLAN host interface options: -  SDIO v2.0 — up to 50 MHz clock rate   BT host digital interface: -  UART (up to 4 Mbps)   FM multiple audio routing options: I2S, PCM, eSCO, A2DP   IEEE Co-existence technologies are integrated die solution   ECI — enhanced coexistence support, ability to coordinate BT SCO transmissions around WLAN receives   A simplified block diagram of the module is depicted in the figure below.
AMPAK  CONFIDENTIAL 保存期限:最新版本                                                 C-RD-047A  53. Deliverables  3.1 Deliverables The following products and software will be part of the product.   Module with packaging  Evaluation Kits   Software utility for integration, performance test.  Product Datasheet.   Agency certified pre-tested report with the adapter board. 3.2 Regulatory certifications The product delivery is a pre-tested module, without the module level certification.   For module approval, the platform’s antennas are required for the certification.
AMPAK  CONFIDENTIAL 保存期限:最新版本                                                 C-RD-047A  64. General Specification 4.1 General Specification                4.2 Voltages 4.2.1 Absolute Maximum Ratings Symbol Description Min. Max. UnitVBAT  Input supply Voltage  -0.5  5.5  V WL_VIO_SD Digital/Bluetooth/SDIO/ I/O Voltage  -0.5  3.6  V   4.2.2 Recommended Operating Rating   The module requires two power supplies: VBAT and VDDIO.  Min. Typ. Max. Unit   Operating Temperature  -30  25  85  deg.CVBAT  3.0 3.6 4.8 V VDDIO  1.7 3.3 3.6 V     Model Name  AP6212 Product Description    Support WiFi/Bluetooth/FM functionalities Dimension  L x W x H: 12 x 12 x 1.5 (typical) mm  WiFi Interface  SDIOV2.0 BT Interface  UART / PCM FM Interface  UART / PCM / Audio Operating temperature  -30°C to 85°C Storage temperature  -40°C to 85°C Humidity  Operating Humidity 10% to 95% Non-Condensing
AMPAK  CONFIDENTIAL 保存期限:最新版本                                                 C-RD-047A  75. WiFi RF Specification 5.1 2.4GHz RF Specification  Conditions : VBAT=3.6V ; VDDIO=3.3V ; Temp:25°C Feature Description WLAN Standard  IEEE 802.11b/g/n, WiFi compliant Frequency Range    2.400 GHz ~ 2.497 GHz (2.4 GHz ISM Band) Number of Channels  2.4GHz:Ch1 ~ Ch14 Modulation  802.11b : DQPSK, DBPSK, CCK 802.11 g/n : OFDM /64-QAM,16-QAM, QPSK, BPSK   802.11b /11Mbps : 16 dBm ± 1.5 dB @ EVM  -9dB 802.11g /54Mbps : 15 dBm ± 1.5 dB @ EVM  -25dB Output Power 802.11n /65Mbps : 14 dBm ± 1.5 dB @ EVM  -28dB -    MCS=0    PER @ -85 dBm, typical -  MCS=1     PER @ -84 dBm, typical -    MCS=2    PER @ -82 dBm, typical -    MCS=3    PER @ -80 dBm, typical -    MCS=4    PER @ -77 dBm, typical -    MCS=5    PER @ -73 dBm, typical -    MCS=6    PER @ -71 dBm, typical Receive Sensitivity (11n,20MHz)  @10% PER -  MCS=7     PER @ -68 dBm, typical -   6Mbps   PER @ -86 dBm, typical -   9Mbps    PER @ -85 dBm, typical -    12Mbps    PER @ -85 dBm, typical -    18Mbps    PER @ -83 dBm, typical -    24Mbps    PER @ -81 dBm, typical -    36Mbps    PER @ -78 dBm, typical -    48Mbps    PER @ -73 dBm, typical Receive Sensitivity (11g) @10% PER -  54Mbps   PER @ -71 dBm, typical -  1Mbps    PER @ -90 dBm, typical -    2Mbps    PER @ -88 dBm, typical -    5.5Mbps   PER @ -87 dBm, typical Receive Sensitivity (11b) @8% PER -    11Mbps    PER @ -84 dBm, typical 802.11b : 1, 2, 5.5, 11Mbps Data Rate  802.11g : 6, 9, 12, 18, 24, 36, 48, 54Mbps
AMPAK  CONFIDENTIAL 保存期限:最新版本                                                 C-RD-047A  8Data Rate (20MHz ,Long GI,800ns) 802.11n: 6.5, 13, 19.5, 26, 39, 52, 58.5, 65Mbps Data Rate (20MHz ,short GI,400ns) 802.11n : 7.2, 14.4, 21.7, 28.9, 43.3, 57.8, 65,72.2Mbps 802.11b : -10 dBm Maximum Input Level  802.11g/n : -20 dBm Antenna Reference  Small antennas with 0~2 dBi peak gain
AMPAK  CONFIDENTIAL 保存期限:最新版本                                                 C-RD-047A  96. Bluetooth Specification 6.1 Bluetooth Specification Conditions : VBAT=3.6V ; VDDIO=3.3V ; Temp:25°C Feature Description General Specification Bluetooth Standard  Bluetooth V4.0 of 1, 2 and 3 Mbps. Host Interface  UART Antenna Reference  Small antennas with 0~2 dBi peak gain   Frequency Band  2402MHz ~ 2480MHz Number of Channels  79 channels Modulation  FHSS, GFSK, DPSK, DQPSK RF Specification  Min. Typical. Max. Output Power (Class 1.5)    9 dBm   Sensitivity @ BER=0.1% for GFSK (1Mbps)   -86 dBm  Sensitivity @ BER=0.01% for π/4-DQPSK (2Mbps)   -86 dBm  Sensitivity @ BER=0.01% for 8DPSK (3Mbps)   -80 dBm  GFSK (1Mbps):-20dBm π/4-DQPSK (2Mbps) :-20dBm Maximum Input Level 8DPSK (3Mbps) :-20dBm
AMPAK  CONFIDENTIAL 保存期限:最新版本                                                 C-RD-047A  107. FM Specification 7.1 FM Specification (TBD) Conditions : VBAT=3.6V ; VDDIO=3.3V ; Temp:25°C Feature Description General Specification Frequency Band  76MHz-108MHz Host Interface  HCI UART, I2S/PCM Channel step  50 KHz Analog Audio output load  RL>30KΩ, CL>20pF Characteristics Condition  MIN TYP MAX UNITOutput Power Level        dBuVAudio harmonic distortion (fmod=1KHz,  △f=75KHz, Pilot  △f=6.75KHz)     % MONO    Transmitter  (FM Tx load = 120nH, Q>30)  Audio SNR (△f=22.5KHz, I2S audio in SNR ≧57dB ) Stereo    dB RDS Sensitivity        dBmfmod=1KHz     Audio harmonic distortion (Vin=1mV,  △f=75KHz) fmod=3KHz     % MONO    Maximum SNR △(fmod=1KHz, f=22.5KHz, BW=300Hz to 15KHz) Stereo      dB Receiver (FM Tx Antenna = 120nH, Q>30) RF input power level       dBuV
AMPAK  CONFIDENTIAL 保存期限:最新版本                                                 C-RD-047A  118. Pin Assignments 8.1 Pin Outline < TOP VIEW >   8.2 Pin Definition  NO Name Type Description 1  GND  - Ground connections 2  WL_BT_ANT  I/O RF I/O port 3  GND  - Ground connections 4  FM_RX  I  FM radio RF input antenna port 5  NC  - Floating (Don’t connected to ground) 6  BT_WAKE  I  HOST wake-up Bluetooth device 7  BT_HOST_WAKE  O  Bluetooth device to wake-up HOST 8  NC  - Floating (Don’t connected to ground) 9  VBAT  P  Main power voltage source input 10  XTAL_IN I  Crystal input  11  XTAL_OUT O  Crystal output  12  WL_REG_ON I Internal regulators power enable/disable 13  WL_HOST_WAKE  O  WLAN to wake-up HOST
AMPAK  CONFIDENTIAL 保存期限:最新版本                                                 C-RD-047A  1214  SDIO_DATA_2  I/O SDIO data line 2 15  SDIO_DATA_3  I/O SDIO data line 3 16  SDIO_DATA_CMD  I/O SDIO command line 17  SDIO_DATA_CLK  I/O SDIO clock line   18  SDIO_DATA_0  I/O SDIO data line 0 19  SDIO_DATA_1  I/O SDIO data line 1 20  GND  - Ground connections 21  VIN_LDO_OUT  P  Internal Buck voltage generation pin 22  VDDIO  P  I/O Voltage supply input 23  VIN_LDO  P  Internal Buck voltage generation pin 24  LPO  I  External Low Power Clock input (32.768KHz) 25  PCM_OUT  O  PCM Data output 26  PCM_CLK I/O PCM clock 27  PCM_IN  I  PCM data input 28  PCM_SYNC  I/O PCM sync signal 29  NC  - Floating (Don’t connected to ground) 30  NC  - Floating (Don’t connected to ground)   31  GND  - Ground connections 32  NC  - Floating (Don’t connected to ground) 33  GND  - Ground connections 34  BT_RST_N  I  Low asserting reset for Bluetooth core 35  NC  - Floating (Don’t connected to ground) 36  GND  - Ground connections 37  GPIO4  I/O WiFi Co-existence pin with LTE 38  GPIO3  I/O WiFi Co-existence pin with LTE 39  GPIO2  I/O WiFi Co-existence pin with LTE 40  GPIO1  I/O WiFi Co-existence pin with LTE 41  UART_RTS_N  O  Bluetooth/FM UART interface 42  UART_TXD  O  Bluetooth/FM UART interface 43  UART_RXD  I  Bluetooth/FM UART interface 44  UART_CTS_N  I  Bluetooth/FM UART interface 45  TP1 O  FM Analog AUDIO left output  46  TP2  O  FM Analog AUDIO right output 47  TP3 (NC)  - Floating (Don’t connected to ground)
AMPAK  CONFIDENTIAL 保存期限:最新版本                                                 C-RD-047A  139. Dimensions 9.1 Physical Dimensions (Unit: mm)            < TOP VIEW >                < Side View >  < TOP VIEW >
AMPAK  CONFIDENTIAL 保存期限:最新版本                                                 C-RD-047A  149.2 Layout Recommendation (Unit: mm)  < TOP VIEW >
AMPAK  CONFIDENTIAL 保存期限:最新版本                                                 C-RD-047A  1510.   External clock reference External LPO signal characteristics Parameter Specification Units Nominal input frequency  32.768  kHz Frequency accuracy  30 ppm Duty cycle  30 - 70  % Input signal amplitude  400 to 1800 mV, p-p Signal type  Square-wave  - Input impedance     >100k <5   pF Clock jitter (integrated over 300Hz – 15KHz)  <1  Hz Output high voltage  0.7Vio - Vio  V  External Ref_CLK signal characteristics    10.1 SDIO Pin Description The module supports SDIO version 2.0 for 4-bit modes (100 Mbps), and high speed 4-bit (50 MHz clocks – 200 Mbps). It has the ability to stop the SDIO clock and map the interrupt signal into a GPIO pin. This ‘out-of-band’ interrupt signal notifies the host when the WLAN device wants to turn on the SDIO interface. The ability to force the control of the gated clocks from within the WLAN chip is also provided.
AMPAK  CONFIDENTIAL 保存期限:最新版本                                                 C-RD-047A  16  Function 0 Standard SDIO function (Max BlockSize / ByteCount = 32B)   Function 1 Backplane Function to access the internal System On Chip (SOC) address space (Max BlockSize / ByteCount = 64B)   Function 2 WLAN Function for efficient WLAN packet transfer through DMA (Max BlockSize/ByteCount=512B)  SDIO Pin Description SD 4-Bit Mode DATA0  Data Line 0 DATA1  Data Line 1 or Interrupt DATA2  Data Line 2 or Read Wait DATA3  Data Line 3 CLK Clock CMD Command Line   11.   Host Interface Timing Diagram 11.1 Power-up Sequence Timing Diagram The module has signals that allow the host to control power consumption by enabling or disabling the Bluetooth, WLAN and internal regulator blocks. These signals are described below. Additionally, diagrams are provided to indicate proper sequencing of the signals for carious operating states. The timing value indicated are minimum required values: longer delays are also acceptable. ※  WL_REG_ON: Used by the PMU to power up the WLAN section. When this pin is high, the regulators are enabled and the WLAN section is out of reset. When this pin is low the WLAN section is in reset.   ※  BT_RST_N: Low asserting reset for Bluetooth and FM only. This pin has no effect on WLAN and does not control any PMU functions. This pin must be driven high or low (not left floating).
AMPAK  CONFIDENTIAL 保存期限:最新版本                                                 C-RD-047A  17   WLAN=ON, Bluetooth=ON  WLAN=OFF, Bluetooth=OFF  WLAN=ON, Bluetooth=OFF
AMPAK  CONFIDENTIAL 保存期限:最新版本                                                 C-RD-047A  18 WLAN=OFF, Bluetooth=ON   11.2 SDIO Default Mode Timing Diagram
AMPAK  CONFIDENTIAL 保存期限:最新版本                                                 C-RD-047A  19  11.3 SDIO High Speed Mode Timing Diagram
AMPAK  CONFIDENTIAL 保存期限:最新版本                                                 C-RD-047A  2012. Recommended Reflow Profile Referred to IPC/JEDEC standard. Peak Temperature : <250°C Number of Times : 2 times                                   2.5 /sec℃ 2.5°C/sec40~70 sec250℃ThenotificationofWiFimodulebeforemounting:Theapertureofstencilshouldbelargerthanfootprintofmodule,andthestencilthicknessshouldbenotlessthan0.12mm.  Reflow  時需使用 N2,  含氧量建議 5000 ppm 以下,  ItmustuseN2forreflowandsuggesttheconcentrationofoxygenlessthan5000ppm.
AMPAK  CONFIDENTIAL 保存期限:最新版本                                                 C-RD-047A  21Solder Paste definition                       Module Specifications : W:0.65mm * L:0.95mm pitch 0.9 mm   The proposed design W:0.65~0.75 mm * L:1.33mm. Consider not place other parts in the peripheral area of 1 mm ~ 1.5 mm to facilitate additional amount of solder for PCB pad.    We Suggest the thickness of Stencil between 0.12 mm ~0.15mm, the W between 0.6~0.65mm and the L between L1.5~1.6mm.   If the thickness of the stencil is thinner, we suggest to adding more solder, to increase the wetting ability. Depends on different production situation, if the stencil thickness is 0.08~0.1mm, and the module nearby area is no more space for expending soldering area, we will suggest to increase the stencil thickness to increase the wetting ability.   The major consideration parts of stencil design is to increase the solder paste wetting ability.       模組規格  W0.65mm *L0.95mm Pitch 0.9mm  PCB Pad建議設計 W0.65~0.75mm *L1.33mm,且周邊1mm~1.5mm區域考慮不放置零件以利外加錫量。  鋼網建議厚度為0.12mm~0.15mm,W0.6~0.65mm* L1.5~1.6mm  因為模組需要側面爬錫,當鋼網厚度越薄外加錫量需越多,需依實際生產狀態評估,當使用鋼網0.08mm或 0.1mm且外加可能性低時則必須考慮局部加厚鋼網的設計。  鋼網設計主要以增加爬錫的焊錫膏量考量。
AMPAK  CONFIDENTIAL 保存期限:最新版本                                                 C-RD-047A  22           模組規格 L 0.7mm PCB Pad 設計 L 0.8mm 鋼網開孔建議 L0.5mm~0.6mm 適當內縮可以避免撐高造成高度影響    Module Specifications L 0.7mm   The design for PCB Pad : L:0.8mm   We recommend the apertures for stencil L:0.5mm~0.6mm   In order to avoid highness impact caused solder paste thickness, the stencil open size can be appropriately retracted
AMPAK  CONFIDENTIAL 保存期限:最新版本                                                 C-RD-047A  2313. Package Information 13.1Label  Label A Anti-static and humidity notice  Label B MSL caution / Storage Condition  Label C Inner box label .  Label D Carton box label .
AMPAK  CONFIDENTIAL 保存期限:最新版本                                                 C-RD-047A  2413.2 Dimension
AMPAK  CONFIDENTIAL 保存期限:最新版本                                                 C-RD-047A  25                               AB C Humidity indicator Desiccant C D
AMPAK  CONFIDENTIAL 保存期限:最新版本                                                 C-RD-047A  2613.3 MSL Level / Storage Condition      ※NOTE : Accumulated baking time should not exceed 96hrs

Navigation menu