Flaircomm Microelectronics BTM501 Bluetooth Module User Manual FLC BTMxxx DS V1 0

Flaircomm Microelectronics,Inc. Bluetooth Module FLC BTMxxx DS V1 0

User Manual

FLC-BTM501 Datasheet Flaircomm Microelectronics Confidential -1- FLC-BTM501/FLC-BTMDC751 Datasheet Document Type: Bluetooth Module Datasheet Document Number: FLC-BTM501-DS Document Version: V1.6 Release Date: 2013/12/18 Copyright 2012~ 2014 by Flaircomm Microelectronics Inc., All Right Reserved Without written permission from Flaircomm Microelectronics Inc., reproduction, transfer, distribution or storage of part or all of the contents in this document in any form is prohibited
FLC-BTM501 Datasheet Flaircomm Microelectronics Confidential -2- Release Record Version Release Date Comments 1.0 2012/06/26 Release 1.1 2012/09/06 Modify operating temperature. 1.2 2012/11/01 Modify power consumptions. 1.3 2012/11/16 Modify Features. 1.4 2013/07/26 Modify table of Mechanical Characteristic. 1.5 2013/08/15 Small modifications. 1.6 2013/12/18 Modify Mechanical Characteristic.
FLC-BTM501 Datasheet Flaircomm Microelectronics Confidential -3- CONTENTS 1. INTRODUCTION ............................................................................................................................................... 6 1.1 NAMING DECLARATION ..................................................................................................................................... 6 1.2 BLOCK DIAGRAM ............................................................................................................................................... 7 1.3 FEATURES .......................................................................................................................................................... 7 1.4 APPLICATIONS ................................................................................................................................................... 7 2. GENERAL SPECIFICATION .......................................................................................................................... 9 3. PIN DEFINITION ............................................................................................................................................. 10 3.1 PIN CONFIGURATION ........................................................................................................................................ 10 3.2 PIN DEFINITION ................................................................................................................................................ 10 4. PHYSICAL INTERFACES ............................................................................................................................. 13 4.1 POWER SUPPLY ................................................................................................................................................ 13 4.2 RESET .............................................................................................................................................................. 13 4.3 AUDIO INTERFACES.......................................................................................................................................... 14 4.3.1 ADC ........................................................................................................................................................ 14 4.3.2 ADC Sample Rate Selection and Warping .............................................................................................. 14 4.3.3 ADC Gain ................................................................................................................................................ 14 4.3.4 DAC ........................................................................................................................................................ 15 4.3.5 DAC Sample Rate Selection and Warping .............................................................................................. 15 4.3.6 DAC Gain ................................................................................................................................................ 15 4.3.7 Mono Operation ...................................................................................................................................... 15 4.3.8 Audio Input Stage .................................................................................................................................... 15 4.3.9 Microphone Input .................................................................................................................................... 15 4.3.10 Audio Output Stage ................................................................................................................................. 15 4.4 RF INTERFACE ................................................................................................................................................. 16 4.5 GENERAL PURPOSE ANALOG IO ...................................................................................................................... 16 4.6 GENERAL PURPOSE DIGITAL IO ....................................................................................................................... 16 4.6.1 Audio Signal Control .............................................................................................................................. 16 4.7 SERIAL INTERFACES ......................................................................................................................................... 17 4.7.1 UART ...................................................................................................................................................... 17 4.7.2 USB ......................................................................................................................................................... 17 4.7.3 I2C ........................................................................................................................................................... 19 4.7.4 SPI ........................................................................................................................................................... 20 5. ELECTRICAL CHARACTERISTIC ............................................................................................................. 21 5.1 ABSOLUTE MAXIMUM RATING ........................................................................................................................ 21 5.2 RECOMMENDED OPERATING CONDITIONS ....................................................................................................... 21 5.3 INPUT/OUTPUT TERMINAL CHARACTERISTICS ................................................................................................. 21 5.3.1 Digital Terminals ..................................................................................................................................... 21 5.3.2 USB ......................................................................................................................................................... 22 5.3.3 Internal CODEC - Analogue to Digital Converter .................................................................................. 22 5.3.4 Internal CODEC - Digital to Analogue Converter .................................................................................. 23 5.3.5 Microphone Input .................................................................................................................................... 23 5.3.6 Speaker Output ........................................................................................................................................ 23 5.4 POWER CONSUMPTIONS .................................................................................................................................... 24 6. REFERENCE DESIGN .................................................................................................................................... 25 7. MECHANICAL CHARACTERISTIC ........................................................................................................... 26 8. RECOMMENDED PCB LAYOUT AND MOUNTING PATTERN............................................................ 27 8.1 ANTENNA CONNECTION AND GROUNDING PLANE DESIGN .............................................................................. 27
FLC-BTM501 Datasheet Flaircomm Microelectronics Confidential -4- 9. RECOMMENDED REFLOW PROFILE ...................................................................................................... 29 10. ORDERING INFORMATION .................................................................................................................... 30 10.1 PRODUCT PACKAGING INFORMATION .............................................................................................................. 30 10.2 ORDERING INFORMATION ................................................................................................................................. 32 10.2.1 Product Revision ..................................................................................................................................... 32 10.2.2 Shipping Package .................................................................................................................................... 32 10.2.3 Product Package ...................................................................................................................................... 32 10.2.4 Product Grade .......................................................................................................................................... 32
FLC-BTM501 Datasheet Flaircomm Microelectronics Confidential -5- TABLES AND FIGURES Table 1: Naming Declaration ........................................................................................................................................ 6 Table 2: General Specification ...................................................................................................................................... 9 Table 3: Pin Definition ................................................................................................................................................ 12 Table 4: Pin Status on Reset ........................................................................................................................................ 13 Table 5: Possible UART Settings ................................................................................................................................ 17 Table 6: USB Interface Component Values ................................................................................................................ 18 Table 7: Absolute Maximum Rating ........................................................................................................................... 21 Table 8: Recommended Operating Conditions ........................................................................................................... 21 Table 9: Digital Terminal ............................................................................................................................................ 22 Table 10: USB Terminal ............................................................................................................................................. 22 Table 11: Analogue to Digital Converter .................................................................................................................... 22 Table 12: Digital to Analogue Converter .................................................................................................................... 23 Table 13: Microphone Input ........................................................................................................................................ 23 Table 14: Microphone Output ..................................................................................................................................... 23 Table 15: Power consumptions ................................................................................................................................... 24 Table 16: Product Revision ......................................................................................................................................... 32 Table 17: Shipping Package ........................................................................................................................................ 32 Table 18: Product Package .......................................................................................................................................... 32 Table 19: Product Grade ............................................................................................................................................. 32 Figure 1: Block Diagram ............................................................................................................................................... 7 Figure 2: Pin Configuration......................................................................................................................................... 10 Figure 3: Audio Input and Output ............................................................................................................................... 14 Figure 4: An Example of the Audio Signal Control by PIOs ...................................................................................... 16 Figure 5: UART Connection ....................................................................................................................................... 17 Figure 6: USB Connections for Self-Powered Mode .................................................................................................. 18 Figure 7: USB Connections for Bus-Powered Mode .................................................................................................. 19 Figure 8: Example EEPROM Connection with I2C Interface..................................................................................... 20 Figure 9: Design SPI for In-System Programming and Debug ................................................................................... 20 Figure 10: Reference Design ....................................................................................................................................... 25 Figure 11: Mechanical Characteristic .......................................................................................................................... 26 Figure 12: Placement the Module on a System Board ................................................................................................ 27 Figure 13: Leave 5mm Clearance Space from the Antenna ........................................................................................ 27 Figure 14: Recommended Trace Connects Antenna and the Module ......................................................................... 28 Figure 15: Recommended Reflow Profile ................................................................................................................... 29 Figure 16: Product Packaging Information (Tape) ...................................................................................................... 30 Figure 17: Product Packaging Information (Tray) ...................................................................................................... 31 Figure 18: Ordering Information ................................................................................................................................. 32
FLC-BTM501 Datasheet Flaircomm Microelectronics Confidential -6- 1. Introduction FLC-BTM501 is a small form factor, low power and highly economic Bluetooth radio module that allows OEM to add wireless capability to their products. The module supports multiple interfaces that make it simple to design into fully certified embedded Bluetooth solutions. With FLC’s AT+™ programming interfaces, designers can easily customize their applications to support different Bluetooth profiles, such HS/HF, A2DP, AVRCP, OPP, DUN, SPP, and etc. The module supports Bluetooth® Enhanced Data Rate (EDR) and delivers up to 3 Mbps data rate for distances to 10M. The module is an appropriate product for designers who want to add wireless capability to their products. 1.1 Naming Declaration New Naming Old Naming Description FLC-BTM501XXXA FLC-BTMDC751 Built-in 16M flash memory. FLC-BTM501XXXB FLC-BTMDC751S Built-in 8M flash memory. FLC-BTM501XXXD FLC-BTMDC751MV Built-in 16M flash memory. HTG. FLC-BTMDC8501BM FLC-BTM501XXXE FLC-BTMDC8501AS Built-in 8M flash memory. Halogen-Free. Table 1: Naming Declaration
FLC-BTM501 Datasheet Flaircomm Microelectronics Confidential -7- 1.2 Block Diagram MicrophoneInputAUX_DAC Speaker OutputsUSBUARTPIOsAntennaFlash CrystalBlueCore5-MMBalun FilterSPIAIOs VDD Figure 1: Block Diagram 1.3 Features  Bluetooth v2.1+EDR, Class 2  Profiles including HS/HF, A2DP, AVRCP, OPP, DUN, SPP, and etc.  UART and USB programming and data interfaces  Small form factor  SMT pads for easy and reliable PCB mounting  BQB/FCC/CE Certified  RoHS compliant  APTX 1.4 Applications  Automobile hands-free applications  Stereo headset applications  Cable replacements  Bar code and RFID scanners
FLC-BTM501 Datasheet Flaircomm Microelectronics Confidential -8-  Measurement and monitoring systems  Industrial sensors and controls  Medical devices  Industrial PCs and laptops
FLC-BTM501 Datasheet Flaircomm Microelectronics Confidential -9- 2. General Specification Bluetooth Specification Standard Bluetooth2.1+EDR, Class II Profiles HS/HF, A2DP, AVRCP, OPP, DUN, SPP, etc. detailed profiles depends on the firmware Frequency Band 2.402GHz ~ 2.480GHz Maximum Data Rate 3Mbps RF Input Impedance 50 ohms Baseband Crystal OSC 16MHz Interface UART, PIO, AIO, USB, SPI, Speaker, Microphone, etc. Sensitivity -86dBm@0.1%BER RF TX Power 4dBm Power Supply Voltage 2.7V ~ 3.6V DC Working Current Depends on profiles, 30mA typical. Standby Current <1mA Operating Environment Temperature -40ºC to +85ºC for A and I grade -20ºC to +70ºC for V and C grade Humidity 10%~90% Non-Condensing Certifications BQB/FCC/CE Environmental RoHS Compliant Dimension and Weight Dimension 23.24mm x 11.94mm x 2.00mm (2.2mm for FLC-BTM501D) Weight 1g Table 2: General Specification
FLC-BTM501 Datasheet Flaircomm Microelectronics Confidential -10- 3. Pin Definition 3.1 Pin Configuration Figure 2: Pin Configuration 3.2 Pin Definition Pin Symbol I/O Type Description 1 GND Ground Ground 2 RESETB CMOS input with weak internal pull-up Active LOW reset 3 SPI_CLK input with weak internal pull-down Serial Peripheral interface clock for programming only 4 SPI_MISO CMOS output, tri-state, with weak internal pull-down Serial Peripheral Interface output for programming only 5 SPI_MOSI CMOS input, with weak internal Serial Peripheral Interface input for programming
FLC-BTM501 Datasheet Flaircomm Microelectronics Confidential -11- pull-down only 6 SPI_CSB CMOS input with weak internal pull-up Chip select for Synchronous Serial Interface for programming only, active low 7 PIO10 Bi-directional with programmable strength internal pull-up/down Programmable input/output line 8 PIO11 Bi-directional with programmable strength internal pull-up/down Programmable input/output line 9 PIO5 Bi-directional with programmable strength internal pull-up/down Programmable input/output line 10 PIO3 Bi-directional with programmable strength internal pull-up/down Programmable input/output line 11 PIO2 Bi-directional with programmable strength internal pull-up/down Programmable input/output line 12 PIO0 Bi-directional with programmable strength internal pull-up/down Programmable input/output line 13 PIO1 Bi-directional with programmable strength internal pull-up/down Programmable input/output line 14 AUX_DAC Analogue Voltage DAC output 15 GND Ground Ground 16 MIC_BIAS Analogue Microphone Bias 17 RF_GND RF Ground RF ground 18 RF_IN Analogue Transceiver input/output line 19 RF_GND RF Ground RF ground 20 AIO1 Bi-directional Analogue Programmable input/output line 21 AIO0 Bi-directional Analogue Programmable input/output line 22 GND Ground Ground 23 MIC_LP Analogue Microphone input positive 24 MIC_LN Analogue Microphone input negative 25 SPK_LN Analogue Speaker output negative (left side) 26 SPK_LP Analogue Speaker output positive (left side) 27 SPK_RN Analogue Speaker output negative (right side) 28 SPK_RP Analogue Speaker output positive (right side) 29 PIO13 Bi-directional with programmable strength internal pull-up/down Programmable input/output line 30 VDD 3.3v power input 3.3v power input 31 USB_DP Bi-directional USB data plus, pull up 1.5K when active 32 USB_DN Bi-directional USB data minus
FLC-BTM501 Datasheet Flaircomm Microelectronics Confidential -12- 33 GND Ground Ground 34 PIO14 Bi-directional with programmable strength internal pull-up/down Programmable input/output line 35 PIO9 Bi-directional with programmable strength internal pull-up/down Programmable input/output line 36 PIO4 Bi-directional with programmable strength internal pull-up/down Programmable input/output line 37 GND Ground Ground 38 UART_TX Bi-directional CMOS output, tri-state, with weak internal pull-up UART data output 39 UART_RX CMOS input with weak internal pull-down UART data input 40 PIO8 Bi-directional with programmable strength internal pull-up/down Programmable input/output line 41 PIO7 Bi-directional with programmable strength internal pull-up/down Programmable input/output line 42 PIO6 Bi-directional with programmable strength internal pull-up/down Programmable input/output line Table 3: Pin Definition
FLC-BTM501 Datasheet Flaircomm Microelectronics Confidential -13- 4. Physical Interfaces 4.1 Power Supply The transient response of the regulator is important. If the power rails of the module are supplied from an external voltage source, the transient response of any regulator used should be 20μs or less. It is essential that the power rail recovers quickly. 4.2 Reset The module may be reset from several sources: RESETB pin, power-on reset, a UART break character or via a software configured watchdog timer. The RESETB pin is an active low reset and is internally filtered using the internal low frequency clock oscillator. A reset will be performed between 1.5 and 4.0ms following RESETB being active. It is recommended that RESETB be applied for a period greater than 5ms. At reset the digital I/O pins are set to inputs for bi-directional pins and outputs are tri-state. The PIOs have weak pull-ups. Pin Name / Group Pin Status on Reset USB_DP Input with PD USB_DN Input with PD UART_RX Input with PD UART_TX Tri-state output with PU SPI_MOSI Input with PD SPI_CLK Input with PD SPI_CSB Input with PU SPI_MISO Tri-state output with PD RESETB Input with PU PIOs Bi-directional with PU AIOs Output, drive low RF-IN High impedance Table 4: Pin Status on Reset Note: Pull-up (PU) and pull-down (PD) default to weak values unless specified otherwise.
FLC-BTM501 Datasheet Flaircomm Microelectronics Confidential -14- 4.3 Audio Interfaces Audio interface provides following features:  Mono analogue input for voice band and audio band  Stereo and mono analogue output for voice band and audio band Digital Circuitry∑△-ADCInput AmplifierDACDACLP FilterLP FilterOutput AmplifierOutput AmplifierMIC_LPMIC_LNSPK_LPSPK_LNSPK_RPSPK_RN Figure 3: Audio Input and Output The stereo audio CODEC uses a fully differential architecture in the analogue signal path, which results in low noise sensitivity and good power supply rejection while effectively doubling the signal amplitude. It operates from a single power-supply of 1.5V and uses a minimum of external components. The module features a differential stereo audio output interfaces. 4.3.1 ADC The ADC consists of a second order Digma Delta converter as show in Figure 3. 4.3.2 ADC Sample Rate Selection and Warping ADC supports the following sample rates: 8kHz, 11.025kHz, 16kHz, 22.05kHz, 24kHz, 32kHz, 44.1kHz. One of the main concerns for stereo wireless music applications is the ability to keep sampl rates for the CODECs at both ends of the wireless link in synchronization. A VM function adjusts the sample rate using a ‘warping’ function to tune the sample rate to the required value. The ADC warp function allows the sample rate to be changed by +/-3%, in steps of 1/217, or 7.6ppm. The warp function preserves the signal quality – the distortion introduced when warping the sample rate is negligible. 4.3.3 ADC Gain The ADC contains two gain stages for each channel, an analogue and a digital gain stage.
FLC-BTM501 Datasheet Flaircomm Microelectronics Confidential -15- 4.3.4 DAC The DAC contains two second order Sigma Delta converters allowing two separate channels that are identical in functionality as show in Figure 3. 4.3.5 DAC Sample Rate Selection and Warping Each DAC supports the following sample rates: 8kHz, 11.025kHz, 16kHz, 22.05kHz, 24kHz, 32kHz, 44.1kHz, 48kHz. One of the main concerns for the DAC used in stereo wireless music applications is the ability to keep sample rates for the CODECs at both ends of the wireless link in synchronization. A VM function adjusts the sample rate using a ‘warping’ function to tune the sample rate to the required value. The ADC warp function allows the sample rate to be changed by +/-3%, in steps of 1/217, or 7.6ppm. The warp function preserves the signal quality – the distortion introduced when warping the sample rate is negligible. 4.3.6 DAC Gain The DAC contains two gain stages for each channel, a digital and an analogue gain stage. 4.3.7 Mono Operation Mono operation is single channel operation of the stereo CODEC. The left channel represents the single mono channel for audio in and audio out. In mono operation the right channel is auxiliary mono channel that may be used in dual mono channel operation. 4.3.8 Audio Input Stage The audio input stage of the module consists of a low noise input amplifier, which receives its analogue input signal from pins MIC_LP and MIC_LN to a second–order ∑-Δ ADC that outputs a 4Mbit/sec single-bit stream into the digital circuitry. The input can be configured to be either single ended or fully differential. It can be programmed for either microphone or line input and has a 3-bit digital gain setting of the input-amplifier in 3dB steps to optimize it for the use of different microphones. 4.3.9 Microphone Input Check the reference design in Figure 10 for the microphone input design. 4.3.10 Audio Output Stage The output digital circuitry converts the signal from 16-bit per sample, linear PCM of variable sampling frequency to a 2Mbits/sec multi-bit stream, which is fed into the analogue output circuitry. The output circuit comprises a digital to analogue converter with gain setting and output amplifier. Its class-AB output-stage is capable of driving a signal on both channels of up to 2V pk-pk-differential into a load of 16Ω. The output is available as a differential signal between SPK_LP and SPK_LN for the left channel; and between SPK_RP and SPK_RN for the right channel. The output is capable of driving a speaker directly if its impedance is at least 8Ω if only one channel is connected or an external regulator is used.
FLC-BTM501 Datasheet Flaircomm Microelectronics Confidential -16- The gain of the output stage is controlled by a 3-bit programmable resistive divider, which sets the gain in steps of approximately 3dB. The multi-bit stream from the digital circuitry is low pass filtered by a second order bi-quad filter with a pole at 20kHz. The signal is then amplified in the fully differential output stage, which has a gain bandwidth of typically 1MHz. 4.4 RF Interface The module integrates a balun filter. The user can connect a 50ohms antenna directly to the RF port. 4.5 General Purpose Analog IO The general purpose analog IOs can be configured as ADC inputs by software. Do not connect them if not use. 4.6 General Purpose Digital IO There are nine general purpose digital IOs defined in the module. All these GPIOs can be configured by software to realize various functions, such as button controls, LED displays or interrupt signals to host controller, etc. Do not connect them if not use. 4.6.1 Audio Signal Control PIOs can be used to switch on/off external audio amplifier and microphone-bias generation. Please contact with Flaircomm for the special firmware. FLC-BTM501PIO5PIO11External Audio AmplifierMic Bias Generation Figure 4: An Example of the Audio Signal Control by PIOs
FLC-BTM501 Datasheet Flaircomm Microelectronics Confidential -17- 4.7 Serial Interfaces 4.7.1 UART This is a standard UART interface for communicating with other serial devices. The UART interface provides a simple mechanism for communicating with other serial devices using the RS232 protocol. When the module is connected to another digital device, UART_RX and UART_TX transfer data between the two devices. The remaining two signals, UART_CTS and UART_RTS, can be used to implement RS232 hardware flow control where both are active low indicators. PIO10 and PIO11 can be configured as UART_DTR and UART_RTS. Table 5: Possible UART Settings When connecting the module to a host, please make sure to follow Figure 5. Module HostTX RXRX TXGND GND Figure 5: UART Connection 4.7.2 USB There is a full speed (12M bits/s) USB interface for communicating with other compatible digital devices. The module acts as a USB peripheral, responding to request from a master host controller, such as a PC. The module features an internal USB pull-up resistor. This pulls the USB_DP pin weakly high when module is ready to enumerate. It signals to the USB master that it is a full speed (12Mbit/s) USB device. The USB internal pull-up is implemented as a current source, and is compliant with section Parameter Possible Values Baud Rate Minimum 1200 baud (≤2%Error) 9600 baud (≤1%Error) Maximum 4M baud (≤1%Error) Flow Control RTS/CTS or None Parity None, Odd or Even Number of Stop Bits 1 or 2 Bits per Byte 8
FLC-BTM501 Datasheet Flaircomm Microelectronics Confidential -18- 7.1.5 of the USB specification v1.2. The internal pull-up pulls USB_DP high to at least 2.8V when loaded with a 15kΩ ±5% pull-down resistor (in the hub/host) when VDD =3.1V. This presents a Thevenin resistance to the host of at least 900Ω. Alternatively, an external 1.5kΩ pull-up resistor can be placed between a PIO line and DP on the USB cable. 4.7.2.1 Self-Powered Mode In self-powered mode, the module is powered from its own power supply and not from the VBUS (5V) line of the USB cable. It draws only a small leakage current (below 0.5mA) from VBUS on the USB cable. This is the easier mode for which to design, as the design is not limited by the power that can be drawn from the USB hub or root port. However, it requires that VBUS be connected to module via a resistor network (Rvb1 and Rvb2), so the module can detect when VBUS is powered up. The module will not pull USB_DP high when VBUS is off. Self-powered USB designs (powered from a battery or LDO) must ensure that a PIO line is allocated for USB pull-up purposes. A 1.5KΩ 5% pull-up resistor between USB_DP and the selected PIO line should be fitted to the design. Failure to fit this resistor may result in the design failing to be USB compliant in self-powered mode. The internal pull-up in the module is only suitable for bus-powered USB devices, e.g., dongles. Figure 6: USB Connections for Self-Powered Mode Note: USB_ON is shared with the module PIO terminals. Identifier Value Function Rs 27Ω Nominal Impedance matching to USB cable Rvb1 22kΩ 5% VBUS ON sense divider Rvb2 47kΩ 5% VBUS ON sense divider Table 6: USB Interface Component Values
FLC-BTM501 Datasheet Flaircomm Microelectronics Confidential -19- 4.7.2.2 Bus-Powered Mode In bus-powered mode, the application circuit draws its current from the 5V VBUS supply on the USB cable. The module negotiates with the PC during the USB enumeration stage about how much current it is allowed to consume. For Class 2 Bluetooth applications, FLC recommends that the regulator used to derive 3.3V from VBUS is rated at 100mA average current and should be able to handle peaks of 120mA without foldback or limiting. In bus-powered mode, the module requests 100mA during enumeration. For Class 1 Bluetooth applications, the USB power descriptor should be altered to reflect the amount of power required. This is higher than for a Class 2 application due to the extra current drawn by the Transmit RF PA. When selecting a regulator, be aware that VBUS may go as low as 4.4V. The inrush current (when charging reservoir and supply decoupling capacitors) is limited by the USB specification. Some applications may require soft start circuitry to limit inrush current if more than 10µF is present between VBUS and GND. Figure 7: USB Connections for Bus-Powered Mode 4.7.3 I2C PIO8, PIO7 and PIO6 can be used to form a master I2C interface. The interface is formed using software to drive these lines. It is suited only to relatively slow functions such as driving a LCD, Keyboard, scanner or EEPROM. In the case, PIO lines need to be pulled up through 2.2Kohm resistors.
FLC-BTM501 Datasheet Flaircomm Microelectronics Confidential -20- Figure 8: Example EEPROM Connection with I2C Interface 4.7.4 SPI The synchronous serial port interface (SPI) can be used for system debugging. It can also be used for in-system programming for the flash memory within the module. SPI interface uses the SPI_MOSI, SPI_MISO, SPI_CSB and SPI_CLK pins. Testing points for the SPI interface are reserved on board in case that the firmware shall be updated during manufacture. The module operates as a slave and thus SPI_MISO is an output of the module. SPI_MISO is not in high-impedance state when SPI_CSB is pulled high. Instead, the module outputs 0 if the processor is running and 1 if it is stopped. Thus the module should NOT be connected in a multi-slave arrangement by simple parallel connection of slave SPI_MISO lines. Figure 9: Design SPI for In-System Programming and Debug
FLC-BTM501 Datasheet Flaircomm Microelectronics Confidential -21- 5. Electrical Characteristic 5.1 Absolute Maximum Rating Table 7: Absolute Maximum Rating 5.2 Recommended Operating Conditions Operating Condition Min Typical Max Unit Storage Temperature -40 -- +85 °C Operating Temperature Range (for A and I grade) -40 -- +85 °C Operating Temperature Range (for V and C grade) -20 -- +70 °C VDD_3V3 Voltage +2.7 +3.3 +3.6 V Table 8: Recommended Operating Conditions 5.3 Input/output Terminal Characteristics 5.3.1 Digital Terminals Supply Voltage Levels Min Typical Max Unit Input Voltage Levels VIL input logic level low -0.3 - +0.25xVDD V VIH input logic level high 0.625VDD - VDD+0.3 V Output Voltage Levels VOL output logic level low, lOL = 4.0mA - - 0.125 V VOH output logic level high, lOH = -4.0mA 0.75xVDD - 0.625xVDD V Input and Tri-state Current Ii input leakage current at Vin=VDD or 0V -100 0 100 nA Ioz tri-state output leakage current at Vo=VDD or 0V -100 0 100 nA With strong pull-up -100 -40 -10 μA With strong pull-down 10 40 100 μA Rating Min Max Unit Storage Temperature -40 +120 °C PIO/AIO Voltage -0.4 +3.6 V VDD_3V3 Voltage -0.4 +3.6 V USB_DP/USB_DN Voltage -0.4 +3.6 V Other Terminal Voltages except RF -0.4 VDD+0.4 V
FLC-BTM501 Datasheet Flaircomm Microelectronics Confidential -22- With weak pull-up -5 -1.0 -0.2 μA With weak pull-down -0.2 +1.0 5.0 μA I/O pad leakage current -1 0 +1 μA CI Input Capacitance 1.0 - 5.0 pF Resistive Strength Rpuw weak pull-up strength at VDD-0.2V 500k - 2M Ω Rpdw weak pull-up strength at 0.2V 500k - 2M Ω Rpus strong pull-up strength at VDD-0.2V 10k - 50k Ω Rpds strong pull-up strength at 0.2V 10k - 50k Ω Table 9: Digital Terminal 5.3.2 USB USB Terminals Min Typical Max Unit Input Threshold VIL input logic level low - - 0.3VDD V VIH input logic level high 0.7VDD - - V Input Leakage Current GND < VIN < VDD(a) -1 1 5 μA CI Input capacitance 2.5 - 10.0 pF Output Voltage Levels to Correctly Terminated USB Cable VIL output logic level low 0.0 - 0.2 V VIH output logic level high 2.8 - VDD V Table 10: USB Terminal (a) Internal USB pull-up disabled 5.3.3 Internal CODEC - Analogue to Digital Converter Parameter Min Typical Max Unit Resolution - - 16 Bits Input Sample Rate 8 - 44.1 kHz Signal / Noise, fin=1kHz, BW=20Hz->20kHz A-Weighted THD+N<1% 150mV Vpk-pk Fsample = 8kHz - 82 - dB Fsample = 11.025kHz - 81 - dB Fsample = 16kHz - 80 - dB Fsample = 22.05kHz - 79 - dB Fsample = 32kHz - 79 - dB Fsample = 44.1kHz - 78 - dB Digital Gain -24 - 21.5 dB Table 11: Analogue to Digital Converter
FLC-BTM501 Datasheet Flaircomm Microelectronics Confidential -23- 5.3.4 Internal CODEC - Digital to Analogue Converter Parameter Min Typical Max Unit Resolution - - 16 Bits Output Sample Rate, Fsample 8 - 48 kHz Signal / Noise, fin=1kHz, BW=20Hz->20kHz A-Weighted THD+N<0.01% 0dBFS signal Load-100kΩ Fsample = 8kHz - 95 - dB Fsample = 11.025kHz - 95 - dB Fsample = 16kHz - 95 - dB Fsample = 22.05kHz - 95 - dB Fsample = 32kHz - 95 - dB Fsample = 44kHz - 95 - dB Fsample = 48kHz - 95 - dB Digital Gain -24 - 21.5 dB Gain Resolution 1/32 dB Table 12: Digital to Analogue Converter 5.3.5 Microphone Input Microphone Input Min Typical Max Unit Input full scale at maximum gain - 4 - mV rms Input full scale at minimum gian(differential) 800 - mV rms Gain -3 - 42 dB Gain resolution - 3 - dB Distortion at 1kHz - - -74 dB 3dB Bandwidth - 20 kHz Input impedance - 6 kΩ THD+N(microphone input)@30mV rms input - 0.04 - % Table 13: Microphone Input 5.3.6 Speaker Output Speaker Driver Min Typical Max Unit Output voltage full scale swing (differential) - 750 - mV rms THD+N 100kΩ load - - 0.01% % THD+N 16Ω load - - 0.1% % SNR(Load=16Ω, 0dBFS input relative to digital silence) - 95 - dB Allowed Load Resistive 16(8) - O.C. Ω Capacitive - - 500 pF Table 14: Microphone Output
FLC-BTM501 Datasheet Flaircomm Microelectronics Confidential -24- 5.4 Power consumptions Search Unconnected (Deep Sleep Idle Mode) Connected Idle Play with Minimum Volume Play with Maximum Volume Shutdown ~30mA ~0.57mA ~4mA ~35mA ~35mA ＜50uA Table 15: Power consumptions
FLC-BTM501 Datasheet Flaircomm Microelectronics Confidential -25- 6. Reference Design Figure 10: Reference Design
FLC-BTM501 Datasheet Flaircomm Microelectronics Confidential -26- 7. Mechanical Characteristic Figure 11: Mechanical Characteristic
FLC-BTM501 Datasheet Flaircomm Microelectronics Confidential -27- 8. Recommended PCB Layout and Mounting Pattern Placement and PCB layout are critical to optimize the performances of a module without on-board antenna designs. The trace from the antenna port of the module to an external antenna should be 50 and must be as short as possible to avoid any interference into the transceiver of the module. The location of the external antenna and RF-IN port of the module should be kept away from any noise sources and digital traces. A matching network might be needed in between the external antenna and RF-IN port to better match the impedance to minimize the return loss. As indicated in Figure 12 below, RF critical circuits of the module should be clearly separated from any digital circuits on the system board. All RF circuits in the module are close to the antenna port. The module, then, should be placed in this way that module digital part towards your digital section of the system PCB. Figure 12: Placement the Module on a System Board 8.1 Antenna Connection and Grounding Plane Design Figure 13: Leave 5mm Clearance Space from the Antenna
FLC-BTM501 Datasheet Flaircomm Microelectronics Confidential -28- General design recommendations are:  The length of the trace or connection line should be kept as short as possible.  Distance between connection and ground area on the top layer should at least be as large as the dielectric thickness.  Routing the RF close to digital sections of the system board should be avoided.  To reduce signal reflections, sharp angles in the routing of the micro strip line should be avoided. Chamfers or fillets are preferred for rectangular routing; 45-degree routing is preferred over Manhattan style 90-degree routing. Figure 14: Recommended Trace Connects Antenna and the Module  Routing of the RF-connection underneath the module should be avoided. The distance of the micro strip line to the ground plane on the bottom side of the receiver is very small and has huge tolerances. Therefore, the impedance of this part of the trace cannot be controlled.  Use as many vias as possible to connect the ground planes.
FLC-BTM501 Datasheet Flaircomm Microelectronics Confidential -29- 9. Recommended Reflow Profile The soldering profile depends on various parameters necessitating a set up for each application. The data here is given only for guidance on solder reflow. 210 217 ℃ 250 A B C D 1 2 0 25 3 4 5 6 min E Figure 15: Recommended Reflow Profile Pre-heat zone (A) — This zone raises the temperature at a controlled rate, typically 0.5 – 2 C/s. The purpose of this zone is to preheat the PCB board and components to 120 ~ 150 C. This stage is required to distribute the heat uniformly to the PCB board and completely remove solvent to reduce the heat shock to components. Equilibrium Zone 1 (B) — In this stage the flux becomes soft and uniformly encapsulates solder particles and spread over PCB board, preventing them from being re-oxidized. Also with elevation of temperature and liquefaction of flux, each activator and rosin get activated and start eliminating oxide film formed on the surface of each solder particle and PCB board. The temperature is recommended to be 150 to 210 for 60 to 120 second for this zone. Equilibrium Zone 2 (c) (optional) — In order to resolve the upright component issue, it is recommended to keep the temperature in 210 – 217  for about 20 to 30 second. Reflow Zone (D) — The profile in the figure is designed for Sn/Ag3.0/Cu0.5. It can be a reference for other lead-free solder. The peak temperature should be high enough to achieve good wetting but not so high as to cause component discoloration or damage. Excessive soldering time can lead to intermetallic growth which can result in a brittle joint. The recommended peak temperature (Tp) is 230 ~ 250 C. The soldering time should be 30 to 90 second when the temperature is above 217 C. Cooling Zone (E) — The cooling ate should be fast, to keep the solder grains small which will give a longerlasting joint. Typical cooling rate should be 4 C.
FLC-BTM501 Datasheet Flaircomm Microelectronics Confidential -30- 10. Ordering Information 10.1 Product Packaging Information Figure 16: Product Packaging Information (Tape)
FLC-BTM501 Datasheet Flaircomm Microelectronics Confidential -31- Figure 17: Product Packaging Information (Tray)
FLC-BTM501 Datasheet Flaircomm Microelectronics Confidential -32- 10.2 Ordering information FLC-BTM501XYZAProduct RevisionShipping PackageProduct PackageProduct Grade Figure 18: Ordering Information 10.2.1 Product Revision Product Revision Product Grade Availability A C/V Yes B C/V Yes D A/I Yes E A/I Yes Table 16: Product Revision 10.2.2 Shipping Package Shipping Package Description Quantity Availability 0 Foam Tray — No 1 Plastic Tray 100x10x3 = 3000 Yes 2 Tape 1000x5 = 5000 Yes Table 17: Shipping Package 10.2.3 Product Package Product Package Description Availability Q QFN Yes L LGA No B BGA No C Connector No Table 18: Product Package 10.2.4 Product Grade Product Grade Description Availability C Consumer Refer to Table 16 I Industrial Refer to Table 16 V Automobile After-Market Refer to Table 16 A Automobile Before-Market Refer to Table 16 Table 19: Product Grade
Flaircomm Microelectronics Confidential 11. Cautions &Warnings 11.1 EU Regulatory Conformance Hereby, Flaircomm Microelectronics,Inc. declares that this device is in compliance with the essential requirements and other relevant provisions of Directive 1999/5/EC. The product is conformity with the following standards. SAFETY (Art. 3.1(a)): • EN 60950-1:2006+A11:2009:+A1:2010+A12:2011+A2:2013 HEALTH (Art. 3.1(a)): • EN 62479:2010 EMC (Art. 3.1(b)): • EN 301 489-1 V1.9.2:2011 • EN 301 489-17 V2.2.1:2012 RADIOS (Art. 3.2) • EN 300 328 V1.9.1:2012 Notified body involved: Telefication B.V. CE Number: 0560 11.2 Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference. (2) This device must accept any interference received, including interference that may cause undesired operation. CAUTION: Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:  Reorient or relocate the receiving antenna.  Increase the separation between the equipment and receiver.  Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.  Consult the dealer or an experienced radio/TV technician for help. RF Warning Statement To comply with FCC RF exposure compliance requirements, the antennas used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. This device is intended only for OEM integrators under the following conditions:
Flaircomm Microelectronics Confidential 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed IMPORTANT NOTE: In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for reevaluating the end product(including the transmitter) and obtaining a separate FCC authorization. End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: “Contains FCC ID: P4I-BTM501”. The grantee's FCC ID can be used only when all FCC compliance requirements are met. Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. 11.3 Industry Canada statement This Class B digital apparatus complies with Canadian ICES-003. Cet appareil numérique de la classe [*] est conforme à la norme NMB-003 du Canada. This device complies with Industry Canada’s licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes : 1) l’appareil ne doit pas produire de brouillage; 2) l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement. Radiation Exposure Statement: This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. Déclaration d'exposition aux radiations: Cet équipement est conforme aux limites d'exposition aux rayonnements IC établies pour un environnement non contrôé. Cet équipement doit être installé et utilisé avec un minimum de 20cm de distance entre la source de rayonnement et votre corps. This device is intended only for OEM integrators under the following conditions: 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna.
Flaircomm Microelectronics Confidential As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Cet appareil est conçu uniquement pour les intégrateurs OEM dans les conditions suivantes:1）L'antenne doit être installée de telle sorte qu'une distance de 20 cm est respectée entre l'antenne et les utilisateurs, et 2) Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne. Tant que les 2 conditions ci-dessus sont remplies, des essais supplémentaires surl'émetteur ne seront pas nécessaires. Toutefois, l'intégrateur OEM est toujoursresponsable des essais sur son produit final pour toutes exigences de conformitésupplémentaires requis pour ce module installé. IMPORTANT NOTE: In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the Canada authorization is no longer considered valid and the IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product(including the transmitter) and obtaining a separate Canada authorization. NOTE IMPORTANTE: Dans le cas où ces conditions ne peuvent être satisfaites (par exemple pour certaines configurations d'ordinateur portable ou de certaines co-localisation avec un autreémetteur), l'autorisation du Canada n'est plus considéré comme valide et l'ID IC ne peut pas être utilisé sur leproduit final. Dans ces circonstances, l'intégrateur OEM sera chargé de réévaluer le produit final (y comprisl'émetteur) et l'obtention d'une autorisation distinct au Canada. End Product Labeling This transmitter module is authorized only for use in device where the antenna may beinstalled such that 20 cm may be maintained between the antenna and users. The finalend product must be labeled in a visible area with the following: “Contains IC: 20580-BTM501”. Plaque signalétique du produit final Ce module émetteur est autorisé uniquement pour une utilisation dans un dispositif oùl'antenne peut être installée de telle sorte qu'une distance de 20cm peut être maintenueentre l'antenne et les utilisateurs. Le produit final doit être étiqueté dans un endroit visible avec l'inscriptionsuivante: "Contient des IC: 20580-BTM501". Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Manuel d'information à l'utilisateur final L'intégrateur OEM doit être conscient de ne pas fournir des informations à l'utilisateur final quant à la façon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intègre ce module. Le manuel de l'utilisateur final doit inclure toutes les informations réglementaires requises et avertissements comme indiqué dans ce manuel. The maximum operating ambient temperature of the equipment declared by the manufacturer is -40~+85℃

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