Flaircomm Microelectronics BTM101 Bluetooth module User Manual FLC BTM401 DS

Fujian Flaircomm Microelectronics,Inc. Bluetooth module FLC BTM401 DS

User Manual

FLC-BTM101 Datasheet Flaircomm Microelectronics Confidential -1- FLC-BTM101 Datasheet Document Type: Bluetooth Module Datasheet Document Number: FLC-BTM101-DS Document Version: V1.4 Release Date: 2012/8/29 Copyright 2012 ~ 2014 by Flaircomm Microelectronics Inc., All Right Reserved Without written permission from Flaircomm Microelectronics Inc., reproduction, transfer, distribution or storage of part or all of the contents in this document in any form is prohibited
FLC-BTM101 Datasheet Flaircomm Microelectronics Confidential -2- Release Record Version Release Date Comments 1.0 2012/6/26 Initial Release 1.1 2012/8/1 Update Table 2. 1.2 2012/8/6 Add the weight. Add Part 5.1.1 & 5.2 & 5.3. Modify PCB footprint and reference design. 1.3 2012/8/8 Add BT/CE/FCC logo. Add Cautions & Warnings. 1.4 2012/8/29 Update FCC 2200 logo. Add module statement.
FLC-BTM101 Datasheet Flaircomm Microelectronics Confidential -3- CONTENTS 1. INTRODUCTION .................................................................................................................. 7 1.1 BLOCK DIAGRAM ................................................................................................................... 7 1.2 FEATURES .............................................................................................................................. 7 1.3 APPLICATIONS ....................................................................................................................... 8 2. GENERAL SPECIFICATION ........................................................................................... 10 3. PIN DEFINITION ................................................................................................................ 11 3.1 PIN CONFIGURATION ............................................................................................................ 11 3.2 PIN DEFINITION .................................................................................................................... 11 4. PHYSICAL INTERFACES ................................................................................................ 14 4.1 POWER SUPPLY .................................................................................................................... 14 4.2 RESET .................................................................................................................................. 14 4.2.1 Digital Pin States on Reset ........................................................................................... 14 4.2.2 Power-on Reset ............................................................................................................ 14 4.3 GENERAL PURPOSE DIGITAL IO ........................................................................................... 15 4.4 GENERAL PURPOSE ANALOGUE IO ...................................................................................... 15 5. SERIAL INTERFACES ...................................................................................................... 16 5.1 UART .................................................................................................................................. 16 5.1.1 UART Configuration While in Deep Sleep ................................................................. 16 5.2 I2C INTERFACE ..................................................................................................................... 16 5.3 SPI MASTER INTERFACE ...................................................................................................... 17 5.4 PROGRAMMING AND DEBUG INTERFACE .............................................................................. 18 5.4.1 Instruction Cycle ........................................................................................................... 19 5.4.2 Multi-slave Operation .................................................................................................... 19 6. ELECTRICAL CHARACTERISTICS ............................................................................. 21 6.1 ABSOLUTE MAXIMUM RATINGS .......................................................................................... 21 6.2 RECOMMENDED OPERATING CONDITIONS ........................................................................... 21 6.3 INPUT/OUTPUT TERMINAL CHARACTERISTICS ..................................................................... 21 6.3.1 Digital Terminals.......................................................................................................... 21
FLC-BTM101 Datasheet Flaircomm Microelectronics Confidential -4- 6.4 AIO ..................................................................................................................................... 22 6.5 POWER CONSUMPTION ......................................................................................................... 22 7. REFERENCE DESIGN ....................................................................................................... 23 8. MECHANICAL CHARACTERISTIC .............................................................................. 24 9. RECOMMENDED REFLOW PROFILE ......................................................................... 27 10. ORDERING INFORMATION ........................................................................................ 29 10.1 PRODUCT PACKAGING INFORMATION ............................................................................... 29 10.2 ORDERING INFORMATION ................................................................................................. 31 10.2.1 Product Revision ....................................................................................................... 31 10.2.2 Shipping Package ...................................................................................................... 31 10.2.3 Product Package ........................................................................................................ 31 10.2.4 Product Grade ........................................................................................................... 32 11. CAUTIONS &WARNINGS ............................................................................................. 33 11.1 FCC STATEMENT .............................................................................................................. 33 11.2 RF WARNING STATEMENT ............................................................................................... 33 11.3 FLC-BTM101 MODULE STATEMENT ............................................................................... 33
FLC-BTM101 Datasheet Flaircomm Microelectronics Confidential -5- TABLES AND FIGURES Table 1: General Specification ......................................................................................................... 10 Table 2: Pin Definition..................................................................................................................... 13 Table 3: Digital Pin Status on Reset ................................................................................................ 14 Table 4: Power-on Reset .................................................................................................................. 15 Table 5: Possible UART Settings .................................................................................................... 16 Table 6: SPI Master Serial Flash Memory Interface ....................................................................... 17 Table 7: Instruction Cycle for a SPI Transaction............................................................................. 19 Table 8: Absolute Maximum Ratings .............................................................................................. 21 Table 9: Recommended Operating Conditions ................................................................................ 21 Table 10: Digital Terminal............................................................................................................... 22 Table 11: Power Consumption......................................................................................................... 22 Table 12: Product Revision .............................................................................................................. 31 Table 13: Shipping Package............................................................................................................. 31 Table 14: Product Package ............................................................................................................... 31 Table 15: Product Grade .................................................................................................................. 32 Figure 1: Block Diagram ................................................................................................................... 7 Figure 2: Pin Configuration ............................................................................................................. 11 Figure 3: Example of an I2C Interface EEPROM Connection ........................................................ 17 Figure 4: Memory Boot-up Sequence .............................................................................................. 18 Figure 5: Reference Design ............................................................................................................. 23 Figure 6: Top View .......................................................................................................................... 24 Figure 7: Bottom View .................................................................................................................... 24 Figure 8: Detail of Pads ................................................................................................................... 25 Figure 9: Recommended PCB Footprint.......................................................................................... 26 Figure 10: Recommended Reflow Profile ....................................................................................... 27 Figure 11: Product Packaging Information ...................................................................................... 29
FLC-BTM101 Datasheet Flaircomm Microelectronics Confidential -6- Figure 12: Product Packaging Information (Tape) .......................................................................... 31 Figure 13: Ordering Information ..................................................................................................... 31
FLC-BTM101 Datasheet Flaircomm Microelectronics Confidential -7- 1. Introduction FLC-BTM101 is a Bluetooth low energy (BLE) module supporting BT4.0 (BLE only). This module enables customers to add ultra-low power wireless connectivity to their products. The module provides everything required to create a Bluetooth low energy product with RF, based band, MCU, system clock, antenna and qualified Bluetooth 4.0 (BLE only) stack and customer application settings. It also enables the transfer of short data sets between compact devices opening up a completely new area of Bluetooth applications such as watches, TV remote controls, medical sensors and fitness trainers. Bluetooth low energy takes less time to establish a connection than conventional Bluetooth wireless technology and can consume approximately 1/20th of the power of Bluetooth Basic Rate. BTM101 support profiles for sensors, watches, HIDs and time synchronization. Naming Declaration 1.1 Block Diagram UARTPIOsFLC-BTM101PM Two ClocksCSR1000 BLEFilterSPIVDDAntenna Figure 1: Block Diagram 1.2 Features  Bluetooth v4.0(BLE only）( doesn’t support BT2.0& BT 2.1 &BT3.0)
FLC-BTM101 Datasheet Flaircomm Microelectronics Confidential -8-  Support of Bluetooth 4.0(BLE only) specification host stack including ATT, GATT, SMP, L2CAP, GAP  RSSI monitoring for proximity applications  32kHz and 16MHz system clocks  10 bits ADC  12 digital PIOs  3 analog AIOs  UART host interface  512 Kbits EEPROM  Debug SPI host interface  3 PWM modules  Wakeup interrupt  64KB RAM and 64K ROM  Watchdog timer  Small form factor  SMT pads for easy and reliable PCB mounting  BQB/FCC/CE Certified  RoHS compliant 1.3 Applications Typical applications are:  Sports and fitness  Healthcare  Home automation  Office and mobile accessories  Automotive
FLC-BTM101 Datasheet Flaircomm Microelectronics Confidential -9-  Commercial  Watches  Human interface devices
FLC-BTM101 Datasheet Flaircomm Microelectronics Confidential -10- 2. General Specification Bluetooth Specification Standard Bluetooth 4.0(BLE only) Frequency Band 2.402GHz ~ 2.480GHz Antenna Antenna High System Clock 16MHz Low System Clock 32.768kHz Interface UART, PIO, SPI, AIO Sensitivity -90dBm@0.1%BER RF TX Power 6dBm Power Supply Voltage 1.8 ~ 3.6V DC Operational Current Refer to Table 11 Deep Sleep Current <5uA in deep sleep mode Operating Environment Temperature -30ºC to +85ºC Certifications BQB/FCC /CE2200 Environmental RoHS Compliant Dimension and Weight Dimension 22.00mm x 13.40mm x 1.50mm Weight 1.08g Table 1: General Specification
FLC-BTM101 Datasheet Flaircomm Microelectronics Confidential -11- 3. Pin Definition 3.1 Pin Configuration Figure 2: Pin Configuration 3.2 Pin Definition Pin Symbol I/O Type Description 1 GND Ground Ground 2 AIO2 Bidirectional analogue Analogue programmable I/O line 3 AIO1 Bidirectional analogue Analogue programmable I/O line 4 AIO0 Bidirectional analogue Analogue programmable I/O line
FLC-BTM101 Datasheet Flaircomm Microelectronics Confidential -12- 5 PIO0 / UART_TX Bi-directional with programmable strength internal pull-up/down Programmable input/output line / UART TX selected by firmware setting 6 PIO1 / UART_RX Bi-directional with programmable strength internal pull-up/down Programmable input/output line / UART RX selected by firmware setting 7 PIO3 Bi-directional with programmable strength internal pull-up/down Programmable input/output line 8 PIO4 Bi-directional with programmable strength internal pull-up/down Programmable input/output line 9 PIO5 / SPI_CLK Bi-directional with programmable strength internal pull-up/down Programmable input/output line / SPI Clock selected by SPI_PIO# 10 GND Ground Ground 11 PIO6 / SPI_CSB Bi-directional with programmable strength internal pull-up/down Programmable input/output line / SPI CSB selected by SPI_PIO# 12 PIO7 / SPI_MOSI Bi-directional with programmable strength internal pull-up/down Programmable input/output line / SPI MOSI selected by SPI_PIO# 13 PIO8 / SPI_MISO Bi-directional with programmable strength internal pull-up/down Programmable input/output line / SPI MISO selected by SPI_PIO# 14 PIO9 Bi-directional with programmable strength internal pull-up/down Programmable input/output line 15 I2C_SDA Bidirectional, tristate, with weak internal pull-up I2C data input/output 16 I2C_SCL Input with weak internal pull-up I2C clock 17 GND Ground Ground 18 PIO2 Bi-directional with programmable strength internal pull-up/down Programmable input/output line
FLC-BTM101 Datasheet Flaircomm Microelectronics Confidential -13- 19 PIO10 Bi-directional with programmable strength internal pull-up/down Programmable input/output line 20 VDD_PIO Power Input Positive supply for all digital I/O port PIO[11:0] 21 PIO11 Bi-directional with programmable strength internal pull-up/down Programmable input/output line 22 SPI_PIO#SEL Input with strong internal pull-down Select SPI debug port on PIO[8:5] 23 Wake-up Input has no internal pull-up or pull-down, use external pull-down Input to wake up BTM101 from hibernate 24 VDD Power input 3.3v power input 25 GND Ground Ground 26 GND Ground Ground Table 2: Pin Definition
FLC-BTM101 Datasheet Flaircomm Microelectronics Confidential -14- 4. Physical Interfaces 4.1 Power Supply BTM101 contains two regulators:  One switch-mode regulator, which generates the main supply rail directly from battery  One low-voltage linear regulator with 1.2V output powers digital circuits VDD_PIO is input voltage to power all digital I/Os including PIOs, UART port, SPI port and I2C. 4.2 Reset The module may be reset from several sources: Power-on reset  Software configured watchdog timer. 4.2.1 Digital Pin States on Reset The following table shows the digital pin states of BTM101 on reset. PU and PD default to weak values unless specified otherwise. Pin Name / Group On Reset I2C_SDA Strong PU I2C_SCL Strong PU PIO[11:0] Weak PD Table 3: Digital Pin Status on Reset 4.2.2 Power-on Reset The following table shows how the power-on reset occurs.
FLC-BTM101 Datasheet Flaircomm Microelectronics Confidential -15- Power-on Reset Type Unit Reset release on VDD_DIG rising 1.05 V Reset assert on VDD_DIG falling 1.00 Reset assert on VDD_DIG falling (Sleep mode) 0.60 Hysteresis 50 mV Table 4: Power-on Reset 4.3 General Purpose Digital IO 12 lines of programmable bidirectional I/O are provided. They are all powered from VDD_PIO. PIO lines are software configurable as weak pull-up, weak pull-down, strong pull-up or strong pull-down. NOTE: at reset all PIO lines are input with weak pull-downs. Any of the PIO line can be configured as interrupt request line or as weak-up lines from sleep modes. The BTM101 supports alternative functions on the PIO lines:  SPI interface,  UART.  LED flashing / PWM module. NOTE: Implementation of the PIO lines is firmware build specific. 4.4 General Purpose Analogue IO BTM101 has 3 general purpose analog interface pins, AIO [2:0].
FLC-BTM101 Datasheet Flaircomm Microelectronics Confidential -16- 5. Serial Interfaces 5.1 UART This is a standard UART interface for communicating with other serial devices. The UART interface provides a simple mechanism for communicating with other serial devices using the RS232 protocol. When the module is connected to another digital device, UART_RX and UART_TX transfer data between the two devices. When selected in firmware PIO[0] is assigned to UART_TX and PIO[1] is assigned to UART_RX. The UART CTS and RTS signals can be assigned to any PIO pin by the on-chip firmware. Parameter Possible Values Baud Rate Minimum 1200 baud (≤2%Error) 9600 baud (≤1%Error) Maximum 4M baud (≤1%Error) Flow control CTS / RTS Parity None, Odd or Even Number of Stop Bits 1 or 2 Bits per Byte 8 Table 5: Possible UART Settings 5.1.1 UART Configuration While in Deep Sleep The maximum baud rate is 9600 baud during deep sleep. 5.2 I2C Interface The I2C interface communicates to an internal EEPROM, or external peripherals or sensors. The internal EEPROM holds the program code inside BTM101. Figure 3 shows the connection of the internal EEPROM with the I2C interface where I2C_SCL, I2C_SDA and PIO [2] are connected to the internal EEPROM. The PIO [2] pin supplies the power to the EEPROM supply pin, e.g. VDD. At boot-up, if there is no valid ROM image in the BTM101 ROM area, BTM101 tries to boot from the I2C interface, see Figure 4. This involves reading the code from the internal EEPROM and loading it into the internal BTM101 RAM.
FLC-BTM101 Datasheet Flaircomm Microelectronics Confidential -17- Figure 3: Example of an I2C Interface EEPROM Connection 5.3 SPI Master Interface BTM101 provides a SPI interface to connect an external serial flash memory. The SPI master memory interface in the BTM101 is overlaid on the I2C interface and uses a further 3 PIOs for the extra pins, see Table 6. SPI Interface Pin Flash_VDD PIO[2] SF_DIN PIO[3] SF_CS# PIO[4] SF_CLK I2C_SCL SF_DOUT I2C_SDA Table 6: SPI Master Serial Flash Memory Interface Note: If an application using BTM101 is designed to boot from SPI serial flash, it is possible for the firmware to map the I2C interface to alternative PIOs. The boot-up sequence for BTM101 is controlled by hardware and firmware. Figure 4 shows the sequence of loading RAM with content from RAM, EEPROM and SPI serial flash.
FLC-BTM101 Datasheet Flaircomm Microelectronics Confidential -18- Figure 4: Memory Boot-up Sequence 5.4 Programming and Debug Interface The BTM101 debug SPI interface is available in SPI slave mode to enable an external MCU to program and control the BTM101, generally via libraries or tools supplied by Flaircomm. The
FLC-BTM101 Datasheet Flaircomm Microelectronics Confidential -19- protocol of this interface is proprietary. The 4 SPI debug lines directly support this function. The SPI programs, configures and debugs the BTM101. Take SPI_PIO#_SEL high to enable the SPI debug feature on PIO [8:5]. BTM101 uses a 16-bit data and 16-bit address programming and debug interface. Transactions occur when the internal processor is running or is stopped. Data is written or read one word at a time, or the auto-increment feature is available for block access. 5.4.1 Instruction Cycle The BTM101 is the slave and receives commands on DEBUG_MOSI and outputs data on DEBUG_MISO. Table 7 shows the instruction cycle for a SPI transaction. 1 Reset the SPI interface Hold DEBUG_CS# high for 2 DEBUG_CLK cycles 2 Write the command word Take DEBUG_CS# low and clock in the 8-bit command 3 Write the address Clock in the 16-bit address word 4 Write or read data words Clock in or out 16-bit data word(s) 5 Termination Take DEBUG_CS# high Table 7: Instruction Cycle for a SPI Transaction With the exception of reset, DEBUG_CS# must be held low during the transaction. Data on DEBUG_MOSI is clocked into the BTM101 on the rising edge of the clock line DEBUG_CLK. When reading, BTM101 replies to the master on DEBUG_MISO with the data changing on the falling edge of the DEBUG_CLK. The master provides the clock on DEBUG_CLK. The transaction is terminated by taking DEBUG_CS# high. The auto increment operation on the BTM101 cuts down on the overhead of sending a command word and the address of a register for each read or write, especially when large amounts of data are to be transferred. The auto increment offers increased data transfer efficiency on the BTM101. To invoke auto increment, DEBUG_CS# is kept low, which auto increments the address, while providing an extra 16 clock cycles for each extra word written or read. 5.4.2 Multi-slave Operation
FLC-BTM101 Datasheet Flaircomm Microelectronics Confidential -20- Do not connect the BTM101 in a multi-slave arrangement by simple parallel connection of slave MISO lines. When BTM101 is deselected (DEBUG_CS# = 1), the DEBUG_MISO line does not float. Instead, BTM101 outputs 0 if the processor is running or 1 if it is stopped.
FLC-BTM101 Datasheet Flaircomm Microelectronics Confidential -21- 6. Electrical Characteristics 6.1 Absolute Maximum Ratings Rating Min Max Unit Storage Temperature -40 +85 °C Operating Temperature -40 +85 °C PIO Voltage -0.4 +3.6 V Battery (VDD) operation 1.8 +3.6 V Other Voltages VSS-0.4 VDD+0.4 V Table 8: Absolute Maximum Ratings 6.2 Recommended Operating Conditions Operating Condition Min Typical Max Unit Storage Temperature -40 -- +85 °C Operating Temperature Range -30 -- +85 °C PIO Voltage +1.2 -- +3.6 V VDD Voltage +1.8 -- +3.6 V Table 9: Recommended Operating Conditions 6.3 Input/output Terminal Characteristics 6.3.1 Digital Terminals Supply Voltage Levels Min Typical Max Unit Input Voltage Levels VIL input logic level low -0.4 - +0.4 V VIH input logic level high 0.7VDD - VDD+0.4 V Tr/Tf - - 25 ns Output Voltage Levels VOL output logic level low, lOL = 4.0mA - - 0.4 V VOH output logic level high, lOH = -4.0mA 0.75VDD - - V
FLC-BTM101 Datasheet Flaircomm Microelectronics Confidential -22- Tr/Tf - - 5 ns Input and Tri-state Current With strong pull-up -150 -40 -10 μA With strong pull-down 10 40 150 μA With weak pull-up -5 -1.0 -0.33 μA With weak pull-down -0.33 +1.0 5.0 μA I/O pad leakage current -1 0 +1 μA CI Input Capacitance 1.0 - 5.0 pF Table 10: Digital Terminal 6.4 AIO Input Voltage Levels Min Typical Max Unit Input Voltages 0 -- +1.3 V 6.5 Power Consumption Operation Mode Description Typical Unit Dormant All functions are shutdown. To wake up toggle the WAKE pin <600 nA Hibernate VDD_PIO = ON. REFCLK = OFF, SLEEPCLK=ON, VDD=ON <1.5 uA Deep Sleep VDD_PIO=ON, REFCLK=OFF, SLEEPCLK=ON,VDD=ON,RAM=ON,DIGITAL CIRCUITS=ON, SMPS=ON (low-power mode), 1us wake up time <5 uA Idle VDD_PIO=ON, REFCLK=ON, SLEEPCLK=ON,VDD=ON,RAM=ON,DIGITAL CIRCUITS=ON, MCU=IDLE, <1us wake up time ~1 mA RX / TX active @3V peak ~16 mA Table 11: Power Consumption
FLC-BTM101 Datasheet Flaircomm Microelectronics Confidential -23- 7. Reference Design Figure 5: Reference Design
FLC-BTM101 Datasheet Flaircomm Microelectronics Confidential -24- 8. Mechanical Characteristic Figure 6: Top View Figure 7: Bottom View
FLC-BTM101 Datasheet Flaircomm Microelectronics Confidential -25- Figure 8: Detail of Pads
FLC-BTM101 Datasheet Flaircomm Microelectronics Confidential -26- Figure 9: Recommended PCB Footprint
FLC-BTM101 Datasheet Flaircomm Microelectronics Confidential -27- 9. Recommended Reflow Profile The soldering profile depends on various parameters necessitating a set up for each application. The data here is given only for guidance on solder reflow. 210 217 ℃ 250 A B C D 1 2 0 25 3 4 5 6 min E Figure 10: Recommended Reflow Profile Pre-heat zone (A) — This zone raises the temperature at a controlled rate, typically 0.5 – 2 C/s. The purpose of this zone is to preheat the PCB board and components to 120 ~ 150 C. This stage is required to distribute the heat uniformly to the PCB board and completely remove solvent to reduce the heat shock to components. Equilibrium Zone 1 (B) — In this stage the flux becomes soft and uniformly encapsulates solder particles and spread over PCB board, preventing them from being re-oxidized. Also with elevation of temperature and liquefaction of flux, each activator and rosin get activated and start eliminating oxide film formed on the surface of each solder particle and PCB board. The temperature is recommended to be 150 to 210 for 60 to 120 second for this zone. Equilibrium Zone 2 (c) (optional) — In order to resolve the upright component issue, it is recommended to keep the temperature in 210 – 217  for about 20 to 30 second. Reflow Zone (D) — The profile in the figure is designed for Sn/Ag3.0/Cu0.5. It can be a reference for other lead-free solder. The peak temperature should be high enough to achieve good wetting but not so high as to cause component discoloration or damage. Excessive soldering time can lead to
FLC-BTM101 Datasheet Flaircomm Microelectronics Confidential -28- intermetallic growth which can result in a brittle joint. The recommended peak temperature (Tp) is 230 ~ 250 C. The soldering time should be 30 to 90 second when the temperature is above 217 C. Cooling Zone (E) — The cooling ate should be fast, to keep the solder grains small which will give a longerlasting joint. Typical cooling rate should be 4 C.
FLC-BTM101 Datasheet Flaircomm Microelectronics Confidential -29- 10. Ordering Information 10.1 Product Packaging Information Figure 11: Product Packaging Information
FLC-BTM101 Datasheet Flaircomm Microelectronics Confidential -30-
FLC-BTM101 Datasheet Flaircomm Microelectronics Confidential -31- Figure 12: Product Packaging Information (Tape) 10.2 Ordering information FLC-BTM101XYZAProduct RevisionShipping PackageProduct PackageProduct Grade Figure 13: Ordering Information 10.2.1 Product Revision Product Revision Description Availability A Release A Yes Table 12: Product Revision 10.2.2 Shipping Package Shipping Package Description Quantity Availability 0 Foam Tray — No 1 Plastic Tray 100x10x3 = 3000 Yes 2 Tape 1000 Yes Table 13: Shipping Package 10.2.3 Product Package Product Package Description Availability Q QFN Yes L LGA No B BGA No C Connector No Table 14: Product Package
FLC-BTM101 Datasheet Flaircomm Microelectronics Confidential -32- 10.2.4 Product Grade Product Grade Description Availability C Consumer Yes I Industrial No V Automobile After-Market Yes A Automobile Before-Market No Table 15: Product Grade
FLC-BTM101 Datasheet Flaircomm Microelectronics Confidential -33- 11. Cautions &Warnings 11.1 FCC Statement 1. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference. (2) This device must accept any interference received, including interference that may cause undesired operation. 2. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. 11.2 RF Warning Statement The device has been evaluated to meet general RF exposure requirement. The device can be used in portable exposure condition without restriction. 11.3 FLC-BTM101 Module Statement The FLC-BTM101 module is designed to comply with the FCC statements.
FLC-BTM101 Datasheet Flaircomm Microelectronics Confidential -34- The Host system using BTM101, should have label indicated "Contains FCC ID: P4IBTM101."

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