Edifier EDF54 5.8G Wireless Audio Transceiver/Receiver Module User Manual

Edifier International Limited 5.8G Wireless Audio Transceiver/Receiver Module

User Manual

深圳市燊利创科技有限公司SENRITRON ELECTRONICS CO., LTD深圳市龙华新区民治街道向南大厦2楼201-203 518131品名(Product): 5.8G模组模组型号(Manufactured Part No.)：EV01S RX 软件版本(Software Version)：RX : V2B客户物料编号：OT-056-000001-01说明: 双方确认之产品,封存样品随承认书装订附上.附录为产品规格书,有同等确认效力.一式两份双方签署盖章各保存一份. 承 认 印Signature for Approval燊利创Senritron客 户Customer
EV01S Rx Subwoofer Module 承認書 Version: 1.0 Subject to change without further notice. 2017/04/11 Everestek Inc.
INDEX 1. Spec ......................................................................................................................................................... 3 2. Features .................................................................................................................................................... 3 3. Application .............................................................................................................................................. 3 4. Electrical Specifications .......................................................................................................................... 4 5. Mechanical Specification ........................................................................................................................ 5 6. Application .............................................................................................................................................. 6 7. Block Diagram ......................................................................................................................................... 7 8. Module Pin Definition ............................................................................................................................. 8 9. Reference Schematics .............................................................................................................................. 8 10. Sticker and Package ............................................................................................................................... 10 11. Revision History .................................................................................................................................... 12
1. Spec Module EV01S FW SUREV2B703135E56 Main Chip ETK51 RF 5.8GHz Modulation FSK 2. Features  Radio Frequency: 5.8GHz unlicensed bands  Uncompressed Audio  Short Audio Latency: < 13ms (analog to analog)  Link Distance: up to 40 Meters  Advanced RF Selection Algorithm  Small RF Foot Print  Best Coexistence with Wi-Fi/Bluetooth  Highly Integrated SoC: RF/PA/CPU/Flash Embedded  Wide-Band Antenna on Module  Short RBOM List  RF Modulation: FSK  Digital I2S (master or slave) Audio Interface, 16/24bit , 32/44.1/48KHz Sampling Rate  Low Power Consumption  Supply Voltage: 2.7~3.6V  Support I2C master/slave mode and SPI/UART  Optional module version with MHF connector for external antenna  Compliant with EMC Regulations (FCC/CE) 3. Application  Wireless Soundbar/Subwoofer
4. Electrical Specifications RF Specification Item Min Typ Max Unit Note RF Carrier Frequency 5725 ─ 5820 MHz For 5.8Ghz -20dB bandwidth ─ 2 ─ MHz Output Power 7 dBm RF Sensitivity ─ -81 dBm Audio Specification(I2S to I2S) Item Min Typ Max Unit Note SNR 142 dB @1kHz THD + N -135 dB @1kHz Frequency response 6 KHz Programmable, <=6KHz Dynamic range -140 dB @1kHz Operation Condition Item Min Typ Max Unit Note VDD 2.7 3.3 3.6 V Power Supply Voltage Operating Temperature -5 25 60 °C Ambient temperature Electrical Specification (MCU+RF) Item Min Typ Max Unit Note Transmitter current 47 mA Output power 7dBm Receiver current 45 mA sleep mode 2 mA Crystal enable, timer or interrupt wake up system Digital interface Item Min Typ Max Unit Note VIH 0.7VDD VDD+0.2 V Input High Threshold VIL VSS 0.3VDD V Input Low Threshold VOH VDD-0.3 VDD V Output High Threshold VOL 0 0.3 V Output Low Threshold
5. Mechanical Specification  Dimension：34 mm x 18 mm  PCB 4 Layers  Mechanical Drawing: Bottom view Antenna AreaNo trace, ground, power copper underneath this area!1.271.275.516.51225264.7 183491113142592 (use plastic screw only)(0, 0)  Connector Drawing:
The no copper area is showed below in pink color. The main board layout should no copper, no trace underneath this area. 6. Application
EV01ModuleI2CExternal MCUExternal Power StageI2SControl signalButtons / LEDBlue Tooth EV01ModuleI2CI2S5.8G RFSoundbarSubwoofer 7. Block Diagram ETK51RFN_RXRFP_RXRFP_TXRFN_TXVDDPAPA BiasBalunBalunLow passfilterLow passfilterConnector
8. Module Pin Definition Pin Name I/O Function Definition 1 VDD P VDD (2.7V~3.6V) 2 DGND P System ground 3 CODEC_12M O For audio codec system clock(12.288MHz or 11.2896MHz) 4 P2.0 I/O GPIO 5 P2.1 I/O GPIO 6 P2.6_PWM I/O GPIO or PWM 7 P2.7_PWM I/O GPIO or PWM 8 P0.2_UART_TXD I/O GPIO or UART TXD 9 P0.7_SPI_CS I/O, C GPIO and SPI chip select for programming internal flash mode, or Arm Debug port 10 P0.3_UART_RXD_Debug I/O General I/O or UART RXD, ARM debug port 11 DGND P System ground 12 DGND P System ground 13 P0.6_SPI_SCK I/O General I/O and SPI SCK for SPI in programming internal flash mode, or Arm Debug port 14 P3.2_ADC_IN I/O, A GPIO or ADC input 15 P0.5_SPI_MISO I/O, C General I/O and SPI MISO for SPI in programming internal flash mode, or Arm Debug port 16 FLASH_PROG C Program mode select, active high, default pull low For programming internal flash memory Please leave this pin float for normal operation. 17 P0.4_SPI_MOSI I/O, C General I/O and SPI MOSI for SPI in programming internal flash mode, or Arm Debug port 18 P0.0_I2C_SCL I/O General I/O, I2C clock 19 P0.1_I2C_SDA I/O General I/O, I2C data 20 P3.1_ADC_IN I/O, A GPIO or ADC input 21 P3.0_ADC_IN I/O, A GPIO or ADC input 22 I2S_PCM_LRCK I/O I2S LRCK(input for I2S slave, output for I2S master) 23 DGND P Power ground 24 I2S_PCM_BCK I/O I2S BCK(input for I2S slave, output for I2S master) 25 I2S_PCM_DIN I/O I2S Data in(from audio codec, or from ADC I2S DATA out) 26 I2S_PCM_DOUT I/O I2S Data out(to audio codec, or to DAC I2S DATA in) Note: P:Power, I/O:GPIO, S:System use only, A:DAC/ADC, C:control 9. Reference Schematics
LBDRX_ENC169pFC_0201R10R/NCR_0402DGNDA2MHF213GNDANTGNDGPIO_P2.6_PWMRX_ENC381uFC_0402DGNDXTAL_NANT2PCB_ANT1INDGNDI2C_SDAC111uFC_0402DGNDXTAL_NL91.0nHL_0201VDD_3VI2S_PCM_LRCKC524.7pFC_0201C34.7uFC_0603XTAL_PDGNDC240.1uFC_0402VDD_3VGPIO_P2.4C51100nFC_0201EAR_LPC4512pFC_0402I2C_SDADGNDC55NC/9pFC_0201DGNDI2S_PCM_BCKP3.2_ADC_INSPI_MISOC420.1uFC_0402XTAL_PTP13VTP_1.0MMDGNDC250.5pFC_0201DGNDGPIO_P2.7_PWMSPI_SCKC56NC/9pFC_0201I2C_SCLDGNDU7XTAL16MHZXTAL_3.2X2.5MM1243DGNDC344.7pFC_0201SPI_MOSIFLASH_WPRSTNTP12 GPIO_P2.4 TP_0.8MMDGNDC530.5pFC_0201VDD_3VA1MHF213GNDANTGNDJTAG_MCODEC_12MP0.2_UART_TXDC131uFC_0402DGNDC200.5pFC_0201DGNDI2S_DOUT2P3.0_ADC_INP3.1_ADC_INL61.6nHL_0201C60.1uFC_0402DGNDL120RL_0201DGNDP0.3_UART_RXD_DebugEAR_LNI2C_SCLL171.0nHL_0201C540.5pFC_0201VDD_3VL51.2nHL_0201DGNDSPI_CSEAR_RPI2S_PCM_DOUTC36NCC_0201DGNDDGNDL82.2nHL_0201I2S_PCM_DOINFLASH_PROGU8ETK51MQFN48_0.5_7X712345678910312728291415161720181112133837333632342625242321224847464544434241403949193035EAR_RNEAR_RPEAR_LPEAR_LNVDD3VXTAL_PXTAL_NVDD3VRFN_RXRFP_RXP0.0RSTNP0.3P0.2VDD3V3V_OUT5V_INP3.2P0.7P3.1RFP_TXRFN_TXVDDPAP1.2P1.3P2.6P2.0P2.7P2.4VDD3VCDVDDLBDP0.4P0.6P0.5VbgDACVDD3VTX_ENRX_ENCLK12MWPJTAG_MPROG_MP1.0P1.1GNDP3.0P0.1P2.1VDD_3VDGNDI2S_DOUT1EAR_RNC4412pFC_0402C190.8pFC_0201VDD_INANT1PCB_ANT1IN I2S_PCM_DOINP0.2_UART_TXDI2S_PCM_DOUTJ1 26pin_ConnectorPIN_2X13_1.27MM_SMD1 23 45 67 891011 1213 1415 1617 1819 20222123 2425 26GPIO_P2.6_PWMI2S_PCM_BCKTP6 FLASH_WPTP_0.8MMGPIO_P2.7_PWMI2S_PCM_LRCKGPIO_P2.4H1H_2.0mmP3.0_ADC_INI2S_DOUT1TP5 EAR_RN TP_0.8MMDGNDP3.1_ADC_INI2S_DOUT2TP4 EAR_RP TP_0.8MMDGNDP3.2_ADC_INCODEC_12MDGNDTP7 JTAG_M TP_0.8MMEAR_LNTP3 EAR_LP TP_0.8MMI2C_SCLDGNDEAR_LPI2C_SDASC1SC_PADVDD_INEAR_RPFLASH_PROGDGNDTP8 RSTN TP_0.8MMEAR_RNTP10 GPIO_P2.4 TP_0.8MMSPI_CSFLASH_WPSC2SC_PADSPI_SCKJTAG_MSPI_MISOTP9 LBD TP_0.8MMRSTNSPI_MOSITP2 EAR_LN TP_0.8MMLBDP0.3_UART_RXD_Debug BOM: Items Type Package Spec Quantity Part ref Remark 1 C CHIP 0201 0.5pF±0.1pF_25V 4 C20,C25,C53,C54 2 C CHIP 0201 0.8pF±0.1pF_25V 1 C19
3 C CHIP 0201 4.7pF±0.25pF_25V 2 C34,C52 4 C CHIP 0201 9pF±0.25pF_25V 1 C16 5 C CHIP 0201 100nF±10%_6.3V 1 C51 6 C CHIP 0402 100nF±10%_6.3V 3 C6,C24,C42 7 C CHIP 0402 1uF-20%~+80%_6.3V 3 C11,C13,C38 8 C CHIP 0402 12pF±5%_50V 2 C44,C45 9 C CHIP 0603 4.7uF-20%~+80%_6.3V 1 C3 10 L CHIP 0201 1nH±0.3nH 2 L9,L17 11 L CHIP 0201 1.2nH±0.3nH 1 L5 12 L CHIP 0201 1.6nH±0.3nH 1 L6 13 L CHIP 0201 2.2nH±0.3nH 1 L8 14 R CHIP 0201 0R±5% 1 L12 15 R CHIP 0402 0R±5%_ 1/16W 1 R1 16 26pin_Connector PIN_2X13_1.27MM_SMD 1 J1 17 XTAL XTAL16MHZ 1 U7 18 ETK51 MQFN48_0.5_7X7 1 U8 C CHIP 0201 9pF±0.25pF_25V 2 C55,C56 NC C CHIP 0201 NC 0201 1 C36 NC MHF MHF_3.1X3_SMD 2 A1,A2 NC 10. Sticker and Package The 1st Line: Module Model Number The 2nd Line: F/W Version The 3rd Line: Serial Number
11. Revision History Date Revision Descriptions 2017/04/10 1.0 Initial Version

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