AcSiP Technology S76S LoRa Wireless Communication Module User Manual S502 SPEC

AcSiP Technology Corporation LoRa Wireless Communication Module S502 SPEC

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S76S User Manual

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0 S76S LoRa Wireless Communication Module H 901-10201 Mar 22nd, 2017 Product Name Version Doc No Date

S76S LoRa Wireless Communication Module H 901-10201 Mar 22th ,2017 2 of 18 Product Name Version Doc No Date Page 1. General Description The S76S integrates ARM Coretex®-M0+ (32-bit RISC core operating at a 32MHz frequency) MCU with LoRaTM modulation that provides ultra-long range spread spectrum communication and high interference immunity whilst minimizing current consumption. S76S can achieve a sensitivity of over -137 dBm. The high sensitivity combined with the integrated +20 dBm power amplifier yields industry leading link budget making it optimal for any low data rate application requiring range or robustness. LoRaTM also provides significant advantages in both blocking and selectivity over conventional modulation techniques, solving the traditional design compromise between range, interference immunity and energy consumption. Feature  Small footprint：13 mm x 11 mm x 1.1 mm  LoRaTM Modem  +20 dBm constant RF output vs. V supply  Programmable bit rate up to 37500 bps  High sensitivity: down to -137 dBm  Excellent blocking immunity  Preamble detection  Automatic RF Sense and CAD with ultra-fast AFC  Payload up to 128 bytes with CRC  Embedded memories (up to 192 Kbytes of Flash memory and 20 Kbytes of RAM)

S76S LoRa Wireless Communication Module H 901-10201 Mar 22th ,2017 3 of 18 Product Name Version Doc No Date Page 1-1 Block Diagram A simplified block diagram of the S76S module is depicted in the figure below. 1-2 Product Version The features of S76S is detailed in the following table Part Number Frequency Range Spreading Factor Bandwidth (K Hz) Effective Bitrate (bps) Est. Sensitivity ( dBm ) S76S 902.3-914.9 MHz 6 - 12 62.5 - 500 146 - 37500 -109 to -137* Note: * LORA setting SF=12, BW=62.5k, Long-Range Mode, highest LNA gain, LnaBoost for Band 1. 1-3 Specification Model Name S76S Product Description LoRa Wireless Communication Module Host Interface UART Operation Conditions Temperature  Storage：-50℃ ~ +105℃  Operating：-20℃ ~ +70℃ Humidity  Operating：10 ~ 95% (Non-Condensing)  Storage：5 ~ 95% (Non-Condensing) Dimension 13 mm x 11 mm x 1.1 mm Package LGA type

S76S LoRa Wireless Communication Module H 901-10201 Mar 22th ,2017 4 of 18 Product Name Version Doc No Date Page 2. Electrical Characteristics 2-1. Absolute Maximum Ratings Symbol Parameter Min. Typ. Max. Unit VDD33 Supply Voltage -0.3 3.9 V VIN Input voltage on digital pins -0.3 3.9 V Pmr RF Input Level +10 dBm 2-2. Recommended Operating Range Symbol Parameter Min. Typ. Max. Unit VDD33 Supply Voltage 2.0 3.3 3.6 V ML RF Input Level +10 dBm 2-3. Power Consumption Characteristics Symbol Parameter Conditions Typ. Max. Unit IDDSL Supply current in Sleep mode TBD uA IDDST Supply current in Standby mode Crystal oscillator enabled 9 9.6 mA IDDR Supply current in Receive mode 17.5 mA IDDT Supply current in Transmit mode with impedance matching RFOP = +20 dBm RFOP = +17 dBm RFOP = +13 dBm RFOP = + 7 dBm 127 82 65 49 mA

S76S LoRa Wireless Communication Module H 901-10201 Mar 22th ,2017 5 of 18 Product Name Version Doc No Date Page 2-4. RF Characteristics The table below gives the electrical specifications for the transceiver operating with LoRaTM modulation. Following conditions apply unless otherwise specified:  Supply voltage = 3.3 V.  Temperature = 25° C.  Frequency bands: 915 MHz  Bandwidth (BW) = 125 kHz.  Spreading Factor (SF) = 12.  Error Correction Code (EC) = 4/6.  Packet Error Rate (PER)= 1%  CRC on payload enabled.  Output power = 13 dBm in transmission.  Payload length = 64 bytes.  Preamble Length = 12 symbols (programmed register PreambleLength=8)  With matched impedances LoRa Transmitter (Conductive) Item Condition Min. Typ. Max. Unit Frequency Range Band1 915 MHz Tx Power Level PA_BOOST pin 18.0 19.5 21.0 dBm LoRa Receiver (Conductive) Item Condition Min. Typ. Max. Unit Frequency Range Band1 863 915 928 MHz RFS_L62_HF (Long-Range Mode, highest LNA gain, LNA boost, 62.5 kHz bandwidth) SF = 6 -119 dBm SF = 7 -114 dBm SF = 8 -127 dBm SF = 12 -137 dBm RFS_L500_HF (Long-Range Mode, highest LNA gain, LNA boost, 500 kHz bandwidth) SF = 6 -109 dBm SF = 7 -114 dBm SF = 8 -117 dBm SF = 9 -120 dBm SF = 10 -123 dBm SF = 11 -126 dBm SF = 12 -128 dBm

S76S LoRa Wireless Communication Module H 901-10201 Mar 22th ,2017 6 of 18 Product Name Version Doc No Date Page 2-5. Digital Characteristics 2-5-1. DC characteristics Input voltage levels Symbol Description Conditions Min Typ. Max Unit VIH I/O input high level voltage NRST 0.7xVDD33 - - V BOOT0 0.7xVDD33 - - V GPIO 0.7xVDD33 - - V VIL I/O input low level voltage NRST - - 0.3xVDD33 V BOOT0 - - 0.14xVDD33 V GPIO - - 0.3xVDD33 V RPU Weak pull-up Equivalent resistor VIN = GND 30 45 60 K Ω RPD Weak pull-down Equivalent resistor VIN =VDD33 30 45 60 K Ω Output voltage levels Symbol Description Conditions Min Max Unit VOL Output low level voltage for an I/O pin CMOS port / IIO = +8 mA 2.7 V≦VDD33≦3.6 V - 0.4 V VOH Output high level voltage for an I/O pin VDD33-0.4 - VOL Output low level voltage for an I/O pin TTL port / IIO =+ 8 mA 2.7 V≦VDD33≦3.6 V - 0.4 VOH Output high level voltage for an I/O pin TTL port / IIO =- 6 mA 2.7 V≦VDD33≦3.6 V 2.4 - VOL Output low level voltage for an I/O pin IIO = +15 mA 2.7 V≦VDD33≦3.6 V - 1.3 VOH Output high level voltage for an I/O pin IIO = -15 mA 2.7 V≦VDD33≦3.6 V VDD33-1.3 - VOL Output low level voltage for an I/O pin IIO = +4 mA 1.65 V≦VDD33≦3.6 V - 0.45 VOH Output high level voltage for an I/O pin IIO = +4 mA 1.65 V≦VDD33≦3.6 V VDD33-0.45 -

S76S LoRa Wireless Communication Module H 901-10201 Mar 22th ,2017 7 of 18 Product Name Version Doc No Date Page 2-5-2. NRST pin characteristics The NRST pin input driver uses CMOS technology. It is connected to a permanent pull-up resistor (RPU). The following figure is recommended NRST pin protection circuit against parasitic resets. Symbol Description Conditions Min Typ. Max Unit VIL(NRST) NRST input low level voltage VSS 0.8 V VIH(NRST) NRST input high level voltage 1.4 VDD33 V VOL(NRST) NRST output low level voltage IOL = 2mA 2.7V＜VDD33＜3.6V 0.4 V VOL(NRST) NRST output low level voltage IOL = 1.5mA 1.65V＜VDD33＜2.7V 0.4 V Vhys(NRST) NRST schmitt trigger voltage hysteresis 10% VDD33 mV RPU Weak pull-up Equivalent resistor VIN = GND 30 45 60 K Ω VF NRST Input filtered pulse 50 nS VNF NRST Input not filtered pulse VDD33 > 2.7 V 350 nS

S76S LoRa Wireless Communication Module H 901-10201 Mar 22th ,2017 8 of 18 Product Name Version Doc No Date Page 2-5-3. UART Interface Parameters Baud Rate = 38400 bps Data Bits = 8 bits Stop Bits = 1 bit Parity Check = None Flow Control = None

S76S LoRa Wireless Communication Module H 901-10201 Mar 22th ,2017 9 of 18 Product Name Version Doc No Date Page 3. Pin Definition Pin Definition I/O Description 1 NC 2 GND Ground pin 3 GND Ground pin 4 PC0 I/O MCU pin name: PC0 5 PC1 I/O MCU pin name: PC1 6 PC2 I/O MCU pin name: PC2 7 PC3 I/O MCU pin name: PC3 8 NC 9 NC 10 NC 11 NC 12 NRST Hardware reset pin 13 PA0 I/O MCU pin name: PA0 14 GND Ground pin 15 GND Ground pin 16 PA2_TXD_A I/O MCU pin name: PA2 17 PA3_RXD_A I/O MCU pin name: PA3 18 PA4_SPI1_NSS I/O MCU pin name: PA4 19 PA5_SPI1_SCK I/O MCU pin name: PA5 20 PA6_SPI1_MISO I/O MCU pin name: PA6 21 PA7_SPI1_MOSI I/O MCU pin name: PA7 22 PC4 I/O MCU pin name: PC4 23 PC5 I/O MCU pin name: PC5 24 PB0_IO_INT1 I/O MCU pin name: PB0 25 PB1_IO_INT2 I/O MCU pin name: PB1 26 PC6 I/O MCU pin name: PC6 27 PC7 I/O MCU pin name: PC7 28 PC8 I/O MCU pin name: PC8 29 PC9 I/O MCU pin name: PC9 30 RXTX/RFMOD O Control signal from SX1276, which connects to internal RF switch at the same time.

S76S LoRa Wireless Communication Module H 901-10201 Mar 22th ,2017 10 of 18 Product Name Version Doc No Date Page 31 GND Ground pin 32 GND Ground pin 33 RF_ANT I/O RF I/O 34 GND Ground pin 35 GND Ground pin 36 PA1_RF_FEM_CPS I/O MCU pin name: PA1 37 GND Ground pin 38 NC 39 GND Ground pin 40 NC 41 GND Ground pin 42 NC 43 VDD33 Power Supply 44 VDD33 Power Supply 45 PA8_USART1_CK I/O MCU pin name: PA8 46 PA10_USART1_RX I/O MCU pin name: PA10 47 PA9_USART1_TX I/O MCU pin name: PA9 48 PA11_USART1_CTS I/O MCU pin name: PA11 49 PA12_USART1_RTS I/O MCU pin name: PA12 50 PA13_SWDIO Serial wire (SWD) debug interface 51 PA14_SWCLK Serial wire (SWD) debug interface 52 PC10 I/O MCU pin name: PC10 53 PC11 I/O MCU pin name: PC11 54 PC12 I/O MCU pin name: PC12 55 PD2 I/O MCU pin name: PD2 56 PB5 I/O MCU pin name: PB5 57 PB6_SCL I/O MCU pin name: PB6 58 PB7_SDA I/O MCU pin name: PB7 59 BOOT0 I Boot mode selection pin 60 PB8_IO_LED_FCT I/O MCU pin name: PB8 61 GND Ground Pin 62 GND Ground Pin

S76S LoRa Wireless Communication Module H 901-10201 Mar 22th ,2017 11 of 18 Product Name Version Doc No Date Page 3-1. Pin Assignment The SiP module will conform to the following pin map, shown in the following diagram (top view)

S76S LoRa Wireless Communication Module H 901-10201 Mar 22th ,2017 12 of 18 Product Name Version Doc No Date Page 4. Mechanical Dimension Unit: mm

S76S LoRa Wireless Communication Module H 901-10201 Mar 22th ,2017 13 of 18 Product Name Version Doc No Date Page 4-1 Recommended Footprint Unit: mm TOP View

S76S LoRa Wireless Communication Module H 901-10201 Mar 22th ,2017 15 of 18 Product Name Version Doc No Date Page 6. SiP Module Preparation 6-1. Handling Handling the module must wear the anti-static wrist strap to avoid ESD damage. After each module is aligned and tested, it should be transport and storage with anti -static tray and packing. This protective package must be remained in suitable environment until the module is assembled and soldered onto the main board. 6-2. SMT Preparation 1. Calculated shelf life in sealed bag: 6 months at<40℃ and <90% relative humidity (RH). 2. Peak package body temperature: 250℃. 3. After bag was opened, devices that will be subjected to reflow solder or other high temperature process must. A. Mounted within: 168 hours of factory conditions<30℃/60%RH. B. Stored at≦10%RH with N2 flow box. 4. Devices require baking, before mounting, if: A. Package bag does not keep in vacuumed while first time open. B. Humidity Indicator Card is >10% when read at 23±5℃. C. Expose at 3A condition over 8 hours or Expose at 3B condition over 24 hours. 5. If baking is required, devices may be baked for 12 hours at 125±5℃.

S76S LoRa Wireless Communication Module H 901-10201 Mar 22th ,2017 17 of 18 Product Name Version Doc No Date Page 7-2. Tray Dimension

S76S LoRa Wireless Communication Module H 901-10201 Mar 22th ,2017 18 of 18 Product Name Version Doc No Date Page 7-3. Packing Information 7-4. Humidity Indicator Card

S76S LoRa Wireless Communication Module H 901-10201 Mar 22th ,2017 19 of 18 Product Name Version Doc No Date Page 8. FCC statement Federal Communication Commission Interference Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures: - Reorient or relocate the receiving antenna. - Increase the separation between the equipment and receiver. - Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. - Consult the dealer or an experienced radio/TV technician for help. FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. IMPORTANT NOTE: Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Country Code selection feature to be disabled for products marketed to the US/CANADA This device is intended only for OEM integrators under the following conditions:

S76S LoRa Wireless Communication Module H 901-10201 Mar 22th ,2017 20 of 18 Product Name Version Doc No Date Page 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna, 3) For all products market in US, OEM has to limit the operation channels in CH1 to CH11 for 2.4G band by supplied firmware programming tool. OEM shall not supply any tool or info to the end-user regarding to Regulatory Domain change. As long as 3 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed IMPORTANT NOTE In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: “Contains FCC ID: 2ADWC-S76S”. Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.

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