AMPAK Technology AP6356SDXX WLAN module for 802.11abgn(2x2) + 11ac+BT4.1 User Manual User Manuel

AMPAK Technology Inc. WLAN module for 802.11abgn(2x2) + 11ac+BT4.1 User Manuel

Contents

User Manuel

AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information i Doc. NO: AMPAK AP6356SDXX Evaluation Kits User manual Version 1.0 Revision History Date Revision Content Revised By Version 2015/12/28 Initial released Aron 1.0
Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures: - Reorient or relocate the receiving antenna. - Increase the separation between the equipment and receiver. - Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. - Consult the dealer or an experienced radio/TV technician for help. FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
Radiation Exposure Statement: The product comply with the FCC portable RF exposure limit set forth for an uncontrolled environment and are safe for intended operation as described in this manual. The further RF exposure reduction can be achieved if the product can be kept as far as possible from the user body or set the device to lower output power if such function is available. This device is intended only for OEM integrators under the following conditions: 1) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. End Product Labeling The product can be kept as far as possible from the user body or set the device to lower output power if such function is available. The final end product must be labeled in a visible area with the following: “Contains FCC ID:ZQ6-AP6356SDXX”. The grantee's FCC ID can be used only when all FCC compliance requirements are met. Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.
Industry Canada statement: This device complies with ISED’s licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Le présent appareil est conforme aux CNR d’ ISED applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes : (1) le dispositif ne doit pas produire de brouillage préjudiciable, et (2) ce dispositif doit accepter tout brouillage reçu, y compris un brouillage susceptible de provoquer un fonctionnement indésirable. Radiation Exposure Statement: The product comply with the Canada portable RF exposure limit set forth for an uncontrolled environment and are safe for intended operation as described in this manual. The further RF exposure reduction can be achieved if the product can be kept as far as possible from the user body or set the device to lower output power if such function is available. Déclaration d'exposition aux radiations: Le produit est conforme aux limites d'exposition pour les appareils portables RF pour les Etats-Unis et le Canada établies pour un environnement non contrôlé. Le produit est sûr pour un fonctionnement tel que décrit dans ce manuel. La réduction aux expositions RF peut être augmentée si l'appareil peut être conservé aussi loin que possible du corps de l'utilisateur ou que le dispositif est réglé sur la puissance de sortie la plus faible si une telle fonction est disponible. This device is intended only for OEM integrators under the following conditions: (For module device use) 1) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Cet appareil est conçu uniquement pour les intégrateurs OEM dans les conditions suivantes: (Pour utilisation de dispositif module)
1) Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne. Tant que les 2 conditions ci-dessus sont remplies, des essais supplémentaires sur l'émetteur ne seront pas nécessaires. Toutefois, l'intégrateur OEM est toujours responsable des essais sur son produit final pour toutes exigences de conformité supplémentaires requis pour ce module installé. IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the Canada authorization is no longer considered valid and the IC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate Canada authorization. NOTE IMPORTANTE: Dans le cas où ces conditions ne peuvent être satisfaites (par exemple pour certaines configurations d'ordinateur portable ou de certaines co-localisation avec un autre émetteur), l'autorisation du Canada n'est plus considéré comme valide et l'ID IC ne peut pas être utilisé sur le produit final. Dans ces circonstances, l'intégrateur OEM sera chargé de réévaluer le produit final (y compris l'émetteur) et l'obtention d'une autorisation distincte au Canada. End Product Labeling The product can be kept as far as possible from the user body or set the device to lower output power if such function is available. The final end product must be labeled in a visible area with the following: “Contains IC: ”. Plaque signalétique du produit final L'appareil peut être conservé aussi loin que possible du corps de l'utilisateur ou que le dispositif est réglé sur la puissance de sortie la plus faible si une telle fonction est disponible. Le produit final doit être étiqueté dans un endroit visible avec l'inscription suivante: "Contient des IC: ". Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module.
The end user manual shall include all required regulatory information/warning as show in this manual. Manuel d'information à l'utilisateur final L'intégrateur OEM doit être conscient de ne pas fournir des informations à l'utilisateur final quant à la façon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intègre ce module. Le manuel de l'utilisateur final doit inclure toutes les informations réglementaires requises et avertissements comme indiqué dans ce manuel. Caution : (i) the device for operation in the band 5150-5250 MHz is only for indoor use to reduce the potential for harmful interference to co-channel mobile satellite systems; (ii) the maximum antenna gain permitted for devices in the bands 5250-5350 MHz and 5470-5725 MHz shall be such that the equipment still complies with the e.i.r.p. limit; (iii) the maximum antenna gain permitted for devices in the band 5725-5850 MHz shall be such that the equipment still complies with the e.i.r.p. limits specified for point-to-point and non-point-to-point operation as appropriate; and (iv) the worst-case tilt angle(s) necessary to remain compliant with the e.i.r.p. elevation mask requirement set forth in Section 6.2.2(3) shall be clearly indicated. (v) Users should also be advised that high-power radars are allocated as primary users (i.e. priority users) of the bands 5250-5350 MHz and 5650-5850 MHz and that these radars could cause interference and/or damage to LE-LAN devices. Avertissement: Le guide d’utilisation des dispositifs pour réseaux locaux doit inclure des instructions précises sur les restrictions susmentionnées, notamment : (i) les dispositifs fonctionnant dans la bande 5150-5250 MHz sont réservés uniquement pour une utilisation à l’intérieur afin de réduire les risques de brouillage préjudiciable aux systèmes de satellites mobiles utilisant les mêmes canaux; (ii) le gain maximal d'antenne permis pour les dispositifs utilisant les bandes de 5250 à 5
350 MHz et de 5470 à 5725 MHz doit être conforme à la limite de la p.i.r.e; (iii) le gain maximal d'antenne permis (pour les dispositifs utilisant la bande de 5 725 à 5 850 MHz) doit être conforme à la limite de la p.i.r.e. spécifiée pour l'exploitation point à point et l’exploitation non point à point, selon le cas; (iv) les pires angles d’inclinaison nécessaires pour rester conforme à l’exigence de la p.i.r.e. applicable au masque d’élévation, et énoncée à la section 6.2.2 3), doivent être clairement indiqués. (v) De plus, les utilisateurs devraient aussi être avisés que les utilisateurs de radars de haute puissance sont désignés utilisateurs principaux (c.-à-d., qu’ils ont la priorité) pour les bandes 5250-5350 MHz et 5650-5850 MHz et que ces radars pourraient causer du brouillage et/ou des dommages aux dispositifs LAN-EL.
第十二條 經型式認證合格之低功率射頻電機，非經許可，公司、商號或使用者均不得擅自變更頻率、加大功率或變更原設計之特性及功能。 第十四條 低功率射頻電機之使用不得影響飛航安全及干擾合法通信；經發現有干擾現象時，應立即停用，並改善至無干擾時方得繼續使用。 前項合法通信，指依電信法規定作業之無線電通信。 低功率射頻電機須忍受合法通信或工業、科學及醫療用電波輻射性電機設備之干擾。 1. 本模組於取得認證後將依規定於模組本體標示審驗合格標籤。 2. 系統廠商應於平台上標示「本產品內含射頻模組：XXXyyyLPDzzzz-x」字 樣 。
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 3 1. AP6356SDXX Evaluation Board Introduction AP6356SDXX Evaluation board (EVB) likes as figure1. That is designed for IEEE802.11 a/b/g/n/ac 2x2 WLAN with integrated Bluetooth. It is subject to provide a convenient environment for customer’s verification on WiFi or Bluetooth function. There are many controller pins and reserved GPIO on Evaluation board which describes as below. Figure1. Top view of AP6356SDXX EVB Interface highlights: 1. U1: AP6356SDXX SIP module. 2. J1: UART interface connects with UART transport board for BT. 3. J80: PCIE interface connects with PCIE transport board for WIFI. 4. J3: Enable(H) or disable(L) Bluetooth and WiFi function. 5. J4: PCIE interface strapping option 6. J5: 5V DC adaptor input connector. 7. J6: 3V3 RF/ VBAT / WL_VIO / BT_VIO for main system I/O power path. 8. J7/J9: 5V DC mini USB input connector. 9. J10: GPIO_2 (input/output) and GPIO_3 (input/output) 10. J11: WL_VIO power path for 1V8 or 3V3 selection. 11. A1: I-PEX connector let RF signal in/out path, you could connect with RF cable or J10 J4 J3 J1 A2 U1 A1 J80 ct2 ct3 ct4 J7 J5 J9 J11 J6 ct1
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 4 Dipole antenna. 12. A2: I-PEX connector let RF signal in/out path, you could connect with RF cable or Dipole antenna. 13. Ct1-Ct4: WLAN and BT control pins, strongly recommended WL_H_WAKE(IRQ) connected to MCU. 2. WiFi function verification step WIFI PCIe: PCIe interface definition as below J80 dip connector and this should be used 3.3V for PCIe voltage. Figure3. WiFi verification connection interface to Host PCIE Hardware Setup:  Refer to Figure3 PCIE pin definition connects the J80 interface of AP6356SDXX evaluation board to Host PCIE control interface.  Connects an external antenna at I-PEX connector on the evaluation board.  Note to the VDDIO voltage level should be the same with GPIO voltage level of Host CPU. (VDDIO 3.3V or 1.8V selection by jump J11)  Pull High J4 are necessary . WiFi software setup: Please follow up software guideline of Ampak official released.
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 5 3. Bluetooth function verification step UART： Figure4. Bluetooth verification connection interface to Host UART Hardware Setup:  Refer to Figure4 UART pin definition connects the J1 interface of AP6356SDXX evaluation board to Host UART control interface.  Connects an external antenna at I-PEX connector on the evaluation board.  Note to the VDDIO voltage level should be the same as GPIO voltage level of Host CPU. USB： Figure5. Bluetooth verification connection interface to Host USB
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 6 Hardware Setup:  Refer to Figure5 USB pin definition connects the J9 interface of AP6356SDXX evaluation board to Host USB control interface.  Connects an external antenna at I-PEX connector on the evaluation board. WiFi and Bluetooth software setup: Please follow up software guideline of Ampak official released.
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 正基科技股份有限公司 SPECIFICATION SPEC. NO.： REV： 1.6 DATE： 09. 07.2015 PRODUCT NAME： AP6356SDXX Customer APPROVED Company Representative Signature PREPARED REVIEW APPROVED DCC ISSUE PM QA
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: AMPAK AP6356SDXX 2x2 WiFi + Bluetooth4.1 Module Spec Sheet
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 1 Revision History Date Revision Content Revised By Version 2014/09/25 -Preliminary Brian 1.0 2014/10/26 -Pin definition modified Brian 1.1 2014/12/11 -Pin definition modified Brian 1.2 2015/03/18 -Layout and Bluetooth Spec modified - Pin map and physical dimension modified Dora 1.3 2015/05/12 -Add Part Number Description Dora 1.4 2015/06/29 -Add Packet type and total pins Dora 1.5 2015/09/07 -Modify label quantity and MSL Dora 1.6
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 2 Contents Contents ................................................................................................................... 2 1. Introduction ......................................................................................................... 4 2. Features............................................................................................................... 5 3. Deliverables ........................................................................................................ 6 3.1 Deliverables .................................................................................................... 6 3.2 Regulatory certifications ................................................................................. 6 4. General Specification ......................................................................................... 7 4.1 General Specification ...................................................................................... 7 4.2 Voltages .......................................................................................................... 7 4.2.1 Absolute Maximum Ratings .................................................................... 7 4.2.2 Recommended Operating Rating ........................................................... 7 5. WiFi RF Specification ......................................................................................... 8 5.1 2.4GHz RF Specification................................................................................. 8 5.2 5GHz RF Specification ............................................................................... 11 6. Bluetooth Specification .................................................................................... 16 6.1 Bluetooth Specification ................................................................................. 16 7. Pin Assignments ............................................................................................... 17 7.1 Pin Map ........................................................................................................ 17 7.2 Pin Definition ................................................................................................ 17 8. Dimensions ....................................................................................................... 21 8.1 Physical Dimensions .................................................................................... 21 8.2 Layout Recommendation .............................................................................. 22 8.3 Part Number Description .............................................................................. 23 9. External clock reference .................................................................................. 24 9.1 SDIO Pin Description .................................................................................... 24 10. Host Interface Timing Diagram ........................................................................ 25 10.1 Power-up Sequence Timing Diagram ......................................................... 25 10.2 SDIO Default Mode Timing Diagram........................................................... 27 10.3 SDIO High Speed Mode Timing Diagram ................................................... 28 10.4 SDIO Bus Timing Specifications in SDR Modes ......................................... 29 10.5 SDIO Bus Timing Specifications in DDR50 Mode ....................................... 31 11. Recommended Reflow Profile ......................................................................... 32 12. Package Information ........................................................................................ 33 12.1Label ............................................................................................................ 33 Label C Inner box label . .................................................................................... 33 Label D Carton box label . ................................................................................. 33 12.2 Dimension ................................................................................................... 34
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 3 12.3 MSL Level / Storage Condition ................................................................... 36
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 4 1. Introduction AMPAK Technology would like to announce a low-cost and low-power consumption module which has all of the WiFi and Bluetooth functionalities. The highly integrated module makes the possibilities of web browsing, VoIP, Bluetooth headsets applications. With seamless roaming capabilities and advanced security, also could interact with different vendors’ 802.11a/b/g/n/ac 2x2 Access Points in the wireless LAN. The wireless module complies with IEEE 802.11 a/b/g/n/ac 2x2 MIMO standard and it can achieve up to a speed of 867Mbps with dual stream in 802.11n to connect the wireless LAN. The integrated module provides SDIO/PCIe interface for WiFi, UART / USB/ PCM interface for Bluetooth. This compact module is a total solution for a combination of WiFi + BT technologies. The module is specifically developed for Smart phones and Portable devices.
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 5 2. Features  Lead Free design which is compliant with ROHS requirements.  802.11a/b/g/n/ac dual-band radio with virtual-simultaneous dual-band operation  Dual-stream spatial multiplexing up to 867 Mbps data rate.  Supports 20, 40, 80 MHz channels with optional SGI(256 QAM modulation)  Supports IEEE 802.11 ac/n beam forming.  Supports IEEE 802.15.2 external coexistence interface to optimize bandwidth utilization with other co-located wireless technologies such as LTE, GPS, or WiMAX. - Supports standard SDIO/PCIe interfaces.  BT host digital interface: - HCI UART (up to 4 Mbps) - PCM for audio data  Complies with Bluetooth Core Specification Version 4.1 with provisions for supporting future specifications. With Bluetooth Class1 or Class2 transmitter operation.  Supports extended synchronous connections (eSCO), for enhanced voice quality by allowing for retransmission of dropped packets.  Adaptive frequency hopping (AFH) for reducing radio frequency interference. A simplified block diagram of the module is depicted in the figure below. Switch UART PCM/I2S RTC_CLK 32.768KHz Ref_CLK Discrete BT WLAN WLAN Switch Discrete VBAT VDDIO USB PCIe
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 6 3. Deliverables 3.1 Deliverables The following products and software will be part of the product.  Module with packaging  Evaluation Kits  Software utility for integration, performance test.  Product Datasheet.  Agency certified pre-tested report with the adapter board. 3.2 Regulatory certifications The product delivery is a pre-tested module, without the module level certification. For module approval, the platform’s antennas are required for the certification.
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 7 4. General Specification 4.1 General Specification 4.2 Voltages 4.2.1 Absolute Maximum Ratings Symbol Description Min. Max. Unit VBAT Input supply Voltage -0.5 5.5 V VDDIO Digital/Bluetooth/SDIO/ I/O Voltage -0.5 3.8 V 4.2.2 Recommended Operating Rating The module requires two power supplies: VBAT and VDDIO. Min. Typ. Max. Unit Operating Temperature -10 25 65 deg.C VBAT 3.0 3.6 4.8 V VDDIO 1.7 - 3.6 V Model Name AP6356SDXX Product Description Support WiFi/Bluetooth functionalities Dimension L x W x H: 16 x 12 x 1.6 (typical) mm WiFi Interface Support PCIe BT Interface UART / USB / PCM Package M.2 1216 Solder down Total Pin 108 Pins Operating temperature -10°C to 65°C Storage temperature -40°C to 85°C Humidity Operating Humidity 10% to 95% Non-Condensing Storage Humidity 5% to 95% Non-Condensing
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 8 5. WiFi RF Specification 5.1 2.4GHz RF Specification Conditions : VBAT=3.6V ; VDDIO=3.3V ; Temp:25°C Feature Description WLAN Standard IEEE 802.11a/b/g/n/ac WiFi compliant Frequency Range 2.400 GHz ~ 2.497 GHz (2.4 GHz ISM Band) Number of Channels 2.4GHz：Ch1 ~ Ch14 Modulation 802.11b : DQPSK, DBPSK, CCK 802.11 g/n : OFDM /64-QAM,16-QAM, QPSK, BPSK Output Power 802.11b /11Mbps : 16 dBm ± 1.5 dB @ EVM  -9dB 802.11g /54Mbps : 15 dBm ± 1.5 dB @ EVM  -25dB 802.11n /MCS7 : 14 dBm ± 1.5 dB @ EVM  -28dB SISO Receive Sensitivity (11b,20MHz) @8% PER - 1Mbps PER @ -93 dBm, typical - 2Mbps PER @ -91 dBm, typical - 5.5Mbps PER @ -88 dBm, typical - 11Mbps PER @ -86 dBm, typical SISO Receive Sensitivity (11g,20MHz) @10% PER - 6Mbps PER @ -90 dBm, typical - 9Mbps PER @ -89 dBm, typical - 12Mbps PER @ -88 dBm, typical - 18Mbps PER @ -85 dBm, typical - 24Mbps PER @ -82 dBm, typical - 36Mbps PER @ -79 dBm, typical - 48Mbps PER @ -74 dBm, typical - 54Mbps PER @ -72 dBm, typical MIMO Receive Sensitivity (11g,20MHz) @10% PER - 6Mbps PER @ -91 dBm, typical - 9Mbps PER @ -91 dBm, typical - 12Mbps PER @ -90 dBm, typical - 18Mbps PER @ -88 dBm, typical - 24Mbps PER @ -85 dBm, typical - 36Mbps PER @ -82 dBm, typical - 48Mbps PER @ -77 dBm, typical - 54Mbps PER @ -75 dBm, typical SISO Receive Sensitivity (11n,20MHz) @10% PER - MCS=0 PER @ -90 dBm, typical - MCS=1 PER @ -87 dBm, typical - MCS=2 PER @ -85 dBm, typical
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 9 - MCS=3 PER @ -81 dBm, typical - MCS=4 PER @ -78 dBm, typical - MCS=5 PER @ -73 dBm, typical - MCS=6 PER @ -72 dBm, typical - MCS=7 PER @ -70 dBm, typical MIMO Receive Sensitivity (11n,20MHz) @10% PER - MCS=0 PER @ -91 dBm, typical - MCS=1 PER @ -90 dBm, typical - MCS=2 PER @ -88 dBm, typical - MCS=3 PER @ -85 dBm, typical - MCS=4 PER @ -81 dBm, typical - MCS=5 PER @ -76 dBm, typical - MCS=6 PER @ -74 dBm, typical - MCS=7 PER @ -71 dBm, typical - MCS=8 PER @ -88 dBm, typical - MCS=15 PER @ -69 dBm, typical SISO Receive Sensitivity (11n,40MHz) @10% PER - MCS=0 PER @ -87 dBm, typical - MCS=1 PER @ -83 dBm, typical - MCS=2 PER @ -82 dBm, typical - MCS=3 PER @ -79 dBm, typical - MCS=4 PER @ -75 dBm, typical - MCS=5 PER @ -71 dBm, typical - MCS=6 PER @ -69 dBm, typical - MCS=7 PER @ -68 dBm, typical MIMO Receive Sensitivity (11n,40MHz) @10% PER - MCS=0 PER @ -89 dBm, typical - MCS=1 PER @ -87 dBm, typical - MCS=2 PER @ -85 dBm, typical - MCS=3 PER @ -82 dBm, typical - MCS=4 PER @ -78 dBm, typical - MCS=5 PER @ -74 dBm, typical - MCS=6 PER @ -72 dBm, typical - MCS=7 PER @ -71 dBm, typical - MCS=8 PER @ -87 dBm, typical - MCS=15 PER @ -68 dBm, typical SISO Receive Sensitivity (11ac,20MHz) @10% PER - MCS=0, NSS1 PER @ -89 dBm, typical - MCS=1, NSS1 PER @ -86 dBm, typical - MCS=2, NSS1 PER @ -85 dBm, typical - MCS=3, NSS1 PER @ -81 dBm, typical
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 10 - MCS=4, NSS1 PER @ -78 dBm, typical - MCS=5, NSS1 PER @ -73 dBm, typical - MCS=6, NSS1 PER @ -71 dBm, typical - MCS=7, NSS1 PER @ -70 dBm, typical - MCS=8, NSS1 PER @ -67 dBm, typical MIMO Receive Sensitivity (11ac,20MHz) @10% PER - MCS=0, NSS1 PER @ -89 dBm, typical - MCS=1, NSS1 PER @ -88 dBm, typical - MCS=2, NSS1 PER @ -87 dBm, typical - MCS=3, NSS1 PER @ -84 dBm, typical - MCS=4, NSS1 PER @ -81 dBm, typical - MCS=5, NSS1 PER @ -76 dBm, typical - MCS=6, NSS1 PER @ -75 dBm, typical - MCS=7, NSS1 PER @ -73 dBm, typical - MCS=8, NSS1 PER @ -69 dBm, typical - MCS=0, NSS2 PER @ -89 dBm, typical - MCS=8, NSS2 PER @ -65 dBm, typical SISO Receive Sensitivity (11ac,40MHz) @10% PER - MCS=0, NSS1 PER @ -86 dBm, typical - MCS=1, NSS1 PER @ -84 dBm, typical - MCS=2, NSS1 PER @ -82 dBm, typical - MCS=3, NSS1 PER @ -79 dBm, typical - MCS=4, NSS1 PER @ -75 dBm, typical - MCS=5, NSS1 PER @ -71 dBm, typical - MCS=6, NSS1 PER @ -69 dBm, typical - MCS=7, NSS1 PER @ -68 dBm, typical - MCS=8, NSS1 PER @ -63 dBm, typical - MCS=9, NSS1 PER @ -62 dBm, typical MIMO Receive Sensitivity (11ac,40MHz) @10% PER - MCS=0, NSS1 PER @ -88 dBm, typical - MCS=1, NSS1 PER @ -87 dBm, typical - MCS=2, NSS1 PER @ -85 dBm, typical - MCS=3, NSS1 PER @ -82 dBm, typical - MCS=4, NSS1 PER @ -77 dBm, typical - MCS=5, NSS1 PER @ -74 dBm, typical - MCS=6, NSS1 PER @ -72 dBm, typical - MCS=7, NSS1 PER @ -71 dBm, typical - MCS=8, NSS1 PER @ -67 dBm, typical - MCS=9, NSS1 PER @ -65 dBm, typical - MCS=0, NSS2 PER @ -86 dBm, typical
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 11 - MCS=9, NSS2 PER @ -61 dBm, typical Maximum Input Level 802.11b : -10 dBm 802.11g/n : -20 dBm Antenna Reference Small antennas with 0~2 dBi peak gain 5.2 5GHz RF Specification Conditions : VBAT=3.6V ; VDDIO=3.3V ; Temp:25°C Feature Description WLAN Standard IEEE 802.11a/n 2x2, WiFi compliant Frequency Range 4.900 GHz ~ 5.845 GHz (5.0 GHz ISM Band) Number of Channels 5.0GHz：Please see the table1 Modulation 802.11a : OFDM /64-QAM,16-QAM, QPSK, BPSK 802.11n : OFDM /64-QAM,16-QAM, QPSK, BPSK 802.11ac : OFDM /256-QAM Output Power 802.11a /54Mbps : 13 dBm ± 1.5 dB @ EVM  -25dB 802.11n /MCS7 : 12 dBm ± 1.5 dB @ EVM  -28dB 802.11ac /MCS9 : 10 dBm ± 1.5 dB @ EVM  -32dB SISO Receive Sensitivity (11a,20MHz) @10% PER - 6Mbps PER @ -90 dBm, typical - 9Mbps PER @ -88 dBm, typical - 12Mbps PER @ -87 dBm, typical - 18Mbps PER @ -84 dBm, typical - 24Mbps PER @ -81 dBm, typical - 36Mbps PER @ -78 dBm, typical - 48Mbps PER @ -73 dBm, typical - 54Mbps PER @ -71 dBm, typical MIMO Receive Sensitivity (11a,20MHz) @10% PER - 6Mbps PER @ -90 dBm, typical - 9Mbps PER @ -90 dBm, typical - 12Mbps PER @ -89 dBm, typical - 18Mbps PER @ -87 dBm, typical - 24Mbps PER @ -84 dBm, typical - 36Mbps PER @ -81 dBm, typical - 48Mbps PER @ -76 dBm, typical - 54Mbps PER @ -72 dBm, typical SISO Receive Sensitivity (11n,20MHz) @10% PER - MCS=0 PER @ -89 dBm, typical - MCS=1 PER @ -86 dBm, typical
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 12 - MCS=2 PER @ -84 dBm, typical - MCS=3 PER @ -81 dBm, typical - MCS=4 PER @ -77 dBm, typical - MCS=5 PER @ -72 dBm, typical - MCS=6 PER @ -71 dBm, typical - MCS=7 PER @ -69 dBm, typical MIMO Receive Sensitivity (11n,20MHz) @10% PER - MCS=0 PER @ -90 dBm, typical - MCS=1 PER @ -89 dBm, typical - MCS=2 PER @ -87 dBm, typical - MCS=3 PER @ -84 dBm, typical - MCS=4 PER @ -80 dBm, typical - MCS=5 PER @ -75 dBm, typical - MCS=6 PER @ -74 dBm, typical - MCS=7 PER @ -72 dBm, typical - MCS=8 PER @ -89 dBm, typical - MCS=15 PER @ -69 dBm, typical SISO Receive Sensitivity (11n,40MHz) @10% PER - MCS=0 PER @ -86 dBm, typical - MCS=1 PER @ -83 dBm, typical - MCS=2 PER @ -81 dBm, typical - MCS=3 PER @ -78 dBm, typical - MCS=4 PER @ -74 dBm, typical - MCS=5 PER @ -70 dBm, typical - MCS=6 PER @ -68 dBm, typical - MCS=7 PER @ -67 dBm, typical MIMO Receive Sensitivity (11n,40MHz) @10% PER - MCS=0 PER @ -88 dBm, typical - MCS=1 PER @ -86 dBm, typical - MCS=2 PER @ -84 dBm, typical - MCS=3 PER @ -81 dBm, typical - MCS=4 PER @ -77 dBm, typical - MCS=5 PER @ -73 dBm, typical - MCS=6 PER @ -71 dBm, typical - MCS=7 PER @ -70 dBm, typical - MCS=8 PER @ -86 dBm, typical - MCS=15 PER @ -67 dBm, typical SISO Receive Sensitivity (11ac,20MHz) @10% PER - MCS=0, NSS1 PER @ -87 dBm, typical - MCS=1, NSS1 PER @ -85 dBm, typical - MCS=2, NSS1 PER @ -83 dBm, typical
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 13 - MCS=3, NSS1 PER @ -80 dBm, typical - MCS=4, NSS1 PER @ -76 dBm, typical - MCS=5, NSS1 PER @ -71 dBm, typical - MCS=6, NSS1 PER @ -70 dBm, typical - MCS=7, NSS1 PER @ -69 dBm, typical - MCS=8, NSS1 PER @ -65 dBm, typical MIMO Receive Sensitivity (11ac,20MHz) @10% PER - MCS=0, NSS1 PER @ -89 dBm, typical - MCS=1, NSS1 PER @ -88 dBm, typical - MCS=2, NSS1 PER @ -86 dBm, typical - MCS=3, NSS1 PER @ -83 dBm, typical - MCS=4, NSS1 PER @ -79 dBm, typical - MCS=5, NSS1 PER @ -74 dBm, typical - MCS=6, NSS1 PER @ -73 dBm, typical - MCS=7, NSS1 PER @ -72 dBm, typical - MCS=8, NSS1 PER @ -68 dBm, typical - MCS=0, NSS2 PER @ -88 dBm, typical - MCS=8, NSS2 PER @ -64 dBm, typical SISO Receive Sensitivity (11ac,40MHz) @10% PER - MCS=0, NSS1 PER @ -85 dBm, typical - MCS=1, NSS1 PER @ -82 dBm, typical - MCS=2, NSS1 PER @ -80 dBm, typical - MCS=3, NSS1 PER @ -77 dBm, typical - MCS=4, NSS1 PER @ -74 dBm, typical - MCS=5, NSS1 PER @ -69 dBm, typical - MCS=6, NSS1 PER @ -68 dBm, typical - MCS=7, NSS1 PER @ -67 dBm, typical - MCS=8, NSS1 PER @ -62 dBm, typical - MCS=9, NSS1 PER @ -61 dBm, typical MIMO Receive Sensitivity (11ac,40MHz) @10% PER - MCS=0, NSS1 PER @ -87 dBm, typical - MCS=1, NSS1 PER @ -85 dBm, typical - MCS=2, NSS1 PER @ -83 dBm, typical - MCS=3, NSS1 PER @ -80 dBm, typical - MCS=4, NSS1 PER @ -77 dBm, typical - MCS=5, NSS1 PER @ -72 dBm, typical - MCS=6, NSS1 PER @ -71 dBm, typical - MCS=7, NSS1 PER @ -70 dBm, typical - MCS=8, NSS1 PER @ -65 dBm, typical - MCS=9, NSS1 PER @ -64 dBm, typical
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 14 - MCS=0, NSS2 PER @ -85 dBm, typical - MCS=9, NSS2 PER @ -60 dBm, typical SISO Receive Sensitivity (11ac,80MHz) @10% PER - MCS=0, NSS1 PER @ -82 dBm, typical - MCS=1, NSS1 PER @ -79 dBm, typical - MCS=2, NSS1 PER @ -77 dBm, typical - MCS=3, NSS1 PER @ -73 dBm, typical - MCS=4, NSS1 PER @ -70 dBm, typical - MCS=5, NSS1 PER @ -67 dBm, typical - MCS=6, NSS1 PER @ -65 dBm, typical - MCS=7, NSS1 PER @ -63 dBm, typical - MCS=9, NSS1 PER @ -59 dBm, typical - MCS=9, NSS1 PER @ -57 dBm, typical MIMO Receive Sensitivity (11ac,80MHz) @10% PER - MCS=0, NSS1 PER @ -83 dBm, typical - MCS=1, NSS1 PER @ -82 dBm, typical - MCS=2, NSS1 PER @ -80 dBm, typical - MCS=3, NSS1 PER @ -76 dBm, typical - MCS=4, NSS1 PER @ -73 dBm, typical - MCS=5, NSS1 PER @ -70 dBm, typical - MCS=6, NSS1 PER @ -68 dBm, typical - MCS=7, NSS1 PER @ -66 dBm, typical - MCS=8, NSS1 PER @ -62 dBm, typical - MCS=9, NSS1 PER @ -60 dBm, typical - MCS=0, NSS2 PER @ -81 dBm, typical - MCS=9, NSS2 PER @ -56 dBm, typical Maximum Input Level 802.11a/n : -30 dBm Antenna Reference Small antennas with 0~2 dBi peak gain
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 15 5GHz(20MHz) Channel table Band (GHz) Operating Channel Numbers Channel center frequencies(MHz) 5.15GHz~5.25GHz 36 5180 40 5200 44 5220 48 5240 5.25GHz~5.35GHz 52 5260 56 5280 60 5300 64 5320 5.5GHz~5.7GHz 100 5500 104 5520 108 5540 112 5560 116 5580 120 5600 124 5620 128 5640 132 5660 136 5680 140 5700 5.725GHz~5.825GHz 149 5745 153 5765 157 5785 161 5805
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 16 6. Bluetooth Specification 6.1 Bluetooth Specification Conditions : VBAT=3.6V ; VDDIO=3.3V ; Temp:25°C Feature Description General Specification Bluetooth Standard Bluetooth V4.1 of 1, 2 and 3 Mbps. Antenna Reference Small antennas with 0~2 dBi peak gain Frequency Band 2402 MHz ~ 2480 MHz Number of Channels 79 channels Modulation FHSS, GFSK, DPSK, DQPSK RF Specification Min. Typical. Max. Output Power (Class 1.5) 7 dBm Output Power (Class 2) 2 dBm Sensitivity @ BER=0.1% for GFSK (1Mbps) -80 dBm Sensitivity @ BER=0.01% for π/4-DQPSK (2Mbps) -80 dBm Sensitivity @ BER=0.01% for 8DPSK (3Mbps) -78 dBm Maximum Input Level GFSK (1Mbps):-20dBm π/4-DQPSK (2Mbps) :-20dBm 8DPSK (3Mbps) :-20dBm
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 17 7. Pin Assignments 7.1 Pin Map < TOP VIEW > 7.2 Pin Definition NO Name Type Description 1 NC － No connect 2 NC － No connect 3 JTAG_TDI_GPIO4 I 1: SPROM is present 0: SPROM is absent (default). Applicable in PCIe HOST mode
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 18 4 NC － No connect 5 3V3_VBAT I VBAT system power supply input 6 GND － Ground connections 7 JTAG_TDO_GPIO_5 I/O GPIO_5 8 GPIO_8 I/O SDIO and PCIe interface strapping option 9 GPIO_9 I/O SDIO and PCIe interface strapping option 10 NC － No connect 11 JTAG_TRST_N_COEX0_ GPIO_6 I/O GPIO_6 12 JTAG_TCK_COEX1_ GPIO_2 I/O GPIO_2 13 JTAG_TMS_COEX2_ GPIO_3 I/O GPIO_3 14 NC － No connect 15 NC － No connect 16 NC － No connect 17 GND － Ground connections 18 NC － No connect 19 NC － No connect 20 GND － Ground connections 21 NC － No connect 22 NC － No connect 23 GND － Ground connections 24 BT_DEV_WAKE I/O Bluetooth DEV_WAKE 25 NC － No connect 26 GND － Ground connections 27 SLP_CLK I External sleep clock input (32.768KHz) 28 WL_RFDISABLE_L_GPIO1 I/O WL_DEV_WAKE 29 PCIE_WAKEn O PCIe wake signal 30 PCIE_CLKREQn I/O PCIe clock request 31 PCIE_PERSTn I PCIe host indication to reset the device 32 GND － Ground connections 33 PCIE_RCLK_N I PCI Express differential clock input-Negative 34 PCIE_RCLK_P I PCI Express differential clock input-Positive 35 GND － Ground connections 36 PCIE_TX_N O PCI Express transmit data-Negative 37 PCIE_TX_P O PCI Express transmit data-Positive
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 19 38 GND － Ground connections 39 PCIE_RX_N I PCI Express receive data-Negative 40 PCIE_RX_P I PCI Express receive data-Positive 41 GND － Ground connections 42 NC － No connect 43 BT_I2S_WS I/O I2S data command line 44 VIO_SD I Digital I/O SDIO power supply 45 SDIO_RESET_L_ WL_REG_ON I Used by PMU to power up or power down the internal module regulators used by the WLAN section. 46 SDIO_WAKE_L_GPIO_0 I WL_HOST_WAKE 47 SDIO_DATA3 I/O SDIO data line bit3 48 SDIO_DATA2 I/O SDIO data line bit2 49 SDIO_DATA1 I/O SDIO data line bit1 50 SDIO_DATA0 I/O SDIO data line bit0 51 SDIO_CMD I/O SDIO command/response 52 SDIO_CLK I SDIO clock input 53 BT_HOST_WAKE O Bluetooth HOST_WAKE 54 UART_CTS I UART_CTS 55 UART_SOUT O UART_SOUT 56 UART_SIN I UART_SIN 57 UART_RTS O UART_RTS 58 PCM_SYNC I/O PCM sync 59 PCM_IN I PCM data in 60 PCM_OUT O PCM data out 61 PCM_CLK I/O PCM bus clock 62 GND － Ground connections 63 BT_ENABLE I Used by PMU to power up or power down the internal module regulators used by the Bluetooth section. 64 BT_I2S_DO_ BT_LED O I2S data line output It can be used as BT_LED 65 WL_LED_GPIO_7 O It can be used as WL_LED 66 BT_I2S_DI I I2S data line input 67 BT_I2S_CLK I/O I2S data line clock 68 GND － Ground connections 69 USB_DM I/O USB serial differential data Negative 70 USB_DP I/O USB serial differential dataPositive 71 GND － Ground connections
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 20 72 3V3_USB I 3.3V power supply 73 VIO I Digital I/O power supply 74 GND － Ground connections 75 GND － Ground connections 76 GND － Ground connections 77 GND － Ground connections 78 GND － Ground connections 79 GND － Ground connections 80 GND － Ground connections 81 GND － Ground connections 82 GND － Ground connections 83 GND － Ground connections 84 GND － Ground connections 85 GND － Ground connections 86 GND － Ground connections 87 GND － Ground connections 88 GND － Ground connections 89 GND － Ground connections 90 GND － Ground connections 91 GND － Ground connections 92 GND － Ground connections 93 GND － Ground connections 94 GND － Ground connections 95 GND － Ground connections 96 GND － Ground connections G1 GND － Ground connections G2 GND － Ground connections G3 GND － Ground connections G4 GND － Ground connections G5 GND － Ground connections G6 GND － Ground connections G7 GND － Ground connections G8 GND － Ground connections G9 GND － Ground connections G10 GND － Ground connections G11 GND － Ground connections G12 GND － Ground connections
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 21 8. Dimensions 8.1 Physical Dimensions (Unit: mm) < TOP VIEW > TOP VIEW >
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 22 8.2 Layout Recommendation (Unit: mm) < TOP VIEW >
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 24 9. External clock reference External LPO signal characteristics Parameter Specification Units Nominal input frequency 32.768 kHz Frequency accuracy 30 ppm Duty cycle 30 - 70 % Input signal amplitude 1600 to 3300 mV, p-p Signal type Square-wave or sine-wave - Input impedance >100k <5  pF Clock jitter (integrated over 300Hz – 15KHz) <1 Hz Output high voltage 0.7Vio - Vio V 9.1 SDIO Pin Description The module supports SDIO version 3.0 for all 1.8V 4-bit UHSI speeds: SDR50(100 Mbps),SDR104(208MHz) and DDR50(50MHz, dual rates) in addition to the 3.3V default speed(25MHz) and high speed (50 MHz). It has the ability to stop the SDIO clock and map the interrupt signal into a GPIO pin. This ‘out-of-band’ interrupt signal notifies the host when the WLAN device wants to turn on the SDIO interface. The ability to force the control of the gated clocks from within the WLAN chip is also provided.  Function 0 Standard SDIO function (Max BlockSize / ByteCount = 32B)  Function 1 Backplane Function to access the internal System On Chip (SOC) address space (Max BlockSize / ByteCount = 64B)  Function 2 WLAN Function for efficient WLAN packet transfer through DMA (Max BlockSize/ByteCount=512B) SDIO Pin Description SD 4-Bit Mode DATA0 Data Line 0 DATA1 Data Line 1 or Interrupt DATA2 Data Line 2 or Read Wait DATA3 Data Line 3 CLK Clock CMD Command Line
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 25 10. Host Interface Timing Diagram 10.1 Power-up Sequence Timing Diagram The module has signals that allow the host to control power consumption by enabling or disabling the Bluetooth, WLAN and internal regulator blocks. These signals are described below. Additionally, diagrams are provided to indicate proper sequencing of the signals for carious operating states. The timing value indicated are minimum required values: longer delays are also acceptable. ※ WL_REG_ON: Used by the PMU to power up or power down the internal regulators used by the WLAN section. When this pin is high, the regulators are enabled and the WLAN section is out of reset. When this pin is low the WLAN section is in reset. ※ BT_REG_ON: Used by the PMU to power up or power down the internal regulators used by the BT section. Low asserting reset for Bluetooth. This pin has no effect on WLAN and does not control any PMU functions. This pin must be driven high or low (not left floating). WLAN=ON, Bluetooth=ON
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 26 WLAN=OFF, Bluetooth=OFF WLAN=ON, Bluetooth=OFF WLAN=OFF, Bluetooth=ON
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 27 10.2 SDIO Default Mode Timing Diagram
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 28 10.3 SDIO High Speed Mode Timing Diagram
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 29 10.4 SDIO Bus Timing Specifications in SDR Modes Clock timing(SDR Modes) Card Input timing (SDR Modes)
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 30 Card output timing (SDR Modes up to 100MHz) Card output timing (SDR Modes 100MHz to 208MHz)
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 31 10.5 SDIO Bus Timing Specifications in DDR50 Mode Data Timing
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 32 11. Recommended Reflow Profile Referred to IPC/JEDEC standard. Peak Temperature : <250°C Number of Times : 2 times 2.5℃/sec 2.5°C/sec 40~70 sec 250℃
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 33 12. Package Information 12.1Label Label A Anti-static and humidity notice Label B MSL caution / Storage Condition Label C Inner box label . Label D Carton box label .
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 34 12.2 Dimension
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 35 A B C Humidity indicator Desiccant C D
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 36 12.3 MSL Level / Storage Condition ※NOTE : Accumulated baking time should not exceed 96hrs

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